JP2023026854A - Liquid resin coating device - Google Patents

Abstract

To provide a liquid resin coating device in which mist-like liquid resin does not roll up from an opening of a housing even when a lid body is opened in a case in which a wafer coated with a protective film is carried out from a spinner table.SOLUTION: A laser processing device includes a rotatable spinner table 32 holding a wafer W, a liquid resin supply nozzle 44 for supplying a liquid resin to an upper surface Wa of the wafer held on the spinner table, a motor 35 that rotates the spinner table, a housing 41 surrounding the spinner table and having exhaust means 42 at a lower part, and control means. After the liquid resin is supplied to the upper surface of the wafer held by the spinner table, the control means spreads the liquid resin over the upper surface of the wafer by rotating the spinner table driven by the motor, and intermittently stops the rotation of the spinner table and controls the exhaust means to exhaust liquid resin mist floating inside the housing.SELECTED DRAWING: Figure 3

Description

The present invention relates to a liquid resin coating apparatus for coating the upper surface of a wafer with a liquid resin.

A wafer having a plurality of devices such as ICs, LSIs, etc. formed on a surface partitioned by dividing lines is divided into individual device chips by a laser processing apparatus and used in electrical equipment such as mobile phones and personal computers.

The laser processing device includes a liquid resin coating device that coats the surface of the wafer with a liquid resin protective film, a chuck table that holds the wafer coated with the protective film, and a laser beam that irradiates the wafer held on the chuck table. a laser beam irradiating means for processing and feeding the chuck table and the laser beam irradiating means relative to each other; and a cleaning means for cleaning the laser-processed wafer and removing the protective film from the surface of the wafer. At least, it is possible to process the wafer with high precision without depositing debris on the surface of the wafer (see Patent Document 1, for example).

Japanese Patent Application Laid-Open No. 2004-322168

In the liquid resin coating apparatus installed in the above laser processing apparatus, after the top surface of the wafer held by the spinner table is coated with the liquid resin protective film, the cover closes the opening of the housing surrounding the spinner table. When the is opened, there is a problem that the mist-like liquid resin remaining inside the housing rolls up and is discharged to the outside from the opening of the housing. , there is a problem that the inside of the laser processing apparatus in which the liquid resin coating apparatus is arranged and the surroundings such as a clean room are polluted. Such a problem is not limited to the case where the liquid resin coating device is installed in the laser processing device, but when it is installed in another processing device, or the device has only the function of coating the liquid resin on the wafer alone. It can also occur in the liquid resin coating equipment.

The present invention has been made in view of the above-mentioned facts, and its main technical problem is that when a wafer coated with a protective film is unloaded from the spinner table, even if the lid is opened, the wafer can be removed from the opening of the housing. To provide a liquid resin coating device which prevents mist-like liquid resin from being rolled up.

In order to solve the above main technical problems, according to the present invention, there is provided a liquid resin coating apparatus for coating the upper surface of a wafer with a liquid resin, comprising: a spinner table capable of holding and rotating the wafer; A liquid resin supply nozzle that supplies liquid resin to the upper surface of the wafer, a motor that rotates the spinner table, and a housing that has an opening at the top for allowing the wafer to be taken in and out, surrounds the spinner table, and has exhaust means at the bottom. and a control means, wherein the control means is driven by the motor after the liquid resin is supplied to the upper surface of the wafer held on the spinner table. The rotation of the spinner table spreads the liquid resin on the upper surface of the wafer, and the rotation of the spinner table is intermittently stopped so that the mist of the liquid resin floating inside the housing is exhausted by the exhaust means. A controlled liquid resin coating apparatus is provided.

A liquid resin coating apparatus according to the present invention is a liquid resin coating apparatus for coating the upper surface of a wafer with a liquid resin, comprising a spinner table capable of holding and rotating the wafer, and a liquid resin coating the upper surface of the wafer held by the spinner table. a liquid resin supply nozzle for supplying a liquid resin, a motor for rotating the spinner table, a housing having an opening at the top for allowing the wafer to be taken in and out, surrounding the spinner table and having exhaust means at the bottom, and an opening in the housing. and a control means, wherein the control means rotates the spinner table driven by the motor after the liquid resin is supplied to the upper surface of the wafer held by the spinner table. Since the liquid resin is spread over the upper surface of the wafer, the rotation of the spinner table is intermittently stopped, and the mist of the liquid resin floating inside the housing is exhausted by the exhaust means. A liquid resin is supplied to the upper surface to form a protective film. When the wafer is unloaded from the spinner table, when the lid that closes the housing is opened, a mist of the liquid resin rolls from the opening of the housing. The problem of contamination of the rising and surrounding areas is eliminated.

1 is an overall perspective view of a laser processing apparatus provided with a liquid resin coating apparatus of the present embodiment; FIG. 2 is an enlarged perspective view showing a liquid resin coating device provided in the laser processing apparatus shown in FIG. 1; FIG. (a) A side view showing a cross section of a part of the main part of the liquid resin coating apparatus shown in FIG. It is a side view which shows the aspect which carries out.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of a liquid resin coating apparatus configured based on the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows an overall perspective view of a laser processing device 2 equipped with a liquid resin coating device 30 of this embodiment. The laser processing device 2 is a device that performs laser processing on a wafer W prepared as a plate-shaped object to be processed.

On the front side of the laser processing apparatus 2, an operating means 4 is provided for an operator to input instructions such as processing conditions. A display means 6 for displaying a guidance screen for the operator, processing conditions by the laser processing device 2, and the like is provided on the upper portion of the laser processing device 2. FIG.

The laser processing apparatus 2 is provided with a wafer cassette 8 capable of accommodating a plurality of wafers W integrated with an annular frame F via an adhesive tape T as shown on the left side of FIG. The wafer cassette 8 is placed on a cassette lifting means 9 that can move up and down.

On the rear side of the wafer cassette 8, a loading/unloading means 10 for unloading the wafer W before laser processing from the wafer cassette 8 and loading the processed wafer W into the wafer cassette 8 is arranged. Between the wafer cassette 8 and the loading/unloading means 10, the wafers W to be loaded/unloaded are temporarily placed, and a provisional device having an alignment function of aligning the wafers W held by the frame F at a predetermined position is provided. Placement means 12 are arranged

In the vicinity of the temporary placement means 12, a transport means 16 having a swivel arm for attracting and transporting the frame F holding the wafer W is arranged. The wafer W carried out from the wafer cassette 8 onto the temporary placement means 12 by the carrying in/out means 10 is sucked by the carrying means 16 and carried to the liquid resin coating device 30 .

The liquid resin coating apparatus 30 of the present embodiment has a function of supplying a liquid resin to the upper surface of the wafer W and coating it as a protective film, and removes debris adhered from the upper surface of the wafer W after laser processing together with the liquid resin by laser processing. It also functions as a cleaning means for removing such as. The liquid resin supplied by the liquid resin coating device 30 is not particularly limited, but is, for example, a water-soluble liquid resin. . The liquid resin coating device 30 will be described later in detail.

A chuck table 18 that functions as a holding means for holding the wafer W is disposed in the laser processing apparatus 2 . The wafer W whose upper surface is coated with the liquid resin protective film by the liquid resin coating device 30 is sucked by the transport means 17 and transported to the loading/unloading position where the chuck table 18 is positioned in FIG. The conveying means 17 includes a suction means 17b having a suction pad 17a on the lower surface for sucking the frame F supporting the wafer W, and a lid closing an opening 36a of the housing 41 of the cover part 40 of the liquid resin coating device 30. and a body 17c. The conveying means 17 can advance and retreat the adsorption means 17b and the lid body 17c in the Z-axis direction (vertical direction) in FIG. 1 by the action of an air cylinder (not shown).

The wafer W conveyed to the chuck table 18 is sucked to the chuck table 18 via the adhesive tape T, and the frame F is fixed by a plurality of clamps 19 . The chuck table 18 includes processing feed means (not shown) that relatively feeds the laser beam irradiation means 24 and the chuck table 18, which will be described later. The processing feed means is configured to rotate the chuck table 18 and move it in the X-axis direction indicated by the arrow X in the figure and the Y-axis direction indicated by the arrow Y orthogonal to the X-axis direction. A camera 22 of alignment means 20 for detecting a position of the wafer W to be laser-processed (for example, a dividing line on the wafer W) is arranged above the moving path of the chuck table 18 in the X-axis direction. there is

A laser beam irradiation means 24 is provided at a position adjacent to the camera 22 in the X-axis direction. The laser beam irradiation means 24 includes a casing 26 housing an optical system (not shown) for oscillating a laser beam having a wavelength that is absorptive to the wafer W, and a condenser 28 for condensing and irradiating the laser beam. , and the upper surface of the wafer W can be ablated by the laser beam emitted from the condenser 28 .

The wafer W, which has been ablated by the laser beam irradiation means 24, is moved together with the chuck table 18 to the loading/unloading position on the front side in the figure, is sucked by the transport means 17, and is subjected to the protective film removal and cleaning described above. It is transported to the liquid resin coating device 30 for the purpose.

The wafer W, which has been cleaned by the liquid resin coating device 30 and the protective film has been removed from the upper surface, is conveyed to the temporary placement means 12 by the frame F supporting the wafer W being adsorbed by the conveyance means 16, and then carried out by the loading/unloading means 10 described above. The wafer cassette 8 is returned to its original storage location.

Each operating part of the laser processing apparatus 2, such as the display means 6, loading/unloading means 10, conveying means 16 and 17, alignment means 20, laser beam irradiation means 24, liquid resin coating device 30, etc., is controlled by control means 100 constituted by a computer. connected and controlled accordingly. In FIG. 1, the control means 100 is shown outside the laser processing apparatus 2 for convenience of explanation, but it is housed inside the laser processing apparatus 2 actually.

The liquid resin coating apparatus 30 described above will be described in more detail with reference to FIG. 2 in addition to FIG.

As shown in FIG. 2 , the liquid resin coating device 30 includes a table mechanism 31 and a cover portion 40 surrounding the table mechanism 31 . 2 is a perspective view of the liquid resin coating device 30, and for convenience of explanation, a part of the front side of the housing 41 constituting the cover portion 40 is cut away. As understood from FIG. 2, the table mechanism 31 has a spinner table 32 that holds the wafer W together with the frame F. As shown in FIG. The spinner table 32 is composed of a suction chuck 321 formed of a porous member having air permeability, and a frame portion 322 surrounding the suction chuck 321. The suction chuck 321 is connected to a suction means (not shown) to perform suction. A suction negative pressure is generated on the upper surface of the chuck 321 . Further, the table mechanism 31 has a shaft portion 34 and is connected to a motor 35 via a rotating shaft (not shown) accommodated inside the shaft portion 34 . The rotating shaft is driven by the motor 35 to rotate the spinner table 32 . A plurality of air pistons 36 are arranged on the outer periphery of the motor 35, and the spinner table 32, the shaft portion 34, and the motor 35 are moved by moving the rod 36a back and forth in the vertical direction indicated by the arrow R1 in the figure by the air pistons 36. Raise and lower together. The shaft portion 34 and the motor 35 described above function as a base for supporting the spinner table 32 .

The housing 41 provided in the cover part 40 has an opening 41a at the top for allowing the wafer W to be taken in and out. An exhaust means 42 for exhausting the liquid resin is provided. The exhaust means 42 includes an exhaust port 421 , an exhaust hose 422 and a suction source 423 . Further, the exhaust means 42 of the present embodiment has a function of exhausting mist-like liquid resin when the liquid resin is coated on the wafer W, and in addition, when the liquid resin coating device 30 functions as a cleaning means, the wafer W is It also has a function to drain the cleaning liquid supplied to the

Inside the housing 41, there are provided a liquid resin supply nozzle 44 having a tip portion 44a for supplying liquid resin to the upper surface of the wafer W held on the spinner table 32, and a tip for injecting air to the upper surface of the wafer W. An air injection nozzle 45 having a portion 45a and a cleaning liquid supply nozzle 46 having a tip portion 46a for injecting a cleaning liquid (water in this embodiment) onto the upper surface of the wafer W are provided. The liquid resin supply nozzle 44, the air injection nozzle 45, and the cleaning liquid supply nozzle 46 described above operate driving means (not shown in FIG. 2) provided on the back side of the bottom surface 41b of the housing 41. As a result, the tips 44a, 45a and 46a of the respective nozzles can be swung above the spinner table 32 in the horizontal directions indicated by arrows R2, R3 and R4. As shown in FIG. 2, when the spinner table 32 is positioned at the position (up position) for loading and unloading the wafer W, the liquid resin supply nozzle 44, the air injection nozzle 45, and the cleaning liquid supply nozzle 46 is positioned at the storage position in the outer peripheral direction.

The liquid resin coating apparatus 30 described above is only one embodiment of the present invention, and the liquid resin coating apparatus 30 configured based on the present invention holds and can rotate at least a wafer W as shown in FIG. a spinner table 32, a liquid resin supply nozzle 44 for supplying liquid resin to the upper surface of the wafer W held on the spinner table 32, a motor 35 for rotating the spinner table 32, and an opening 41a for allowing the wafer W to be taken in and out. is provided in the upper part and surrounds the spinner table 32, and the housing 41 provided with the exhaust means 42 in the lower part is provided. It includes a control means 100 for controlling the supply nozzle 44 and the evacuation means 42, provided that the motor 35, the liquid resin supply nozzle 44 and the evacuation means 42 are controlled as will be explained below. In this embodiment, the cover 17c for closing the opening 41a of the housing 41 of the liquid resin coating apparatus 30 is provided on the conveying means 17. It may be installed independently.

The laser processing apparatus 2 equipped with the liquid resin coating apparatus 30 of the present embodiment has generally the configuration described above, and the effects thereof will be described below.

When performing laser processing in the laser processing apparatus 2 described above, the wafer W is carried out from the wafer cassette 8 to the temporary placement means 12 by operating the loading/unloading means 10 described with reference to FIG. Next, the conveying means 16 is operated to suck the frame F and convey the wafer W to the liquid resin coating apparatus 30 . The wafer W conveyed to the liquid resin coating device 30 is placed on the spinner table 32 as shown in FIG. After the wafer W is sucked and held on the spinner table 32, a predetermined process described below is started according to a predetermined control program stored in the control means 100. FIG. More specifically, the air piston 36 is operated to lower the wafer W together with the spinner table 32 as indicated by an arrow R5 in FIG. 3(b). At the same time, the lid 17c attached to the conveying means 17 described with reference to FIG. 1 is lowered in the direction indicated by the arrow R6 in FIG. For convenience of explanation, the suction pad 17a and the suction means 17b are omitted in FIG. 3(b). Next, the spinner table 32 is gently rotated by the motor 35, and the driving means 44b of the liquid resin supply nozzle 44 is operated to move the tip 44a of the liquid resin supply nozzle 44 directly above the center of the wafer W, thereby supplying the liquid resin P with a predetermined amount. When the liquid resin P is supplied, the exhaust means 42 is operated. Incidentally, when the liquid resin P is supplied to the upper surface Wa of the wafer W, the spinner table 32 may be stopped and then rotated.

As described above, after the liquid resin P is supplied to the upper surface Wa of the wafer W, the motor 35 is operated at high speed to spread the liquid resin P over the entire surface of the wafer and to dry the spinner table 32 as indicated by an arrow R7. direction at a predetermined rotational speed (eg, 3000 rpm). The rotation of the spinner table 32 is intermittently stopped, and while the spinner table 32 is stopped, the mist-like liquid resin P floating inside the housing 41 is discharged through the discharge means 42. 421 and exhausted to the suction source 423 side through the discharge hose 422 . On the side of the suction source 423, an appropriate labyrinth-like gas-liquid separation mechanism (not shown) is provided to collect the liquid resin P in mist form. The intermittent operation of the spinner table 32 by the motor 35 is, for example, repeating rotation for 30 seconds and then stopping for 5 seconds. actuated to a complete stop. By carrying out such a liquid resin coating process, the liquid resin P supplied to the upper surface Wa of the wafer W is uniformly spread over the entire upper surface Wa of the wafer W and dried to form a protective film.

As described above, when the spinner table 32 is intermittently stopped and the mist-like liquid resin P floating inside the housing 41 is exhausted by the exhaust means 42, the housing 41 is maintained while the spinner table 32 is stopped. The mist-like liquid resin P floating in the body 41 settles, the mist-like liquid resin P is efficiently sucked from the discharge port 421 of the exhaust means 42, and passes through the discharge hose 422 to the suction source 423 side. exhausted to After a predetermined period of time has elapsed since the end of the liquid resin coating process performed in this way, a protective film is formed on the upper surface Wa of the wafer W by solidifying the liquid resin P. As shown in FIG. The length and ratio of the rotation time and stop time in the intermittent operation of the spinner table 32 and the total rotation time depend on the properties of the material selected as the liquid resin P, the size of the wafer, and the like. to be changed accordingly. In addition, "intermittently stopped" in the present invention is not limited to being stopped multiple times, and includes a case of being stopped only once.

After the protective film is formed on the upper surface Wa of the wafer W by performing the resin film coating process, the wafer W is sucked and transported to the chuck table 18 by the transport means 17 described with reference to FIG. do. The wafer W conveyed to the chuck table 18 is placed on the chuck table 18 and held by suction, and the frame F is fixed by the clamps 19 . Next, the above-described feeding means is operated to move the wafer W directly below the camera 22 of the alignment means 20, the camera 22 picks up an image of the wafer W, and a predetermined laser processing area is detected. Next, the feeding means is operated to move the wafer W directly below the condenser 28 of the laser beam irradiation means 24, position the condensing point at a predetermined laser processing area on the upper surface Wa of the wafer W, and move the wafer W. A laser beam is irradiated while being moved in the X-axis direction in the figure. The laser beam irradiated at this time has a wavelength that is absorptive to the wafer W and the protective film, and is set to an output that enables the wafer W to be ablated.

By irradiating the above-described laser beam, the laser-processed regions to be divided on the wafer W are ablated together with the protective film to form processed grooves. By appropriately operating the laser beam irradiation means 24 and the processing feed means, the wafer W is processed and fed in the X-axis direction and the Y-axis direction, and the above-described ablation processing is performed. A processing groove is formed along the laser processing region. Next, the chuck table 18 is rotated by 90 degrees to align the laser processing region along the direction orthogonal to the direction in which the processing grooves were previously formed in the X-axis direction. A processing groove is formed by performing ablation processing along all the laser processing regions along. In this embodiment, as described above, since the protective film is formed on the upper surface Wa of the wafer W with the liquid resin P, debris scattered during the ablation process may adhere to the devices separated from the wafer W. prevented. As described above, the processed grooves are formed along the entire laser-processed region of the upper surface Wa of the wafer W, and the laser processing process is completed.

After the above-described laser processing step is completed, the protective film removing step of removing the protective film of the wafer W is performed using the liquid resin coating apparatus 30 as cleaning means.

After the above laser processing step is performed, the chuck table 18 holding the wafer W is positioned at the loading/unloading position shown in FIG. With the upper surface Wa side of the coated wafer W facing upward, the wafer W is placed on the spinner table 32 positioned at the elevated position in the housing 41 and held by suction. Next, after the spinner table 32 is lowered, the motor 35 explained with reference to FIGS. The spinner table 32 is rotated at a predetermined rotational speed (eg, 3000 rpm), and the cleaning liquid supply nozzle 46 is oscillated to spray the cleaning liquid (eg, water) onto the upper surface Wa of the wafer W from the tip portion 46a for a predetermined period of time. . As a result, the protective film covering the wafer W is melted and flung to the outer peripheral side, and discharged into the housing 41 together with contaminants such as debris discharged by the ablation process. The melted and discharged protective film flows along the bottom surface 41b of the housing 41 together with the washing water, is discharged through the discharge port 421 and the discharge hose 422 that constitute the exhaust means 42, and is stored in a predetermined disposal tank. be.

Next, the cleaning liquid supply nozzle 46 is retracted to the storage position in the outer peripheral direction in the housing 41, the air injection nozzle 45 is operated, and the tip portion 45a of the air injection nozzle 45 is moved above the wafer W. Then, air is jetted toward the upper surface Wa of the wafer W to sway it in the horizontal direction (not shown), and the spinner table 32 is rotated at high speed (for example, 3000 rpm) to dry the upper surface Wa of the wafer W ( drying process). Also at this time, the cleaning liquid remaining in the housing 41 and the cleaning liquid misted are discharged by operating the exhaust means 42 . It is also possible to intermittently stop the spinner table 32 during the protective film removing process and the drying process.

After the wafer W has been dried as described above, the spinner table 32 is lifted and the lid 17c is lifted to open the opening 41a of the housing 41, and the conveying means 16 is operated to operate the spinner. The wafer W is unloaded from the table 32 and transported to the temporary placement means 12 . Next, using the loading/unloading means 10, the wafer cassette 8 is accommodated at a predetermined position. As described above, the laser processing performed by the laser processing device 2 is completed.

As described above, according to the liquid resin coating apparatus 30 of the present embodiment, after the liquid resin P is supplied to the upper surface Wa of the wafer W held on the spinner table 32, the liquid resin P is spread over the entire surface of the wafer W. At the same time, the motor 35 is operated to rotate the spinner table 32, and the rotation of the spinner table 32 is intermittently stopped, and the mist of the liquid resin P floating inside the housing 41 is exhausted by the exhaust means 42. Therefore, when the liquid resin P is supplied to the upper surface Wa of the wafer W to form a protective film, and the wafer W is unloaded from the spinner table 32, the lid 17c closing the housing 41 is opened. Even so, the mist-like liquid resin P is prevented from being rolled up from the opening 41a of the housing 41 and contaminating the surroundings.

In the above-described embodiment, an example in which the liquid resin coating device 30 of the present invention is arranged in the laser processing device 2 is shown, but the present invention is not limited to this, and may be arranged in other processing devices, Alternatively, it is also possible to implement it as a liquid resin coating device 30 independent from the processing device.

2: Laser processing device 4: Operation means 6: Display means 8: Wafer cassette 9: Cassette lifting means 10: Loading/unloading means 12: Temporary placing means 16: Transfer means 17: Transfer means 17a: Suction pad 17b: Suction means 17c: Lid 18: Chuck table 19: Clamp 20: Alignment means 22: Camera 24: Laser beam irradiation means 26: Casing 28: Concentrator 30: Liquid resin coating device 31: Table mechanism 32: Spinner table 321: Adsorption chuck 322: Frame 34: Shaft 35: Motor 36: Air piston 36a: Rod 40: Cover 41: Housing 41a: Opening 41b: Bottom 42: Exhaust means 421: Exhaust port 422: Exhaust hose 423: Suction source 44: Liquid Resin supply nozzle 44a: tip 45: air injection nozzle 45a: tip 46: cleaning liquid supply nozzle 46a: tip P: liquid resin W: wafer Wa: upper surface

Claims (1)

A liquid resin coating apparatus for coating the upper surface of a wafer with a liquid resin,
A spinner table that holds and rotates a wafer, a liquid resin supply nozzle that supplies liquid resin to the upper surface of the wafer held by the spinner table, a motor that rotates the spinner table, and an opening that allows the wafer to be taken in and out. A housing provided in the upper part surrounding the spinner table and equipped with an exhaust means in the lower part, a lid closing the opening of the housing, and a control means,
After the liquid resin is supplied to the upper surface of the wafer held by the spinner table, the control means spreads the liquid resin on the upper surface of the wafer by rotating the spinner table driven by the motor, and intermittently A liquid resin coating apparatus for controlling the rotation of the spinner table to be stopped and the liquid resin mist floating inside the housing to be exhausted by the exhaust means.

Images