JP2023091141A - Method and device for processing wafer - Google Patents

Method and device for processing wafer Download PDF

Info

Publication number
JP2023091141A
JP2023091141A JP2021205706A JP2021205706A JP2023091141A JP 2023091141 A JP2023091141 A JP 2023091141A JP 2021205706 A JP2021205706 A JP 2021205706A JP 2021205706 A JP2021205706 A JP 2021205706A JP 2023091141 A JP2023091141 A JP 2023091141A
Authority
JP
Japan
Prior art keywords
wafer
processing
belt
dividing
conveyor belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021205706A
Other languages
Japanese (ja)
Inventor
篤史 井上
Atsushi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2021205706A priority Critical patent/JP2023091141A/en
Priority to KR1020220172211A priority patent/KR20230094146A/en
Priority to CN202211598035.0A priority patent/CN116313767A/en
Priority to TW111148258A priority patent/TW202325457A/en
Publication of JP2023091141A publication Critical patent/JP2023091141A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

To provide a method and a device for processing a wafer that can provide an inexpensive device and can increase the productivity.SOLUTION: A method for processing a wafer includes: a mounting step of mounting a wafer on a transfer belt having an adhesive layer on a top surface and pressing the wafer; a detecting step of imaging the wafer mounted on the transfer belt and detecting a region to be processed; and a processing step of dividing the wafer where the region to be processed is detected into individual device chips on the transfer belt. A device 1 for processing a wafer includes: belt conveyor means 70 comprising a conveyance belt 78 having an adhesive layer 78a on a top surface; mounting means 20 for mounting a wafer 10 on the conveyance belt 78 and pressing the wafer; detecting means 30 for imaging the wafer 10 pressed on the conveyance belt 78 and detecting a region to be processed; and processing means 40 for dividing the wafer 10 into individual device chips 12' on the conveyance belt 78.SELECTED DRAWING: Figure 2

Description

本発明は、複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工方法及びウエーハの加工装置に関する。 The present invention relates to a wafer processing method and a wafer processing apparatus for dividing a wafer, on which a plurality of devices are divided by dividing lines and formed on the surface, into individual device chips.

ＩＣ、ＬＳＩ等の複数のデバイスが、分割予定ラインによって区画されて表面に形成されたウエーハは、研削装置によって裏面が研削されて薄化された後、ダイシング装置、レーザー加工装置等によって個々のデバイスチップに分割され、携帯電話、パソコン等の電気機器に利用される。 A wafer having a plurality of devices such as ICs, LSIs, etc. separated by division lines and formed on the surface thereof is thinned by grinding the back surface thereof with a grinding device, and then separated into individual devices by a dicing device, a laser processing device, or the like. It is divided into chips and used in electrical equipment such as mobile phones and personal computers.

研削装置は、ウエーハを保持する吸着チャックと、該吸着チャックに保持されたウエーハを研削する研削砥石を備えた研削手段と、を含み構成される。そして、研削装置によってウエーハが研削される際には、ウエーハの表面に吸着チャックによって傷が付かないように、保護テープが配設される。 A grinding apparatus includes a suction chuck that holds a wafer, and grinding means that includes a grinding wheel that grinds the wafer held by the suction chuck. Then, when the wafer is ground by the grinding device, a protective tape is provided so that the surface of the wafer is not scratched by the suction chuck.

また、研削が終了したウエーハは、ウエーハを収容する開口部を中央に備えたフレームの該開口部に位置付けられ、ダイシングテープによってフレームと一体に配設された後、カセットに収容されて、ダイシング装置（例えば特許文献１を参照）、レーザー加工装置（例えば特許文献２を参照）、さらには、洗浄装置、ピックアップ装置等に搬送されて、加工が施される。 Further, the wafer that has been ground is positioned in the opening of a frame having an opening for housing the wafer in the center, and after being integrally arranged with the frame by a dicing tape, it is housed in a cassette and processed by a dicing device. (see, for example, Patent Document 1), a laser processing device (see, for example, Patent Document 2), a cleaning device, a pick-up device, or the like, and processed.

特開平０７－４５５５６号公報JP-A-07-45556 特開２００４－３２２１６８号公報Japanese Patent Application Laid-Open No. 2004-322168

ところで、上記した特許文献１、２に記載された従来の加工装置においては、ウエーハを各装置に搬送するために、ウエーハを保持するフレーム及び該フレーム毎にウエーハを収容するカセットが必要なことに加え、カセット単位で搬送されて加工が施されることから、ダイシング装置、レーザー加工装置等には、カセットからフレームを仮置きテーブルまで搬出入する搬出入手段、該仮置きテーブルから吸着チャックにウエーハを搬送する搬送手段、吸着チャックを加工位置まで移送する加工送り手段、加工後のウエーハを吸着チャックから洗浄装置まで搬送する搬送手段、該洗浄装置から該仮置きテーブルまで搬送する手段等が必要であり、また、それらの動作を制御する制御プログラムもそれぞれに対応して構成する必要があることから、生産性が悪いと共に、装置が高額になるという問題がある。 By the way, in the conventional processing apparatuses described in Patent Documents 1 and 2, a frame for holding the wafer and a cassette for accommodating the wafer are required for each frame in order to transport the wafer to each apparatus. In addition, since the processing is carried out in units of cassettes, the dicing device, the laser processing device, etc. are equipped with loading/unloading means for loading/unloading the frame from the cassette to the temporary placement table, and loading/unloading the wafer from the temporary placement table to the suction chuck. , processing feed means for transporting the suction chuck to the processing position, transport means for transporting the processed wafer from the suction chuck to the cleaning device, and means for transporting the wafer from the cleaning device to the temporary placement table. In addition, since it is necessary to configure control programs for controlling these operations in correspondence with each other, there is a problem that the productivity is low and the apparatus becomes expensive.

本発明は、上記事実に鑑みなされたものであり、その主たる技術課題は、生産性を向上させると共に、安価な装置を提供できるウエーハの加工方法及びウエーハの加工装置を提供することにある。 The present invention has been made in view of the above facts, and its main technical problem is to provide a wafer processing method and a wafer processing apparatus capable of improving productivity and providing an inexpensive apparatus.

上記主たる技術課題を解決するため、本発明によれば、複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工方法であって、上面に粘着層を有する搬送ベルトにウエーハを載置し圧着する載置工程と、該搬送ベルトに載置されたウエーハを撮像し加工すべき領域を検出する検出工程と、該加工すべき領域が検出された該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工工程と、を含み構成されるウエーハの加工方法が提供される。 In order to solve the main technical problems described above, according to the present invention, there is provided a wafer processing method for dividing a wafer having a plurality of devices formed on the surface thereof partitioned by dividing lines into individual device chips, comprising: A placing step of placing and pressing a wafer on a conveying belt having an adhesive layer, a detecting step of picking up an image of the wafer placed on the conveying belt and detecting an area to be processed, and detecting the area to be processed. and a processing step of dividing the wafer into individual device chips on the conveyor belt.

該加工工程の後、ウエーハを洗浄すると共に乾燥する洗浄乾燥工程と、該搬送ベルトのウエーハが載置された領域からデバイスチップをピックアップするピックアップ工程と、を含むことが好ましい。また、該載置工程の前、又は後に、ウエーハの表面に配設された保護テープを剥離する保護テープ除去工程を含むことが好ましい。 After the processing step, it is preferable to include a cleaning/drying step of cleaning and drying the wafer, and a pickup step of picking up the device chips from the area of the transfer belt where the wafer is placed. Moreover, it is preferable to include a protective tape removing step of peeling off the protective tape provided on the surface of the wafer before or after the mounting step.

該加工工程は、切削ブレードを備えた切削手段によってウエーハの分割予定ラインを切削する工程であってもよい。また、該加工工程は、レーザー光線を照射するレーザー光線照射手段によってウエーハの分割予定ラインにレーザー加工を施す工程であってもよい。 The processing step may be a step of cutting the dividing line of the wafer by a cutting means having a cutting blade. Further, the processing step may be a step of performing laser processing on the division line of the wafer by a laser beam irradiation means for irradiating a laser beam.

該搬送ベルトは、ロール状のダイシングテープの一端をローラに巻き付けて構成されるものであってもよい。 The transport belt may be configured by winding one end of a roll-shaped dicing tape around a roller.

上記主たる技術課題を解決するため、本発明によれば、複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工装置であって、上面に粘着層を有する搬送ベルトを備えるベルトコンベアー手段と、該搬送ベルトにウエーハを載置し圧着する載置手段と、該搬送ベルトに圧着されたウエーハを撮像し加工すべき領域を検出する検出手段と、該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工手段と、を含み構成されるウエーハの加工装置が提供される。 In order to solve the main technical problems described above, according to the present invention, there is provided a wafer processing apparatus for dividing a wafer having a plurality of devices formed on the surface thereof partitioned by dividing lines into individual device chips, comprising: A belt conveyor means having a conveyor belt having an adhesive layer, a mounting means for placing and pressing a wafer on the conveyor belt, and a detection means for picking up an image of the wafer pressed on the conveyor belt and detecting an area to be processed. and processing means for dividing the wafer into individual device chips on the conveyor belt.

該ウエーハの加工装置は、該加工手段によって加工されたウエーハを該搬送ベルト上で洗浄すると共に乾燥する洗浄乾燥手段と、該搬送ベルトのウエーハが載置された領域からデバイスチップをピックアップするピックアップ手段と、を含むものであってもよい。また、ウエーハの表面に配設された保護テープを剥離する保護テープ除去手段を含むものであってもよい。さらに、該加工手段は、切削ブレードを備えた切削手段であってもよく、レーザー光線を照射するレーザー光線照射手段であってもよい。該搬送ベルトは、ダイシングテープで構成されることが好ましい。 The wafer processing apparatus includes cleaning and drying means for cleaning and drying the wafer processed by the processing means on the transport belt, and pickup means for picking up device chips from the area of the transport belt where the wafer is placed. and may be included. Moreover, it may include protective tape removing means for removing the protective tape provided on the surface of the wafer. Furthermore, the processing means may be a cutting means having a cutting blade, or may be a laser beam irradiation means for irradiating a laser beam. The conveying belt is preferably composed of a dicing tape.

本発明のウエーハの加工方法は、複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工方法であって、上面に粘着層を有する搬送ベルトにウエーハを載置し圧着する載置工程と、該搬送ベルトに載置されたウエーハを撮像し加工すべき領域を検出する検出工程と、該加工すべき領域が検出された該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工工程と、を含み構成されることから、ウエーハを環状のフレームに保持する必要がなく、カセットが不要になることに加え、ウエーハを保持するフレームを搬出入する搬出入手段を使用する搬出入動作、搬送手段を使用する搬送動作等が不要となり、生産性が向上すると共に、該加工方法を実現するための装置が高額になるという問題が解消する。 A wafer processing method of the present invention is a method of dividing a wafer having a plurality of devices formed on the surface thereof partitioned by lines to be divided into individual device chips, wherein the conveyor belt has an adhesive layer on its upper surface. a mounting step of placing and pressing the wafer on the conveyor belt; a detecting step of imaging the wafer mounted on the conveyor belt to detect a region to be processed; and a processing step of dividing the wafers into individual device chips on the belt. This eliminates the need for loading/unloading operation using a loading/unloading means for loading, transporting operation using a transporting means, etc., thereby improving productivity and solving the problem of high cost of an apparatus for realizing the processing method.

また、本発明のウエーハの加工装置は、複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工装置であって、上面に粘着層を有する搬送ベルトを備えるベルトコンベアー手段と、該搬送ベルトにウエーハを載置し圧着する載置手段と、該搬送ベルトに圧着されたウエーハを撮像し加工すべき領域を検出する検出手段と、該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工手段と、を含み構成されることから、ウエーハを環状のフレームに保持する必要がなく、カセットが不要になることに加え、ウエーハを保持するフレームを搬出入する搬出入手段を使用する搬出入動作、搬送手段を使用する搬送動作等が不要となり、生産性が向上すると共に、装置が高額になるという問題が解消する。 Further, the wafer processing apparatus of the present invention is a wafer processing apparatus that divides a wafer having a plurality of devices formed on the surface thereof partitioned by dividing lines into individual device chips, and has an adhesive layer on the upper surface. belt conveyer means having a conveying belt; placing means for placing and pressing a wafer on the conveying belt; detecting means for imaging the wafer pressed against the conveying belt to detect an area to be processed; and processing means for dividing into individual device chips on the conveying belt. Therefore, there is no need to hold the wafers in an annular frame, eliminating the need for a cassette, and a frame holding the wafers. This eliminates the need for a carrying-in/carrying operation using a carrying-in/carrying-out means for carrying in and out a carrying-in/carrying-out means, a carrying operation using a carrying means, and the like, thereby improving productivity and solving the problem that the apparatus becomes expensive.

本実施形態で加工されるウエーハの斜視図である。1 is a perspective view of a wafer processed in this embodiment; FIG. （ａ）本実施形態のウエーハの加工装置の全体斜視図、（ｂ）（ａ）に示す実施形態の加工装置において、ベルトコンベアー手段を別の実施形態で実施した例を示す斜視図である。(a) An overall perspective view of the wafer processing apparatus of the present embodiment, (b) A perspective view showing an example in which belt conveyor means is implemented in another embodiment in the processing apparatus of the embodiment shown in (a). 図２に示す載置手段による載置工程の実施態様を示す斜視図、（ｂ）（ａ）に示す載置手段においてウエーハを圧着する態様を示す斜視図である。FIG. 3B is a perspective view showing an embodiment of a mounting step by the mounting means shown in FIG. 2, and a perspective view showing a state in which the wafer is crimped by the mounting means shown in (b) and (a). 図２に示す検出手段による検出工程を実施する態様を示す斜視図である。FIG. 3 is a perspective view showing a mode in which a detection step is performed by the detection means shown in FIG. 2; 図２に示す加工手段による加工工程の実施態様を示す斜視図である。FIG. 3 is a perspective view showing an embodiment of a processing step by the processing means shown in FIG. 2; 図５に示す加工手段の別の実施形態を示す斜視図である。FIG. 6 is a perspective view showing another embodiment of the processing means shown in FIG. 5; 図２に示す洗浄乾燥手段を示す斜視図である。FIG. 3 is a perspective view showing the washing/drying means shown in FIG. 2; （ａ）図２に示すピックアップ手段を示す斜視図、（ｂ）（ａ）に示すピックアップ手段により実施されるピックアップ工程の実施態様を示す一部拡大断面図である。3(a) is a perspective view showing the pick-up means shown in FIG. 2, and (b) is a partially enlarged cross-sectional view showing an embodiment of a pick-up process performed by the pick-up means shown in (a). 保護テープ除去手段による保護テープ除去工程の実施態様を示す斜視図、及びその一部を拡大して示す側方図である。It is the perspective view which shows the embodiment of the protective tape removal process by a protective tape removal means, and the side view which expands and shows a part.

以下、本発明に基づいて構成されるウエーハの加工方法、及び該ウエーハの加工方法に好適なウエーハの加工装置に係る実施形態について、添付図面を参照しながら、詳細に説明する。 DETAILED DESCRIPTION OF THE INVENTION Embodiments of a wafer processing method and a wafer processing apparatus suitable for the wafer processing method according to the present invention will now be described in detail with reference to the accompanying drawings.

図１には、本実施形態のウエーハの加工方法によって加工されるウエーハ１０の斜視図が示されている。ウエーハ１０は、複数のデバイス１２が分割予定ラインによって区画されて表面１０ａに形成された、例えばシリコン（Ｓｉ）のウエーハである。以下に説明するウエーハの加工方法では、ウエーハ１０の裏面１０ｂが、予め図示を省略する研削装置によって所望の厚みまで研削され薄化された状態であることを前提として説明する。 FIG. 1 shows a perspective view of a wafer 10 processed by the wafer processing method of the present embodiment. The wafer 10 is, for example, a silicon (Si) wafer in which a plurality of devices 12 are partitioned by dividing lines and formed on a surface 10a. The wafer processing method described below is based on the premise that the back surface 10b of the wafer 10 has been previously ground to a desired thickness by a grinding device (not shown) and thinned.

図２（ａ）には、本実施形態のウエーハの加工装置１が示されている。該加工装置１は、上記したウエーハ１０を個々のデバイスチップに分割するウエーハの加工方法を実施する加工装置であり、上面７８ａに粘着層を有する搬送ベルト７８を備えるベルトコンベアー手段７０と、搬送ベルト７８にウエーハ１０を載置して圧着する載置手段２０と、搬送ベルト７８に圧着されたウエーハ１０を撮像し加工すべき領域を検出する検出手段３０と、ウエーハを搬送ベルト７８上で個々のデバイスチップに分割する加工手段４０と、を少なくとも含み構成される。なお、図２（ａ）に示す本実施形態の加工装置１は、上記の構成に加えて、加工手段４０によって加工されたウエーハ１０を搬送ベルト７８上で洗浄すると共に乾燥する洗浄乾燥手段５０、及び搬送ベルト７８のウエーハ１０が載置された領域からデバイスチップをピックアップするピックアップ手段６０も含んでいる。この加工装置１と、該加工装置１によって実施されるウエーハの加工方法について、より具体的に説明する。 FIG. 2A shows the wafer processing apparatus 1 of this embodiment. The processing apparatus 1 is a processing apparatus for carrying out the wafer processing method for dividing the wafer 10 into individual device chips as described above. A mounting means 20 for placing and pressing the wafer 10 on the conveyor belt 78, a detecting means 30 for picking up an image of the wafer 10 pressed on the conveying belt 78 and detecting an area to be processed, and the wafer on the conveying belt 78 individually. and a processing means 40 for dividing into device chips. In addition to the above configuration, the processing apparatus 1 of the present embodiment shown in FIG. 2(a) has a cleaning/drying means 50 for cleaning and drying the wafer 10 processed by the processing means 40 on the conveyor belt 78, It also includes pick-up means 60 for picking up device chips from the area of the transport belt 78 where the wafer 10 is placed. The processing apparatus 1 and the wafer processing method performed by the processing apparatus 1 will be described in more detail.

図２（ａ）に示す加工装置１は、上記した載置手段２０、検出手段３０、加工手段４０、洗浄乾燥手段５０、及びピックアップ手段６０を、図中のＸ軸方向に直列に配設している。 The processing apparatus 1 shown in FIG. 2(a) has the placing means 20, the detecting means 30, the processing means 40, the washing/drying means 50, and the pick-up means 60 arranged in series in the X-axis direction in the drawing. ing.

図２（ａ）に示すベルトコンベアー手段７０は、従動ローラ７２を回転自在に支持する第１ローラ支持台７１と、駆動ローラ７４を回転自在に支持する第２ローラ支持台７３と、駆動ローラ７４を矢印Ｒ１で示す方向に回転駆動する駆動モータ７５とを備え、搬送ベルト７８が従動ローラ７２と駆動ローラ７４とに巻き掛けられている。駆動モータ７５は、図示を省略する制御手段に接続されて、搬送ベルト７８の移動、停止が精密に制御される。ベルトコンベアー手段７０によってＸ軸方向に送り出される搬送ベルト７８は、載置手段２０からピックアップ手段６０に至るまで順に移動可能であり、ウエーハ１０を上記した載置手段２０で搬送ベルト７８上に載置した後、検出手段３０、加工手段４０、洗浄乾燥手段５０、及びピックアップ手段６０に搬送する。搬送ベルト７８は、例えば、ダイシングテープとして使用される素材で形成され、例えばポリオレフィンを基材とし上面を形成する表面７８ａにアクリルの粘着層を有したものが採用される。 The belt conveyor means 70 shown in FIG. and a driving motor 75 that rotates in the direction indicated by an arrow R1. The drive motor 75 is connected to control means (not shown) to precisely control the movement and stopping of the conveyor belt 78 . A conveyor belt 78 sent out in the X-axis direction by the belt conveyor means 70 can move in order from the mounting means 20 to the pickup means 60, and the wafer 10 is mounted on the conveyor belt 78 by the mounting means 20 described above. After that, it is transported to the detection means 30 , the processing means 40 , the cleaning/drying means 50 and the pickup means 60 . The conveying belt 78 is formed of a material used as a dicing tape, for example, and is made of polyolefin as a base material and has an acrylic adhesive layer on the surface 78a forming the upper surface.

載置手段２０、検出手段３０、加工手段４０、洗浄乾燥手段５０、及びピックアップ手段６０には、それぞれ、作業空間２２、３２、４２、５２、６２と、ベルト通過部２１ｃ、３１ｃ、４１ｃ、５１ｃ、６１ｃと、が形成されている。載置手段２０、検出手段３０、加工手段４０、及び洗浄乾燥手段５０の各作業空間に配設された吸着チャック２３、３３、４３、５３、及びピックアップ手段６０に配設されたピックアップ領域６３は、均等な間隔でＸ軸方向に一直線で形成されている。搬送ベルト７８は無端ベルトであり、各作業空間に配設された吸着チャック２３、３３、４３、５３、及びピックアップ領域６３上を通過し、ベルト通過部２１ｃ、３１ｃ、４１ｃ、５１ｃ、６１ｃを通過して元の位置に戻される。吸着チャック２３、３３、４３、５３は、通気性を有する部材で形成され、図示を省略する吸引源に接続されている。 Placement means 20, detection means 30, processing means 40, cleaning/drying means 50, and pickup means 60 include work spaces 22, 32, 42, 52, and 62, and belt passing portions 21c, 31c, 41c, and 51c, respectively. , 61c are formed. The adsorption chucks 23, 33, 43, and 53 arranged in the work spaces of the placing means 20, the detecting means 30, the processing means 40, and the washing/drying means 50, and the pick-up area 63 arranged in the pick-up means 60 are , are formed in a straight line in the X-axis direction at regular intervals. The conveying belt 78 is an endless belt, and passes over the suction chucks 23, 33, 43, and 53 arranged in each working space and the pick-up area 63, and passes through the belt passing portions 21c, 31c, 41c, 51c, and 61c. to its original position. The suction chucks 23, 33, 43, 53 are made of a member having air permeability and are connected to a suction source (not shown).

図２（ａ）に示す加工装置１において採用されたベルトコンベアー手段７０は、上記したように、搬送ベルト７８を無端ベルトで構成し、繰り返し連続使用される形態で示したが、本発明はこれに限定されない。例えば、ベルトコンベアー手段７０に替えて、図２（ｂ）に別の実施形態として示すベルトコンベアー手段８０を使用するものであってもよい（加工装置１の検出手段３０、加工手段４０、洗浄乾燥手段５０については、説明の都合上省略している）。ベルトコンベアー手段８０は、載置手段２０側の端部側に配設され搬送ベルト８３として使用されるダイシングテープがロール状に巻かれたロール８１と、該ロール８１を回転自在に支持する第３ローラ支持台８２と、ピックアップ手段６０側の端部に配設され搬送ベルト８３の一端が固定され、使用後の搬送ベルト８３が巻き取られる巻取り用のローラ８４と、該ローラ８４を駆動する駆動モータ８５と、該ローラ８４を支持する第４ローラ支持台８６と、駆動モータ８５を作動させることによりロール８１から引き出される搬送ベルト８３を一定の高さに調整するローラ８７と、ピックアップ手段６０側に隣接して配設され巻取り用のローラ８４によって巻き取られるダイシングテープ８３の高さを調整するローラ８８と、を備えている。加工装置１に対してこのベルトコンベアー手段８０を採用することで、図２（ａ）に示す載置手段２０、検出手段３０、加工手段４０、洗浄乾燥手段５０、及びピックアップ手段６０に配設されたベルト通過部２１ｃ、３１ｃ、４１ｃ、５１ｃ、６１ｃは省略することができ、加工装置１の加工途中においてダイシングテープ８３が汚染されても洗浄する必要がなく、また、ダイシングテープ８３の表面８３ａの粘着層の粘着力が低下して作業途中に交換が必要になる等の問題が回避される。なお、以下に説明する実施形態では、加工装置１に対し、図２（ａ）に基づき説明したベルトコンベアー手段７０を採用したものとして説明する。 The belt conveyor means 70 adopted in the processing apparatus 1 shown in FIG. 2(a) is shown in a form in which the conveying belt 78 is composed of an endless belt and is repeatedly used continuously, as described above. is not limited to For example, instead of the belt conveyor means 70, a belt conveyor means 80 shown as another embodiment in FIG. Means 50 is omitted for convenience of explanation). The belt conveyer means 80 includes a roll 81 wound with a dicing tape used as a conveying belt 83 disposed on the end portion side of the placing means 20 side, and a third belt rotatably supporting the roll 81 . A roller support base 82, a winding roller 84 disposed at the end on the pickup means 60 side and fixed to one end of the conveying belt 83 for winding the conveying belt 83 after use, and driving the roller 84. A drive motor 85, a fourth roller support base 86 that supports the roller 84, a roller 87 that adjusts the conveying belt 83 pulled out from the roll 81 by operating the drive motor 85 to a constant height, and a pick-up means 60. and a roller 88 for adjusting the height of the dicing tape 83 which is disposed adjacent to the side and is wound by the winding roller 84 . By adopting this belt conveyor means 80 for the processing apparatus 1, it is arranged in the placing means 20, the detecting means 30, the processing means 40, the cleaning/drying means 50, and the pickup means 60 shown in FIG. The belt passing portions 21c, 31c, 41c, 51c, and 61c can be omitted, and even if the dicing tape 83 is contaminated during processing by the processing apparatus 1, there is no need to clean it. Problems such as the need to replace the adhesive layer during work due to a decrease in the adhesive strength of the adhesive layer can be avoided. In the embodiment described below, it is assumed that the processing apparatus 1 employs the belt conveyor means 70 described with reference to FIG. 2(a).

図３（ａ）には、説明の都合上、上部ハウジング２１ｂを省略した載置手段２０が示されている。載置手段２０の作業空間２２には、搬送手段２４が配設されている。テーブル２１ｄ上に配設された吸着チャック２３は、通気性を有する部材であってテーブル２１ｄの上面と面一で構成され、搬送ベルト７８が通過する位置に配設される。搬送手段２４は、テーブル２１ｄ上に配設された搬送基台２４ａと、搬送基台２４ａから上方に延びる伸長ロッド２４ｂと、伸長ロッド２４ｂの上端に一端が固定される回転アーム２４ｃと、該回転アーム２４ｃの他端に垂下されたパイプ２４ｄと、該パイプ２４ｄの下端に配設され下面に複数の孔（図示は省略する）が形成された吸着パッド２４ｅと、を備えている。吸着パッド２４ｅには、図示を省略する吸引源が接続され、該吸引源を作動させることにより、吸着パッド２４ｅの下面に負圧を生成する。 FIG. 3(a) shows the mounting means 20 with the upper housing 21b omitted for convenience of explanation. A conveying means 24 is arranged in the work space 22 of the placing means 20 . The suction chuck 23 arranged on the table 21d is a member having air permeability, is flush with the upper surface of the table 21d, and is arranged at a position through which the conveying belt 78 passes. The conveying means 24 includes a conveying base 24a arranged on a table 21d, an extension rod 24b extending upward from the conveying base 24a, a rotating arm 24c having one end fixed to the upper end of the extending rod 24b, and a rotating arm 24c. A pipe 24d suspended from the other end of the arm 24c and a suction pad 24e provided at the lower end of the pipe 24d and having a plurality of holes (not shown) formed in the lower surface thereof are provided. A suction source (not shown) is connected to the suction pad 24e, and a negative pressure is generated on the lower surface of the suction pad 24e by operating the suction source.

搬送手段２４の搬送基台２４ａは、伸長ロッド２４ｂを上下方向で昇降させることで、吸着パッド２４ｅを昇降させると共に回転アーム２４ｃを矢印で示す方向に旋回させることができる。搬送手段２４により、ウエーハ１０はテーブル２１ｄの吸着チャック２３上に載置され、搬送ベルト７８を介して吸引保持される。 The transfer base 24a of the transfer means 24 can raise and lower the suction pad 24e and rotate the rotary arm 24c in the direction indicated by the arrow by vertically raising and lowering the extension rod 24b. The wafer 10 is placed on the suction chuck 23 of the table 21 d by the transport means 24 and held by suction through the transport belt 78 .

本実施形態の載置手段２０には、図３（ａ）に示すように、搬送手段２４に加えて、圧着手段として機能する圧着ローラ２５が配設されている。圧着ローラ２５は、説明の都合上省略された移動手段を備えており、図３（ｂ）に示すように、上記の吸着チャック２３上に吸引保持されたウエーハ１０上で回転しながら上方から押圧することで、搬送ベルト７８に対してウエーハ１０を圧着する。なお、該圧着手段によってウエーハ１０が圧着される際には、上記の搬送手段２４は、図３（ｂ）に示す収納位置に移動させられる。また、該圧着手段は、上記した圧着ローラ２５に限定されず、例えば、平らな板状部材でもよく、吸着パッド２４ｅをウエーハ１０と同様の寸法で形成し、吸着チャック２３上にウエーハ１０を載置した後、ウエーハ１０を上方から押圧して搬送ベルト７８に圧着するものであってもよい。 As shown in FIG. 3A, the placing means 20 of the present embodiment is provided with a pressing roller 25 functioning as a pressing means in addition to the conveying means 24 . The pressing roller 25 has moving means omitted for convenience of explanation, and as shown in FIG. By doing so, the wafer 10 is pressed against the conveyor belt 78 . When the wafer 10 is crimped by the crimping means, the conveying means 24 is moved to the storage position shown in FIG. 3(b). Further, the pressing means is not limited to the pressing roller 25 described above, and may be, for example, a flat plate-like member. After the wafer 10 is placed, the wafer 10 may be pressed from above and pressed against the conveyor belt 78 .

上記した実施形態の加工装置１の載置手段２０の搬送手段２４及び圧着ローラ２５を使用することにより、上面（表面７８ａ）に粘着層を有する搬送ベルト７８にウエーハ１０を載置し圧着する載置工程が実施される。なお、本実施形態のウエーハの加工装置１では、圧着手段としての圧着ローラ２５を載置手段２０に配設したが、本発明はこれに限定されず、載置手段２０と、検出手段３０との間に独立した別途の圧着手段を配設して、搬送ベルト７８に対してウエーハ１０を圧着することで載置工程を完了するものであってもよい。該載置工程が完了したならば、ベルトコンベアー手段７０を作動して、搬送ベルト７８を矢印Ｒ２で示す方向に移動させる。 By using the conveying means 24 and the pressing rollers 25 of the placing means 20 of the processing apparatus 1 of the above-described embodiment, the wafer 10 is placed on the conveying belt 78 having an adhesive layer on the upper surface (surface 78a) and pressed. A placement step is performed. In addition, in the wafer processing apparatus 1 of the present embodiment, the pressing roller 25 as the pressing means is disposed on the placing means 20, but the present invention is not limited to this, and the placing means 20 and the detecting means 30 are provided. An independent and separate pressing means may be arranged between them, and the mounting process may be completed by pressing the wafer 10 against the conveying belt 78 . When the placing process is completed, the belt conveyor means 70 is operated to move the transport belt 78 in the direction indicated by the arrow R2.

図２（ａ）に示したように、載置手段２０にＸ軸方向で隣接する位置に、検出手段３０が配設されている。上記の載置工程により、搬送ベルト７８に対して圧着されたウエーハ１０は、ベルトコンベアー手段７０の作動により、図４に示す検出手段３０の作業空間３２に搬送され、テーブル３１ｄと面一で形成された上記の吸着チャック３３上に位置付けられて、吸引保持される。検出手段３０には、図４では図示を省略した上部ハウジング３１ｂに、撮像ユニット３４が配設されている。撮像ユニット３４は、撮像基台３４ａと、撮像基台３４ａの下面においてＸ軸方向に延びるように配設された一対のＸ軸案内レール３４ｂと、該Ｘ軸案内レール３４ｂに沿ってＸ軸方向に移動するＸ軸移動基台３４ｃと、Ｘ軸移動基台３４ｃの下面に配設されＹ軸方向に延びる一対のＹ軸案内レール３４ｄと、該Ｙ軸案内レール３４ｄに沿ってＹ軸方向に移動するＹ軸移動基台３４ｅと、該Ｙ軸移動基台３４ｅにおいて下面に向けて配設されたカメラ３４ｆとを備えている。なお、Ｘ軸移動基台３４ｃと、Ｙ軸移動基台３４ｅは、図示を省略する制御手段に接続されたパルスモータによって駆動され、Ｘ軸及びＹ軸によって規定されるＸＹ平面の所望の位置に、カメラ３４ｆを位置付けることができる。また、撮像基台３４ａは、該制御手段に接続された図示を省略する駆動手段によって、上下方向（Ｚ軸方向）に移動可能であり、カメラ３４ｆの撮像領域を調整したり、焦点位置を調整したりすることが可能である。 As shown in FIG. 2(a), the detecting means 30 is arranged at a position adjacent to the mounting means 20 in the X-axis direction. The wafer 10 pressed against the conveying belt 78 by the above mounting process is conveyed to the working space 32 of the detecting means 30 shown in FIG. It is positioned on the above suction chuck 33 and held by suction. In the detection means 30, an image pickup unit 34 is arranged in an upper housing 31b (not shown in FIG. 4). The imaging unit 34 includes an imaging base 34a, a pair of X-axis guide rails 34b arranged to extend in the X-axis direction on the lower surface of the imaging base 34a, and a pair of X-axis guide rails 34b extending in the X-axis direction. a pair of Y-axis guide rails 34d disposed on the lower surface of the X-axis move base 34c and extending in the Y-axis direction; It has a movable Y-axis movable base 34e and a camera 34f arranged downward on the Y-axis movable base 34e. The X-axis movable base 34c and the Y-axis movable base 34e are driven by a pulse motor connected to control means (not shown), and are positioned at desired positions on the XY plane defined by the X-axis and the Y-axis. , the camera 34f can be positioned. The imaging base 34a can be moved vertically (in the Z-axis direction) by driving means (not shown) connected to the control means, thereby adjusting the imaging area of the camera 34f and adjusting the focal position. It is possible to

上記した検出手段３０を使用して、搬送ベルト７８を介して吸着チャック３２に吸引保持されたウエーハ１０の表面１０ａを撮像し、カメラ３４ｆによって撮像された画像は、図示を省略する制御手段に送られ、ウエーハ１０の加工すべき分割予定ライン１４の角度、位置情報を特定することで、ウエーハ１０上の加工すべき領域を検出する検出工程を実施する。検出された加工すべき領域の角度、位置情報は、該制御手段の適宜のメモリに記憶する。なお、検出手段３０においてこの検出工程を実施している際には、載置手段２０において、前記した載置工程が同時進行で実施される。 The surface 10a of the wafer 10 sucked and held by the suction chuck 32 via the conveyor belt 78 is imaged using the detection means 30 described above, and the image imaged by the camera 34f is sent to control means (not shown). By specifying the angle and position information of the dividing line 14 to be processed on the wafer 10, a detection step of detecting the area to be processed on the wafer 10 is performed. The angle and position information of the detected area to be processed are stored in an appropriate memory of the control means. It should be noted that while the detecting means 30 is performing this detecting step, the placing means 20 is performing the above-described placing step simultaneously.

上記の検出工程を実施したならば、載置手段２０において同時進行で実施された載置工程が完了していることを条件として、吸着チャック２３、３３における吸引保持を解除して、ベルトコンベアー手段７０を作動し、矢印Ｒ３で示す方向に搬送ベルト７８を移動して、検出工程が施されたウエーハ１０を、図５（ａ）に示す加工手段４０の作業空間４２に搬送する。作業空間４２に搬送されたウエーハ１０は、上記の吸着チャック４３上に位置付けられ、搬送ベルト７８を介して吸引保持される。 After the detection process has been carried out, on the condition that the placement process carried out simultaneously in the placement means 20 is completed, the suction and holding of the suction chucks 23 and 33 is released, and the belt conveyor means 70 is operated to move the conveyor belt 78 in the direction indicated by the arrow R3 to convey the wafer 10 subjected to the detection process to the working space 42 of the processing means 40 shown in FIG. 5(a). The wafer 10 transported to the work space 42 is positioned on the suction chuck 43 and held by suction via the transport belt 78 .

加工手段４０には、ウエーハ１０を搬送ベルト７８上で個々のデバイスチップに分割する加工手段として切削手段４４が配設されている。切削手段４４の一部は、図５（ａ）で図示を省略した上部ハウジング４１ｂの内部に収容され保持される。切削手段４４は、切削基台４４ａと、切削基台４４ａの下面においてＸ軸方向に延びるように配設された一対のＸ軸案内レール４４ｂと、Ｘ軸案内レール４４ｂに沿ってＸ軸方向に移動するＸ軸移動基台４４ｃと、Ｘ軸移動基台４４ｃの下面に配設されＹ軸方向に延びる一対のＹ軸案内レール４４ｄと、該Ｙ軸案内レール４４ｄに沿ってＹ軸方向に移動するＹ軸移動基台４４ｅと、該Ｙ軸移動基台４４ｅにおいて下面に向けて配設された支持筒４４ｆと、該支持筒４４ｆの下端において支持される切削ユニット４５と、を備えている。切削ユニット４５は、回転軸ハウジング４５ａと、回転軸ハウジング４５ａに回転自在に保持された回転軸４５ｂと、回転軸４５ｂの先端部に固定された切削ブレード４５ｃと、を備えている。該回転軸４５ｂは、回転軸ハウジング４５ａに収容された図示を省略するモータにより回転駆動される。支持筒４４ｆは、図示を省略する制御手段に接続された回転駆動手段により矢印θで示す方向に回転可能であり、切削ブレード４５ｃの切削方向を任意の角度に位置付けることが可能である。Ｘ軸移動基台４４ｃ、及びＹ軸移動基台４４ｅは、図示を省略する制御手段に接続されたパルスモータによって駆動され、該回転駆動手段と協働することで、Ｘ軸及びＹ軸によって規定されるＸＹ平面の所望の位置に、所望の角度で切削ブレード４５ｃを位置付けることができる。また、切削基台４４ａは、該制御手段に接続された図示を省略する切込み送り手段を備えており、該切込み送り手段により、切削ブレード４５ｃを上下方向（Ｚ軸方向）にも移動可能であり、切削ブレード４５ｃの先端位置を上下方向で調整し、切込み送りすることが可能である。 The processing means 40 is provided with cutting means 44 as processing means for dividing the wafer 10 into individual device chips on the conveying belt 78 . A part of the cutting means 44 is accommodated and held inside an upper housing 41b, which is not shown in FIG. 5(a). The cutting means 44 includes a cutting base 44a, a pair of X-axis guide rails 44b arranged on the lower surface of the cutting base 44a so as to extend in the X-axis direction, and a pair of X-axis guide rails 44b extending in the X-axis direction along the X-axis guide rails 44b. A moving X-axis moving base 44c, a pair of Y-axis guide rails 44d arranged on the lower surface of the X-axis moving base 44c and extending in the Y-axis direction, and moving in the Y-axis direction along the Y-axis guide rails 44d. a Y-axis movable base 44e, a support cylinder 44f disposed downward on the Y-axis movable base 44e, and a cutting unit 45 supported at the lower end of the support cylinder 44f. The cutting unit 45 includes a rotating shaft housing 45a, a rotating shaft 45b rotatably held by the rotating shaft housing 45a, and a cutting blade 45c fixed to the tip of the rotating shaft 45b. The rotary shaft 45b is rotationally driven by a motor (not shown) housed in the rotary shaft housing 45a. The support cylinder 44f is rotatable in the direction indicated by the arrow .theta. by means of a rotary drive means connected to control means (not shown), and the cutting direction of the cutting blade 45c can be positioned at an arbitrary angle. The X-axis moving base 44c and the Y-axis moving base 44e are driven by a pulse motor connected to control means (not shown), and cooperate with the rotation driving means to define the X-axis and Y-axis. The cutting blade 45c can be positioned at the desired position in the desired XY plane and at the desired angle. In addition, the cutting base 44a is provided with a cutting feeding means (not shown) connected to the control means, and the cutting blade 45c can also be moved in the vertical direction (Z-axis direction) by the cutting feeding means. , the tip position of the cutting blade 45c can be adjusted in the vertical direction for cutting and feeding.

加工手段４０の吸着チャック４３に保持されたウエーハ１０に対し、該制御手段に記憶された加工すべき領域（分割予定ライン１４）の角度、位置情報に基づいて、図５（ａ）に示すように、高速で回転させた切削ブレード４５ｃを位置付けて切込み送りすると共に、上記のＸ軸移動基台４４ｃと、Ｙ軸移動基台４４ｅとを移動させて、所定の方向に沿って形成された全ての分割予定ライン１４に沿って加工送りして切削溝を形成する（なお、図５では、説明の都合上ウエーハ１０に形成されたデバイス１２、分割予定ライン１４等は省略されている）。該所定の方向に沿う全ての分割予定ライン１４に沿って切削溝を形成したならば、図５（ｂ）に示すように、切削ユニット４５を９０度回転して、先に形成した切削溝に直交する方向に切削ブレード４５ｃを位置付け、上記のＸ軸移動基台４４ｃと、Ｙ軸移動基台４４ｅを移動させて、先に切削溝を形成した方向と直交する方向に沿って形成された全ての分割予定ライン１４に沿って切込み送りすると共に加工送りして切削溝を形成する。これにより、搬送ベルト７８に保持されたウエーハ１０の表面１０ａに形成された全ての分割予定ライン１４に沿って切削溝が形成される。以上のようにして、搬送ベルト７８上でウエーハ１０を個々のデバイスチップに分割する加工工程が完了する。なお、この加工工程を実施する際には、上記の載置手段２０、検出工程３０において、同時進行で上記の載置工程、検出工程が実施される。該加工工程が完了したならば、同時進行で実施された検出工程、載置工程が完了していることを条件にベルトコンベアー手段７０を作動して、搬送ベルト７８を、図５（ｂ）に示す矢印Ｒ４の方向に移動させる。 The wafer 10 held by the suction chuck 43 of the processing means 40 is processed as shown in FIG. Then, the cutting blade 45c rotated at high speed is positioned and fed, and the X-axis movable base 44c and the Y-axis movable base 44e are moved to move the entirety formed along a predetermined direction. (Note that the device 12 formed on the wafer 10, the planned division line 14, etc. are omitted in FIG. 5 for convenience of explanation). After forming the cutting grooves along all the dividing lines 14 along the predetermined direction, as shown in FIG. Positioning the cutting blade 45c in the orthogonal direction, moving the X-axis movable base 44c and the Y-axis movable base 44e, all the cutting grooves formed along the direction orthogonal to the direction in which the cutting grooves were previously formed cutting and feeding along the planned dividing line 14 to form cutting grooves. As a result, cut grooves are formed along all the dividing lines 14 formed on the surface 10a of the wafer 10 held by the conveyor belt 78. As shown in FIG. As described above, the processing step of dividing the wafer 10 into individual device chips on the conveyor belt 78 is completed. When performing this processing step, the placement step and the detection step are performed simultaneously in the placement means 20 and the detection step 30 . When the processing process is completed, the belt conveyer means 70 is operated on the condition that the detection process and the placement process, which are carried out simultaneously, are completed, and the conveying belt 78 is moved as shown in FIG. 5(b). It is moved in the direction of arrow R4 shown.

上記した実施形態によれば、ウエーハを環状のフレームに保持する必要がなく、カセットが不要になることに加え、ウエーハを保持するフレームを搬出入する搬出入手段を使用する搬出入動作、搬送手段を使用する搬送動作等が不要となり、生産性が向上すると共に、装置が高額になるという問題が解消する。 According to the above-described embodiment, there is no need to hold the wafers in the annular frame, and the need for a cassette is eliminated. This eliminates the need for a transport operation, etc., using a .

上記した実施形態では、加工手段４０に切削手段４４を配設し、該加工工程が、切削ブレード４５ｃを備えた切削手段４４によって分割予定ライン１４を切削する工程である例を説明したが、本発明はこれに限定されない。例えば、図６に示す加工手段４０’には、上記した切削手段４４に替えて、レーザー光線を照射するレーザー光線照射手段４６が配設されている。なお、加工手段４０’において、上記の加工手段４０と同一の構成については、同一の番号を付してある。レーザー光線照射手段４６は、レーザー照射基台４６ａとレーザー照射基台４６ａの下面においてＸ軸方向に延びるように配設された一対のＸ軸案内レール４６ｂと、該Ｘ軸案内レール４６ｂに沿ってＸ軸方向に移動するＸ軸移動基台４６ｃと、Ｘ軸移動基台４６ｃの下面に配設されＹ軸方向に延びる一対のＹ軸案内レール４６ｄと、該Ｙ軸案内レール４６ｄに沿ってＹ軸方向に移動するＹ軸移動基台４６ｅと、該Ｙ軸移動基台４６ｅにおいて下面に向けて配設され、図示を省略する光学系で発振されたレーザー光線ＬＢを照射する集光器４７と、を備えている。Ｘ軸移動基台４６ｃ、及びＹ軸移動基台４６ｅは、図示を省略する制御手段に接続されたパルスモータによって駆動され、Ｘ軸及びＹ軸によって規定されるＸＹ平面の所望の位置に、該集光器４７を位置付けレーザー光線ＬＢを照射することができる。また、レーザー照射基台４６ａは、該制御手段に接続された図示を省略する昇降手段によって、上下方向（Ｚ軸方向）にも移動可能であり、集光器４７によって集光されるレーザー光線ＬＢの集光点位置を上下方向で調整することが可能である。このレーザー光線照射手段４６を、上記した検出工程において検出されたウエーハ１０の分割予定ライン１４の角度、位置情報に基づいて、Ｘ軸移動基台４６ｃ、Ｙ軸移動基台４６ｅを移動して、レーザー光線ＬＢをウエーハ１０の全ての分割予定ライン１４に沿って照射することで、例えばアブレーション加工を施し、ウエーハ１０を個々のデバイスチップに分割することができる。 In the above-described embodiment, the cutting means 44 is arranged in the processing means 40, and the processing step is a step of cutting the dividing line 14 by the cutting means 44 having the cutting blade 45c. The invention is not so limited. For example, the processing means 40' shown in FIG. 6 is provided with a laser beam irradiation means 46 for irradiating a laser beam instead of the cutting means 44 described above. In addition, in the processing means 40', the same numbers are assigned to the same components as the processing means 40 described above. The laser beam irradiation means 46 includes a laser irradiation base 46a, a pair of X-axis guide rails 46b arranged to extend in the X-axis direction on the lower surface of the laser irradiation base 46a, and X-axis guide rails 46b along the X-axis guide rails 46b. An X-axis moving base 46c that moves in the axial direction, a pair of Y-axis guide rails 46d arranged on the lower surface of the X-axis moving base 46c and extending in the Y-axis direction, and a Y-axis moving along the Y-axis guide rails 46d. a Y-axis movable base 46e that moves in the direction of the Y-axis movable base 46e; I have. The X-axis moving base 46c and the Y-axis moving base 46e are driven by a pulse motor connected to control means (not shown), and are moved to desired positions on the XY plane defined by the X-axis and the Y-axis. A light collector 47 can be positioned to illuminate the laser beam LB. The laser irradiation base 46a can also be moved vertically (in the Z-axis direction) by a lifting means (not shown) connected to the control means. It is possible to adjust the focal point position in the vertical direction. The laser beam irradiation means 46 moves the X-axis movable base 46c and the Y-axis movable base 46e based on the angle and position information of the dividing line 14 of the wafer 10 detected in the detection process described above, and the laser beam is emitted. By irradiating the LB along all the dividing lines 14 of the wafer 10, for example, ablation processing can be performed to divide the wafer 10 into individual device chips.

本実施形態においては、図２（ａ）に示すように、加工手段４０に対してＸ軸方向に隣接した位置に、洗浄乾燥手段５０及びピックアップ手段６０も配設されている。以下に、洗浄乾燥手段５０、ピックアップ手段６０の機能、作用について説明する。 In the present embodiment, as shown in FIG. 2(a), cleaning/drying means 50 and pick-up means 60 are also arranged adjacent to the processing means 40 in the X-axis direction. The functions and actions of the cleaning/drying means 50 and the pick-up means 60 will be described below.

図７には、説明の都合上、上部ハウジング５１ｂを省略した洗浄乾燥手段５０が示されている。図７に示すように、洗浄乾燥手段５０の作業空間５２には、洗浄乾燥ユニット５４が配設されている。上記した如く加工手段４０により加工工程を実施し、図５（ｂ）に矢印Ｒ４で示す方向に搬送ベルト７８を移動して、ウエーハ１０を図７に示す洗浄乾燥手段５０の作業空間５２に搬送する。作業空間５２に搬送されたウエーハ１０は、上記の吸着チャック５３上に位置付けられ、ベルトコンベアー手段７０の停止と共に、搬送ベルト７８を介して吸引保持される。 FIG. 7 shows the cleaning/drying means 50 with the upper housing 51b omitted for convenience of explanation. As shown in FIG. 7, a cleaning/drying unit 54 is arranged in the working space 52 of the cleaning/drying means 50 . The processing step is performed by the processing means 40 as described above, and the transport belt 78 is moved in the direction indicated by the arrow R4 in FIG. do. The wafer 10 transported to the working space 52 is positioned on the suction chuck 53 and is held by suction via the transport belt 78 as the belt conveyor means 70 stops.

洗浄乾燥ユニット５４は、洗浄乾燥手段５０の作業空間５２において、ウエーハ１０が保持された位置の上方に位置付けられる。洗浄乾燥ユニット５４は、内部に通路を有する円筒部材５４ａと、円筒部材５４ａの下端部に配設され下面側に該通路に連通された複数の噴射孔を有するシャワーヘッド５４ｂと、該円筒部材５４ａに洗浄水Ｌを供給する洗浄水供給手段５５と、該円筒部材５４ａに乾燥用のエアＡを供給するエア供給手段５６とを備えている。洗浄水供給手段５５は、洗浄水タンク５５ａと、該洗浄水タンク５５ａと円筒部材５４ａとを連通し途中に開閉弁５５ｂを備えた供給路５５ｃとを備え、エア供給手段５６は、エアタンク５６ａと、該エアタンク５６ａと円筒部材５４ａとを連通し途中に開閉弁５６ｂを備えた供給路５６ｃとを備えている。 The cleaning/drying unit 54 is positioned above the position where the wafer 10 is held in the working space 52 of the cleaning/drying means 50 . The washing/drying unit 54 includes a cylindrical member 54a having a passage therein, a shower head 54b disposed at the lower end of the cylindrical member 54a and having a plurality of injection holes communicating with the passage on the lower surface side, and the cylindrical member 54a. and an air supply means 56 for supplying drying air A to the cylindrical member 54a. The cleansing water supply means 55 includes a cleansing water tank 55a and a supply passage 55c provided with an on-off valve 55b in the communication between the cleansing water tank 55a and the cylindrical member 54a. , and a supply passage 56c which communicates between the air tank 56a and the cylindrical member 54a and has an on-off valve 56b in the middle thereof.

上記の加工工程を経て、ウエーハ１０を作業空間５２に搬送して、上記した吸着チャック５３上に吸引保持したならば、洗浄水供給手段５５の開閉弁５５ｂを開とし、洗浄水タンク５５ａから洗浄水Ｌを圧送して、シャワーヘッド５４ｂからウエーハ１０に向けて洗浄水Ｌを所定時間噴射する。次いで、洗浄水供給手段５５を停止して、エア供給手段５６の開閉弁５６ｂを開とし、エアタンク５６ａから高圧のエアＡを圧送して、シャワーヘッド５４ｂからウエーハ１０に向けてエアＡを所定時間噴射する。これにより、搬送ベルト７８上において、ウエーハ１０の表面１０ａから切削屑等の汚れが除去されて、表面１０ａが洗浄されると共に乾燥されて洗浄乾燥工程が完了する。なお、図７には記載されていないが、洗浄乾燥手段５０において、ウエーハ１０に洗浄水Ｌ、及びエアＡを供給する際に、作業空間５２を覆うカバー部材を配設して、洗浄乾燥ユニット５４から供給される洗浄水Ｌや切削屑等が、洗浄乾燥手段５０の外部に飛散しないようにすることが好ましい。上記した如く洗浄乾燥工程を実施したならば、図７に矢印Ｒ５で示す方向に搬送ベルト７８を移動して、ウエーハ１０を、図８（ａ）に示すピックアップ手段６０の作業空間６２に搬送する。 After the wafer 10 is transported to the work space 52 through the above-described processing steps and held by suction on the suction chuck 53, the on-off valve 55b of the cleaning water supply means 55 is opened to clean the wafer from the cleaning water tank 55a. The water L is pressure-fed, and the washing water L is sprayed toward the wafer 10 from the shower head 54b for a predetermined time. Next, the cleaning water supply means 55 is stopped, the on-off valve 56b of the air supply means 56 is opened, high-pressure air A is pumped from the air tank 56a, and the air A is directed from the shower head 54b toward the wafer 10 for a predetermined time. Inject. As a result, dirt such as cutting dust is removed from the surface 10a of the wafer 10 on the conveying belt 78, and the surface 10a is cleaned and dried to complete the cleaning/drying process. Although not shown in FIG. 7, in the cleaning/drying means 50, when the cleaning water L and the air A are supplied to the wafer 10, a cover member covering the work space 52 is arranged to cover the cleaning/drying unit. It is preferable to prevent the cleaning water L, cutting waste, and the like supplied from 54 from scattering outside the cleaning/drying means 50 . After the cleaning/drying process has been carried out as described above, the transport belt 78 is moved in the direction indicated by the arrow R5 in FIG. 7 to transport the wafer 10 to the work space 62 of the pick-up means 60 shown in FIG. 8(a). .

図８（ａ）には、説明の都合上、ウエーハ１０及び上部ハウジング６１ｂが省略されたピックアップ手段６０が示されている。図に示すように、テーブル６１ｄには、ピックアップ領域６３を形成する開口が配設されており、ピックアップ領域６３の内部には、ピックアップ領域６３に臨むプッシュロッド６４ａが配設され、該プッシュロッド６４ａの上方には、ピックアップコレット６４ｂの吸引部６４ｃが配設されている。図８（ｂ）にピックアップ手段６０の一部を断面で示す。図から理解されるように、ピックアップ領域６３を構成する開口は、ウエーハ１０よりも大きい寸法で形成される。また、該プッシュロッド６４ａは、下部ハウジング６１ａ内に収容された押し上げ部材６４ｄによって、上下方向に進退させられる。ピックアップコレット６４ｂの吸引部６４ｃは、図示を省略する吸引源に接続されている。下部ハウジング６１ａの内部には、図示を省略するＸ軸方向移動手段、及びＹ軸方向移動手段が配設されており、ピックアップコレット６４ｂと、押し上げ部材６４ｄとを任意のＸ座標、Ｙ座標位置に位置付けることができる。上記した洗浄乾燥工程が施されたウエーハ１０は、ベルトコンベアー手段７０を作動することにより、作業空間６２に搬送され、上記のピックアップ領域６３上に位置付けられる。なお、ベルトコンベアー手段７０を作動する際には、同時進行で実施された上記の載置工程、検出工程、加工工程も完了していることが条件となる。次いで、ピックアップコレット６４ｂと共に押し上げ部材６４ｄを移動して、所定のデバイスチップ１２’の上下位置に、プッシュロッド６４ａと、吸引部６４ｃを位置付ける。次いで、該プッシュロッド６４ａを上昇させると共に、該吸引部６４ｃに負圧を生成しながら下降させて、デバイスチップ１２’を吸引し、ピックアップコレット６４ｂを上昇、旋回させて、図８（ａ）に示すテーブル６１ｄ上に配設された収容ケースに６５にデバイスチップ１２’を収容する。これらを繰り返すことにより、ウエーハ１０が載置されたピックアップ領域６３から、全てのデバイスチップ１２’をピックアップし収容して、ピックアップ工程が完了する。該ピックアップ工程を実施する際には、同時進行で、上記の載置工程、検出工程、加工工程、洗浄乾燥工程が実施される。以上により、本実施形態におけるウエーハの加工方法が完了するが、ベルトコンベアー手段７０を作動して、矢印Ｒ６で示す方向に搬送ベルト７８を送ることで、上記のウエーハの加工方法が繰り返され、連続的に上記のウエーハの加工方法を実施することができる。 FIG. 8(a) shows the pickup means 60 with the wafer 10 and the upper housing 61b omitted for convenience of explanation. As shown in the figure, the table 61d is provided with an opening that forms a pickup area 63. Inside the pickup area 63, a push rod 64a facing the pickup area 63 is provided. A suction portion 64c of the pickup collet 64b is arranged above the . A part of the pick-up means 60 is shown in cross section in FIG. 8(b). As can be seen from the figure, the opening forming the pickup area 63 is formed with dimensions larger than the wafer 10 . Further, the push rod 64a is vertically advanced and retracted by a push-up member 64d housed in the lower housing 61a. The suction portion 64c of the pickup collet 64b is connected to a suction source (not shown). An X-axis moving means and a Y-axis moving means (not shown) are provided inside the lower housing 61a, and the pick-up collet 64b and the push-up member 64d can be moved to arbitrary X- and Y-coordinate positions. can be positioned. The wafer 10 subjected to the cleaning and drying process described above is conveyed to the work space 62 by operating the belt conveyor means 70 and positioned on the pickup area 63 described above. In addition, when the belt conveyor means 70 is operated, it is a condition that the above-mentioned mounting process, detection process, and processing process, which are carried out simultaneously, are completed. Next, the push-up member 64d is moved together with the pick-up collet 64b to position the push rod 64a and the suction portion 64c at predetermined upper and lower positions of the device chip 12'. Next, the push rod 64a is lifted and lowered while generating a negative pressure in the suction portion 64c to suck the device chip 12', and the pick-up collet 64b is lifted and rotated, as shown in FIG. 8(a). The device chip 12' is housed in the housing case 65 arranged on the table 61d shown. By repeating these steps, all the device chips 12' are picked up from the pickup area 63 on which the wafer 10 is placed and accommodated, and the pickup process is completed. When carrying out the pick-up process, the above-described placing process, detection process, processing process, and cleaning/drying process are carried out simultaneously. As described above, the wafer processing method according to the present embodiment is completed. By operating the belt conveyor means 70 and feeding the conveyor belt 78 in the direction indicated by the arrow R6, the above-described wafer processing method is repeated and continuously performed. In practice, the above-described wafer processing method can be implemented.

上記したように、本実施形態におけるウエーハの加工装置１において実施されるウエーハの加工方法によれば、搬送ベルト７８上に載置されたウエーハ１０を個々のデバイスチップ１２’に分割してピックアップするまでの間、フレームに保持する必要がなく、カセットに収容して搬送する等の作業を実施する必要がない。また、上記の載置工程を実施してから、搬出入手段による搬出入動作や、搬送手段による搬送動作を実施することなく、ピックアップ工程まで実施することができ、生産性が向上すると共に、安価な加工装置を構成することが可能である。 As described above, according to the wafer processing method performed in the wafer processing apparatus 1 of the present embodiment, the wafer 10 placed on the conveyor belt 78 is divided into individual device chips 12' and picked up. Until then, there is no need to hold it on the frame, and there is no need to carry out operations such as accommodating it in a cassette and transporting it. In addition, the pick-up process can be performed without performing the loading/unloading operation by the loading/unloading means or the carrying operation by the carrying means after the above-described placing process is carried out, thereby improving the productivity and reducing the cost. It is possible to construct a processing device that is flexible.

なお、上記した実施形態では省略しているが、本実施形態のウエーハの加工装置１にウエーハ１０を搬送する前に、図示を省略する研削装置によってウエーハ１０の裏面が研削されている。その際には、一般的にウエーハ１０のデバイス１２が形成された表面１０ａに吸着チャックによって傷が付かないように、保護テープＴが配設されている。その保護テープＴがウエーハ１０の表面１０ａに貼着されたまま本実施形態の加工装置１に搬入されてくる場合には、図２（ａ）に示す載置手段２０の上流側（第１ローラ支持台７１側）、又は載置手段２０の下流側（検出手段３０側）に、図９（ａ）に示すような、ウエーハ１０の表面１０ａに配設された保護テープＴを剥離する保護テープ除去手段９０を配設し、ウエーハ１０の表面１０ａに配設された保護テープＴを剥離する保護テープ除去工程を実施するようにしてもよい。 Although omitted in the above embodiment, the back surface of the wafer 10 is ground by a grinding apparatus (not shown) before the wafer 10 is transported to the wafer processing apparatus 1 of this embodiment. At that time, a protective tape T is generally provided so that the surface 10a of the wafer 10 on which the devices 12 are formed is not damaged by the suction chuck. When the protective tape T is carried into the processing apparatus 1 of the present embodiment with the protective tape T adhered to the surface 10a of the wafer 10, the upstream side of the mounting means 20 shown in FIG. support table 71 side) or the downstream side of the mounting means 20 (detection means 30 side), as shown in FIG. A removing means 90 may be provided to perform a protective tape removing step of peeling off the protective tape T provided on the front surface 10a of the wafer 10. FIG.

図に示す保護テープ除去手段９０は、図９（ａ）に示す剥離手段９４を備えている点を除き、概ね、上記した載置手段２０、検査手段３０、加工手段４０と略同等の構成を備えている。剥離手段９４は、剥離基台９４ａと、剥離基台９４に配設された旋回アーム９４ｂと、旋回アーム９４ｂの先端部に配設され旋回可能に構成された剥離爪９４ｃとを備えている。表面に保護テープＴが貼着されたウエーハ１０は、搬送ベルト７８によって作業空間９２に搬送され、下部ハウジング９１ａのテーブル９１ｄ上に配設された図示を省略する吸着チャック上に位置付けられて吸引保持される。そして、剥離爪９４ｃを保護テープＴの側面から差し込み、該剥離爪９４ｃを上昇させながら旋回アーム９４ｂを旋回させて、図９（ｂ）に示すように、ウエーハ１０の表面１０ａから保護テープＴを剥離して除去する。以上により、保護テープ除去工程が完了する。保護テープ除去工程が完了したならば、矢印Ｒ７で示す方向に搬送ベルト７８と共にウエーハ１０が移動させられる。このような保護テープ除去工程を実施する保護テープ除去手段９０を配設することで、研削工程を完了した後、そのまま本実施形態の加工装置１にウエーハ１０を搬送することが可能になり、ウエーハ１０に形成された複数のデバイス１２が保護される。なお、剥離手段９４は、上記した保護テープ除去手段９０の如く独立した装置として配設することに限定されず、例えば、載置手段２０に配設するようにしてもよい。 The illustrated protective tape removing means 90 has substantially the same configuration as the placing means 20, the inspecting means 30, and the processing means 40 described above, except that the removing means 94 shown in FIG. 9(a) is provided. I have. The stripping means 94 includes a stripping base 94a, a swivel arm 94b arranged on the stripping base 94, and a stripping claw 94c arranged at the tip of the swivel arm 94b and configured to be swivelable. The wafer 10 with the protective tape T adhered to its surface is conveyed to the work space 92 by the conveying belt 78, positioned on a suction chuck (not shown) arranged on the table 91d of the lower housing 91a, and held by suction. be done. Then, the peeling claw 94c is inserted from the side surface of the protective tape T, and the turning arm 94b is turned while lifting the peeling claw 94c to remove the protective tape T from the surface 10a of the wafer 10 as shown in FIG. 9(b). Peel and remove. With the above, the protective tape removing process is completed. After the protective tape removing process is completed, the wafer 10 is moved together with the transport belt 78 in the direction indicated by the arrow R7. By arranging the protective tape removing means 90 for carrying out such a protective tape removing process, it becomes possible to transfer the wafer 10 to the processing apparatus 1 of the present embodiment as it is after the grinding process is completed. A plurality of devices 12 formed in 10 are protected. The peeling means 94 is not limited to being arranged as an independent device like the protective tape removing means 90 described above, and may be arranged in the placing means 20, for example.

なお、本実施形態の加工装置１においては、上記したように、載置工程、検出工程、加工工程、洗浄乾燥工程、及びピックアップ工程を同時進行で実施すべく、載置手段２０の吸着チャック２３、検出手段３０の吸着チャック３３、加工手段４０の吸着チャック４３、洗浄乾燥手段５０の吸着チャック５３、及びピックアップ手段６０のピックアップ領域６３は、所定の均等な間隔で配設されており、ウエーハ１０は、搬送ベルト７８上に、少なくとも該所定の均等な間隔で載置、圧着される。しかし、本発明は、必ずしもウエーハ１０を搬送ベルト７８上に該所定の均等な間隔を空けて載置、圧着することに限定されず、上記の載置工程、検出工程、加工工程、洗浄乾燥工程、及びピックアップ工程が、同時進行で実施可能な位置であれば、該所定の一定間隔にウエーハ１０を配設することに加え、該所定の均等な間隔の間（例えば中間位置）にもウエーハ１０を載置、圧着するようにしてもよい。 In addition, in the processing apparatus 1 of the present embodiment, as described above, the suction chuck 23 of the mounting means 20 is arranged to simultaneously perform the mounting process, the detection process, the processing process, the cleaning/drying process, and the pick-up process. , the adsorption chuck 33 of the detection means 30, the adsorption chuck 43 of the processing means 40, the adsorption chuck 53 of the cleaning/drying means 50, and the pickup area 63 of the pickup means 60 are arranged at predetermined equal intervals. are placed and pressed on the conveying belt 78 at least at the predetermined equal intervals. However, the present invention is not necessarily limited to placing and pressing the wafers 10 on the conveyor belt 78 with the predetermined equal intervals, and the above-described placement process, detection process, processing process, and cleaning/drying process. , and a position where the pick-up process can be performed simultaneously, in addition to arranging the wafers 10 at the predetermined regular intervals, the wafers 10 are also placed between the predetermined uniform intervals (for example, intermediate positions). may be placed and crimped.

１：加工装置
２０：載置手段
２１ａ：下部ハウジング
２１ｂ：上部ハウジング
２１ｃ：ベルト通過部
２１ｄ：テーブル
２２：作業空間
２３：吸着チャック
２４：搬送手段
２４ａ：搬送基台
２４ｂ：伸長ロッド
２４ｃ：回転アーム
２４ｄ：パイプ
２４ｅ：吸着パッド
２５：圧着ローラ
３０：検出手段
３１ａ：下部ハウジング
３１ｂ：上部ハウジング
３１ｃ：ベルト通過部
３１ｄ：テーブル
３２：作業区間
３３：吸着チャック
４０：加工手段
４１ａ：下部ハウジング
４１ｂ：上部ハウジング
４１ｃ：ベルト通過部
４１ｄ：テーブル
４２：作業空間
４３：吸着チャック
４４：切削手段
４４ａ：切削基台
４４ｂ：Ｘ軸案内レール
４４ｃ：Ｘ軸移動基台
４４ｄ：Ｙ軸案内レール
４４ｅ：Ｙ軸移動基台
４４ｆ：支持筒
４５：切削ユニット
４５ａ：回転軸ハウジング
４５ｂ：回転軸
４５ｃ：切削ブレード
５０：洗浄乾燥手段
５１ａ：下部ハウジング
５１ｂ：上部ハウジング
５１ｃ：ベルト通過部
５１ｄ：テーブル
５２：作業空間
５３：吸着チャック
６０：ピックアップ手段
６１ａ：下部ハウジング
６１ｂ：上部ハウジング
６１ｃ：ベルト通過部
６１ｄ：テーブル
６２：作業空間
６３：ピックアップ領域
７０：ベルトコンベヤー手段
７１：第１ローラ支持台
７２：従動ローラ
７３：第２ローラ支持台
７４：駆動ローラ
７５：駆動モータ
７８：搬送ベルト
８０：ベルトコンベアー手段
８１：ロール
８２：第３ローラ支持台
８３：搬送ベルト
８４：ローラ
８５：駆動モータ
８６：第４ローラ支持台
８７：ローラ
８８：ローラ
９０：保護テープ除去手段
９１ａ：下部ハウジング
９１ｄ：テーブル
９２：作業空間
９４：剥離手段
９４ａ：剥離基台
９４ｂ：旋回アーム
９４ｃ：剥離爪 1: Processing device 20: Placement means 21a: Lower housing 21b: Upper housing 21c: Belt passing part 21d: Table 22: Work space 23: Adsorption chuck 24: Transfer means 24a: Transfer base 24b: Extension rod 24c: Rotating arm 24d: Pipe 24e: Suction pad 25: Pressure roller 30: Detection means 31a: Lower housing 31b: Upper housing 31c: Belt passing part 31d: Table 32: Working section 33: Suction chuck 40: Processing means 41a: Lower housing 41b: Upper part Housing 41c: Belt passing portion 41d: Table 42: Work space 43: Suction chuck 44: Cutting means 44a: Cutting base 44b: X-axis guide rail 44c: X-axis movement base 44d: Y-axis guide rail 44e: Y-axis movement Base 44f: Support cylinder 45: Cutting unit 45a: Rotating shaft housing 45b: Rotating shaft 45c: Cutting blade 50: Washing and drying means 51a: Lower housing 51b: Upper housing 51c: Belt passage 51d: Table 52: Work space 53: Suction chuck 60: Pickup means 61a: Lower housing 61b: Upper housing 61c: Belt passing part 61d: Table 62: Work space 63: Pickup area 70: Belt conveyor means 71: First roller support base 72: Driven roller 73: Second Roller support 74: Drive roller 75: Drive motor 78: Conveyor belt 80: Belt conveyor means 81: Roll 82: Third roller support 83: Conveyor belt 84: Roller 85: Drive motor 86: Fourth roller support 87: Roller 88: Roller 90: Protective tape removing means 91a: Lower housing 91d: Table 92: Working space 94: Peeling means 94a: Peeling base 94b: Pivoting arm 94c: Peeling claw

Claims (12)

複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工方法であって、
上面に粘着層を有する搬送ベルトにウエーハを載置し圧着する載置工程と、該搬送ベルトに載置されたウエーハを撮像し加工すべき領域を検出する検出工程と、該加工すべき領域が検出された該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工工程と、を含み構成されるウエーハの加工方法。 A wafer processing method for dividing a wafer having a plurality of devices formed on the surface thereof partitioned by dividing lines into individual device chips,
A placing step of placing a wafer on a conveying belt having an adhesive layer on its upper surface and pressing the wafer thereon, a detecting step of picking up an image of the wafer placed on the conveying belt and detecting an area to be processed, and and a processing step of dividing the detected wafer into individual device chips on the conveyor belt. 該加工工程の後、ウエーハを洗浄すると共に乾燥する洗浄乾燥工程と、該搬送ベルトのウエーハが載置された領域からデバイスチップをピックアップするピックアップ工程と、を含む請求項１に記載のウエーハの加工方法。 2. The wafer processing according to claim 1, further comprising a cleaning and drying step of cleaning and drying the wafer after the processing step, and a pick-up step of picking up the device chips from the area of the conveyor belt on which the wafer is placed. Method. 該載置工程の前、又は後に、ウエーハの表面に配設された保護テープを剥離する保護テープ除去工程を含む請求項１、又は２に記載のウエーハの加工方法。 3. The wafer processing method according to claim 1, further comprising a protective tape removing step of removing the protective tape provided on the surface of the wafer before or after the mounting step. 該加工工程は、切削ブレードを備えた切削手段によってウエーハの分割予定ラインを切削する工程である請求項１から３のいずれかに記載のウエーハの加工方法。 4. The method of processing a wafer according to claim 1, wherein the processing step is a step of cutting the dividing line of the wafer by a cutting means having a cutting blade. 該加工工程は、レーザー光線を照射するレーザー光線照射手段によってウエーハの分割予定ラインにレーザー加工を施す工程である請求項１から３のいずれかに記載のウエーハの加工方法。 4. The method of processing a wafer according to claim 1, wherein said processing step is a step of performing laser processing on the dividing line of the wafer by a laser beam irradiation means for irradiating a laser beam. 該搬送ベルトは、ロール状のダイシングテープの一端をローラに巻き付けて構成される請求項１から５のいずれかに記載のウエーハの加工方法。 6. The method of processing a wafer according to claim 1, wherein said conveyor belt is constructed by winding one end of a roll-shaped dicing tape around a roller. 複数のデバイスが分割予定ラインによって区画されて表面に形成されたウエーハを個々のデバイスチップに分割するウエーハの加工装置であって、
上面に粘着層を有する搬送ベルトを備えるベルトコンベアー手段と、該搬送ベルトにウエーハを載置し圧着する載置手段と、該搬送ベルトに圧着されたウエーハを撮像し加工すべき領域を検出する検出手段と、該ウエーハを該搬送ベルト上で個々のデバイスチップに分割する加工手段と、を含み構成されるウエーハの加工装置。 A wafer processing apparatus for dividing a wafer formed on a surface thereof with a plurality of devices partitioned by dividing lines into individual device chips,
Belt conveyor means having a conveyor belt having an adhesive layer on its upper surface, mounting means for placing and pressing a wafer on the conveyor belt, and detection for detecting an area to be processed by imaging the wafer pressed to the conveyor belt. and processing means for dividing the wafer into individual device chips on the conveyor belt. 該加工手段によって加工されたウエーハを該搬送ベルト上で洗浄すると共に乾燥する洗浄乾燥手段と、該搬送ベルトのウエーハが載置された領域からデバイスチップをピックアップするピックアップ手段と、を含む請求項７に記載のウエーハの加工装置。 8. A washing and drying means for washing and drying the wafer processed by the processing means on the transport belt, and a pickup means for picking up the device chip from the area of the transport belt where the wafer is placed. The wafer processing apparatus according to 1. ウエーハの表面に配設された保護テープを剥離する保護テープ除去手段を含む請求項７又は８に記載のウエーハの加工装置。 9. The wafer processing apparatus according to claim 7, further comprising protective tape removing means for removing the protective tape provided on the surface of the wafer. 該加工手段は、切削ブレードを備えた切削手段である請求項７に記載のウエーハの加工装置。 8. The wafer processing apparatus according to claim 7, wherein said processing means is cutting means having a cutting blade. 該加工手段は、レーザー光線を照射するレーザー光線照射手段である請求項７～９のいずれかに記載のウエーハの加工装置。 10. The wafer processing apparatus according to claim 7, wherein said processing means is a laser beam irradiation means for irradiating a laser beam. 該搬送ベルトは、ダイシングテープで構成される請求項７から１１のいずれかに記載のウエーハの加工装置。 12. The wafer processing apparatus according to any one of claims 7 to 11, wherein the conveying belt is composed of a dicing tape.
JP2021205706A 2021-12-20 2021-12-20 Method and device for processing wafer Pending JP2023091141A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021205706A JP2023091141A (en) 2021-12-20 2021-12-20 Method and device for processing wafer
KR1020220172211A KR20230094146A (en) 2021-12-20 2022-12-12 Method of processing wafer and apparatus of processing wafer
CN202211598035.0A CN116313767A (en) 2021-12-20 2022-12-14 Wafer processing method and wafer processing device
TW111148258A TW202325457A (en) 2021-12-20 2022-12-15 Wafer processing method and wafer processing device enhancing productivity and eliminating problem of becoming higher equipment price

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021205706A JP2023091141A (en) 2021-12-20 2021-12-20 Method and device for processing wafer

Publications (1)

Publication Number Publication Date
JP2023091141A true JP2023091141A (en) 2023-06-30

Family

ID=86789389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021205706A Pending JP2023091141A (en) 2021-12-20 2021-12-20 Method and device for processing wafer

Country Status (4)

Country Link
JP (1) JP2023091141A (en)
KR (1) KR20230094146A (en)
CN (1) CN116313767A (en)
TW (1) TW202325457A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3076179B2 (en) 1993-07-26 2000-08-14 株式会社ディスコ Dicing equipment
JP2004322168A (en) 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd Laser machining apparatus

Also Published As

Publication number Publication date
TW202325457A (en) 2023-07-01
KR20230094146A (en) 2023-06-27
CN116313767A (en) 2023-06-23

Similar Documents

Publication Publication Date Title
JP6865828B2 (en) Transport equipment, substrate processing system, transport method, and substrate processing method
TWI816945B (en) Wafer splitting device
TW201608627A (en) Grinding device, protective tape attaching method and protective tape
JP7184620B2 (en) cutting equipment
JP4776431B2 (en) Protective film coating equipment
JP2023091141A (en) Method and device for processing wafer
JP4580806B2 (en) Work support frame, work cleaning and drying device, and cutting device
JP2010087443A (en) Transport mechanism
CN115410952A (en) Processing device
CN114975174A (en) Processing device
KR102619218B1 (en) Cutting apparatus
JP7096733B2 (en) Cutting equipment
JP2023026854A (en) Liquid resin coating device
JP2021174920A (en) Wafer processing method
CN116913845A (en) Conveying pad
KR20230043722A (en) Method of processing sheet-shaped workpiece
JP6093531B2 (en) Cutting equipment
JP2023089631A (en) Protective member formation apparatus
CN117863238A (en) Method for cutting strip-shaped sheet
JP2024053803A (en) Protective member forming device
JP2023025560A (en) Processing device
JP2023031741A (en) Conveyance device and conveyance method for chip-shaped workpiece
JP2000077362A (en) Dicing device
JP2007281094A (en) Dicing apparatus and dicing method