KR20070074401A - Sawing and handling apparatus for manufacturing semiconductor - Google Patents

Abstract

A sawing and handling apparatus for manufacturing a semiconductor is provided to effectively remove foreign materials attached on a rim region of a unit picker by rotating a nozzle body for injecting cleaning solution and air. An on-loading unit(100) supplies a processing target. A cutting unit(200) cuts the processing target provided from the on-loading unit. A brushing unit(300) brushes the processing target cut by the cutting unit. A cleaning unit(400) cleans the processing target brushed by the brushing unit. A dry unit(500) dries the processing target cleaned by the cleaning unit. A vision inspection unit(600) inspects an error rate of the processing target dried by the dry unit. An off-loading unit(700) loads the processing target inspected by the vision inspection unit. The cleaning unit injects cleaning solution in a rotating manner.

Description

Cutting and handling apparatus for semiconductor manufacturing process

1 is a plan view showing the entire arrangement of a cutting and processing apparatus for a conventional semiconductor manufacturing process,

2 is a plan view showing the entire arrangement of the cutting and processing apparatus for a semiconductor manufacturing process according to an embodiment of the present invention,

3 is a plan view illustrating a brushing apparatus of a cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2;

4 is a cross-sectional view of the brushing apparatus shown in FIG.

5 and 6 are cross-sectional views illustrating an operating state of the first brushing device and the second brushing device, respectively.

FIG. 7 is a plan view illustrating a cleaning apparatus of a cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2;

8 and 9 are cross-sectional views showing the internal configuration of the washing apparatus shown in FIG.

10 to 12 are cross-sectional views showing an operating state of the washing apparatus shown in FIG.

13 to 15 are cross-sectional views illustrating a process of discharging scrap adsorbed to a unit picker to a scrap box in a cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2;

16 to 28 are plan views illustrating operating states of a cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2.

* Description of the symbols for the main parts of the drawings *

100: on-loading device 110: pusher

120: gripper 130: inlet rail

150: strip picker 200: cutting device

210: chuck table 220: spindle

250: unit picker 300: brushing device

310: brush body 320: brush

330: brush driving device 340: guide rail

400: cleaning device 410: housing

420: rotary body 430: nozzle body

442: high pressure water nozzle 444: high temperature water nozzle

446: air nozzle 450: nozzle drive device

500: drying device 550: turntable picker

650: turntable 600: vision inspection device

670: shooting picker 700: off-loading device

The present invention relates to a cutting and processing apparatus for a semiconductor manufacturing process, and more particularly, to a cutting and processing apparatus for a semiconductor manufacturing process that can effectively remove foreign substances generated in the cutting process.

In general, a semiconductor manufacturing process is mainly composed of a FAB (fabrication) process and an assembly process. In the FAB process, an integrated circuit is designed on a silicon wafer to form a semiconductor chip.In an assembly process, a lead frame is attached to a semiconductor chip, and wire bonding or A soldering process of forming a solder ball and a molding process using a resin such as epoxy are sequentially performed to form a semiconductor strip.

The semiconductor strip thus manufactured is transferred to a cutting device and cut into individual packages, and the individually cut packages are transferred to a next process such as an offloading device by a unit picker or the like.

A conventional cutting and processing apparatus for a semiconductor manufacturing process is shown in FIG.

As shown in Figure 1, a conventional cutting and processing device for a semiconductor manufacturing process largely on-loading device 10, cutting device 20, cleaning device 30, drying device 40, vision inspection device ( 50) and the offloading device 60. In addition, a transfer picker 13 having a strip head 15 and a unit head 25 is provided between the onloading device 10 and the cutting device 20 to be movable.

In this way, the semiconductor strip loaded on the on-loading device 10 is vacuum-absorbed on the strip head 15 and individually by the spindle 22 in a state of being seated on the chuck table 21 of the cutting device 20. Is cut into packages. The individually cut package is vacuum-adsorbed to the unit head 25, washed in the washing apparatus 30, dried in the drying apparatus 40, and then transferred to the vision inspection apparatus 50. The package in which the vision inspection is completed in the vision inspection apparatus 50 is delivered to the offloading apparatus 60 according to the vision inspection result and loaded.

However, the cleaning apparatus provided in the cutting and processing apparatus for the conventional semiconductor manufacturing process requires a large installation area, and since the spray angle of the washing water or the air is limited, the foreign matter attached to the edge region of the package cannot be effectively removed. There is this.

In addition, since the strip head 15 and the unit head 25 are integrally provided in the transfer picker 13, when the strip having a large size needs to be processed, the size of the transfer picker 13 is too large.

Accordingly, the present invention has been proposed to solve the conventional problems as described above, an object of the present invention is to provide a cutting and processing apparatus for a semiconductor manufacturing process having a compact configuration while effectively removing foreign substances generated in the cutting process. It is.

Cutting and processing apparatus for a semiconductor manufacturing process according to the present invention is an on-loading device for supplying the workpiece, a cutting device for cutting the workpieces delivered from the on-loading device individually, and cut separately by the cutting device A brushing apparatus for brushing the workpiece, a washing apparatus for washing the workpiece brushed by the brushing apparatus, a drying apparatus for drying the workpiece washed by the washing apparatus, and a workpiece dried by the drying apparatus. And an offloading device for loading the workpieces inspected by the vision inspection device, wherein the washing device is configured to spray the washing water toward the workpiece while rotating. It features.

The washing apparatus includes a rotary body, a nozzle body rotatably installed on an upper portion of the rotary body, a high pressure water nozzle installed on an upper surface of the nozzle body and spraying high pressure washing water, and a high temperature installed on an upper surface of the nozzle body. And a hot water nozzle for spraying the washing water, an air nozzle installed on an upper surface of the nozzle body to inject high pressure air, and a nozzle driving device connected to one side of the rotary body to provide rotational force to the nozzle body. .

Each of the high pressure water nozzle, the high temperature water nozzle and the air nozzle is composed of a plurality of, and each of the plurality of high pressure water nozzle, the high temperature water nozzle and the air nozzle is preferably arranged in parallel to each other in the longitudinal direction of the nozzle body.

The high pressure water nozzle and the air nozzle may be configured in plural, and the washing water and the air injected from the plurality of high pressure water nozzles and the air nozzle may be controlled to increase the injection pressure toward the center.

Each of the high pressure water nozzles, the high temperature water nozzles, and the air nozzles may include a plurality of nozzles, and the plurality of high pressure water nozzles, the high temperature water nozzles, and the air nozzles may be irregularly disposed.

The brushing device may be configured as a first brushing device installed above the transport path of the workpiece to brush the upper surface of the workpiece, and a second brushing device installed below the transport path of the workpiece to brush the lower surface of the workpiece. have.

The brushing device is configured to brush the workpiece while oscillating in a direction orthogonal to the conveying direction of the workpiece.

In addition, between the on-loading device and the cutting device is installed a strip picker for transferring the workpiece supplied from the on-loading device to the cutting device, the cutting device is cut between the cutting device and the cleaning device in the cutting device The unit picker for delivering the individual packages to the cleaning device is movably installed, and the strip picker and the unit picker may be designed such that the transport paths exist on different planes to cross each other.

Between the cutting device and the cleaning device is provided with a scrap box having a width smaller than the width of the workpiece and the scrap (sacap) separated from the workpiece is discharged, the vacuum sucked by the unit picker by a predetermined amount It can be controlled to be discharged to the scrap box.

An inlet rail cover that opens and closes the inlet rail while interlocking with the unit picker may be installed at an upper portion of the inlet rail to be movable in the y-axis direction.

Hereinafter, a cutting and processing apparatus for a semiconductor manufacturing process according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In describing the components of the embodiment according to the present invention, symmetrically arranged components will be described with reference to only one element, and detailed descriptions of the components already described in the prior art will be omitted. Let's do it.

Figure 2 is a plan view showing the overall arrangement of the cutting and processing apparatus for a semiconductor manufacturing process according to an embodiment of the present invention.

As shown in Figure 2, the cutting and processing apparatus for a semiconductor manufacturing process according to an embodiment of the present invention largely on-loading device 100, cutting device 200, brushing device 300, cleaning device 400 , A drying apparatus 500, a vision inspection apparatus 600, and an offloading apparatus 700. In addition, a strip picker 150 is installed between the onloading device 100 and the cutting device 200 to move in the x-axis direction, and between the cutting device 200 and the cleaning device 400. The unit picker 250 is provided to be movable in the x-axis direction. In addition, a turntable picker 550 is installed between the drying apparatus 500 and the offloading apparatus 700 to move in the x-axis direction, and the turntable is between the drying apparatus 500 and the offloading apparatus 700. 650 is provided to be movable in the y-axis direction.

The onloading device 100 is an element for supplying a plurality of semiconductor strips to be cut in the cutting device 200. The on-loading device 100 includes a magazine (not shown) having a plurality of strips loaded therein, a pusher 110 for pushing one of the plurality of strips loaded in the magazine (not shown), and the magazine supplied from the magazine. The gripper 120 grips the semiconductor strip and draws it toward the strip picker 150, and the inlet rail 130 guides and guides the semiconductor strip drawn by the gripper 120. In addition, the inlet rail cover 140 is installed on the upper portion of the inlet rail 130 to be movable in the y-axis direction. The inlet rail cover 140 is for preventing the coolant sprayed on the package from falling into the strip of the inlet rail 130 when the package is transported by the unit picker 250. Interlocked with the 150 and the unit picker 250 is operated to open and close the inlet rail 130. That is, when the strip picker 150 adsorbs the strip in the inlet rail 130, the strip picker 150 moves backward to open the inlet rail 130, and the unit picker 250 is on the inlet rail 130. When moving to cover the inlet rail 130 by moving forward.

The cutting device 200 is an element for cutting the semiconductor strip supplied from the onloading device 100 into a separate semiconductor package. The cutting device 200 is installed to be movable in the x-axis direction and the spindle to cut the strip to be cut, and the spindle for cutting the strip into individual packages by interaction with the chuck table 210 It consists of 220. In addition, the rotary blade 222 is rotatably installed at the end of the spindle 220.

The brushing device 300 is an element for removing the foreign matter attached to the package by brushing the package cut individually.

3 is a plan view illustrating the brushing apparatus, FIG. 4 is a cross-sectional view of the brushing apparatus illustrated in FIG. 3, and FIGS. 5 and 6 are cross-sectional views illustrating an operating state of the first brushing apparatus and the second brushing apparatus, respectively.

As shown in FIGS. 3 and 4, the brushing apparatus 300 is largely composed of a brush body 310, a brush 320, a brush driving device 330, and a guide rail 340.

The brush body 310 as a whole is a rectangular flat plate is provided long in the y-axis direction, which is a direction orthogonal to the transport direction of the package.

A guide member 312 is formed below the brush body 310. The brush 320 is an element that directly contacts the bottom surface of the package and removes foreign substances attached to the bottom surface of the package, and extends in the longitudinal direction on the top surface of the brush body 310. The brush 320 is formed of a soft material which does not damage the package, and is disposed in parallel in a plurality of rows. The brush 320 is configured to swing in a direction orthogonal to the conveying direction of the package (y-axis direction) to remove foreign substances attached to the package.

The brush driving device 330 is an element that provides a rocking force to the brush body 310, and is coupled to one side of the brush body 310 via a connecting rod 332. Meanwhile, although the cylinder is used as the brush driving device 330 in this embodiment, various well-known driving devices such as a link type or an ultrasonic vibration by a motor may be used.

The guide rail 340 is an element for guiding the brush body 310 and extends in the y-axis direction under the brush body 310. The guide rail 340 is movably coupled to the guide member 312 of the brush body 310 to stably maintain the swing of the brush body 310.

In addition, the brushing apparatus is installed on an upper portion of the transport path of the package to brush the first surface of the package 301, and a second brushing device 302 is installed on the lower portion of the package of the package to brush the lower surface of the package. It can be configured as. That is, the first bristle device 301 is installed downward in the upper portion of the outlet side of the cutting device 200, the second bristle device 302 is installed upward on the front surface of the cleaning device 400 It is.

As shown in FIG. 5, the first brushing device 301 is individually cut by the spindle 220 of the cutting device 200 and then mounted on the chuck table 210. The foreign material is removed by brushing the upper surface of the package moving in the x-axis direction toward 250 in the y-axis direction. As described above, since the first brushing device 302 swings while brushing in the direction perpendicular to the feeding direction of the chuck table 210, the interference with the package is maximized to double the effect of removing foreign substances.

As shown in FIG. 6, the second brushing device 302 removes foreign substances by brushing while vacuuming the unit picker 250 while rocking the bottom surface of the package moving in the x-axis direction in the y-axis direction. As described above, since the second brushing device 302 shakes while brushing in the direction perpendicular to the transfer direction of the unit picker 250, interference with the package is maximized to double the effect of removing foreign substances.

The cleaning device 400 is an element that completely removes foreign substances attached to the package by spraying the washing water and air toward the package brushed by the brushing device 300.

FIG. 7 is a plan view illustrating a cleaning apparatus of a cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2, and FIGS. 8 and 9 are cross-sectional views illustrating an internal configuration of the cleaning apparatus illustrated in FIG. 7, and FIGS. 10 to 12. 7 is a cross-sectional view showing an operating state of the washing apparatus shown in FIG.

As shown in FIGS. 7 to 9, the cleaning device 400 is largely composed of a housing 410, a rotary body 420, a nozzle body 430, nozzles, and a nozzle driving device 450.

The housing 410 is an element for supporting other components in a box shape having an inner space. A cover 412 having an opening 414 is provided on an upper surface of the housing 410. A rubber pad member 416 is installed at the edge of the opening 414 to prevent damage to the package adsorbed onto the unit picker 250.

The rotary body 420 is installed on the inner bottom surface of the housing 410, and the high pressure water hose 443, the high temperature water hose 445, and the air hose 447 connected to the outside are installed.

The nozzle body 430 is a rectangular rectangular plate as a whole and is rotatably installed around the z axis on the upper surface of the rotary body 420. Since the nozzle body 430 is designed to rotate by the rotary jointer 432, the high pressure water hose 443, the high temperature water hose 445, and the air hose 447 even though the nozzle body 430 rotates. Does not twist.

An upper surface of the nozzle body 430 is provided with a high pressure water nozzle 442 for spraying high pressure washing water, a high temperature water nozzle 444 for spraying high temperature washing water, and an air nozzle 446 for spraying high pressure air. It is. Each of the high pressure water nozzle 442, the high temperature water nozzle 444, and the air nozzle 446 is composed of a plurality, and each of the plurality of high pressure water nozzles 442, the high temperature water nozzle 444, and the air nozzle 446, respectively. Are parallel to each other in the longitudinal direction of the nozzle body 430. In addition, the high pressure water nozzle 442, the high temperature water nozzle 444, and the air nozzle 446 are connected to the high pressure water hose 443, the high temperature water hose 445, and the air hose 447, respectively.

On the other hand, the washing water and air injected from the high pressure water nozzle 442 and the air nozzle 446 may be controlled to increase the injection pressure toward the center. This configuration may vary the injection pressure by injecting the washing water and air through separate nozzle lines having different providing pressures, or may vary the injection pressure through a single nozzle line due to the difference in nozzle diameter. As such, by controlling the injection pressure of the washing water and the air toward the center thereof, the foreign matter attached to the center part of the package can be effectively removed.

The nozzle driving device 450 is an element that provides rotational force to the nozzle body 430. The nozzle driving device 450 is a nozzle driving motor 452 installed on one side of the outer surface of the housing 410, and a drive pulley 454 for transmitting the power of the nozzle driving motor 452 to the nozzle body 430. , An electric belt 456 and a driven pulley 458. Meanwhile, in the present embodiment, a combination of a motor and a belt transmission device is used as the nozzle driving device 450, but various known driving devices may be used as long as the nozzle body 430 can be rotated without interference with other components. There will be.

Hereinafter, referring to the operation state of the washing apparatus 400, first, the individually packaged and then brushed package is moved in the process direction in the vacuum adsorbed state to the unit picker 250 of the washing apparatus 400 Move to the top of the opening 414 (see FIG. 10). In this state, when the unit picker 250 descends and descends to the cover 412 of the washing apparatus 400, the nozzle body 430 rotates around the z-axis and sprays washing water and air to attach to the bottom surface of the package. Completely remove the debris. That is, high pressure washing water is injected from the high pressure water nozzle 442, high temperature washing water is injected from the high temperature water nozzle 444, and high pressure air is injected from the air nozzle 446, which is attached to the bottom surface of the package. Remove the foreign matter (see Figs. 11 and 12).

As such, since the nozzle body 430 rotates about the z-axis, the washing water and the air are injected, and thus, the foreign matter attached to the package adsorbed to the edge portion of the unit picker 250 may be effectively removed. In addition, since high temperature wash water is sprayed onto the package together with high pressure wash water, foreign matter attached to the package may be easily removed while being softened by heat.

The drying apparatus 500 is an element for drying the semiconductor package that has been cleaned, and the vision inspection apparatus 600 serves to inspect whether the semiconductor package dried in the drying apparatus 500 is defective. The offloading device 700 is an element on which a package is finally loaded.

The strip picker 150 is an element that absorbs the semiconductor strip drawn out by the inlet rail 130 and seats it on the chuck table 210 of the cutting device 200. The first guide rail 155 extending in the x-axis direction is installed. It is installed to be movable along.

The unit picker 250 moves in the process direction in the state in which the individual semiconductor packages and scraps cut by the cutting device 200 are adsorbed together, and discharges scraps to the scrap box 800 below. As an element for transmitting to the washing apparatus 400 and the drying apparatus 500, it is installed to be movable along the second guide rail 255 extending in the x-axis direction. The unit picker 250 vacuum-adsorbs the individually cut packages and scrap together, and the vacuum pressure is controlled so that the scraps are sequentially discharged to the scrap box 800 during the transfer.

The strip picker 150 and the unit picker 250 are designed such that the transport paths exist on different planes so as to cross each other. That is, the first guide rail 155 is installed below the second guide rail 255 and is designed not to interfere with each other even when the strip picker 150 and the unit picker 250 move in the same path. This improves design freedom when dealing with large strips and makes the entire device compact.

On the other hand, between the cutting device 200 and the cleaning device 400 is provided with a scrap box 800 for discharging the scrap (sacap) separated from the package in the cutting process. The scrap box 800 extends in the y-axis direction below the transfer path of the unit picker 250 and is designed to have a width smaller than that of the semiconductor strip.

13 to 15 are cross-sectional views illustrating a process of discharging scrap adsorbed to a unit picker to a scrap box in the cutting and processing apparatus for a semiconductor manufacturing process illustrated in FIG. 2. For reference, reference P refers to a package and S refers to scrap.

As shown in FIGS. 13 to 15, the unit picker 250 moves up to the upper portion of the scrap box 800 while simultaneously vacuum-adsorbing the scrap S together with the package P cut individually. The scrap S is sequentially discharged to the scrap box 800 by a predetermined amount. On the other hand, in this embodiment is shown an example in which the vacuum pressure is controlled so that the scrap is discharged to the scrap box 800 three times, but is not limited thereto.

As described above, since the unit picker 250 is configured to discharge the scraps S into the scrap box 800 sequentially by a predetermined amount in a state in which the scraps S are simultaneously vacuum-adsorbed together with the packages P individually cut. Since the width of the scrap box 800 is smaller, the entire apparatus becomes more compact and the process distance is shorter.

Hereinafter, an operating state of the cutting and processing apparatus for a semiconductor manufacturing process according to the present embodiment will be described.

First, when the pusher 110 of the on-loading device 100 pushes one of a plurality of strips loaded in a magazine (not shown) to the inlet rail 130, the gripper 120 moves to the strip side and strips. The strip picker 150 moves along the inlet rail 130 to an area where the strip can be picked up with one side of the grip (see FIGS. 16 to 19).

In this state, the strip picker 150 descends and rises again in a state in which the strip is vacuum-adsorbed, thereby horizontally moving upward along the first guide rail 155 toward the chuck table 210 of the cutting device 200. Next, it descends and rests the strip on the chuck table 210 (see FIG. 20).

Next, when the chuck table 210 moves horizontally toward the spindle 220, the strip is cut into separate packages by the relative movement of the spindle 220 and the chuck table 210. While the strip is cut into individual packages by the cutting device, the new strip is withdrawn from the onloading device 100 (see FIGS. 21 to 22).

Next, the unit picker 250 brushes the upper surface of the package by interacting with the first brushing device 302 while moving in the direction of the process in the state of adsorbing the individually cut packages. That is, when the package adsorbed on the strip picker 150 is moved while contacting with the first brushing device 302, the first brushing device 302 swings in the orthogonal direction (y-axis direction) to move the package upper surface. Brush (see FIG. 23).

Next, the unit picker 250 continuously discharges the scraps to the scrap box 800 while continuously moving in the process progress direction while absorbing the brushed package, and then interacts with the second brushing device 302. Brushes the bottom of the package. When the brushing process is completed, the unit picker 250 moves to the cleaning device 400 and then washes by spraying the washing water and air on the bottom surface of the package. That is, the high pressure water nozzle 442, the hot water nozzle 444, and the air nozzle 446 rotate to spray the high pressure water, the hot water and the air to completely remove foreign substances attached to the bottom surface of the package (see FIG. 24).

Next, the unit picker 250 moves in the process progress direction to the drying apparatus 500 in a state where the unit picker 250 absorbs the washed package, and then dries the package, and then the drying apparatus 500 includes the vision inspection apparatus 600. To check whether the package is processed (see FIGS. 25 to 26).

As such, when the vision inspection is completed, the drying apparatus 500 moves to the turntable picker 550 again. At this time, when the turntable picker 550 picks up a package and seats the turntable 650, the turntable 650 moves toward the sorting picker 670 to be offloaded to the offloading device 700 (FIGS. 27 to 27). 28).

The strip is cut into separate packages, washed, dried and then offloaded while repeatedly performing the above process.

As in the above example, the present invention may be variously applied using the same principle by appropriately modifying the above embodiments. Therefore, it should be interpreted that the above description does not limit the scope of the present invention, which is defined by the limits of the following claims. That is, in this embodiment, an example in which a semiconductor strip is used as a workpiece is disclosed, but it should be construed that it belongs to the scope of the patent even when other semiconductor products are processed.

As described above, since the cutting and processing apparatus for the semiconductor manufacturing process according to the present invention sprays the washing water and air onto the package while the nozzle body rotates, foreign substances attached to the package adsorbed to the edge area of the unit picker can be effectively removed. Can be. In addition, the brushing device is configured to brush both the upper and lower surfaces of the package, and the brushing device swings in a direction orthogonal to the conveying direction of the package, thereby maximizing interference with the package and thus excellent in removing foreign substances.

In addition, the washing apparatus applied to the present invention has a compact structure as a whole because the process of spraying high pressure, high temperature washing water and high pressure air in the cleaning chamber within 40cm at the same time.

In addition, since the transport paths are designed to exist on different planes so that the strip picker and the unit picker can cross, the design freedom can be improved when processing a strip having a large size.

In addition, since the unit picker is configured to discharge the scrap box 800 sequentially by a predetermined amount while the scraps are simultaneously vacuum-adsorbed together with the individually cut packages, the width of the scrap box is reduced so that the width of the entire apparatus is reduced. Is reduced and the processing distance of the workpiece is shortened.

As such, the present invention ultimately results in a compact overall processing apparatus and higher processing quality of the workpiece.

Claims (10)

On-loading device for supplying the workpiece, A cutting device for individually cutting the workpiece transferred from the on-loading device; A brushing device for brushing the workpieces individually cut by the cutting device; A washing apparatus for washing the workpiece brushed by the brushing apparatus, A drying device for drying the workpiece washed by the washing device; Vision inspection apparatus for inspecting whether the workpiece dried by the drying device is defective, It comprises a off-loading device for loading the workpiece to be vision-tested by the vision inspection device, The cutting device is a cutting and processing device for a semiconductor manufacturing process, characterized in that configured to spray the washing water toward the workpiece while rotating. The method of claim 1, The washing device Rotary body, A nozzle body rotatably installed on an upper portion of the rotary body, A high pressure water nozzle installed on an upper surface of the nozzle body and spraying high pressure washing water; A hot water nozzle installed on an upper surface of the nozzle body and spraying hot washing water; An air nozzle installed on an upper surface of the nozzle body and spraying high pressure air; Cutting and processing apparatus for a semiconductor manufacturing process comprising a nozzle driving device connected to one side of the rotary body to provide a rotational force to the nozzle body. The method of claim 2, Each of the high pressure water nozzles, the high temperature water nozzles and the air nozzles is composed of a plurality of semiconductors, each of the plurality of high pressure water nozzles, the hot water nozzles and the air nozzles are arranged in parallel to each other in the longitudinal direction of the nozzle body Cutting and processing device for manufacturing process. The method of claim 2, The high pressure water nozzle and the air nozzle is composed of a plurality, the cutting and processing apparatus for a semiconductor manufacturing process, characterized in that the washing water and the air injected from the plurality of high pressure water nozzle and the air nozzle increases the injection pressure toward the center. The method of claim 2, Each of the high pressure water nozzle, the high temperature water nozzle and the air nozzle is composed of a plurality, the plurality of high pressure water nozzle, hot water nozzle and the air nozzle is a cutting and processing apparatus for a semiconductor manufacturing process, characterized in that arranged irregularly. The method according to any one of claims 1 to 5, The brushing device comprises a first brushing device installed above the transport path of the workpiece to brush the upper surface of the workpiece, and a second brushing device installed below the transport path of the workpiece to brush the lower surface of the workpiece. Cutting and processing apparatus for a semiconductor manufacturing process. The method of claim 6, The brushing apparatus is a cutting and processing apparatus for a semiconductor manufacturing process, characterized in that for brushing the workpiece while shaking in a direction perpendicular to the conveying direction of the workpiece. The method according to any one of claims 1 to 5, Between the on-loading device and the cutting device is provided a strip picker for moving the workpiece supplied from the on-loading device to the cutting device to be movable, Between the cutting device and the washing device is installed a unit picker for transferring the individual package cut in the cutting device to the washing device, The strip picker and the unit picker is a cutting and processing apparatus for a semiconductor manufacturing process, characterized in that the transfer path is present on different planes so as to cross. The method of claim 8, Between the cutting device and the washing device is provided with a scrap box having a width smaller than the width of the workpiece and discharged (sacap) separated from the workpiece, Cutting and processing apparatus for a semiconductor manufacturing process, characterized in that the vacuum sucked by the unit picker is controlled to be discharged to the scrap box sequentially by a predetermined amount. The method of claim 8, Cutting and processing apparatus for a semiconductor manufacturing process, characterized in that the inlet rail cover for interlocking with the unit picker to open and close the inlet rail to be moved in the y-axis direction on the upper portion of the inlet rail.

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