JP6121265B2 - Cleaning device and processing device - Google Patents

Description

  The present invention relates to a frame unit cleaning apparatus and a processing apparatus including the cleaning apparatus.

  2. Description of the Related Art A cutting device called a dicer equipped with a cutting blade is widely used as a processing device for cutting a plate-like workpiece such as a semiconductor wafer, a ceramic plate, a glass plate, or a resin substrate. The workpiece to be cut by the cutting device is attached in advance to a dicing tape that is an adhesive tape, and is attached to the annular frame via the dicing tape. The workpiece mounted on the annular frame is cut by the cutting blade and divided into a plurality of chips by cutting the workpiece while the cutting blade cuts partway along the thickness direction of the dicing tape. Here, the workpiece divided into the plurality of chips is held on the dicing tape without being scattered. For this reason, the annular frame facilitates the handling of workpieces, dicing tapes and chips.

  A work piece held on a dicing tape and divided into a plurality of chips usually has an unnecessary area called an end material on the outer periphery of a chip (device chip) to be a device. This unnecessary area is also cut and divided in the same way as the device chip, but the divided unnecessary area (end material chip) is often smaller than the device chip and scatters from the dicing tape during processing with the cutting blade. There is. Therefore, for example, as in Patent Document 1, in order to suppress damage to the bellows (bellows cloth) due to the pinching of the end material chip, measures such as covering the bellows with a protective sheet have been taken.

JP 2002-66869 A

  End material chips may scatter from the dicing tape during cleaning in a cleaning chamber equipped with a chuck table surrounded by an outer peripheral wall, and when stored at the bottom of the cleaning chamber, block the drain opening at the bottom, There is a possibility that the cleaning liquid (drainage) used for cleaning the workpiece overflows from the cleaning chamber.

  In order to prevent the cleaning liquid from overflowing from the cleaning chamber, it is necessary to periodically remove the end material chips from the bottom of the cleaning chamber. To perform the cleaning operation to remove the end material chips from the bottom of the cleaning chamber, It is necessary for an operator such as an operator to put a hand in a narrow gap with the outer peripheral wall surrounding the chip and pick up the end material chips accumulated at the bottom. However, the cleaning operation is difficult because the operator puts his hands in a narrow gap and picks up the end material chips, and the operator repeatedly picks up the end material chips, and the number of work steps is large.

  This invention is made | formed in view of the above, Comprising: It aims at providing the washing | cleaning apparatus and processing apparatus which can suppress that the chip | tip of a workpiece is stored in the bottom part of a washing | cleaning chamber.

  In order to solve the above-described problems and achieve the object, the cleaning apparatus of the present invention is a frame unit in which a plate-like workpiece divided into a plurality of chips is supported by an opening of an annular frame via an adhesive tape. A cleaning device for cleaning a workpiece, comprising a holding surface for sucking and holding the workpiece via an adhesive tape, and a chuck table that rotates around a rotation axis orthogonal to the holding surface, and is held by the chuck table A cleaning nozzle that injects cleaning liquid onto the workpiece, an outer peripheral wall that surrounds the chuck table and the cleaning nozzle to form a cleaning chamber, and a space below the chuck table holding surface and between the chuck table and the inner periphery of the outer peripheral wall And a bottomed annular strainer that accepts chips of the workpiece scattered during cleaning, and the annular strainer includes a plurality of arc-shaped strainers connected in the circumferential direction. Te is formed in an annular shape, at least one arcuate strainer, characterized in that it can be detached from the cleaning chamber.

  Moreover, in the said washing | cleaning apparatus, it is preferable to arrange | position the circular arc strainer which adjoins the circumferential direction edge part, and to maintain the diameter of the annular strainer which a several circular arc strainer forms.

  In the cleaning apparatus, it is preferable that the bottom of the annular strainer is formed so as to be lowered toward a predetermined detachable arc-shaped strainer, and the received chip is guided to the predetermined arc-shaped strainer.

  In order to solve the above-described problems and achieve the object, a processing apparatus of the present invention includes a processing chuck table that holds a workpiece of a frame unit, and a workpiece that is held on the processing chuck table. A processing device for processing, further comprising the above-described cleaning device for cleaning the workpiece of the frame unit after processing by the processing means.

  According to the cleaning apparatus of the present invention, since the annular strainer receives the chips of the workpiece scattered during the cleaning, the chip of the workpiece scattered during the cleaning and the cleaning liquid for cleaning the workpiece of the frame unit are annularly formed. It can be separated by a strainer. Therefore, the cleaning apparatus can suppress the chip of the workpiece scattered during cleaning from being stored in the bottom of the cleaning chamber.

  Further, according to the cleaning device, the plurality of arc-shaped strainers are formed in an annular shape in a circumferential direction, and at least one arc-shaped strainer can be detached from the cleaning chamber, so that the workpiece chip can be removed from the cleaning chamber. Cleaning work can be easily performed, and the number of work steps for the cleaning work can be reduced. That is, according to the cleaning device, the arc-shaped strainer that receives the chips scattered during the cleaning is removed from the cleaning device, so that the chips of the workpiece can be easily removed.

  Moreover, according to the processing apparatus of this invention, it can suppress that the chip | tip of the to-be-processed object scattered during washing | cleaning accumulates in the bottom part of a washing | cleaning chamber by providing the said washing | cleaning apparatus.

FIG. 1 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the first embodiment. FIG. 2 is a plan view of the cleaning apparatus shown in FIG. 3 is a cross-sectional view of the cleaning apparatus shown in FIG. FIG. 4 is a diagram illustrating a schematic configuration example of an arcuate strainer included in the cleaning device illustrated in FIG. 2. FIG. 5 is a side view of the arcuate strainer shown in FIG. FIG. 6 is a diagram illustrating a schematic configuration example of a scraping unit for scraping chips scattered during cleaning by the cleaning apparatus according to the first embodiment. FIG. 7 is a side view showing a state where the chip is scraped by the scraping means shown in FIG. FIG. 8 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the second embodiment. FIG. 9 is an explanatory diagram for explaining the inclination of the annular strainer included in the cleaning device according to the second embodiment. FIG. 10 is a diagram illustrating a schematic configuration example of a processing apparatus according to the third embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
FIG. 1 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the first embodiment. FIG. 2 is a plan view of the cleaning apparatus shown in FIG. 3 is a cross-sectional view of the cleaning apparatus shown in FIG. FIG. 4 is a diagram illustrating a schematic configuration example of an arcuate strainer included in the cleaning device illustrated in FIG. 2. FIG. 5 is a side view of the arcuate strainer shown in FIG. As shown in FIG. 1, in the cleaning apparatus 1-1 according to the first embodiment, a plate-like workpiece W divided into a plurality of chips WC is supported by an opening of an annular frame F via an adhesive tape T. The workpiece W of the frame unit U is cleaned. The cleaning device 1-1 includes a chuck table 10, a cleaning nozzle 20, a cleaning chamber 30, and an annular strainer 40.

Here, the workpiece W is not particularly limited, but for example, a plate-like semiconductor wafer or optical device wafer based on silicon, gallium arsenide (GaAs) or the like, ceramic, glass, sapphire (Al ₂ O _3). ) -Based plate-like inorganic material substrates, plate-like ductile materials such as metals and resins, and other plate-like processed materials. In the present embodiment, the workpiece W has an adhesive tape T (also referred to as a dicing tape) attached to the back surface where no device such as an IC (Integrated Circuit) or LSI (Large Scale Integration) is formed. The outer periphery of the adhesive tape T is attached to the annular frame F so that the opening of the annular frame F is supported via the adhesive tape T. In addition, the workpiece W is divided into a lattice shape (in this embodiment, so-called full cut) by cutting, for example, and is divided into a plurality of chips WC. The plurality of chips WC include a device chip DC in which a device is formed and an end material chip SC in which no device is formed on the outer periphery of the device chip DC. The end material chip SC includes a chip smaller than the device chip DC.

  As shown in FIG. 2, the chuck table 10 includes a holding surface 11 and a clamp 12. As illustrated in FIG. 3, the chuck table 10 includes a drive source 13, a shaft portion 14, and a cover portion 15. . The chuck table 10 rotates around a rotation axis orthogonal to the holding surface 11, that is, around the Z axis in this embodiment. The holding surface 11 is made of a disk-shaped porous ceramic or the like and communicates with a vacuum suction source (not shown). The holding surface 11 sucks and holds the workpiece W through the adhesive tape T of the frame unit U by a vacuum suction source. The clamps 12 are disposed on the outer periphery of the chuck table 10, and four clamps 12 are disposed at equal intervals in the circumferential direction of the chuck table 10. The clamp 12 is swung by a centrifugal force generated with the rotation of the chuck table 10 and sandwiches the outer peripheral edge of the annular frame F of the frame unit U held by the chuck table 10. The drive source 13 is for rotating the chuck table 10 and is, for example, an electric motor. The drive source 13 is connected to the chuck table 10 via a shaft portion 14 that is a drive shaft. The drive source 13 is supported so as to be movable up and down by an actuator such as an air piston (not shown). The actuator moves the drive source 13 and the chuck table 10 up and down. The cover portion 15 is formed in a covered cylinder shape having the same outer diameter as that of the chuck table 10. The cover portion 15 is disposed at the lower portion of the chuck table 10. The cover portion 15 covers an opening at the upper end of an inner peripheral wall 33 (described later) of the cleaning chamber 30 during the cleaning of the workpiece W of the frame unit U.

  The cleaning nozzle 20 is an injection nozzle that injects the cleaning liquid L onto the workpiece W held by the chuck table 10. As shown in FIG. 3, the cleaning nozzle 20 has a supply pipe 21, an arm part 22, and a nozzle part 23. The supply pipe 21 communicates with the cleaning liquid supply source 50, and pure water and compressed air, for example, are supplied as the cleaning liquid L from the cleaning liquid supply source 50. The supply pipe 21 is rotationally driven by a rotating means such as an electric motor (not shown). The arm portion 22 extends in parallel to the chuck table 10 from the tip of the supply pipe 21. The arm portion 22 is set to a length that positions the nozzle portion 23 at the rotation center of the chuck table 10. Further, the arm portion 22 is disposed at a retracted position on the outer peripheral wall 31 side that does not interfere with the chuck table 10 before and after cleaning the workpiece W of the frame unit U. The nozzle unit 23 is a so-called two-fluid nozzle that injects the cleaning liquid L using, for example, a high-speed flow of compressed air supplied from the cleaning liquid supply source 50, and the cleaning liquid L is applied to the workpiece W of the frame unit U. Inject towards. The nozzle portion 23 is positioned on the rotation center of the chuck table 10 when the arm portion 22 is directed toward the rotation center of the chuck table 10. The nozzle portion 23 reciprocates on the chuck table 10 in a circular arc shape with the supply tube 21 as a rotation center by the rotation of the supply tube 21.

  As shown in FIG. 3, the cleaning chamber 30 is formed of an outer peripheral wall 31, a bottom 32, and an inner peripheral wall 33. In the cleaning chamber 30, a chuck table 10, a cleaning nozzle 20, and an annular strainer 40 are disposed. The outer peripheral wall 31 is formed in a circular shape corresponding to the outer periphery of the chuck table 10. The outer peripheral wall 31 surrounds the chuck table 10 and the cleaning nozzle 20 and forms a cleaning chamber 30. The outer peripheral wall 31 is provided with an exhaust path 34 communicating with the exhaust means 60 for exhausting the air in the cleaning chamber 30 to the outside. The bottom 32 is formed in an annular shape and has a width that allows the annular strainer 40 to be placed thereon. The bottom 32 is provided with a drain 35 for draining the cleaning liquid L supplied during the cleaning of the workpiece W of the frame unit U from the cleaning chamber 30 to the outside. In addition, a drain opening 35 a communicating with the drain 35 is formed in the bottom portion 32. The drain opening 35 a is disposed on the inner peripheral wall 33 side so as not to interfere with the annular strainer 40 placed on the bottom 32. The inner peripheral wall 33 projects upward from the bottom 32 and is formed in a cylindrical shape facing the outer peripheral wall 31. The inner peripheral wall 33 has a smaller amount of protrusion upward from the bottom 32 than the outer peripheral wall 31. The outer diameter of the inner peripheral wall 33 is smaller than the outer diameter of the chuck table 10, that is, the outer diameter of the cover portion 15. The opening of the upper end of the inner peripheral wall 33 is covered with the cover portion 15 during the cleaning of the workpiece W of the frame unit U.

  The annular strainer 40 receives the chip WC of the workpiece W scattered during the cleaning of the workpiece W of the frame unit U above the bottom 32 of the cleaning chamber 30, and during the cleaning of the workpiece W of the frame unit U. This is a so-called strainer (filter) that separates the chip WC and the cleaning liquid L by flowing the supplied cleaning liquid L to the bottom 32 of the cleaning chamber 30. As shown in FIG. 3, the annular strainer 40 is placed on the bottom 32 of the cleaning chamber 30. In the present embodiment, the annular strainer 40 corresponds to a region between the chuck table 10 and the inner periphery of the outer peripheral wall 31 below the holding surface 11 of the chuck table 10, and the workpiece S that scatters during cleaning. It is formed in a bottomed shape for receiving the chip WC. The annular strainer 40 has an annular shape corresponding to an annular region formed between the outer periphery of the chuck table 10, that is, the outer periphery of the cover portion 15 and the inner periphery of the outer peripheral wall 31. The annular strainer 40 is disposed along the inner periphery of the outer peripheral wall 31 and is disposed away from the outer periphery of the cover portion 15. As shown in FIG. 2, the annular strainer 40 includes a bottom 40a, an outer wall 40b, an inner wall 40c, a leg 40d (see FIG. 3), a hole 40e, and a handle 40f. The outer wall portion 40b and the inner wall portion 40c face each other with the bottom portion 40a interposed therebetween. In the present embodiment, the bottomed shape means a shape having a bottom portion 40a for receiving the chip WC of the workpiece W scattered during cleaning.

  The bottom portion 40a receives the chip WC of the workpiece W scattered from the adhesive tape T of the frame unit U during cleaning. As shown in FIG. 2, the bottom portion 40a has a width corresponding to an annular region formed between the outer periphery of the chuck table 10, that is, the outer periphery of the cover portion 15 (see FIG. 3) and the inner periphery of the outer peripheral wall 31. It is formed in an annular shape. The outer side wall portion 40 b is formed in a cylindrical shape that faces the inner periphery of the outer peripheral wall 31 of the cleaning chamber 30 and extends along the inner periphery of the outer peripheral wall 31. As shown in FIG. 5, the outer wall 40b has a smaller upward protrusion than the inner wall 40c. As shown in FIG. 3, the inner wall portion 40 c is formed in a cylindrical shape that faces the outer periphery of the cover portion 15 and is not in contact with the outer periphery of the cover portion 15. The inner wall 40c has an outer periphery (an outer surface facing the outer periphery of the cover 15) facing the outer periphery of the cover 15 with a gap. The size of the gap between the outer periphery of the inner wall portion 40c and the outer periphery of the cover portion 15 is such that the chip WC of the workpiece W, particularly the end material chip SC, cannot pass through. As shown in FIG. 3, the inner wall portion 40c has a larger upward protrusion than the outer wall portion 40b. The amount of protrusion upward of the inner wall portion 40c is such that the outer wall portion 40b and the inner wall portion 40c face each other and a sufficient amount of chips WC of the workpiece W can be held on the bottom portion 40a. Is set. As shown in FIGS. 4 and 5, the leg portion 40 d is disposed on the back surface of the bottom portion 40 a (the surface facing the bottom portion 32 when the annular strainer 40 is disposed on the bottom portion 32 of the cleaning chamber 30). The hole 40e is a hole having a size that allows the cleaning liquid L supplied during cleaning to pass without passing the chips WC of the workpiece W, particularly the end material chips SC, scattered during the cleaning. The handle 40f is disposed on the surface of the bottom 40a. The handle 40f is a gripping member that is picked up by an operator such as an operator.

  Moreover, in this embodiment, as shown in FIG. 2, the cyclic | annular strainer 40 is formed with the some circular arc shaped strainers 41-45, and is divided | segmented into five at equal intervals in the circumferential direction. That is, the annular strainer 40 is formed in an annular shape by connecting a plurality of arc-shaped strainers 41 to 45 in the circumferential direction. In the arc-shaped strainers 41 to 45, the adjacent ones are arranged with their circumferential ends abutting each other. The arc-shaped strainers 41 to 45 maintain the diameter of the annular strainer 40. The arcuate strainers 41 to 45 are made of, for example, punching metal. The arcuate strainers 41 to 45 have a bottom 40a, an outer wall 40b, an inner wall 40c, a leg 40d (see FIG. 3), and a hole 40e in common. As for the arc shaped strainers 41-45, the leg part 40d is arrange | positioned by the back surface of the circumferential direction edge part side of the both ends of the bottom part 40a. As shown in FIG. 3, the arc-shaped strainers 41 to 45 have their bottom portions 40 a parallel to the holding surface 11 of the chuck table 10, and the bottom portions 40 a are arranged on the same plane. In the arc-shaped strainers 41 to 45, the upper ends of the respective outer wall portions 40b are arranged on the same plane, and the upper ends of the respective inner wall portions 40c are arranged on the same plane. At least one arcuate strainer 45 (predetermined arcuate strainer 45) can be attached to and detached from the cleaning chamber 30 from the arcuate strainers 41 to 45.

  Further, as shown in FIG. 2, the arc-shaped strainers 41 to 45 have a plurality of holes 40 e in the entire surface (the whole) of the bottom portion 40 a. Although the arc-shaped strainers 41 to 45 are not shown, a plurality of holes (holes similar to the holes 40e) are also formed on the entire surface (the whole) of the outer wall portion 40b and the inner wall portion 40c. In addition, it is preferable that the hole 40e which overlaps the leg part 40d arrange | positioned in the back surface of the bottom part 40a among the some holes 40e penetrates the leg part 40d. The arcuate strainers 41 and 44 adjacent to each other across the supply pipe 21 are formed with semicircular supply pipe insertion parts 41 a and 44 a corresponding to the outer periphery of the supply pipe 21 at the circumferential ends that abut each other. The predetermined arcuate strainer 45 is provided with a handle 40f on the surface of the bottom 40a. In the present embodiment, the arc-shaped strainers 41 to 45 can be detached from the cleaning chamber 30.

  The cleaning apparatus 1-1 configured as described above moves the chuck table 10 to a position where the chuck table 10 is transported and placed by an actuator (not shown) (a position where the holding surface 11 of the chuck table 10 and the upper end of the outer peripheral wall 31 are on the same plane). Raise. Next, the cleaning device 1-1 sucks and holds the frame unit U placed on the chuck table 10 by an operator or a transport unit (not shown) by a vacuum suction source (not shown). Next, the cleaning device 1-1 lowers the chuck table 10 to the working position shown in FIG. 3 (position where the cover portion 15 covers the opening at the upper end of the inner peripheral wall 33) by the actuator. Next, the cleaning device 1-1 exhausts the air in the cleaning chamber 30 by the exhaust means 60 through the exhaust path 34. Next, the cleaning apparatus 1-1 rotates the chuck table 10 by the driving source 13 and sandwiches the outer peripheral edge of the annular frame F of the frame unit U by the clamp 12. Next, the cleaning apparatus 1-1 moves the cleaning nozzle 20 from the retracted position to the center of rotation of the chuck table 10 by a rotating unit (not shown). Next, the cleaning device 1-1 sprays the cleaning liquid L from the cleaning nozzle 20 onto the workpiece W of the frame unit U from the cleaning liquid supply source 50, and moves the cleaning nozzle 20 to the workpiece of the frame unit U by the rotating means. Reciprocate on W.

  Here, the cleaning device 1-1 uses the annular strainer 40 to remove the chips WC, particularly the end material chips SC, of the workpiece W scattered from the adhesive tape T of the frame unit U during the cleaning of the workpiece W of the frame unit U. Accept it. Further, the cleaning device 1-1 receives the scattered device chip DC with the annular strainer 40 even if the device chip DC may be scattered during the cleaning of the workpiece W of the frame unit U. In addition, the cleaning device 1-1 cleans the cleaning liquid L sprayed onto the workpiece W of the frame unit U during the cleaning of the workpiece W of the frame unit U through the hole 40 e of the annular strainer 40. The water flows down to the bottom 32 and is drained to the outside through the drain 35 from the drain opening 35a.

  Next, the cleaning device 1-1 stops the supply of the cleaning liquid L by the cleaning liquid supply source 50 after a predetermined time or a time set by the operator, and moves the cleaning nozzle 20 to the retracted position by the rotating means. Let Next, the cleaning device 1-1 stops the rotation of the chuck table 10 by the driving source 13 and releases the outer peripheral edge of the annular frame F of the frame unit U by the clamp 12. Next, the cleaning apparatus 1-1 stops the exhaust by the exhaust unit 60, raises the chuck table 10 to the transport placement position by the actuator, and stops the suction by the vacuum suction source. Next, the cleaning apparatus 1-1 finishes cleaning the workpiece W of the frame unit U by removing the frame unit U from the chuck table 10 by an operator or a transport unit. As described above, the cleaning apparatus 1-1 receives the chip WC of the workpiece W scattered from the adhesive tape T of the frame unit U by the annular strainer 40 during the cleaning of the workpiece W of the frame unit U. It is possible to prevent the drain opening 35 a of the bottom 32 of the chamber 30 from being blocked by the chip WC (end material chip SC or device chip DC) of the workpiece W and to prevent the cleaning liquid L from overflowing from the cleaning chamber 30. .

  Next, a method for removing the chip WC of the workpiece W received by the annular strainer 40 in the cleaning apparatus 1-1 will be described. First, the cleaning device 1-1 supplies the cleaning liquid L, rotates the chuck table 10 and the like in accordance with an instruction input for stopping the cleaning by the operator and an instruction input for removing the chip WC of the workpiece W from the cleaning chamber 30. Stop. Next, the cleaning device 1-1 drives the cleaning device 1-1 after moving the chuck table 10 to the work position shown in FIG. 3 so that the operator can easily collect the chip WC of the workpiece W. For power off.

  Next, the operator collects the chips WC of the workpiece W in a predetermined arc-shaped strainer 45 and then removes the predetermined arc-shaped strainer 45 from the cleaning chamber 30. Next, the operator discards the chip WC of the workpiece W on the predetermined arcuate strainer 45 and then attaches the predetermined arcuate strainer 45 to the cleaning chamber 30. Thereby, the removal work of the chip WC of the workpiece W is completed. As described above, according to the cleaning apparatus 1-1, since the predetermined arc-shaped strainer 45 is detachable from the cleaning chamber 30, the chips WC of the workpiece W are collected on the predetermined arc-shaped strainer 45. By removing the predetermined arc-shaped strainer 45 from the cleaning chamber 30 in this state, the chip WC of the workpiece W can be removed from the cleaning chamber 30. Therefore, according to the cleaning device 1-1, the chip WC of the workpiece W can be easily removed from the cleaning chamber 30 with a small number of work steps.

  Next, with reference to FIGS. 6 and 7, a method for scraping the chips WC of the workpiece W onto the predetermined arc-shaped strainer 45 by the scraping means 70 will be described. FIG. 6 is a diagram illustrating a schematic configuration example of a scraping unit for scraping chips scattered during cleaning by the cleaning apparatus according to the first embodiment. FIG. 7 is a side view showing a state where the chip is scraped by the scraping means shown in FIG. As shown in FIG. 6, the scraping means 70 includes a main body portion 71, a grip portion 72, and a scraper portion 73. The main body 71 is formed with a width corresponding to a region between the opposed outer wall 40b and inner wall 40c. The main body 71 has an outer roller 71a and an inner roller 71b that are rotatably supported by shafts 71c and 71d disposed on both side surfaces. The outer roller 71a has a flange facing the inner periphery (side surface facing the inner wall portion 40c) on the upper end side of the outer wall portion 40b. The inner roller 71b has a flange that opposes the inner periphery (side surface facing the outer wall portion 40b) on the upper end side of the inner wall portion 40c. Each of the rollers 71 a and 71 b is set to have a diameter that makes the main body 71 parallel to the bottom 40 a of the annular strainer 40. Each roller 71a, 71b moves the main body 71 along the annular shape of the annular strainer 40 by using each wall 40b, 40c as a guide rail. The grip 72 is disposed on the upper end of the main body 71. The grip portion 72 is a member that is gripped by an operator. The scraper portion 73 is disposed at the lower end of the main body portion 71. The scraper portion 73 is formed with the same width as the main body portion 71. The scraper unit 73 is made of an elastic member, for example. The scraper unit 73 is a so-called brush or spatula. As shown in FIG. 7, the scraper portion 73 is in sliding contact with the bottom portion 40a of the annular strainer 40 while being elastically deformed, and inserts the tip WC of the workpiece W on the bottom portion 40a in the direction of the arrow (the moving direction of the scraping means 70). Scrap out.

  The operator scrapes the chips WC of the workpiece W on the predetermined arc-shaped strainer 45 by the scraping means 70 configured as described above, and then removes the predetermined arc-shaped strainer 45 from the cleaning chamber 30. Next, the operator discards the chip WC of the workpiece W on the predetermined arcuate strainer 45 and then attaches the predetermined arcuate strainer 45 to the cleaning chamber 30. Thereby, the removal work of the chip WC of the workpiece W is completed. For this reason, according to the cleaning apparatus 1-1, the chip WC of the workpiece W can be efficiently and easily set to the predetermined chip WC more efficiently than the case where the chips WC of the workpiece W are collected on the predetermined arc-shaped strainer 45 by the operator's hand. The arc-shaped strainer 45 can be collected. Therefore, according to the cleaning device 1-1, the scraping means 70 is used, so that the number of work steps can be reduced compared with the case where the chips WC of the workpiece W are collected by the operator's hand, and the chips WC of the workpiece W can be easily obtained. It can be removed from the cleaning chamber 30.

  As described above, according to the cleaning device 1-1 according to the first embodiment, the annular strainer 40 is processed by the workpiece W scattered from the adhesive tape T of the frame unit U during the cleaning of the workpiece W of the frame unit U. The chip WC is received, and the cleaning liquid L used for cleaning the workpiece W is caused to flow from the hole 40 e to the bottom 32 of the cleaning chamber 30. That is, according to the cleaning apparatus 1-1, the chip WC of the workpiece W and the cleaning liquid L are separated, and the cleaning liquid L is caused to flow to the bottom 32. For this reason, according to the cleaning apparatus 1-1, it is possible to prevent the chips WC of the workpiece W scattered during the cleaning from being stored in the bottom portion 32 of the cleaning chamber 30. Therefore, according to the cleaning apparatus 1-1, the drain opening 35a of the bottom 32 of the cleaning chamber 30 can be prevented from being blocked by the chip WC of the workpiece W, and the cleaning liquid L overflows from the cleaning chamber 30. Can be suppressed.

  Further, in the conventional cleaning apparatus in which the chip WC of the workpiece W is stored in the bottom 32 of the cleaning chamber 30, the cleaning liquid L may overflow, and therefore it is necessary to periodically remove the chip WC. According to the cleaning apparatus 1-1, since it is possible to prevent the chip WC of the workpiece W from being stored in the bottom 32 of the cleaning chamber 30, the interval for performing the cleaning operation for removing the chip WC is widened. The number of cleaning operations can be reduced. That is, according to the cleaning device 1-1, the number of cleaning operations performed periodically can be reduced.

  Further, according to the cleaning device 1-1 according to the first embodiment, the annular strainer 40 is formed in an annular shape by connecting a plurality of arcuate strainers 41 to 45 in the circumferential direction, and at least one arcuate strainer 45 (predetermined The arcuate strainer 45) can be detached from the cleaning chamber 30. For this reason, according to the cleaning apparatus 1-1, the chip WC of the workpiece W scattered from the adhesive tape T of the frame unit U during the cleaning and received by the annular strainer 40 becomes a predetermined arc-shaped strainer 45 by the operator. After the collection, when the predetermined arc-shaped strainer 45 is removed from the cleaning chamber 30 by the operator, the chip WC of the workpiece W can be removed from the cleaning chamber 30.

  In addition, in a conventional cleaning apparatus that requires an operator to put a hand in the narrow gap between the chuck table 10 and the outer peripheral wall 31 and pick up the chip WC of the workpiece W at the bottom 32, the operation is difficult. However, according to the cleaning apparatus 1-1, after the chips WC of the workpiece W are collected on the predetermined arc-shaped strainer 45, the predetermined arc-shaped strainer 45 is moved from the cleaning chamber 30 by the operator. Since the chip WC of the workpiece W is removed by the work of removing, the work is easy and the number of work steps is small. That is, according to the cleaning apparatus 1-1, the predetermined arc-shaped strainer 45 is removed from the cleaning chamber 30, so that the chip WC of the workpiece W received by the annular strainer 40 can be easily removed with a small number of work steps. Can do.

  Moreover, according to the cleaning apparatus 1-1 according to the first embodiment, the adjacent arc-shaped strainers 41 to 45 are arranged in a state where the circumferential end portions abut each other, and a plurality of arc-shaped strainers 41 to 45 are formed. The diameter of the annular strainer 40 is maintained. For this reason, according to the washing | cleaning apparatus 1-1, the circumferential direction edge part of the arc-shaped strainers 41-45 can be arrange | positioned without gap.

  Moreover, according to the cleaning apparatus 1-1, the plurality of arc-shaped strainers 41 to 45 are connected in the circumferential direction to form the annular strainer 40. Therefore, the configuration of the annular strainer 40 is simple. Further, according to the cleaning device 1-1, since the diameter of the annular strainer 40 is maintained by the plurality of arcuate strainers 41 to 45, the annular strainer 40 toward the chuck table 10 (individual arcuate strainers 41 to 45). Movement is restricted, and the chuck table 10 and the annular strainer 40 do not interfere with each other. Moreover, according to the cleaning apparatus 1-1, since the annular strainer 40 is divided into a plurality of pieces and is small, it is easy to detach the annular strainer 40 from the cleaning chamber 30.

  Moreover, according to the cleaning apparatus 1-1 according to the first embodiment, the arc-shaped strainers 41 to 45 can be attached to and detached from the cleaning chamber 30, so that the arc-shaped strainers 41 to 45 are detached from the cleaning chamber 30 and the bottom of the cleaning chamber 30 is removed. 32 cleanings can be performed. For this reason, according to the cleaning apparatus 1-1, even if the chip WC of the workpiece W enters the bottom 32 of the cleaning chamber 30, the chip WC of the workpiece W is removed from the bottom 32 of the cleaning chamber 30. Can be removed.

[Embodiment 2]
Next, the cleaning apparatus 1-2 according to the second embodiment will be described. FIG. 8 is a diagram illustrating a schematic configuration example of the cleaning apparatus according to the second embodiment. FIG. 9 is an explanatory diagram for explaining the inclination of the annular strainer included in the cleaning device according to the second embodiment. In the cleaning device 1-2 according to the second embodiment, the bottom 40a of the annular strainer 40 is inclined so that the predetermined arc-shaped strainer 45 collects the chips WC of the workpiece W. Since the basic configuration of the cleaning device 1-2 according to the second embodiment is the same as that of the cleaning device 1-1 according to the first embodiment, description of the configuration of the same portion is omitted.

  As shown in FIG. 8, the cleaning device 1-2 according to the second embodiment includes cleaning water supply units 36 and 37. The cleaning water supply means 36 and 37 supply strainer cleaning water to the annular strainer 40. The cleaning water supply means 36 and 37 have supply ports 36a and 37a for supplying strainer cleaning water. The supply ports 36a and 37a supply strainer cleaning water to the bottom 40a on the circumferential end side where adjacent arcuate strainers 41 and 44 abut against each other with the supply pipe 21 of the cleaning nozzle 20 in between. The supply ports 36a and 37a preferably supply strainer washing water in the arc-tangential direction of the arc-shaped strainers 41 and 44 adjacent to each other. The strainer cleaning water is supplied from a cleaning water supply source 80 that communicates with the supply ports 36a and 37a.

  Further, in the cleaning device 1-2, an annular strainer 40 in which a plurality of holes 40e are formed only in a predetermined arc-shaped strainer 45 is disposed in the cleaning chamber 30. In the annular strainer 40, a predetermined arc-shaped strainer 45 is disposed at a position facing the supply pipe 21 of the cleaning nozzle 20 with the chuck table 10 interposed therebetween. In the annular strainer 40, the arc-shaped strainers 41 to 44 excluding the predetermined arc-shaped strainer 45 have a bowl shape without the hole 40e, and the predetermined arc-shaped strainer 45 has a bowl shape with the hole 40e. As shown in FIG. 9, the bottom portion 40 a of the annular strainer 40 is formed with an inclination that decreases from the cleaning water supply means 36, 37 side toward the hole 40 e of the predetermined arcuate strainer 45. For this reason, as shown by the arrow in FIG. 8, the bottom portion 40a of the annular strainer 40 is supplied with the cleaning liquid L sprayed from the cleaning nozzle 20 and the strainer cleaning water supplied from the cleaning water supply means 36, 37. Guide is performed from the arcuate strainers 41 and 44 adjacent to each other across the 20 supply pipes 21 toward a predetermined arcuate strainer 45. The bottom 40a of the annular strainer 40 guides the tip WC of the workpiece W received by the annular strainer 40 to a predetermined arc-shaped strainer 45 by the flow of the cleaning liquid L and the strainer cleaning water. The outer wall portion 40b of the annular strainer 40 has the same amount of upward protrusion from the bottom portion 40a in each of the plurality of arcuate strainers 41 to 45. Further, the inner wall 40c of the annular strainer 40 has the same amount of upward protrusion from the bottom 40a in each of the plurality of arc-shaped strainers 41-45.

  In the cleaning device 1-2 configured as described above, the cleaning water supply is performed after the outer peripheral edge of the annular frame F of the frame unit U is sandwiched by the clamp 12 in the same manner as the cleaning device 1-1 according to the first embodiment. While the strainer cleaning water is supplied from the cleaning water supply means 36 and 37 to the annular strainer 40 by the source 80, the cleaning liquid L is jetted while the cleaning nozzle 20 is reciprocated.

  Here, the cleaning device 1-2 uses the annular strainer to remove the chip WC (particularly the end material chip SC) of the workpiece W scattered from the adhesive tape T of the frame unit U during the cleaning of the workpiece W of the frame unit U. Accept at 40. The cleaning device 1-2 also includes a tip WC of the workpiece W received by the annular strainer 40, an inclination of the bottom 40a of the annular strainer 40, and strainer cleaning water supplied from the cleaning water supply means 36 and 37. To guide to a predetermined arcuate strainer 45 and collect. Further, the cleaning device 1-2 loops the cleaning liquid L sprayed from the cleaning nozzle 20 and the strainer cleaning water supplied from the cleaning water supply means 36 and 37 during the cleaning of the workpiece W of the frame unit U. The water is drained to the bottom 32 of the cleaning chamber 30 through the hole 40e of the strainer 40.

  Next, the cleaning device 1-2 supplies the cleaning liquid L from the cleaning liquid supply source 50 and the strainer cleaning water from the cleaning water supply source 80 after a predetermined cleaning time or a cleaning time set by the operator has elapsed. And the frame unit U is removed from the chuck table 10 in the same manner as the cleaning device 1-1 according to the first embodiment, and the cleaning of the workpiece W of the frame unit U is completed. As described above, according to the cleaning device 1-2, during the cleaning of the workpiece W of the frame unit U, the tip WC of the workpiece W received by the annular strainer 40 is guided to the predetermined arc-shaped strainer 45, Since the supplied cleaning liquid L and strainer cleaning water are drained from the hole 40e of the annular strainer 40, the drain opening 35a is prevented from being blocked by the chip WC of the workpiece W, and the cleaning liquid L and strainer cleaning water are removed from the cleaning chamber. Overflow from 30 can be suppressed.

  Next, a method for removing the chip WC of the workpiece W received by the annular strainer 40 in the cleaning device 1-2 will be described. First, the operator removes the predetermined arc-shaped strainer 45 from the cleaning chamber 30 after shutting off the power supply of the cleaning device 1-2 itself, similarly to the cleaning device 1-1 according to the first embodiment. Next, the operator discards the chip WC of the workpiece W on the predetermined arcuate strainer 45 and then attaches the predetermined arcuate strainer 45 to the cleaning chamber 30. Thereby, the removal work of the chip WC of the workpiece W is completed. As described above, according to the cleaning device 1-2, even if the chips WC of the workpiece W are not collected by the operator, the chips WC of the workpiece W are guided and collected on the predetermined arc-shaped strainer 45. Therefore, the chip WC of the workpiece W can be easily removed from the cleaning chamber 30 with less work man-hours.

  As described above, according to the cleaning device 1-2 according to the second embodiment, the bottom 40a of the annular strainer 40 is formed so as to be lowered toward the predetermined arc-shaped strainer 45, and the object that has been scattered during cleaning is formed. Since the chip WC of the workpiece W is guided to the predetermined arc-shaped strainer 45, the cleaning liquid L sprayed from the cleaning nozzle 20 can be caused to flow down to the predetermined arc-shaped strainer 45, so that the cleaning water supply means 36, Even if the strainer washing water is not supplied from 37, the chips WC of the workpiece W can be guided to the predetermined arc-shaped strainer 45 and collected.

  Further, according to the cleaning device 1-2, in each of the plurality of arc-shaped strainers 41 to 45, the protruding amount of the outer wall 40b upward from the bottom 40a is the same, and the inner wall 40c from the bottom 40a. Are not guided by the predetermined arcuate strainer 45 by the scraping means 70 (see FIG. 6) that uses the outer wall 40b and the inner wall 40c as guide rails. It is also possible to scrape the chips WC of the workpiece W onto a predetermined arc-shaped strainer 45.

[Embodiment 3]
Next, the processing apparatus 100 according to the third embodiment will be described. FIG. 10 is a diagram illustrating a schematic configuration example of a processing apparatus according to the third embodiment. A processing apparatus 100 according to the third embodiment is a processing apparatus including the cleaning apparatus 1-1 (1-2) according to the first or second embodiment. Since the basic configuration of the cleaning device 1-1 (1-2) is the same as that of the cleaning device 1-1 (1-2) according to the first embodiment or the second embodiment, the description of the configuration of the same portion is omitted.

  The processing apparatus 100 according to the third embodiment is configured to divide the workpiece W of the frame unit U in which the plate-like workpiece W is supported by the opening of the annular frame F via the adhesive tape T into a plurality of chips WC. Device. The processing apparatus 100 includes a cassette 110, a temporary placement means 120, a processing chuck table 130, a processing means 140, an imaging means 150, a first transport means 160, a second transport means 170, and a cassette elevator 180. And a cleaning device 1-1 (1-2).

  The cassette 110 stores the workpieces W of the frame unit U one by one. The temporary placement means 120 temporarily places the workpiece W before and after the processing of the frame unit U temporarily on the pair of temporary placement rails 121 and 122. The machining chuck table 130 sucks and holds the workpiece W of the frame unit U placed on the holding surface 131 by a suction source (not shown). Further, the machining chuck table 130 reciprocates relative to the apparatus main body 101 in the X-axis direction (corresponding to the machining feed direction) by driving means (not shown).

  The processing means 140 processes (cuts) the workpiece W of the frame unit U held on the processing chuck table 130. The processing means 140 includes a cutting blade 141, a spindle 142, a cutting fluid supply nozzle 143, and a driving means 144. The cutting blade 141 is an extremely thin ring-shaped cutting grindstone that cuts the workpiece W of the frame unit U held by the machining chuck table 130 by rotating at high speed. The spindle 142 fixes the cutting blade 141 in a replaceable manner with a fixing nut (not shown) or the like. The cutting fluid supply nozzle 143 supplies the cutting fluid toward the processing point of the cutting blade 141. The drive unit 144 reciprocates the cutting blade 141 relative to the apparatus main body 101 in each of the Y-axis direction (corresponding to the index feed direction) and the Z-axis direction (corresponding to the cutting feed direction).

  The imaging means 150 is, for example, a camera using a CCD (Charge Coupled Device) image sensor. Further, the imaging unit 150 generates image data for adjusting the alignment of the processing unit 140 with respect to the workpiece W of the frame unit U. The first transport unit 160 is a so-called frame transport unit having a chuck unit that sandwiches the periphery of the annular frame F of the frame unit U by driving an actuator such as an air cylinder. The first conveying means 160 conveys the workpiece W of the frame unit U from the machining chuck table 130 to the chuck table 10 of the cleaning device 1-1 (1-2). Similar to the first transport unit 160, the second transport unit 170 is a so-called frame transport unit. The second conveying means 170 conveys the workpiece W of the frame unit U before cleaning from the cassette 110 to the temporary placing means 120, and from the temporary placing means 120 to the machining chuck table 130, and processes the frame unit U after washing. The article W is conveyed to the cassette 110 via the temporary placement means 120. The cassette elevator 180 is movable up and down in the Z-axis direction with respect to the apparatus main body 101 and moves the cassette 110 up and down.

  The cleaning device 1-1 (1-2) is the cleaning device according to the first embodiment or the second embodiment, and the plate-like workpiece W divided into the plurality of chips WC by the processing means 140 is annular. This is a cleaning device for cleaning the workpiece W of the frame unit U (see FIG. 1) supported by the opening of the frame F via the adhesive tape T. The cleaning device 1-1 (1-2) cleans the workpiece W of the frame unit U after processing.

  In the processing apparatus 100 configured as described above, after the workpiece W of the frame unit U before processing is transported from the cassette 110 to the temporary placement means 120 by the second transporting means 170, the frame unit is processed by the processing chuck table 130. U work piece W is held. Next, the processing apparatus 100 causes the imaging unit 150 to image the workpiece W of the frame unit U held on the processing chuck table 130, and based on the image data generated by the imaging unit 150, The alignment with the workpiece W is adjusted. Next, the processing apparatus 100 rotates the cutting blade 141 of the processing means 140 at a high speed and causes the processing means 140 to be relatively cut and fed in the Z-axis direction by the driving means 144 with respect to the processing chuck table 130. The machining chuck table 130 is relatively fed in the X-axis direction by a driving means (not shown) with respect to 140, and the machining means 140 is relatively indexed in the Y-axis direction by the driving means 144 with respect to the machining chuck table 130. By feeding, the dividing line of the workpiece W of the frame unit U is cut while cutting the cutting blade 141 partway along the thickness direction of the adhesive tape T. Next, the machining apparatus 100 cuts all the planned division lines in the same direction, and then rotates the machining chuck table 130 by 90 degrees around the Z axis by a rotating means (not shown), and repeats the same cutting by the machining means 140. Thus, the plate-like workpiece W of the frame unit U is divided into a plurality of chips WC (full cut in this embodiment).

  Next, the processing apparatus 100 transports the workpiece W of the frame unit U from the processing chuck table 130 to the chuck table 10 of the cleaning apparatus 1-1 (1-2) by the first transport unit 160 and then performs cleaning. The workpiece W of the frame unit U is cleaned by the apparatus 1-1 (1-2). Next, the processing apparatus 100 cleans the workpiece W of the frame unit U by the cleaning apparatus 1-1 (1-2), and then the second transport means 170 from the chuck table 10 via the temporary placement means 120. The workpiece W of the frame unit U is transported to the cassette 110, and the processing and cleaning of the workpiece W of the frame unit U are finished. As described above, according to the processing apparatus 100, the chip WC scattered from the adhesive tape T of the frame unit U is removed from the annular strainer during the cleaning of the workpiece W of the frame unit U by the cleaning apparatus 1-1 (1-2). Received at 40. Further, according to the processing apparatus 100, the chip WC of the workpiece W is removed from the cleaning chamber 30 by removing the predetermined arc-shaped strainer 45 from the cleaning chamber 30 by the operator.

  As described above, according to the machining apparatus 100 according to the third embodiment, the machining chuck table 130 that holds the workpiece W of the frame unit U and the workpiece W that is held by the machining chuck table 130 are machined. And a cleaning device 1-1 (1-2) for cleaning the workpiece W of the frame unit U processed by the processing unit 140. For this reason, according to the processing apparatus 100, the chip WC of the workpiece W scattered from the adhesive tape T of the frame unit U is received by the annular strainer 40 while the workpiece W of the frame unit U after processing is being cleaned. Therefore, the processing apparatus 100 prevents the chips WC of the workpiece W scattered during the cleaning from being stored in the bottom 32 of the cleaning chamber 30, and prevents the cleaning liquid L or the strainer cleaning water from overflowing from the cleaning chamber 30. it can.

  Further, according to the processing apparatus 100, the chip WC of the workpiece W can be easily removed from the cleaning chamber 30 of the cleaning apparatus 1-1 (1-2) with a small number of work steps. When it is necessary to remove the chip WC of the workpiece W from the cleaning chamber 30 during processing, the time required for the cleaning operation for removing the chip WC of the workpiece W from the cleaning chamber 30 can be shortened. The time during which the processing apparatus 100 is stopped can be shortened.

  In the above-described at least one embodiment, the cleaning device 1-1 (1-2) cleans the workpiece W of the frame unit U, but the workpiece W of the frame unit U has air. There may be further provided an air supply nozzle for spraying and drying. Accordingly, the cleaning device 1-1 (1-2) can continuously perform the cleaning and drying of the workpiece W of the frame unit U.

  In the first or second embodiment, since the arc-shaped strainers 41 to 45 can be attached to and detached from the cleaning chamber 30, the annular strainer is also provided in the cleaning chamber 30 of the existing cleaning apparatus having the chuck table 10 and the cleaning nozzle 20. 40 can be installed.

  In Embodiment 3 described above, the processing apparatus 100 cuts the workpiece W of the frame unit U with the cutting blade 141 and divides the workpiece into a plurality of chips WC. It may be divided into a plurality of chips WC by irradiating a pulse laser beam having a wavelength having an absorptivity to W. Thereby, also in what is called a laser processing apparatus, the washing | cleaning apparatus 1-1 (1-2) can be provided. Further, other processing means may be used.

1-1, 1-2 Cleaning device 10 Chuck table 11 Holding surface 20 Cleaning nozzle 30 Cleaning chamber 31 Outer peripheral wall 40 Annular strainer 41-44 Arc strainer 45 Arc strainer (predetermined arc strainer)
DESCRIPTION OF SYMBOLS 100 Processing apparatus 130 Processing chuck table 140 Processing means L Cleaning liquid F Annular frame T Adhesive tape U Frame knit W Workpiece WC Chip

Claims (4)

A cleaning device for cleaning the workpiece of a frame unit in which a plate-like workpiece divided into a plurality of chips is supported by an opening of an annular frame via an adhesive tape,
A chuck table provided with a holding surface for sucking and holding the workpiece via the adhesive tape, and rotating around a rotation axis orthogonal to the holding surface;
A cleaning nozzle for injecting a cleaning liquid onto the workpiece held by the chuck table;
An outer peripheral wall surrounding the chuck table and the cleaning nozzle to form a cleaning chamber;
A bottomed annular strainer below the holding surface of the chuck table, corresponding to a region between the chuck table and the inner periphery of the outer peripheral wall, and receiving chips of the workpiece scattered during cleaning; Including
The annular strainer includes a plurality of arc-shaped strainers formed in an annular shape in a circumferential direction, and at least one of the arc-shaped strainers is detachable from the cleaning chamber.   2. The cleaning according to claim 1, wherein the adjacent arc-shaped strainers are arranged in a state in which circumferential end portions abut against each other, and maintain a diameter of the annular strainer formed by the plurality of arc-shaped strainers. apparatus.   The bottom part of the said annular strainer is formed so that it may become lower toward the said predetermined | prescribed arcuate strainer which can be attached or detached, and guides the received said chip | tip to the said arcuate strainer. The cleaning device as described. A chuck table for processing that holds the workpiece of the frame unit;
A processing device for processing the workpiece held on the processing chuck table,
4. The processing apparatus according to claim 1, further comprising a cleaning device for cleaning the workpiece of the frame unit after processing by the processing means.

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