JP5988562B2 - Drying equipment - Google Patents

Description

  The present invention relates to a drying apparatus for drying after cleaning the surface of a plate-like object such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. The semiconductor wafer thus formed is cut along the streets to divide the region where the device is formed to manufacture individual semiconductor devices. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of sapphire substrates are also divided into optical devices such as individual light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the semiconductor wafer and the optical device wafer described above is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a wafer such as a semiconductor wafer, a cutting means having a cutting blade for cutting the wafer held on the chuck table, and the chuck table and the cutting means relative to the cutting feed direction. A cutting feed means for cutting and feeding the wafer, and a cleaning means for cleaning the wafer cut by the cutting means. As this cleaning means, a spinner table including a spinner table that holds a wafer and is rotatable, and a cutting water injection mechanism that includes a cutting water injection nozzle having an injection port for injecting a cleaning liquid onto the wafer held on the spinner table. A cleaning device is used. Further, the cleaning means includes an air nozzle that blows air onto the wafer held on the spinner table, and dries the cleaned wafer by blowing air onto the wafer while rotating the spinner table holding the cleaned wafer at a high speed. ing. (For example, refer to Patent Document 1.)

JP 2006-128359 A

  Thus, the cutting water that has entered the cutting groove of the wafer cut by the cutting blade is difficult to be sufficiently discharged even if the spinner table is rotated at a high speed, becomes insufficiently dried and is relatively long. There is a problem that it takes time.

  This invention is made | formed in view of the said fact, The main technical subject is to provide the drying apparatus which can dry the plate-shaped object to which the liquid adhered in a short time.

In order to solve the above main technical problem, according to the present invention, a drying apparatus for removing and drying liquid adhering to a plate-like object after cutting ,
A holding table having a holding surface for holding a plate-like object after cutting ;
An ultrasonic vibration applying means for applying ultrasonic vibration to the holding table;
The ultrasonic vibration applying means is operated to apply ultrasonic vibration having a frequency at which the cutting waste that has entered the cutting groove of the plate-like object after the cutting becomes fine particles and floats on the holding table. By applying ultrasonic vibration to the held plate-like object after being held, the liquid adhering to the plate-like object after the cutting is dispersed as fine particles,
A drying apparatus is provided.

The ultrasonic vibration applying means applies ultrasonic vibration having a frequency of 2.5 MHz or more to the holding table.
Rotation driving means for rotating the holding table is provided.
An air supply mechanism for supplying air to the plate-like object held on the holding table is provided.
Further, a cleaning liquid supply mechanism is provided for supplying the cleaning liquid to the plate-like object held on the holding table.

The drying apparatus according to the present invention includes an ultrasonic vibration applying unit that applies ultrasonic vibration to a holding table that holds a plate-like object after cutting , and operates the ultrasonic vibration applying unit to the holding table after the cutting. Applying ultrasonic vibration having a frequency at which the cutting waste entering the cutting groove of the plate-like material floats as fine particles, and applying ultrasonic vibration to the plate-like material after cutting held on the holding table Thus, since the liquid adhering to the cut plate-like material is dispersed as fine particles, the plate-like material to which the liquid has adhered can be dried in a short time.

The perspective view of the cutting machine equipped with the drying apparatus comprised according to this invention. The perspective view which fractures | ruptures and shows a part of drying apparatus comprised according to this invention with which the cutting machine shown in FIG. 1 was equipped. Explanatory drawing which fractures | ruptures and shows the principal part of the holding table and ultrasonic vibration provision means which comprise the drying apparatus shown in FIG. Explanatory drawing which shows the state which positioned the holding table of the drying apparatus shown in FIG. 2 in the workpiece carrying in / out position. Explanatory drawing which shows the state which positioned the holding table of the drying apparatus shown in FIG. 2 in a work position.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a drying apparatus configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a cutting machine equipped with a drying device constructed in accordance with the present invention.
A cutting machine 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction (X-axis direction). The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a work piece via a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction (X-axis direction) indicated by an arrow X by a cutting feed means (not shown).

  A cutting machine 1 shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the cutting feed direction (X-axis direction). The spindle unit 4 is moved in the index feed direction (Y-axis direction) by an index feed means (not shown), and is moved in the cut feed direction (Z-axis direction) indicated by an arrow Z in FIG. 1 by a not-shown cut feed means. It is like that. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in an indexing direction (Y-axis direction) and a cutting direction (Z-axis direction), and is rotatably supported by the spindle housing 41. A rotary spindle 42 and a cutting blade 43 attached to the front end of the rotary spindle 42 are provided. The rotary spindle 42 is configured to be rotated by a servo motor (not shown).

  The cutting machine 1 in the illustrated embodiment includes an image pickup means 5 for picking up an image of the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 43. . The imaging means 5 is composed of optical means such as a microscope and a CCD camera, and sends the captured image signal to a control means (not shown). In addition, the cutting machine 1 includes a display unit 6 that displays an image captured by the imaging unit 5.

  In the cassette mounting area 11a of the apparatus housing 2, a cassette mounting table 111 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 111 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 111, a cassette 11 for storing the semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 11 has a grid-like street formed on the surface thereof, and devices such as IC and LSI are formed in a plurality of rectangular areas partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 11 with the back surface adhered to the front surface of the dicing tape T mounted on the annular frame F.

  Further, the cutting machine 1 in the illustrated embodiment is supported by a semiconductor wafer 10 (annular frame F via a dicing tape T) housed in a cassette 11 placed on the cassette placement table 111. State) is carried out to the temporary table 12, the wafer carry-in / carry-in means 13, the first wafer conveyance means 14 which conveys the semiconductor wafer 10 carried out to the temporary table 12 onto the chuck table 3, and the chuck table 3 A cleaning / drying device 7 that cleans and dries the semiconductor wafer 10 that has been cut above, and a second wafer transfer means 15 that transfers the semiconductor wafer 10 that has been cut on the chuck table 3 to the cleaning / drying device 7. It has.

Next, the cleaning / drying apparatus 7 will be described with reference to FIGS.
The cleaning / drying apparatus 7 in the illustrated embodiment includes a holding table mechanism 70 as shown in FIG. The holding table mechanism 70 includes a holding table 71, an electric motor 72 as a rotation driving unit that rotationally drives the holding table 71, and a support unit 73 that supports the electric motor 72 so as to be movable in the vertical direction. . As shown in FIG. 3, the holding table 71 includes a circular table main body 711 and a shaft portion 712 formed continuously on the lower surface of the table main body 711. The holding table 71 is integrated with a metal material such as stainless steel. Is formed. A circular fitting recess 711 a is provided on the upper surface of the table body 711. In the fitting recess 711a, an annular mounting shelf 711b is provided on the outer periphery of the bottom surface. The table body 711 and the shaft portion 712 are provided with a suction passage 711c that opens into the fitting recess 331a, and the suction passage 711c communicates with suction means (not shown). A suction chuck 713 formed of a porous member made of porous ceramics or the like having countless suction holes is fitted into a fitting recess 711a provided in the table body 711, and placed on an annular placement shelf 711b. Is done. The holding table 71 configured as described above sucks and holds the wafer on the suction chuck 713 by placing a plate-like object such as a wafer on the holding surface which is the upper surface of the suction chuck 713 and operating a suction means (not shown). To do.

Continuing the description with reference to FIG. 3, the cleaning / drying apparatus 7 in the illustrated embodiment includes ultrasonic vibration applying means 8 for applying ultrasonic vibration to the holding table 71. The ultrasonic vibration applying means 8 includes ultrasonic vibrators 81a and 81b disposed on a holding table 71, and a power supply means 82 for applying AC power to the ultrasonic vibrators 81a and 81b. The ultrasonic transducers 81 a and 81 b are disposed in an annular groove 711 d formed on the outer periphery of the table body 711. Each of the ultrasonic transducers 81a and 81b is composed of a piezoelectric body 811 and two electrode plates 812 and 813 mounted on both side polarization surfaces of the piezoelectric body 811, respectively, and each is formed in a semi-annular shape. ing. The piezoelectric body 811 is formed of piezoelectric ceramics such as barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb (Zr, Ti) O ₃ ), lithium niobate (LiNbO ₃ ), and lithium tantalate (LiTaO ₃ ). Has been. In the ultrasonic transducers 81a and 81b configured as described above, the electrode plates 812 and 813 are attached to the table main body 711 by insulator bonds, respectively. In the ultrasonic transducers 81a and 81b thus mounted on the table main body 711, the electrode plates 812 and 813 are disposed on the outer peripheral surface of the shaft portion 712 via the conductors 814 and 815 via the insulator bond, respectively. The ring-shaped electrode terminals 816 and 817 are connected. Note that slip rings 818 and 819 are attached to the outer periphery of the annular electrode terminals 816 and 817, and the slip rings 818 and 819 are connected to the power supply means 82.

  The AC power supply means 82 for applying AC power of a predetermined frequency to the ultrasonic transducers 81a and 81b described above includes an AC power supply 821, a voltage adjustment means 822 as a power adjustment means, and a frequency adjustment for adjusting the frequency of the AC power. And a control means 824 for controlling the voltage adjusting means 822 and the frequency adjusting means 823.

The ultrasonic vibration applying means 8 shown in FIG. 3 is configured as described above, and the operation thereof will be described below.
The power supply unit 82 constituting the ultrasonic vibration applying unit 8 controls the voltage adjusting unit 822 and the frequency converting unit 823 by the control unit 824 to control the voltage of the AC power to a predetermined voltage (for example, 75 V), The frequency of AC power is converted to a frequency of 2.5 MHz or higher. The AC power controlled to a predetermined frequency with a predetermined voltage in this way is applied to each electrode of the ultrasonic transducers 81a and 81b via the slip rings 818 and 819, the annular electrode terminals 816 and 817, and the conductors 814 and 815. Applied to the plates 812, 813. As a result, the ultrasonic transducers 81a and 81b are repeatedly displaced in the radial direction and the axial direction to vibrate ultrasonically. This ultrasonic vibration is transmitted to the circular table main body 711 of the holding table 71, and the table main body 711 ultrasonically vibrates in the radial direction and the axial direction.

  In the holding table 71 configured as described above, the shaft portion 712 is connected to the drive shaft 721 of the electric motor 72 shown in FIG. Accordingly, by driving the electric motor 72, the holding table 71 is rotated in a predetermined direction.

  The support means 73 includes a plurality of (three in the illustrated embodiment) support legs 731 and a plurality of (three in the illustrated embodiment) attached to the electric motor 72 by connecting the support legs 731. ) Air cylinder 732. The support means 73 configured in this manner operates the air cylinder 732 to bring the electric motor 72 and the holding table 71 into the workpiece loading / unloading position which is the upper position shown in FIG. 4 and the lower position shown in FIG. Position to the working position that is the position.

  Continuing the description with reference to FIG. 2, the cleaning / drying apparatus 7 in the illustrated embodiment includes a water receiving means 74 disposed so as to surround the spinner table mechanism 70. The water receiving means 74 includes a cleaning liquid receiving container 741, three supporting legs 742 that support the cleaning liquid receiving container 741 (two are shown in FIG. 2), and a shaft portion 712 of the holding table 71. And a cover member 743 attached to the head. As shown in FIGS. 4 and 5, the cleaning liquid receiving container 741 includes a cylindrical outer wall 741a, a bottom wall 741b, and an inner wall 741c. A hole 741d through which the drive shaft 721 of the electric motor 72 is inserted is provided at the center of the bottom wall 741b, and an inner wall 741c protruding upward from the periphery of the hole 741d is formed. Further, as shown in FIG. 2, the bottom wall 741b is provided with a drain port 741e, and a drain hose 744 is connected to the drain port 741e. The cover member 743 is formed in a disc shape and includes a cover portion 743a that protrudes downward from the outer peripheral edge thereof. When the electric motor 72 and the holding table 71 are positioned at the work position shown in FIG. 5, the cover member 743 configured in this manner has a gap on the outer side of the inner wall 741 c that constitutes the cleaning liquid receiving container 741. Positioned to polymerize.

  The cleaning / drying apparatus 7 in the illustrated embodiment includes a cleaning liquid supply mechanism 75 for supplying a cleaning liquid to the semiconductor wafer 10 that is a processed workpiece held on the holding table 71. The cleaning liquid supply mechanism 75 includes a cleaning liquid injection nozzle 751 that supplies the cleaning liquid toward the wafer held by the holding table 71, and an electric motor 752 that can be rotated forward and backward to swing the cleaning liquid injection nozzle 751. The cleaning liquid jet nozzle 751 is composed of a nozzle portion 751b that extends horizontally and has a tip portion bent downward and a jet port 751a at the tip, and a support portion 751c that extends downward from the base end of the nozzle portion 751b. The portion 751c is disposed through an insertion hole (not shown) provided in the bottom wall 741b constituting the storage container 741. A seal member (not shown) that seals between the support portion 751c and the support hole 751c is attached to the periphery of the insertion hole (not shown) through which the support portion 751c of the cleaning liquid injection nozzle 751 is inserted.

  2, 4, and 5, the cleaning / drying apparatus 7 in the illustrated embodiment applies air to the semiconductor wafer 10 that is a workpiece to be processed held by the holding table 71. An air supply mechanism 76 for supplying the air is provided. The air supply mechanism 76 includes an air nozzle 761 that blows air toward the semiconductor wafer 10 that is a workpiece to be cleaned, which is held by the spinner table 711, and forward / reverse rotation for swinging the air nozzle 761. A possible electric motor 762 is provided, and the air nozzle 761 is connected to an air supply means (not shown). The air nozzle 761 is composed of a nozzle portion 761b that extends horizontally and has a distal end bent downward and has an injection port 761a at the distal end, and a support portion 761c that extends downward from the base end of the nozzle portion 761b. 761c is disposed through an insertion hole (not shown) provided in the bottom wall 741b constituting the cleaning liquid receiving container 741. In addition, a seal member (not shown) that seals between the support portion 761c and the periphery of an insertion hole (not shown) through which the support portion 761c of the air nozzle 761 is inserted is attached.

Next, the operation of the cutting machine 1 equipped with the cleaning / drying device 7 configured as described above will be described.
The semiconductor wafer 10 (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 11 placed on the cassette placement table 111 is placed in the cassette by a lifting means (not shown). The mounting table 111 is positioned at the carry-out position by moving up and down. Next, the wafer carry-out / carry-in means 13 is advanced and retracted to carry the semiconductor wafer 10 positioned at the carry-out position onto the temporary table 12. The semiconductor wafer 10 carried out to the temporary placement table 12 is transferred onto the chuck table 3 by the turning operation of the first wafer transfer means 14.

  When the semiconductor wafer 10 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer 10 on the chuck table 3. An annular frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by the clamp 33. The chuck table 3 that sucks and holds the semiconductor wafer 10 in this way is moved to a position immediately below the image pickup means 5. When the chuck table 3 is positioned immediately below the image pickup means 5, the street formed on the semiconductor wafer 10 is detected by the image pickup means 5, and the spindle unit 4 is moved and adjusted in the direction of the arrow Y which is the indexing direction. A precision alignment operation with the cutting blade 43 is performed (alignment process).

  If the alignment process is performed as described above, the cutting blade 43 is cut and fed by a predetermined amount in the direction indicated by the arrow Z, and the chuck table 3 that sucks and holds the semiconductor wafer 10 while rotating in the predetermined direction is cut and fed. Is cut and fed in a direction indicated by an arrow X at a predetermined cutting feed speed. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43 (cutting process). When the semiconductor wafer 10 is cut along a predetermined street in this way, the spindle unit 4 is indexed and fed in the direction indicated by the arrow Y by the street interval, and the above-described cutting process is performed. When the cutting process is performed along all the streets extending in the predetermined direction of the semiconductor wafer 10, the chuck table 3 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the semiconductor wafer 10. The cutting process is performed along the street. As a result, the semiconductor wafer 10 is cut along all the streets formed in a lattice pattern on the surface and divided into individual devices. Note that the divided individual devices do not fall apart due to the action of the dicing tape T, and the state of the wafer supported by the annular frame F is maintained.

  As described above, when the cutting process is completed along the street of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. Then, the suction holding of the semiconductor wafer 10 is released. The semiconductor wafer 10 on the chuck table 3 released from the suction and holding in this way is transferred onto the holding table 71 of the cleaning / drying apparatus 7 by the second wafer transfer means 15. Then, the semiconductor wafer 10 is sucked and held on the holding table 71 by operating a suction means (not shown). At this time, the cleaning liquid ejection nozzle 751 is positioned at a standby position spaced apart from above the holding table 71 as shown in FIGS.

  If the processed semiconductor wafer 10 is held on the holding table 71 of the cleaning / drying apparatus 7, a cleaning process for cleaning the processed semiconductor wafer 10 is executed. That is, the holding table 71 is positioned at the work position shown in FIG. 5, and the electric motor 752 of the cleaning liquid supply mechanism 75 is operated to rotate the semiconductor wafer 10 in which the nozzle portion 751a of the cleaning liquid injection nozzle 751 is held on the holding table 71. Position above the center. Then, while rotating the holding table 71 at a rotational speed of, for example, 300 to 1000 rpm, a cleaning liquid supply unit (not shown) is operated to supply 0.2 Mpa of cleaning liquid to the cleaning liquid injection nozzle 751. The amount of cleaning liquid sprayed from the spray port 751a of the nozzle portion 751b constituting the cleaning liquid spray nozzle 751 is set to 2 liters / minute in the illustrated embodiment. Then, the electric motor 752 of the cleaning liquid supply mechanism 75 is operated to swing the cleaning liquid injection nozzle 751 to move the nozzle portion 751a from the rotation center of the semiconductor wafer 10 toward the outer periphery (cleaning process). As a result, the surface of the semiconductor wafer 10 is spinner cleaned by the cleaning liquid ejected from the ejection port 751a of the nozzle portion 751b constituting the cleaning liquid ejection nozzle 751. When the cleaning process is completed, the cleaning liquid spray nozzle 751 is positioned at the standby position.

  In the above-described cleaning process, the power supply means 82 constituting the ultrasonic vibration applying means 8 applies high-frequency power having a voltage of 75 V and a frequency of 2.5 MHz to the electrode plates 812 of the ultrasonic vibrators 81a and 81b, By applying to 813, it is desirable to ultrasonically vibrate the table body 711 of the holding table 71 in the radial direction and the axial direction as described above. Since the table main body 711 of the holding table 71 is ultrasonically vibrated in this way, the semiconductor wafer 10 after cutting held on the holding table 71 is ultrasonically vibrated, so that it enters the cutting groove formed in the semiconductor wafer 10. Since the cutting waste that has been lifted becomes fine particles, cleaning is promoted.

If the washing | cleaning process mentioned above is implemented, the drying process which dries the semiconductor wafer 10 after washing | cleaning will be performed.
That is, by applying high-frequency power having a voltage of 75 V and a frequency of 2.5 MHz to the electrode plates 812 and 813 of the ultrasonic transducers 81a and 81b by the power supply unit 82 constituting the ultrasonic vibration applying unit 8, for example. As described above, the table main body 711 of the holding table 71 is ultrasonically vibrated in the radial direction and the axial direction. As a result, since the cleaned semiconductor wafer 10 held on the holding table 71 is ultrasonically vibrated, the cleaning liquid adhering to the semiconductor wafer 10 is scattered as fine particles, so that the semiconductor wafer 10 is dried in a short time. can do. At this time, after the cleaning in which the nozzle portion 761b of the air nozzle 761 is held by the spinner table 711 by operating the electric motor 762 of the air supply mechanism 76 while rotating the holding table 71 at a rotational speed of, for example, 3000 rpm for about 15 seconds. For example, 200 milliliters / second of air is supplied to the surface of the semiconductor wafer 10 from an injection port 761a of the nozzle portion 761b that constitutes the air nozzle 761 by operating an air supply means (not shown). However, it is desirable that the nozzle portion 761b of the air nozzle 761 is swung within a required angle range. As a result, the cleaned semiconductor wafer 10 held on the holding table 71 can be reliably dried in a short time.

  As described above, when the above-described drying process is performed on the cleaned semiconductor wafer 10, the rotation of the holding table 71 is stopped and the air nozzle 761 of the air supply mechanism 76 is positioned at the standby position. Then, the holding table 71 is positioned at the workpiece loading / unloading position shown in FIG. 4, and the suction holding of the semiconductor wafer 10 held by the holding table 71 is released. Next, the processed semiconductor wafer 10 whose suction holding is released on the holding table 71 is transferred to the temporary table 12 by the first wafer transfer means 14. The processed semiconductor wafer 10 conveyed to the temporary placement table 12 is stored in a predetermined position of the cassette 11 by the wafer carry-in / carry-in means 13.

1: Cutting machine 2: Device housing 3: Chuck table 4: Spindle unit 42: Rotary spindle 43: Cutting blade 5: Imaging means 6: Display means 7: Cleaning / drying device 70: Holding table mechanism 71: Holding table 72: Electric Motor 74: Water receiving means 75: Cleaning liquid supply mechanism 751: Cleaning liquid injection nozzle 76: Air supply mechanism 761: Air nozzle 8: Ultrasonic vibration applying means 81a, 81b: Ultrasonic vibrator 82: AC power supply means 10: Semiconductor wafer 11: Cassette 12: Temporary placement table 13: Wafer unloading / carrying means 14: First wafer conveying means 15: Second wafer conveying means
F: Ring frame
T: Dicing tape

Claims (5)

A drying device for removing and drying the liquid adhering to the plate after cutting ,
A holding table having a holding surface for holding a plate-like object after cutting ;
An ultrasonic vibration applying means for applying ultrasonic vibration to the holding table;
The ultrasonic vibration applying means is operated to apply ultrasonic vibration having a frequency at which the cutting waste that has entered the cutting groove of the plate-like object after the cutting becomes fine particles and floats on the holding table. By applying ultrasonic vibration to the held plate-like object after being held, the liquid adhering to the plate-like object after the cutting is dispersed as fine particles,
A drying apparatus characterized by that.   The drying apparatus according to claim 1, wherein the ultrasonic vibration applying means applies ultrasonic vibration having a frequency of 2.5 MHz or more to the holding table.   The drying apparatus according to claim 1, further comprising a rotation driving unit that rotates the holding table.   The drying apparatus according to claim 1, further comprising an air supply mechanism for supplying air to the plate-like object held on the holding table.   The drying apparatus according to any one of claims 1 to 4, further comprising a cleaning liquid supply mechanism for supplying a cleaning liquid to the plate-like object held by the holding table.

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