JP5669461B2 - Spinner cleaning device - Google Patents

Description

  The present invention relates to a spinner cleaning apparatus that cleans a wafer by supplying cleaning water while rotating a wafer such as a semiconductor wafer.

  A semiconductor wafer on which a plurality of imaging devices such as CCD and CMOS are formed is ground to a predetermined thickness by grinding the back surface with a grinding machine, and then divided into individual imaging devices by a cutting machine (dicing machine). The obtained imaging device is widely used in electric devices such as digital cameras, video cameras, and mobile phones.

  When dust adheres to the surface of an image pickup device such as a CCD or CMOS, the image pickup function partially deteriorates and the quality deteriorates. Therefore, the wafer divided into individual image pickup devices and attached to a dicing tape is It is immediately cleaned by a spinner cleaning device attached to the cutting device to prevent the attachment of cutting waste (for example, JP-A-2006-339435).

JP 2006-339435 A

  However, in the conventional spinner cleaning apparatus, when the wafer is dried by the high speed rotation of the spinner table after the cleaning is completed, a stagnation occurs in the air current generated by the high speed rotation of the spinner table, and the mist is floating in this There is a problem that contaminants fall and adhere to the surface of the dried wafer, degrading the quality of devices such as imaging devices.

  The present invention has been made in view of these points, and an object of the present invention is to provide a spinner cleaning apparatus that does not cause stagnation in the airflow generated by the high-speed rotation of the spinner table.

According to the present invention, a spinner table that rotates while sucking and holding a wafer, cleaning water supply means that supplies cleaning water to the wafer held by the spinner table, an annular outer peripheral side wall and an annular inner periphery surrounding the spinner table A cleaning water receiving container having a side wall and a bottom wall, and the cleaning water supply means are formed on the outer side of the annular outer peripheral side wall so as to be separated from the cleaning position for cleaning the wafer held by the spinner table and from above the spinner table. spinner having a drive means for rotating between a retracted position housed in has been receptacle, and an exhaust means for exhausting the air in the container receiving detergent connected to the bottom wall of the container receiving cleaning water purified water In the cleaning apparatus, the cleaning water supply means is formed at a rotating shaft connected to the driving means, an arm integrally connected to the rotating shaft and extending in a horizontal direction, and a tip of the arm. And a washing water jetting nozzle for injecting wash water to the wafer held on the spinner table, the annular peripheral side wall, when positioning the cleaning water supply means to the retracted position to be housed in the housing section, said receiving opening to allow passage of the cleaning water supply means is formed, closed cover the washing water supply means, when the cleaning water supply means housed in said housing section, which closes the housing opening And a plurality of flexible curtains are suspended from the accommodation opening, and when the cleaning water supply means is positioned at the cleaning position, the curtain is A spinner cleaning device is provided that closes an accommodation opening .

According to the present invention, after the wafer is cleaned, when the spinner table to dry the wafer is rotated at a high speed, the cleaning water supply means together are housed in the housing formed in the annular peripheral side wall of the receiving wash water container Since the housing opening is closed by the closing cover, no stagnation occurs in the air flow generated in the washing water receiving container, and the scattered mist-like contaminants are smoothly exhausted by the exhaust means and dried on the surface of the wafer. Contamination does not fall and adhere, and the quality of devices such as an imaging device is not deteriorated.

Further, since the curtain which is divided into a plurality having flexibility in the receiving opening is arranged suspended, in receptacle in the cleaning water supply means is to wash the position is in a wafer in the cleaning position It is possible to prevent the mist of cleaning water from entering.

It is an external appearance perspective view of the cutting device provided with the spinner cleaning apparatus of this invention. It is a perspective view of the semiconductor wafer supported by the annular frame via the dicing tape. It is a partially broken perspective view of the spinner cleaning apparatus of the embodiment of the present invention in a state where the spinner table is raised. It is a longitudinal cross-sectional view of the spinner cleaning apparatus shown in FIG. It is a perspective view of a spinner cleaning device in a state where the spinner table is lowered. It is a longitudinal cross-sectional view of the spinner cleaning apparatus shown in FIG. It is a longitudinal cross-sectional view at the time of spin drying.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device (dicing device) 2 provided with a spinner cleaning device according to an embodiment of the present invention is shown.

  On the front side of the cutting device 2, there is provided operating means 4 for an operator to input instructions to the device such as machining conditions. In the upper part of the apparatus, there is provided a display means 6 such as a CRT for displaying a guidance screen for an operator and an image taken by an imaging means described later.

  As shown in FIG. 2, on the surface of the wafer W to be diced, the first street S1 and the second street S2 are formed orthogonally, and the first street S1 and the second street S2 A large number of imaging devices D such as a CCD and a CMOS are formed on the wafer W.

  The wafer W is attached to a dicing tape T that is an adhesive tape, and the outer peripheral edge of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the frame F via the dicing tape T, and a plurality of wafers (for example, 25 sheets) are accommodated in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a cassette elevator 9 that can move up and down.

  Behind the wafer cassette 8, a loading / unloading means 10 for unloading the wafer W before cutting from the wafer cassette 8 and loading the wafer after cutting into the wafer cassette 8 is disposed. Between the wafer cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which a wafer to be carried in / out, is temporarily placed, is provided. Positioning means 14 for positioning at a certain position is provided.

  In the vicinity of the temporary placement area 12, transport means 16 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed, and the wafer W carried to the temporary placement area 12 is It is sucked by the transport means 16 and transported onto the chuck table 18 and is sucked by the chuck table 18 and is held on the chuck table 18 by fixing the frame F by a plurality of clamps 19.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction. Above the movement path of the chuck table 18 in the X-axis direction, an alignment unit 20 that detects a street to be cut of the wafer W is provided. It is arranged.

  The alignment unit 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be cut by a process such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 is displayed on the display unit 6.

  On the left side of the alignment means 20, a cutting means 24 for cutting the wafer W held on the chuck table 18 is disposed. The cutting means 24 is configured integrally with the alignment means 20, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting means 24 is configured by attaching a cutting blade 28 to the tip of a rotatable spindle 26 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 28 is located on the extended line of the imaging means 22 in the X-axis direction.

  Reference numeral 30 denotes a spinner cleaning apparatus according to an embodiment of the present invention that cleans and spin-drys a wafer that has been cut. The wafer W that has been cut by the cutting means 24 is used to remove attached cutting waste and the like on a chuck table. 18 is moved to the wafer carry-in / carry-out position in the X-axis direction, and is then gripped by the transfer means 25 movable in the Y-axis direction and transferred to the spinner cleaning device 30. Reference numeral 32 denotes a lid which is transported by the transport means 25 and covers the upper part of the spinner cleaning device 30 when the wafer W is cleaned and spin-dried, and has a plurality of through holes 33.

  Hereinafter, the spinner cleaning apparatus 30 according to the embodiment of the present invention will be described in detail with reference to FIGS. 3 to 7. The spinner cleaning device 30 includes a spinner table mechanism 34 and a cleaning water receiving mechanism 36 that surrounds the spinner table table mechanism 34.

  The spinner table mechanism 34 includes a spinner table 38, an electric motor 40 that rotationally drives the spinner table 38, and a support mechanism 42 that supports the electric motor 40 so as to be movable in the vertical direction.

  The spinner table 38 includes a suction holding portion 38a made of a porous material, and the suction holding portion 38a communicates with a suction means (not shown). Therefore, the spinner table 38 sucks and holds the wafer on the suction holding portion 38a by placing the wafer on the suction holding portion 38a and applying a negative pressure by suction means (not shown).

  The spinner table 38 is connected to the output shaft 40 a of the electric motor 40. The support mechanism 42 includes a plurality of (three in the present embodiment) support legs 44, and a plurality of (three in the present embodiment) air cylinders 46 respectively connected to the support legs 44 and attached to the electric motor 40. Consists of

  The support mechanism 42 configured in this manner operates the air cylinder 46 to move the electric motor 40 and the spinner table 38 to the wafer loading / unloading position, which is the raised position shown in FIGS. 3 and 4, and FIGS. 6 can be positioned at a work position which is a lowered position shown in FIG.

  The cleaning water receiving mechanism 36 includes a cleaning water receiving container 48, three supporting legs 50 (only two are shown in FIGS. 3 and 5) that support the cleaning water receiving container 48, and an output shaft 40a of the electric motor 40. And a cover member 52 attached to the cover.

  The washing water receiving container 48 includes an annular outer peripheral side wall 48a, a bottom wall 48b, and an annular inner peripheral side wall 48c, and defines a chamber 51 therein. A hole 41 into which the output shaft 40a of the electric motor 40 is inserted is provided at the center of the bottom wall 48b, and the annular inner peripheral wall 48c is formed so as to protrude upward from the periphery of the hole 41. .

  As shown in FIG. 3, a plurality of holes 49 are formed in the bottom wall 48b, and an annular ridge 54 for receiving waste liquid dropped from the holes 49 is formed on the lower surface of the bottom wall 48b. A waste liquid port 55 is formed in the annular spear 54, and a drain hose 56 connected to a suction source is connected to the waste liquid port 55.

  The cover member 52 is formed in a disc shape and includes a cover portion 52a that protrudes downward from the outer peripheral edge thereof. When the electric motor 40 and the spinner table 38 are positioned at the work position shown in FIG. 6, the cover member 52 configured in this manner is positioned outside the annular inner peripheral wall 48 c that constitutes the cleaning water receiving container 48. It is positioned to polymerize with a gap.

  An accommodation wall 58 defining an arcuate accommodation portion 60 is integrally formed on the annular outer peripheral side wall 48 a of the cleaning water receiving container 48. The cleaning water supply means 62 includes a rotating shaft 66, an arc-shaped arm 68 extending horizontally from the upper end of the rotating shaft 66, and a cleaning water spray nozzle 70 formed at the tip of the arc-shaped arm 68. Composed.

  The rotating shaft 66 is connected to an electric motor 64 that can be rotated forward and reversely and is attached to the bottom wall 58 a of the receiving wall 58. When the electric motor 64 is driven, the cleaning water supply means 62 is rotated between the retracted position accommodated in the accommodating portion 60 shown in FIG. 3 and the cleaning position shown in FIG.

  As best shown in FIG. 5, an arc-shaped closing cover 72 is supported on the arm 68 of the cleaning water supply means 62 via a support member 74. 4 and 6, when the cleaning water supply means 62 is rotated to the retracted position and stored in the storage portion 60 on the annular outer peripheral wall 48a of the cleaning water receiving container 48, the cleaning is performed. An accommodation opening 71 that allows passage of the water injection nozzle 70 is formed.

  As shown in FIGS. 3 and 4, when the cleaning water supply means 62 is positioned at the retracted position, the closing cover 72 closes the accommodation opening 71. The cleaning water supply means 62 is connected to a cleaning water supply source that supplies cleaning water composed of pure water and compressed air (not shown).

  Hereinafter, the operation of the spinner cleaning apparatus 30 configured as described above will be described. When the semiconductor wafer W is divided into the individual image pickup devices D, the chuck table 18 is returned to the wafer loading / unloading position, and the suction holding of the wafer W is released here.

  Then, the wafer W is transported to the spinner table 38 of the spinner cleaning device 30 by the transport means 25, and is sucked and held by the suction holding portion 38a positioned at the raised position as shown in FIGS.

  At this time, the cleaning water supply means 62 having the rotating shaft 66, the arm 68, and the cleaning water injection nozzle 70 is accommodated in the accommodating portion 60 that is a retreat position isolated from above the spinner table 38. The accommodation opening 71 is closed by a closing cover 72.

  When cleaning the wafer W sucked and held by the spinner table 38, the air cylinder 46 is driven and the spinner table 38 is lowered and positioned at the work position shown in FIGS.

  Further, the rotating shaft 66 is rotated by driving the motor 64 so that the cleaning water spray nozzle 70 is positioned on the wafer W held by the spinner table 38, and the cleaning water spray nozzle 70 is sprayed with pure water and air. The wafer W is cleaned by rotating the wafer W at a low speed (for example, 300 rpm) while spraying the cleaning water.

  At the time of this cleaning, the housing opening 71 is provided with a flexible curtain 76 that hangs down, so that the wafer W is cleaned while spraying the cleaning water from the cleaning water spray nozzle 70. It is possible to prevent the mist-like contaminants from entering the housing opening 71 during the operation.

  Waste liquid used for cleaning the wafer W and containing contaminants such as cutting waste is discharged into the annular ridge 54 from the hole 49 formed in the bottom wall 48b of the cleaning water receiving container 48, and further drained from the annular ridge 54. The air is sucked into the suction source through the mouth 55 and the drain hose 56.

  When cleaning is completed, the rotating shaft 66 is rotated by the motor 64, the cleaning water supply means 62 is returned to the retracted position as shown in FIG. 7, and the accommodation opening 71 is closed by the closing cover 72. In this state, the spinner table 38 is rotated at, for example, 3000 rpm by the motor 40 while operating the suction source as the exhaust means, and the spin drying of the cleaned wafer W is performed.

  At the time of spin drying, the arm 68 and the cleaning water jet nozzle 70 are retracted from the chamber 51, and the accommodation opening 71 formed in the annular outer peripheral wall 48a of the cleaning water receiving container 48 is closed by the closing cover 72. The airflow generated in the chamber 51 does not stagnate, the scattered mist-like contamination is smoothly exhausted by the exhaust means, and the mist-like contamination does not fall and adhere to the surface of the dried wafer W. The quality of a device such as an imaging device is not degraded.

  Note that the upper portion of the spinner cleaning device 30 is closed by a lid 32 during cleaning of the wafer W and during spin drying.

2 Cutting device 18 Chuck table 24 Cutting means 30 Spinner cleaning device 34 Spinner table mechanism 38 Spinner table 40 Motor 48 Washing water receiving container 60 Arc-shaped container 62 Washing water supply means 64 Motor 66 Rotating shaft 68 Arm 70 Washing water injection nozzle 71 Accommodation opening 72 Closure cover 76 Curtain

Claims (1)

A spinner table that rotates while sucking and holding a wafer, cleaning water supply means for supplying cleaning water to a wafer held by the spinner table, an annular outer peripheral side wall, an annular inner peripheral side wall, and a bottom wall surrounding the spinner table A cleaning water receiving container, a cleaning position for cleaning the wafer held by the spinner table, and a container formed on the outside of the annular outer peripheral wall, separated from above the spinner table. drive means for rotating between a retracted position to be housed, a spinner cleaning apparatus and an exhaust means for exhausting the air in the container receiving detergent connected to the bottom wall of the container receiving cleaning water purified water ,
The cleaning water supply means includes a rotating shaft connected to the driving means, an arm integrally connected to the rotating shaft and extending in the horizontal direction, and a wafer formed at the tip of the arm and held by the spinner table. A cleaning water jet nozzle for jetting cleaning water to
The annular outer peripheral side wall is formed with a storage opening that allows the cleaning water supply means to pass through when the cleaning water supply means is positioned at a retracted position stored in the storage portion.
The washing water supply means, when the cleaning water supply means housed in said housing section, with closed cover which closes the housing opening is arranged,
The accommodating opening is provided with a plurality of flexible curtains hanging down, and the curtain closes the accommodating opening when the cleaning water supply means is positioned at the cleaning position. A spinner cleaning device.

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