TW201608627A - Grinding device, protective tape attaching method and protective tape - Google Patents

Abstract

An object of the present invention is to attach a protective tape on a wafer without occupying the arrangement area in a factory and reducing the yield rate. A solution of the present invention is a grinding device including at least a holding platform and a grinding means, wherein the holding platform includes a sucking surface for holding a first surface of a wafer, and the grinding means is configured to grind a second surface of the wafer held on the holding platform. The grinding device at least includes a protective tape conveying means, a wafer conveying means, and a suction force generating means. The protective tape conveying means applies a back surface of the protective tape, which is air-permeable from a front surface to the rear surface with an adhesive layer on the front surface and in a shape about identical to the wafer, on the sucking surface of the holding platform. The wafer conveying means applies the first surface of the wafer on the adhesive layer of the protective tape applied on the sucking surface. The suction force generating means provides suction force on the sucking surface, and sucks the first surface of the wafer through the protective tape for attaching the first surface of the wafer on the adhesive layer of the protective tape, such that the protective tape can be attached to the wafer without using a protective tape applying device.

Description

Grinding device, protective tape attaching method and protective tape Field of invention

The present invention relates to a grinding device in which a protective tape can be attached to a wafer to be ground, a protective tape adhering a protective tape to a wafer, and a protective tape attached to the wafer.

Background of the invention

A wafer formed on a surface by dividing a plurality of elements such as an IC and an LSI by a predetermined dividing line, and forming a predetermined thickness by forming a back surface by a grinding device, is divided into individual components by a cutting device or the like. And it is used in various electronic machines and the like.

The grinding device includes a grinding device and a grinding feed device, and the grinding device includes a working clamping table for sucking and holding the wafer and a rotatable grinding stone, and the grinding feeding means can move the grinding device relative to the working The clamping table grinds the feed relatively, and by grinding the rotating grinding vermiculite against the back side of the wafer that is attracted to the working chuck, the wafer can be ground to a desired thickness. .

In the case of grinding the back surface of the wafer, a protective tape is applied to the surface of the wafer in order to prevent damage to the components formed on the surface of the wafer. To apply a protective tape to the surface of the wafer, use a protective tape attached to the device (see For example, Patent Document 2).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 61-25769

Patent Document 2: Japanese Patent Laid-Open No. 62-230561

Summary of invention

However, since the protective tape attaching device is provided separately from the grinding device and adjacent to the grinding device, there is a problem that the installation space of the factory is pressed. Further, since the step of attaching the protective tape to the surface of the wafer must be performed before the grinding step of grinding the wafer, there is a problem that the productivity is lowered. Such a problem occurs not only in the case where the protective tape is attached to the wafer to be polished, but also in the case where the protective tape is attached to the wafer to be processed.

The present invention has been made in view of such problems, and an object thereof is to attach a protective tape to a wafer without pressing the installation area in the factory or reducing the productivity.

The first invention is a grinding apparatus having at least a working chuck and a grinding means, wherein the working chuck has an adsorption surface for holding the first side of the wafer, and the grinding means is maintained on the working chuck In the second aspect, the grinding device comprises at least a protective tape conveying means, which is ventilated from the surface to the back surface and a back surface of the protective tape having an adhesive layer on the surface and having a shape substantially the same as that of the wafer is placed on the adsorption surface of the work chuck; the wafer transfer means places the first side of the wafer on the loaded surface On the adhesive layer of the protective tape on the adsorption surface; and the attraction generating means, the attraction force acts on the adsorption surface, and the first surface of the wafer is attracted through the protective tape so that the first surface of the wafer is attached to the protective tape Adhesive layer.

Preferably, a release paper is adhered to the adhesive layer of the protective tape, and a plurality of fine pores are formed from the release paper to the back surface of the protective tape to cause air permeability.

Further, it is preferable that the grinding device is provided with a protective tape storage means and a peeling means for stacking and storing a plurality of protective tapes, and the peeling means carries the peeling paper from the loaded The adhesive layer of the protective tape placed on the adsorption surface of the working clamp is peeled off, and the protective tape conveying means conveys the protective tape from the protective tape storage means to the adsorption surface of the working clamp.

A second invention is a method of adhering a protective tape to a first surface of a wafer having a first side and a second side, the method comprising at least: a protective tape loading step, having a surface to a back surface a back surface of the protective tape having an adhesive layer on the surface and having an adhesive layer on the surface and having a shape substantially the same as that of the wafer is placed on the adsorption surface of the work chuck; the wafer transfer step is performed on the first side of the wafer Placed on the adhesive layer of the protective tape placed on the adsorption surface; The attraction step is such that the attraction acts on the adsorption surface and the first side of the wafer is attracted through the protective tape so that the first side of the wafer is attached to the adhesive layer of the protective tape.

A third invention is a protective tape comprising at least a sheet, an adhesive layer laid on the surface of the sheet, and a plurality of pores penetrating the sheet and the adhesive layer to cause air permeability.

Preferably, a release paper is adhered to the adhesive layer, and a plurality of fine holes corresponding to the fine pores formed in the adhesive layer are formed on the release paper.

The grinding device of the present invention includes a protective tape transfer means, a wafer transfer means, and an attraction generating means, and the protective tape transfer means has air permeability from the front surface to the back surface and has an adhesive layer on the surface and has The back surface of the protective tape having a substantially identical shape of the wafer is placed on the adsorption surface of the working chuck, and the wafer transfer method is to place the first surface of the wafer on the protective tape that has been placed on the adsorption surface. On the adhesive layer, the attraction generating means is to apply an attractive force on the adsorption surface, and to attract the first surface of the wafer through the protective tape so that the first surface of the wafer is adhered to the adhesive layer of the protective tape, and The protective tape can be attached to the wafer without the use of a protective tape attached to the device, so that the portion of the factory's installation area where the protective tape is held by the device can be released. Moreover, since the waiting time during the period in which the other wafer is being ground can be utilized, the protective tape is attached to the first surface of the wafer to be ground next, and the productivity can be improved.

The protective tape of the present invention is attached to the method, since it will have ventilation The back side of the protective tape is placed on the adsorption surface of the working chuck, and the first side of the wafer is placed on the adhesive layer of the protective tape that has been placed on the adsorption surface, and the attraction is applied. The first side of the wafer is attracted to the adhesive layer by the protective tape to adhere the first side of the wafer to the adhesive layer of the protective tape, so that the protective tape can be attached without using the protective tape to the device. Stick to the wafer. Therefore, it is possible to release the portion of the factory's installation area where the protective tape is held by the device.

The protective tape of the present invention is composed of a sheet, an adhesive layer laid on the surface of the sheet, and a plurality of pores having a gas permeability through the sheet and the adhesive layer, and thus can be applied to the above-mentioned grinding device and The protective tape is attached to the method.

1‧‧‧ grinding device

11‧‧‧Processing area

12‧‧‧ handover area

2‧‧‧ Turntable

3‧‧‧Working table

30‧‧‧Adsorption plate

31‧‧‧Frame

32‧‧‧Attraction source

33‧‧‧Adsorption surface

4a, 4b‧‧‧ grinding means

40‧‧‧ Spindle

41‧‧‧Motor

42‧‧‧ Mounting

43‧‧‧ grinding wheel

44‧‧‧ grinding diamonds

5a, 5b‧‧‧ grinding feed means

50‧‧‧Rolling screw

51‧‧‧ pulse motor

52‧‧‧rails

53‧‧‧ lifting plate

6a, 6b‧‧‧Facsimile loading area

60a, 60b‧‧‧ wafer cassette

61‧‧‧ Move in and out

610, 641, 651‧‧ ‧ arm department

611, 640, 650, 72‧‧‧ Keeping Department

62‧‧‧Premium

63‧‧‧ Washing means

630‧‧‧Rotating table

64‧‧‧ Wafer transfer means

65‧‧‧Transfer means

7‧‧‧Protection tape transport means

70‧‧‧ Track

71‧‧‧Mobile Department

8‧‧‧Protective tape storage means

9‧‧‧Disposal of discarded paper

100‧‧‧Protection tape

101‧‧‧Sheet

102‧‧‧Adhesive layer

103‧‧‧ peeling paper

104, 105‧‧‧ holes

106‧‧‧ Relaxation

101a‧‧‧Surface of sheet

101b‧‧‧The back of the sheet

D‧‧‧ components

L‧‧‧ dividing line

N‧‧‧ Scotch

P‧‧‧ interval

W‧‧‧ wafer

W1‧‧‧ surface

W2‧‧‧ back

±X, ±Y, ±Z‧‧‧ directions

A, B, C‧‧‧ arrows

Fig. 1 is a perspective view showing an example of a grinding device.

Fig. 2 is a perspective view showing an example of a work chuck.

3 is a perspective view showing an example of a wafer.

Fig. 4 is a perspective view showing an example of a protective tape storage means.

Fig. 5 is a cross-sectional view showing an example of a protective tape.

Fig. 6 is a perspective view showing an example of a means for discarding a release paper.

Fig. 7 is a perspective view showing a state in which a protective tape is conveyed.

Fig. 8 is a perspective view showing a step of placing a protective tape.

FIG. 9 is a perspective view showing a wafer transfer step.

Fig. 10 is a perspective view showing a state in which a wafer has been attached to a protective tape.

Fig. 11 is a perspective view showing a grinding step.

Form for implementing the invention

1 Composition of the grinding device

The grinding apparatus 1 shown in Fig. 1 is a device that grinds various wafers such as semiconductor wafers to have a predetermined thickness. This grinding device 1 is a processing region 11 (+Y direction side) for grinding a wafer, and supplies a wafer before grinding to the processing region 11 and receives a transferred region of the wafer after grinding from the processing region 11. 12 (-Y direction side) is composed.

In the processing region 11, a rotatable turntable 2, a plurality of work chucks 3 disposed on the turntable 2, grinding means 4a, 4b for grinding the wafer held on the work chuck 3, and a grinding machine are disposed. The cutting means 4a, 4b grind the feed grinding feed means 5a, 5b in the Z-axis direction.

The work table 3 is self-rotating and is reversible by the rotation of the turntable 2. As shown in FIG. 2, the working chuck 3 is a disk-shaped adsorption plate 30 formed of porous ceramics or the like, and a frame 31 surrounding the adsorption plate 30. A wafer can be placed on the adsorption surface 33 of the surface of the adsorption plate 30. A suction source 32 for causing an attraction force acting on the adsorption surface 33 is connected to the adsorption plate 30.

The grinding means 4a, 4b shown in Fig. 1 are a main shaft 40 having a Z-axis direction axis, a motor 41 for rotating the main shaft 40, a mounting seat 42 attached to the lower end of the main shaft 40, and a mounting seat 42 mounted on the mounting base 42. The grinding wheel 43 is constructed. On the lower surface of the grinding wheel 43, there are a plurality of grinding vermiculite 44 fixed in an annular shape. The grinding vermiculite 44 constituting the grinding means 4a is a coarsely ground vermiculite, and the grinding vermiculite constituting the grinding means 4b is a vermiculite for fine grinding.

The grinding feed means 5a, 5b are a ball screw 50 having a Z-axis direction axis, a pulse motor 51 for rotating the ball screw 50, a pair of guide rails 52 arranged in parallel with the ball screw 50, and a ball screw 50. The elevating plate 53 is rotated by the guide rail 52 to elevate and lower. Grinding means 4a, 4b are respectively fixed to the lift plate 53, and are formed so that the lift means 53 can be raised and lowered by the rotation of the ball screw 50, and the grinding means 4a, 4b can also be raised and lowered.

The transfer area 12 is provided with wafer cassette mounting areas 6a and 6b for respectively receiving the wafer cassette 60a of the wafer before grinding and the wafer containing the ground wafer. The wafer cassette 60b is placed. As shown in FIG. 3, the wafer W accommodated in the wafer cassette 60a is formed into a substantially circular shape, and is formed by dividing the predetermined line L on the surface (first surface) W1 to form a plurality of elements D. . Further, the opposite surface of the surface W1 is the back surface (second surface) W2 where the element is not formed. On the peripheral portion of the wafer W, a notch N as a mark for identifying a crystal orientation is formed to be recessed toward the center of the wafer W.

As shown in FIG. 1, between the wafer cassette 60a and the wafer cassette 60b, the wafer W before the grinding is carried out from the wafer cassette 60a, and the wafer W after the grinding is carried into the wafer cassette 60b. Means 61. The loading/unloading means 61 includes an arm portion 610 that is bendable and movable, and a holding portion 611 that is attached to the distal end of the arm portion 610 and that sucks and holds the wafer W. In the movable range of the holding portion 611, a temporary stage 62 for aligning the wafer W to a fixed position and a cleaning means 63 for cleaning the wafer W after the grinding process are disposed. The cleaning means 63 is provided with a rotary table 630 for holding the wafer W to be cleaned for rotation, and for discharging the cleaning liquid and the high-pressure air to the wafer W held on the rotary table 630. The nozzle of the figure is not shown.

In the vicinity of the temporary stage 62, a wafer transfer means 64 for transporting the wafer W before grinding from the temporary stage 62 to the work stage 3 located in the transfer area 12 is disposed. Further, a transfer means 65 adjacent to the wafer transfer means 64 for transferring the ground wafer W from the work chuck 3 to the cleaning means 63 is disposed. The wafer transfer means 64 includes a holding portion 640 that holds the wafer W and an arm portion 641 that moves the holding portion 640 in the horizontal direction and in the vertical direction. Similarly, the transfer means 65 includes an arm portion 651 that moves the holding portion 650 in the horizontal direction and the vertical direction.

A protective tape transporting means 7 for transporting a protective tape to be attached to the wafer W is disposed above the work chuck 3 located in the handover area 12. The protective tape transporting means 7 includes a rail 70 that is placed across the turntable 2 in the X-axis direction, a moving portion 71 that moves in the X-axis direction along the rail 70, and a moving portion 71 that moves in the X-axis direction along the rail 70. Holding portion 72. The holding portion 72 is provided with a suction plate that sucks and holds the wafer at the lower end.

The protective tape storage means 8 is disposed in the vicinity of one of the ends of the rail 70 constituting the protective tape transporting means 7, and the release paper discarding means 9 is disposed in the vicinity of the other end. As shown in FIG. 4, the protective tape storage means 8 is formed in a cylindrical shape in which a plurality of protective tapes 100 can be stacked.

The protective tape 100 is a tape that is attached to the surface W1 of the wafer W shown in FIG. 3 to protect the element D, and as shown in FIG. 5, is an adhesive layer of the sheet 101 and the surface 101a of the sheet 101. 102 constitutes. The back surface 101b of the sheet 101 is in an exposed state, and the back surface 101b becomes the back of the protective tape 100. surface. The sheet 101 and the adhesive layer 102 are formed with a plurality of pores 104 penetrating in the thickness direction, and have air permeability. This fine hole 104 can be formed by, for example, irradiating laser light toward the thickness direction of the protective tape 100. The diameter of each of the fine holes 104 is, for example, 0.1 mm, and the interval P between the adjacent fine holes 104 is, for example, about 5 mm. Ideally, this interval is fixed. Further, as the protective tape 100, for example, a tape which is formed into a mesh-like material by a hole penetrating the front surface and the back surface may be used.

A release paper 103 is adhered to the adhesive layer 102. On the release paper 103, a plurality of sheets penetrating in the thickness direction are formed at positions corresponding to the fine holes 104 formed in the sheet 101 and the adhesive layer 102 (that is, at positions facing the fine holes 104). In the pores 105, the protective tape 100 and the release paper 103 as a whole have air permeability in the thickness direction from the surface (the exposed surface of the release paper 103) to the back surface (the back surface 101b of the sheet 101). In the case where the wafer W shown in FIG. 2 is formed into a substantially circular shape, the protective tape 100 and the release paper 103 are also formed in a substantially circular shape having substantially the same shape as the wafer W. Further, the protective tape 100 may not have a notch corresponding to the notch N formed on the wafer W. Further, in the case where the wafer is formed into, for example, a rectangular shape, the protective tape is also formed in a rectangular shape.

As shown in Fig. 6, the release paper discarding means 9 is formed into a tubular shape in which a plurality of used release papers 103 which are peeled off from the adhesive layer 102 shown in Fig. 5 are laminated.

2 Grinding device action

Hereinafter, the grinding apparatus 1 when the protective tape 100 shown in FIG. 5 is attached to the surface W1 of the wafer W shown in FIG. 3 and the back surface W2 of the wafer W is ground is used. The action is explained.

(1) Protective tape loading step

First, the moving portion 71 of the protective tape conveying means 7 shown in Fig. 1 is moved in the +X direction, and the holding portion 72 is moved above the protective tape storing means 8. Then, the holding portion 72 is lowered, and as shown in FIG. 7, the holding portion 72 is caused to suck the release paper 103 of the protective tape 100. Then, after the holding portion 72 is raised in this state, the moving portion 71 is moved in the -X direction, and the protective tape 100 is positioned above the working table 3 located in the handover region 12. Next, the holding portion 72 is lowered, and the back surface of the protective tape 100 (the back surface 101b of the sheet 101) is placed on the adsorption surface 33 of the work chuck 3.

After the back surface of the protective tape 100 is placed on the adsorption surface 33, the suction force is applied from the suction source 32 shown in FIG. 2 to the adsorption surface 33, and as shown in FIG. 8, the holding portion 72 is attracted as it is. In the state where the release paper 103 is placed, the holding portion 72 is rotated by, for example, about several degrees in the direction of the arrow A, and as shown in FIG. 9, the slack 106 is formed on the release paper 103. Then, by raising the holding portion 72, the release paper 103 is peeled off from the adhesive layer 102, and the adhesive layer 102 is exposed. The pores 105 of the release paper 103 are formed at positions corresponding to the pores 104 of the protective tape 100. Since the pores 104 are opened to the atmosphere through the pores 105, even if the attraction force acts on the adsorption surface 33, The pores 104 also do not form a negative pressure. Therefore, there is no case where the release paper 103 is attracted by the attraction force acting on the adsorption surface 33, and only the protective tape 100 is attracted. According to this, when the holding portion 72 sucks the release paper 103 and rises, since only the release paper 103 rises, the release paper 103 can be smoothly peeled off from the adhesive layer 102. Also, by forming the slack 106 in advance to peel the paper first A gap is formed between the 103 and the adhesive layer 102, and the release paper 103 can be more easily peeled off from the adhesive layer 102. As described above, the protective tape transporting means 7 also has a function of peeling off the release paper 103 from the adhesive layer 102 of the protective tape 100 as a peeling means.

The holding portion 72 holding the release paper 103 is moved in the -X direction and positioned above the release paper discarding means 9 shown in Fig. 6. Then, by lowering the holding portion 72 and releasing the suction of the holding portion 72, the used release paper 103 is stored in the release paper discarding means 9.

(2) Wafer transfer step

On the other hand, the wafer cassette loading/unloading means 61 shown in FIG. 1 carries out the wafer W before grinding from the wafer cassette 60a, and conveys it to the temporary stage 62. Further, the wafer W is aligned on the temporary stage 62 at a predetermined position.

Next, the holding portion 640 of the wafer transfer means 64 holds the side of the back surface W2 of the wafer W that has been placed on the temporary stage 62. Then, as the arm portion 641 is raised and rotated, the wafer W is positioned above the protective tape 100 that has been placed on the adsorption surface 33 of the working chuck 3 located in the handover region 12, and the arm portion 641 is lowered. Thereby, the surface W1 side of the wafer W is placed on the adhesive layer 102 of the protective tape 100. When the surface W1 side of the wafer W is placed on the adhesive layer 102 in this manner, the holding portion 640 rises and retreats after the attraction force is released.

(3) Attraction step

Next, the suction source 32 shown in FIG. 2 causes an attractive force to act on the adsorption surface 33 of the work chuck 3 on which the protective tape 100 and the wafer W are placed. Since the fine holes 104 are formed on the protective tape 100, and from the back side of the protective tape 100 to the sticky Since the upper surface of the layer 102 has air permeability, the surface W1 of the wafer W can be attracted through the protective tape 100 by applying an attractive force to the adsorption surface 33, whereby the surface W1 of the wafer W can be attached. On the adhesive layer 102 of the protective tape 100. As shown in FIG. 10, in a state where the surface W1 of the wafer W is adhered to the adhesive layer 102 of the protective tape 100, the back surface W2 of the wafer W is exposed.

(4) Grinding step

Next, by rotating the turntable 2 by a predetermined angle (120 degrees in the example of FIG. 1), the wafer W having the surface W1 attached to the protective tape 100 is moved below the grinding means 4a. Then, as shown in FIG. 11, the work chuck 3 is rotated in the arrow B direction at a rotational speed of, for example, 300 rpm, and the grinding wheel 43 is rotated while rotating at a rotational speed of, for example, 6000 rpm in the direction of the arrow C. 5a lowers the grinding means 4a, and causes the rotating rough grinding grindstone 44 to contact the back surface W2 of the wafer W to coarsely grind the back surface W2.

When the back surface W2 of the wafer W is coarsely ground by a predetermined amount, the surface W1 can be attached to the wafer with the protective tape 100 and the back surface W2 is roughly ground by rotating the turntable 2 by a predetermined angle (120 degrees). W moves to the lower side of the grinding means 4b. Then, while the grinding wheel 43 is rotated, the grinding feed means 5b lowers the grinding means 4b, and the rotating fine grinding grindstone 44 is brought into contact with the back surface W2 of the wafer W to refine the back surface W2. Cutting, when the wafer W is formed to a predetermined thickness, the grinding is ended.

During the rough grinding and the completion of the steps, the protective tape mounting step, the wafer transfer step, and the suction step are performed on the wafer W to be ground next. When required for each grinding with each wafer When the required time is compared, since the time required for the protective tape mounting step, the wafer transfer step, and the attraction step is short, the waiting time during the grinding of the other wafer W can be utilized, and the next step is to be ground. The surface W1 of the wafer W is attached to the protective tape to make the productivity good.

(5) Washing step

Next, by rotating the turntable 2 shown in FIG. 1 by a predetermined angle (120 degrees), the wafer W that has been finely ground and attracted and held on the work chuck 3 is returned to the transfer area 12. Then, after the arm portion 651 of the transfer means 65 is rotated and lowered to suction the back surface W2 of the wafer W, and the arm portion 651 is raised and rotated, the wafer W is moved to the top of the rotary table 630 of the cleaning means 63. The arm portion 651 is lowered to place the wafer W on the rotary table 630. Next, the attraction force acts on the turntable 630 to suck and hold the protective tape 100 adhering to the surface W1 of the wafer W, and the suction formed by the holding portion 650 of the transfer means 65 is released.

Then, the rotary table 630 is rotated, and the cleaning liquid is ejected from the nozzle (not shown) toward the back surface W2 of the wafer W to remove the grinding debris. Further, after that, the rotary table 630 is rotated, and high-pressure air is ejected toward the back surface W2 of the wafer W to remove the cleaning liquid.

(6) Containment steps

The wafer W on which the back surface W2 has been cleaned is held by the holding portion 611 of the loading and unloading means 61 to hold the protective tape 100 side, and the arm portion 610 is swung and raised and lowered, and is accommodated in the wafer cassette 60b.

As described above, in the grinding device 1, since the protective tape 100 can be attached to the wafer W without using a protective tape attached to the device Therefore, it is possible to release the portion of the factory's installation area where the protective tape is attached to the device.

Further, in the present embodiment, although the work chuck 3 is arranged in three in the example of Fig. 1, one or two or four or more may be used. In the case where only one of the work chucks 3 is disposed, the turntable 2 is not required, and in this case, it is only necessary to linearly move one of the work clamps between the handover region 12 and the processing region 11 in the ±Y direction. The institution can be.

In the present embodiment, the protective tape transporting means 7 is also configured as a peeling means for peeling the release paper 103 from the protective tape 100. However, the peeling means may be provided separately from the protective tape transporting means 7. Composition. However, it is preferable to use a configuration in which the protective tape transporting means 7 also serves as a peeling means, and the apparatus configuration can be simplified.

In the present embodiment, the release paper 103 is placed on the adhesive layer 102 of the protective tape 100, and the surface W1 of the wafer W is applied to the adhesive layer 102 after the release paper 103 is peeled off. However, in the case where the back surface 101b of the sheet 101 constituting the protective tape 100 has the same function as the release paper, the release paper 103 becomes unnecessary.

In the present embodiment, the grinding device will be described. However, it is applicable to a processing device other than the grinding device as long as the protective tape is attached to one surface of the wafer. this invention.

1‧‧‧ grinding device

2‧‧‧ Turntable

3‧‧‧Working table

11‧‧‧Processing area

12‧‧‧ handover area

30‧‧‧Adsorption plate

4a, 4b‧‧‧ grinding means

40‧‧‧ Spindle

41‧‧‧Motor

42‧‧‧ Mounting

43‧‧‧ grinding wheel

44‧‧‧ grinding diamonds

5a, 5b‧‧‧ grinding feed means

50‧‧‧Rolling screw

51‧‧‧ pulse motor

52‧‧‧rails

53‧‧‧ lifting plate

6a, 6b‧‧‧Facsimile loading area

60a, 60b‧‧‧ wafer cassette

61‧‧‧ Move in and out

610, 641, 651‧‧ ‧ arm department

611, 640, 650, 72‧‧‧ Keeping Department

62‧‧‧Premium

63‧‧‧ Washing means

630‧‧‧Rotating table

64‧‧‧ Wafer transfer means

65‧‧‧Transfer means

7‧‧‧Protection tape transport means

70‧‧‧ Track

71‧‧‧Mobile Department

8‧‧‧Protective tape storage means

9‧‧‧Disposal of discarded paper

±X, ±Y, ±Z‧‧‧ directions

Claims (6)

A grinding device having at least a working clamping table and a grinding means, wherein the working clamping table has an adsorption surface for holding a first surface of the wafer, and the grinding means grinds the second surface held on the working clamping table The grinding device includes at least a protective tape transporting means, and a back surface of the protective tape having a venting property from the front surface to the back surface and having an adhesive layer on the surface and having a shape substantially the same as that of the wafer is placed on the working chuck On the adsorption surface, the wafer transfer means places the first surface of the wafer on the adhesive layer of the protective tape that has been placed on the adsorption surface; and the attraction generating means causes the attraction force to act on the adsorption The first side of the wafer is attracted through the protective tape so that the first side of the wafer is attached to the adhesive layer of the protective tape. A grinding apparatus according to claim 1, wherein a release paper is adhered to the adhesive layer of the protective tape, and a plurality of fine pores are formed from the release paper to the back surface of the protective tape to cause air permeability. The grinding device of claim 2, further comprising a protective tape storage means and a peeling means for stacking and storing a plurality of protective tapes, the peeling means loading the release paper from the work clamping table The adhesive layer of the protective tape on the adsorption surface is peeled off, and the protective tape transporting means is to protect the protective tape from the protection The tape storage means is carried to the suction surface of the work chuck. A protective tape attaching method, wherein a protective tape is attached to the first surface of the wafer having the first surface and the second surface, and the method includes at least: a protective tape loading step, which will a back surface of the protective tape having a gas permeable surface and an adhesive layer on the surface and having a shape substantially the same as that of the wafer is placed on the adsorption surface of the work chuck; the wafer transfer step carries the first side of the wafer Placed on the adhesive layer of the protective tape that has been placed on the adsorption surface; and a suction step that causes attraction to act on the adsorption surface and attracts the first side of the wafer through the protective tape to make the wafer One side is attached to the adhesive layer of the protective tape. A protective tape comprising at least a sheet, an adhesive layer laid on a surface of the sheet, and a plurality of pores penetrating the sheet and the adhesive layer to cause air permeability. The protective tape of claim 5, wherein a release paper is adhered to the adhesive layer, and a plurality of fine holes corresponding to the fine holes formed in the adhesive layer are formed on the release paper.