TWI669201B - Cutting device - Google Patents

Abstract

Shorten the time required for cutting and burr removal.

The cutting device (1) includes: a disk mounting table (4) for holding a plate-shaped workpiece (W); a cutting device (3) for cutting a plate-shaped workpiece by a cutting tool (31); a disk mounting table and a cutting means The cutting feed means (15) for relatively cutting the feed in the X direction; and the burr removing means (5) for removing the burrs of the cutting groove (G) forming the plate-like workpiece. The burr removing means has a burr removing nozzle (51) for spraying high-pressure water onto the upper surface of the plate-shaped workpiece after the cutting tool passes. The burr removing nozzle moves the high pressure water toward the cutting groove while moving relative to the cutting table at the same time as the cutting tool.

Description

Cutting device

The present invention relates to a cutting device for cutting a plate-shaped workpiece using a cutting tool, and more particularly to a cutting device for cutting a package substrate using a cutting tool.

A plate-shaped workpiece such as a package substrate is formed by molding a resin on a substrate made of a resin substrate. The cutting groove after cutting such a plate-like workpiece by the cutting tool generates a burr. In order to remove the burrs, it is proposed to provide a device for removing a burr, in addition to a cutting device for cutting a sheet-like workpiece (for example, Patent Document 1). In addition, as another method of removing the burrs, a method of cutting the plate-shaped workpiece by a cutting tool to form a cutting groove and then rotating the cutting tool to reverse the tracking groove to remove the burr is proposed (for example, a patent) Document 2 or Patent Document 3).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 09-193099

[Patent Document 2] Japanese Patent No. 4394210

[Patent Document 3] Japanese Patent No. 4540421

However, in the burr removing device described in Patent Document 1, since the plate-shaped workpiece needs to be conveyed to the burr removing device after the cutting work is performed on the plate-shaped workpiece by the cutting device, it takes time until the burr removal is completed. problem. Further, in the burr removing method described in Patent Document 2 and Patent Document 3, since the burr removal process is performed after the cutting work on the plate-shaped workpiece, there is a problem that it takes time until the burr removal is completed.

The present invention has been made in view of such problems, and aims to provide a cutting device capable of shortening the time required for cutting and burr removal.

A cutting apparatus according to the present invention includes: a disk mounting table including a plurality of concave portions corresponding to the convex portions having a plurality of convex portions and a plate-shaped workpiece surrounding a remaining portion of the convex portion, and a suction plate shape is attracted to a bottom surface of the concave portion a convex portion of the workpiece, and attracting and holding the remaining region; a cutting means for cutting a plate-like workpiece held by the tray mounting table by a cutting tool; and a cutting feeding means for causing the tray mounting table and The cutting means Cutting feed in the X direction; the index feeding means is such that the disk mounting table and the cutting means are relatively indexed in the Y direction; and the burr removing means is utilized from the cutting The cutting groove for cutting the plate-like workpiece held by the disk mounting table is formed on the burr of the plate-shaped workpiece, and the cutting device is characterized in that the cutting device includes a rotating shaft, and the cutting tool is mounted Capable of rotating; and a cutter cover covering the cutting tool mounted on the rotating shaft, the burr removing means having: a burr removing nozzle having a plate-like workpiece extending in a vertical direction and passing from the lower end toward the cutting tool An injection port for injecting high-pressure water thereon; and a high-pressure water supply means for supplying high-pressure water to the burr removing nozzle, the ejector opening being wider than the width of the cutting groove, the burr removing nozzle system simultaneously facing the cutting means The disk mounting table is relatively moved, and a high-pressure water wider than the cutting groove is sprayed from the ejection port toward the cutting groove to push the plate-like workpiece to the crucible. Stage, and removing the burr is formed in the plate-shaped work piece.

According to this configuration, the burr removing nozzle and the cutting tool simultaneously cut and feed the plate-shaped workpiece, and the burr removing nozzle sprays high-pressure water from the ejection opening to the upper surface of the plate-shaped workpiece after the cutting tool passes. As a result, as a result of jetting high-pressure water to the cutting groove cut by the cutting tool, the burr can be removed while performing the cutting process. Accordingly, the time required for the removal of the burrs is not required, and the time required for the cutting process and the burr removal can be shortened. As a result, the efficiency of the cutting process can be improved.

Furthermore, in the above cutting apparatus of the present invention, the burr removing nozzle faces a cutting groove adjacent to the cutting groove cut by the cutting tool Spray high pressure water.

According to the present invention, the burr removing nozzle and the cutting tool simultaneously perform the cutting feed, and the high-pressure water is sprayed on the plate-shaped workpiece after the cutting tool passes, whereby the time required for the cutting process and the burr removal can be shortened.

W‧‧‧plate work

G‧‧‧Cutting trench

1‧‧‧Cutting device

15‧‧‧Cutting feed means

20‧‧‧Divided feeding means

3‧‧‧ cutting means

31‧‧‧Cutting tools

32‧‧‧ shaft

33‧‧‧Tool cover

4‧‧‧挟盘台

5‧‧‧Mask removal means

51‧‧‧Mask removal nozzle

52‧‧‧High-pressure water supply means

53‧‧‧jet

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus according to this embodiment.

Fig. 2 is a side view of the cutting device according to the embodiment.

Fig. 3 is a side view showing the machining operation of the cutting device according to the embodiment.

Fig. 4 is a side view showing the machining operation of the cutting device according to the embodiment.

Fig. 5 is a top view of the machining operation of the cutting device according to the embodiment.

Hereinafter, the cutting device according to this embodiment will be described with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus according to this embodiment. Fig. 2 is a side view of the cutting device according to the embodiment. Further, in the following, an example of the cutting device will be described, but the configuration of the cutting device according to the present embodiment is not limited thereto. If When cutting a plate-shaped workpiece, it is possible to make the cutting device into any configuration. Furthermore, in Fig. 1, the size of the plate-like workpiece is exaggerated with respect to the tray mounting table.

As shown in FIG. 1 and FIG. 2, the cutting apparatus 1 is configured to relatively move the cutting tool 3 by the disk mounting table 4, and divide the plate-shaped workpiece W held by the disk mounting table 4 into individual wafers. . The plate-shaped workpiece W is composed of a package substrate provided by arranging a plurality of resin projections 61 in the longitudinal direction on the surface of the rectangular resin substrate 60 in the longitudinal direction. The resin substrate 60 is, for example, a PCB substrate. The plate-shaped workpiece W is divided into a plurality of device regions A1 for a semiconductor device in which a plurality of convex portions 61 are disposed and electrodes are disposed therein, and a remaining region A2 around the device region A1. Each of the device regions A1 is divided into a plurality of regions by a grid-shaped dividing line L, and a semiconductor device (not shown) is disposed in each region.

In the plate-like workpiece W, the remaining area A2 is removed as an end material, and the device area A1 is divided into individual wafers along the dividing line L1. Further, the plate-shaped workpiece W is not limited to the substrate for the semiconductor device, and may be a metal substrate for the LED device. Furthermore, it is not limited to the substrate after the wafer is mounted, and may be a substrate before the wafer is mounted. The convex portion 61 of the plate-like workpiece W is formed of, for example, an epoxy resin or a polyoxyn resin. However, if the convex portion 61 can be formed on the resin substrate 60, it may be any resin.

A rectangular opening (not shown) extending in the X-axis direction (cutting direction) is formed on the upper surface of the casing 11. The opening portion and the tray The mounting table 4 is simultaneously covered by the movable X-axis mounting table 12 and the bellows-shaped waterproof cover 13. Below the waterproof cover 13, a ball screw type cutting feed means 15 (see Fig. 2) for moving the disk mounting table 4 in the X-axis direction is provided.

The X-axis mounting table 12 is provided with a top-side rectangular disk mounting table 4 on which the rotating means 14 can rotate. The tray mounting table 4 has a suction surface 41 that holds the plate-shaped mounting table W. A plurality of concave portions 42 corresponding to the plurality of convex portions 61 of the plate-shaped workpiece W are formed on the suction surface 41 of the tray mounting table 4 in the longitudinal direction. Each of the recessed portions 42 of the cymbal mounting table 4 has a depth that matches the height of each of the convex portions 61 of the plate-like workpiece W, and is formed with each convex portion 61 capable of accommodating the plate-shaped workpiece W. A support surface 43 is formed around each recess 42 to support the remaining area A2 around the convex portion 61 of the plate-like workpiece W.

In the suction surface 41 of the cymbal mounting table 4, an entry groove 44 (see FIG. 2) in which the cutting tool 31 enters the predetermined dividing line L of the plate-shaped workpiece W is formed. In the bottom surface (suction surface) 41 of the concave portion 42 of the disk mounting table 4, a plurality of suction holes for sucking and holding the divided wafers W are formed in a region which is divided into a lattice shape by the entrance grooves 44. (No picture). Further, a plurality of suction holes (not shown) that suck and hold the remaining area A2 of the plate-shaped workpiece W are formed on the support surface 43 (the suction surface 41) around the concave portion 42. Each of the suction holes is connected to a suction source (not shown) through a flow path in the tray mounting table 4, respectively.

The tray mounting table 4 reciprocates between the receiving position at the center of the apparatus and the processing position of the cutting means 3. And, Figure 1 shows The tray mounting table 4 is in a standby state at the receiving position. In the casing 11, a pair of guide rails 16 which are parallel to the Y-axis direction are provided on the deep side of one of the corner portions adjacent to the receiving position. The pair of guide rails 16 position the plate-like workpiece W in the X-axis direction.

In the vicinity of the pair of guide rails 16, a first conveyance arm 17 that conveys the plate-shaped workpiece W between the guide rail 16 and the tray mounting table 4 is provided. The L-shaped arm portion 17a is rotated by the first transport arm 17 to transport the plate-shaped workpiece W. Further, a rotator type cleaning mechanism 18 is provided after the tray mounting table 4 at the receiving position. In the cleaning mechanism 18, after the washing water is sprayed toward the rotating rotating table 18a to wash the plate-shaped workpiece W, the drying gas is blown to dry the plate-shaped workpiece W.

A support table 19 that supports the cutting means 3 is provided on the casing 11. The cutting means 3 is positioned above the disk mounting table 4 at the machining position, and is configured to cut the cutting tool 31 from the surface of the plate-shaped workpiece W to cut the plate-shaped workpiece W. The cutting means 3 mounts the cutting tool 31 that cuts the sheet-like workpiece W so as to be rotatable. The cutting means 3 is indexed and fed in the Y-axis direction by the index feeding means 20 so that the cutting means 3 and the disk mounting table 4 relatively move in the Y-axis direction. Further, the cutting means 3 is moved in the Z-axis direction by a lifting means (not shown). The index feeding means 20 and the lifting means are configured by, for example, a ball screw type moving mechanism.

The cutting means 3 is configured to mount the cutting tool 31 at the front end of the rotating shaft 32, and to provide the tool cover 33 so as to cover the outer circumference of the cutting tool 31. The cutting tool 31 is composed of, for example, a ring-shaped washer type cutter. It is formed by bonding a bonding material to an abrasive such as diamond. The cutter cover 33 is formed in a box shape that covers the upper half of the cutting tool 31. The cutter cover 33 is provided with a cutting water nozzle 34 that sprays cutting water toward the cutting portion. Here, the side of the receiving position is regarded as the front with respect to the processing position, and the side of the processing position is regarded as the rear with respect to the receiving position.

The cutting water nozzle 34 is formed in a slightly L shape extending forward from the lower end of the tool cover 33, and the front end of the cutting water nozzle 34 is positioned at a lower half of the cutting tool 31. A plurality of slits 35 are formed at the front end of the cutting water nozzle 34 (refer to FIG. 2). The cutting water is sprayed from the slit 35 toward the cutting tool 31. By supplying the cutting water, the cutting tool 31 that is rotated at a high speed cuts into the sheet-like workpiece W, and the sheet-shaped workpiece W is cut along the dividing line L.

Further, the cutting device 1 is provided with a burr removing means 5 for removing the burrs formed on the upper surface of the plate-like workpiece W. The burr removing means 5 has a plurality of burr removing nozzles 51 for jetting high-pressure water toward the sheet-like workpiece W, and a high-pressure water supply means 52 for supplying high-pressure water to the burr removing nozzles 51. The burr removing nozzle 51 is formed in a cylindrical shape extending in the vertical direction. At the lower end of the burr removing nozzle 51, an injection port 53 for injecting high-pressure water toward the upper surface of the plate-shaped workpiece W after the cutting tool 31 passes is formed (see Fig. 2).

As will be described later in detail, the injection port 53 is formed, for example, in a circular shape, and has a diameter larger than the width (scratch width) of the cutting groove formed by the cutting tool 31. Further, the injection port 53 communicates with a flow path (not shown) formed inside the burr removal nozzle 51, and the flow path is connected via a valve 54. High pressure water supply means 52. The high-pressure water supply means 52 supplies a fluid (high-pressure water) having a high pressure to each of the burr removing nozzles 51 by a compressor (not shown).

The burr removing nozzle 51 is disposed behind the cutter cover 33 (the left side of the sheet of FIG. 2), and the burr removing nozzle 51 and the cutting means 3 are integrally movable. More specifically, the burr removal nozzle 51 is disposed on the upstream side in the cutting feed direction of the plate-shaped workpiece W by the cutting means 3, and is disposed along the radial direction of the cutting tool 31 so as to be removable and formed on the cutting tool 31 The burrs on the cutting groove after cutting. Further, the burr removing nozzle 51 can be disposed so that the cutting tool 31 can remove the burrs formed on the cutting groove previously cut on the cutting groove that is currently being cut. At this time, by providing the burr removing nozzle 51 on the side where the cutting tool 31 is cut (the front side (the right side of the sheet of FIG. 2)), it is possible to prevent the burr of the cutting water that is rolled up by the rotation of the cutting tool 31. Remove.

A second transport arm 21 that transports the plate-shaped workpiece W between the guide rail 4 and the cleaning mechanism 18 is provided on the side surface 19a of the support base 19. The arm portion 21a of the second transport arm 21 extends obliquely, and the arm portion 21a moves in the Y-axis direction to transport the plate-shaped workpiece W. Further, the support base 19 is provided with a cantilever support portion 23 that supports the photographing portion 22 so as to straddle the movement path (X-axis direction) of the tray mounting table 4. The photographing unit 22 protrudes from below the cantilever support portion 23, and the photographing unit 22 photographs the sheet-like workpiece W. The photographing image formed by the photographing unit 22 is aligned by the cutting means 3 and the tray mounting table 4.

At the corner of the housing 11, there is a receiving portion for receiving the device The indicated input means 24. Further, a monitor 25 is disposed on the upper surface of the support table 19. The monitor 25 indicates an image photographed by the photographing unit 22, processing conditions of the sheet-like workpiece W, and the like. Further, the cutting device 1 is provided with a control means 26 for coordinating the respective parts of the control device. The control means 26 is constituted by a processor or a memory that performs various processes. The memory system is composed of one or a plurality of memory media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application.

In the cutting apparatus 1 configured as described above, as shown in FIG. 2, the plate-shaped workpiece W is placed on the tray mounting table 4 with the sheet-like workpiece W facing downward, and the apparatus area A1 is sucked and held on the bottom surface of the recess 42 ( The suction surface 41) is held by the remaining area A2 on the support surface 43 (suction surface 41). The cutting means 3 descends to the height of the sheet-like workpiece W by the cutting tool 31 after the alignment line L is aligned. Further, the plate-shaped workpiece W is cut and fed while the cutting tool 31 is rotated at a high speed, and a cutting groove is formed in the plate-shaped workpiece W. In the cutting process, since high-pressure water is sprayed toward the cutting groove while forming the cutting groove, the burr can be removed while performing the cutting process.

Hereinafter, the machining operation of the cutting device according to the present embodiment will be described with reference to Figs. 2 to 5 . 3 and 4 are side views showing the machining operation of the cutting device according to the present embodiment. Fig. 5 is a top view of the machining operation of the cutting device according to the embodiment.

First, the holding operation of the sheet-like workpiece W will be described. As described in FIG. 2, the sheet-like workpiece W is placed on the tray mounting table 4 with the surface side on which the plurality of convex portions 61 are formed facing downward. At this time, the convex portions 61 of the plate-shaped workpiece W are housed in the respective concave portions 42 of the tray mounting table 4, the device region A1 is in contact with the bottom surface of the concave portion 42, and the remaining region A2 is in contact with the support surface 43. Further, the sheet-like workpiece W is sucked and held by the tray mounting table 4 (suction surface 41) by the negative pressure generated at the attraction surface 41.

Next, an operation of cutting the predetermined line L in the short-side direction of the sheet-like workpiece W will be described. In a state where the plate-shaped workpiece W is sucked and held by the tray mounting table 4, the disk mounting table 4 is rotated by the rotating means 14, as shown in Fig. 3, the cutting feed direction of the cutting feed means 15 ( The X-axis direction is the same as the short-side direction of the plate-shaped workpiece W. Further, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20 (see Fig. 1), and the position of the cutting means 3 is adjusted so that the cutting tool 31 is positioned at the division line L of the sheet-like workpiece W. on.

Next, the cutting means 3 is moved in the Z-axis direction by a lifting means (not shown), and the cutting tool 31 is lowered to a height at which the plate-shaped workpiece W can be completely cut. In addition, the high-pressure water is sprayed from the burr removing nozzle 51 toward the plate-shaped workpiece W, and the cutting wheel 31 is moved in the X-axis direction (cutting feed). The cutting tool 31 intrudes into the inlet groove 44 and cuts the plate-shaped workpiece W along the dividing line L. According to this, the cutting work G along the dividing line L is formed in the plate-like workpiece W. At this time, a burr (not shown) that is wound up along the rotation direction of the cutting tool 31 is generated at the edge portion of the cutting groove G (resin substrate 60).

As described above, after the cutting tool 31 (on the upstream side with respect to the cutting feed direction of the plate-shaped workpiece W) and the plate-shaped workpiece W Above, the high pressure water is sprayed from the ejection port 53 of the burr removing nozzle 51. By the high pressure water colliding with the upper surface of the plate-like workpiece W, the plate-like workpiece W is pushed to the side of the chuck mounting table 4 while being blown off by the conflict with the cutting groove G formed by the cutting tool 31. A burr is produced in the cutting groove G.

In this manner, the cutting groove G can be formed in the plate-shaped workpiece W by the cutting tool 31, and high-pressure water can be sprayed toward the cutting groove G to remove the burrs, and the burr can be removed while performing the cutting process. That is, both the formation of the cutting groove G and the removal of the burr can be performed by one cutting feed. Accordingly, the processing time can be shortened and the processing efficiency can be improved as compared with the configuration in which the burr removal process is required after the formation of the cutting groove G.

When the cutting of the dividing line L of one row is completed, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20, and the cutting tool 31 is positioned on the adjacent dividing line L. Further, the cutting process is performed along the new division planned line L. When the cutting process is completed in all the predetermined dividing lines L in one direction (short side direction), the cutting process of the dividing line L of the other direction (longitudinal direction) orthogonal to the dividing line L in one direction is performed.

The operation of dividing the predetermined line L in the longitudinal direction of the sheet-like workpiece W will be described with reference to FIGS. 4 and 5 . Further, a part of the operation similar to that of FIG. 3 will be omitted from FIG. 4, and the state when the cutting operation is viewed from above will be mainly described with reference to FIG. 5. In addition, in FIG. 5, for the convenience of description, the cutter cover 33 and the division planned line L are not shown, and the cutting groove G is shown by the broken line.

As described above, when the cutting process in the short-side direction is completed, the disk mounting table 4 is rotated by 90 degrees by the rotating means 14, as shown in Figs. 4 and 5, the cutting feed direction of the cutting feed means 15 (X) The axial direction) coincides with the longitudinal direction of the plate-shaped workpiece W. Further, the cutting means 3 is moved in the Y-axis direction by the index feeding means 20, and the position of the cutting means 3 is adjusted so that the cutting tool 31 is positioned on the dividing line L of the sheet-like workpiece W.

Further, similarly to the operation described with reference to Fig. 3, the cutting means 3 moves in the Z-axis direction, and after the height of the cutting tool 31 is adjusted, the high-pressure water is ejected from the burr removing nozzle 51 toward the plate-shaped workpiece W. The disk mounting table 4 is moved in the X-axis direction with respect to the cutting tool 31 that rotates at a high speed (cutting feed). According to this, even in the longitudinal direction, the cutting groove G can be formed on the dividing line L, and the burrs can be removed.

Further, as shown in FIG. 5, the diameter of the ejection opening 53 of the burr removing nozzle 51 is formed larger than the width of the cutting groove G formed by the cutting tool 31 (the thickness of the cutting tool 31). As a result, the high-pressure water sprayed from the injection port 53 also collides with the upper surface of the plate-shaped workpiece W in a state in which the width of the cutting groove G or the thickness of the cutting tool 31 is large. Accordingly, the high-pressure water collides with not only the cutting groove G but also the edge portion of the cutting groove G or the plate-shaped workpiece W around the cutting groove G. As a result, the high-pressure water also collides with the outer side of the cutting groove G, and the plate-shaped workpiece W is pushed downward toward the tray mounting table 4. Further, a burr is formed at the edge portion of the cutting groove G, and the burr can be effectively removed by the high pressure water colliding with the edge portion of the cutting groove G.

As described above, when the cutting apparatus 1 according to the present embodiment is used, the burr removing nozzle 51 and the cutting tool 31 simultaneously cut and feed the plate-shaped workpiece W, and the burr removing nozzle 51 pairs the cutting tool from the ejection opening 53. 31 is sprayed with high-pressure water through the upper surface of the plate-shaped workpiece W. As a result, as a result of jetting high-pressure water to the cutting groove G cut by the cutting tool 31, it is possible to perform burr removal while performing cutting. Accordingly, the time required for the removal of the burrs is not required, and the efficiency of the cutting process can be improved. Further, by spraying high-pressure water onto the upper surface of the plate-shaped workpiece W, not only the effect of removing the burrs but also the effect of washing or cooling the plate-shaped workpiece W can be obtained. Therefore, the cleaning of the sheet-like workpiece W can be performed even in a cutting apparatus having no rotatory type cleaning mechanism.

Further, the present invention is not limited to the above-described embodiments, and various modifications can be made thereto. In the above-described embodiment, the size, shape, and the like shown on the attached surface are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exerted. Further, it can be carried out as appropriate without departing from the scope of the invention.

For example, in the above-described embodiment, the burr removing nozzle 51 is disposed in the rear portion of the cutter cover 33 (the upstream side of the cutting means 3 in the cutting feed direction of the plate-shaped workpiece W), but is not limited thereto. In this configuration. For example, even if the burr removing nozzle 51 is disposed on the side surface of the tool cover 33, it is also possible to apply high pressure water to the adjacent cutting groove G (divided line L) during the cutting process. At this time, it is possible to perform the hair without the impedance of the cutting water which is rolled up by the rotation of the cutting tool 31. Remove it.

In the above embodiment, the injection port 53 is formed in a circular shape, but the configuration is not limited thereto. The ejection opening 53 may be formed in a rectangular shape having a wider slit width, for example.

Further, in the above-described embodiment, the cutting groove 31 is formed so as to be cut in the same direction as the cutting feed direction of the tray mounting table 4, and the cutting groove G is formed. It is not limited to this configuration. Even if the cutting tool 31 is rotated to the opposite direction to the cutting feed direction of the tray mounting table 4, the cutting is performed, and the cutting groove G may be formed.

[Industry use possibility]

As described above, the present invention has an effect of shortening the time required for cutting and burr removal, and is particularly effective for a cutting device that cuts a package substrate by a cutting tool.

Claims (2)

A cutting device comprising: a cymbal mounting table having a plurality of recesses corresponding to the convex portions having a plurality of convex portions and a plate-shaped workpiece surrounding a remaining portion of the convex portions, and suctioning and maintaining a plate shape on a bottom surface of the concave portion a convex portion of the object, and sucking and holding the remaining region; a cutting means for cutting a plate-like workpiece held by the disk mounting table by a cutting tool; and a cutting feeding means for the disk mounting table and the The cutting means relatively cuts the feed in the X direction; the index feeding means causes the disc mounting table and the cutting means to relatively index feed in the Y direction; and the burr removal means is utilized The cutting means for cutting the cutting groove of the plate-shaped workpiece held by the disk mounting table is formed on the burr of the plate-shaped workpiece, and the cutting device is characterized in that the cutting means comprises: a rotating shaft, which is the cutting tool Mounted to be rotatable; and a cutter cover covering the cutting tool mounted on the rotating shaft, the burr removing means having: a burr removing nozzle having a vertical extending from the lower After the upper face of the cutting tool through the working of a plate material of a high pressure water jet ejection port; and a high-pressure water supply means, the burr removal system which high-pressure water supplied nozzle, The ejection opening is wider than the width of the cutting groove, and the burr removing nozzle moves relative to the cutting table at the same time as the cutting means, and the ejection from the ejection opening toward the cutting groove is wider than the cutting groove The high-pressure water pushes the plate-like workpiece to the tray mounting table, and removes the burrs formed on the plate-like workpiece. The cutting device according to claim 1, wherein the burr removing nozzle sprays high-pressure water toward a cutting groove adjacent to the cutting groove cut by the cutting tool.