JP5156459B2 - Substrate cutting method and apparatus - Google Patents

Description

  The present invention relates to a substrate cutting method for cutting a molded substrate in which a plurality of required electronic parts such as ICs are collectively sealed with a resin material into individual packages (pieces) and an improvement of the apparatus. It is.

  Conventionally, individual packages can be formed by cutting a required portion of a molded substrate with a cutting mechanism (cutting mechanism) such as a blade (circular rotary cutting blade) using a substrate cutting device. The cutting is performed as follows.

That is, first, at the substrate mounting position of this apparatus, the molded substrate 1 is supplied and set on the mounting surface of a cutting table (mounting rotary table for cutting) with its ball surface 1a facing up and fixed by suction. At the same time, the ball surface (substrate surface) 1a of the molded substrate 1 is aligned [see FIGS. 9 (1) and 9 (2)].
At this time, the required cutting line 4 is set by aligning the alignment mark provided on the ball surface 1a of the molded substrate 1 with the detection mechanism.
Next, the cutting table on which the molded substrate 1 is placed is moved to the substrate cutting position, and the cutting line 4 set on the molded substrate 1 is cut at the substrate cutting position by using a cutting mechanism. Individual packages 5 to be cut substrates (package assemblies) 1c can be formed.
At this time, foreign substances such as cutting waste and broken materials generated by the cutting are removed by spraying cleaning water (cleaning liquid) onto the molded substrate 1 while cutting.
Therefore, the cutting table on which the molded substrate 1c (individual package 5) cut while being cleaned is placed is moved back to the substrate placement position.

JP 2003-166867 A

However, as described above, since the molded substrate 1 is cleaned while being cut, it is formed on the upper surface or the lower surface (on the ball surface 5a or the resin surface 5b) of each cut package 5, cutting waste, broken material, etc. The foreign matter remains and tends to adhere.
That is, there is an adverse effect that it is not possible to efficiently prevent foreign matters from remaining on the surface of the package 5 (on the ball surface 5a or the resin surface 5b).

  Therefore, an object of the present invention is to provide a substrate cutting method and apparatus capable of efficiently preventing foreign matters from remaining on the surface of a package.

  A substrate cutting method according to the present invention for solving the technical problem described above is to cut individual molded substrates by using a substrate cutting apparatus to form individual packages, and to clean the individual packages described above. A method of cutting a substrate to be dried, characterized in that, first, one side of each individual package is washed and dried, and then the other side of each individual package is washed and dried. To do.

  In addition, the substrate cutting method according to the present invention for solving the technical problem first places a molded substrate on a cutting table at a substrate placement position of the above-described device using a substrate cutting device. Then, the substrate is moved to the substrate cutting position of the apparatus described above, and then the individual substrate is cut by the cutting mechanism with the molded substrate placed on the cutting table described above at the substrate cutting position to form individual packages. Further, there is provided a substrate cutting method for cleaning and drying the individual packages described above, when the individual packages cut at the substrate cutting position are moved to the substrate mounting position described above. A step of washing and drying one side of each package, and the other side of the individual package described above in a state where the individual package washed and dried on the side of the one side is fastened by a fastening member. Characterized by comprising the step of washing and drying.

  Further, the substrate cutting method according to the present invention for solving the technical problem is characterized in that one surface of each individual package is selected from the substrate surface or the resin surface.

  Further, the substrate cutting method according to the present invention for solving the technical problem described above is a cutting method in which the individual packages are placed in the step of cleaning and drying one surface of the individual packages. The table is rotated at a required angle with the eccentric position of the cutting table as the center position of rotation.

  Further, a substrate cutting apparatus according to the present invention for solving the technical problem described above includes a cutting mechanism for cutting individual portions of a molded substrate to form individual packages, and mounting the molded substrate described above. And a reciprocating means for reciprocating the cutting table between a substrate mounting position and a substrate cutting position, wherein the substrate mounting position and the substrate cutting in the apparatus are described. The main cleaning unit for cleaning and drying one surface of each individual package described above is provided between the positions, and the individual packages placed on the cutting table at the substrate placement position described above are provided in the above-described apparatus. An engaging member to be engaged is provided, and a sub-cleaning section for cleaning and drying the other surface of each of the individual packages in a state where the individual packages are engaged with the engaging member. It is characterized in.

  Further, a substrate cutting apparatus according to the present invention for solving the technical problem is provided with a main cleaning section for cleaning and drying one surface side of each individual package, with respect to each individual package described above. A cleaning water spraying mechanism for injecting cleaning water and a compressed air pressure feeding mechanism for a main cleaning unit for supplying compressed air to each package cleaned by the cleaning water spraying mechanism and drying it are provided. And

  Further, the substrate cutting apparatus according to the present invention for solving the technical problem includes a sub-cleaning unit that cleans and dries the other surface of each individual package, and cleans each individual package described above. It is characterized in that a mechanism and a compressed air pressure feeding mechanism of a sub-cleaning section for feeding compressed air to each package cleaned by the above-described cleaning mechanism and drying it are provided.

  In addition, the substrate cutting apparatus according to the present invention for solving the technical problem described above has a cleaning mechanism of a sub-cleaning unit that cleans and dries the other surface of each individual package. The cleaning rubber roller rotates and contacts the other surface of the cleaning rubber roller, and a cleaning water reservoir for supplying cleaning water to the cleaning rubber roller.

  In addition, the substrate cutting apparatus according to the present invention for solving the technical problem includes a cleaning mechanism of a sub-cleaning unit that cleans and dries the other surface of each individual package. The cleaning brush roller rotates and contacts the other surface for cleaning, and a cleaning water reservoir for supplying cleaning water to the cleaning brush roller.

  In addition, the substrate cutting apparatus according to the present invention for solving the technical problem includes a cleaning mechanism of a sub-cleaning unit that cleans and dries the other surface of each individual package. It is characterized by comprising a cleaning brush member for cleaning in contact with the other surface and a brush cleaning water supply mechanism for supplying cleaning water to the cleaning brush member.

  Further, the substrate cutting apparatus according to the present invention for solving the technical problem described above is the individual package described above as a cleaning mechanism of the sub-cleaning unit that cleans and dries the other surface of the individual package. A cleaning water spray mechanism for spraying cleaning water is provided on the other surface of the structure.

  Further, the substrate cutting apparatus according to the present invention for solving the above technical problem is configured by providing two cutting tables as described above and rotating the eccentric position of the cutting table as described above. It is characterized in that a rotation mechanism that rotates at a required angle is provided.

According to the present invention, the upper and lower surfaces of individual packages (cut substrates) formed by cutting a molded substrate using the substrate cutting apparatus according to the present invention are sequentially cleaned (including drying). can do.
That is, according to the present invention, first, in the main cleaning unit (for example, cleaning water spray mechanism) of the cutting device, the upper surface of each package placed on the cutting table is cleaned (including drying), and then In the sub-cleaning unit (for example, the rubber roller cleaning unit) of the cutting device, the lower surface of each package engaged with the engaging member can be cleaned (including drying).
Therefore, according to the present invention, there is an excellent effect that it is possible to provide a substrate cutting method and apparatus that can efficiently prevent foreign matters from remaining on the surface (upper and lower surfaces) of the package. Is.

First, an embodiment according to the present invention will be described in detail with reference to an embodiment diagram.
FIG. 1 shows a substrate cutting apparatus according to the present invention.
FIG. 2 is a cutting unit of the apparatus shown in FIG.
3, 4 (1), and 4 (2) are main cleaning parts of the cutting unit shown in FIG. 2.
5 (1) and FIG. 5 (2) are the main parts of the main cleaning part in the cutting unit shown in FIG.
6 (1) and 6 (2) are sub-cleaning units (rubber roller cleaning units) in the cutting unit shown in FIG.
FIGS. 7A and 7B are other sub-cleaning units (brush roller cleaning units).
FIGS. 8A and 8B show another sub-cleaning unit (brush cleaning unit).
FIG. 9A is a substrate, and FIG. 9B is a package.

(About molded substrate and package used in the present invention)
First, the molded substrate and package used in the present invention will be described.
That is, for example, the molded substrate 1 shown in FIG. 9 (1) and the package 5 shown in FIG. 9 (2) can be used in the present invention. This molded substrate 1 is required to be mounted on the substrate 2. A plurality of electronic components (IC or the like) are formed by sealing molding (single-sided molding) in the resin molded body 3 with a resin material.
Accordingly, the resin molded body 3 is formed on one surface of the substrate 2, the surface on which the resin molded body 3 is formed becomes the mold surface (resin surface) 1a, and the opposite surface is the ball surface (substrate surface) 1a. It will be.
In order to form individual packages 5 on the ball surface (substrate surface) 1a side of the molded substrate 1 (substrate 2), a cutting line 4 [with an alignment mechanism 27 (see FIGS. 1 and 2)]. Is configured (virtually).
Therefore, by cutting the molded substrate 1 along the cutting line 4, a cutting groove having a required width corresponding to the cutting line 4 (having a required groove width) is formed on the ball surface 1 a of the molded substrate 1. A cutting kerf) is formed.
Further, as shown in FIG. 9 (2), the package 5 formed by cutting the cutting line 4 of the molded substrate 1 is separated from the ball surface 5a and the surface opposite to the ball surface 5a. And a mold surface 5b.
The package 5 includes a substrate unit 6 (substrate 2) and a resin unit 7 (resin molded body 3) provided on the mold surface 5a side of the substrate unit 6 (package 5). .
In addition, a ball electrode 8 may be formed on the ball surface 5a (1a) side of the substrate portion 6 (substrate 2).
Further, FIG. 9A shows a cut substrate 1c that is an assembly of individual packages 5 cut and separated from the molded substrate 1 (appearance is the same size as the molded substrate 1). .
Further, the cut substrate 1c (an assembly of the individual packages 5) may indicate a cleaned substrate 1c or a dried substrate 1c.
Therefore, as will be described later, by cutting the molded substrate 1 using the substrate cutting device (9) according to the present invention, it is possible to form individual packages 5 to be the cut substrate 1c.
Further, in FIG. 9A, 4a is a long-side cutting line (cutting portion in the first direction) corresponding to the long side of the rectangular shaped substrate 1 in a parallel state, and 4b is a short side. It is a cutting line in the short side direction corresponding to the parallel state (cutting part in the second direction).
In addition, referring to the direction of the cutting line (cutting part), the cutting line (4) for cutting the molded substrate 1 is set in an arbitrary direction, and various directions (for example, the first direction or (Second direction).
Reference numeral 58 denotes a cutting groove formed corresponding to the cutting line 4 by cutting the cutting line 4.

(Regarding the configuration of the substrate cutting apparatus according to the present invention)
Next, the overall configuration of the substrate cutting apparatus 9 according to the present invention will be described.
That is, as shown in FIG. 1, a substrate cutting apparatus 9 according to the present invention includes a substrate loading unit A for loading a molded substrate 1 and a molded substrate 1 transferred from the substrate loading unit A. Inspection of package cutting unit B to be cut (separated) into package 5 (cut substrate 1c), and individual package 5 cut by substrate cutting unit B to be visually inspected and classified into good products and defective products The unit C and a package accommodation unit D for accommodating the packages inspected and sorted by the package inspection unit C into good and defective products in trays.

Therefore, the molded substrate 1 loaded in the substrate loading unit A is first transferred to the substrate cutting unit B and cut into individual packages 5, and then the cut individual packages 5 are converted into package inspection units. While being inspected and selected by C, the package 5 can be separately accommodated as a good product and a defective product by the package accommodation unit D.
Further, the substrate cutting apparatus 9 according to the present invention is configured such that the units A, B, C, and D described above can be detachably connected in series in this order and installed. ing.
Moreover, in the board | substrate cutting device 9 which concerns on this invention, it is comprised so that each unit A * B * C * D can be connected detachably with the connector 10, for example.
Further, in the substrate cutting device 9 shown in FIG. 1, 9a is a front surface of the device, and 9b is a rear surface of the device.

(About the configuration of the cutting unit of the package according to the present invention)
Next, the configuration of the cutting unit B according to the present invention will be described.
That is, as shown in FIG. 2, the substrate cutting unit B includes a substrate alignment mechanism 11 for aligning the molded substrate 1 in a required direction, and a substrate cutting mechanism 12 for cutting the molded substrate 1 (mainly). Including a cleaning unit) and a package cleaning mechanism unit (sub-cleaning unit) for further cleaning each package 5 (cut substrate 1c) cut (cleaned) by the substrate cutting mechanism unit 12. ing.
Therefore, first, the molded substrate 1 supplied from the substrate loading unit A side is aligned in a required direction by the substrate alignment mechanism unit 11 and supplied to the substrate cutting mechanism unit 12, and then the substrate cutting mechanism. The molded substrate 1 is cut by the unit 12 (including cleaning of the upper surface of the package by the main cleaning unit), and the package (lower surface) can be cleaned by the package cleaning mechanism unit (sub-cleaning unit). ing.
The substrate cutting apparatus 9 (substrate cutting unit B) according to the present invention employs a twin table (two cutting tables) system.

(Regarding the configuration of the substrate alignment mechanism)
That is, as shown in FIG. 2, the substrate alignment mechanism unit 11 includes a substrate supply base 13 that supplies the molded substrate 1 from the substrate loading unit A, and a molded substrate 1 that is supplied to the substrate supply base 13. And a substrate rotation alignment means 14 for supplying and setting the molded substrate 1 aligned in a required direction by rotating at a required angle (for example, 90 degrees) to the substrate cutting mechanism 12 side. Is configured.
Accordingly, first, the molded substrate 1 is supplied and set from the substrate loading unit A to the substrate supply table 13, and then the molded substrate 1 is engaged and lifted from the substrate supply table 13, and further at a desired angle. The molded substrate 1 is aligned in a required direction (for example, in a state where the long side direction of the molded substrate 1 is matched with the Y direction) and supplied to the substrate cutting mechanism 12 side. It is configured to be able to.

(Regarding the configuration of the substrate cutting mechanism)
That is, as shown in FIGS. 2 and 3, the substrate cutting mechanism unit 12 includes individual units that are production lines in the cutting apparatus 9 (substrate cutting unit B) for substrate cutting (substrate separation). Two sets (two lines) of singulated lines are arranged.
Further, these two sets of individualized lines are arranged in parallel with the Y direction, and the arrangement positions thereof substantially coincide with a moving area 26 of the cutting table 17 described later.
In the example shown in FIG. 2, with respect to two sets of individualized lines (movement area 26 of the cutting table 17), the first individualized line (movement of the first cutting table 17 a) is on the left side. An area 26a) is arranged, and a second singulation line (a moving area 26b of the second cutting table 17b) is arranged on the right side.
Further, the substrate cutting mechanism 12 is provided with the substrate mounting means 15 and the substrate mounting means 15 in the Y direction in each of the first and second singulation lines (the moving area 26 of the cutting table 17). And reciprocating means 16 for reciprocating and guiding is provided.
In addition, a bellows member 31 that protects the reciprocating means 16 from foreign matters such as cutting dust and broken materials is provided on both sides of the substrate placing means 15 in the Y direction. It can be extended or shortened with 15 reciprocating movements.
In addition, the substrate cutting mechanism 12 includes a substrate placement position 24 and a substrate cutting position 25, and a substrate cutting position 25 between the substrate placement position 24 and the substrate cutting position 25. A main cleaning unit 72 for cleaning and drying the cut substrate 1c (individual package 5) cut from the molded substrate 1 is provided.
In the substrate cutting mechanism 12, the substrate mounting means 15 (cutting table 17) is moved between the substrate mounting position 24 and the substrate cutting position 25 by the reciprocating means 16 through the main cleaning section 72. It is configured to be able to reciprocate in the direction.

Therefore, as shown in FIGS. 2 and 3, in the first singulation line 26a, the first substrate mounting means 15a (first cutting table 17a) is placed on the substrate by the first reciprocating movement means 16a. The main cleaning unit 72 can be moved back and forth between the position 24 and the substrate cutting position 25.
Further, in the second singulation line 26b, the second substrate placing means 15b (second cutting table 17b) is moved between the substrate placing position 24 and the substrate cutting position 25 by the second reciprocating means 16b. The main cleaning unit 72 can be moved back and forth.
Regarding the constituent members related to the singulation line (moving region 26) in the substrate cutting mechanism 12, the subscript “a” is attached to the first and the subscript “b” is attached to the second. Is.

(About cutting table)
That is, as shown in FIG. 2 and FIG. 3, the placement surface on which the molded substrate 1 is placed on the substrate placement means 15 (the first substrate placement means 15 a and the second substrate placement means 15 b). A cutting table (mounting rotary table for cutting) 17 (17a, 17b) having 20 (20a, 20b) is provided.
As shown in FIGS. 1 and 2, an alignment mechanism 27 that aligns the molded substrate 1 placed on the cutting table 17 (17 a, 17 b) and sets the cutting line 4 is provided. .
That is, the molded substrate 1 is placed on the cutting table 17 (17a, 17b) with the substrate surface (ball surface) 1a being the upper surface [or with the mold surface (resin surface) 1b being the lower surface]. Can be placed.
Conversely, the molded substrate 1 can be placed on the cutting table 17 (17a, 17b) with the mold surface 1b being the upper surface (or with the substrate surface 1a being the lower surface). .
Therefore, the molded substrate 1 placed on the placement surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) can be aligned by the alignment mechanism 27.

Further, on the lower end side of the cutting table 17 (17a, 17b), the cutting table 17 (17a, 17b) is an eccentric position set on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b). The cutting table 17 (17a, 17b) is rotated at a required angle (for example, at an angle of 90 degrees) in a required direction (eccentric rotation) with 21 (21a, 21b) as the center of rotation. A rotation mechanism 18 and a table mounting base 19 on which the rotation mechanism 18 is placed are provided [see FIG. 5 (1)].
As shown in FIG. 2, a first bellows member 31a is provided on the first cutting table 17a (first substrate mounting means 15a) side, and a second cutting table 17b (second substrate) is provided. A second bellows member 31b is provided on the mounting means 15Bb) side.
Although not shown, the cutting table 17 (17a, 17b) has an adsorption fixing means for adsorbing and fixing the molded substrate 1 to the table mounting surface 20 (20a, 20b), and the table mounting surface 20 ( 20a, 20b) and a table groove corresponding to the cutting line 4 of the molded substrate 1 is provided.
Accordingly, as shown in FIGS. 2 and 3, first, the formed substrate 1 aligned by the rotary alignment means 14 on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) is supplied and set. By doing so, the molded substrate 1 can be sucked and fixed to the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) on the mold surface 1a side.
At this time, the position of the cutting line 4 of the molded substrate 1 matches the position of the table groove.
Further, in this state, the cutting table 17 (17a, 17b) is placed in a required direction at a required angle with the eccentric position 21 (21a, 21b) of the table mounting surface 20 (20a, 20b) as the center of rotation. Can be rotated.

(About the structure of the main washing section)
As shown in FIGS. 2, 3, 4 (1), and 4 (2), the main cleaning unit (spray cleaning unit) 72 has individual packages 5 placed on the first cutting table 17a. A first main cleaning unit 72a for cleaning the package and a second main cleaning unit 72b for cleaning the individual packages 5 placed on the second cutting table 17b are provided.
The first and second main cleaning units 72 (72a, 72b) are provided corresponding to the moving regions 26 (26a, 26b) of the first and second cutting tables 17 (17a, 17b), respectively. Configured.
In addition, the main cleaning unit 72 is configured to include, for example, a box body 73 (having an opening on the lower side) serving as a main body of the main cleaning unit 72, and the cutting table 17 inside the box body 73. The cut substrate 1c (individual package 5) placed on (17a, 17b) can be cleaned with cleaning water (cleaning liquid).
The box 73 has a partition plate (vertical wall-shaped plate) 75 that partitions an exterior plate 74 provided on the outer periphery thereof, and the first main cleaning portion 72a and the second main cleaning portion 72b. A partition plate 76 provided on the lower side of the partition plate 75 so as to be movable up and down, and a lid plate provided on the substrate mounting position 24 side (device front surface 9a side) of the box 73 (main cleaning unit 72). 77 (vertical wall-shaped plate) and a shutter (78) having an appropriate opening and closing method provided on the substrate cutting position 25 side (device rear surface 9b side) of the box body 73 (main cleaning unit 72). It is configured.
Therefore, in the box body 73 (main body of the main cleaning section 72) having the exterior plate 74, the partition plate 75 including the intermediate partition plate 76, the lid plate 77, and the shutter 78 (in the closed state), the exterior The washing water can be efficiently prevented from splashing.

(About the cover plate of the main cleaning section)
In addition, with respect to the lid plate 77 described above, the molded substrate 1 (individual package 5) is placed on the cutting table 17 (17a, 17b) and passes under the lid plate 77 (entrance / exit part 30). The cutting table 17 (17a, 17b) is configured to reciprocate separately in the Y direction.
Therefore, the lower (30) side of the cover plate 77 is configured to be an entrance / exit 30 where the cutting table 17 (17a, 17b) enters and exits into the main cleaning section 72.
As described above, the cover plate 77 can efficiently prevent the cleaning water from splashing from the main cleaning section 72 (72a, 72b).
Further, the cutting water (or cleaning water) used when the molded substrate 1 is cut by the cutting mechanisms 28 and 29 scatters, so that the scattered cutting water is separated from the main cleaning portion 72 (72a, 72a, 72b) can be efficiently prevented and reduced.

(About the partition plate of the main washing section)
Further, as shown in FIGS. 3 and 5 (1), in the lower side of the partition plate 75 provided between the first main cleaning unit 72 a and the second main cleaning unit 72 b in the main cleaning unit 72, An intermediate partition plate 76 is arranged to be movable up and down.
Further, the intermediate partition plate 76 moves upward and comes into contact with the partition plate 75 so as to be integrated with the partition plate 75, and between the first main cleaning unit 72 a and the second main cleaning unit 72 b in the main cleaning unit 72. The first main cleaning unit 72a and the second main cleaning unit 72b are divided and can be formed in independent spaces.
Therefore, for example, when the cut substrate 1c (individual package 5) placed on the cutting table 17a is cleaned in the first main cleaning section 72a, the first main cleaning section 71a is moved into the second cleaning section 72b. It is comprised so that washing water can be prevented efficiently.
As in the case of the first main cleaning unit 72a, for example, when the cut substrate 1c (individual package 5) placed on the cutting table 17b in the second main cleaning unit 72b is cleaned, the second The cleaning water can be efficiently prevented from splashing from the main cleaning section 71b into the first cleaning section 72a.

Further, the intermediate partition plate 76 is moved downward to be separated from the partition plate 75, so that the first main cleaning unit 72a and the second main cleaning unit in the main cleaning unit 72 are in a state where the fence is removed. The unit 72b is integrated so as to be integrated into one space.
In this case, the intermediate partition plate 76 can be moved down to a position where it does not interfere with the cutting table 17 (17a, 17b) (to a position where it does not collide).
Therefore, for example, in the first main cleaning unit 72a, the first cutting table 17a can be rotated at a required angle, for example, an angle of 90 degrees, with the eccentric position 21a as the center of rotation.
At this time, a part of the first cutting table 17a is arranged in the second main cleaning section 72b.
At this time, the cutting table 17 is reciprocated in a state where any one of the cutting tables 17 is rotated at a required angle in the main cleaning unit 72, or is reciprocated between the required angles. By moving the cutting table 17 back and forth, the cut substrate 1c (individual package 5) placed on the cutting table 17 can be cleaned.

Further, a configuration in which the middle partition plate 76 is moved up to a position where it does not interfere with the cutting table 17 (17a, 17b) (to a position where it does not collide) may be adopted.
In this case, the partition plate 76 and the cutting table 17 (17a, 17b) that rotates eccentrically at a required angle are always in a position where they interfere, but the partition plate 76 moves upward and the cutting table 17 (17a, 17b) 17b), the intermediate partition plate 76 and the cutting table 17 (17a, 17b) rotating eccentrically at a required angle are configured so as not to interfere with each other as in the case where the intermediate partition plate 76 moves downward. can do.
Therefore, when the intermediate partition plate 76 is moved up, the same operational effects as when the above-described intermediate partition plate 76 is moved down can be obtained.
Furthermore, the configuration for moving up the above-described partition plate 76 or the configuration for moving down the above-described partition plate 76 can be arbitrarily selected.

(About the shutter of the main cleaning section)
As shown in FIGS. 2 and 3, a shutter 78 having an appropriate opening and closing method is provided on the substrate cutting position 25 (apparatus rear surface 9b) side in the main cleaning unit 72.
That is, the first shutter 78a is provided on the substrate cutting position 25 (device rear surface 9b) side in the first main cleaning unit 72a, and the substrate cutting position 25 (device) in the second main cleaning unit 72b. A second shutter 78b is provided on the back surface 9b) side.
Therefore, for example, when the molded substrate 1 is cut, the shutter 78 (78a, 78b) in the opened state with the molded substrate 1 (individual package 5) placed on the cutting table 17 (17a, 17b). By passing below, the cutting table 17 (17a, 17b) can be reciprocated separately in the Y direction.
Further, when the cut substrate 1c is cleaned, the shutter 78 (78a, 78b) in the closed state is configured to block the reciprocating movement of the cutting table 17 (17a, 17b) and the shutter 78 in the closed state. It is possible to efficiently prevent the cleaning water from splashing from the main cleaning unit 72 (72a, 72b) including (78a, 78b).
Further, the closed shutter 78 (78a, 78b) causes the cutting mechanisms 28 and 29 to be contaminated by the scattered cleaning water (that is, the scattered cleaning water enters the substrate cutting position 25 side). Can be efficiently prevented and reduced.
Further, the cutting water used when the molded substrate 1 is cut by the cutting mechanisms 28 and 29 scatters, so that the scattered cutting water is transferred to the main cleaning portion 72 (by the shutter 78 (78a, 78b) in the closed state. 72a and 72b) can be efficiently prevented and reduced.

(About shutter opening and closing methods)
That is, as shown in FIGS. 4 (1) and 4 (2), on the substrate cutting position side in the main cleaning section 72 (72a, 72b), for example, a shutter whose opening / closing method is a “flying-up method (flying method)”. 78 (a first shutter 78a and a second shutter 78b) are provided separately.
The shutter 78 (78a, 78b) of the “spring-up method” includes a shutter gate plate 79 (a configuration corresponding to the cover plate 77), a support portion 80 provided on the shutter gate plate 79, and a rotation fixed to the support portion 80. A shaft 81 (rotation center position) and a shutter rotation mechanism (not shown) for rotating the rotation shaft 81 at a required angle with the position of the rotation shaft 81 as a rotation center are provided.
Therefore, the shutter gate plate 79 including the support portion 80 can be raised (raised) or lowered by rotating the shutter shaft 79 at a required angle with the rotation shaft 81 as the center of rotation. It is configured as follows.
For this reason, the substrate cutting position 25 side in the main cleaning section 72 (72a, 72b) can be opened and closed by the shutter 78 (78a, 78b).

Further, a configuration for raising the shutter 78 (78a, 78b) will be described in detail.
That is, in the example shown in FIG. 4A, the shutter gate plate 79 is configured in a horizontal plane on the upper space side of the main cleaning unit 72, and the shutter is set in an open state.
Further, in the example shown in FIG. 4B, the shutter gate plate 79 is configured in a vertical plane state on the lower space side of the main cleaning unit 72, and the shutter is set in a closed state.
Therefore, by rotating the rotation shaft 81 at a required angle by the shutter rotation mechanism, the shutter portal plate 79 is placed in the horizontal plane state (shutter open state) shown in FIG. 4 (1) and the vertical plane shown in FIG. 4 (2). It is configured to be able to reciprocate ascending or descending between states (shutter closed state).
Further, for example, as shown in FIG. 4A, when the shutter 78 (78a, 78b) is set in the open state, the shutter gate plate 79 is formed in a horizontal plane on the upper space side of the main cleaning unit 72. The cutting table 17 (17a, 17b) can reciprocate (in the horizontal direction) on the lower space side of the main cleaning section 72 (72a, 72b) which is the lower side of the shutter 78 (78a, 78b) in the horizontal plane. It is configured.
Therefore, by reciprocating the molded substrate 1 placed on the cutting table 17 (17a, 17b), the cutting mechanism 28 (62), 29 cuts into the cut substrate 1c (individual package 5). It is configured to be able to.
Further, for example, as shown in FIG. 4B, when the shutter 78 (78a, 78b) is set in the closed state, the shutter gate plate 79 is formed in a vertical surface state, and thus the shutter gate plate 79 in the vertical surface state is formed. Thus, the cleaning water can be efficiently prevented from splashing from the main cleaning section 72 (72a, 72b) to the substrate cutting position 25 side.

(Other shutters in the main cleaning section)
In the above-described main cleaning unit 72 (72a, 72b), the shutter 78 (first shutter 78a, second shutter 78b) of the “splash-up method (flying method)” is illustrated as the opening / closing method. Can be used.
For example, a system in which the shutter gate plate (shutter) is moved up and down to open and close, or a method in which the shutter gate plate (shutter) is reciprocated in the X direction (lateral direction) to open and close can be employed.

(About the washing water spray mechanism of the main washing part)
That is, as shown in FIG. 3, FIG. 4 (1), FIG. 4 (2), FIG. 5 (1), and FIG. 5 (2), the main cleaning section 72 (the first main cleaning section 72a and the second main cleaning section 72a). The cleaning unit 72b) is provided with a required number of cleaning water spray mechanisms 82 of the main cleaning unit 72 arranged in an appropriate manner.
Further, the cleaning water spray mechanism 82 sprays the cleaning water onto a predetermined range of the cut substrate 1c (individual package 5) placed on the cutting table 17 (sprays the cleaning water in a mist state). It is configured to be able to.
Further, the cutting table 17 (17a, 17b) on which the cut substrate 1c (individual package 5) is placed is reciprocated in the Y direction, so that the cleaning water spray mechanism 82 cuts the cut substrate 1c (individually). The package 5) can be cleaned.
Accordingly, the cleaning water spray mechanism 82 can efficiently clean the cut substrate 1c (individual package 5) by spraying the cleaning water to a required range in the cut substrate 1c (individual package 5). It is configured to be able to.
In particular, the cleaning water spray mechanism 82 sprays the cleaning water so that the upper surface (ball surface 5a or resin surface 5b) and the side surface of each package 5 can be efficiently cleaned. Yes.
In the example shown in FIG. 5 (1), two cleaning water spray mechanisms 82 are provided in each of the first main cleaning unit 72a and the second main cleaning unit 72b in the main cleaning unit 72. Is configured.

(About the structure of the washing water spray mechanism)
Further, the cleaning water spray mechanism 82 includes a cleaning water spray member 83 having a spray port (spray port) for discharging and spraying cleaning water in a required shape (required spray pattern) on the tip side, and cleaning water. A water supply path (water supply hose) 84 that is connected to the base end side of the spray member 83, an appropriate water supply means 85 that sprays the cleaning water spray member 83 at a required pressure through the water supply path 84, and the cleaning water spray member 83. And a spray direction setting member 86 for setting the spray direction to a required direction.
Further, the spray direction setting member 86 (for example, a bar) in the cleaning water spray mechanism 82 is provided and configured in a state where the main cleaning unit main body (side plate of the box body 73) and the partition plate 75 are passed. A required number of washing water spray members 83 are provided at a required position of the spray direction setting member 86 (for example, a bar) so as to be movable in the X direction.
That is, the required number of washing water spraying members 83 are moved separately in the X direction and arranged at required positions in the spraying direction setting member 86, and the spraying direction of the cleaning water spraying member 82 is further changed by the spraying direction setting member 86. It is configured so that it can be set in the required direction (89).
Accordingly, in the cleaning water spray mechanism 82, the cleaning water (spray water) is discharged from the tip (spray port) of the cleaning water spray member 83 through the water supply path 84 by the water supply means 85, so that the required spray shape ( For example, it is comprised so that it can spray (with the fan-shaped part 90 mentioned later).
At this time, the spray water (wash water) is sprayed in the required direction (89) from the spray port of the wash water spray member 83 arranged at a required position in the spray direction setting member 86. The sprayed substrate 1c (individual package 5) can be cleaned by spraying in a required range (87, 88).

4 (1) and FIG. 5 (2), for example, regarding the required direction of spraying spray water (cleaning water) from the cleaning water spray member 83 arranged at a required position in the spray direction setting member 86. In the example shown in the figure, the reference numeral 89 (angle from the vertical line) is used.
That is, the spray direction of the cleaning water spray member 83 can be set to an appropriate direction (for example, the angle 89) by the spray direction setting member 86 as described above.
Therefore, for example, in the example shown in FIGS. 4 (1), 4 (2), and 5 (2), the spray direction of the cleaning water spray mechanism 82 (the spray port at the tip of the cleaning water spray member 83) is changed. It is configured to be provided in a state of being slightly inclined from the direct downward direction side to the apparatus back surface 9b side (to the substrate cutting position 25 side), not directly below.
In addition, at least below the main cleaning section 72 and the substrate cutting position 25, although not shown, a storage pan (accommodating) for storing used cleaning water (including cutting water sprayed onto the blade during cutting) Device).
Further, for example, the required spray shape can be formed by discharging cleaning water (spray water) radially (in a wide-angle fan shape) from the tip (spray port) of the cleaning water spray member 83.
In the example shown in FIG. 5A, this required spray shape is indicated by a fan-shaped portion (spray water) 90.
Accordingly, the required range of the substrate 1c to which the spray water (wash water) is sprayed is the reference numeral 87 (X direction) shown in the example of FIG. 5A and the reference numeral 88 shown in the example of FIG. 5B. A range (surface) surrounded by (Y direction).
For example, in the example shown in FIG. 3, the spray port of the cleaning water spray mechanism 82 (the tip of the cleaning water spray member 83) is directed toward the lid plate 77 side of the main cleaning unit 72.

That is, for example, as shown in FIG. 5A, in the first main cleaning section 72a, two cleaning water spray mechanisms 82 are applied to the cut substrate 1c (individual package 5) placed on the cutting table 17a. The cleaning water spray member 83 can be sprayed and cleaned in a fan shape [that is, with a fan-shaped portion (spray water) 90].
At this time, the entire short side (entire width) of the cut substrate 1c (5) may be sprayed by two fan-shaped portions 90 parts by the two cleaning water spray mechanisms 82 (cleaning water spray members 83). It is comprised so that it can be performed, and it is comprised so that the required range 87 in the two washing water spray mechanisms 82 can be piled up (overlapped), and it can wash.
Further, in the example shown in FIG. 5 (1), the required ranges 87 and 88 in the two cleaning water spray mechanisms 82 (cleaning water spray members 83) are the central part of the short side of the cut substrate 1c (5). It overlaps slightly in the vicinity (overlapping).
Accordingly, as shown in FIGS. 5 (1) and 5 (2), the two washed water spray mechanisms 82 are used to cut the cut substrate 1c (individual package 5) placed on the cutting table 17a. By spraying at the required pressure in the required direction 89, the cleaning water (spray water 90) can be sprayed onto the required jet ranges 87 and 88 of the cut substrate 1c (individual package 5).
For this reason, the upper surface (ball surface 5a or resin surface 5b) and side surface of each package 5 can be efficiently cleaned.

(About the compressed air supply mechanism of the main washing part)
In addition, the first main cleaning unit 72a and the second main cleaning unit 72b in the main cleaning unit 72 are cut outside the substrate placement position 24 by the cleaning water spray mechanism 82 (main cleaning unit 72). As a drying means for drying the finished substrate 1c (individual package 5), a compressed pneumatic feeding mechanism 91 (first compressed pneumatic feeding mechanism 91a) that feeds compressed air to the cleaned substrate 1c (individual package 5) to dry it. The second compressed air pressure feeding mechanism 91b) is provided separately.
Accordingly, the first compressed air pressure feeding mechanism 91a (second compressed air pressure feeding mechanism) is applied to the cleaned substrate 1c (individual package 5) cleaned by the first main cleaning portion 72a (second main cleaning portion 72b). 91b) is configured so that the compressed substrate 1c (individual package 5) can be efficiently dried by pumping the compressed air from 91b).
At this time, the cutting table 17a (17b) on which the cleaned substrate 1c (individual package 5) is placed is reciprocated below the first compressed air pressure feeding mechanism 91a (second compressed air pressure feeding mechanism 91b). Can be moved and dried.
In addition, in a state where the cutting table 17a (17b) is rotated at a required angle (for example, 90 degrees), the first substrate is placed on the cleaned substrate 1c (individual package 5) placed on the cutting table 17a (17b). It is possible to employ a configuration in which compressed air is pumped and dried from the compressed air pressure feeding mechanism 91a and the second compressed air pressure feeding mechanism 91b.

(About the movement of the cutting table in the singulation line)
Here, regarding the singulation line 26 (the first moving region 26a and the second moving region 26b) in the cutting unit B, at the time of cutting by the cutting mechanism, at the time of cleaning by the cleaning water spray mechanism, at the time of drying by the compressed air pressure feeding mechanism In each of the above, the movement state of the cutting table (the moving range of the cutting table) will be described.

(About the movement range of the cutting table when cutting)
As shown in FIGS. 3 and 4 (1), when the molded substrate 1 placed on the first cutting table 17a (or the second cutting table 17b) is cut, the first cutting mechanism 28 ( The first blade 63) and the second cutting mechanism 29 can be used for cutting.
The first cutting mechanism 28 (first blade 63) and the kerf check mechanism 59 for inspecting the width of the cutting groove 58 formed by cutting the cutting line 4 are integrated to form an integrated cutting detecting means 62. Is formed.
That is, first, both the first shutter 78a and the second shutter 78b in the main cleaning unit 72 (the first main cleaning unit 72a and the second cleaning unit 72b) are set in an open state.
In this state, for example, by reciprocating the first cutting table 17a (or the second cutting table 17b) on which the molded substrate 1 is placed in the Y direction, the long side direction (Y The cutting line 4 (4a) along (direction) can be cut.
Further, for example, the first cutting table 17a (or the second cutting table 17b) on which the molded substrate 1 is placed is set at a required angle (for example, 90 ° with the eccentric position 21a (21b) as the center of the rotation axis). The first cutting table 17a on which the molded substrate 1 is placed (or in this state), or the long side of the molded substrate 1 is aligned with the X direction (arranged parallel to the X direction). The cutting line 4 (4b) along the short side direction (Y direction) of the molded substrate 1 can be cut by reciprocating the second cutting table 17b) in the Y direction.
When cutting the cutting line 4 of the molded substrate 1, the width of the cutting groove 58 (formed by cutting the cutting line 4) can be inspected by the kerf check mechanism 59.

That is, when the molded substrate 1 placed on the cutting table 17 (17a, 17b) is cut to form individual packages 5, the substrate cutting position (substrate cutting region) 25 and a part of the main cleaning unit 72 The cutting table 17 (17a, 17b) can be reciprocated in the “movement range (92) of the cutting table at the time of cutting” consisting of the area on the shutter 78 (78a, 78b) side. .
FIG. 3 schematically shows the “movement range 92 in the Y direction on the cutting table 17”.
That is, a part of the region of the main cleaning unit 72 used for cleaning the substrate is used as a “movement range 92 of the cutting table 17 at the time of cutting” in which the cutting table 17 (17a, 17b) reciprocates in order to cut the substrate. Therefore, the moving range 92 of the cutting table 17 used for cutting the substrate can be reduced substantially efficiently.
Therefore, the overall size of the substrate cutting device (device length in the Y direction) can be efficiently reduced.

(About the range of movement of the cutting table during spray cleaning)
Further, as shown in FIGS. 3 and 4 (2), cleaning is performed on the cut substrate 1c (individual package 5) that is cut and placed on the first cutting table 17a (or the second cutting table 17b). In the case of cleaning by spraying water (spray water), after cutting the molded substrate 1 to form the cut substrate 1c (5), first, the first cutting on which the cut substrate 1c (5) is placed The table 17a (second cutting table 17b) is placed in the first main cleaning section 72a (second main cleaning section 72b) so that the long side direction of the cut substrate 1c (5) is aligned with the Y direction ( Move in parallel to the Y direction.
Next, the first shutter 78a (second shutter 78b) is closed, and cleaning water (spray water) is sprayed from the two cleaning water spray mechanisms 82 onto the cut substrate 1c (5) for cleaning. .
At this time, the entire width (short side) of the cut substrate 1c (5) placed on the first cutting table 17a (second cutting table 17b) is sprayed water (fan-shaped) of the two cleaning water spray mechanisms 82. Part 90) can be coated (overlapped) in the spray areas 87, 88.
At this time, the two washing water spray mechanisms 82 can spray in a required direction.
Further, in this state, the first cutting table 17a (second cutting table 17b) on which the cut substrate 1c (5) is placed is moved in the Y direction in the vicinity of the position where the cleaning water spray mechanism 82 is disposed. Move back and forth.
At this time, the entire long side of the cut substrate 1c (5) placed on the first cutting table 17a (second cutting table 17b) can be sprayed and cleaned.
At this time, the first cutting table 17 a (second cutting table 17 b) on which the cut substrate 1 c (5) is placed is located in the main cleaning unit 72 and the substrate placement position (substrate placement region) 24. It will move back and forth between some parts.

That is, in the case where the cut substrate 1c (5) placed on the cutting table 17a (second cutting table 17b) is sprayed and cleaned, a part of the substrate mounting position (substrate mounting region) 24 and the main cleaning unit The first cutting table 17a (second cutting table 17b) can be reciprocated within the “movement range (93) of the cutting table 17 during spray cleaning” consisting of 72 regions. .
FIG. 3 schematically shows “the moving range 93 of the cutting table during spray cleaning”.
That is, the substrate mounting position (substrate mounting position) used for mounting the substrate is used as the “movement range 93 of the cutting table 17 during spray cleaning” in which the cutting table 17 (17a, 17b) reciprocates for spray cleaning of the substrate. Since a part of the (placement area) 24 can be used, the moving range 93 of the cutting table 17 can be reduced substantially efficiently.
Therefore, the overall size of the substrate cutting device (device length in the Y direction) can be efficiently reduced.

(About other spray cleaning in the main cleaning section)
When the cut substrate 1c (individual package 5) placed on the first cutting table 17a (second cutting table 17b) is spray-cleaned, the first cutting table 17a (second cutting table 17b) is used. The first cutting table 17a (second cutting table 17b) with the required angle rotated and held at the required angle (that is, with the cutting table inclined with respect to the Y direction). ) Can be reciprocated within the “moving range 93 of the cutting table during spray cleaning” (in the example shown in FIG. 3, the left side of FIG. 3 is indicated by a two-dot chain line in the first main cleaning portion 72a). (Refer to the inclination of the first cutting table 17a).
In this case, foreign matters such as cutting chips remaining in the cutting grooves 58 between the individual packages 5 on the cut substrate 1c can be efficiently removed.
About this required angle, the cutting table 17 (17a, 17b) should just be reciprocated in the state which does not contact the box of the main washing | cleaning part 72 (72a, 72b).
In addition, as this required angle, it can be set to 5 degrees or less with respect to the Y direction which passes the eccentric position 21 (21a, 21b), for example.

  In addition, the partition plate 76 in the main cleaning unit 72 (72a, 72b) is moved downward, and the cutting table 17 (17a, 17b) on which the cut substrate 1c (5) is placed is moved to the eccentric position 21 (21a, 21b). ) Is rotated at a required angle to match the long side direction of the cut substrate 1c (individual package 5) with the X direction. In this state, the cut substrate 1c (individual package 5) Can be cleaned by spraying cleaning water from the cleaning water spray mechanism 82 onto the cut substrate 1c (individual package 5).

(About the movement range of the cutting table during drying)
Further, as shown in FIGS. 3 and 4 (2), the cut substrate 1c (individual package 5) that has been cut and placed on the first cutting table 17a (or the second cutting table 17b) is sprayed. After the cleaning, the first cutting table is used by using the first compressed air pressure feeding mechanism 91a (or the second compressed air pressure feeding mechanism 91b) provided on the cover plate 77 side which is the apparatus front surface 9a side of the main washing section. The substrate 1c (individual package 5) placed and cleaned on 17a (or the second cutting table 17b) can be dried.
At this time, the first compressed air pressure feeding mechanism 91a (second compressed air pressure feeding mechanism 91b) and the lower side of the cover plate 77 are passed and placed on the first cutting table 17a (second cutting table 17b). The cleaned substrate 1c (individual package 5) can be reciprocated in the Y direction.
That is, the compressed air can be pumped and dried over the cleaned substrate 1c (5) placed on the first cutting table 17a (or the second cutting table 17b).
At this time, the first cutting table 17a (second cutting table 17b) on which the cut substrate 1c (5) is placed is the apparatus front surface 9a side which is a part of the main cleaning unit 72 (72a, 72b). And a part of the substrate placement position (substrate placement region).
Therefore, it is not necessary to provide the entire range in which the cutting table 17 (17a, 17b) reciprocates in order to dry the cleaned substrate 1c (5) inside the main cleaning section 72 (72a, 72b).
That is, when the cleaned substrate 1c (5) placed on the cutting table 17 (17a, 17b) is dried, a part of the substrate placement position (substrate placement region) 24 and the main cleaning unit 72 (72a, 72b) are dried. The cutting table 17 (17a, 17b) can be reciprocated within the "moving range (94) of the cutting table 17 during drying" consisting of an area on the device front surface 9a side which is a part of ing.
FIG. 3 schematically shows the “movement range 94 of the cutting table 17 during drying”.
That is, in order to dry the cleaned substrate 1c (5), the “mounting range 94 of the cutting table 17 during drying” in which the cutting table 17 (17a, 17b) reciprocates is used to mount the substrate. Since a part of the placement position (substrate placement region) 24 and a part of the main cleaning unit 72 (72a, 72b) can be used, the range 94 in which the cutting table 17 moves can be reduced substantially efficiently. be able to.
Therefore, the overall size of the substrate cutting device (device length in the Y direction) can be efficiently reduced.

(About cutting, cleaning and drying in the individualization line including the main cleaning section)
That is, for cutting the substrate, the first cutting mechanism 28 and the second cutting mechanism 29 are used to reciprocate the cutting table 17 (17a, 17b) within the moving range 92 at the time of cutting, while the cutting table 17 ( The molded substrate 1 placed on 17a, 17b) can be cut.
At this time, the shutter 78 (the first shutter 78a and the second shutter 78b) is in the open state.
For spray cleaning of the substrate, the cut substrate 1c (individual package) placed on the cutting table 17 (17a, 17b) while reciprocating the cutting table 17 (17a, 17b) in the moving range 93 at the time of spray cleaning. In 5), the washing water (spray water 90) can be sprayed from the washing water spray mechanism 82 for cleaning.
At this time, the shutters 78 (the first shutter 78a and the second shutter 78b) are in the closed state, and the main washing unit 72 (including the closed shutters 78 (the first shutter 78a and the second shutter 78b)) ( 72a and 72b) can effectively prevent the washing water from splashing outside.
For drying the substrate, the cleaned substrate 1c (individual package 5) placed on the cutting table 17 (17a, 17b) while reciprocating the cutting table 17 (17a, 17b) within the moving range 94 at the time of drying. ) Can be dried by compressing compressed air from the compressed air pressure feeding mechanism 91 (91a, 91b).
That is, as described above, as the range in which the cutting table is reciprocated in the Y direction, the above-described reciprocating movement ranges 92, 93, 94 of the cutting table can be adopted, so that the length in the Y direction in the cutting apparatus can be efficiently used. It can reduce well and can perform cutting | disconnection of a board | substrate, washing | cleaning, and drying in order.
Therefore, the overall size of the substrate cutting device (device length in the Y direction) can be efficiently reduced.

(About cleaning in the sub-cleaning section)
Next, a sub-cleaning unit that cleans the lower surface of the package will be described.
As shown in FIGS. 1 and 2, in the cutting unit B, the cut substrate 1c (individual package 5) on the cutting table 17 (17a, 17b) cleaned and dried by the main cleaning unit 72 (72a, 72b) is provided. A sub-cleaning section (rubber roller cleaning section) 96 for cleaning and drying the lower surface side of the cut substrate 1c (individual package 5) in a state of being engaged with the engaging member (first transfer) 95 is provided. ing.
That is, first, at the substrate placement position 24, the upper surface side of the cut substrate 1c (individual package 5) placed on the cutting table 17 (17a, 17b) is fastened by the fastening member 95, and then the secondary board 1c. The cleaning unit 96 is configured so that the lower surface side of the cut substrate 1c (individual package 5) can be cleaned and dried.
Therefore, in the present invention, first, the main cleaning unit 72 (72a, 72b) cleans and dries the upper surface side of the package (including the package side surface) in the cut substrate 1c (individual package 5), and then The sub-cleaning unit 96 is configured so that the lower surface side of the cut substrate 1c (individual package 5) can be cleaned and dried.
Normally, the upper surface side of the package is the ball surface 5a and the lower surface of the package is the resin surface 5b, but the opposite configuration may be adopted.
In addition, the cut substrate 1c (individual package 5) is in a state where its short side direction is matched with the X direction (in a state parallel to the X direction), and the cut substrate 1c (individual package 5) is In a state where it is engaged with the engaging member 95, it moves from the substrate mounting position 24 to the package inspection part C side.
That is, the cut substrate 1c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1c (individual package 5) is engaged with the engaging member 95, so that the sub-cleaning unit 96 performs cleaning. It is configured so that it can be dried.
Therefore, the cut substrate 1c (individual package 5) can be moved in the cleaning direction 97, which is the short side direction (X direction) of the substrate, and can be cleaned and dried. Compared to the above, the cleaning and drying time of the substrate can be efficiently shortened.

[Configuration of sub-cleaning section (rubber roller cleaning section)]
Hereinafter, the sub-cleaning section (rubber roller cleaning section) 96 provided in the cutting unit B will be described with reference to FIGS. 6 (1) and 6 (2).
That is, the sub-cleaning section (rubber roller cleaning section) 96 includes a rubber roller cleaning mechanism 98 (cleaning mechanism) for cleaning the cut substrate 1c (individual package 5) attached to the engaging member 95, and a cleaned substrate. 1c (individual package 5) is provided with a compressed air feeding mechanism 103 of a rubber roller cleaning section that feeds compressed air to dry it.
Accordingly, the cut substrate 1c (5) is first cleaned by the rubber roller cleaning mechanism 98 in a state where the cut substrate 1c (5) is fixed to the engaging member 95, and then dried by the compressed air pressure feeding mechanism 103. It is comprised so that it can be made to.

The rubber roller cleaning mechanism 98 includes a cleaning rubber roller 99 that absorbs the cleaning water and cleans the substrate 1c (individual package 5) while rotating, and a cleaning water reservoir 100 that supplies the cleaning rubber roller 99 with the cleaning water. , A draining roller 101 that adjusts the amount of cleaning water supplied to the cleaning rubber roller 99, an advancing / retracting means 102 that advances and retracts the draining roller 101 in the direction of the cleaning rubber roller 99, and a rotation mechanism such as a motor that rotates the cleaning rubber roller in a required direction. (Not shown) are provided.
The cleaning rubber roller 99 is formed of, for example, silicon rubber and can be formed in a sponge shape to absorb cleaning water.
That is, the cleaning rubber roller 99 is rotated by a rotating mechanism in a direction opposite to the substrate cleaning direction 97 (from left to right in the example) (counterclockwise in the example) and the water stored in the water storage tank 100 is stored. The cleaning rubber roller 99 is immersed in water so that cleaning water can be supplied to the cleaning rubber roller 99.
Further, the water draining roller 101 is advanced to the cleaning rubber roller 99 side by the advancing / retreating means 102 and the cleaning rubber roller 99 is pressed, so that the cleaning water amount of the cleaning rubber roller 99 can be adjusted.
Further, the rotating cleaning rubber roller 99 is brought into contact with the lower surface of the substrate 1c (individual package 5) engaged with the engaging member 95, and foreign matters such as cutting scraps and broken materials remaining on the lower surface of the package 5 are cleaned with the cleaning rubber roller. By moving to the 99 side and making it adhere, it is comprised so that a foreign material can be removed from the lower surface of the board | substrate 1c (individual package 5).
Further, the foreign matter transferred to the washing water in the water storage tank 100 can be removed from the water storage tank 100 by supplying the cleaning water to the water storage tank 100 and causing it to overflow (overflow). .

Accordingly, first, as shown in FIG. 6A, at the substrate placement position 24, the cut is placed on the cutting table 17 (17a, 17b) and cleaned and dried by the main cleaning unit 72 (72a, 72b). The substrate 1c (individual package 5) is engaged with the engaging member 95, and in this state, the substrate 1c (individual package 5) is moved in the X direction (in the cleaning direction 97) on the side of the auxiliary cleaning unit (rubber roller cleaning unit) 96.
At this time, the short side direction of the substrate of the cut substrate 1c (individual package 5) coincides with the X direction.
Next, as shown in FIG. 6 (2), the cut substrate 1 c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1 c (individual package 5) is engaged by the engagement member 95. By moving the cleaning rubber roller 99 supplied with the cleaning water from the cleaning water storage tank 100 and whose cleaning water amount is adjusted by the draining roller 101, the cleaning rubber roller 99 is brought into contact with the lower surface side of the cut substrate 1c (individual package 5). can do.
Next, the substrate 1c (individual package 5) cleaned by the cleaning rubber roller 99 is engaged with the engaging member 95, and the cleaned substrate 1c (5) is moved in the cleaning direction 97 to compress it. The compressed air can be pumped from the pneumatic feeding mechanism 103 to the substrate 1c (5) to dry the substrate 1c (5).
Accordingly, foreign matter such as cutting waste and broken material adhered to the lower surface (ball surface 5a or substrate surface 5b) side of the cut substrate 1c (individual package 5) by the cleaning rubber roller 99 of the sub-cleaning portion (rubber roller cleaning portion) 96. Can be efficiently removed.

That is, in the present invention, first, in the main cleaning section 72 (72a, 72b), the upper surface of the package 5 (including the package side surface) in the cut substrate 1c (individual package 5) is washed and dried. In the sub-cleaning unit (rubber roller cleaning unit) 96, the lower surface of the package 5 in the cut substrate 1c (individual package 5) can be cleaned and dried.
Therefore, in the present invention, it is possible to efficiently remove foreign matters such as cutting chips and broken materials adhering to the upper and lower surfaces (surfaces) of the cut substrate 1c (individual package 5).

(About the substrate cutting method according to the present invention)
Next, the substrate cutting method according to the present invention will be described using the substrate cutting device 9 (cutting unit B) according to the present invention.

That is, first, the molded substrate 1 is supplied and set from the substrate loading unit A to the substrate alignment mechanism 11 (substrate supply table 13) in the substrate cutting unit B, and the molded substrate 1 is rotated and aligned by the rotating alignment means 14. Aligned in a required direction and supplied to the mounting surface 20a (20b) of the first cutting table 17a (or the second cutting table 17b) present at the substrate mounting position 24.
At this time, the molded substrate 1 can be mounted on the table mounting surface 20a (20b) by suction and fixation.
Next, the first cutting table 17 a is moved to the substrate cutting position 25 with the molded substrate 1 placed thereon.
At this time, the vertical wall-shaped bellows members 31a separately provided on both sides of the first cutting table 17a extend the one bellows member 31a on both sides thereof as the first cutting table 17a is moved, and The other bellows member 31a on both sides is reduced.
At this time, the first shutter 78a and the second shutter 78b are set to the open state separately.

Next, at the substrate cutting position 25, the cutting line 4 (4a, 4b) in the molded substrate 1 is cut using the first cutting mechanism 28 (integrated cutting detecting means 62) and the second cutting mechanism 29. Thus, the cut substrate 1c (individual package 5) can be formed.
At this time, as described above, the eccentric position 21a on the mounting surface 20a of the first cutting table 17a is set as the rotation center position, and the first cutting table 17a is moved at a required angle (for example, an angle of 90 degrees). The cutting line 4 (4a, 4b) can be cut by rotating, and the first cutting table 17a can be rotated back to the original position.
At this time, the width of the cutting groove 58 corresponding to the cutting line 4 can be detected by the kerf check mechanism 59 (integrated cutting detecting means 62).
Further, at this time, in the “moving range 92 of the cutting table 17a at the time of cutting” consisting of the substrate cutting position 25 (substrate cutting region) and a part on the shutter 78 (78a, 78b) side in the region of the main cleaning unit 72, The first cutting table 17a can be reciprocated.
Accordingly, individual packages 5 (cut substrates 1c) can be formed on the mounting surface 20a of the first cutting table 17a.

Next, after the substrate is cut, the first cutting table 17a on which the cut substrate 1c (individual package 5) is placed is moved into the first main cleaning section 72a and the required number of cleanings are performed. Cleaning water (90) is sprayed from the water spray mechanism 82 onto the cut substrate 1c (individual package 5) on the first cutting table 17a for cleaning.
At this time, the first cutting table 17a on which the cut substrate 1c (individual package 5) is placed is separated from a part of the substrate placement position (substrate placement region) 24 and the region of the main cleaning unit 72 (72a). The first cutting table 17a is reciprocated within the “movement range 93 of the cutting table 17a during spray cleaning”.
Therefore, by spraying the cleaning water (90) onto the cut substrate 1c (individual package 5), the foreign matter attached to the upper surface of the package 5 including the package side surface can be efficiently removed.

Next, after cleaning the substrate, the compressed air is pumped from the first compressed air pressure feeding mechanism 91a to the first cutting table 17a on which the cleaned substrate 1c (individual package 5) is placed and dried. It will be.
At this time, the first cutting table 17 a on which the cut substrate 1 c (individual package 5) is placed is placed on a part of the substrate placement position (substrate placement region) 24 and the apparatus front surface 9 a in the region of the main cleaning unit 72. The first cutting table 17a is reciprocated in the “movement range 94 of the cutting table 17a during drying” which is a part of the side (the first compressed air pressure feeding mechanism 91a side).

Next, the first cutting table 17a on which the dried substrate 1c (individual package 5) is placed is returned to the substrate placement position 24, and the dried substrate 1c ( The individual packages 5) are engaged by the engaging members 95 and moved from the substrate mounting position 24 in the cleaning direction 97 (the moving direction of the package 5), which is the direction of the package on the inspection unit C side.
That is, next, in the sub-cleaning section (rubber roller cleaning section) 96, the substrate 1 c (individual package 5) is passed in the cleaning direction 97 over the sub-cleaning section (rubber roller cleaning section). The lower surface side of each package 5) is brought into contact with the cleaning rubber roller 99 for cleaning.
Next, in the sub-cleaning unit (rubber roller cleaning unit) 96, the compressed air is pumped from the compressed air feeding mechanism 103 to the lower surface of the substrate 1c (individual package 5) to dry the substrate 1c (individual package 5). It will be.
Thereafter, the board 1c (individual package 5) attached to the engaging member 95 is inspected by the inspection unit C.

  Note that the molded substrate 1 placed on the placement surface 20b of the second cutting table 17b is cut into the molded substrate 1 as in the case of the first cutting table 17a, and the second main cleaning section 72a. Thus, the cut substrate 1c (individual package 5) can be washed and dried.

(Operational effects according to the present invention)
That is, in the present invention, as described above, first, in the main cleaning unit 72 (72a, 72b), the upper surface of the package 5 (including the package side surface) in the cut substrate 1c (individual package 5) is cleaned. Then, the sub-cleaning section (rubber roller cleaning section) 96 can clean and dry the lower surface of the cut substrate 1c (individual package 5).
Therefore, in the present invention, it is possible to efficiently remove foreign matters such as cutting chips and broken materials adhering to the upper and lower surfaces (surfaces) of the cut substrate 1c (individual package 5).
Further, in the cutting unit B of the apparatus according to the present invention, the moving range (Y direction) of the cutting table 17 (17a, 17b) is the moving range 92 at the time of cutting, the moving range 93 at the time of spray cleaning, and at the time of drying. Each of the moving ranges 94 can be efficiently shortened individually.
Therefore, the overall size of the substrate cutting device (device length in the Y direction) can be efficiently reduced.

(About other spray cleaning in the main cleaning section)
Note that the first cutting table 17a is slightly placed so that the first cutting table 17a does not come into contact with the main body (wall plate) 73 of the main cleaning section 72 during spray cleaning of the cut substrate 1c (individual package 5). The first cutting table 17a can be reciprocated in this state by rotating at a proper angle.
In this case, the foreign matter adhering to the side surface of the package 5 in the cutting groove 58 formed by cutting can be efficiently removed.

In addition, as described above, when the cut substrate 1c (individual package 5) is cleaned by spraying with the cleaning water spray mechanism 82, it is between the first main cleaning unit 72a and the second main cleaning unit 72b. The first main cleaning section 72a and the second main cleaning section 72b are integrated and integrated into one cleaning section (72) by lowering (upward moving) the provided partition plate 76. Can do.
Therefore, the first cutting table 17a on which the cut substrate 1c (individual package 5) is placed is rotated at a required angle (for example, 90 degrees), and in this state, the first cutting table 17a is reciprocated. By moving, it can be sprayed and cleaned by the required number of cleaning water spray mechanisms 82 provided in the first main cleaning section 72a and the second main cleaning section 72b.
At this time, the first cutting table 17a is cut by the required number of washing water spray mechanisms 82 while reciprocally rotating (rotating) between the required angles with the eccentric position 21a as the center of rotation. The finished substrate 1c (individual package 5) can be sprayed and cleaned.
In this case, the foreign matter adhering to the side surface of the package 5 in the cutting groove 58 formed by cutting can be efficiently removed.

(Regarding the configuration of another sub-cleaning unit according to the present invention)
In the above-described embodiment, the configuration of the sub-cleaning unit (rubber roller cleaning unit) 96 having the cleaning rubber roller 99 is illustrated as the sub-cleaning unit. However, instead of the sub-cleaning unit 96 having the cleaning rubber roller 99, a cleaning brush roller is used. The structure of the sub-cleaning part (brush roller cleaning part) which has, or the sub-cleaning part (brush cleaning part) which has a cleaning brush member is employable.

[Configuration of sub-cleaning section (brush roller cleaning section)]
That is, as shown in FIGS. 7A and 7B, a sub-cleaning unit (brush roller cleaning unit) 105 having the cleaning brush roller 104 can be used as the sub-cleaning unit.
Since the main configuration of the sub-cleaning unit (brush roller cleaning unit) 105 is the same as that of the sub-cleaning unit (rubber roller cleaning unit) 96, the same reference numerals are given.
As shown in FIGS. 7A and 7B, the sub-cleaning unit (brush roller cleaning unit) 105 includes a brush roller cleaning mechanism that cleans the lower surface of the cut substrate 1c (individual package 5). 106 (cleaning mechanism) and a compressed air supply mechanism 103 of the brush roller cleaning unit are provided.
Accordingly, the cut substrate 1c (5) is first cleaned by the brush roller cleaning mechanism 106 in a state where the cut substrate 1c (5) is fixed to the engaging member 95, and then the compressed air pressure feeding mechanism 103 is used. It is configured so that it can be dried.

Further, as shown in FIGS. 7A and 7B, the brush roller cleaning mechanism 106 includes a cleaning brush roller 104 that cleans while rotating the lower surface of the cut substrate 1c (individual package 5), A cleaning water reservoir 100 for supplying cleaning water to the cleaning brush roller 104 and a rotation mechanism (not shown) such as a motor for rotating the cleaning brush roller 104 in a required direction are provided.
Therefore, first, as shown in FIG. 7 (1), at the substrate mounting position 24, the cut is placed on the cutting table 17 (17a, 17b) and washed and dried by the main cleaning unit 72 (72a, 72b). The substrate 1c (individual package 5) is engaged with the engaging member 95, and in this state, the substrate 1c (individual package 5) can be moved in the X direction (in the cleaning direction 97) on the side of the sub-cleaning unit (brush roller cleaning unit) 105. .
At this time, the short side direction of the substrate of the cut substrate 1c (individual package 5) coincides with the X direction.
Next, as shown in FIG. 7 (2), the cut substrate 1 c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1 c (individual package 5) is engaged with the engagement member 95. By moving, the cleaning water is supplied from the cleaning water reservoir 100 and the cleaning brush roller 104 can be cleaned by contacting the lower surface side of the cut substrate 1c (individual package 5).
Next, the cut substrate 1c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1c (individual package 5) cleaned by the cleaning brush roller 104 is engaged by the engagement member 95. By doing so, the compressed air can be pumped from the compressed air feeding mechanism 103 to dry the cut substrate 1c (individual package 5).
Therefore, the cutting brush, the broken material, etc. attached to the lower surface (ball surface 5a or substrate surface 5b) side of the cut substrate 1c (individual package 5) by the cleaning brush roller 104 in the sub-cleaning unit (brush roller cleaning unit) 105. The foreign matter can be efficiently removed.

In the sub-cleaning unit (brush roller cleaning unit) 105, similarly to the sub-cleaning unit (rubber roller cleaning unit) 96, a draining roller (101) for adjusting the amount of cleaning water supplied to the cleaning brush roller 104, and a draining roller The advancing / retreating means (102) may be provided.
Further, in the sub-cleaning unit (brush roller cleaning unit) 105, a cleaning water spraying unit that sprays cleaning water directly onto the cleaning brush roller 104 may be provided.

[Configuration of sub-cleaning unit (brush cleaning unit)]
As shown in FIGS. 8A and 8B, a sub-cleaning unit (brush cleaning unit) 111 having a cleaning brush member can be used as the sub-cleaning unit.
That is, as shown in FIGS. 8A and 8B, the sub-cleaning unit (brush cleaning unit) 111 includes a brush cleaning mechanism 112 that cleans the lower surface side of the cut substrate 1c (individual package 5). (Cleaning mechanism) and the compressed air pressure feeding mechanism 103 of the brush cleaning unit are provided.
Further, the brush cleaning mechanism 112 includes a cleaning brush member 113 for cleaning the lower surface side of the cut substrate 1c (individual package 5), and cleaning water for the brush cleaning unit that sprays and supplies cleaning water to the cleaning brush member 113. Supply means 114 is provided.
Accordingly, first, as shown in FIG. 8A, at the substrate mounting position 24, the cut is placed on the cutting table 17 (17a, 17b) and washed and dried by the main cleaning unit 72 (72a, 72b). The substrate 1c (individual package 5) is engaged with the engaging member 95, and in this state, the substrate 1c (individual package 5) can be moved in the X direction (in the cleaning direction 97) on the side of the sub-cleaning unit (brush cleaning unit) 111.
At this time, the short side direction of the substrate of the cut substrate 1c (individual package 5) coincides with the X direction.
Next, as shown in FIG. 8 (2), the cut substrate 1 c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1 c (individual package 5) is engaged by the engagement member 95. By moving, the brush member 113 supplied with the cleaning water from the cleaning water supply mechanism 114 can be brought into contact with the lower surface of the cut substrate 1c (individual package 5) for cleaning.
Next, the cut substrate 1c (individual package 5) is moved in the cleaning direction 97 in a state where the cut substrate 1c (individual package 5) cleaned with the brush member 113 is engaged with the engagement member 95. Thus, the compressed air can be pumped from the compressed air feeding mechanism 103 to dry the cut substrate 1c (individual package 5).
Accordingly, foreign matter such as cutting dust or broken material adhered to the lower surface (ball surface 5a or substrate surface 5b) side of the cut substrate 1c (individual package 5) by the brush member 113 of the sub-cleaning portion (brush cleaning portion). Can be efficiently removed.

In the sub-cleaning unit (brush cleaning unit) 111, a configuration in which the brush member 113 is reciprocated in the X direction or the Y direction, or a configuration in which the brush member 113 is swung can be employed.
That is, foreign matter such as cutting waste and broken material adhered to the lower surface side of the cut substrate 1c (individual package 5) by the brush member 113 that reciprocally moves (or by the brush member that swings as described above). Can be efficiently removed.

Although not shown, the cleaning member spraying means of the brush cleaning unit 111 for cleaning by spraying the cleaning water on the lower surface side of the package 5 may be provided on the substrate mounting position 24 side of the brush member 113. good.
Alternatively, the cleaning water spraying means of the brush cleaning unit may be provided between the cleaning water supply mechanism 114 and the compressed air pressure feeding mechanism 103.
Note that the washing water spray mechanism 82 provided in the main washing unit 72 described above may be used as the washing water spraying means of the brush washing unit 111 described above.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

Further, the compressed air pressure feeding mechanism 103 provided in each of the sub-cleaning units 96, 105, and 111 and the compressed air pressure feeding mechanism 91 provided in the main cleaning unit 72 have the same configuration. Therefore, the same effect (drying) can be obtained.
In the above-described embodiment, for example, an air knife (registered trademark) can be used as the compressed air pressure feeding mechanisms 91 and 103.

Further, in the above-described embodiment, as a cleaning mechanism of the sub-cleaning unit, an appropriate cleaning water spraying means for cleaning by spraying cleaning water on the lower surface of the cut substrate 1c (individual package 5) may be provided. it can.
As the above-described washing water spraying means, the washing water spray mechanism 82 provided in the above-described main washing unit 72 may be used.

(About the configuration of other units)
That is, the substrate loading unit A includes a substrate loading unit 41 that loads the molded substrate 1 and an extrusion member 42 that pushes the molded substrate 1 from the substrate loading unit 41.
Therefore, the molded substrate 1 can be supplied to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B by extruding the molded substrate 1 from the substrate loading unit 41 by the pushing member 42. It is configured as follows.
The package inspection unit C includes a package supply unit 43 that supplies individual packages 5 (cut substrates 1c) cut by the substrate cutting unit B, and individual packages 5 (1c) from the package supply unit 43. ) To inspect the individual packages 5 by the package inspection unit 44, and the packages 5 inspected by the package inspection units 44 and 45 are classified into good products and defective products. Package sorting means 46 for transferring to the package accommodation unit D is provided.
Accordingly, in the package inspection unit C, each package 5 (1c) supplied from the substrate cutting unit B to the package supply unit 43 is inspected by the camera 45 by the package inspection unit 44, whereby the package selection unit 46 is inspected. Thus, it can be sorted into non-defective products and defective products and transferred to the package accommodation unit D.
The package housing unit D includes a non-defective product tray 47 that stores non-defective products and a defective product tray 48 that stores defective products.
Therefore, in the package housing unit D, the package 5 inspected as a non-defective product by the package inspection unit C is stored in the non-defective product tray 47 by the package sorting means 46, and the package 5 inspected as a defective product is stored in the package sorting means 46. Can be accommodated in the defective product tray 48.

As described above, the package inspection unit C is a unit that inspects the package 5 cut from the molded substrate 1 with an inspection camera (inspection mechanism).
That is, in the inspection unit C, the ball surface 5a (including the package size) of the package 5 can be inspected first, and then the resin surface 5b of the package 5 can be inspected.
Furthermore, in the inspection unit C, the ball surface 5a of each package 5 (1c) is placed on the first plate with the ball surface 5a as the upper surface, and is reversed in this state, and is individually viewed by the inspection camera from the lower position. The ball surface 5a of the package 5 (1c) is inspected, and then the package 5 (1c) is placed on the second plate with the resin surface 5b of the package 5 (1c) as the upper surface, and this package 5 ( The resin surface 5b of 1c) can be inspected with an inspection camera.

FIG. 1 is a schematic plan view schematically showing a substrate cutting apparatus according to the present invention. FIG. 2 is an enlarged schematic plan view schematically showing an enlarged main part (package cutting unit) in the substrate cutting apparatus shown in FIG. FIG. 3 is an enlarged schematic plan view schematically showing an enlarged main part (main cleaning part) of the substrate cutting apparatus shown in FIG. 4 (1) and 4 (2) are enlarged schematic longitudinal sectional views schematically showing an enlarged main part (main cleaning part) of the substrate cutting apparatus shown in FIG. ) Shows the open state of the apparatus shutter, and FIG. 4B shows the closed state of the apparatus shutter. FIG. 5 (1) is an enlarged schematic longitudinal sectional view schematically showing an essential part (main cleaning part) of the substrate cutting apparatus shown in FIG. FIG. 5 (2) schematically shows an enlarged main part (main cleaning part) of the substrate cutting apparatus shown in FIG. 2 (cut in the Y direction). This is an enlarged schematic longitudinal sectional view showing a state of jetting the cleaning water of the cleaning water injection mechanism provided in the apparatus. 6 (1) is an enlarged schematic plan view schematically showing an enlarged main part (sub-cleaning part) of the substrate cutting apparatus shown in FIG. 2, and FIG. 6 (2) is shown in FIG. 6 (1). It is an expansion schematic front view which expands and shows an apparatus principal part roughly. FIG. 7 (1) is an enlarged schematic plan view schematically showing an enlarged main part (sub-cleaning part) of another substrate cutting apparatus according to the present invention, and FIG. 7 (2) is an enlarged schematic plan view of FIG. It is an expansion schematic front view which expands and shows roughly the principal part of an apparatus shown in FIG. FIG. 8 (1) is an enlarged schematic plan view schematically showing an enlarged main part (sub-cleaning part) of another substrate cutting apparatus according to the present invention, and FIG. 8 (2) is FIG. 8 (1). It is an expansion schematic front view which expands and shows roughly the principal part of an apparatus shown in FIG. FIG. 9 (1) is a schematic perspective view schematically showing a molded substrate used in the present invention, and FIG. 9 (2) shows a package formed by cutting the molded substrate shown in FIG. 9 (1). It is a schematic perspective view.

Explanation of symbols

1 Molded substrate 1a Ball surface (substrate surface)
1b Mold surface (resin surface)
1c Cut substrate (package assembly)
1c (5) Cut substrate (individual package)
2 Substrate 3 Resin molding 4 Cutting line 4a Longitudinal cutting line (cutting part in the first direction)
4b Transverse line (second direction cut)
5 Package 5a Ball surface 5b Mold surface 5 (1c) Package assembly (cut substrate)
DESCRIPTION OF SYMBOLS 6 Substrate part 7 Resin part 8 Ball electrode 9 Substrate cutting device 9a Device front surface 9b Device rear surface 10 Connector 11 Substrate alignment mechanism part 12 Substrate cutting mechanism part 13 Substrate supply stand 14 Substrate rotation alignment means 15 Substrate placement Means 15a First substrate placing means 15b Second substrate placing means 16 Reciprocating means 16a First reciprocating means 16b Second reciprocating means 17 Cutting table 17a First cutting table 17b Second Cutting table 18 Rotating mechanism 19 Table mount 20 Mounting surface (cutting table)
20a First placement surface (placement surface of the first cutting table)
20b 2nd mounting surface (mounting surface of 2nd cutting table)
21 Eccentric position (center position of rotation)
21a First eccentric position (the eccentric position of the first cutting table)
21b Second eccentric position (the eccentric position of the second cutting table)
24 Substrate placement position 25 Substrate cutting position 26 Moving area (single line)
26a First moving area (moving area of the first cutting table)
26b Second moving area (moving area of the second cutting table)
27 Alignment mechanism 28 First cutting mechanism 29 Second cutting mechanism 30 Entrance / exit part (below the cover plate)
31 Bellows member 31a 1st bellows member 31b 2nd bellows member 33 Minimum interval 41 Substrate loading section 42 Extruding member 43 Package supply section 44 Package inspection section 45 Inspection camera 46 Package selection means 47 Non-defective tray 48 Defective tray 58 Cutting groove (calf)
59 Calf check mechanism (calf detection mechanism)
62 Integrated cutting detection means 63 First blade 72 Main cleaning section 72a First main cleaning section 72b Second main cleaning section 73 Box body (main body) of main cleaning section
74 Exterior plate 75 Partition plate 76 Middle partition plate 77 Cover plate 78 Shutter 78a First shutter 78b Second shutter 79 Shutter gate plate 80 Support portion 81 Rotating shaft 82 Washing water spray mechanism 83 Washing water spray member 84 Water supply path (hose)
85 Water supply means 86 Spray direction setting member (bar)
87 Spray range (X direction)
88 Spray range (Y direction)
89 Required direction (spraying direction)
90 Fan-shaped part (spray water)
91 Compressed Pneumatic Feeding Mechanism 91a First Compressed Pneumatic Feeding Mechanism 91b Second Compressed Pneumatic Feeding Mechanism 92 Moving Range of Cutting Table During Cutting 93 Moving Range of Cutting Table During Spray Cleaning 94 Moving Range of Cutting Table During Drying 95 Anchor member (first transfer)
96 Sub-cleaning section (rubber roller cleaning section)
97 Cleaning direction (Moving direction of package)
98 Rubber roller cleaning mechanism 99 Cleaning rubber roller 100 Water storage tank 101 Water draining roller 102 Water draining roller advance / retreat means 103 Compressed air feeding mechanism 104 Cleaning brush roller 105 Sub-cleaning section (brush roller cleaning section)
106 Brush roller cleaning mechanism 111 Sub-cleaning unit (brush cleaning unit)
112 Brush cleaning mechanism 113 Cleaning brush member 114 Cleaning water supply mechanism A Substrate loading unit B Substrate cutting unit C Package inspection unit D Package accommodation unit

Claims (10)

Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A cutting method of a substrate in which each package is formed by cutting with a cutting mechanism in a state where the above-described molded substrate is placed on the above-described cutting table, and further, the individual package is washed and dried. ,
When the individual package cut at the substrate cutting position is moved to the substrate mounting position, a process of cleaning and drying one surface of the individual package;
A step of washing and drying the other surface of each of the individual packages in a state in which the individual package washed and dried by the engagement member is engaged with the one surface side described above ,
In the step of cleaning and drying one surface of the individual package, the cutting table on which the individual package is placed is rotated at a required angle with the eccentric position of the cutting table being the center position of rotation. A method for cutting a substrate, which is characterized. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A cutting method of a substrate in which each package is formed by cutting with a cutting mechanism in a state where the above-described molded substrate is placed on the above-described cutting table, and further, the individual package is washed and dried. ,
  When the individual package cut at the substrate cutting position is moved to the substrate mounting position, a process of cleaning and drying one surface of the individual package;
  A step of washing and drying the other surface of each of the individual packages in a state in which the individual package washed and dried by the engagement member is engaged with the one surface side described above,
During the process of cleaning and drying one surface of each individual package, the cutting table on which the individual package is placed is reciprocated at a required angle with the eccentric position of the cutting table as the center of rotation. A method for cutting a substrate. 3. The substrate cutting method according to claim 1, wherein one surface of each package is selected from a substrate surface or a resin surface. A cutting mechanism that cuts a required portion of the molded substrate to form individual packages, a cutting table for mounting the molded substrate, and a position between the substrate mounting position and the substrate cutting position for the cutting table. A substrate cutting apparatus having a reciprocating means for reciprocating, wherein the main cleaning is performed by cleaning one surface of each individual package between the substrate mounting position and the substrate cutting position in the apparatus described above. And an engaging member for engaging the individual packages placed on the cutting table at the substrate mounting position, and the individual packages described above to the engaging members. secondary cleaning unit and configured by providing the two said cutting table to washed and dried the other surface of the individual packages described above in state, while constructed by providing, cutting the hand of which an Cutting device for the substrate, characterized in that which is configured by providing a rotation mechanism for rotating at a desired angle by the eccentric position of the cutting table above the table to the center position of rotation. A cleaning water spray mechanism for injecting cleaning water onto each of the individual packages described above on the main cleaning section that cleans and dries one surface side of each package, and an individual that has been cleaned by the above-described cleaning water spray mechanism. 5. The substrate cutting apparatus according to claim 4, wherein the package is provided with a compressed air pressure feeding mechanism of a main cleaning section that feeds compressed air to dry the package. In the sub-cleaning unit that cleans and drys the other surface of each package, the cleaning mechanism that cleans the individual package described above, and the compressed air is pumped and dried to the individual package cleaned by the cleaning mechanism described above. 5. The substrate cutting apparatus according to claim 4, further comprising a compressed air pressure feeding mechanism for the sub-cleaning unit. The cleaning mechanism of the sub-cleaning unit that cleans and dries the other surface of each package rotates the other surface of each package in contact with the cleaning rubber roller, and the cleaning rubber roller has cleaning water. The substrate cutting device according to claim 6, wherein the substrate cutting device is configured to include a cleaning water reservoir for supplying water. The cleaning mechanism of the sub-cleaning unit that cleans and dries the other surface of each package is a cleaning brush roller that rotates in contact with the other surface of each package and cleans it, and the cleaning brush roller described above. The substrate cutting device according to claim 6, wherein the substrate cutting device is configured with a cleaning water reservoir for supplying cleaning water. The cleaning mechanism of the sub-cleaning unit that cleans and dries the other surface of each package, the cleaning brush member that contacts and cleans the other surface of each individual package, and cleaning water is supplied to the aforementioned cleaning brush member The substrate cutting apparatus according to claim 6, comprising a brush cleaning water supply mechanism for supplying the substrate. A cleaning water spray mechanism for spraying cleaning water on the other surface of each individual package is provided as a cleaning mechanism for the sub-cleaning unit that cleans and drys the other surface of each package. The substrate cutting device according to claim 6 .

Images