JP7300952B2 - Conveyor and cutting equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a chip conveying device and a cutting device.

A cutting device using a cutting blade is known as a processing device for dividing various plate-like workpieces such as resin package substrates into individual device chips. In particular, in the case of a resin package substrate, the division line of the resin package substrate and the escape groove of the chuck table are aligned, the resin package substrate is held by suction on the chuck table, and the cutting blade is used to divide the substrate into individual chips. is sucked and held in a suction path of a chuck table (see, for example, Patent Documents 1 and 2).

Chips divided by the cutting devices disclosed in Patent Documents 1 and 2 are transported from a chuck table by a transport pad that sucks and holds each chip individually with a suction pad. etc. will be returned.

JP 2011-049193 A JP 2015-012264 A

As a problem with the transfer pad mentioned above, when the suction pad sucks the cutting water remaining on the top surface of the chip, it is often sucked and held together. Water may drain to the top surface of the chip. For example, when the chip is removed at the destination after the lower surface of the chip is washed while being sucked and held by the transfer pad, the chip becomes dirty when cutting water containing a large amount of cutting waste flows out to the chip after cleaning.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide a conveying device and a cutting device capable of suppressing cutting water flowing out when chips are removed.

In order to solve the above-described problems and achieve the object, the conveying device of the present invention conveys a plurality of chips which are held on a holding surface of a chuck table and cut and divided while being supplied with cutting water from the chuck table. A conveying device for returning to a destination, comprising a suction pad for sucking the chip, a conveying section main body having a suction path for applying negative pressure to the sucking pad, and a moving unit for moving the conveying section main body. The suction path is provided with an open-cell sponge for absorbing cutting water flowing into the suction path through the suction pad when the chip is sucked, and the cutting water absorbed by the open-cell sponge is disposed. is sucked and discharged from the suction path.

The cutting apparatus of the present invention includes a chuck table that sucks and holds a plate-shaped workpiece, and a cutting blade that divides the workpiece into a plurality of chips while supplying cutting water to the workpiece held by the chuck table. a cutting unit for cutting, a cleaning unit for cleaning chips separated by the cutting unit, and a transfer unit for transferring chips from the chuck table to the cleaning unit, wherein the transfer unit comprises the It is characterized by being a conveying device.

ADVANTAGE OF THE INVENTION This invention is effective in the ability to suppress the cutting water which flows out when a chip|tip is detached.

FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. 2 is a perspective view showing an example of a workpiece to be machined by the cutting apparatus shown in FIG. 1. FIG. 3 is a perspective view of a chuck table of the cutting apparatus shown in FIG. 1; FIG. FIG. 4 is a cross-sectional view of a part of the conveying unit of the cutting apparatus shown in FIG. FIG. 5 is a perspective view of the transport unit main body of the transport unit shown in FIG. 4 as seen from below. FIG. 6 is a cross-sectional view showing a state in which the transport unit shown in FIG. 4 faces the divided chips on the chuck table.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A conveying device and a cutting device according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. 2 is a perspective view showing an example of a workpiece to be machined by the cutting apparatus shown in FIG. 1. FIG. 3 is a perspective view of a chuck table of the cutting apparatus shown in FIG. 1; FIG. FIG. 4 is a cross-sectional view of a part of the conveying unit of the cutting apparatus shown in FIG. FIG. 5 is a perspective view of the transport unit main body of the transport unit shown in FIG. 4 as seen from below. FIG. 6 is a cross-sectional view showing a state in which the transport unit shown in FIG. 4 faces the divided chips on the chuck table.

A cutting apparatus 1 according to Embodiment 1 shown in FIG. 1 is an apparatus for cutting a workpiece 200 shown in FIG. As shown in FIG. 2, a workpiece 200 to be machined by the cutting apparatus 1 shown in FIG. 1 according to the first embodiment is formed in a flat plate shape having a rectangular planar shape. The workpiece 200 has an electrode plate 201, and a plurality of planned division lines 203 are formed in a grid pattern on the surface 202 of the electrode plate 201. As shown in FIG. A workpiece 200 has a plurality of regions partitioned by a plurality of planned dividing lines 203, and device chips 204 are arranged in each of these regions. A device chip 204 is arranged on the back surface of the electrode plate 201 and covered with a mold resin 205 . In Embodiment 1, the workpiece 200 is a so-called package substrate in which a device chip 204 is embedded with a mold resin 205 .

The workpiece 200 configured as described above is cut along the dividing lines 203 by the cutting apparatus 1 shown in FIG.

The cutting device 1 is a processing device that holds a workpiece 200 on a chuck table 10 and performs cutting along a plurality of dividing lines 203 . In Embodiment 1, the cutting device 1 is a device that holds a workpiece 200 to which no dicing tape is attached on a chuck table 10 and splits the workpiece 200 into package device chips 206 by so-called full cutting.

As shown in FIG. 2 , the cutting apparatus 1 is scheduled to be divided while supplying cutting water to a chuck table 10 that sucks and holds a workpiece 200 on a holding surface 11 and the workpiece 200 that is sucked and held by the chuck table 10 . A cutting unit 20 for cutting a line 203 with a cutting blade 21 to divide a workpiece 200 into a plurality of package device chips 206 and a control unit 100 .

As shown in FIG. 3 , the chuck table 10 has a rectangular holding surface 11 that holds a workpiece 200 . The holding surface 11 is provided with a suction hole 12 for sucking the workpiece 200 and the package device chip 206 and an escape groove 13 for releasing the cutting blade 21 . The suction hole 12 is provided at a position overlapping the package device chip 206 and opened to the holding surface 11 . In Embodiment 1, the suction holes 12 are in one-to-one correspondence with the package device chips 206 . The escape groove 13 is provided at a position corresponding to the planned dividing line 203 and formed concavely from the holding surface 11 .

The suction hole 12 of the chuck table 10 is connected to the suction source 15 via the on-off valve 14 , and the suction hole 12 is sucked by the suction source 15 to hold the workpiece 200 and the package device chip 206 on the holding surface 11 . Hold suction. The chuck table 10 is movable in the X-axis direction parallel to the horizontal direction by a processing feed unit (not shown), and is rotatable about an axis parallel to the Z-axis direction parallel to the vertical direction by a rotary drive source 16 . ing. In Embodiment 1, one chuck table 10 is installed on the rotation drive source 16 .

The cutting unit 20 cuts the workpiece 200 . The cutting unit 20 includes a spindle (not shown) on which a cutting blade 21 for cutting the workpiece 200 held on the chuck table 10 is mounted, and a cutting water nozzle for supplying cutting water to the workpiece.

The cutting blade 21 is an ultra-thin cutting whetstone having a substantially ring shape. The spindle cuts the workpiece 200 by rotating the cutting blade 21 . The spindle is contained within a spindle housing 22 . The axial center of the spindle of the cutting unit 20 and the cutting blade 21 is set parallel to the horizontal direction and parallel to the Y-axis direction perpendicular to the X-axis direction.

The cutting unit 20 is provided to be movable in the Y-axis direction by an indexing feed unit (not shown) with respect to the workpiece 200 held on the chuck table 10, and is also movable in the Z-axis direction by a not-shown cutting feed unit. is provided in The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the indexing feed unit and the cutting feed unit. The cutting unit 20 is moved in the Y-axis direction and the Z-axis direction by the indexing feed unit and the cutting feed unit, so that the chuck table is moved in the X-axis direction by the machining feed unit while supplying cutting water from the cutting water nozzle. 10 to divide the workpiece 200 into a plurality of package device chips 206.

Further, the cutting apparatus 1 includes a cassette 30 for storing a plurality of workpieces 200 before cutting, a carry-out unit 40 for taking out the workpieces 200 from the cassette 30, and the workpieces 200 before machining taken out from the cassette 30. to the chuck table 10, an imaging unit 60 that captures an image of the workpiece 200 before processing and obtains an image for alignment, and the package device chip 206 that is individually divided by the cutting unit 20. a cleaning unit 70 for cleaning, a bottom surface drying unit 80 for drying the bottom surface of the package device chip 206 after cleaning by the cleaning unit 70, and a chip storage section 90 for storing the package device chip 206 after drying by the bottom surface drying unit 80. , a top surface drying and chip dropping unit 170 which removes cutting water from the top surface of the package device chip 206 whose bottom surface has been dried by the bottom surface drying unit 80 and drops it into the chip accommodating section 90, and a transport unit 110 which is a transport device. Prepare.

The cassette 30 accommodates a plurality of workpieces 200 . The cassette 30 accommodates a plurality of workpieces 200 at intervals in the Z-axis direction. The cassette 30 has an opening 31 through which the workpiece 200 can be taken in and out. The cassette 30 is provided so as to be vertically movable in the Z-axis direction by a cassette elevator (not shown).

The carry-out unit 40 includes a carry-out stage 41 for taking out one unprocessed workpiece 200 from the cassette 30 and a pair of rails 42 for temporarily placing the workpiece 200 taken out from the cassette 30 . The package conveying unit 50 sucks and holds the workpiece 200 on the pair of rails 42 , conveys the sucked and held workpiece 200 to the chuck table 10 , and places it on the holding surface 11 of the chuck table 10 .

The imaging unit 60 outputs an image obtained by imaging to the control unit 100 . In Embodiment 1, the imaging unit 60 is attached to the package transport unit 50 . The cleaning unit 70 is provided between the chuck table 10 and the chip storage section 90 . The lower surface drying unit 80 is provided between the cleaning unit 70 and the chip storage section 90 . The chip accommodating portion 90 is formed in a box shape having an opening 91 at the top. In Embodiment 1, the cutting apparatus 1 includes a pair of rails 42, a chuck table 10 at a position where the workpiece 200 is placed, a cleaning unit 70, a lower surface drying unit 80, and a chip storage section 90, They are arranged at intervals in the Y-axis direction. The upper surface drying/chip dropping unit 170 is provided movably over the lower surface drying unit 80 and the chip storage section 90 .

The transport unit 110 transports a plurality of package device chips 206 that are held on the holding surface 11 of the chuck table 10 and that are cut and individually divided while being supplied with cutting water from the chuck table 10 to the cleaning unit 70 that is the transport destination. It is also a conveying device for conveying to a lower surface drying unit 80 as a conveying destination via the cleaning unit 70 . The transport unit 110 has a suction pad 120, a transport section main body 130, and a moving unit 150, as shown in FIG.

The suction pad 120 is for sucking the package device chip 206 . The suction pad 120 is made of a synthetic resin having airtightness and elasticity. In Embodiment 1, the suction pad 120 is made of rubber, but is not limited to being made of rubber. The suction pad 120 is formed in a cylindrical shape having a base end portion 121 that is supported by the conveying portion main body 130 and has a constant outer diameter, and a bellows-like tip portion 122 that continues to the base end portion 121 . A suction hole 124 is formed in the tip surface 123 of the suction pad 120 .

The suction holes 124 of the suction pad 120 are formed at positions corresponding to the package device chips 206 on the holding surface 11 on a one-to-one basis. The suction holes 124 are arranged at positions where they are blocked by the corresponding package device chips 206 on the holding surface 11 when the transport unit 110 transports the package device chips 206 . In Embodiment 1, the suction holes 124 correspond to the package device chips 206 on a one-to-one basis, but a plurality of suction holes 124 may correspond to one package device chip 206 . In Embodiment 1, the suction hole 124 is formed to have a round planar shape.

The conveying unit main body 130 is formed in a box shape, and includes a first plate-like member 131 and a second plate-like member 132 in the first embodiment, as shown in FIGS. 4 and 5 . The first plate-like member 131 and the second plate-like member 132 are made of metal such as stainless steel, and are rectangular in plan view and have the same size and shape. Fixed. The first plate-like member 131 and the second plate-like member 132 are fixed so as to be airtight with each other. The planar shape of the first plate-like member 131 and the second plate-like member 132 , that is, the conveying unit main body 130 is larger than the planar shape of the workpiece 200 . In Embodiment 1, the first plate member 131 and the second plate member 132 are detachable.

Further, the conveying unit main body 130 includes a suction path 133 that applies negative pressure to the suction holes 124 of the suction pad 120 . In the first embodiment, the suction path 133 is provided between the first suction path 134 provided in the second plate member 132 and the first plate member 131 and the second plate member 132. a second suction path 136 connected to a suction source 138 via a switching valve 139; and a suction path 137.

The first suction paths 134 are through holes provided in the second plate-like member 132 and passing through the second plate-like member 132 in the thickness direction. The first suction path 134 corresponds to the suction pad 120 on a one-to-one basis, and supports the suction pad 120 by inserting the base end portion 121 of the corresponding suction pad 120 inside. Airtightness is maintained between the inner surface of the first suction path 134 and the outer peripheral surface of the base end portion 121 of the suction pad 120 . The first suction path 134 supports the corresponding suction pad 120 at a position where the suction hole 124 is blocked by the package device chip 206 on the holding surface 11 .

The suction chamber 135 is a space formed between the first plate member 131 and the second plate member 132 and communicating with all the first suction paths 134 . In Embodiment 1, the suction chamber 135 is formed by recessing from the lower surface of the second plate member 132 .

The second suction path 136 is composed of an airtight cylindrical member such as a pipe or tube, and one end of the through hole 140 passes through the first plate member 131 in the thickness direction and communicates with the suction chamber 135 . , and the other end is connected to a suction source 138 via a switching valve 139 . The second suction path 136 is kept airtight with the through hole 140 , the switching valve 139 and the suction source 138 .

The third suction path 137 is composed of an airtight cylindrical member such as a pipe or tube, and has one end connected to the second suction path 136 and the other end connected to the suction source 138 via a switching valve 139. Connected. The third suction path 137 is provided with a pressure detector 141 . The pressure detector 141 detects the air pressure inside the third suction path 137 and outputs the detection result to the control unit 100 . The third suction path 137 is kept airtight with the second suction path 136 , the through hole 140 , the switching valve 139 , the suction source 138 and the pressure detector 141 .

In addition, the switching valve 139 has a state in which the second suction path 136 and the suction source 138 are communicated, a state in which the third suction path 137 and the suction source 138 are communicated, and a state in which the second suction path 136 and the third suction path 136 are communicated. and the state in which both the suction path 137 and the suction source 138 are shut off. The suction source 138 communicates with the suction hole 124 via a switching valve 139, a second suction path 136, a third suction path 137, or the like. The suction source 138 sucks air through the second suction path or the third suction path 137 or the like to apply negative pressure to the suction holes 124 of the suction pad 120 . In the first embodiment, an air supply path (not shown) is connected to the suction path 133 via an on-off valve (not shown). Air is supplied to the suction path 133 from the air supply path.

In the conveying unit 110, the switching valve 139 connects the second suction path 136 or the third suction path 137 to the suction source 138, and the suction hole 124 is sucked by the suction source 138 to apply negative pressure. As a result, the package device chip 206 is suction-held on the front end surface 123 of the suction pad 120 . When the transport unit 110 sucks and holds the package device chip 206 on the tip surface 123 of the suction pad 120 , the cutting water adhering to the package device chip 206 may be sucked into the suction path 133 through the suction hole 124 . The cutting water adhering to the package device chip 206 may contain shavings generated during cutting.

The moving unit 150 moves the conveying unit main body 130, and includes a lifting cylinder 151 and a Y-axis moving unit 152 as shown in FIG. The elevating cylinder 151 includes a telescopic rod 153 parallel to the Z-axis direction, and a cylinder body 154 that telescopically supports the rod 153 . The rod 153 is arranged parallel to the Z-axis direction, and has the transport section main body 130 of the transport unit 110 attached to its lower end.

The Y-axis movement unit 152 supports the cylinder body 154 of the lifting cylinder 151 so as to be movable in the Y-axis direction. The Y-axis moving unit 152 supports a known ball screw rotatable about its axis, a known pulse motor for rotating the ball screw about its axis, and a lifting cylinder 151 movably in the Y-axis direction. Equipped with known guide rails.

In the moving unit 150, the Y-axis moving unit 152 moves the lifting cylinder 151 in the Y-axis direction, and the rod 153 of the lifting cylinder 151 expands and contracts, thereby moving the conveying unit main body 130 in the Y-axis direction and the Z-axis direction. Let

The transport unit 110 also includes an open cell sponge 160 arranged in the suction path 133, as shown in FIG. In Embodiment 1, the open cell sponge 160 is arranged in the suction chamber 135 . In Embodiment 1, the outer shape of the open cell sponge 160 is formed in the same shape as the suction chamber 135 . The open-cell sponge 160 is made of an elastic resin such as rubber, has a plurality of continuous cells formed therein, and has water absorbability capable of absorbing cutting water. The open-cell sponge 160 absorbs cutting water flowing into the suction path 133 through the suction holes 124 of the suction pad 120 when the package device chip 206 is suctioned to the tip surface 123 of the suction pad 120 . Also, the cutting water absorbed by the open cell sponge 160 is sucked by the negative pressure from the suction source 138 . For this reason, the cutting water absorbed by the open-cell sponge 160 is sucked and discharged from the suction passage 133 by the negative pressure from the suction source 138 .

The control unit 100 controls each component of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200 . The control unit 100 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. is a computer having The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to the above-described control signals of the cutting device 1 via the input/output interface device. output to the configured element.

The control unit 100 includes a display unit 101 configured by a liquid crystal display device or the like for displaying the state of the machining operation and images, an input unit 102 used by the operator to register machining content information, etc., and a sound and light controller. It is connected to a notification unit (not shown) that emits at least one of them to give notification. The input unit 102 is composed of a display unit, a touch panel provided in 101, and an external input device 103 such as a keyboard.

Next, the machining operation of the cutting device 1 according to Embodiment 1 will be described. First, an operator puts the workpiece 200 before cutting into the cassette 30 and operates the input device 106 to register machining content information in the control unit 100 . When the control unit 100 receives a machining operation start instruction from the operator, the cutting device 1 starts the machining operation.

In the machining operation, the cutting device 1 causes the carrying-out unit 40 to take out one workpiece 200 from the cassette 30 and causes the package conveying unit 50 to convey the workpiece 200 from the rails 42 to the chuck table 10 . In the machining operation, the cutting apparatus 1 opens the on-off valve 14 to suck and hold the workpiece 200 on the holding surface 11 of the chuck table 10 by the negative pressure from the suction source 138, and moves the chuck table 10 to the imaging unit by the processing feed unit. 60 is moved downward to cause the imaging unit 60 to image the workpiece 200 to perform alignment.

In the machining operation, the cutting device 1 moves the cutting unit 20 and the chuck table 10 along the dividing line 203 by using the machining feed unit, the indexing feed unit, the cutting feed unit, and the rotary drive source 16 based on the machining content information. The cutting blade 21 is caused to cut into the planned division line 203 until it reaches the escape groove 13 while being relatively moved by the sprocket 203, thereby cutting the planned division line 203. - 特許庁

In the machining operation, after the cutting blade 21 cuts all the dividing lines 203, the cutting device 1 causes the chuck table 10 to suck and hold the package device chip 206, as shown in FIG. Position the suction pad 120 over the corresponding packaged device chip 206 on the chuck table 10 . The cutting device 1 extends the rod 153 of the lifting cylinder 151 to bring the tip surface 123 of the suction pad 120 into contact with the corresponding package device chip 206 .

The cutting device 1 causes the switching valve 139 to communicate with the suction source 138 and the third suction path 137 , and based on the detection result of the pressure detector 141 , the control unit 100 controls the tip surfaces 123 of all the suction pads 120 . It is determined whether or not the package device chip 206 is held by suction. When the control unit 100 determines that the package device chip 206 has been sucked and held on the leading end surfaces 123 of all the suction pads 120 , the cutting apparatus 1 closes the on-off valve 14 to cancel the sucking and holding of the chuck table 10 . The package device chips 206 held by suction are transported to the cleaning unit 70 at once. In the first embodiment, when the control unit 100 determines that the package device chip 206 is not suction-held on the tip surface 123 of at least one suction pad 120, the cutting apparatus 1 stops the machining operation and operates the notification unit. and notify the operator.

In the machining operation, the cutting apparatus 1 causes the cleaning unit 70 to clean the package device chip 206 , then causes the transport unit 110 to suck and hold the cleaned package device chip 206 and transports it to the lower surface drying unit 80 . After drying the lower surface of the package device chip 206 in the lower surface drying unit 80 , the cutting apparatus 1 supplies cutting water from the upper surface of the package device chip 206 whose lower surface has been dried to the upper surface drying and chip dropping unit 170 . is removed to drop the package device chip 206 into the chip receiving portion 90 .

The cutting device 1 cuts the next workpiece 200, sequentially cuts the workpieces 200 in the cassette 30, and finishes the machining operation when all the workpieces 200 in the cassette 30 are cut. .

In the cutting apparatus 1 and the transfer unit 110 according to the first embodiment described above, the open-cell sponge 160 is arranged in the suction path 133 to absorb the sucked cutting water when the suction pad 120 sucks and holds the package device chip 206 . Then, the cutting water absorbed by the open cell sponge 160 is sucked from the suction source 138 and discharged. Therefore, the cutting apparatus 1 and the transport unit 110 prevent the cutting water from flowing back through the suction holes 124 of the suction pad 120 and being discharged when the suction holding of the suction pad 120 is released. As a result, the cutting apparatus 1 and the transfer unit 110 can suppress cutting water flowing out when the package device chip 206 is removed.

In the cutting device 1 and the transport unit 110, cutting water absorbed by the open-cell sponge 160 is sucked upstream of the suction path 133 by negative pressure from the suction source 138 and discharged. There is an effect that water in the open cell sponge 160 is also discharged as the device chip 206 is sucked.

In addition, since the first plate-like member 131 and the second plate-like member 132 are detachable from the cutting device 1 and the conveying unit 110, the second plate-like member 132 can be removed from the first plate-like member 131. The open cell sponge 160 can be removed and replaced before the suction force is reduced due to clogging with cutting debris. It should be noted that whether or not cutting chips are clogged can be detected from the fact that the pressure drop of the pressure detector 141 is small or slow even when the transmission of the negative pressure from the suction source 138 is stopped.

In addition, this invention is not limited to the said embodiment. That is, various modifications can be made without departing from the gist of the present invention.

1 Cutting Device 10 Chuck Table 11 Holding Surface 20 Cutting Unit 21 Cutting Blade 70 Cleaning Unit (Destination)
80 Bottom drying unit (destination)
110 transport unit (transport device)
REFERENCE SIGNS LIST 120 suction pad 130 conveying section main body 133 suction path 150 moving unit 160 open cell sponge 200 workpiece 206 package device chip (chip)

Claims (2)

A conveying device that is held on a holding surface of a chuck table and that is cut and divided while being supplied with cutting water and returns a plurality of chips from the chuck table to a conveying destination,
a suction pad for sucking the tip;
a conveying unit body including a suction path for applying negative pressure to the suction pad;
a moving unit that moves the transport unit body,
The suction path is provided with an open-cell sponge that absorbs cutting water flowing into the suction path through the suction pad when the tip is suctioned,
A conveying device in which cutting water absorbed by the open-cell sponge is sucked and discharged from the suction path. a chuck table for sucking and holding a plate-like workpiece;
a cutting unit that divides the workpiece into a plurality of chips with a cutting blade while supplying cutting water to the workpiece held on the chuck table;
a cleaning unit that cleans the chips split by the cutting unit;
a conveying unit that conveys chips from the chuck table to the cleaning unit,
A cutting apparatus, wherein the conveying unit is the conveying apparatus according to claim 1 .

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