JP7493465B2 - Processing device and method for carrying out workpiece - Google Patents

Processing device and method for carrying out workpiece Download PDF

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JP7493465B2
JP7493465B2 JP2021001746A JP2021001746A JP7493465B2 JP 7493465 B2 JP7493465 B2 JP 7493465B2 JP 2021001746 A JP2021001746 A JP 2021001746A JP 2021001746 A JP2021001746 A JP 2021001746A JP 7493465 B2 JP7493465 B2 JP 7493465B2
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workpiece
holding
suction
processing
unit
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JP2022106618A (en
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奈津子 花村
聡 花島
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Disco Corp
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Disco Corp
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Priority to CN202111630473.6A priority patent/CN114743909A/en
Priority to TW110149694A priority patent/TW202228195A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Feeding Of Workpieces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、保持テーブルから被加工物を搬出する加工装置及び被加工物の搬出方法に関する。 The present invention relates to a processing device that removes a workpiece from a holding table and a method for removing the workpiece.

保持テーブルで保持した被加工物を加工し、加工後の被加工物を保持テーブルから搬出する加工装置が知られている（例えば、特許文献１、２参照）。 There is known a processing device that processes a workpiece held on a holding table and then removes the processed workpiece from the holding table (see, for example, Patent Documents 1 and 2).

特開２０１６－１２７１９５号公報JP 2016-127195 A 特許第６３０９３７１号公報Japanese Patent No. 6309371

加工後に保持テーブルから被加工物を搬出する際に、被加工物と保持テーブルの保持面との間に入り込んだ加工用の液体（水）の表面張力により搬出できないという問題があった。そこで、保持面に溜まった水を抜くために被加工物の搬出時に保持面に負圧を導入して、被加工物を吸引保持しつつ水を吸い込むことで水を抜き、表面張力による固定を解除しているが、被加工物と保持面との間が真空になった状態でいくら吸引しても保持面に残った水がすべて除去できず、保持面からの搬出時に搬送エラーが発生することがあるという問題があった。 When removing the workpiece from the holding table after processing, there was a problem that it could not be removed due to the surface tension of the processing liquid (water) that had gotten in between the workpiece and the holding surface of the holding table. To remove the water that had accumulated on the holding surface, negative pressure was introduced to the holding surface when the workpiece was removed, and the workpiece was sucked in while being held by suction, thereby removing the water and releasing the fixation caused by surface tension. However, when a vacuum was created between the workpiece and the holding surface, no matter how much suction was applied, it was not possible to remove all of the water remaining on the holding surface, and there was a problem that transport errors could occur when removing the workpiece from the holding surface.

本発明は、かかる問題点に鑑みてなされたものであり、その目的は、加工後の被加工物を搬出する際に、保持面上の水抜きをより強力に行い、被加工物の搬出をより確実に行える加工装置及び被加工物の搬出方法を提供することである。 The present invention was made in consideration of these problems, and its purpose is to provide a processing device and a method for transporting a processed workpiece that can more effectively drain water from the holding surface when transporting the processed workpiece, and can more reliably transport the workpiece.

上述した課題を解決し、目的を達成するために、本発明の加工装置は、被加工物を保持する保持面を有する保持テーブルと、該保持テーブルに保持された被加工物を加工する加工ユニットと、該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、該保持テーブルから被加工物を搬出する搬出ユニットと、制御ユニットと、を有する加工装置であって、該保持テーブルは、被加工物を吸引保持する中央領域を有するポーラス板と、該ポーラス板を収容する凹部を有する枠体と、該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、該制御ユニットは、該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し、該外周領域からエアを噴出させて被加工物の外周部を該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除した状態で、該搬出ユニットによって被加工物を該保持テーブルから搬出することを特徴とする。 In order to solve the above-mentioned problems and achieve the object, the processing device of the present invention is a processing device having a holding table having a holding surface for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a liquid supply nozzle for supplying processing liquid to a processing point processed by the processing unit, a carrying-out unit for carrying the workpiece from the holding table, and a control unit, and the holding table has a porous plate having a central area for suction-holding the workpiece, a frame having a recess for accommodating the porous plate, and a suction hole formed on the bottom surface of the frame for connecting the central area to a suction source. The control unit is characterized in that it has a suction line that sucks the workpiece into the central region and an air supply line that is connected to an air supply source and that blows air from an outer peripheral region that surrounds the central region, and the control unit connects the porous plate to the suction source through the suction line to suck the workpiece into the central region, supplies air to the air supply line while removing water between the porous plate and the workpiece, blows air from the outer peripheral region to lift the outer periphery of the workpiece from the holding surface, and, in a state in which the surface tension of the water between the porous plate and the workpiece is released, the unloading unit unloads the workpiece from the holding table.

上述した課題を解決し、目的を達成するために、本発明の被加工物の搬出方法は、被加工物を保持する保持面を有する保持テーブルと、該保持テーブルに保持された被加工物を加工する加工ユニットと、該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、該保持テーブルから被加工物を搬出する搬出ユニットと、を有する加工装置において、被加工物を該搬出ユニットによって該保持テーブルから搬出する搬出方法であって、該保持テーブルは、被加工物を吸引保持する中央領域を有するポーラス板と、該ポーラス板を収容する凹部を有する枠体と、該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し該外周領域からエアを噴出させて被加工物の外周部のみを該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除する外周浮上ステップと、該搬出ユニットによって被加工物を保持する被加工物保持ステップと、該被加工物保持ステップ及び該外周浮上ステップの後、該中央領域における被加工物の吸引を遮断して該保持テーブルから被加工物全体を離反させて該保持テーブルから被加工物を搬出する搬出ステップと、を備える。 In order to solve the above-mentioned problems and achieve the object, the method of carrying out a workpiece of the present invention is a method of carrying out a workpiece from a holding table having a holding surface for holding the workpiece, a processing unit for processing the workpiece held on the holding table, a liquid supply nozzle for supplying processing liquid to a processing point processed by the processing unit, and a carrying-out unit for carrying out the workpiece from the holding table, the method being a carrying out of a workpiece from the holding table by the carrying-out unit, the holding table comprising a porous plate having a central region for suction-holding the workpiece, a frame having a recess for accommodating the porous plate, a suction line formed on the bottom surface of the frame for connecting the central region to a suction source, and a suction line for sucking air from an outer peripheral region surrounding the central region. The apparatus includes an air supply line connected to an air supply source that blows out air from the porous plate, and a peripheral floating step in which the porous plate and the suction source are connected by the suction line to suck the workpiece in the central region, and while removing water between the porous plate and the workpiece, air is supplied to the air supply line and blown out from the peripheral region to lift only the peripheral portion of the workpiece from the holding surface, thereby releasing the surface tension of the water between the porous plate and the workpiece; a workpiece holding step in which the unloading unit holds the workpiece; and a carrying step in which, after the workpiece holding step and the peripheral floating step, the suction of the workpiece in the central region is cut off, the entire workpiece is separated from the holding table, and the workpiece is carried out from the holding table.

本発明は、加工後の被加工物を搬出する際に、保持面上の水抜きをより強力に行い、被加工物の搬出をより確実に行える。 When removing the processed workpiece, the present invention allows for more powerful drainage of water from the holding surface, making it possible to more reliably remove the workpiece.

図１は、実施形態に係る加工装置の構成例を示す斜視図である。FIG. 1 is a perspective view showing an example of the configuration of a processing device according to an embodiment. 図２は、図１の加工装置の要部を示す断面図である。FIG. 2 is a cross-sectional view showing a main part of the processing apparatus of FIG. 図３は、図１の加工装置１の要部を示す斜視図である。FIG. 3 is a perspective view showing a main part of the processing apparatus 1 of FIG. 図４は、実施形態に係る被加工物の搬出方法の処理手順の一例を示すフローチャートである。FIG. 4 is a flowchart showing an example of a processing procedure of the workpiece carrying-out method according to the embodiment.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。 The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

〔実施形態〕
本発明の実施形態に係る加工装置１及び被加工物の搬出方法を図面に基づいて説明する。図１は、実施形態に係る加工装置１の構成例を示す斜視図である。図２は、図１の加工装置１の要部を示す断面図である。図３は、図１の加工装置１の要部を示す斜視図である。実施形態に係る加工装置１は、図１に示すように、保持テーブル１０と、加工ユニット２０と、液体供給ノズル３０と、第１搬出ユニット４０と、第２搬出ユニット５０と、制御ユニット６０と、表示ユニット７０と、洗浄ユニット８０と、カセット載置台９０と、を有する。 [Embodiment]
A processing apparatus 1 and a method for carrying out a workpiece according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of the processing apparatus 1 according to the embodiment. Fig. 2 is a cross-sectional view showing a main part of the processing apparatus 1 of Fig. 1. Fig. 3 is a perspective view showing a main part of the processing apparatus 1 of Fig. 1. As shown in Fig. 1, the processing apparatus 1 according to the embodiment has a holding table 10, a processing unit 20, a liquid supply nozzle 30, a first carrying-out unit 40, a second carrying-out unit 50, a control unit 60, a display unit 70, a cleaning unit 80, and a cassette mounting table 90.

本実施形態において、加工装置１が加工する加工対象である被加工物１００は、例えば、シリコン、サファイア、シリコンカーバイド（ＳｉＣ）、ガリウムヒ素、ガラスなどを母材とする円板状の半導体ウエーハや光デバイスウエーハなどである。被加工物１００は、図１に示すように、平坦な表面１０１の格子状に形成される複数の分割予定ライン１０２によって区画された領域にチップサイズのデバイス１０３が形成されている。本発明において被加工物１００は、粘着テープに貼着されず、被加工物１００の単体で処理されてもよい。例えば完全に分割しない深さの溝を形成するハーフカットを精度良く施したい場合は粘着テープの厚みばらつきに影響を受けないようにするため、被加工物１００の単体で加工される場合が多い。また、被加工物１００は、表面１０１の裏側の裏面１０４に粘着テープが貼着され、粘着テープの外縁部に環状フレームが装着されてもよい。また、環状フレームに装着されず、同形の粘着テープに貼着されていても良い。また、被加工物１００は、本発明では、樹脂により封止されたデバイスを複数有した矩形状のパッケージ基板、セラミックス板、又はガラス板等でも良い。 In this embodiment, the workpiece 100, which is the object to be processed by the processing device 1, is, for example, a disk-shaped semiconductor wafer or an optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. As shown in FIG. 1, the workpiece 100 has chip-sized devices 103 formed in areas partitioned by a plurality of planned division lines 102 formed in a lattice shape on a flat surface 101. In the present invention, the workpiece 100 may be processed as a single piece of workpiece 100 without being attached to an adhesive tape. For example, when it is desired to perform a half cut with high accuracy to form a groove with a depth that does not completely divide, the workpiece 100 is often processed as a single piece of workpiece 100 so as not to be affected by variations in the thickness of the adhesive tape. In addition, the workpiece 100 may have an adhesive tape attached to the back surface 104 on the back side of the front surface 101, and an annular frame may be attached to the outer edge of the adhesive tape. In addition, the workpiece 100 may be attached to an adhesive tape of the same shape without being attached to an annular frame. In addition, in the present invention, the workpiece 100 may be a rectangular package substrate having multiple devices sealed with resin, a ceramic plate, a glass plate, or the like.

保持テーブル１０は、図２に示すように、ポーラス板１１と、枠体１２と、吸引ライン１６と、エア供給ライン１８と、を備える。ポーラス板１１は、多数のポーラス孔を備えたポーラスセラミック等で円盤形状に形成されている。枠体１２は、ステンレス等で円盤状に形成されており、中央にポーラス板１１を収容する凹部１４が形成されている。ポーラス板１１は、枠体１２の凹部１４に嵌め込まれる。 As shown in FIG. 2, the holding table 10 includes a porous plate 11, a frame 12, a suction line 16, and an air supply line 18. The porous plate 11 is formed in a disk shape from porous ceramics or the like with a large number of porous holes. The frame 12 is formed in a disk shape from stainless steel or the like, and has a recess 14 in the center to accommodate the porous plate 11. The porous plate 11 is fitted into the recess 14 of the frame 12.

保持テーブル１０は、被加工物１００が載置されて、載置された被加工物１００を保持する保持面１３を有する。保持面１３は、ポーラス板１１の上面と、枠体１２の上面と、により構成される。ポーラス板１１の上面と枠体１２の上面とは、同一平面上に配置されており、かつ、水平面であるＸＹ平面に平行に形成されている。保持面１３は、本実施形態では、被加工物１００が表面１０１を上方に向けて載置され、載置された被加工物１００を裏面１０４側から直接保持する。枠体１２の上面は、被加工物１００よりポーラス板１１の径が小さい場合、ポーラス板１１からはみ出した被加工物１００の外周部を支持する。 The holding table 10 has a holding surface 13 on which the workpiece 100 is placed and which holds the placed workpiece 100. The holding surface 13 is composed of the upper surface of the porous plate 11 and the upper surface of the frame 12. The upper surfaces of the porous plate 11 and the frame 12 are arranged on the same plane and are formed parallel to the horizontal XY plane. In this embodiment, the workpiece 100 is placed on the holding surface 13 with the front surface 101 facing upward, and the holding surface 13 directly holds the placed workpiece 100 from the back surface 104 side. When the diameter of the porous plate 11 is smaller than that of the workpiece 100, the upper surface of the frame 12 supports the outer periphery of the workpiece 100 that protrudes from the porous plate 11.

吸引ライン１６は、図２に示すように、枠体１２の凹部１４の底面１４－１の中央部分１５－１に形成され、吸引バルブ１６－１を介してポーラス板１１の中央領域１３－１と吸引源１７とを連通させる。ポーラス板１１の中央領域１３－１は、図２に示すように、吸引バルブ１６－１を開放して吸引ライン１６により吸引源１７からの負圧が導入されることにより、載置された被加工物１００を吸引保持する吸引エリアとなる。 As shown in FIG. 2, the suction line 16 is formed in the central portion 15-1 of the bottom surface 14-1 of the recess 14 of the frame 12, and connects the central region 13-1 of the porous plate 11 to the suction source 17 via the suction valve 16-1. As shown in FIG. 2, the central region 13-1 of the porous plate 11 becomes a suction area that suction-holds the placed workpiece 100 by opening the suction valve 16-1 and introducing negative pressure from the suction source 17 through the suction line 16.

エア供給ライン１８は、図２に示すように、枠体１２の凹部１４の底面１４－１の外周部分１５－２に形成され、エア供給バルブ１８－１を介してポーラス板１１の中央領域１３－１を囲繞する外周領域１３－２とエア供給源１９とを連通させ、中央領域１３－１を囲繞する外周領域１３－２からエアを噴出させる。ここで、ポーラス板１１の上面は、中央領域１３－１と外周領域１３－２とを有し、外周領域１３－２は、中央領域１３－１の外周側に位置している。エア供給ライン１８は、図２に示す例に限定されず、凹部１４を囲繞する枠体１２の内側面１４－２や枠体１２の環状凸部１４－３の上面からエアが噴出されるように形成されてもよい。 As shown in FIG. 2, the air supply line 18 is formed on the outer peripheral portion 15-2 of the bottom surface 14-1 of the recess 14 of the frame 12, and connects the outer peripheral region 13-2 surrounding the central region 13-1 of the porous plate 11 to the air supply source 19 via the air supply valve 18-1, and ejects air from the outer peripheral region 13-2 surrounding the central region 13-1. Here, the upper surface of the porous plate 11 has the central region 13-1 and the outer peripheral region 13-2, and the outer peripheral region 13-2 is located on the outer peripheral side of the central region 13-1. The air supply line 18 is not limited to the example shown in FIG. 2, and may be formed so that air is ejected from the inner surface 14-2 of the frame 12 surrounding the recess 14 or the upper surface of the annular protrusion 14-3 of the frame 12.

ここで、本実施形態では例えば、外周部分１５－２は、底面１４－１と同心であり、底面１４－１の内径の半分の円の外側の領域の部分を指す。また、中央部分１５－１は、底面１４－１においてエア供給ライン１８を形成した位置よりも径方向の内側の領域の部分を指す。 Here, in this embodiment, for example, the outer peripheral portion 15-2 is concentric with the bottom surface 14-1 and refers to the area outside a circle that is half the inner diameter of the bottom surface 14-1. Also, the central portion 15-1 refers to the area on the bottom surface 14-1 that is radially inward from the position where the air supply line 18 is formed.

保持テーブル１０において、図２に示すように、吸引バルブ１６－１を開放して吸引ライン１６により吸引源１７からの負圧が導入され、なおかつ、エア供給バルブ１８－１を開放してエア供給ライン１８によりエア供給源１９からのエアが導入されると、保持面１３の中央領域１３－１は、保持面１３上の被加工物１００を吸引しつつ、保持面１３と被加工物１００との間に入り込んだ加工用の液体３５を吸引して除去する吸引エリアとなり、外周領域１３－２は、中央領域１３－１を囲繞し、少なくとも１箇所にエアを噴出させるエア噴出口を有し、保持面１３上の被加工物１００の外周部を保持面１３から浮上させる噴出エリアとなる。 As shown in FIG. 2, when the suction valve 16-1 is opened on the holding table 10 to introduce negative pressure from the suction source 17 through the suction line 16, and the air supply valve 18-1 is opened to introduce air from the air supply source 19 through the air supply line 18, the central region 13-1 of the holding surface 13 becomes a suction area that sucks in the workpiece 100 on the holding surface 13 while sucking in and removing the processing liquid 35 that has entered between the holding surface 13 and the workpiece 100, and the peripheral region 13-2 surrounds the central region 13-1 and has at least one air outlet that ejects air, becoming an ejection area that lifts the outer periphery of the workpiece 100 on the holding surface 13 from the holding surface 13.

なお、ポーラス板１１の上面の中央領域１３－１と外周領域１３－２との境界は、本実施形態では、吸引ライン１６及びエア供給ライン１８が形成された位置、並びに、吸引ライン１６からの負圧の圧力値（ゲージ圧）及びエア供給ライン１８からのエアの供給量や供給圧等に応じて変わる。 In this embodiment, the boundary between the central region 13-1 and the peripheral region 13-2 on the upper surface of the porous plate 11 varies depending on the positions where the suction line 16 and the air supply line 18 are formed, as well as the negative pressure value (gauge pressure) from the suction line 16 and the amount and supply pressure of air from the air supply line 18.

保持テーブル１０は、不図示のＸ軸移動ユニットにより水平方向の一方向であるＸ軸方向に移動自在に設けられている。保持テーブル１０は、Ｘ軸移動ユニットによりＸ軸方向に沿って移動することで、図１に示すように、被加工物１００を搬入及び搬出する搬出入領域３と、被加工物１００を加工ユニット２０により加工する加工領域４との間を行き来する。保持テーブル１０は、不図示の回転駆動源により鉛直方向でありＸＹ平面に直交するＺ軸回りに回転自在に設けられている。 The holding table 10 is provided so as to be movable in the X-axis direction, which is one horizontal direction, by an X-axis moving unit (not shown). The holding table 10 moves along the X-axis direction by the X-axis moving unit, and moves back and forth between a loading/unloading area 3 where the workpiece 100 is loaded and unloaded, and a processing area 4 where the workpiece 100 is processed by a processing unit 20, as shown in FIG. 1. The holding table 10 is provided so as to be rotatable around the Z-axis, which is vertical and perpendicular to the XY plane, by a rotary drive source (not shown).

加工ユニット２０は、図１に示すように加工領域４に設けられており、加工領域４に位置付けられた保持テーブル１０の保持面１３で保持された被加工物１００を加工する。加工ユニット２０は、本実施形態では、スピンドルの先端に装着された切削ブレードを有し、スピンドルにより水平方向の別の一方向でありＸ軸方向に直交するＹ軸方向と平行な軸心周りの回転動作が加えられた切削ブレードで、加工領域４に位置付けられた保持テーブル１０に保持された被加工物１００を例えば分割予定ライン１０２に沿って切削する切削ユニットである。 As shown in FIG. 1, the processing unit 20 is provided in the processing area 4, and processes the workpiece 100 held on the holding surface 13 of the holding table 10 positioned in the processing area 4. In this embodiment, the processing unit 20 is a cutting unit that has a cutting blade attached to the tip of a spindle, and cuts the workpiece 100 held on the holding table 10 positioned in the processing area 4, for example along the planned division line 102, with the cutting blade rotated by the spindle about an axis parallel to the Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction.

なお、加工ユニット２０は、本発明ではこのような切削ユニットに限定されず、例えば、スピンドルの先端に装着された研削ホイールを有し、スピンドルによりＺ軸方向と平行な軸心周りの回転動作が加えられた研削ホイールで、加工領域４に位置付けられた保持テーブル１０に保持された被加工物１００の例えば裏面１０４側を研削する研削ユニットでもよい。また、加工ユニット２０は、スピンドルの先端に装着された研磨パッドを有し、スピンドルによりＺ軸方向と平行な軸心周りの回転動作が加えられた研磨パッドで、加工領域４に位置付けられた保持テーブル１０に保持された被加工物１００の例えば裏面１０４側を研磨する研磨ユニットでもよい。 In the present invention, the processing unit 20 is not limited to such a cutting unit, and may be, for example, a grinding unit having a grinding wheel attached to the tip of a spindle, and grinding, for example, the back surface 104 side of the workpiece 100 held on a holding table 10 positioned in the processing area 4 with the grinding wheel rotated by the spindle around an axis parallel to the Z-axis direction. Also, the processing unit 20 may be a polishing unit having a polishing pad attached to the tip of a spindle, and polishing, for example, the back surface 104 side of the workpiece 100 held on a holding table 10 positioned in the processing area 4 with the polishing pad rotated by the spindle around an axis parallel to the Z-axis direction.

液体供給ノズル３０は、加工ユニット２０に隣接して加工領域４に設けられ、不図示の液体供給源から供給される加工用の液体３５を、被加工物１００において加工ユニット２０で加工される加工点及び加工点の近傍の領域に供給する。加工点は、加工ユニット２０が前述の切削ユニットである場合、被加工物１００が切削ブレードで切削されている点である。加工点は、加工ユニット２０が研削ユニットや研磨ユニットである場合、被加工物１００が研削ホイールや研磨パッドで研削や研磨されている面上の任意の点である。加工用の液体３５は、加工ユニット２０の加工の種類や条件、仕様等に応じて適宜選択して使用することができ、本実施形態では、切削水、研削水、研磨水として使用する水（純水）である。 The liquid supply nozzle 30 is provided in the processing area 4 adjacent to the processing unit 20, and supplies the processing liquid 35 supplied from a liquid supply source (not shown) to the processing point on the workpiece 100 that is processed by the processing unit 20 and to the area near the processing point. When the processing unit 20 is the cutting unit described above, the processing point is the point where the workpiece 100 is cut by a cutting blade. When the processing unit 20 is a grinding unit or polishing unit, the processing point is any point on the surface where the workpiece 100 is ground or polished by a grinding wheel or polishing pad. The processing liquid 35 can be appropriately selected and used depending on the type, conditions, specifications, etc. of the processing of the processing unit 20, and in this embodiment, it is water (pure water) used as cutting water, grinding water, and polishing water.

第１搬出ユニット４０は、図１及び図２に示すように、第１搬出アーム４１と、Ｙ軸移動ユニット４２と、Ｚ軸移動ユニット４３と、板部材４４と、溝４５と、把持部４６と、エア供給源４７と、エア供給ライン４８と、を有する。第１搬出アーム４１は、上方側がＺ軸方向に沿って延び、下方側がＸ軸方向に沿って延びるＬ字状の部材であり、上方がＺ軸移動ユニット４３を介してＹ軸移動ユニット４２に接続されており、下方に板部材４４が固定されている。 1 and 2, the first ejection unit 40 has a first ejection arm 41, a Y-axis moving unit 42, a Z-axis moving unit 43, a plate member 44, a groove 45, a gripper 46, an air supply source 47, and an air supply line 48. The first ejection arm 41 is an L-shaped member whose upper side extends along the Z-axis direction and whose lower side extends along the X-axis direction, and whose upper part is connected to the Y-axis moving unit 42 via the Z-axis moving unit 43, and whose lower part has the plate member 44 fixed thereto.

Ｙ軸移動ユニット４２は、Ｚ軸移動ユニット４３とともに第１搬出アーム４１をＹ軸方向に沿って移動させる。Ｚ軸移動ユニット４３は、第１搬出アーム４１をＺ軸方向に沿って移動させる。Ｙ軸移動ユニット４２及びＺ軸移動ユニット４３は、それぞれ、例えば、Ｙ軸及びＺ軸の軸心回りに回転自在に設けられた周知のボールねじ、ボールねじを軸心回りに回転させる周知のパルスモータ、及び、第１搬出アーム４１をＹ軸方向またはＺ軸方向に移動自在に支持する周知のガイドレールを備えて構成されている。 The Y-axis moving unit 42 moves the first output arm 41 along the Y-axis direction together with the Z-axis moving unit 43. The Z-axis moving unit 43 moves the first output arm 41 along the Z-axis direction. The Y-axis moving unit 42 and the Z-axis moving unit 43 are each configured with, for example, a well-known ball screw that is rotatable around the axis of the Y axis and the Z axis, a well-known pulse motor that rotates the ball screw around the axis, and a well-known guide rail that supports the first output arm 41 so that it can be moved in the Y axis or Z axis direction.

板部材４４は、図１及び図３に示すように、円板状に形成されており、上方側が第１搬出アーム４１に支持されており、下方側には、中央から放射状に複数本（図１及び図３に示す例では３本）の溝４５が形成されている。板部材４４は、後述するカセット載置台９０に載置されたカセット９５の開口と対向する位置に、被加工物１００に装着された環状フレーム１０６を把持する把持部４６が設けられている。 As shown in Figs. 1 and 3, the plate member 44 is formed in a disk shape, with its upper side supported by the first discharge arm 41, and its lower side having multiple grooves 45 (three in the example shown in Figs. 1 and 3) formed radially from the center. The plate member 44 is provided with a gripping portion 46 for gripping the annular frame 106 attached to the workpiece 100 at a position facing the opening of a cassette 95 placed on a cassette placement table 90 described later.

溝４５は、図２及び図３に示すように、板部材４４の内部に形成されたエア供給ライン４８を介して、エア供給源４７と連通している。溝４５は、エア供給ライン４８との接続部分において、溝４５が延びる方向に直交する断面における溝４５の断面積が、エアが流れる方向に直交する断面におけるエア供給ライン４８の断面積よりも大きくなるように、形成される。 As shown in Figures 2 and 3, the groove 45 is connected to the air supply source 47 via an air supply line 48 formed inside the plate member 44. The groove 45 is formed so that at the connection portion with the air supply line 48, the cross-sectional area of the groove 45 in a cross section perpendicular to the direction in which the groove 45 extends is larger than the cross-sectional area of the air supply line 48 in a cross section perpendicular to the direction in which the air flows.

エア供給源４７から供給されたエアは、溝４５内を中央から放射方向に向かって高速で流れる。エア供給源４７から供給されたエアは、溝４５とエア供給ライン４８との断面積の関係から、エア供給ライン４８から溝４５に流れる際に加速して、溝４５の両脇の周囲の空気を引き込みながら溝４５内を流れるので、ベルヌーイ効果によって溝４５の近傍に負圧が生じる。第１搬出ユニット４０の板部材４４は、この溝４５の近傍に生じる負圧により、板部材４４が溝４５の形成された側に対向する保持テーブル１０の保持面１３上の被加工物１００を非接触で保持する。 The air supplied from the air supply source 47 flows at high speed from the center toward the radial direction within the groove 45. Due to the relationship between the cross-sectional areas of the groove 45 and the air supply line 48, the air supplied from the air supply source 47 accelerates as it flows from the air supply line 48 into the groove 45, and flows within the groove 45 while drawing in the surrounding air on both sides of the groove 45, so that negative pressure is generated near the groove 45 due to the Bernoulli effect. Due to the negative pressure generated near the groove 45, the plate member 44 of the first discharge unit 40 holds the workpiece 100 on the holding surface 13 of the holding table 10 facing the side where the groove 45 is formed, without contacting the plate member 44.

第１搬出ユニット４０の板部材４４は、本実施形態では、溝４５内にエアを流すことによりベルヌーイ効果によって生じる負圧により非接触で保持テーブル１０上の被加工物１００を保持するが、本発明ではこれに限定されず、板部材４４の下方側に設置された吸引パッドを被加工物１００の表面１０１に接触させて吸引パッドにより被加工物１００を吸引保持してもよいし、吸引パッドにより被加工物１００に粘着テープを介して装着された環状フレームの上面側を吸引保持してもよい。 In this embodiment, the plate member 44 of the first discharge unit 40 holds the workpiece 100 on the holding table 10 in a non-contact manner by the negative pressure generated by the Bernoulli effect by flowing air into the groove 45, but the present invention is not limited to this. A suction pad installed on the lower side of the plate member 44 may be brought into contact with the surface 101 of the workpiece 100 to suction and hold the workpiece 100 by the suction pad, or the suction pad may suction and hold the upper surface side of an annular frame attached to the workpiece 100 via adhesive tape.

第１搬出ユニット４０は、カセット載置台９０に載置されたカセット９５内の加工前の被加工物１００を把持部４６で把持して取り出し、搬出入領域３に保持テーブル１０の移動領域よりも上方に設けられた被加工物１００の仮置き用の一対のガイドレール９３上に載置する。第１搬出ユニット４０は、一対のガイドレール９３上に載置した加工前の被加工物１００をベルヌーイ効果によって生じる負圧により非接触で保持して、搬出入領域３に位置付けられた保持テーブル１０の保持面１３上に載置する。第１搬出ユニット４０は、搬出入領域３に位置付けられた保持テーブル１０の保持面１３上の加工後の被加工物１００をベルヌーイ効果によって生じる負圧により非接触で保持して搬出し、洗浄ユニット８０に搬送する。第１搬出ユニット４０は、洗浄ユニット８０で洗浄された被加工物１００をベルヌーイ効果によって生じる負圧により非接触で保持し、一対のガイドレール９３上に載置する。第１搬出ユニット４０は、一対のガイドレール９３上に載置した加工後及び洗浄後の被加工物１００を把持部４６で把持して、カセット載置台９０に載置されたカセット９５内に搬送する。 The first unloading unit 40 grips the unprocessed workpiece 100 in the cassette 95 placed on the cassette placement table 90 with the gripping portion 46, removes it, and places it on a pair of guide rails 93 for temporarily placing the workpiece 100, which are provided in the loading/unloading area 3 above the movement area of the holding table 10. The first unloading unit 40 holds the unprocessed workpiece 100 placed on the pair of guide rails 93 in a non-contact manner by the negative pressure generated by the Bernoulli effect, and places it on the holding surface 13 of the holding table 10 positioned in the loading/unloading area 3. The first unloading unit 40 holds the processed workpiece 100 on the holding surface 13 of the holding table 10 positioned in the loading/unloading area 3 in a non-contact manner by the negative pressure generated by the Bernoulli effect, and transports it to the cleaning unit 80. The first discharge unit 40 holds the workpiece 100 cleaned by the cleaning unit 80 without contacting it by using the negative pressure generated by the Bernoulli effect, and places it on a pair of guide rails 93. The first discharge unit 40 grips the processed and cleaned workpiece 100 placed on the pair of guide rails 93 with the gripping portion 46, and transports it into a cassette 95 placed on the cassette placement table 90.

第２搬出ユニット５０は、第１搬出ユニット４０と概ね同様の構成を有しており、図１及び図２に示すように、第２搬出アーム５１と、Ｙ軸移動ユニット５２と、Ｚ軸移動ユニット５３と、板部材５４と、溝５５と、把持部５６と、エア供給源５７と、エア供給ライン５８と、を有する。第２搬出アーム５１、Ｙ軸移動ユニット５２、Ｚ軸移動ユニット５３、板部材５４、溝５５、把持部５６、エア供給源５７及びエア供給ライン５８は、それぞれ、第１搬出アーム４１、Ｙ軸移動ユニット４２、Ｚ軸移動ユニット４３、板部材４４、溝４５、把持部４６、エア供給源４７及びエア供給ライン４８と概ね同様の構成を有している。第２搬出ユニット５０は、板部材５４で加工後の被加工物１００をベルヌーイ効果によって生じる負圧により非接触で保持し、保持テーブル１０から洗浄ユニット８０へと搬送する。第１搬出ユニット４０と第２搬出ユニット５０は、互いにぶつからないようにＺ軸方向の位置をずらしながら、交互に被加工物１００を搬送する。加工装置１は、図１に示す例では第１搬出ユニット４０と第２搬出ユニット５０との２つの搬出ユニットを備えているが、本発明ではこれに限定されず、いずれか一方の１つの搬出ユニットのみ備えていても、３つ以上の複数の搬出ユニットを備えていてもよい。 The second discharge unit 50 has a configuration similar to that of the first discharge unit 40, and includes a second discharge arm 51, a Y-axis moving unit 52, a Z-axis moving unit 53, a plate member 54, a groove 55, a gripping portion 56, an air supply source 57, and an air supply line 58, as shown in FIGS. 1 and 2. The second discharge arm 51, the Y-axis moving unit 52, the Z-axis moving unit 53, the plate member 54, the groove 55, the gripping portion 56, the air supply source 57, and the air supply line 58 have a configuration similar to that of the first discharge arm 41, the Y-axis moving unit 42, the Z-axis moving unit 43, the plate member 44, the groove 45, the gripping portion 46, the air supply source 47, and the air supply line 48, respectively. The second discharge unit 50 holds the workpiece 100 after processing by the plate member 54 in a non-contact manner by the negative pressure generated by the Bernoulli effect, and transports it from the holding table 10 to the cleaning unit 80. The first and second carry-out units 40 and 50 alternately transport the workpiece 100 while shifting their positions in the Z-axis direction so as not to collide with each other. In the example shown in FIG. 1, the processing device 1 is equipped with two carry-out units, the first and second carry-out units 40 and 50, but the present invention is not limited to this, and the processing device 1 may be equipped with only one of the carry-out units, or may be equipped with three or more multiple carry-out units.

制御ユニット６０は、加工装置１の各種構成要素の動作を制御して、被加工物１００の加工処理を加工装置１に実施させる。制御ユニット６０は、吸引ライン１６の吸引バルブ１６－１の開閉及びエア供給ライン１８のエア供給バルブ１８－１の開閉を制御することで、保持面１３上の吸引エリア及び噴出エリアの形成を制御する。制御ユニット６０は、吸引源１７を制御することで吸引ライン１６から保持面１３に導入する負圧の圧力値（ゲージ圧）を制御し、エア供給源１９を制御することでエア供給ライン１８からのエアの供給量や供給圧等を制御する。 The control unit 60 controls the operation of various components of the processing device 1 to cause the processing device 1 to perform processing of the workpiece 100. The control unit 60 controls the opening and closing of the suction valve 16-1 of the suction line 16 and the opening and closing of the air supply valve 18-1 of the air supply line 18, thereby controlling the formation of the suction area and the jetting area on the holding surface 13. The control unit 60 controls the pressure value (gauge pressure) of the negative pressure introduced from the suction line 16 to the holding surface 13 by controlling the suction source 17, and controls the amount and supply pressure of air supplied from the air supply line 18 by controlling the air supply source 19.

制御ユニット６０は、Ｙ軸移動ユニット４２，５２及びＺ軸移動ユニット４３，５３を制御することで、第１，第２搬出ユニット４０，５０の第１，第２搬出アーム４１，５１のＹ軸方向及びＺ軸方向の位置及び移動を制御する。制御ユニット６０は、エア供給源４７，５７から溝４５，５５へのエアの供給を制御することで、溝４５，５５内にエアを流すことによりベルヌーイ効果によって生じる負圧を制御し、第１搬出ユニット４０，５０の板部材４４，５４による被加工物１００の保持を制御する。制御ユニット６０は、把持部４６，５６を制御することで、被加工物１００の把持を制御する。 The control unit 60 controls the Y-axis movement units 42, 52 and the Z-axis movement units 43, 53 to control the positions and movements in the Y-axis and Z-axis directions of the first and second carry-out arms 41, 51 of the first and second carry-out units 40, 50. The control unit 60 controls the supply of air from the air supply sources 47, 57 to the grooves 45, 55 to control the negative pressure generated by the Bernoulli effect by flowing air into the grooves 45, 55, and controls the holding of the workpiece 100 by the plate members 44, 54 of the first carry-out units 40, 50. The control unit 60 controls the gripping of the workpiece 100 by controlling the gripping parts 46, 56.

制御ユニット６０は、本実施形態では、コンピュータシステムを含む。制御ユニット６０が含むコンピュータシステムは、ＣＰＵ（Central Processing Unit）のようなマイクロプロセッサを有する演算処理装置と、ＲＯＭ（Read Only Memory）又はＲＡＭ（Random Access Memory）のようなメモリを有する記憶装置と、入出力インターフェース装置とを有する。制御ユニット６０の演算処理装置は、制御ユニット６０の記憶装置に記憶されているコンピュータプログラムに従って演算処理を実施して、加工装置１を制御するための制御信号を、制御ユニット６０の入出力インターフェース装置を介して加工装置１の各構成要素に出力する。 In this embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input/output interface device of the control unit 60.

表示ユニット７０は、加工装置１の加工条件の設定の画面、加工処理の結果の画面、制御ユニット６０による吸引バルブ１６－１の開閉及びエア供給バルブ１８－１の開閉の制御に関する設定の画面、制御ユニット６０による第１，第２搬出ユニット４０，５０の動作の制御に関する設定の画面等を表示する。表示ユニット７０は、本実施形態では、液晶表示装置等により構成される。表示ユニット７０は、オペレータが加工装置１の各種設定に関する情報等を入力する際に使用する入力ユニットが設けられている。表示ユニット７０に設けられた入力ユニットは、本実施形態では、表示ユニット７０に設けられたタッチパネルと、キーボード等とのうち少なくとも一つにより構成される。なお、加工装置１は、本発明ではこれに限定されず、表示ユニット７０を有していなくてもよい。なお、加工装置１は、本発明ではこれに限定されず、表示ユニット７０の代わりに、有線または無線で、スマートフォン、タブレット、ウェアラブルデバイス、コンピュータなどの情報機器に接続され、情報機器の表示部に表示したり、情報機器の入力部を介して操作されたりしても良い。 The display unit 70 displays a screen for setting the processing conditions of the processing device 1, a screen for the results of the processing process, a screen for setting the control of the opening and closing of the suction valve 16-1 and the air supply valve 18-1 by the control unit 60, a screen for setting the control of the operation of the first and second discharge units 40 and 50 by the control unit 60, and the like. In this embodiment, the display unit 70 is configured with a liquid crystal display device or the like. The display unit 70 is provided with an input unit that is used when the operator inputs information about various settings of the processing device 1. In this embodiment, the input unit provided on the display unit 70 is configured with at least one of a touch panel provided on the display unit 70 and a keyboard or the like. Note that the present invention is not limited to this, and the processing device 1 may not have a display unit 70. Note that the present invention is not limited to this, and the processing device 1 may be connected to an information device such as a smartphone, tablet, wearable device, or computer by wire or wirelessly instead of the display unit 70, and may be displayed on the display unit of the information device or operated via the input unit of the information device.

洗浄ユニット８０は、加工後の被加工物１００を洗浄し、被加工物１００に付着した加工屑等の異物を除去する。カセット載置台９０は、複数の被加工物１００を収容するための収容器であるカセット９５を載置する載置台であり、載置されたカセット９５をＺ軸方向に昇降させる。なお、加工装置１は、本実施形態では、第２搬出ユニット５０による被加工物１００の搬出先の１つとして洗浄ユニット８０を有しているが、本発明ではこれに限定されず、第２搬出ユニット５０による被加工物１００の搬出先として加工後の被加工物１００の品質を検査する検査装置をさらに有してもよく、また洗浄ユニット８０を有していなくてもよい。 The cleaning unit 80 cleans the workpiece 100 after processing and removes foreign matter such as processing debris adhering to the workpiece 100. The cassette mounting table 90 is a mounting table on which a cassette 95, which is a container for storing multiple workpieces 100, is mounted, and raises and lowers the mounted cassette 95 in the Z-axis direction. In this embodiment, the processing device 1 has the cleaning unit 80 as one of the destinations for the workpiece 100 to be carried out by the second carrying-out unit 50, but the present invention is not limited to this, and may further have an inspection device that inspects the quality of the workpiece 100 after processing as a destination for the workpiece 100 to be carried out by the second carrying-out unit 50, or may not have the cleaning unit 80.

次に、本明細書は、実施形態に係る被加工物の搬出方法を図面に基づいて説明する。実施形態に係る被加工物の搬出方法は、被加工物１００を第１，第２搬出ユニット４０，５０によって保持テーブル１０から搬出する方法であって、加工装置１を用いて実施される。図４は、実施形態に係る被加工物の搬出方法の処理手順の一例を示すフローチャートである。実施形態に係る被加工物の搬出方法は、図４に示すように、外周浮上ステップ１００１と、被加工物保持ステップ１００２と、搬出ステップ１００３と、を備える。実施形態に係る被加工物の搬出方法は、例えば、保持テーブル１０の保持面１３で吸引保持した被加工物１００を加工ユニット２０での加工後に搬出する際に実施される。 Next, this specification describes a method for carrying out a workpiece according to an embodiment with reference to the drawings. The method for carrying out a workpiece according to the embodiment is a method for carrying out the workpiece 100 from the holding table 10 by the first and second carrying-out units 40 and 50, and is performed using the processing device 1. FIG. 4 is a flowchart showing an example of a processing procedure of the method for carrying out a workpiece according to the embodiment. As shown in FIG. 4, the method for carrying out a workpiece according to the embodiment includes an outer periphery floating step 1001, a workpiece holding step 1002, and a carrying-out step 1003. The method for carrying out a workpiece according to the embodiment is performed, for example, when carrying out the workpiece 100 held by suction on the holding surface 13 of the holding table 10 after processing in the processing unit 20.

外周浮上ステップ１００１は、吸引ライン１６によってポーラス板１１と吸引源１７とを連通させ保持面１３の中央領域１３－１で被加工物１００を吸引し、ポーラス板１１と被加工物１００との間の加工用の液体３５（水）を除去しつつ、エア供給ライン１８にエアを供給し、中央領域１３－１を囲繞する外周領域１３－２からエアを噴出させて被加工物１００の外周部のみを保持面１３から浮上させ、ポーラス板１１と被加工物１００との間の加工用の液体３５（水）の表面張力を解除するステップである。 The outer periphery floating step 1001 is a step in which the porous plate 11 and the suction source 17 are connected by the suction line 16 to suck the workpiece 100 in the central region 13-1 of the holding surface 13, and while removing the processing liquid 35 (water) between the porous plate 11 and the workpiece 100, air is supplied to the air supply line 18, and air is ejected from the outer periphery region 13-2 surrounding the central region 13-1 to float only the outer periphery of the workpiece 100 from the holding surface 13, thereby releasing the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100.

外周浮上ステップ１００１では、制御ユニット６０は、吸引源１７の負圧の圧力値（ゲージ圧）をポーラス板１１の保持面１３の全面で被加工物１００を吸引保持する際よりも弱く制御しつつ、吸引ライン１６の吸引バルブ１６－１を開放することにより、吸引ライン１６によってポーラス板１１と吸引源１７とを連通させて、保持面１３の中央領域１３－１で被加工物１００を吸引し、ポーラス板１１と被加工物１００との間の加工用の液体３５等の水を除去する。また、外周浮上ステップ１００１では、制御ユニット６０は、エア供給ライン１８のエア供給バルブ１８－１を開放することにより、エア供給ライン１８にエア供給源１９からのエアを供給し保持面１３の外周領域１３－２からエアを噴出させて被加工物１００の外周部のみを保持面１３から浮上させる。外周浮上ステップ１００１では、このように、吸引源１７の負圧の圧力値（ゲージ圧）を弱めにして、保持面１３の中央領域１３－１における吸引ライン１６による吸引と、保持面１３の外周領域１３－２におけるエア供給ライン１８からのエアの噴出による被加工物１００の外周部の浮上とを同時に実施することで、保持面１３上の加工用の液体３５（水）と保持面１３上の被加工物１００の裏面１０４側とを強制的に引き離して、ポーラス板１１と被加工物１００との間に形成された真空状態を破壊し、ポーラス板１１と被加工物１００との間の加工用の液体３５（水）の表面張力を解除することができる。なお、エア噴出口が形成される外周領域１３－２は、図２に示すようにポーラス板１１の上面の外周領域でも良いし、ポーラス板１１を囲繞する枠体１２の上面でもよい。被加工物１００の径がポーラス板１１よりも大きい場合は、枠体１２の上面に被加工物１００の外周部が支持されるため、枠体１２の上面にエア噴出口が形成される方が好ましい。 In the outer periphery floating step 1001, the control unit 60 controls the negative pressure value (gauge pressure) of the suction source 17 to be weaker than when the workpiece 100 is suction-held on the entire surface of the holding surface 13 of the porous plate 11, and opens the suction valve 16-1 of the suction line 16 to communicate the porous plate 11 with the suction source 17, sucks the workpiece 100 in the central region 13-1 of the holding surface 13, and removes water such as the processing liquid 35 between the porous plate 11 and the workpiece 100. In the outer periphery floating step 1001, the control unit 60 opens the air supply valve 18-1 of the air supply line 18 to supply air from the air supply source 19 to the air supply line 18, and ejects air from the outer periphery region 13-2 of the holding surface 13 to float only the outer periphery of the workpiece 100 from the holding surface 13. In the outer periphery floating step 1001, the negative pressure value (gauge pressure) of the suction source 17 is weakened in this way, and the suction by the suction line 16 in the central region 13-1 of the holding surface 13 and the floating of the outer periphery of the workpiece 100 by the ejection of air from the air supply line 18 in the outer periphery region 13-2 of the holding surface 13 are simultaneously performed, so that the processing liquid 35 (water) on the holding surface 13 and the back surface 104 side of the workpiece 100 on the holding surface 13 are forcibly separated, the vacuum state formed between the porous plate 11 and the workpiece 100 is broken, and the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100 can be released. The outer periphery region 13-2 in which the air ejection port is formed may be the outer periphery region of the upper surface of the porous plate 11 as shown in FIG. 2, or may be the upper surface of the frame 12 surrounding the porous plate 11. If the diameter of the workpiece 100 is larger than that of the porous plate 11, the outer periphery of the workpiece 100 is supported on the upper surface of the frame 12, so it is preferable to form an air outlet on the upper surface of the frame 12.

被加工物保持ステップ１００２は、外周浮上ステップ１００１でポーラス板１１と被加工物１００との間の加工用の液体３５（水）の表面張力を解除した状態で、第１搬出ユニット４０によって被加工物１００を保持するステップである。被加工物保持ステップ１００２では、制御ユニット６０は、溝４５内にエアを流すことでベルヌーイ効果によって生じる負圧により、第１搬出ユニット４０の板部材４４で、保持面１３上でポーラス板１１との間の加工用の液体３５（水）の表面張力が解除された状態の被加工物１００を非接触で保持する。 The workpiece holding step 1002 is a step in which the first discharge unit 40 holds the workpiece 100 in a state in which the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100 has been released in the outer periphery floating step 1001. In the workpiece holding step 1002, the control unit 60 uses the plate member 44 of the first discharge unit 40 to hold the workpiece 100 in a non-contact state in a state in which the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100 has been released on the holding surface 13 by flowing air into the groove 45, resulting in negative pressure caused by the Bernoulli effect.

搬出ステップ１００３は、外周浮上ステップ１００１及び被加工物保持ステップ１００２の後、保持面１３の中央領域１３－１における被加工物１００の吸引を遮断して保持テーブル１０から被加工物１００の全体を離反させて、保持テーブル１０から被加工物１００を搬出するステップである。搬出ステップ１００３では、制御ユニット６０は、吸引ライン１６の吸引バルブ１６－１を閉鎖することにより、吸引ライン１６によるポーラス板１１と吸引源１７との連通を遮断することで、保持面１３の中央領域１３－１における被加工物１００の吸引を遮断して保持テーブル１０から被加工物１００の全体を離反させる。搬出ステップ１００３では、これにより、第１搬出ユニット４０の板部材４４は、溝４５内にエアを流すことでベルヌーイ効果によって生じる負圧により、被加工物１００を非接触で保持する。搬出ステップ１００３では、その後、制御ユニット６０は、第１搬出ユニット４０の板部材４４によって非接触で保持した被加工物１００を搬出する。 The unloading step 1003 is a step of unloading the workpiece 100 from the holding table 10 by cutting off the suction of the workpiece 100 in the central region 13-1 of the holding surface 13 after the outer periphery floating step 1001 and the workpiece holding step 1002. In the unloading step 1003, the control unit 60 closes the suction valve 16-1 of the suction line 16 to cut off communication between the porous plate 11 and the suction source 17 through the suction line 16, thereby cutting off the suction of the workpiece 100 in the central region 13-1 of the holding surface 13 and unloading the workpiece 100 from the holding table 10. In the unloading step 1003, the plate member 44 of the first unloading unit 40 holds the workpiece 100 in a non-contact manner by the negative pressure generated by the Bernoulli effect by flowing air into the groove 45. In the unloading step 1003, the control unit 60 then unloads the workpiece 100 held in a non-contact manner by the plate member 44 of the first unloading unit 40.

第１搬出ユニット４０の板部材４４は、被加工物保持ステップ１００２でのベルヌーイ効果によって生じる負圧による非接触での吸引力が弱いために被加工物１００を完全に保持できない場合、次の搬出ステップ１００３で保持面１３の中央領域１３－１における被加工物１００の吸引を遮断して保持テーブル１０から被加工物１００の全体を離反させたときに、被加工物１００を完全に保持する。 If the plate member 44 of the first discharge unit 40 is unable to completely hold the workpiece 100 due to a weak non-contact suction force caused by the negative pressure generated by the Bernoulli effect in the workpiece holding step 1002, the plate member 44 completely holds the workpiece 100 when the suction of the workpiece 100 in the central region 13-1 of the holding surface 13 is cut off in the next discharge step 1003 to separate the entire workpiece 100 from the holding table 10.

なお、被加工物保持ステップ１００２及び搬出ステップ１００３では、本実施形態では、第１搬出ユニット４０の板部材４４が溝４５内にエアを流すことでベルヌーイ効果によって生じる負圧により被加工物１００を非接触で保持するが、本発明ではこれに限定されず、板部材４４の下方側に設置された吸引パッドにより被加工物１００を直接接触して吸引保持してもよい。 In the present embodiment, in the workpiece holding step 1002 and the unloading step 1003, the plate member 44 of the first unloading unit 40 holds the workpiece 100 in a non-contact manner by the negative pressure generated by the Bernoulli effect caused by air flowing into the groove 45, but the present invention is not limited to this, and the workpiece 100 may be held by direct contact and suction using a suction pad installed on the lower side of the plate member 44.

以上のような構成を有する実施形態に係る加工装置１及び被加工物の搬出方法は、保持テーブル１０が吸引ライン１６及びエア供給ライン１８を備え、加工後の被加工物１００を搬出する際に、吸引ライン１６によって保持面１３の中央領域１３－１で被加工物１００を比較的弱い負圧で吸引し、ポーラス板１１と被加工物１００との間の加工用の液体３５（水）を除去しつつ、エア供給ライン１８によって被加工物１００の外周部を保持面１３から浮上させ、ポーラス板１１と被加工物１００との間に形成された真空状態を破壊し、加工用の液体３５（水）の表面張力を解除する。このため、実施形態に係る加工装置１及び被加工物の搬出方法は、保持面１３上の水抜きをより強力に行うことができるとともに、この表面張力によって被加工物１００の保持面１３への固定を解除できる。また、実施形態に係る加工装置１及び被加工物の搬出方法は、加工後の被加工物１００を搬出する際に、被加工物１００の搬出をより確実に行えるという作用効果を奏する。 In the processing device 1 and the method for carrying out the workpiece according to the embodiment having the above configuration, the holding table 10 is provided with a suction line 16 and an air supply line 18, and when carrying out the workpiece 100 after processing, the suction line 16 sucks the workpiece 100 at a relatively weak negative pressure in the central region 13-1 of the holding surface 13, and while removing the processing liquid 35 (water) between the porous plate 11 and the workpiece 100, the air supply line 18 causes the outer periphery of the workpiece 100 to float from the holding surface 13, destroying the vacuum state formed between the porous plate 11 and the workpiece 100, and releasing the surface tension of the processing liquid 35 (water). Therefore, the processing device 1 and the method for carrying out the workpiece according to the embodiment can more powerfully drain the water on the holding surface 13, and the fixation of the workpiece 100 to the holding surface 13 can be released by this surface tension. In addition, the processing device 1 and the method for carrying out a workpiece according to the embodiment have the effect of more reliably carrying out the workpiece 100 after processing.

例えば、被加工物１００を分割予定ライン１０２に沿って切削加工して被加工物１００の厚み以下（例えば厚みの半分程度）の深さの切削溝を形成するいわゆるハーフカットを実施するような場合や、被加工物１００を非常に薄く研削加工するような場合、被加工物１００の外周部の全周を環状に切削するエッジトリミング加工をするような場合には、被加工物１００の破損を防ぐため、第１搬出ユニット４０でベルヌーイ効果を利用して非接触で被加工物１００を保持する。実施形態に係る加工装置１及び被加工物の搬出方法は、このように第１搬出ユニット４０によりベルヌーイ効果を利用して非接触で弱い力で被加工物１００を保持するような場合には、特に、ポーラス板１１と被加工物１００との間の加工用の液体３５（水）の表面張力を解除することにより、この表面張力によって被加工物１００の保持面１３への固定を解除できることによる上述の実施形態の効果を大きく発揮することができる。 For example, when performing a so-called half cut in which the workpiece 100 is cut along the planned dividing line 102 to form a cutting groove with a depth less than the thickness of the workpiece 100 (for example, about half the thickness), when grinding the workpiece 100 very thin, or when performing edge trimming to cut the entire circumference of the outer periphery of the workpiece 100 in a ring shape, the first discharge unit 40 holds the workpiece 100 without contact using the Bernoulli effect to prevent damage to the workpiece 100. In this way, when the first discharge unit 40 holds the workpiece 100 with a weak force without contact using the Bernoulli effect, the processing device 1 and the workpiece discharge method according to the embodiment can greatly exert the effect of the above embodiment by releasing the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100, and releasing the fixation of the workpiece 100 to the holding surface 13 using this surface tension.

なお、本発明は上記実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。 The present invention is not limited to the above embodiment. In other words, the present invention can be implemented in various modifications without departing from the gist of the invention.

１ 加工装置
１０ 保持テーブル
１１ ポーラス板
１２ 枠体
１３ 保持面
１３－１ 中央領域（吸引エリア）
１３－２ 外周領域（吸引エリアの外周部分）
１４ 凹部
１４－１ 底面
１４－２ 内側面
１５－１ 中央部分
１５－２ 外周部分
１６ 吸引ライン
１７ 吸引源
１８ エア供給ライン
１９ エア供給源
２０ 加工ユニット
３０ 液体供給ノズル
３５ 加工用の液体（水）
４０ 第１搬出ユニット
５０ 第２搬出ユニット
６０ 制御ユニット
１００ 被加工物 1 Processing device 10 Holding table 11 Porous plate 12 Frame 13 Holding surface 13-1 Central region (suction area)
13-2 Outer region (outer portion of suction area)
14 Recess 14-1 Bottom surface 14-2 Inner surface 15-1 Central portion 15-2 Outer peripheral portion 16 Suction line 17 Suction source 18 Air supply line 19 Air supply source 20 Processing unit 30 Liquid supply nozzle 35 Processing liquid (water)
40 First output unit 50 Second output unit 60 Control unit 100 Workpiece

Claims (2)

被加工物を保持する保持面を有する保持テーブルと、
該保持テーブルに保持された被加工物を加工する加工ユニットと、
該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、
該保持テーブルから被加工物を搬出する搬出ユニットと、
制御ユニットと、を有する加工装置であって、
該保持テーブルは、
被加工物を吸引保持する中央領域を有するポーラス板と、
該ポーラス板を収容する凹部を有する枠体と、
該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、
該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、
該制御ユニットは、該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し、該外周領域からエアを噴出させて被加工物の外周部を該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除した状態で、該搬出ユニットによって被加工物を該保持テーブルから搬出することを特徴とする加工装置。 A holding table having a holding surface for holding a workpiece;
a processing unit for processing a workpiece held on the holding table;
A liquid supply nozzle for supplying a processing liquid to a processing point processed by the processing unit;
a carry-out unit for carrying out the workpiece from the holding table;
A processing apparatus having a control unit,
The holding table is
A porous plate having a central region for suction-holding a workpiece;
A frame having a recess for accommodating the porous plate;
a suction line formed on a bottom surface of the frame for connecting the central region to a suction source;
an air supply line communicating with an air supply source for blowing air from an outer peripheral region surrounding the central region;
The control unit connects the porous plate to the suction source via the suction line to suck the workpiece in the central region, removes water between the porous plate and the workpiece, supplies air to the air supply line, and sprays air from the outer circumferential region to lift the outer periphery of the workpiece from the holding surface, and releases the surface tension of the water between the porous plate and the workpiece, and then transports the workpiece from the holding table by the discharge unit. 被加工物を保持する保持面を有する保持テーブルと、該保持テーブルに保持された被加工物を加工する加工ユニットと、該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、該保持テーブルから被加工物を搬出する搬出ユニットと、を有する加工装置において、被加工物を該搬出ユニットによって該保持テーブルから搬出する搬出方法であって、
該保持テーブルは、
被加工物を吸引保持する中央領域を有するポーラス板と、
該ポーラス板を収容する凹部を有する枠体と、
該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、
該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、
該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し該外周領域からエアを噴出させて被加工物の外周部のみを該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除する外周浮上ステップと、
該搬出ユニットによって被加工物を保持する被加工物保持ステップと、
該被加工物保持ステップ及び該外周浮上ステップの後、該中央領域における被加工物の吸引を遮断して該保持テーブルから被加工物全体を離反させて該保持テーブルから被加工物を搬出する搬出ステップと、
を備える被加工物の搬出方法。 A method for carrying out a workpiece from the holding table by the carrying unit in a processing apparatus having a holding table having a holding surface for holding a workpiece, a processing unit for processing the workpiece held on the holding table, a liquid supply nozzle for supplying a processing liquid to a processing point processed by the processing unit, and a carrying unit for carrying out the workpiece from the holding table, comprising the steps of:
The holding table is
A porous plate having a central region for suction-holding a workpiece;
A frame having a recess for accommodating the porous plate;
a suction line formed on a bottom surface of the frame for connecting the central region to a suction source;
an air supply line communicating with an air supply source for blowing air from an outer peripheral region surrounding the central region;
a peripheral floating step in which the porous plate and the suction source are connected by the suction line to suck the workpiece in the central region, and water between the porous plate and the workpiece is removed while air is supplied to the air supply line to eject air from the peripheral region to float only the peripheral portion of the workpiece from the holding surface, thereby releasing the surface tension of the water between the porous plate and the workpiece;
a workpiece holding step of holding the workpiece by the carrying-out unit;
a carrying-out step of cutting off suction of the workpiece in the central region after the workpiece holding step and the outer periphery floating step, to separate the entire workpiece from the holding table, and carrying out the workpiece from the holding table;
A method for carrying out a workpiece comprising the steps of:
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