JP2021034647A - Protective film coating device and laser processing apparatus equipped with protective film coating device - Google Patents

Abstract

To provide a protective film coating device that eliminates the problem in that accumulation of liquid resin scattered on an internal wall of a chamber is prevented to remove the resin periodically accumulated by a worker, which is troublesome, and to provide a laser processing apparatus equipped with a protective film coating device.SOLUTION: There is provided a protective film coating device 2, which coats a surface of a work piece with a protective film, the device including: a spinner table 31 holding the work piece W and rotatable; liquid resin application means 31 that applies liquid resin 60 to the surface of the work piece W held by the spinner table 31; and a chamber 33 that receives the liquid resin 60 scattering due to rotation of the spinner table 31; wherein the chamber 33 comprises at least: a cylindrical body 34 accommodating the spinner table 31; and internal-wall washing means 35 disposed on an internal wall 34a of the cylindrical body 34 and washes the internal wall 34a by jetting a washing liquid along the internal wall 34a and removing the liquid resin 60 scattered on the internal wall 34a when the liquid resin 60 is applied to the work piece W.SELECTED DRAWING: Figure 6

Description

The present invention relates to a protective film coating device that coats the surface of a work piece with a protective film, and a laser processing device provided with the protective film coating device.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by a scheduled division line and formed on the surface is divided into individual device chips by a laser processing device and used for electric devices such as mobile phones and personal computers.

The laser processing apparatus relatively processes and feeds the holding means for holding the workpiece, the laser beam irradiating means for irradiating the workpiece held by the holding means with a laser beam, and the holding means and the laser beam irradiating means. It is provided with a processing feed means for processing, and a protective film coating device for covering the surface of the work piece before processing with a protective film to protect the device from debris scattered by irradiation with a laser beam (for example, Patent Document 1). reference).

Further, the protective film coating device includes a spinner table that holds the workpiece and can rotate, a coating means that applies a liquid resin to the surface of the workpiece held on the spinner table, and the spinner table that scatters the surface. It is configured to include a chamber for receiving the liquid resin to be used, and a protective film can be appropriately coated on the surface of the wafer.

Japanese Unexamined Patent Publication No. 2004-322168

However, since the scattered liquid resin is deposited on the inner wall of the chamber that receives the liquid resin scattered by the rotation of the spinner table, the worker must regularly remove the deposited resin, which is not bothersome. There is a problem of poor productivity.

The present invention has been made in view of the above facts, and its main technical problem is to prevent the liquid resin scattered on the inner wall of the chamber from accumulating, and the worker must periodically remove the deposited resin. It is an object of the present invention to provide a protective film coating device that solves the problem of being uncomfortable, and a laser processing device provided with the protective film coating device.

In order to solve the above-mentioned main technical problem, according to the present invention, a protective film coating device for coating a protective film on the surface of a work piece, a spinner table that holds and rotates the work piece, and the spinner table. The chamber includes a liquid resin coating means for applying a liquid resin to the surface of the work piece held in the above, and a chamber for receiving the liquid resin scattered by the rotation of the spinner table, and the chamber is a cylinder for accommodating the spinner table. An inner wall that is disposed on the inner wall of the body and the cylinder and sprays a cleaning liquid along the inner wall to remove the liquid resin scattered on the inner wall when the liquid resin is applied to the workpiece to clean the inner wall. A cleaning means and a protective film coating device composed of at least are provided.

It is preferable that the inner wall of the cylinder is formed in an inverted conical shape, and the cleaning liquid sprayed by the inner wall cleaning means is formed so as to spirally flow down along the inner wall. Further, more preferably, a spiral guide portion for guiding the cleaning liquid sprayed from the inner wall cleaning means is formed on the inner wall formed in the inverted conical shape. Further, it is preferable that a plurality of the inner wall cleaning means are arranged on the inner wall of the cylinder. Then, the protective film covering device may be provided with a protective film cleaning means for removing the protective film coated on the workpiece.

In order to solve the above-mentioned main technical problem, according to the present invention, a holding means for holding a work piece, a laser beam irradiation means for irradiating a work piece held by the holding means with a laser beam, the holding means, and the holding means A laser processing apparatus including the processing feed means for relatively processing and feeding the laser beam irradiation means and the protective film coating apparatus described above is provided.

The protective film coating device of the present invention includes a spinner table that holds a work piece and can rotate, a liquid resin coating means that applies a liquid resin to the surface of the work piece held by the spinner table, and the spinner table. A chamber for receiving the liquid resin scattered by rotation is included, and the chamber includes a cylinder for accommodating the spinner table and a liquid resin which is arranged on the inner wall of the cylinder and injects a cleaning liquid along the inner wall. The liquid resin adheres to and accumulates on the inner wall of the chamber by at least being composed of an inner wall cleaning means for removing the liquid resin scattered on the inner wall and cleaning the inner wall when the liquid resin is applied to the work piece. There is no need to manually remove the resin that has accumulated on a regular basis, which solves the problem of unbearable and poor productivity. Further, according to the laser processing device provided with the protective film coating device described above, the liquid resin does not adhere to and accumulate on the inner wall of the chamber, and the worker does not need to remove the deposited resin on a regular basis. The problem of unbearable and poor productivity is solved.

It is a perspective view of the laser processing apparatus provided with the protective film coating apparatus of this embodiment. (A) A perspective view of a protective film coating device arranged in the laser processing apparatus shown in FIG. 1, a partial cross-sectional view showing an example of a cylinder of the protective film coating apparatus shown in (b) and (a), (c). It is a partial cross-sectional view which shows the other example of the cylinder of the protective film coating apparatus shown in (a). (A) A perspective view showing a mode in which the wafer is placed on the protective film covering device shown in FIG. 2, and (b) a perspective view showing a state in which the wafer is placed on the protective film covering device and the spinner table is moved to the working position. It is a figure. (A) is a perspective view showing a state in which a liquid resin is applied to a wafer, and (b) is a side view showing a state in which a protective film made of a liquid resin is formed on the wafer. It is a perspective view which shows the mode that the protective film on a wafer is removed by the protective film cleaning means. It is a perspective view which shows the mode of supplying the cleaning liquid to the inner wall of a chamber by the inner wall cleaning means.

Hereinafter, an embodiment of a protective film coating device configured based on the present invention and a laser processing device provided with the protective film coating device will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a laser processing apparatus 2 provided with a protective film coating apparatus configured based on the present invention. The laser processing device 2 is a device that performs laser processing on a wafer W prepared as a plate-like object to be a work piece. The outline of the laser processing apparatus 2 provided with the protective film coating apparatus of the present embodiment will be described below with reference to FIG.

On the front side of the laser processing apparatus 2, an operating means 4 for an operator to input an instruction to the apparatus such as processing conditions is provided. A display means 6 for displaying processing conditions and an image captured by an imaging means described later is provided on the upper part of the laser processing device 2.

The laser processing apparatus 2 is provided with a wafer cassette 8 (indicated by a two-point chain line) capable of accommodating a plurality of wafers W integrated with an annular frame F via a dicing tape T. The wafer cassette 8 is placed on a cassette elevating means 9 that can move up and down.

Behind the wafer cassette 8, a carry-in / out means 10 for carrying out the wafer W before laser processing from the wafer cassette 8 and carrying the processed wafer W into the wafer cassette 8 is arranged. A wafer W to be loaded / unloaded is temporarily placed between the wafer cassette 8 and the loading / unloading means 10, and a temporary storage means having a function of aligning the wafer W held in the frame F at a fixed position. 12 is arranged.

In the vicinity of the temporary placement means 12, a first transport means 16 having a swivel arm for sucking and transporting the frame F holding the wafer W is arranged. The wafer W carried out from the wafer cassette 8 onto the temporary storage means 12 by the carry-in / out means 10 is attracted by the first transport means 16 and is disposed at a position adjacent to the temporary storage means 12. Will be transported to.

The protective film coating device 30 is a device having a function of coating a protective film made of a liquid resin on the upper surface of the wafer W. In the present embodiment, the protective film cleaning means for removing the protective film from the upper surface of the wafer W after processing. Also equipped. The protective film coated on the upper surface of the wafer W is, for example, a water-soluble liquid resin, and more specifically, it is adopted from polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), and the like. The protective film coating device 30 will be described in detail later.

The laser processing apparatus 2 is provided with holding means 18 for holding the wafer W to be laser processed. The wafer W whose upper surface is coated with the protective film by the protective film covering device 30 is conveyed by the second conveying means 29 onto the chuck table 181 of the holding means 18 located at the loading / unloading position in FIG. The wafer W conveyed to the chuck table 181 is sucked into the chuck table 181 via the dicing tape T, and the frame F is gripped and fixed by the plurality of clamps 182. The holding means 18 is moved by a processing feeding means 50 that relatively processes and feeds the laser beam irradiating means 24 and the holding means 18, which will be described later.

A part of the holding means 18 and the processing feeding means 50 are housed in the housing 2A of the laser processing apparatus 2. The holding means 18 and the processing feeding means 50 housed in the housing 2A are shown in the lower part of FIG. As shown in the figure, the holding means 18 includes a rectangular X-axis direction movable plate 183 mounted on a base 2B arranged in the housing 2A and an X-axis direction movable plate 183 that is movable in the Y-axis direction. A rectangular Y-axis movable plate 184 mounted on the above, a cylindrical support plate 185 fixed to the upper surface of the Y-axis direction movable plate 184, and a rectangular cover plate 186 fixed to the upper end of the support column 185. Including. The cover plate 186 is provided with a chuck table 181 extending upward through an elongated hole formed on the cover plate 186. The chuck table 181 holds a circular plate-shaped object, and is configured to be rotatable by a rotation driving means (not shown) housed in the support column 185. The upper surface of the chuck table 181 is formed of a breathable porous material and is connected to a suction means (not shown) by a flow path formed in the column 183.

The machining feed means 50 includes an X-axis feed means 52 and a Y-axis feed means 54. The X-axis feed means 50 converts the rotational motion of the motor 52a into a linear motion via the ball screw 52b and transmits it to the movable plate 183 in the X-axis direction, and X along the guide rails 2C and 2C on the base 2B. The axially movable plate 183 is moved forward and backward in the X-axis direction. The Y-axis feeding means 54 converts the rotational motion of the motor 54a into a linear motion via the ball screw 54b, transmits it to the Y-axis direction movable plate 184, and transmits it to the guide rails 187 and 187 on the X-axis direction movable plate 183. Along the Y-axis direction movable plate 184 is moved back and forth in the Y-axis direction. The machining feed means 50 in the present embodiment also includes means for rotating the chuck table 181 by a rotation drive means (not shown) housed in the support column 185.

Above the movement path of the chuck table 181 in the X-axis direction, an alignment means 20 for detecting a position of the wafer W to be laser-machined (for example, a scheduled division line on the wafer W) is arranged. The alignment means 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a scheduled division line to be laser-processed by image processing such as pattern matching based on the image acquired by the imaging. The image acquired by the imaging means 22 is sent to a control means (not shown) and displayed on the display means 6.

A laser beam irradiating means 24 is arranged at a position adjacent to the alignment means 20 in the X-axis direction. The laser beam irradiating means 24 includes a casing 26 that houses an optical system (not shown) that oscillates a laser beam having a wavelength that is absorbent to the wafer W, and a condenser 28 for condensing and irradiating the laser beam. , And the upper surface of the wafer W can be ablated by a laser beam emitted from the condenser 28.

The wafer W that has been ablated by the laser beam irradiating means 24 is moved to the loading / unloading position on the front side in the drawing together with the chuck table 18 and is adsorbed by the second transporting means 29 to remove the protective film on the wafer W. Is transported to the protective film coating device 30 for executing the above. The wafer W from which the protective film has been removed from the upper surface by the protective film covering device 30 is transported to the temporary storage means 12 by adsorbing the frame F supporting the wafer W by the transport means 16, and the wafer cassette 8 is transported by the carry-in / out means 10. Returned to the original storage location.

The protective film coating device 30 described above will be described more specifically with reference to FIG. FIG. 2A shows a perspective view of the protective film coating device 30 taken out from the laser processing device 2.

The protective film coating device 30 comprises a spinner table 31 that holds and rotates the wafer W, a liquid resin coating means 32 that applies liquid resin to the surface of the wafer W held by the spinner table 31, and rotation of the spinner table 31. A chamber 33 for receiving the scattered liquid resin and a spinner motor 40 for rotationally driving the spinner table 31 via a rotating shaft 42 are provided. The chamber 33 includes a tubular body 34 whose upper portion is circularly open and capable of accommodating a spinner table 31, and an inner wall cleaning means 35 which is arranged on the inner wall 34a of the tubular body 34 and ejects a cleaning liquid along the inner wall 34a. Further, in the present embodiment, the protective film cleaning means 36 for cleaning and removing the protective film coated on the surface of the wafer W held on the spinner table 31 is also provided.

The liquid resin coating means 32 is arranged on the outside of the chamber 33 and has a vertically extending vertical portion 32a and a shape that curves horizontally from the upper end portion of the vertical portion 32a and along the upper opening of the tubular body 34. The arm portion 32b extending in the above direction and the nozzle portion 32c formed at the tip end portion of the arm portion 32b are provided. A liquid resin supply means (not shown) is connected to the liquid resin coating means 32, and the liquid resin supplied from the liquid resin supply means passes through the inside of the upright portion 32a and the arm portion 32b and the lower tip of the nozzle portion 32c. Is injected downward. The upright portion 32a expands and contracts in the vertical direction, and the arm portion 32b is configured to rotate in the horizontal direction around the upright portion 32a. The nozzle portion 32c is above the center of the chuck table 181 and is arbitrary. It is possible to position it at the height of.

The protective film cleaning means 36 also has substantially the same configuration as the liquid resin coating means 32 described above, and has a vertically extending vertical portion 36a and a tubular body 34 horizontally from the upper end portion of the vertical portion 36a. The arm portion 36b extending in a curved shape along the upper opening and the nozzle portion 36c formed at the tip end portion of the arm portion 36b are provided. A cleaning liquid supply means (not shown) is connected to the protective film cleaning means 36, and the cleaning liquid supplied from the cleaning liquid supply means passes through the inside of the upright portion 36a and the arm portion 36b and downward from the lower tip of the nozzle portion 36c. It is sprayed toward. The upright portion 36a expands and contracts in the vertical direction, and the arm portion 36b is configured to rotate in the horizontal direction around the upright portion 36a. The nozzle portion 36c is the center of the chuck table 181 and is arbitrary. It is possible to position it at the height.

A plurality (two in the illustrated embodiment) of the inner wall cleaning means 35 are arranged at equal intervals on the upper edge of the inner wall 34a of the tubular body 34. The inner wall cleaning means 35 is formed with a plurality of injection holes 35a for injecting the cleaning liquid, and the cleaning liquid supplied from the cleaning liquid supply means (not shown) is injected from the injection holes 35a in the horizontal direction or diagonally along the inner wall 34a. It is sprayed downward. The inner wall 34a of the tubular body 34 is formed in an inverted conical shape, and the cleaning liquid sprayed from the inner wall cleaning means 35 spirally flows down along the inner wall 34a. Further, on the inner wall 34a of the tubular body 34, a spiral guide portion 34b having a step spirally formed is formed so that the cleaning liquid described above flows down in a spiral shape better along the inner wall 34a. .. The spiral guide portion 34b is formed, for example, by providing a stepped step on the inner wall 34a (see FIG. 2B), or forming spiral rib-shaped protrusions on the inner wall 34a at predetermined intervals (see FIG. 2B). This can be achieved by referring to FIG. 2 (c)). A drain hose 37 is connected to the bottom wall (not shown) of the tubular body 34, and the cleaning liquid supplied from the inner wall cleaning means 35 and the protective film cleaning means 36 drains together with the removed protective film. It is discharged from the hose 37. Although two of the illustrated inner wall cleaning means 35 are arranged on the inner wall 34a, the present invention is not limited to this, and one or three or more may be arranged.

The protective film coating device 30 of the present embodiment and the laser processing device 2 provided with the protective film coating device 30 have substantially the same configurations as described above, and the protective film coating device arranged in the laser processing device 2 has a structure as described above. 30 and the operation of laser machining will be described below with reference to FIGS. 1, 3 to 6.

When carrying out this embodiment, the wafer W shown in FIG. 3A is prepared. The wafer W is formed by, for example, a plurality of devices D being partitioned by a scheduled division line L on the surface Wa of a substrate made of silicon (Si). The wafer W is attached to a dicing tape T having an adhesive back surface side, and is supported by an annular frame F having an opening capable of accommodating the wafer W via the dicing tape T.

In the laser processing apparatus 2 of the present embodiment, first, the wafer W housed in the wafer cassette 8 shown in FIG. 1 is pulled out to the temporary storage means 12 by the loading / unloading means 10, and then the protective film coating device is pulled out by the transporting means 16. It is transported to 30. At this time, as shown in FIG. 3A, the spinner table 31 of the protective film covering device 30 is raised by the action of a drive mechanism (not shown) and is positioned at the wafer loading / unloading position. Further, the liquid resin coating means 32 and the protective film cleaning means 36 are positioned at retracted positions that do not hinder the loading and unloading of the wafer W, as shown in the figure. The wafer W conveyed to the protective film covering device 30 is placed on a spinner table 31 positioned at the wafer loading / unloading position and is sucked and held, and the frame F is fixed by the clamp 38. After that, the spinner table 31 is lowered and positioned at the working position shown in FIG. 3 (b).

As described above, when the spinner table 31 is positioned at the working position, the liquid resin coating means 32 is operated (raised and rotated) as shown in FIG. 4A to move the nozzle portion 32a to the center of the wafer W. Positioned in the upper working position. Next, a liquid resin supply means (not shown) is operated to supply the liquid resin 60 (for example, PVA) maintained in a molten state to the liquid resin coating means 32, and a predetermined amount is supplied from the nozzle portion 32c to the surface of the wafer W. Supply. When the liquid resin 60 is supplied onto the wafer W, the spinner motor 40 is driven to rotate the wafer W held on the spinner table 31 together with the frame F in the direction indicated by the arrow R1. By this operation, the liquid resin 60 supplied to the surface of the wafer W spreads evenly, and as can be understood from the side view of the wafer W shown in FIG. 4 (b), a predetermined thickness (for example, for example) is provided on the surface side of the wafer W. A protective film (liquid resin) 60 of 0.2 to 1.0 μm) is formed. When the protective film 60 is formed on the surface of the wafer W, the nozzle portion 32a of the liquid resin coating means 32 is moved to the retracted position shown in FIG. 2, and the spinner table 31 is raised to be positioned at the wafer loading / unloading position. ..

As described above, when the protective film 60 is formed on the surface of the wafer W, the second transport means 29 is operated to activate the wafer on the wafer table 31 positioned at the wafer loading / unloading position of the protective film covering device 30. W is adsorbed, transported to the loading / unloading position where the holding means 18 shown in FIG. 1 is positioned, and placed on the chuck table 181. When the wafer W is placed on the chuck table 181 and sucked and held, the above-mentioned processing feed means 50 is operated, the wafer W is moved directly under the alignment means 20, alignment is performed, and the wafer W is formed on the wafer W. The position of the scheduled division line D is detected. When the position of the scheduled division line D is detected, the focusing point of the laser beam irradiated by the concentrator 28 of the laser beam irradiating means 24 is divided based on the position information of the scheduled division line D detected by the alignment means 20. Positioned on the surface of the scheduled line D. Next, the processing feed means 50 described above is operated to move the wafer W, and a laser for forming a division starting point along all scheduled division lines D via the protective film 60 formed on the wafer W. Perform processing (ablation processing).

The laser processing conditions for performing the above laser processing can be set as follows, for example.
Light source: YAG laser wavelength: 355 nm
Output: 3.0W
Repeat frequency: 20kHz
Pulse width: 0.1ns
Condensing spot diameter: φ0.5 μm

When the laser machining is performed as described above and the laser machining is performed on all the scheduled division lines D of the wafer W, the machining feed means 50 is operated to obtain the chuck table 181 holding the wafer W in FIG. It is positioned at the loading / unloading position of the wafer W shown in. When the processed wafer W is positioned at the loading / unloading position, the suction holding of the wafer W by the chuck table 181 is released, the second transport means 29 is operated, and the wafer W held by the chuck table 181 is released. It is adsorbed, transported to the protective film coating device 30 again, placed on a spinner table 31 (see FIG. 3A) positioned at the wafer loading / unloading position, and suction-held. When the processed wafer W is held on the spinner table 31 and lowered to be positioned at the working position, the protective film cleaning means 36 is operated.

As shown in FIG. 5, the protective film cleaning means 36 is operated (raised, rotated) to position the nozzle portion 36c at a working position above the center of the wafer W. Next, a cleaning liquid supply means (not shown) is operated to supply the cleaning liquid (pure water) to the protective film cleaning means 36, and the spinner motor 40 is driven while supplying the cleaning liquid (pure water) from the nozzle portion 36c to the surface of the wafer W. The wafer W held on the spinner table 31 is rotated together with the frame F in the direction indicated by the arrow R1. By this operation, the cleaning liquid 70 supplied to the surface of the wafer W spreads on the wafer W, and the water-soluble protective film 60 is removed from the wafer W. The protective film 60 removed from the wafer W is scattered together with the cleaning liquid 70 on the inner wall 34a of the cylinder 34 of the chamber 33, and the protective film 60 scattered on the inner wall 34a flows together with the cleaning liquid 70 and is discharged from the drain hose 37. To. After removing the protective film 60 from the wafer W, the spinner table 31 may be rotated at high speed, and air may be blown to dry the wafer W.

As described above, when the protective film 60 is removed from the wafer W, the spinner table 31 is raised and positioned at the wafer loading / unloading position. The wafer W held on the spinner table 31 is adsorbed, the clamp 38 is released, and the first transport means 16 is operated to adsorb the upper wafer W held on the spinner table 31. After that, the first transport means 16, the temporary storage means 12, and the carry-in / out means 10 are operated to accommodate the wafer W at a predetermined position of the wafer cassette 8.

As described above, in the protective film coating device 30 of the present embodiment, the liquid resin coating means 32 is operated to coat the protective film 60 on the upper surface of the wafer W before laser processing, and the wafer W after laser processing is coated. On the other hand, the protective film cleaning means 36 is operated to inject the cleaning liquid 70 to remove the protective film 60 from the wafer W. At this time, by rotating the spinner table 31 that holds the wafer W, the protective film 60 (that is, the liquid resin) dissolved by the cleaning liquid 70 is scattered outward from the upper surface of the wafer W to form the chamber 33. It adheres to the inner wall 34a of the tubular body 34. When the protective film cleaning means 36 is operated, the cleaning liquid 70 is supplied to the upper surface of the wafer W and scattered on the inner wall 34a, but the protective film 60 adhering to the inner wall 34a is not completely discharged and is not completely discharged to the inner wall 34a. It will remain.

Here, as described above, the inner wall cleaning means 35 is arranged in the chamber 33 of the protective film covering device 30 of the present embodiment, and can be operated at an arbitrary timing. When the inner wall cleaning means 35 is operated, a cleaning liquid supply means (not shown) is operated to inject the cleaning liquid 70 from the injection hole 35a of the inner wall cleaning means 35 as shown in FIG. In the present embodiment, since the inner wall 34a of the tubular body 34 constituting the chamber 33 has an inverted conical shape, the cleaning liquid 70 injected from the injection hole 35a spirally flows down along the inner wall 34a. In the present embodiment, as described above, the inner wall 34a is formed with a spiral guide portion 34b for guiding the cleaning liquid 70 ejected from the inner wall cleaning means 35, and the cleaning liquid 70 ejected from the inner wall cleaning means 35 is formed on the inner wall 34a. It is collected at the bottom of the chamber 33 while spirally flowing down along the spiral guide portion 34b of the inner wall 34a, and is discharged from the drain hose 37 together with the protective film 60 removed from the inner wall 34a.

The timing at which the inner wall cleaning means 35 is operated can be arbitrarily set, but it is periodically performed according to the characteristics of the liquid resin constituting the protective film 60 to be used. For example, when the liquid resin used as the protective film 60 tends to stick to the inner wall 34a of the chamber 33, the protective film 60 coated on the upper surface of the wafer W is subjected to laser processing on the wafer W by the protective film cleaning means 36. Each time it is removed, the inner wall cleaning means 35 is activated. If the liquid resin constituting the protective film 60 does not stick so much, for example, the laser machining may be performed at the timing when the laser processing for all the wafers W housed in the wafer cassette 8 is completed.

According to the present invention, various modifications are provided without being limited to the above-described embodiment. For example, in the above-described embodiment, the protective film coating device 30 is provided in the laser processing device 2, but the present invention is not limited to this, and the protective film coating device 30 is separated from the laser processing device 2. , May be an independent device. Further, in the above-described embodiment, an example in which the cleaning liquid 70 is pure water is shown, but the present invention is not limited to this, and the liquid resin constituting the protective film 60 can be satisfactorily removed from the upper surface of the wafer W. As long as it is a liquid that can be produced, another cleaning liquid may be selected, or a pure water supplemented with another liquid may be selected.

2: Laser processing device 4: Operating means 6: Displaying means 8: Weir cassette 9: Cassette raising / lowering means 10: Carrying / removing means 12: Temporary placing means 16: First transporting means 18: Holding means 181: Chuck table 182: Clamp 183 : X-axis movable plate 184: Y-axis movable plate 185: Support 186: Cover plate 20: Alignment means 22: Imaging means 24: Laser beam irradiation means 28: Condenser 29: Second transport means 30: Protective film coating device 31: Spinner table 32: Liquid resin coating means 32a: Standing part 32b: Arm part 32c: Nozzle part 33: Chamber 34: Cylinder 34a: Inner wall 34b: Spiral guide part 35: Inner wall cleaning means 35a: Injection hole 36: Protective film cleaning means 36a: Standing part 36b: Arm part 36c: Nozzle part 37: Drain hose 38: Clamp 40: Spinner motor 42: Rotating shaft 50: Machining feed means 60: Liquid resin (protective film)
70: Cleaning liquid (pure water)
W: Wafer D: Device L: Scheduled division line F: Frame T: Dicing tape

Claims (6)

A protective film coating device that coats the surface of the work piece with a protective film.
A spinner table that holds the work piece and can rotate, a liquid resin coating means that applies liquid resin to the surface of the work piece held on the spinner table, and a chamber that receives the liquid resin that scatters due to the rotation of the spinner table. And, including
The chamber has a cylinder for accommodating the spinner table and a liquid that is disposed on the inner wall of the cylinder and sprays a cleaning liquid along the inner wall to scatter the liquid resin on the inner wall when the liquid resin is applied to the work piece. An inner wall cleaning means for removing the resin and cleaning the inner wall,
A protective film coating device consisting of at least. The protective film coating device according to claim 1, wherein the inner wall of the cylinder is formed in an inverted conical shape, and the cleaning liquid sprayed by the inner wall cleaning means flows down spirally along the inner wall. The protective film coating device according to claim 2, wherein a spiral guide portion for guiding a cleaning liquid sprayed from the inner wall cleaning means is formed on the inner wall formed in the inverted conical shape. The protective film coating device according to any one of claims 1 to 3, wherein the inner wall cleaning means is disposed on the inner wall of the cylinder. The protective film coating device according to any one of claims 1 to 4, wherein a protective film cleaning means for removing the protective film coated on the workpiece is provided. A holding means for holding the workpiece, a laser beam irradiating means for irradiating the workpiece held by the holding means with a laser beam, and a machining feeding means for relatively machining and feeding the holding means and the laser beam irradiating means. , A laser processing apparatus comprising the protective film coating apparatus according to any one of claims 1 to 5.