JP6612206B2 - Cutting device - Google Patents

Description

  The present invention relates to a cutting apparatus for cleaning and drying a cut product cut by a cutting mechanism.

  Conventionally, a cutting object such as a wafer or a sealed substrate is cut by a cutting mechanism using a cutting device. In order to remove cutting debris and contaminants generated by cutting the object to be cut, the cut piece is washed and dried. For example, a cutting device that cleans a processed workpiece using a cleaning mechanism is disclosed (see Patent Document 1).

JP2013-80811A

  However, the cutting device 1 disclosed in Patent Document 1 has the following problems. As shown in FIG. 3 of Patent Document 1, the cleaning / drying nozzle 89 is provided in a rectangular parallelepiped casing 82 whose lower surface is opened, and injects cleaning water and dry air onto the workpiece W. The cleaning / drying nozzle 89 is connected to a cleaning water supply source 94 and a drying air supply source 95 via a switching valve 96. By switching the switching valve 96, cleaning water and dry air are selectively supplied to the cleaning / drying nozzle 89. The workpiece W is cleaned and dried by reciprocating the cleaning / drying nozzle 89 in the casing 82.

  As described above, since the cleaning water and the dry air are selectively switched and sprayed from the cleaning / drying nozzle 89, the cleaning water remaining in the nozzle and the pipe during the drying of the workpiece W is returned to the workpiece W again. There is a risk of spraying. Further, the cleaning water jumping from the workpiece W during cleaning and the cleaning water in the form of mist adhere to the ceiling or inner wall of the casing 82 and drop onto the workpiece W as water droplets during drying. There is a risk. Therefore, waterdrop marks (watermarks) may be formed on the surface of the workpiece W and remain as stains. In addition, there is a risk of poor drying due to water drops falling.

  The present invention solves the above-mentioned problems, and provides a cutting device that suppresses water droplets from dropping on a cut object by providing an intermediate chamber between a cleaning unit and a drying unit. Objective.

  In order to solve the above problems, a cutting apparatus according to the present invention includes a cutting mechanism for cutting a cutting object, a table on which a cutting object cut by the cutting mechanism is placed, and a table on the table A cleaning unit for cleaning the cut material, a drying unit for drying the cut material on the table moved from the cleaning unit, and an intermediate chamber provided between the cleaning unit and the drying unit.

  According to the present invention, in the cutting device, by providing the intermediate chamber between the cleaning unit and the drying unit, it is possible to prevent water droplets from falling on the cut product.

In the cutting device which concerns on this invention, it is a top view which shows the outline | summary of an apparatus. It is a general-view figure which shows the washing-drying mechanism used in Embodiment 1, (a) is a top view, (b) is an AA sectional view, (c) is a BB sectional drawing. (A)-(b) is a schematic sectional drawing which shows the operation | movement which wash | cleans a cut material using the washing-drying mechanism of Embodiment 1. FIG. (A)-(b) is a schematic sectional drawing which shows the operation | movement which dries a cut material using the washing-drying mechanism of Embodiment 1. FIG. It is a general-view figure which shows the washing-drying mechanism used in Embodiment 2, (a) is a top view, (b) is CC sectional view taken on the line, (c) is DD sectional view. (A)-(b) is a schematic sectional drawing which shows the operation | movement which wash | cleans a cut material using the washing-drying mechanism of Embodiment 2. FIG. (A)-(b) is a schematic sectional drawing which shows the operation | movement which dries a cut material using the washing-drying mechanism of Embodiment 2. FIG.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. In this application document, the “support member” is a member that supports a support object such as a chip, an insulating film, a conductive film, or a semiconductor film, and includes a glass epoxy substrate, a ceramic substrate, a resin substrate, Examples include general substrates such as metal substrates, lead frames, and semiconductor wafers.
Embodiment 1

(Configuration of cutting device)
The configuration of the cutting device according to the present invention will be described with reference to FIG. As shown in FIG. 1, the cutting device 1 is a device that cuts a cutting object having a large area into pieces into a plurality of regions, for example. The cutting device 1 includes a supply module A that supplies a cutting object, a cutting module B that cuts the cutting object, and an inspection module C that inspects the cut object as components. Each component (each module A to C) is detachable and replaceable with respect to other components. Here, the “cutting object having a large area” is, for example, a square cutting object having four sides of 200 mm or more, 250 mm or more, or 300 mm or more, or a circular cutting object having a diameter of 200 mm or more, 250 mm or more, or 300 mm or more. .

  As a cutting object, a supporting member having a resin portion, a semiconductor wafer in which a semiconductor pre-process (diffusion process and wiring process) has been completed, and the like are cut by the cutting device 1 into individual pieces. Examples of the support member having a resin portion include a sealed substrate in which a chip mounted on a substrate is sealed with a resin, a sealed wafer in which a chip mounted on a semiconductor wafer is sealed with resin, and the like. The support member itself before molding the resin portion can also be cut. In the first embodiment, a case will be described in which a sealed substrate is cut into pieces as a cutting object. Note that the cutting object may be a semiconductor wafer on which elements are formed.

  The sealed substrate includes a substrate, a plurality of chips mounted in a plurality of regions included in the substrate, and a sealing resin that is molded so that the plurality of regions are collectively covered. Each region obtained by cutting the sealed substrate into individual pieces corresponds to a product.

  The supply module A includes a cutting object supply mechanism 3 that supplies a sealed substrate 2 corresponding to a cutting object, a cutting object placement unit 4 that delivers the sealed substrate 2, and a sealed substrate 2 And a transport mechanism 5 for transporting. The transport mechanism 5 is movable in the X direction, the Y direction, and the Z direction. The sealed substrate 2 is positioned in the cutting object mounting unit 4 and then transferred to the cutting module B by the transfer mechanism 5.

  The cutting module B includes an alignment region 6 for setting a virtual cutting line on the sealed substrate 2, a cutting region 7 for cutting and cutting the sealed substrate 2 into pieces, and an individual cut piece And a cleaning / drying region 8 for cleaning and drying the substrate.

  In the cutting module B, the alignment region 6 is provided with a cutting table 9 on which the sealed substrate 2 is placed. The cutting table 9 can be moved in the Y direction in the figure by a moving mechanism (not shown). The cutting table 9 can move between the alignment region 6, the cleaning / drying region 8, and the cutting region 7. The cutting table 9 can be rotated in the θ direction by a rotation mechanism (not shown). For example, a cutting jig (not shown) may be attached on the cutting table 9 and the sealed substrate 2 may be placed on the cutting jig.

  The alignment region 6 is provided with an alignment camera 10. The alignment camera 10 can move independently in the X direction. As the camera 10 moves in the X direction and the cutting table 9 moves in the Y direction, the coordinate position of the alignment mark formed on the sealed substrate 2 is measured. Thereby, the cutting line of the sealed substrate 2 is virtually set along the X direction and the Y direction.

  The cutting area 7 is provided with two spindles 11a and 11b as a cutting mechanism. The cutting device 1 is a twin spindle cutting device provided with two spindles 11a and 11b. The spindles 11a and 11b are independently movable in the X direction and the Z direction. The rotary blades 12a and 12b are mounted on the spindles 11a and 11b, respectively. The spindles 11a and 11b are respectively provided with cutting water nozzles for injecting cutting water and cooling water nozzles (not shown) for injecting cooling water to suppress frictional heat generated by the rotating blades 12a and 12b rotating at high speed. Provided. The sealed substrate 2 is cut by relatively moving the cutting table 9 and the spindles 11a and 11b. The rotary blades 12a and 12b cut the sealed substrate 2 by rotating in a plane plane orthogonal to the X axis.

  It is also possible to make a cutting device having a single spindle configuration in which one spindle is provided in the cutting region 7. When cutting a large area cutting object, the total distance of the cutting object cut by the rotary blade becomes very long. Therefore, it is preferable to efficiently cut the cutting object by providing two spindles. .

  The cleaning / drying area 8 is provided with a cleaning / drying mechanism 14 that cleans and dries the cut substrate 13 that is a cut product cut by the spindles 11a and 11b. The cleaning / drying mechanism 14 includes a cleaning unit 15 that cleans the cut substrate 13 and a drying unit 16 that dries the cleaned substrate 13. Between the washing | cleaning part 15 and the drying part 16, the intermediate | middle chamber 17 which comprises the space divided | segmented by each partition wall of the washing | cleaning part 15 and the drying part 16 is provided. Below the cleaning / drying mechanism 14, the cutting substrate 9 reciprocates in the Y direction, whereby the cut substrate 13 is cleaned and dried. The cleaning / drying mechanism 14 will be described in detail with reference to FIGS.

  The inspection module C is provided with an inspection table 18. On the inspection table 18, the cut substrate 13 that is an aggregate of the products P cut into pieces by cutting the sealed substrate 2 is transferred. The cut substrate 13 is transferred from the cutting table 9 onto the inspection table 18 by the transport mechanism 19. The transport mechanism 19 is movable in the X direction, the Y direction, and the Z direction.

  In the inspection module C, the plurality of products P are inspected by, for example, an inspection camera 20. The inspection camera 20 is movable in the X direction and the Y direction. The inspected product P is sorted into a non-defective product and a defective product. The non-defective product is stored in the non-defective product tray 21. Defective products are stored in a defective product tray 22.

  The supply module A is provided with a control unit CTL. The controller CTL operates the cutting device 1, transports the sealed substrate 2, aligns the sealed substrate 2, cuts the sealed substrate 2, cleans and dries the cut substrate 13, and cleans the cut substrate 13. Control of conveyance and inspection of the cut substrate 13 is performed. In the present embodiment, the control unit CTL is provided in the supply module A. Not only this but control part CTL may be provided in other modules. Further, the control unit CTL may be divided into a plurality and provided in at least two of the supply module A, the cutting module B, and the inspection module C.

  In addition, in FIG. 1, since the example which cut | disconnects the sealed board | substrate 2 as a cutting target was shown, the cutting target mounting part 4, the cutting table 9, and the inspection table 18 are rectangular (square) shapes. It was. For example, when a semiconductor wafer is handled as a cutting target, the cutting target mounting unit 4, the cutting table 9, and the inspection table 18 may be formed in a circular shape.

(Structure of washing and drying mechanism)
With reference to FIG. 2, the structure of the washing-drying mechanism 14 of Embodiment 1 used in the cutting device 1 shown in FIG. 1 will be described.

  As shown in FIG. 2A, the cleaning / drying mechanism 14 includes a cleaning unit 15 that cleans the cut substrate 13 that has been cut, a drying unit 16 that drys the cleaned substrate 13 that has been cleaned, and a cleaning unit 15. An intermediate chamber 17 provided between the drying unit 16 and the drying unit 16. The cleaning / drying mechanism 14 has a length L1 and a width W in plan view. The width W of the cleaning / drying mechanism 14 is set to be larger than the width of the cutting table 9. The cutting table 9 reciprocates in the Y direction below the cleaning / drying mechanism 14.

  As shown in FIGS. 2B and 2C, below the cleaning / drying mechanism 14, a cutting table 9 and a moving space 23 in which the cut substrate 13 placed on the cutting table 9 moves. Is formed. The cutting table 9 reciprocates in the Y direction in the moving space 23 using, for example, a moving mechanism (not shown) such as a ball screw mechanism.

  The moving space 23 is a space having at least a part surrounded by the outer peripheral side wall plates constituting the cleaning unit 15, the drying unit 16 and the intermediate chamber 17, and having a height h 1 with the lower end of the cleaning / drying mechanism 14 as a reference plane. is there. The moving space 23 is a rectangular parallelepiped space having a length L1 × width W × height h1, including the thickness of each wall of the cleaning unit 15, the drying unit 16, and the intermediate chamber 17. The intermediate chamber 17 has a height of h2, the drying section 16 has a height of h3, and the cleaning section 15 has a height of h4 with the lower end of the cleaning / drying mechanism 14 as a reference plane. The relationship between these heights is h4> h3> h2> h1.

  The cleaning unit 15 includes a cleaning chamber 24 having an opening below and a cleaning mechanism 25 accommodated in the cleaning chamber 24. The cleaning chamber 24 and the intermediate chamber 17 are partitioned by an intermediate chamber-side partition wall 26 that constitutes the cleaning unit 15. As the cut substrate 13 reciprocates in the moving space 23 below the cleaning chamber 24 and the intermediate chamber 17, the entire surface of the cut substrate 13 is cleaned by the cleaning mechanism 25.

  As the cleaning mechanism 25, for example, an injection cleaning mechanism (spray cleaning) for injecting the cleaning liquid 27 is used. Spray cleaning is cleaning using a nozzle composed of one or two fluids. In the case of a one-fluid nozzle, the cleaning liquid 27 is sprayed toward the cut substrate 13 from the tip of the nozzle. As the cleaning liquid 27, it is preferable to use pure water, carbonated water, ozone water, or the like. In the case of a two-fluid nozzle, a gas such as compressed air or nitrogen gas is supplied into the cleaning liquid 27. The cleaning liquid 27 mixed with gas is sprayed toward the cut substrate 13 as fine mist particles. Moreover, it is also possible to apply ultrasonic waves to the cleaning liquid 27 sprayed from the cleaning mechanism 25 and spray it. The direction, angle, and the like for injecting the cleaning liquid 27 can be arbitrarily set.

  When cleaning the cut substrate 13 having a large area, a plurality of cleaning mechanisms 25 or slit-like nozzles wider than the width of the cut substrate 13 are used to clean the entire surface of the cut substrate 13 at once. It is preferable to use a cleaning mechanism 25 having a porous nozzle. Further, the nozzle may be configured to automatically change the direction of the nozzle in the left-right or up-down direction toward the cut substrate 13. As shown in FIG. 2B, the cleaning liquid 27 is preferably sprayed from the cleaning chamber 24 in a direction opposite to the intermediate chamber 17. It is preferable to prevent the cleaning liquid 27 sprayed from the cleaning mechanism 25, water droplets adhering to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 from entering the intermediate chamber 17.

  The drying unit 16 includes a drying chamber 28 having an opening below and a drying mechanism 29 accommodated in the drying chamber 28. The drying chamber 28 and the intermediate chamber 17 are partitioned by an intermediate chamber-side partition wall 30 constituting the drying unit 16. As the cut substrate 13 reciprocates in the moving space 23 below the drying chamber 28 and the intermediate chamber 17, the entire surface of the cut substrate 13 is dried by the drying mechanism 29.

  As the drying mechanism 29, for example, air knife draining drying in which a gas 31 such as compressed air or nitrogen gas is blown toward the cut substrate 13 to blow the cleaning liquid 27 from the surface of the cut substrate 13 is used. The air knife draining and drying generates a wide and narrow air flow, and can blow off the cleaning liquid 27 with a strong jet power. The direction and angle of blowing the gas 31 can be arbitrarily set.

  When an air knife is used, the width is preferably larger than the width of the cut substrate 13 in order to dry the entire surface of the cut substrate 13 all together. Further, the direction of the air knife injection port may be automatically changed in the left-right or up-down direction. The gas 31 ejected from the drying mechanism 29 may be ejected from the drying chamber 28 in the direction opposite to the intermediate chamber 17 or may be ejected from the drying chamber 28 toward the intermediate chamber 17. Good. Or you may inject directly below. The cleaning liquid 27 on the cut substrate 13 may be configured to be blown downward from the drying chamber 28.

  In the cleaning / drying mechanism 14, each of the cleaning mechanism 25 and the drying mechanism 29 is configured to collectively clean and dry an assembly of a plurality of products P arranged along the width direction of the cut substrate 13. Good. In addition, the cleaning / drying mechanism 14 is configured so that water droplets adhering to the inner walls of the cleaning / drying mechanism 14 (specifically, the cleaning chamber 24 and the intermediate chamber 17) are dried on or after the cut substrate 13 is dried. It is preferable to adopt a configuration that suppresses falling.

(Operation of washing and drying mechanism)
With reference to FIGS. 3-4, the operation | movement which wash | cleans and dries the cut | disconnected board | substrate 13 with the washing | cleaning drying mechanism 14 is demonstrated.

  As shown in FIGS. 3A and 3B, in order to clean the cut substrate 13, the cutting table 9 is reciprocated in the Y direction below the cleaning chamber 24 using a moving mechanism (not shown). Move. When the cut substrate 13 placed on the cutting table 9 passes below the cleaning chamber 24, the cleaning solution 27 is sprayed onto the cut substrate 13 from the plurality of cleaning mechanisms 25 to clean the cut substrate 13. To do. For example, the entire surface of the cut substrate 13 can be cleaned by the plurality of cleaning mechanisms 25 by reciprocating the cutting table 9 in the Y direction by a certain distance D from the position S1 to the position S2. A plurality of cleaning mechanisms 25 removes cutting waste and contaminants remaining on the cut substrate 13.

  As the cleaning mechanism 25, spray cleaning using a nozzle made of one fluid or two fluids is used. In the case of a one-fluid nozzle, a part of the cleaning liquid 27 ejected from the tip of the nozzle may jump from the cut substrate 13 and adhere to the inner wall of the cleaning chamber 24 or the cleaning mechanism 25 to form water droplets. There is a risk that water droplets adhering to the inner wall of the cleaning chamber 24 or the cleaning mechanism 25 will fall downward as time passes.

  In the case of a two-fluid nozzle, a gas such as compressed air or nitrogen gas is supplied into the cleaning liquid 27. The cleaning liquid 27 mixed with gas is sprayed onto the cut substrate 13 in the form of fine mist particles (mist). Mist may adhere to the walls and ceiling in the cleaning chamber 24 and aggregate to form water droplets. There is a risk that the water droplets adhering to the walls and ceiling in the cleaning chamber 24 will fall downward with the passage of time. Note that mist is more likely to occur with the two-fluid nozzle, but mist may also occur with the one-fluid nozzle.

  As described above, when spray cleaning is used, water droplets attached to the walls and ceiling in the cleaning chamber 24 and the cleaning mechanism 25 may fall downward over time. Therefore, it is preferable that the cleaning / drying mechanism 14 is configured to prevent water droplets from falling on the cut substrate 13 when or after the cut substrate 13 is dried.

  As shown in FIGS. 4A and 4B, in order to dry the cleaned cut substrate 13, the cutting table 9 is moved under the drying chamber 28 using a moving mechanism (not shown). Move back and forth in the direction. When the cut substrate 13 placed on the cutting table 9 passes under the drying chamber 28, a gas 31 such as compressed air or nitrogen gas is blown onto the cut substrate 13 from the drying mechanism 29 and cut. The cleaning liquid 27 is blown off from the surface of the substrate 13. For example, the entire surface of the cut substrate 13 is dried by the drying mechanism 29 by reciprocating the cutting table 9 in the Y direction by a certain distance D from the position S3 to the position S4.

  In order to clean the entire surface of the cut substrate 13, the cutting table 9 is moved in the Y direction by a certain distance D from the position S1 to the position S2, and the cut substrate 13 is cleaned. Similarly, in order to dry the entire surface of the cut substrate 13, the cutting table 9 is moved in the Y direction by a fixed distance D from the position of S3 to the position of S4 to dry the cut substrate 13. In both cases of cleaning the cut substrate 13 and drying the cut substrate 13, the entire surface of the cut substrate 13 is cleaned and dried by moving the cutting table 9 in the Y direction by a fixed distance D. can do.

  In the cleaning / drying mechanism 14, an intermediate chamber 17 is provided between the cleaning unit 15 and the drying unit 16. As shown in FIG. 4A, in the Y direction, the intermediate chamber 17 has a length of d1. Accordingly, it is possible to make a configuration in which the cut substrate 13 does not pass below the cleaning chamber 24 while the cut substrate 13 is being dried. Accordingly, it is possible to prevent water droplets attached to the walls and ceiling in the cleaning chamber 24 and the cleaning mechanism 25 from falling on the cut substrate 13 during or after the cut substrate 13 is dried.

(Function and effect)
In the present embodiment, the cutting device 1 is a spindle 11a, 11b that is a cutting mechanism that cuts the sealed substrate 2 that is the object to be cut, and a cut product in which the sealed substrate 2 is cut by the spindles 11a, 11b. A cutting table 9 which is a table on which a certain cut substrate 13 is placed, a cleaning unit 15 for cleaning the cut substrate 13 on the cutting table 9, and a cutting table 9 moved from the cleaning unit 15 A drying unit 16 that dries the cut substrate 13 and an intermediate chamber 17 provided between the cleaning unit 15 and the drying unit 16 are provided.

  According to this configuration, the cutting apparatus 1 includes a cleaning unit 15 that cleans the cut substrate 13, a drying unit 16 that dries the cut substrate 13, and an intermediate provided between the cleaning unit 15 and the drying unit 16. And a chamber 17. By providing the intermediate chamber 17, the cutting table 9 does not pass below the cleaning chamber 24 while drying the cut substrate 13. Therefore, it is possible to prevent water droplets adhering to the walls and ceiling in the cleaning chamber 24 and the cleaning mechanism 25 from falling on the cut substrate 13.

  According to the present embodiment, the cutting apparatus 1 includes spindles 11a and 11b for cutting the sealed substrate 2, and a cutting table on which the cut substrate 13 that is a cut product obtained by cutting the sealed substrate 2 is placed. 9 and a cleaning / drying mechanism 14 that moves the cutting table 9 to clean and dry the cut substrate 13. The cleaning / drying mechanism 14 includes a cleaning unit 15 for cleaning the cut substrate 13, a drying unit 16 for drying the cut substrate 13, and an intermediate chamber 17 provided between the cleaning unit 15 and the drying unit 16. . By providing the intermediate chamber 17 between the cleaning unit 15 and the drying unit 16, when the cut substrate 13 is dried by the drying mechanism 29, the cut substrate 13 does not pass below the cleaning chamber 24. As a result, it is possible to prevent water droplets adhering to the walls and ceiling in the cleaning chamber 24 and the cleaning mechanism 25 from falling on the cut substrate 13. Therefore, it is possible to suppress the occurrence of stains and poor drying due to drops of water drops.

According to the present embodiment, since the intermediate chamber 17 is provided between the cleaning unit 15 and the drying unit 16, the cleaning liquid 27 ejected from the cleaning mechanism 25, the cleaning chamber is compared with a configuration in which no intermediate chamber is provided. The water droplets adhering to the inner wall of 24 and the mist generated in the cleaning chamber 24 can be prevented from entering the drying section 16, and the water droplets falling onto the cut product can be suppressed.
[Embodiment 2]

(Structure of washing and drying mechanism)
With reference to FIG. 5, the structure of the washing-drying mechanism of Embodiment 2 used in the cutting device 1 will be described. The difference from the first embodiment is that the configurations of the cleaning unit and the intermediate chamber are changed. Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

  As shown in FIG. 5A, the cleaning / drying mechanism 32 includes a cleaning unit 33 that cleans the cut substrate 13 that has been cut, a drying unit 16 that drys the cleaned substrate 13 that has been cleaned, and a cleaning unit 33. An intermediate chamber 34 provided between the drying unit 16 and the drying unit 16. The drying unit 16 is the same as the drying unit shown in the first embodiment. The cleaning / drying mechanism 32 has a length L2 and a width W in plan view. The width W of the cleaning / drying mechanism 32 is the same as the width of the cleaning / drying mechanism 14 shown in the first embodiment. The length L2 of the cleaning / drying mechanism 32 is smaller than the length L1 of the cleaning / drying mechanism 14 shown in the first embodiment (see FIG. 2A). The cutting table 9 reciprocates in the Y direction below the cleaning / drying mechanism 32.

  As shown in FIG. 5B, the cleaning unit 33 includes an intermediate chamber side partition wall 35 provided on the intermediate chamber 34 side of the cleaning unit 33 and a partition inclined from the intermediate chamber side partition wall 35 toward the cleaning unit 33 side. A plate 36. For example, the partition plate 36 is located on the intermediate chamber side partition wall 35 from the position corresponding to the top of the top plate of the intermediate chamber 34 (the height position of h2 with the lower end of the cleaning / drying mechanism 32 as a reference plane) on the cleaning unit 33 side. It is provided toward the lower side (the height position of h1 with the lower end of the cleaning / drying mechanism 32 as a reference plane). In the intermediate chamber side partition wall 35 of the cleaning unit 33, the attachment position, the inclination angle, and the length of the partition plate 36 can be arbitrarily set. The cleaning chamber 24 and the intermediate chamber 34 are partitioned by an intermediate chamber-side partition wall 35 and a partition plate 36 that constitute the cleaning unit 33. By providing the partition plate 36, it is possible to prevent the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets attached to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. it can.

  As shown in FIG. 5 (c), the top plate 37 constituting the intermediate chamber 34 has a gable roof shape that inclines to both sides from the central portion. In other words, the ceiling inner surface, which is the lower surface 38 of the top plate 37 of the intermediate chamber 34, has a shape that is inclined downward from the center to both sides. The central portion of the intermediate chamber 34 has a height h2 with the lower end of the cleaning / drying mechanism 32 as a reference plane, and the side wall plate of the intermediate chamber 34 has a height h1 with the lower end of the cleaning / drying mechanism 32 as a reference plane. Therefore, the intermediate chamber 34 is configured by a space surrounded by a top plate 37 having a gable roof shape, a partition plate 36 provided in the cleaning unit 33, and side wall plates that respectively constitute the intermediate chamber 34 and the cleaning unit 33.

  As shown in FIGS. 5B and 7A, the intermediate chamber 34 is formed by a space below the top plate 37 of the intermediate chamber 34 and a space below the partition plate 36 provided in the cleaning unit 33. Composed. Not only the space below the top plate 37 of the intermediate chamber 34, but also the space below the partition plate 36 provided in the cleaning unit 33 is a space constituting the intermediate chamber 34. Accordingly, in the Y direction of the cleaning / drying mechanism 32, the length d2 of the space below the top plate 37 (see FIG. 7A) and the length d3 of the space below the partition plate 36 (see FIG. 7A). The total length (d2 + d3) is the effective length of the intermediate chamber 34. Accordingly, when the cut substrate 13 is dried, the cutting table 9 can be reciprocated to a space formed below the partition plate 36. The distance moved in the cutting table 9 + Y direction by the length d3 in the Y direction (see FIG. 7A) of the space formed below the partition plate 36 can be increased. Therefore, even if the length L2 of the cleaning / drying mechanism 32 (see FIG. 5A) is smaller than the length L1 of the cleaning / drying mechanism 14 (see FIG. 2A), the entire surface of the cut substrate 13 is dried. Therefore, a distance D (see FIG. 7A) for reciprocating the cutting table 9 can be secured below the intermediate chamber 34.

  The cleaning / drying mechanism 32 is provided with a partition plate 36 in the cleaning unit 33, so that the cleaning liquid 27 ejected from the cleaning mechanism 25 enters the intermediate chamber 34, and water droplets adhering to the inner wall of the cleaning chamber 24 enter the intermediate chamber 34. Intrusion and mist generated in the cleaning chamber 24 are prevented from entering the intermediate chamber 34. However, even when the cleaning plate 33 is provided with the partition plate 36, the mist generated in the cleaning chamber 24 may still enter the intermediate chamber 34.

  Therefore, in order to prevent mist that has entered the intermediate chamber 34 from adhering to the inner wall of the intermediate chamber 34 and aggregating into water droplets, the inner wall of the intermediate chamber 34 may be made hydrophilic. Fine irregularities can be formed on the surface by, for example, blasting the lower surface 38 of the top plate 37 constituting the intermediate chamber 34, that is, the inner surface of the ceiling and the lower surface 39 of the partition plate 36 provided in the cleaning unit 33. The lower surface 38 of the top plate 37 and the lower surface 39 of the partition plate 36 can be roughened by blasting to make them hydrophilic. As a result, even if the mist adhering to the lower surface 38 of the top plate 37 and the lower surface 39 of the partition plate 36 is aggregated, it is possible to suppress the formation of large water droplets that fall downward. Since the lower surface 38 of the top plate 37 is more likely to drop water on the cut than the lower surface 39 of the partition plate 36, only the lower surface 38 of the top plate 37 is roughened. Also good.

  In addition, the top plate 37 constituting the intermediate chamber 34 has a gable roof shape that is inclined from the center to both sides. The partition plate 36 provided in the cleaning unit 33 is also inclined downward. Therefore, even if the mist adhering to the inner wall of the intermediate chamber 34 aggregates and forms water droplets, the water droplets do not become large enough to fall downward, and the water droplets easily flow downward along the inclination of the top plate 37 and the partition plate 36. It has become. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13.

  Furthermore, the gas injection mechanism 40 which injects air and nitrogen can be provided on the upper surface of the partition plate 36 provided in the cleaning unit 33. The direction, angle, etc. which inject gas can be set arbitrarily. Furthermore, a configuration may be adopted in which the direction in which the gas is ejected is automatically changed in the left-right or up-down direction. By providing the gas ejection mechanism 40, the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets adhering to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 are further suppressed from entering the intermediate chamber 34. be able to. Therefore, it is possible to further suppress water droplets from adhering to the inner wall of the intermediate chamber 34.

  In the cleaning / drying mechanism 32 shown in the second embodiment, the following four measures were taken. (1) An inclined partition plate 36 is provided in the cleaning unit 33, (2) the top plate 37 of the intermediate chamber 34 is formed into a gable roof shape, (3) the lower surface 38 of the top plate 37 of the intermediate chamber 34 and the cleaning unit 33 The lower surface 39 of the provided partition plate 36 is roughened. (4) The gas injection mechanism 40 is provided on the upper surface of the partition plate 36. By taking these measures, it is possible to further suppress the drop of water on the cut substrate 13.

(Operation of washing and drying mechanism)
With reference to FIGS. 6-7, the operation | movement which wash | cleans and dries the cut | disconnected board | substrate 13 by the washing | cleaning drying mechanism 32 is demonstrated.

  As shown in FIGS. 6A and 6B, in order to clean the cut substrate 13, the cutting table 9 is reciprocated in the Y direction below the cleaning chamber 24 using a moving mechanism (not shown). Move. When the cutting table 9 passes through an opening that is partitioned by a partition plate 36 provided in the cleaning section 33 and opens below the cleaning chamber 24, the cleaning liquid 27 is sprayed from the plurality of cleaning mechanisms 25 onto the cut substrate 13. Then, the cut substrate 13 is cleaned. As in the first embodiment, in order to clean the entire surface of the cut substrate 13, the cutting table 9 is reciprocated in the Y direction by a fixed distance D from the position S1 to the position S2. The entire surface of the cut substrate 13 is cleaned by the plurality of cleaning mechanisms 25.

  The cleaning chamber 24 and the intermediate chamber 34 are partitioned by an intermediate chamber-side partition wall 35 and a partition plate 36 that constitute the cleaning unit 33. By providing the partition plate 36, the cleaning liquid 27 ejected from the cleaning mechanism 25 enters the intermediate chamber 34, the water droplets attached to the inner wall of the cleaning chamber 24 enter the intermediate chamber 34, and the cleaning chamber 24 It is possible to suppress the generated mist from entering the intermediate chamber 34.

  As shown in FIGS. 7A and 7B, in order to dry the cut substrate 13, the cutting table 9 is reciprocated in the Y direction below the drying chamber 28 using a moving mechanism (not shown). Move. Similarly to the first embodiment, the cutting table 9 is reciprocated in the Y direction by a fixed distance D from the position S3 to the position S4 in order to dry the entire surface of the cut substrate 13.

  The intermediate chamber 34 is configured by a space below the top plate 37 of the intermediate chamber 34 and a space below the partition plate 36 provided in the cleaning unit 33. When the cut substrate 13 is dried, the cutting table 9 can be reciprocated to the space below the partition plate 36. That is, in the Y direction of the cleaning / drying mechanism 32, the cutting table up to the range of the total length (d2 + d3) of the length d2 of the space below the top plate 37 and the length d3 of the space below the partition plate 36. 9 can be reciprocated in the + Y direction. By providing the partition plate 36 in the cleaning unit 33, the effective length of the intermediate chamber 34 in the Y direction can be increased. Therefore, the distance for reciprocating the cutting table 9 under the intermediate chamber 34 can be increased. Thereby, even if the length of the cleaning / drying mechanism 32 is reduced, the distance D for reciprocating the cutting table 9 in order to dry the entire surface of the cut substrate 13 can be secured. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13.

(Function and effect)
According to the present embodiment, the cleaning / drying mechanism 32 is provided with the partition plate 36 inclined from the intermediate chamber side partition wall 35 of the cleaning unit 33 toward the cleaning unit 33. The cleaning chamber 24 and the intermediate chamber 34 are partitioned by an intermediate chamber-side partition wall 35 and a partition plate 36 that constitute the cleaning unit 33. As a result, the opening below the cleaning chamber 24 can be reduced and the effective space constituting the intermediate chamber 34 can be increased. Therefore, when the cut substrate 13 is dried, the distance for reciprocating the cutting table 9 in the intermediate chamber 34 can be increased. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13. In addition, the length of the cleaning / drying mechanism 32 can be reduced.

  According to the present embodiment, the cleaning / drying mechanism 32 is provided with the partition plate 36 inclined from the intermediate chamber side partition wall 35 of the cleaning unit 33 toward the cleaning unit 33. As a result, it is possible to prevent the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets attached to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. Therefore, it is possible to suppress water droplets from adhering to the inner wall of the intermediate chamber 34. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

  According to this embodiment, the top plate 37 constituting the intermediate chamber 34 is formed into a gable roof shape that inclines from the center to both sides. In other words, the inner surface of the ceiling of the intermediate chamber 34 is inclined downward from the center to both sides. Even if the mist that has entered the intermediate chamber 34 aggregates into water droplets, the water droplets can easily flow along both sides of the ceiling inner surface, that is, the top plate 37. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

  According to the present embodiment, at least the ceiling inner surface is roughened on the inner wall of the intermediate chamber 34 to make it hydrophilic. Fine irregularities are formed on the surface by blasting the lower surface 38 of the top plate 37 constituting the intermediate chamber 34 and the lower surface 39 of the partition plate 36 provided in the cleaning unit 33. As a result, it is possible to suppress the mist adhering to the inner wall of the intermediate chamber 34 from becoming large water droplets. Therefore, it is possible to prevent water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

  According to the present embodiment, the gas injection mechanism 40 is provided on the upper surface of the partition plate 36 provided in the cleaning unit 33. Accordingly, it is possible to further suppress the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets attached to the inner wall of the cleaning chamber 24, and the mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. Therefore, it is possible to further suppress water droplets from adhering to the inner wall of the intermediate chamber 34. Therefore, it is possible to further suppress water drops from falling on the cut substrate 13.

  In each embodiment, the case where a cutting object having a rectangular (square) shape is cut as the cutting object is shown. The present invention is not limited to this, and the contents described so far can also be applied to the case of cutting a cutting object having a substantially circular shape such as a semiconductor wafer.

  In each embodiment, the case where the sealed board | substrate with which the chip | tip was mounted | worn as a cutting target was cut | disconnected was shown. However, the present invention is not limited to this, and the present invention can be applied to a case where the next cutting object is cut into pieces as a cutting object other than the sealed substrate. First, a semiconductor wafer made of silicon and a compound semiconductor and having functional elements such as circuit elements and MEMS (Micro Electro Mechanical Systems) is separated. Secondly, a chip resistor, a chip capacitor, a chip-type sensor, a surface acoustic wave device are obtained by dividing a ceramic substrate, a glass substrate, etc., in which functional elements such as resistors, capacitors, sensors, and surface acoustic wave devices are incorporated. This is the case of manufacturing such products. In these two cases, a semiconductor wafer, a ceramic substrate, a glass substrate, or the like corresponds to a support member in which functional elements corresponding to a plurality of regions are formed.

  As described above, the cutting device of the above embodiment cleans the cutting mechanism that cuts the cutting object, the table on which the cutting object cut by the cutting mechanism is placed, and the cutting object on the table. A cleaning unit for drying, a drying unit for drying the cut material on the table moved from the cleaning unit, and an intermediate chamber provided between the cleaning unit and the drying unit.

  According to this configuration, the intermediate chamber is provided between the cleaning unit and the drying unit. This can prevent the cut product from passing under the cleaning part when the cut product is dried. Therefore, it can suppress that a water drop falls on a cut material from a washing part.

  Furthermore, the cutting device of the said embodiment is set as the structure which has the partition plate inclined toward the washing | cleaning part side under the intermediate chamber side partition wall of the washing | cleaning part.

  According to this structure, the effective space of an intermediate chamber is enlarged by providing a partition plate in a washing | cleaning part. Thereby, the distance to which the table is moved when the cut product is dried can be increased. Therefore, it can suppress that a water drop falls on a cut material.

  Furthermore, the cutting device of the said embodiment is set as the structure which has a gas injection mechanism which injects gas on the upper surface of a partition plate.

  According to this configuration, the gas jetting mechanism prevents the cleaning liquid, water droplets, and mist from entering the intermediate chamber. Therefore, it can suppress that a water drop falls on a cut material from the top plate of an intermediate chamber.

  Furthermore, the cutting device of the above embodiment has a configuration in which the ceiling inner surface of the intermediate chamber is inclined downward from the center to both sides.

  According to this structure, the ceiling inner surface of the intermediate chamber is inclined downward from the center to both sides. Even if water droplets adhere to the ceiling inner surface, the water droplets easily flow on both sides along the inclination of the ceiling inner surface. Therefore, it can suppress that a water drop falls on a cut material from the ceiling inner surface of an intermediate chamber.

  Furthermore, the cutting device of the above embodiment is configured such that at least the inner surface of the ceiling of the intermediate chamber is roughened.

  According to this configuration, fine irregularities are formed on the inner surface of the ceiling of the intermediate chamber. This suppresses that the mist adhering to the ceiling inner surface of the intermediate chamber becomes a large water droplet. Therefore, it can suppress that a water drop falls on a cut material from the ceiling inner surface of an intermediate chamber.

  Further, in the cutting device of the above embodiment, the cleaning unit has a cleaning mechanism for cleaning the cut product, and the drying unit has a drying mechanism for drying the cut product.

  According to this configuration, the cut product can be washed by the cleaning mechanism, and the cut product can be dried by the drying mechanism.

  Furthermore, in the cutting device of the above-described embodiment, the object to be cut is a support member having a resin portion.

  According to this structure, the cutting target object resin-molded with respect to the supporting member can be cut | disconnected using said cutting device.

  Furthermore, in the cutting apparatus of the above embodiment, the drying mechanism is configured to dry the cut product when the table moves at least below the drying unit and the intermediate chamber.

  According to this configuration, when the table moves below the drying unit and the intermediate chamber, the cut material is dried by the drying mechanism. Therefore, it can suppress that a water drop falls on a cut material from a washing part.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Cutting device 2 Sealed substrate (cutting object)
DESCRIPTION OF SYMBOLS 3 Cutting object supply mechanism 4 Cutting object mounting part 5 Conveyance mechanism 6 Alignment area 7 Cutting area 8 Washing and drying mechanism 9 Cutting table (table)
10 Cameras for alignment 11a, 11b Spindle (cutting mechanism)
12a, 12b Rotary blade 13 Cut substrate (cut)
14, 32 Cleaning and drying mechanism 15, 33 Cleaning unit 16 Drying unit 17, 34 Intermediate chamber 18 Inspection table 19 Transport mechanism 20 Inspection camera 21 Non-defective tray 22 Defective tray 23 Moving space 24 Cleaning chamber 25 Cleaning mechanism 26 Intermediate chamber Side partition wall 27 Cleaning liquid 28 Drying chamber 29 Drying mechanism 30 Intermediate chamber side partition wall 31 Gas 35 Middle chamber side partition wall 36 Partition plate 37 Top plate 38 Top plate bottom surface (ceiling inner surface)
39 Bottom surface of partition plate 40 Gas injection mechanism A Supply module B Cutting module C Inspection module P Product CTL control unit L1, L2 Length W Width h1, h2, h3, h4 Height S1, S2, S3, S4 Position D Distance d1 , D2, d3 length

Claims (8)

A cutting mechanism for cutting an object to be cut;
A table on which a cut object obtained by cutting the cutting object by the cutting mechanism is placed;
A cleaning section for cleaning the cut object on the table;
A drying unit for drying the cut product on the table moved from the cleaning unit;
A cutting apparatus comprising an intermediate chamber provided between the cleaning unit and the drying unit. The cutting device according to claim 1, wherein
A cutting device having a partition plate inclined toward the cleaning unit side below the intermediate chamber side partition wall of the cleaning unit. The cutting device according to claim 2, wherein
A cutting device having a gas injection mechanism for injecting gas onto the upper surface of the partition plate. In the cutting device according to any one of claims 1 to 3,
The cutting device having a shape in which the ceiling inner surface of the intermediate chamber is inclined downward from the central portion to both sides. In the cutting device according to any one of claims 1 to 4,
A cutting device in which at least the ceiling inner surface of the intermediate chamber is roughened. In the cutting device according to any one of claims 1 to 5,
The cleaning unit has a cleaning mechanism for cleaning the cut object,
The drying unit has a drying mechanism for drying the cut product. In the cutting device according to any one of claims 1 to 6,
The cutting apparatus, wherein the cutting object is a support member having a resin portion. The cutting device according to claim 6, wherein
The drying mechanism is a cutting device that dries the cut material when the table moves at least below the drying unit and the intermediate chamber.

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