JP6635864B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus used for removing a chamfered portion of a wafer.

  In recent years, in order to realize a small and lightweight device chip, it has been required to process a wafer made of a semiconductor material such as silicon thinner (hereinafter, thinned). For example, a wafer in which devices such as ICs are formed in a region defined by streets (planned division lines) on the front surface is thinned by grinding the back surface. The thinned wafer is divided along the street into a plurality of device chips corresponding to each device.

  An outer peripheral edge of a wafer used for manufacturing such a device chip is chamfered to prevent chipping or the like during transportation. However, when the chamfered wafer is thinned by grinding, the outer peripheral portion of the wafer is sharply sharpened like a knife edge, and on the contrary, chips, cracks and the like are liable to occur.

  Therefore, a wafer processing method has been proposed in which a chamfered portion (chamfered portion) of the wafer is cut and removed before thinning by grinding (for example, see Patent Document 1). In this processing method, a cutting blade is cut into a wafer before grinding to cut and remove a chamfered portion, thereby preventing the outer peripheral portion from being sharply sharpened after grinding.

  Further, a processing apparatus suitable for the above-described processing method has been proposed (for example, see Patent Document 2). This processing apparatus includes, for example, a holding table that holds only the outer peripheral portion of the wafer from the back side. The cutting blade is cut into the front surface of the wafer while holding only the outer peripheral portion of the wafer by the holding table, so that even if foreign matter such as processing debris remains on the holding table, the foreign matter remains in the center of the wafer. The possibility of adhesion can be kept low.

JP 2000-173961 A JP 2015-23239 A

  However, in the above-described processing apparatus, since the height of the cutting blade is controlled based on the height of the holding surface of the holding table, if foreign matter remains on the holding surface of the holding table, the height of the holding surface changes and the cutting blade Height cannot be controlled properly. As a result, the cutting depth of the cutting blade into the wafer held by the holding table cannot be appropriately controlled, and the processing accuracy tends to decrease.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a processing apparatus capable of processing a wafer with high accuracy.

According to one aspect of the present invention, a holding table having an annular holding surface for holding an outer peripheral portion of a wafer, and a half-cut process for removing a chamfered portion formed by chamfering the outer peripheral edge of the wafer are held by the holding table. A processing unit on which a cutting blade to be mounted on the wafer is mounted , a cleaning unit having a cleaning unit for cleaning the holding surface of the holding table, and a cleaning liquid supply path for supplying a cleaning liquid to the cleaning unit; A moving mechanism for moving between a cleaning position in contact with the surface and a retracted position away from the holding surface, and a relative mechanism for relatively moving the cleaning unit and the holding surface in a direction parallel to the holding surface. A moving mechanism, and a concave portion for accommodating the cleaning unit at the retracted position, wherein the cleaning liquid is supplied from the cleaning liquid supply path in a state where the cleaning unit is accommodated in the concave portion, and the cleaning unit is cleaned. Washing Comprising a cleaning unit, and before starting the cleaning of the holding surface, and after cleaning of the holding surface is completed, the cleaning unit processing apparatus that is positioned in the retreat position is provided.

In one embodiment of the present invention, it is preferable that the cleaning section is accommodated in the recess filled with the cleaning liquid .

  Since the processing device according to one aspect of the present invention includes the cleaning unit for cleaning the annular holding surface of the holding table, even when foreign matter such as processing waste generated during processing adheres to the holding surface. In addition, foreign matters can be removed by cleaning the holding surface. That is, according to the processing apparatus of one embodiment of the present invention, foreign matter remaining on the holding table can be appropriately removed, so that the cutting depth of the cutting blade can be controlled to process the wafer with high accuracy.

It is a perspective view showing typically the example of composition of a processing device. It is a figure which shows typically the external appearance of a table washing unit typically. It is a figure which shows typically the cross section of a table cleaning unit typically. FIG. 4A is a view schematically showing a half-cut step (half-cut processing) for removing a chamfered part, and FIG. 4B is a view schematically showing a cleaning step. FIGS. 5A and 5B are views schematically showing the holding table cleaning step. FIGS. 6A and 6B are diagrams schematically showing the holding table cleaning step.

  An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically illustrating a configuration example of a processing apparatus according to the present embodiment. As shown in FIG. 1, the processing apparatus 2 includes a base 4 that supports each structure. On the front end side of the upper surface of the base 4, a rectangular opening 4a long in the Y-axis direction (left and right direction, indexing feed direction) is formed, and a first transfer for transferring the wafer 11 is formed in the opening 4a. A mechanism (first transport unit) 6 is provided.

  A rectangular opening 4b is formed behind one end of the opening 4a in the Y-axis direction, and a cassette support 8 is provided in the opening 4b so as to be able to move up and down. A rectangular parallelepiped cassette 10 for accommodating a plurality of wafers (workpieces) 11 is mounted on the upper surface of the cassette support 8.

  The wafer 11 is, for example, a circular substrate made of a semiconductor such as silicon. The surface 11a of the wafer 11 is divided into a central device region (central portion) and an outer peripheral surplus region (outer peripheral portion) surrounding the device region. I have. The device region is further divided into a plurality of regions by lines to be divided (streets) arranged in a lattice shape, and devices 13 such as ICs and LSIs are formed in each region.

  In addition, the wafer 11 includes a chamfered portion 11c (see FIG. 4A) formed by chamfering the outer peripheral edge. The processing device 2 is used for cutting and removing the chamfered portion 11c. In this embodiment, the wafer 11 is a circular substrate made of a semiconductor such as silicon. However, the material, shape, and the like of the wafer 11 are not limited. For example, a substrate made of a material such as ceramic, resin, or metal can be used as the wafer 11.

  A rectangular opening 4c long in the X-axis direction (front-back direction, processing feed direction) is formed obliquely rearward of the cassette support base 8. In the opening 4c, an X-axis moving table 12, an X-axis moving mechanism (processing feed means) (not shown) for moving the X-axis moving table 12 in the X-axis direction, and a dustproof and drip-proof cover 14 for covering the X-axis moving mechanism Is provided.

  The X-axis moving mechanism includes a pair of X-axis guide rails (not shown) substantially parallel to the X-axis direction, and the X-axis moving table 12 is slidably mounted on the X-axis guide rail. A nut (not shown) is provided on the lower surface side of the X-axis moving table 12, and an X-axis ball screw (not shown) substantially parallel to the X-axis guide rail is screwed to the nut.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 12 moves in the X-axis direction along the X-axis guide rail.

  Above the X-axis moving table 12, a holding table (holding means) 16 for holding an outer peripheral portion of the wafer 11 transferred from the cassette 10 by the first transfer mechanism 6 is provided. The holding table 16 is connected to a rotation drive source (relative moving mechanism, relative moving means) (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). The holding table 16 is processed and fed in the X-axis direction by the X-axis moving mechanism described above.

  The holding table 16 has a cylindrical base portion 18 (see FIG. 4 (A)) made of metal such as stainless steel, and an upper surface 18a (see FIG. 4 (A) etc.) of the base portion 18 made of resin or the like. And an annular holding portion 20 (see FIG. 4 (A) and the like) to be fixed. The upper surface of the holding unit 20 is a holding surface 20a (see FIG. 4A and the like) that holds the outer peripheral portion of the wafer 11 from the back surface 11b side. An upper end of a through-hole 20b (see FIG. 4 (A) and the like) penetrating the holding portion 20 vertically is opened in the holding surface 20a.

  One end of a suction passage 18b (see FIG. 4A) formed inside the base 18 is connected to the lower end of the through hole 20b. A suction source 24 (see FIG. 4A) is connected to the other end of the suction path 18b via an on-off valve 22 (see FIG. 4A) and the like. This allows the negative pressure generated by the suction source 24 to act on the wafer 11 on the holding surface 20a.

  On the upper surface of the base 4, a portal-shaped support structure 28 that supports two sets of processing units (processing means) 26 is disposed so as to straddle the opening 4 c. At the upper part of the front surface of the support structure 28, two sets of processing unit moving mechanisms (index feed means, elevating means) 30 for moving each processing unit 26 in the Y-axis direction and the Z-axis direction are provided.

  Each processing unit moving mechanism 30 has a pair of Y-axis guide rails 32 arranged in front of the support structure 28 and substantially parallel to the Y-axis direction. A Y-axis moving plate 34 constituting each processing unit moving mechanism 30 is slidably attached to the Y-axis guide rail 32.

  A nut (not shown) is provided on the rear surface side (rear surface side) of each Y-axis moving plate 34, and a Y-axis ball screw 36 that is substantially parallel to the Y-axis guide rail 32 is screwed into the nut. ing. A Y-axis pulse motor 38 is connected to one end of each Y-axis ball screw 36. When the Y-axis ball screw 36 is rotated by the Y-axis pulse motor 38, the Y-axis moving plate 34 moves in the Y-axis direction along the Y-axis guide rail 32.

  A pair of Z-axis guide rails 40 substantially parallel to the Z-axis direction are provided on the front surface (front surface) of each Y-axis moving plate 34. A Z-axis moving plate 42 is slidably attached to the Z-axis guide rail 40.

  A nut (not shown) is provided on the rear surface side (rear surface side) of each Z-axis moving plate 42, and a Z-axis ball screw 44 substantially parallel to the Z-axis guide rail 40 is screwed to the nut. ing. A Z-axis pulse motor 46 is connected to one end of each Z-axis ball screw 44. When the Z-axis ball screw 44 is rotated by the Z-axis pulse motor 46, the Z-axis moving plate 42 moves in the Z-axis direction along the Z-axis guide rail 40.

  A processing unit 26 is provided below each Z-axis moving plate 42. The processing unit 26 includes a spindle 48 (see FIG. 4A) that is a rotation axis substantially parallel to the Y-axis direction. An annular cutting blade 50 is mounted on one end of the spindle 48, and a rotary drive source such as a motor is connected to the other end of the spindle 48. In the vicinity of the processing unit 26, a camera (imaging unit, imaging means) (not shown) for imaging the wafer 11 and the like on the holding table 16 is provided.

  A circular opening 4d is formed behind the other end of the opening 4a (opposite to the opening 4b) in the Y-axis direction. In the opening 4d, a wafer cleaning unit (wafer cleaning means) 52 for cleaning the processed wafer 11 is provided. The wafer cleaning unit 52 includes a spinner table 54 for sucking and holding the wafer 11, and a nozzle 56 for ejecting a cleaning fluid to the wafer 11 sucked and held by the spinner table 54.

  The spinner table 54 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction. The spinner table 54 is connected to a lifting mechanism (not shown), and can move between an upper loading / unloading position and a lower cleaning position. The upper surface of the spinner table 54 is a holding surface 54a (see FIG. 4B) for sucking and holding the central portion of the wafer 11 from the back surface 11b side.

  The holding surface 54a is connected to a suction source 60 (see FIG. 4 (B)) through a suction path 54b (see FIG. 4 (B)) formed inside the spinner table 54, an opening / closing valve 58 (see FIG. 4 (B)), and the like. B)). By applying the negative pressure generated by the suction source 60 to the wafer 11 on the holding surface 54a, the wafer 11 can be sucked and held by the spinner table 54.

  A second transfer mechanism (second transfer means) 62 for transferring the processed wafer 11 from the holding table 16 to the spinner table 54 is arranged near the openings 4c and 4d. The second transfer mechanism 62 includes a plurality (three in this embodiment) of grippers 64 for gripping the outer peripheral edge of the wafer 11.

  The gripper 64 is moved in the radial direction of the wafer 11 in accordance with slits (recesses) 18 c and 20 c (see FIG. 4A) formed on the outer periphery of the holding table 16, so that the wafer 11 on the holding table 16 is moved. Can be gripped by the gripper 64. The wafer 11 transferred by the second transfer mechanism 62 is placed on the holding surface 54a of the spinner table 54, for example, in such a manner that the surface 11a side is exposed upward. The washed wafer 11 is accommodated in the cassette 10 by the first transfer mechanism 6.

  A table cleaning unit (cleaning unit, cleaning means) 66 for cleaning the holding surface 20a of the holding table 16 is arranged near the opening 4c. FIG. 2 is a diagram schematically illustrating an appearance of the table cleaning unit 66, and FIG. 3 is a diagram schematically illustrating a cross section of the table cleaning unit 66.

  As shown in FIGS. 2 and 3, the table cleaning unit 66 includes a columnar holder 68. The holder 68 includes a cylindrical case 70 having a space therein, and a cap 72 for closing an upper part of the case 70. Inside the case 70, a cleaning member (cleaning unit) 74 made of a sponge or the like is accommodated. The lower portion of the cleaning member 74 is exposed (projects downward) to the outside of the case 70 through an opening 70 a formed on the lower surface of the case 70.

  The cap 72 has a cleaning liquid supply hole 72a for supplying the cleaning liquid 21 such as pure water to a space inside the case 70 in which the cleaning member 74 is stored. The cleaning liquid supply hole 72a is connected to a cleaning liquid supply source 78 via a cleaning liquid supply path 76 composed of a pipe or the like. When the holding table 16 is cleaned by the table cleaning unit 66, the cleaning liquid 21 is supplied from the cleaning liquid supply source 78 to the cleaning member 74 through the cleaning liquid supply path 76.

  The table cleaning unit 66 is supported by a table cleaning unit moving mechanism (moving mechanism, moving means) 80. The table cleaning unit moving mechanism 80 includes, for example, an air cylinder 82 fixed to the base 4 and a piston rod 84 inserted into the air cylinder 82.

  The back side of the moving plate 86 is fixed to the tip of the piston rod 84. By controlling the amount of air supply to the air cylinder 82, the moving plate 86 can be moved in the Y-axis direction. A pair of guide rails 88 substantially parallel to the Z-axis direction are provided on the surface of the moving plate 86. An L-shaped support plate 90 is slidably attached to the guide rail 88.

  A nut (not shown) is provided on the back surface side (guide rail 86 side) of the support plate 90, and a ball screw (not shown) substantially parallel to the guide rail 88 is screwed to the nut. A pulse motor (not shown) is connected to one end of the ball screw. When the ball screw is rotated by the pulse motor, the support plate 90 moves along the guide rail 88 in the Z-axis direction. The table cleaning unit 66 is fixed to the tip of the support plate 90.

  A cleaning member cleaning unit (cleaning unit cleaning unit, cleaning unit cleaning means) 94 is provided at a lower front portion of the air cylinder 82 via an L-shaped support 92. On the upper surface side of the cleaning member cleaning unit 94, a concave portion 94a capable of housing the cleaning member 74 exposed below the case 70 is formed.

  For example, the cleaning member 74 is accommodated in the concave portion 94a, and the cleaning liquid 21 is supplied from the cleaning liquid supply source 78, so that foreign matters such as processing chips adhered to the lower portion of the cleaning member 74 can be removed. In this case, the recess 94a may be filled with the cleaning liquid 21 in advance. This makes it possible to more reliably remove foreign matter attached to the lower portion of the cleaning member 74.

  A cleaning liquid discharge port 94b is formed at the bottom of the concave portion 94a, and the cleaning liquid 21 in the concave portion 94a is gradually discharged through the cleaning liquid discharge port 94b. By discharging the cleaning liquid 21 in the concave portion 94a through the cleaning liquid discharge port 94b, the cleaning liquid 21 hardly stays in the concave portion 94a, and the cleaning liquid 21 in the concave portion 94a can be always kept in a clean state. It is desirable that the size of the cleaning liquid outlet 94b be adjusted in accordance with the supply amount of the cleaning liquid 21 so that the recess 94a is always filled with the cleaning liquid 21.

  Next, an outline of a wafer processing method performed by the processing apparatus 2 will be described. FIG. 4A is a diagram schematically showing a half-cutting step (half-cutting) for removing the chamfered portion 11c. In the half-cut process, first, the wafer 11 is transported from the cassette 10 by the first transport mechanism 6, and the wafer 11 is placed on the holding table 16 in such a manner that the front surface 11a is exposed upward. Specifically, the outer peripheral portion of the wafer 11 is overlaid on the holding surface 20a of the holding table 16.

  Next, the on-off valve 22 is opened to apply the negative pressure of the suction source 24 to the wafer 11. Thereby, the wafer 11 can be sucked and held by the holding table 16. After the wafer 11 is sucked and held, the holding table 16 and the processing unit 26 are relatively moved to align the cutting blade 50 above the chamfered portion 11c.

  Then, the rotated cutting blade 50 is lowered, and as shown in FIG. 4A, the cutting blade 50 is cut into the chamfered portion 11c of the wafer 11. At the same time, the holding table 16 is rotated. As a result, the cutting blade 50 is cut into the entire circumference of the wafer 11, and the surface 11a side of the chamfered portion 11c can be cut and removed.

  In addition, the descending amount (cutting depth) of the cutting blade 50 is set according to conditions such as the finished thickness of the wafer 11, for example. Further, the thickness (width) of the cutting blade 50, the number of times the cutting blade 50 is cut, the position where the cutting blade 50 is cut, and the like are set according to conditions such as the size of the chamfered portion 11c.

  After the half cutting step, a wafer cleaning step of cleaning the wafer 11 is performed. FIG. 4B is a diagram schematically showing a wafer cleaning step. In the wafer cleaning process, first, the wafer 11 is transported from the holding table 16 by the second transport mechanism 62, and the wafer 11 is placed on the spinner table 54 such that the front surface 11a is exposed upward. Specifically, the central portion of the wafer 11 is overlaid on the holding surface 54a of the spinner table 54. The spinner table 54 has been moved to an upper carry-in / out position in advance.

  Next, the on-off valve 58 is opened to apply the negative pressure of the suction source 60 to the wafer 11. Thereby, the wafer 11 can be sucked and held by the spinner table 54. After sucking and holding the wafer 11, the spinner table 54 is moved to a lower cleaning position. Thereafter, as shown in FIG. 4B, the spinner table 54 is rotated, and the cleaning fluid 23 is ejected from the upper nozzle 56. Thereby, the wafer 11 can be cleaned. At this time, the fluid 23 may be ejected while moving the nozzle 56 in the horizontal direction. As the fluid 23, for example, a liquid such as pure water, a mixed fluid in which a gas such as air is mixed with the liquid, or the like can be used.

  In the wafer processing method according to the present embodiment, a holding table cleaning step of cleaning the holding surface 20a of the holding table 16 is performed in parallel with the wafer cleaning step. The holding table cleaning step is started, for example, after the wafer 11 is transferred from the holding table 16 in the wafer cleaning step. FIGS. 5A, 5B, 6A and 6B are views schematically showing the holding table cleaning step.

  Before starting the holding table cleaning step, as shown in FIG. 5A, the table cleaning unit 66 is previously moved to a retracted position away from the holding table 16 (the holding surface 20a). In this retracted position, the cleaning member 74 is housed in the recess 94a of the cleaning member cleaning unit 94.

  When the cleaning liquid 21 is supplied from the cleaning liquid supply source 78 in a state where the cleaning member 74 is accommodated in the concave portion 94a, the foreign matter attached to the lower portion of the cleaning member 74 can be removed. In the present embodiment, since the cleaning member 74 is made of a porous material such as a sponge, as shown in FIG. Foreign matter adhering to the cleaning member 74 can be removed.

  In the holding table cleaning step, first, the table cleaning unit 66 in the retracted position is raised by the table cleaning unit moving mechanism 80, and the cleaning member 74 is removed from the concave portion 94a of the cleaning member cleaning unit 94 as shown in FIG. Take out. Next, as shown in FIG. 6 (A), the table cleaning unit 66 is moved in the horizontal direction, and the cleaning member 74 is positioned just above the holding surface 20a.

  Thereafter, as shown in FIG. 6B, with the holding table 16 rotated, the table cleaning unit 66 is lowered to a cleaning position where the lower portion of the cleaning member 74 contacts the holding surface 20a. Thereby, the cleaning member 74 and the holding surface 20a that are in contact with each other are relatively moved in a direction parallel to the holding surface 20a, and the holding surface 20a can be cleaned by the cleaning member 74.

  When the cleaning member 74 is brought into contact with the holding surface 20a, it is desirable that the cleaning liquid 21 be supplied from the cleaning liquid supply source 78 in advance. Thereby, the holding surface 20a can be appropriately cleaned. When the cleaning of the holding surface 20a is completed, the table cleaning unit 66 is moved to the retreat position in a procedure reverse to the procedure described above.

  As described above, the processing apparatus 2 according to the present embodiment includes the table cleaning unit (cleaning unit, cleaning means) 66 for cleaning the annular holding surface 20a of the holding table 16, so that the processing apparatus 2 generates during processing. Even when foreign matter such as processing dust adheres to the holding surface 20a, the foreign matter can be removed by cleaning the holding surface 20a. That is, according to the processing apparatus 2 according to the present embodiment, the foreign matter remaining on the holding table 16 can be appropriately removed, so that the cutting depth of the cutting blade 50 can be controlled to process the wafer with high precision.

  Further, in the processing apparatus 2 according to the present embodiment, since the foreign matter remaining on the holding table 16 can be appropriately removed as described above, for example, based on a captured image obtained by capturing the outer peripheral edge of the wafer 11 with a camera or the like. When the cutting position of the cutting blade 50 is determined by the above, the possibility that a foreign matter appears in the captured image can be suppressed low. That is, the possibility that the outer peripheral edge of the wafer 11 cannot be determined due to the foreign matter remaining on the holding table 16 is reduced, and the chamfered portion 11c can be reliably cut and removed by cutting the cutting blade 50 into an appropriate position.

  The present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above embodiment, the holding table cleaning step is performed in parallel with the wafer cleaning step, but the timing and frequency of performing the holding table cleaning step can be arbitrarily set and changed. The holding table cleaning step may be performed each time processing of one wafer 11 is completed, or the holding table cleaning step may be performed after processing a plurality of wafers 11.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Processing device 4 Base 4a, 4b, 4c, 4d Opening 6 First transport mechanism (first transport means)
Reference Signs List 8 Cassette support stand 10 Cassette 12 X-axis moving table 14 Dust-proof drip-proof cover 16 Holding table (holding means)
18 Base part 18a Upper surface 18b Suction path 18c Slit (recess)
Reference Signs List 20 holding unit 20a holding surface 20b through hole 20c slit (recess)
22 On-off valve 24 Suction source 26 Processing unit (processing means)
28 Support structure 30 Processing unit moving mechanism (indexing and feeding means, elevating means)
32 Y axis guide rail 34 Y axis moving plate 36 Y axis ball screw 38 Y axis pulse motor 40 Z axis guide rail 42 Z axis moving plate 44 Z axis ball screw 46 Z axis pulse motor 48 spindle 50 Cutting blade 52 Wafer cleaning unit (wafer cleaning) means)
54 Spinner table 54a Holding surface 54b Suction path 56 Nozzle 58 Open / close valve 60 Suction source 62 Second transport mechanism (second transport means)
64 Holder 66 Table cleaning unit (cleaning unit, cleaning means)
68 Holder 70 Case 70a Opening 72 Cap 72a Cleaning liquid supply hole 74 Cleaning member (cleaning unit)
76 Cleaning liquid supply path 78 Cleaning liquid supply source 80 Table cleaning unit moving mechanism (moving mechanism, moving means)
82 Air cylinder 84 Piston rod 86 Moving plate 88 Guide rail 90 Support plate 92 Support tool 94 Cleaning member cleaning unit (cleaning unit cleaning unit, cleaning unit cleaning means)
94a recess 11 wafer (workpiece)
11a Surface 11b Back 11c Chamfered part 13 Device 21 Cleaning liquid 23 Fluid

Claims (2)

A holding table having an annular holding surface for holding an outer peripheral portion of the wafer,
A processing unit to which a cutting blade for applying a half-cut process to the wafer held by the holding table to remove a chamfered portion formed by chamfering an outer peripheral edge of the wafer is mounted ,
A cleaning unit having a cleaning unit for cleaning the holding surface of the holding table and a cleaning liquid supply path for supplying a cleaning liquid to the cleaning unit;
A moving mechanism for moving the cleaning unit between a cleaning position in contact with the holding surface and a retracted position away from the holding surface;
A relative movement mechanism that relatively moves the cleaning unit and the holding surface in a direction parallel to the holding surface,
A cleaning unit cleaning unit having a recess for accommodating the cleaning unit at the retracted position, and cleaning the cleaning unit by supplying the cleaning liquid from the cleaning liquid supply path in a state in which the cleaning unit is accommodated in the recess; and, with a,
Before starting the cleaning of the holding surface, and after cleaning of the holding surface is completed, the processing apparatus in which the cleaning unit is characterized Rukoto positioned to the retracted position. The processing apparatus according to claim 1 , wherein the cleaning unit is housed in the recess filled with the cleaning liquid .