JP2015015400A - Processing device - Google Patents

Processing device Download PDF

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JP2015015400A
JP2015015400A JP2013142148A JP2013142148A JP2015015400A JP 2015015400 A JP2015015400 A JP 2015015400A JP 2013142148 A JP2013142148 A JP 2013142148A JP 2013142148 A JP2013142148 A JP 2013142148A JP 2015015400 A JP2015015400 A JP 2015015400A
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workpiece
cleaning
sheet
housing
shutter member
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斌 呉
Takeshi Go
斌 呉
将二郎 山田
Shiyoujiro Yamada
将二郎 山田
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a processing device which reduces the possibility of damage of a sheet-like shutter member and inhibits a cleaning liquid from scattering to the exterior of a housing.SOLUTION: A cutting device includes: a chuck table; cutting means which cuts a processed object W held by the chuck table; and cleaning means 50 which cleans the processed object W cut by the cutting means. The cleaning means 50 includes: a spinner table 51; a cleaning nozzle 52 which jets a cleaning liquid CL; a housing 53 which houses the spinner table 51 etc.; and a sheet-like shutter member 55. The sheet-like shutter member 55 has flexibility and fully closes an opening 56 of the housing 53 during cleaning of the processed object W. The sheet-like shutter member 55 includes ventilation pores 55a which allow a gas to flow into the housing 53 and inhibit droplets D Of the cleaning liquid CL scattering in the housing 53 from passing.

Description

本発明は、加工装置の特に洗浄手段に関する。   The present invention relates to a processing device, particularly a cleaning means.

半導体デバイス製造工程においては、半導体ウエーハ等のワークの表面に格子状の分割予定ラインにより多数の矩形状のデバイス領域を区画して、これらデバイス領域の表面にICやLSI等からなる電子回路を形成し、次いで裏面を研削してから研磨するなど必要な処理を施してから、ワークを分割予定ラインに沿って切断、分割して1枚のワークから多数のデバイスを得ている。   In the semiconductor device manufacturing process, a large number of rectangular device areas are defined on the surface of a workpiece such as a semiconductor wafer by grid-like division lines, and electronic circuits such as ICs and LSIs are formed on the surface of these device areas. Then, after performing necessary processing such as grinding after polishing the back surface, the workpiece is cut and divided along a predetermined division line to obtain a large number of devices from one workpiece.

ワークを分割する装置としては、高速回転させた切削ブレードをワークに切り込ませて切断する切削手段と、切断したワークを洗浄するスピンナ洗浄装置を備えた切削装置が知られている(特許文献1)。該スピンナ洗浄装置は、円筒状の筐体内に配設された保持テーブルにワークを吸着、保持して保持テーブルを回転させ、回転するワークに向けて洗浄ノズルから洗浄液を噴出させてワークを洗浄し、次いで、エアノズルからワークにエアを噴出させてワークを乾燥させるといった構成となっている。また、洗浄液が筐体から外部に飛散しないよう、筐体はシート状の部材が開口を塞ぐように構成されている(特許文献2)。   As a device for dividing a workpiece, there is known a cutting device provided with a cutting means for cutting a workpiece by cutting a cutting blade rotated at high speed into the workpiece and a spinner cleaning device for cleaning the cut workpiece (Patent Document 1). ). The spinner cleaning device adsorbs and holds a workpiece on a holding table disposed in a cylindrical casing, rotates the holding table, and jets cleaning liquid from a cleaning nozzle toward the rotating workpiece to clean the workpiece. Then, the work is dried by ejecting air from the air nozzle to the work. Further, the casing is configured such that a sheet-like member closes the opening so that the cleaning liquid does not scatter from the casing to the outside (Patent Document 2).

特開2006−128359号公報JP 2006-128359 A 特開2012−94659号公報JP 2012-94659 A

この種の洗浄装置では、流速の早い洗浄液を高速で回転するワークに噴射させるため、洗浄液がワークに供給されると汚れたミストが発生する。そこで上記筐体にダクトを設け、ダクトを介して筐体内の空気を吸引してミストを外部に排出している。よって、筐体内は陰圧に傾いているが、筐体の開口を完全に塞いでしまうと、シート状の部材が撓んでしまい、開閉ができなくなったり、破損してしまう虞があり、その対策として、1/4〜1/5程度の領域を残して開口を遮蔽しており、開口の遮蔽されていない部分から、多少ながら洗浄中に飛散する洗浄液が筐体外に飛び出してしまっている。   In this type of cleaning apparatus, a cleaning liquid having a high flow rate is sprayed onto a work rotating at a high speed, so that a dirty mist is generated when the cleaning liquid is supplied to the work. Therefore, a duct is provided in the casing, and air in the casing is sucked through the duct to discharge mist to the outside. Therefore, the inside of the housing is inclined to negative pressure, but if the housing opening is completely blocked, the sheet-like member may bend and open / close may be damaged, or countermeasures may be taken. As described above, the opening is shielded leaving a region of about ¼ to 5, and the cleaning liquid scattered slightly during the cleaning has jumped out of the casing from the portion where the opening is not shielded.

本発明は、上記に鑑みてなされたものであって、破損する虞を抑制しながらも筐体外へ洗浄液が飛散することを抑制できる加工装置を提供することを目的とする。   This invention is made | formed in view of the above, Comprising: It aims at providing the processing apparatus which can suppress that a washing | cleaning liquid disperses outside a housing | casing, suppressing the possibility of damaging.

上述した課題を解決し、目的を達成するために、本発明の加工装置は、被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、該加工手段で加工された該被加工物に洗浄液を供給し該被加工物を洗浄する洗浄手段と、を備えた加工装置であって、該洗浄手段は、該被加工物を保持する保持テーブルと、該保持テーブルに保持された該被加工物に向かって該洗浄液を噴出する洗浄ノズルと、該保持テーブルと該洗浄ノズルを収容し、該被加工物の通過を許容する開口を上面に備えた筐体と、一端が吸引源に連通し、他端が筐体に接続された該筐体内の該洗浄液を含んだ雰囲気を排気する排気ダクトと、該被加工物の洗浄時に該筐体の該開口を全閉する可撓性を備えたシート状シャッター部材と、を有し、該シート状シャッター部材は、該筐体内への気体の流入を許容し、該筐体内で飛散する該洗浄液の液滴の通過を抑制する通気細孔を備えることを特徴とする。   In order to solve the above-described problems and achieve the object, a processing apparatus of the present invention includes a chuck table that holds a workpiece, a processing unit that processes the workpiece held on the chuck table, and the processing A cleaning means for supplying a cleaning liquid to the workpiece processed by the means and cleaning the workpiece, wherein the cleaning means includes a holding table for holding the workpiece; A cleaning nozzle that ejects the cleaning liquid toward the workpiece held by the holding table, a housing that houses the holding table and the cleaning nozzle, and has an opening on the upper surface that allows the workpiece to pass through. A body, one end communicating with the suction source, and the other end connected to the casing, the exhaust duct for exhausting the atmosphere containing the cleaning liquid in the casing, and the opening of the casing when cleaning the workpiece Sheet-like shutter member with flexibility to fully close The sheet-like shutter member is provided with ventilation pores that allow gas to flow into the casing and suppress the passage of the droplets of the cleaning liquid scattered in the casing. .

また、前記加工装置は、前記シート状シャッター部材の前記通気細孔は、2mm以上でかつ8mm以下であることが望ましい。   In the processing apparatus, it is preferable that the ventilation pores of the sheet-like shutter member are 2 mm or more and 8 mm or less.

そこで、本発明の加工装置は、シート状シャッター部材に通気を確保しつつ洗浄中に飛散する洗浄液の液滴の通過を抑制する程度の小さい通気細孔を形成している。このために、加工装置は、開口を全閉しても筐体中の排気によってシート状シャッター部材が撓む事を抑制することができ、かつ筐体外へ洗浄液が飛散することを抑制する事が可能となった。また、シート状シャッター部材に通気細孔を形成するという安価な対策で、安価なシート状シャッター部材の利用価値を増大するという効果も奏する。   In view of this, the processing apparatus of the present invention is formed with small ventilation pores that prevent passage of droplets of the cleaning liquid scattered during cleaning while ensuring ventilation in the sheet-like shutter member. For this reason, the processing apparatus can prevent the sheet-like shutter member from being bent by the exhaust in the housing even when the opening is fully closed, and can prevent the cleaning liquid from scattering outside the housing. It has become possible. Further, an inexpensive measure of forming ventilation pores in the sheet-like shutter member has an effect of increasing the utility value of the inexpensive sheet-like shutter member.

図1は、実施形態に係る切削装置の構成例を示す図である。Drawing 1 is a figure showing the example of composition of the cutting device concerning an embodiment. 図2は、実施形態に係る切削装置の洗浄手段の概略を示す側断面図である。FIG. 2 is a side sectional view showing an outline of the cleaning means of the cutting apparatus according to the embodiment. 図3は、図2に示された洗浄手段から被加工物を搬出する際の概略を示す側断面図である。FIG. 3 is a side sectional view showing an outline when the workpiece is unloaded from the cleaning means shown in FIG.

本発明を実施するための形態(実施形態)につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。   DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

〔実施形態〕
本発明の実施形態に係る加工装置としての切削装置を図面に基いて説明する。図1は、実施形態に係る切削装置の構成例の概略を示す斜視図である。図2は、実施形態に係る切削装置の洗浄手段の概略を示す側断面図である。図3は、図2に示された洗浄手段から被加工物を搬出する際の概略を示す側断面図である。
Embodiment
A cutting apparatus as a processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating an outline of a configuration example of a cutting apparatus according to an embodiment. FIG. 2 is a side sectional view showing an outline of the cleaning means of the cutting apparatus according to the embodiment. FIG. 3 is a side sectional view showing an outline when the workpiece is unloaded from the cleaning means shown in FIG.

本実施形態に係る切削装置1(加工装置に相当)は、切削ブレード21を有する切削手段20(加工手段に相当)と被加工物W(図1に示す)を保持するチャックテーブル10とを少なくとも備え、これらを相対移動させることで、被加工物Wを切削加工(加工に相当)するものである。また、切削装置1は、切削手段20で切削加工された被加工物Wを洗浄手段50で洗浄するものである。   A cutting apparatus 1 (corresponding to a processing apparatus) according to this embodiment includes at least a cutting means 20 (corresponding to a processing means) having a cutting blade 21 and a chuck table 10 that holds a workpiece W (shown in FIG. 1). The workpiece W is cut (corresponding to machining) by providing and relatively moving them. The cutting apparatus 1 is for cleaning the workpiece W cut by the cutting means 20 with the cleaning means 50.

切削装置1は、図1に示すように、切削加工前後の被加工物Wを収容する図示しないカセットエレベータと、前記チャックテーブル10と、前記切削手段20と、前記洗浄手段50と、制御手段(図示せず)を備えている。さらに、切削装置1は、チャックテーブル10と切削手段20とをX軸方向に相対移動させるX軸移動手段(図示せず)と、チャックテーブル10と切削手段20とをY軸方向に相対移動させるY軸移動手段30と、チャックテーブル10と切削手段20とをZ軸方向に相対移動させるZ軸移動手段40と、切削加工前の被加工物Wをカセットエレベータからチャックテーブル10に搬送する第1の搬送手段(図示せず)と、切削加工後の被加工物Wをチャックテーブル10と洗浄手段50とカセットテーブルとの間で搬送する第2の搬送手段60(図3に示す)とを備えている。   As shown in FIG. 1, the cutting apparatus 1 includes a cassette elevator (not shown) that accommodates a workpiece W before and after cutting, the chuck table 10, the cutting means 20, the cleaning means 50, and control means ( (Not shown). Furthermore, the cutting apparatus 1 relatively moves the chuck table 10 and the cutting means 20 in the Y-axis direction, and an X-axis moving means (not shown) that relatively moves the chuck table 10 and the cutting means 20 in the X-axis direction. Y-axis moving means 30, Z-axis moving means 40 for relatively moving the chuck table 10 and cutting means 20 in the Z-axis direction, and a first for conveying the workpiece W before cutting to the chuck table 10 from the cassette elevator. Transporting means (not shown), and second transporting means 60 (shown in FIG. 3) for transporting the workpiece W after cutting between the chuck table 10, the cleaning means 50, and the cassette table. ing.

ここで、被加工物Wは、切削装置1により加工される板状の加工対象であり、本実施形態では、互いに直行する分割予定ラインによって区画されたデバイスを複数有した半導体ウエーハや光デバイスウエーハである。被加工物Wは、切削装置1がチャックテーブル10と切削ブレード21を有する切削手段20とを相対移動させて、分割予定ラインに切削加工が施されることで、個々のデバイスに分割される。また、本実施形態では、被加工物Wは、図1に示すように、デバイスが形成された表面の反対側の裏面にダイシングテープTが貼着され、ダイシングテープTに環状フレームFが貼着されて、ダイシングテープTを介して環状フレームFに貼着されている。なお、本発明では、被加工物Wは、分割予定ラインによって区画されたデバイスを複数有したパッケージ基板などであっても良い。   Here, the workpiece W is a plate-like workpiece to be processed by the cutting apparatus 1. In this embodiment, the workpiece W is a semiconductor wafer or an optical device wafer having a plurality of devices partitioned by division lines that are orthogonal to each other. It is. The workpiece W is divided into individual devices by causing the cutting apparatus 1 to relatively move the chuck table 10 and the cutting means 20 having the cutting blade 21 to perform cutting on the division line. Moreover, in this embodiment, as shown in FIG. 1, the workpiece W has a dicing tape T attached to the back surface opposite to the surface on which the device is formed, and an annular frame F attached to the dicing tape T. And is attached to the annular frame F via the dicing tape T. In the present invention, the workpiece W may be a package substrate having a plurality of devices partitioned by the division lines.

カセットエレベータは、被加工物Wを複数枚収容するものであり、切削装置1の装置本体2にZ軸方向に昇降自在に設けられている。   The cassette elevator accommodates a plurality of workpieces W, and is provided on the apparatus main body 2 of the cutting apparatus 1 so as to be movable up and down in the Z-axis direction.

チャックテーブル10は、第1の搬送手段により切削加工前の被加工物Wが搬送されてきて、ダイシングテープTを介して環状フレームFの開口に貼着された被加工物Wを保持するものである。チャックテーブル10は、表面を構成する部分がポーラスセラミック等から形成された円盤形状であり、図示しない真空吸引経路を介して図示しない真空吸引源と接続され、表面に載置された被加工物Wを吸引することで保持する。なお、チャックテーブル10は、X軸移動手段によりX軸方向に移動自在に設けられかつ回転駆動源(図示せず)により中心軸線(Z軸と平行である)回りに回転自在に設けられている。   The chuck table 10 holds the workpiece W that has been transferred to the opening of the annular frame F through the dicing tape T by the workpiece W before being cut by the first transfer means. is there. The chuck table 10 has a disk shape in which a portion constituting the surface is made of porous ceramic or the like, is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown), and is a workpiece W placed on the surface. Hold by sucking. The chuck table 10 is provided so as to be movable in the X-axis direction by the X-axis moving means, and is provided so as to be rotatable around a central axis (parallel to the Z-axis) by a rotation drive source (not shown). .

切削手段20は、チャックテーブル10で保持された被加工物Wを切削加工するものである。切削手段20は、チャックテーブル10に保持された被加工物Wに対して、Y軸移動手段30によりY軸方向に移動自在に設けられ、かつ、Z軸移動手段40によりZ軸方向に移動自在に設けられている。切削手段20は、略リング形状を有する極薄の切削砥石でありかつスピンドル(図示せず)により回転することで被加工物Wに切削加工を施す切削ブレード21などを含んで構成されている。   The cutting means 20 is for cutting the workpiece W held by the chuck table 10. The cutting means 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving means 30 with respect to the workpiece W held on the chuck table 10, and is movable in the Z-axis direction by the Z-axis moving means 40. Is provided. The cutting means 20 is an extremely thin cutting grindstone having a substantially ring shape, and includes a cutting blade 21 that performs cutting on the workpiece W by rotating with a spindle (not shown).

なお、X軸移動手段は、被加工物Wをチャックテーブル10から搬出入する搬出入領域Oと、切削手段20により被加工物Wを切削する加工領域Pとの間で、チャックテーブル10をX軸方向に加工送りさせるものである。加工領域Pでは、チャックテーブル10は加工手段の下方に位置する。なお、搬出入領域Oと加工領域Pとの間には、仕切り扉70(図1に一点鎖線で示す)が設けられている。   The X-axis moving means moves the chuck table 10 between the carry-in / out area O where the workpiece W is carried in and out of the chuck table 10 and the machining area P where the workpiece W is cut by the cutting means 20. It is processed and fed in the axial direction. In the processing area P, the chuck table 10 is located below the processing means. A partition door 70 (indicated by a one-dot chain line in FIG. 1) is provided between the carry-in / out area O and the processing area P.

洗浄手段50は、切削手段20で切削加工された被加工物Wに洗浄液CLを供給し、被加工物Wを洗浄するものである。洗浄手段50は、図2及び図3に示すように、被加工物Wを保持するスピンナーテーブル51(保持テーブルに相当)と、スピンナーテーブル51に保持された被加工物Wに向かって洗浄液CLを噴出する洗浄ノズル52と、筐体53と、排気ダクト54と、シート状シャッター部材55とを有している。   The cleaning unit 50 supplies the cleaning liquid CL to the workpiece W cut by the cutting unit 20 to clean the workpiece W. As shown in FIGS. 2 and 3, the cleaning unit 50 includes a spinner table 51 (corresponding to a holding table) that holds the workpiece W, and a cleaning liquid CL toward the workpiece W held on the spinner table 51. It has a cleaning nozzle 52 that ejects, a housing 53, an exhaust duct 54, and a sheet-like shutter member 55.

スピンナーテーブル51には、チャックテーブル10上の切削加工後の被加工物Wが第2の搬送手段60により搬送されてくる。スピンナーテーブル51は、表面を構成する部分がポーラスセラミック等から形成された円盤形状であり、図示しない真空吸引経路を介して図示しない真空吸引源と接続され、表面に載置された被加工物Wを吸引することで保持する。スピンナーテーブル51は、スピンナーテーブル駆動源(図示せず)が発生する回転力により、中心軸線(Z軸と平行である)回りに回転される。また、スピンナーテーブル51は、エアシリンダなどの昇降手段(図示せず)によりZ軸方向に昇降自在に設けられている。   The workpiece W after cutting on the chuck table 10 is transported to the spinner table 51 by the second transport means 60. The spinner table 51 has a disk shape in which a portion constituting the surface is formed of porous ceramic or the like, is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown), and is a workpiece W placed on the surface. Hold by sucking. The spinner table 51 is rotated around a central axis (parallel to the Z axis) by a rotational force generated by a spinner table drive source (not shown). The spinner table 51 is provided so as to be movable up and down in the Z-axis direction by an elevating means (not shown) such as an air cylinder.

洗浄ノズル52は、スピンナーテーブル51と先端が対向する図2に示す作業位置と、スピンナーテーブル51の表面から先端が退避した図3に示す退避位置とに亘って揺動自在に設けられている。洗浄ノズル52は、作業位置では、先端から洗浄液CLをスピンナーテーブル51が保持した被加工物Wに向かって噴出する。洗浄ノズル52は、退避位置では、洗浄手段50への被加工物Wの出し入れを妨げない(許容する)。   The cleaning nozzle 52 is swingably provided between a work position shown in FIG. 2 where the tip faces the spinner table 51 and a retracted position shown in FIG. 3 where the tip is retracted from the surface of the spinner table 51. The cleaning nozzle 52 ejects the cleaning liquid CL from the tip toward the workpiece W held by the spinner table 51 at the work position. The cleaning nozzle 52 does not prevent (allow) the workpiece W to be taken in and out of the cleaning means 50 at the retracted position.

筐体53は、切削装置1の装置本体2に設けられ、スピンナーテーブル51と洗浄ノズル52とを収容する。筐体53は、被加工物Wの通過を許容する開口56を上面57に備えた箱状に形成されている。排気ダクト54は、一端が図示しない吸引源に連通し、他端が筐体53に接続されている。排気ダクト54は、吸引源により吸引されることで、筐体53内の洗浄液CLを含んだ雰囲気を筐体53及び切削装置1の装置本体2外へ排気する。   The casing 53 is provided in the apparatus main body 2 of the cutting apparatus 1 and accommodates the spinner table 51 and the cleaning nozzle 52. The casing 53 is formed in a box shape having an upper surface 57 with an opening 56 that allows the workpiece W to pass therethrough. The exhaust duct 54 has one end communicating with a suction source (not shown) and the other end connected to the housing 53. The exhaust duct 54 exhausts the atmosphere containing the cleaning liquid CL in the casing 53 to the outside of the casing 53 and the apparatus main body 2 of the cutting apparatus 1 by being sucked by a suction source.

シート状シャッター部材55は、可撓性を備えたものであって、洗浄手段50の被加工物Wの洗浄時に筐体53の開口56を全閉するものである。シート状シャッター部材55は、合成樹脂などで構成されたシート状又はフィルム状に形成され、引張力が作用しない自由状態において、巻付棒58の外周にロール状に巻き付けられた状態に維持される。シート状シャッター部材55は、引張力が作用されることによって巻付棒58の外周から引き出すことができるものである。シート状シャッター部材55の一端は、筐体53の上面57に固定された固定部材59aに取り付けられている。固定部材59aは、開口56の縁部(近傍)に配置されている。   The sheet-like shutter member 55 has flexibility, and fully closes the opening 56 of the housing 53 when the workpiece W is cleaned by the cleaning means 50. The sheet-like shutter member 55 is formed in a sheet-like or film-like shape made of synthetic resin or the like, and is maintained in a state of being wound around the outer periphery of the winding rod 58 in a roll shape in a free state where no tensile force acts. . The sheet-like shutter member 55 can be pulled out from the outer periphery of the winding rod 58 by applying a tensile force. One end of the sheet-like shutter member 55 is attached to a fixing member 59 a fixed to the upper surface 57 of the housing 53. The fixing member 59 a is disposed at the edge (near the edge) of the opening 56.

シート状シャッター部材55の他端は、水平方向に移動自在に設けられかつ水平方向に移動することで、固定部材59aに対して近付いたり離れたりする移動部材59bに取り付けられている。本実施形態では、移動部材59bと固定部材59aとは、X軸方向に並べられ、移動部材59bが固定部材59aよりも加工領域P寄りに配置されている。また、移動部材59bは、エアシリンダなどの移動手段(図示せず)によりX軸方向に移動される。さらに、移動部材59b及びシート状シャッター部材55は、幅方向の両端がガイド部材(図示せず)によりガイドされて、X軸方向に移動することで開口56の上方を移動する。移動部材59bは、最も固定部材59aに近付くと、被加工物Wの開口56内の通過を許容する位置に配置される。移動部材59bは、最も固定部材59aから離れると、平面視において固定部材59aとの間に開口56を挟む位置に配置される。   The other end of the sheet-like shutter member 55 is attached to a moving member 59b which is provided so as to be movable in the horizontal direction and moves toward and away from the fixed member 59a by moving in the horizontal direction. In the present embodiment, the moving member 59b and the fixed member 59a are arranged in the X-axis direction, and the moving member 59b is disposed closer to the processing region P than the fixed member 59a. The moving member 59b is moved in the X-axis direction by moving means (not shown) such as an air cylinder. Further, the moving member 59b and the sheet-like shutter member 55 are guided by guide members (not shown) at both ends in the width direction, and move above the opening 56 by moving in the X-axis direction. When the moving member 59b is closest to the fixed member 59a, the moving member 59b is disposed at a position that allows the workpiece W to pass through the opening 56. When the moving member 59b is farthest from the fixing member 59a, the moving member 59b is disposed at a position where the opening 56 is sandwiched between the moving member 59b and the fixing member 59a in plan view.

シート状シャッター部材55は、エアシリンダにより移動部材59bが固定部材59aから最も離れた位置に配置されると、巻付棒58の外周から引き出されて、図2に示すように、開口56を全閉する(開口56全体を覆う)。なお、本発明では、シート状シャッター部材55と筐体53の開口56との間にはZ軸方向に数mm程度の隙間があっても、シート状シャッター部材55が開口56を全閉する(開口56全体を覆う)という。即ち、本発明では、シート状シャッター部材55は、筐体53の開口56との間に隙間が無い状態で、開口56を全閉する(開口56全体を覆う)ことと、筐体53の開口56との間に数mm程度の隙間がある状態で、開口56を全閉する(開口56全体を覆う)ことを併せて、シート状シャッター部材55が開口56を全閉する(開口56全体を覆う)という。   When the moving member 59b is disposed at the position farthest from the fixed member 59a by the air cylinder, the sheet-like shutter member 55 is pulled out from the outer periphery of the winding rod 58, and as shown in FIG. Close (covers the entire opening 56). In the present invention, even if there is a gap of about several mm in the Z-axis direction between the sheet-like shutter member 55 and the opening 56 of the housing 53, the sheet-like shutter member 55 fully closes the opening 56 ( It covers the entire opening 56). In other words, in the present invention, the sheet-like shutter member 55 fully closes the opening 56 (covers the entire opening 56) with no gap between the sheet-like shutter member 55 and the opening 56 of the housing 53. The sheet-like shutter member 55 fully closes the opening 56 (the entire opening 56 is fully closed) together with the opening 56 being fully closed (covering the entire opening 56) in a state where there is a gap of about several mm between the opening 56 and the opening 56. Cover).

シート状シャッター部材55は、エアシリンダにより移動部材59bが固定部材59aに最も近付いた位置に配置されると、巻付棒58の外周に巻き付けられて、図3に示すように、開口56の略全体を開放し、被加工物Wの開口56内の通過を許容する。   When the moving member 59b is disposed at the position closest to the fixed member 59a by the air cylinder, the sheet-like shutter member 55 is wound around the outer periphery of the winding rod 58, and as shown in FIG. The whole is opened and the workpiece W is allowed to pass through the opening 56.

また、シート状シャッター部材55は、開口56を全閉した状態で筐体53内への気体の流入を許容し、筐体53内で飛散する洗浄液CLの液滴Dの通過を抑制する通気細孔55aを複数備えている。ここで、本発明でいう洗浄液CLの液滴Dの通過を抑制するとは、洗浄液CLの液滴Dの通過を完全に防ぐこと即ち洗浄液CLの液滴Dを通過させないことと、洗浄液CLの液滴Dが洗浄手段50に収容されていない被加工物Wに付着するなどして切削加工において不具合を生じさせない程度のわずかな量の洗浄液CLの液滴Dの通過を許容することをいう。即ち、本発明でいう洗浄液CLの液滴Dの通過を抑制するとは、切削加工において不具合を生じさせないように、洗浄液CLの液滴Dの通過を極力抑制することをいう。   Further, the sheet-like shutter member 55 allows a gas to flow into the housing 53 with the opening 56 fully closed, and suppresses the passage of the droplets D of the cleaning liquid CL scattered in the housing 53. A plurality of holes 55a are provided. Here, suppressing the passage of the droplet D of the cleaning liquid CL in the present invention means that the passage of the droplet D of the cleaning liquid CL is completely prevented, that is, the liquid droplet D of the cleaning liquid CL is not allowed to pass. It means that the liquid droplet D is allowed to pass through a slight amount of the cleaning liquid CL so as not to cause a trouble in the cutting process by, for example, the droplet D adhering to the workpiece W not accommodated in the cleaning means 50. That is, to suppress the passage of the droplet D of the cleaning liquid CL in the present invention means to suppress the passage of the droplet D of the cleaning liquid CL as much as possible so as not to cause a problem in the cutting process.

通気細孔55aは、本実施形態では、平面視が丸形に形成され、シート状シャッター部材55の表面に等間隔に配置されて、シート状シャッター部材55を貫通している。通気細孔55aの直径(大きさ)は、2mm以上でかつ8mm以下に形成されている。なお、本発明では、これに限定されることなく、通気細孔55aの平面形状が種々の形状に形成されてもよく、等間隔に限らず種々の間隔で配置されてもよい。また、通気細孔55aの大きさは、洗浄液CLの表面張力、洗浄液CLとシート状シャッター部材55との濡れ性、及び排気ダクト54の吸引量等に基いて、切削加工において不具合を生じさせないように洗浄液CLの液滴Dの通過を極力抑制できる大きさに適宜設定されるのが望ましい。   In the present embodiment, the ventilation pores 55 a are formed in a round shape in plan view, are arranged at equal intervals on the surface of the sheet-like shutter member 55, and penetrate the sheet-like shutter member 55. The diameter (size) of the vent hole 55a is 2 mm or more and 8 mm or less. In the present invention, the planar shape of the vent hole 55a may be formed in various shapes without being limited to this, and may be arranged at various intervals without being limited to equal intervals. Further, the size of the vent hole 55a is set so as not to cause a trouble in the cutting process based on the surface tension of the cleaning liquid CL, the wettability between the cleaning liquid CL and the sheet-like shutter member 55, the suction amount of the exhaust duct 54, and the like. In addition, it is desirable that the size is appropriately set so that the passage of the droplets D of the cleaning liquid CL can be suppressed as much as possible.

制御手段は、切削装置1を構成する上述した構成要素をそれぞれ制御して、被加工物Wに対する加工動作を切削装置1に行わせるものである。なお、制御手段は、例えばCPU等で構成された演算処理装置やROM、RAM等を備える図示しないマイクロプロセッサを主体として構成されており、加工動作の状態を表示する表示手段(図示せず)や、オペレータが加工内容情報などを登録する際に用いる操作手段(図示せず)と接続されている。   The control means controls the above-described components constituting the cutting apparatus 1 to cause the cutting apparatus 1 to perform a machining operation on the workpiece W. The control means is mainly composed of an arithmetic processing unit constituted by a CPU or the like and a microprocessor (not shown) provided with a ROM, a RAM, etc., and a display means (not shown) for displaying the state of the machining operation, The operation means (not shown) used when the operator registers the machining content information and the like is connected.

次に、実施形態に係る切削装置1の加工動作について説明する。オペレータが加工内容情報を制御手段に登録し、オペレータから加工動作の開始指示があった場合に、切削装置1が加工動作を開始する。加工動作では、制御手段は、切削加工前の被加工物Wを第1の搬送手段によりカセットエレベータからチャックテーブル10まで搬送し、搬出入領域Oにおいてチャックテーブル10に保持する。   Next, the machining operation of the cutting device 1 according to the embodiment will be described. When the operator registers the machining content information in the control means and receives an instruction to start the machining operation from the operator, the cutting device 1 starts the machining operation. In the processing operation, the control means transports the workpiece W before cutting from the cassette elevator to the chuck table 10 by the first transport means, and holds it on the chuck table 10 in the carry-in / out area O.

次に、制御手段は、X軸移動手段によりチャックテーブル10を移動して、撮像手段の撮像した画像の情報に基づいてアライメントを遂行した後、チャックテーブル10と共に被加工物Wを加工領域Pに移動させる。そして、制御手段は、加工内容情報に基づいて、被加工物Wを分割予定ラインなどに沿って切削し、被加工物Wを個々のデバイスに分割する。全ての分割予定ラインなどに切削加工が施されると、制御手段は、チャックテーブル10と共に被加工物Wを搬出入領域Oに移動させ、第2の搬送手段60にチャックテーブル10上の切削加工が施された被加工物Wを洗浄手段50のスピンナーテーブル51上に載置させ、スピンナーテーブル51に保持させる。このとき、移動部材59bが、固定部材59aに最も近付いた位置に配置され、スピンナーテーブル51が、上昇した位置に配置され、洗浄ノズル52が退避位置に配置されている。   Next, the control means moves the chuck table 10 by the X-axis moving means and performs alignment based on the information of the image picked up by the image pickup means, and then moves the workpiece W together with the chuck table 10 to the processing region P. Move. And a control means cuts the workpiece W along a division | segmentation planned line etc. based on processing content information, and divides the workpiece W into each device. When all the division lines are cut, the control means moves the workpiece W together with the chuck table 10 to the carry-in / out area O, and the second conveying means 60 cuts the work on the chuck table 10. The workpiece W subjected to the above is placed on the spinner table 51 of the cleaning means 50 and held on the spinner table 51. At this time, the moving member 59b is disposed at the position closest to the fixed member 59a, the spinner table 51 is disposed at the raised position, and the cleaning nozzle 52 is disposed at the retracted position.

そして、制御手段は、スピンナーテーブル51を降下させるとともに、移動部材59bを固定部材59aから最も離れた位置まで移動させて、シート状シャッター部材55に開口56を全閉させる。さらに、制御手段は、洗浄ノズル52を作業位置まで揺動させる。制御手段は、図2に示すように、スピンナーテーブル51を中心軸線回りに回転させながら、洗浄ノズル52から洗浄液CLを被加工物Wに噴出させて、遠心力による洗浄液CLが移動して被加工物Wの表面から切削屑を除去する(洗い流す)とともに、吸引源を駆動して筐体53内の雰囲気を排気する。このとき、シート状シャッター部材55の通気細孔55aは、筐体53内への気体の流入を許容しつつ洗浄液CLの液滴Dの通過を抑制する。   Then, the control unit lowers the spinner table 51 and moves the moving member 59b to the position farthest from the fixed member 59a to fully close the opening 56 in the sheet-like shutter member 55. Further, the control means swings the cleaning nozzle 52 to the working position. As shown in FIG. 2, the control means jets the cleaning liquid CL from the cleaning nozzle 52 onto the workpiece W while rotating the spinner table 51 around the central axis, and the cleaning liquid CL is moved by the centrifugal force to be processed. The cutting waste is removed (washed away) from the surface of the object W, and the suction source is driven to exhaust the atmosphere in the housing 53. At this time, the vent hole 55a of the sheet-like shutter member 55 suppresses the passage of the liquid droplet D of the cleaning liquid CL while allowing the gas to flow into the housing 53.

被加工物Wの洗浄が終了すると、制御手段は、スピンナーテーブル51の回転及び洗浄ノズル52からの洗浄液CLの噴出を停止させ、洗浄ノズル52を退避位置まで揺動させるとともに、移動部材59bを固定部材59aに最も近付いた位置まで移動させる。そして、シート状シャッター部材55が、開口56を略開放すると、制御手段は、スピンナーテーブル51を上昇させた後、図3に示すように、第2の搬送手段60によりスピンナーテーブル51上の被加工物Wを洗浄手段50外へと搬出し、カセットテーブルに搬送する。   When the cleaning of the workpiece W is completed, the control unit stops the rotation of the spinner table 51 and the ejection of the cleaning liquid CL from the cleaning nozzle 52, swings the cleaning nozzle 52 to the retracted position, and fixes the moving member 59b. Move to the position closest to the member 59a. When the sheet-like shutter member 55 substantially opens the opening 56, the control means raises the spinner table 51, and then the workpiece on the spinner table 51 is processed by the second conveying means 60 as shown in FIG. The article W is carried out of the cleaning means 50 and conveyed to the cassette table.

以上のように、本実施形態に係る切削装置1によれば、シート状シャッター部材55に通気を確保しつつ洗浄中に飛散する洗浄液CLの液滴Dの通過を抑制する程度の小さい通気細孔55aを形成している。このために、切削装置1は、開口56を全閉しても筐体53中の排気によってシート状シャッター部材55が撓む事を抑制することができ、かつ筐体53外へ洗浄液CLが飛散することを抑制する事が可能となった。よって、切削装置1は、シート状シャッター部材55が破損する虞を抑制しながらも筐体53外へ洗浄液CLが飛散することを抑制できる。   As described above, according to the cutting apparatus 1 according to the present embodiment, the ventilation pores are small enough to prevent passage of the droplets D of the cleaning liquid CL that is scattered during the cleaning while ensuring the ventilation of the sheet-like shutter member 55. 55a is formed. For this reason, the cutting apparatus 1 can prevent the sheet-like shutter member 55 from being bent by the exhaust in the housing 53 even when the opening 56 is fully closed, and the cleaning liquid CL is scattered outside the housing 53. It became possible to suppress doing. Therefore, the cutting device 1 can suppress the cleaning liquid CL from being scattered outside the housing 53 while suppressing the possibility that the sheet-like shutter member 55 is damaged.

また、シート状シャッター部材55に通気細孔55aを形成するという安価な対策で、安価なシート状シャッター部材55の利用価値を増大するという効果も奏し、切削装置1は、コストの高騰を抑制できる。   In addition, the inexpensive measure of forming the ventilation pores 55a in the sheet-like shutter member 55 also has the effect of increasing the utility value of the inexpensive sheet-like shutter member 55, and the cutting device 1 can suppress an increase in cost. .

さらに、本発明の発明者は、前述した実施形態に記載された切削装置1のシート状シャッター部材55の通気細孔55aの効果を確認した。結果を以下の表1に示す。   Furthermore, the inventors of the present invention have confirmed the effect of the ventilation pores 55a of the sheet-like shutter member 55 of the cutting apparatus 1 described in the above-described embodiment. The results are shown in Table 1 below.

Figure 2015015400
Figure 2015015400

表1において、比較例1では、直径が10mmの通気細孔55aを複数備えたシート状シャッター部材55を用いて、洗浄手段50により被加工物Wを洗浄した。比較例2では、直径が1mmの通気細孔55aを複数備えたシート状シャッター部材55を用いて、洗浄手段50により被加工物Wを洗浄した。   In Table 1, in Comparative Example 1, the workpiece W was cleaned by the cleaning means 50 using the sheet-like shutter member 55 having a plurality of vent holes 55a having a diameter of 10 mm. In Comparative Example 2, the workpiece W was cleaned by the cleaning means 50 using the sheet-like shutter member 55 having a plurality of ventilation pores 55a having a diameter of 1 mm.

本発明品1では、直径が8mmの通気細孔55aを複数備えたシート状シャッター部材55を用いて、洗浄手段50により被加工物Wを洗浄した。本発明品2では、直径が2mmの通気細孔55aを複数備えたシート状シャッター部材55を用いて、洗浄手段50により被加工物Wを洗浄した。   In the product 1 of the present invention, the workpiece W was cleaned by the cleaning means 50 using the sheet-like shutter member 55 having a plurality of ventilation pores 55a having a diameter of 8 mm. In the product 2 of the present invention, the workpiece W was cleaned by the cleaning means 50 using the sheet-like shutter member 55 having a plurality of ventilation pores 55a having a diameter of 2 mm.

表1の結果によれば、比較例1は、通気細孔55aを通して筐体53外へ飛散する洗浄液CLの液滴Dの量が多すぎて、特に、切削装置1の洗浄手段50付近に洗浄液CLが付着して、切削加工において望ましくないことが明らかとなった。また、表1の結果によれば、比較例2は、通気細孔55aを通して筐体53へ流入する気体の量が少なすぎて、シート状シャッター部材55が変形してしまい、巻付棒58の外周に巻き付けることが困難となり、最悪の場合には、シート状シャッター部材55が破損する虞があって望ましくないことが明らかとなった。   According to the results in Table 1, in Comparative Example 1, the amount of the liquid droplet D of the cleaning liquid CL scattered outside the housing 53 through the ventilation pores 55a is too large. CL was found to be undesirable in the cutting process. Further, according to the results in Table 1, in Comparative Example 2, the amount of gas flowing into the housing 53 through the ventilation pores 55a is too small, and the sheet-like shutter member 55 is deformed. It became difficult to wrap around the outer periphery, and in the worst case, it became clear that the sheet-like shutter member 55 may be damaged, which is undesirable.

表1の結果によれば、本発明品1及び本発明品2は、通気細孔55aを通して筐体53外へ飛散する洗浄液CLの液滴Dの量が少なく(全くなく又は殆どなく)、切削加工において望ましいことが明らかとなった。さらに、本発明品1及び本発明品2は、通気細孔55aを通して十分な量の気体を筐体53へ流入することができ、シート状シャッター部材55が変形することなく、巻付棒58の外周に巻き付けることができ、シート状シャッター部材55が破損する虞がないことが明らかとなった。よって、表1の結果によれば、通気細孔55aの直径を2mm以上でかつ8mm以下とすることで、シート状シャッター部材55が破損する虞を抑制しながらも筐体53外へ洗浄液CLが飛散することを抑制できることが明らかとなった。   According to the results in Table 1, the products 1 and 2 of the present invention have a small amount (no or little) of the liquid droplet D of the cleaning liquid CL scattered outside the housing 53 through the ventilation pores 55a. It became clear that it was desirable in processing. Furthermore, the product 1 of the present invention and the product 2 of the present invention can flow a sufficient amount of gas into the housing 53 through the ventilation holes 55a, and the sheet-like shutter member 55 is not deformed. It has been clarified that the sheet-like shutter member 55 can be wound around the outer periphery and there is no risk of damage. Therefore, according to the results in Table 1, the cleaning liquid CL is discharged to the outside of the housing 53 while suppressing the possibility that the sheet-like shutter member 55 is damaged by setting the diameter of the vent hole 55a to 2 mm or more and 8 mm or less. It became clear that scattering could be suppressed.

前述した実施形態では、被加工物Wに加工としての切削加工を施す切削装置1を示している。しかしながら、本発明は、例えば、被加工物Wに加工としてのレーザー光線を照射して、アブレーション加工や内部に改質層を形成するレーザー加工を施す加工装置としてのレーザー加工装置に適用しても良い。即ち、本発明は、レーザー加工装置の保護膜除去及び洗浄装置に適用しても良い。要するに、本発明は、被加工物Wに種々の加工を施す種々の加工装置に適用しても良い。   In the above-described embodiment, the cutting apparatus 1 that performs cutting as the processing on the workpiece W is shown. However, the present invention may be applied to, for example, a laser processing apparatus as a processing apparatus that irradiates the workpiece W with a laser beam as processing to perform ablation processing or laser processing for forming a modified layer inside. . That is, the present invention may be applied to a protective film removal and cleaning device of a laser processing apparatus. In short, the present invention may be applied to various processing apparatuses that perform various processing on the workpiece W.

なお、本発明は上記実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。   The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

1 切削装置(加工装置)
10 チャックテーブル
20 切削手段(加工手段)
50 洗浄手段
51 スピンナーテーブル(保持テーブル)
52 洗浄ノズル
53 筐体
54 排気ダクト
55 シート状シャッター部材
55a 通気細孔
56 開口
57 上面
W 被加工物
CL 洗浄液
D 液滴
1 Cutting equipment (processing equipment)
10 chuck table 20 cutting means (processing means)
50 Cleaning means 51 Spinner table (holding table)
52 Cleaning nozzle 53 Housing 54 Exhaust duct 55 Sheet-like shutter member 55a Ventilation pore 56 Opening 57 Upper surface W Workpiece CL Cleaning liquid D Droplet

Claims (2)

被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、該加工手段で加工された該被加工物に洗浄液を供給し該被加工物を洗浄する洗浄手段と、を備えた加工装置であって、
該洗浄手段は、
該被加工物を保持する保持テーブルと、
該保持テーブルに保持された該被加工物に向かって該洗浄液を噴出する洗浄ノズルと、
該保持テーブルと該洗浄ノズルを収容し、該被加工物の通過を許容する開口を上面に備えた筐体と、
一端が吸引源に連通し、他端が筐体に接続された該筐体内の該洗浄液を含んだ雰囲気を排気する排気ダクトと、
該被加工物の洗浄時に該筐体の該開口を全閉する可撓性を備えたシート状シャッター部材と、を有し、
該シート状シャッター部材は、
該筐体内への気体の流入を許容し、該筐体内で飛散する該洗浄液の液滴の通過を抑制する通気細孔を備える事を特徴とする加工装置。
A chuck table for holding the workpiece, a processing means for processing the workpiece held on the chuck table, and a cleaning liquid is supplied to the workpiece processed by the processing means to clean the workpiece. A processing device comprising a cleaning means,
The cleaning means includes
A holding table for holding the workpiece;
A cleaning nozzle that ejects the cleaning liquid toward the workpiece held by the holding table;
A housing that houses the holding table and the cleaning nozzle and has an opening on the top surface that allows the workpiece to pass through;
An exhaust duct for exhausting the atmosphere containing the cleaning liquid in the housing, one end of which communicates with a suction source and the other end of which is connected to the housing;
A flexible sheet-like shutter member that fully closes the opening of the housing when the workpiece is cleaned,
The sheet-like shutter member is
A processing apparatus comprising a vent hole that allows gas to flow into the housing and suppresses the passage of the droplets of the cleaning liquid scattered in the housing.
前記シート状シャッター部材の前記通気細孔は、2mm以上でかつ8mm以下であることを特徴とする請求項1記載の加工装置。   The processing apparatus according to claim 1, wherein the ventilation pores of the sheet-like shutter member are 2 mm or more and 8 mm or less.
JP2013142148A 2013-07-05 2013-07-05 Processing device Pending JP2015015400A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019192853A (en) * 2018-04-27 2019-10-31 株式会社ディスコ Cleaning apparatus
JPWO2019244665A1 (en) * 2018-06-22 2020-07-16 住友重機械工業株式会社 Laser annealing method for semiconductor device, semiconductor device, laser annealing method, control device for laser annealing device, and laser annealing device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162435A (en) * 1994-12-06 1996-06-21 Disco Abrasive Syst Ltd Spin cleaning and drying equipment
JP2009260094A (en) * 2008-04-18 2009-11-05 Disco Abrasive Syst Ltd Spinner cleaning device and working device
JP2012015347A (en) * 2010-07-01 2012-01-19 Disco Abrasive Syst Ltd Spinner cleaning device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162435A (en) * 1994-12-06 1996-06-21 Disco Abrasive Syst Ltd Spin cleaning and drying equipment
JP2009260094A (en) * 2008-04-18 2009-11-05 Disco Abrasive Syst Ltd Spinner cleaning device and working device
JP2012015347A (en) * 2010-07-01 2012-01-19 Disco Abrasive Syst Ltd Spinner cleaning device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019192853A (en) * 2018-04-27 2019-10-31 株式会社ディスコ Cleaning apparatus
JP7002400B2 (en) 2018-04-27 2022-01-20 株式会社ディスコ Cleaning equipment
JPWO2019244665A1 (en) * 2018-06-22 2020-07-16 住友重機械工業株式会社 Laser annealing method for semiconductor device, semiconductor device, laser annealing method, control device for laser annealing device, and laser annealing device

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