TWI737247B - Cutting device and manufacturing method of cut product - Google Patents

Abstract

The present invention provides a cutting device capable of efficiently drying a semiconductor package and a method for manufacturing a cut product. The cutting device of the present invention cuts a resin-sealed package substrate into a plurality of semiconductor packages, and includes: a cutting mechanism to cut the package substrate; a conveying mechanism to suck, hold and convey the cut by the cutting mechanism The semiconductor package; a cleaning mechanism for cleaning the semiconductor package transported by the transport mechanism; and a suction drying mechanism for suction drying the semiconductor package that has been cleaned by the cleaning mechanism.

Description

Cutting device and manufacturing method of cut product

The present invention relates to the technology of a cutting device and a method of manufacturing a cut product.

Patent Document 1 discloses a dicing device that cleans a diced workpiece (semiconductor package) and then transports it to a subsequent processing step. A technique is described in which in the cutting device, a cleaning liquid is sprayed from a spray nozzle to clean dust and the like attached to a workpiece, and then air is sprayed from a drying nozzle to dry the workpiece. [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2003-163180

[The problem to be solved by the invention] In the case of spraying air to dry the workpiece as in the cutting device disclosed in Patent Document 1, for example, if the distance between the semiconductor packages is short, it may be difficult to remove the water droplets simply by moving the water droplets in the gap between the workpieces. . In other words, there is a concern that drying cannot be performed sufficiently, and appearance defects such as residual water marks on the workpiece may occur.

The present invention is made in view of the above situation, and the problem to be solved is to provide a cutting device capable of efficiently drying a semiconductor package and a method of manufacturing a cut product.

[Technical means to solve the problem] The problem to be solved by the present invention is as described above. In order to solve the problem, the cutting device of the present invention cuts a resin-sealed package substrate into a plurality of semiconductor packages, including: a cutting mechanism to cut the package substrate; A conveying mechanism that sucks, holds, and conveys the semiconductor package that has been cut by the cutting mechanism; a cleaning mechanism that cleans the semiconductor package that is conveyed by the conveying mechanism; and a suction drying mechanism that performs The semiconductor package cleaned by the cleaning mechanism is suction dried.

In addition, the method of manufacturing a cut product of the present invention includes a cutting step of cutting a resin-sealed package substrate into a plurality of semiconductor packages; and a conveying step of conveying the semiconductor package cut in the cutting step A cleaning step, cleaning the semiconductor package transported in the transport step; and a suction drying step, suction drying the semiconductor package that has been cleaned in the cleaning step.

[Effects of the invention] According to the present invention, the semiconductor package can be dried efficiently.

<First Embodiment> First, using FIGS. 1 and 2, the configuration of the cutting device 1 of the first embodiment and the method of manufacturing a cut product using the cutting device 1 will be described. In this embodiment, for example, a description will be given of the configuration of the cutting device 1 when the package substrate P is used as the object to be cut by the cutting device 1, which is a resin-sealed substrate on which a semiconductor wafer is mounted. Become.

As the package substrate P, for example, a ball grid array (BGA) package substrate, a Land Grid Array (LGA) package substrate, a chip size package (CSP) package substrate, and a light emitting diode (Light Emitting Diode) package substrate are used. Emitting diode, LED) package substrate, etc. In addition, as the object to be cut, not only the package substrate P but also a sealed lead frame may be used. The sealed lead frame is formed by resin sealing a lead frame on which a semiconductor chip is mounted.

In addition, in the following, the surface on the resin-sealed side of the two surfaces of the package substrate P is referred to as a mold face, and the surface on the opposite side to the mold surface is referred to as a ball face/lead face.

The cutting device 1 includes a cutting module A and an inspection module B as constituent elements. Each constituent element is detachable and replaceable with respect to other constituent elements. Hereinafter, the configuration of the cutting module A and the inspection module B, and the operation steps performed by the cutting module A and the inspection module B will be described in order.

The cutting module A is a component that mainly performs cutting of the package substrate P. The cutting module A mainly includes a substrate supply mechanism 2, a positioning mechanism 3, a cutting table 4, a spindle 5, a first cleaner 6, a conveying mechanism 20, a second cleaner 30, and a control unit 9.

In the cutting module A, first, the supply step S2 is performed. The supply step S2 is a step of supplying the package substrate P using the substrate supply mechanism 2. The substrate supply mechanism 2 pushes out the package substrate P piece by piece from a magazine M containing a plurality of package substrates P, and supplies it to the positioning mechanism 3 described later. The package substrate P is arranged with the ball surface/lead surface facing upward.

Next, in the cutting module A, a positioning step S4 is performed. The positioning step S4 is a step of using the positioning mechanism 3 to position the package substrate P supplied from the substrate supply mechanism 2. The positioning mechanism 3 arranges and positions the package substrate P pushed out from the substrate supply mechanism 2 on the rail portion 3a. After that, the positioning mechanism 3 transports the positioned package substrate P to the cutting table 4 described later.

Next, in the cutting module A, a cutting step S6 is performed. The cutting step S6 is a step of cutting the package substrate P using the cutting table 4 and the spindle 5 to obtain the semiconductor package S as a cut product.

The cutting table 4 holds the package substrate P to be cut. In the present embodiment, the cutting device 1 having a double cutting table configuration including two cutting tables 4 is exemplified. The cutting table 4 is provided with a holding member 4a that sucks and holds the package substrate P conveyed by the positioning mechanism 3 from below. In addition, the cutting table 4 is provided with a rotating mechanism 4b capable of rotating the holding member 4a in the θ direction in the figure, and a moving mechanism 4c capable of moving the holding member 4a in the Y direction in the figure.

The spindle 5 as a cutting mechanism cuts the package substrate P and singulates them into a plurality of semiconductor packages S (see FIG. 3). In this embodiment, the cutting device 1 having a dual-spindle configuration including two spindles 5 is exemplified. The main shaft 5 can move in the X direction and the Z direction in the figure. On the main shaft 5, a rotating knife 5a for cutting the package substrate P is installed.

The main shaft 5 is provided with a cutting water nozzle for spraying cutting water to the rotating blade 5a rotating at a high speed, a cooling water nozzle for spraying cooling water, and a cleaning water nozzle for spraying cleaning water for cleaning cutting chips (all not shown) Show) etc.

After the cutting table 4 sucks the package substrate P, the first position confirmation camera 4d is used to confirm the position of the package substrate P. After that, the cutting table 4 moves so as to approach the main shaft 5 in the Y direction in the figure. After the cutting table 4 moves below the main shaft 5, the cutting table 4 and the main shaft 5 are moved relative to each other, thereby cutting the package substrate P. Every time the package substrate P is cut by the spindle 5, the position of the package substrate P and the like are confirmed by the second position confirmation camera 5b.

Here, the confirmation by the first position confirmation camera 4d can confirm the position of the mark indicating the cutting position provided on the package substrate P, for example. The confirmation by the second position confirmation camera 5b can confirm, for example, the position where the package substrate P is cut, the width of the cut, and the like. In addition, the confirmation using the confirmation camera may not use the first position confirmation camera 4d, and only the second position confirmation camera 5b may be used for confirmation.

Next, in the cutting module A, the first cleaning step S8 and the first drying step S10 are performed. The first cleaning step S8 is a step of cleaning the plurality of semiconductor packages S formed by cutting the package substrate P into pieces by using the first cleaner 6. In addition, the first drying step S10 is a step of drying the cleaned semiconductor package S using the first cleaner 6.

After the cutting of the package substrate P is completed, the cutting table 4 maintains a state of adsorbing the plurality of singulated semiconductor packages S, and moves so as to move away from the main shaft 5 in the Y direction in the figure. At this time, the first cleaner 6 uses an appropriate cleaning solution to clean the upper surface (ball surface/lead surface) of the semiconductor package S (first cleaning step S8). In addition, the first cleaner 6 sprays gas (air) on the upper surface of the semiconductor package S to dry the upper surface of the semiconductor package S (first drying step S10).

Next, in the cutting module A, a transport step S12, a second cleaning step S14 as a cleaning step, and a second drying step S16 as a suction drying step are performed. The transport step S12 is a step of transporting the semiconductor package S to the inspection table 11 of the inspection module B using the transport mechanism 20. In addition, the second cleaning step S14 is a step of cleaning the semiconductor package S using the second cleaner 30. In addition, the second drying step S16 is a step of drying the cleaned semiconductor package S using the second cleaner 30.

The transfer mechanism 20 sucks the semiconductor package S held by the cutting table 4 from above and transfers it to the inspection module B (transfer step S12). In addition, the second cleaner 30 performs cleaning (second cleaning step S14) and drying (second cleaning step S14) and drying (second cleaning step S14) of the lower surface (mold surface) of the semiconductor package S in the middle of the path that the transport mechanism 20 transports the semiconductor package S to the inspection module B. Second drying step S16).

Specifically, the second cleaner 30 includes a cleaning mechanism 40 and a suction drying mechanism 50. The cleaning mechanism 40 includes a rotatable brush (not shown). The cleaning mechanism 40 cleans the semiconductor package S by rotating the brush containing the cleaning liquid while contacting the lower surface (mold surface) of the semiconductor package S (second cleaning step S14). In addition, the suction drying mechanism 50 performs drying of the semiconductor package S by sucking and sucking the cleaning liquid on the lower surface (mold surface) of the semiconductor package S (second drying step S16).

In addition, the case where the semiconductor package S is dried by the suction drying mechanism 50 will be described in detail below.

The operation of the various parts of the cutting module A (the substrate supply mechanism 2, the positioning mechanism 3, the cutting table 4, the spindle 5, the first cleaner 6, the conveying mechanism 20, and the second cleaner 30, etc.) as described above is controlled by Section 9 controls. In addition, the operation of each part of the shutdown module A can be arbitrarily changed (adjusted) using the control unit 9.

The inspection module B is a constituent element that mainly performs inspection of the semiconductor package S. The inspection module B mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement mechanism 14, an extraction mechanism 15 and a control unit 16.

In the inspection module B, the inspection step S18 is first performed. The inspection step S18 is a step of optically inspecting the semiconductor package S using the inspection table 11, the first optical inspection camera 12, and the second optical inspection camera 13.

The inspection table 11 holds the semiconductor package S for optical inspection. The inspection table 11 can move along the X direction in the figure. In addition, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member 11 a that sucks and holds the semiconductor package S.

The first optical inspection camera 12 and the second optical inspection camera 13 optically inspect the surface (ball surface/lead surface and mold surface) of the semiconductor package S. The first optical inspection camera 12 and the second optical inspection camera 13 are arranged in the vicinity of the inspection table 11 facing upward. The first optical inspection camera 12 and the second optical inspection camera 13 are each provided with an illumination device (not shown) capable of irradiating light during inspection.

The first optical inspection camera 12 inspects the mold surface of the semiconductor package S transported to the inspection table 11 by the transport mechanism 20. After that, the transport mechanism 20 places the semiconductor package S on the holding member 11 a of the inspection table 11. After the holding member 11a sucks and holds the semiconductor package S, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the second optical inspection camera 13 inspects the solder ball surface and the lead surface of the semiconductor package S.

For example, the first optical inspection camera 12 can inspect the notch of the semiconductor package S or the characters marked on the semiconductor package S, and the like. In addition, for example, the second optical inspection camera 13 can inspect the size and shape of the semiconductor package S, the positions of solder balls/leads, and the like.

The placement mechanism 14 is used for placement of the semiconductor package S whose inspection has been completed. The arrangement mechanism 14 can move along the Y direction in the figure. The inspection table 11 arranges the semiconductor package S that has been inspected by the first optical inspection camera 12 and the second optical inspection camera 13 on the arrangement mechanism 14.

Next, in the inspection module B, an accommodation step S20 is performed. The storing step S20 is a step of using the extraction mechanism 15 to transfer and store the semiconductor package S arranged in the arrangement mechanism 14 in a tray. Based on the inspection results obtained by the first optical inspection camera 12 and the second optical inspection camera 13, a good product and a defective product are distinguished, and the separated semiconductor package S is stored in the tray by the extraction mechanism 15. At this time, the extraction mechanism 15 stores the good products in the semiconductor package S in the good product tray 15a and the defective products in the defective product tray 15b, respectively. When the tray is filled with semiconductor packages S, another empty tray is appropriately supplied.

The operations of the various parts of the inspection module B (the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement mechanism 14, and the extraction mechanism 15, etc.) as described above are controlled by the control unit 16. In addition, the operation of each unit of the inspection module B can be arbitrarily changed (adjusted) using the control unit 16.

As described above, the cutting device 1 of the present embodiment can cut the package substrate P and singulate it into a plurality of semiconductor packages S.

Next, the configuration of the conveying mechanism 20 and the suction drying mechanism 50 used in the second drying step S16 will be described using FIGS. 3 to 6. In addition, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow B shown in the figure are defined as the upper direction, the lower direction, the left direction, the right direction, the front direction, and the rear direction, respectively. To explain. In addition, for ease of description, each member shown in the figure is appropriately simplified. The actual configuration of each member (the conveying mechanism 20 and the suction drying mechanism 50) (for example, the shape, size, number or arrangement of the holes, etc.) of each member is not limited to the illustration.

As described above, the transport mechanism 20 shown in FIG. 3 sucks and transports the semiconductor package S. The transport mechanism 20 mainly includes a transport base 21 and a resin sheet 22.

The transport base 21 can be moved in a predetermined direction by an appropriate drive mechanism (a motor as a power source, a gear that transmits power from the motor, etc.). The transport base 21 is formed in a substantially rectangular plate shape in plan view. The transport base 21 is arranged so that the thickness direction becomes the vertical direction.

The resin sheet 22 shown in FIGS. 3 and 4 holds the semiconductor package S by suction. As the raw material of the resin sheet 22, for example, silicone-based resin, fluorine-based resin, or the like is used. The resin sheet 22 is formed in a substantially rectangular plate shape in plan view. The resin sheet 22 is arrange|positioned so that the thickness direction may become an up-down direction. The front-rear width and the left-right width of the resin sheet 22 are formed to be smaller than the front-rear width and the left-right width of the conveying base 21, respectively. The resin sheet 22 is mainly formed with suction holes 22a.

The adsorption hole 22a is a hole for adsorbing the semiconductor package S. The suction holes 22a are formed so as to penetrate the resin sheet 22 in the vertical direction (thickness direction). A plurality of suction holes 22a are formed in a manner that they are arranged at fixed intervals in front, back, and left and right. The lower end portion of the suction hole 22a (the portion opening on the lower surface of the resin sheet 22) is formed so as to be enlarged compared to the other upper portion.

The resin sheet 22 is fixed to the approximate center of the lower surface of the conveying base 21. The suction hole 22 a of the resin sheet 22 is connected to a suction device (not shown) such as a vacuum pump through a connection hole (not shown) formed in the conveyance base 21. The semiconductor package S is sucked by sucking air by the suction device, and the semiconductor package S is held in contact with the lower surface of the resin sheet 22. By sucking one semiconductor package S in each suction hole 22a, the semiconductor packages S are arranged in front and rear and left and right.

As described above, the suction drying mechanism 50 shown in FIGS. 3 and 5 performs drying of the semiconductor package S. The suction drying mechanism 50 mainly includes a suction base 51, a suction plate 52 and a supporting member 53.

The suction base 51 supports a suction plate 52 described later. The suction base 51 is formed in a substantially rectangular parallelepiped shape (box shape) opened upward. The suction base 51 mainly includes a recess 51a, a through hole 51b, and a sealing member 51c.

The recess 51 a is a recess formed on the upper surface of the suction base 51. The recess 51a is formed in a substantially rectangular shape in plan view. The upper part of the recessed part 51a is formed so that it may become larger than the lower part (the front-to-rear width and the left-to-right width become larger). Thereby, a level difference is formed in the upper and lower midway parts of the recessed part 51a.

The through hole 51b is a hole that penetrates the suction base 51 in the vertical direction. The through hole 51 b is formed in the approximate center of the suction base 51. Thereby, the through hole 51 b connects the lower surface side of the suction base 51 and the recess 51 a of the suction base 51.

The sealing member 51c improves the airtightness between the suction base 51 and the conveyance base 21 when the suction base 51 and the conveyance base 21 are in contact with each other. The sealing member 51c is formed of, for example, elastic rubber or the like. The sealing member 51c is arranged on the upper surface of the suction base 51 in a groove formed so as to surround the recess 51a.

The suction plate 52 shown in FIG. 3, FIG. 5, and FIG. The suction plate 52 is formed in a substantially rectangular plate shape in plan view. The suction plate 52 is arranged so that the thickness direction becomes the vertical direction. The front-rear width and the left-right width of the suction plate 52 are formed so that the upper part of the recessed part 51a of the suction base 51 becomes substantially the same. Therefore, when the suction plate 52 is arranged in the recess 51a, the suction plate 52 is placed on the level difference of the recess 51a and held by the upper and lower midway portions of the recess 51a. The suction plate 52 is mainly formed with a suction hole 52a and a groove 52b.

The suction hole 52a is a hole that penetrates the suction plate 52 in the vertical direction (thickness direction). A plurality of suction holes 52a are formed in a manner that they are arranged at fixed intervals in the front, back, and left and right.

The groove portion 52 b is a depression formed on the upper surface (the surface opposite to the semiconductor package S) of the suction plate 52. The groove portion 52b is formed in a shape that surrounds a plurality of (at least two or more) suction holes 52a from the outside in a plan view (see FIG. 6(a)). The groove portion 52b is formed to connect the suction holes 52a adjacent to each other in the front and rear. The groove portion 52b is formed in a long-side shape (linear shape) with the long-side direction oriented forward and backward. The width of the groove portion 52b (the width in the direction perpendicular to the longitudinal direction) is formed to be smaller than the width of the semiconductor package S to be dried. The groove part 52b is formed in plural at fixed intervals on the left and right.

The support member 53 shown in FIGS. 3 and 5 supports the suction plate 52. The support member 53 is formed in a lattice shape in plan view. The vertical width of the support member 53 is formed to be substantially the same as the height of the step of the recess 51a. The support member 53 is arranged in the recess 51a (under the suction plate 52). Thereby, the support member 53 can support substantially the entire surface of the suction plate 52 from below. In addition, for the sake of simplification, the illustration of the supporting member 53 is omitted in FIG. 7 and later.

The through hole 51b of the suction base 51 is connected to a suction device (not shown) such as a vacuum pump. The air is sucked by the suction device, and the air above the suction plate 52 is sucked to the lower side of the suction plate 52 through the suction hole 52 a and the groove portion 52 b formed in the suction plate 52.

Next, the operations of the conveying mechanism 20 and the suction drying mechanism 50 in the second drying step S16 will be described.

First, as shown in FIG. 7( a ), the conveying mechanism 20 located above the suction drying mechanism 50 moves downward to bring the semiconductor package S into contact with the suction plate 52. At this time, the upper surface of the suction base 51 is in contact with the lower surface of the conveying base 21. The sealing member 51c is used to fill the gap between the suction base 51 and the conveying base 21 to ensure air tightness.

Next, as shown in FIG. 8, a suction device (not shown) connected to the through hole 51 b of the suction base 51 is driven to suck the air in the suction base 51 through the through hole 51 b. As a result, the air above the suction plate 52 is sucked downward through the suction hole 52a and the groove portion 52b of the suction plate 52. With the suction force, the water (cleaning liquid) in the portion facing the groove 52b (specifically, the lower surface (mold surface) of the semiconductor package S, or the gap between adjacent semiconductor packages S, etc.) can be directed to The underside of the suction plate 52 is sucked, so that the semiconductor package S is dried.

At this time, the sealing member 51c between the transport base 21 and the suction base 51 can prevent air from flowing in from the outside. This can prevent the suction force (negative pressure) from decreasing.

In addition, by forming the width of the groove portion 52 b to be smaller than the width (left-right width) of the semiconductor package S, the upper surface of the suction plate 52 can be used to press the lower surface of the semiconductor package S from below. Thereby, it is possible to prevent the semiconductor package S from falling off the conveying mechanism 20 due to the suction force of the suction plate 52.

In addition, by supporting the suction plate 52 from below by the supporting member 53 (refer to FIGS. 3 and 5 ), it is possible to prevent the suction plate 52 from being deformed (deflection downward) due to the suction force for drying.

After drying (suction) in the state shown in (a) of FIG. 7 for an arbitrary period of time, as shown in (b) of FIG. 7, the transport mechanism 20 moves upward, and the semiconductor package S leaves the suction plate 52. Furthermore, the conveyance mechanism 20 moves in the direction (right direction in the example of FIG. 7) different from the longitudinal direction (front-back direction) of the groove part 52b. At this time, the conveyance mechanism 20 moves to the right by a distance corresponding to the width of the groove portion 52b.

Next, as shown in FIG. 7( c ), the transport mechanism 20 moves downward again to bring the semiconductor package S into contact with the suction plate 52. In this state, the suction device is driven, air is sucked through the suction plate 52, and the semiconductor package S is dried.

As described above, in the second drying step S16, the movement by the conveying mechanism 20 and the suction by the suction drying mechanism 50 are alternately repeated an arbitrary number of times, thereby drying the semiconductor package S. In addition, from the viewpoint of suctioning the entire area of the lower surface of the semiconductor package S, the number of times of movement and suction of the transport mechanism 20 is preferably at least "(the pitch of the groove 52b)/(the width of the groove 52b) ) + 1" times or more.

As described above, the cutting device 1 of this embodiment cuts the resin-sealed package substrate P into a plurality of semiconductor packages S, including: Cutting mechanism (spindle 5) to cut the package substrate P; The conveying mechanism 20 sucks, holds and conveys the semiconductor package S that has been cut by the cutting mechanism; The cleaning mechanism 40 cleans the semiconductor package S transported by the transport mechanism 20; and The suction drying mechanism 50 sucks and dries the semiconductor package S that has been cleaned by the cleaning mechanism.

By configuring in this manner, the semiconductor package S can be dried efficiently. That is, the drying of the gas ejected from the semiconductor package S merely moves the water droplets (cleaning liquid) in the gap between the semiconductor packages S, and it is difficult to remove the water droplets. However, by sucking and drying the semiconductor package S as in the present embodiment, the movement of water droplets as described above is less likely to occur, and the semiconductor package S can be dried effectively.

In addition, the suction drying mechanism 50 includes a suction plate 52 having a plurality of suction holes 52a.

By configuring in this manner, the moisture of the semiconductor package S can be sucked through the plurality of suction holes 52a. As described above, the semiconductor package S is not directly sucked, but by increasing the suction force (negative pressure) through the suction hole 52a, the semiconductor package S can be dried effectively. In addition, by appropriately setting the arrangement of the plurality of suction holes 52a according to the arrangement of the semiconductor package S to be dried, etc. (for example, arranged at a position facing the gap between the semiconductor packages S to which water droplets are easily attached), it is also possible to effectively make the semiconductor The package S is dry.

In addition, the suction plate 52 includes a groove portion 52b formed to connect the plurality of suction holes 52a to each other on the surface facing the semiconductor package S.

By configuring in this way, the semiconductor package S can be dried efficiently. That is, by forming the groove part 52b, the range in which moisture can be sucked can be expanded, and the semiconductor package S can be dried efficiently.

In addition, the method of manufacturing a cut product of this embodiment includes: Cutting step S6, cutting the resin-sealed package substrate P into a plurality of semiconductor packages S; Conveying step S12, conveying the semiconductor package S cut in the cutting step S6; A cleaning step (second cleaning step S14), cleaning the semiconductor package S transported in the transport step S12; and In the suction drying step (the second drying step S16), the semiconductor package S that has been cleaned in the cleaning step is suction dried.

By configuring in this manner, the semiconductor package S can be dried efficiently.

In addition, in the suction drying step, the semiconductor package S is moved in a predetermined direction.

By configuring in this manner, the semiconductor package S can be dried efficiently. That is, by moving the semiconductor package S, the range in which moisture can be sucked can be expanded, and the semiconductor package S can be dried efficiently.

<Second Embodiment> Next, the second embodiment will be described using FIGS. 9 and 10.

The suction plate 152 of the second embodiment mainly includes a suction hole 152a and a groove 152b. The suction plate 152 of the second embodiment is different from the suction plate 52 of the first embodiment (refer to FIG. 6) in the position or shape of the suction hole 152 a and the groove 152 b.

Specifically, a plurality of suction holes 152a are formed so as to be arranged in a direction inclined with respect to the front-rear direction. In this embodiment, the suction holes 152a are formed in a row from the rear left to the front right.

In addition, the groove portion 152b is formed to connect the suction holes 152a arranged in an inclined manner with respect to the front-rear direction to each other. That is, the groove portion 152b is formed in a linear shape with the longitudinal direction directed in a direction inclined with respect to the front-rear direction. That is, the groove portion 152b is formed obliquely with respect to the direction in which the semiconductor packages S are arranged (the front-rear direction and the left-right direction).

Next, a case where the second drying step S16 is performed using the suction plate 152 of the second embodiment will be described.

In the second drying step S16, in a state where the semiconductor package S is brought into contact with the suction plate 152 by the transport mechanism 20, as shown in FIG. (Front-to-back direction and left-to-right direction) are arranged in an inclined manner.

Here, as shown in FIG. 10( b ), the groove portion 52 b of the suction plate 52 of the first embodiment is parallel to the direction in which the semiconductor packages S are arranged (the front-rear direction). Therefore, when the groove portion 52b is located between the adjacent semiconductor packages S on the left and right, most of the groove portion 52b faces the gap between the semiconductor packages S.

If suction is performed through the suction plate 52 in the above-mentioned state, a relatively large amount of air is sucked from the gap between the semiconductor packages S through the groove portion 52b. Therefore, there is a concern that the negative pressure used for suction decreases, and the suction power decreases.

In contrast, the groove portion 152 b of the suction plate 52 of the second embodiment shown in FIG. 10( a) is arranged to be inclined with respect to the direction in which the semiconductor packages S are arranged. Therefore, at least a part of the groove portion 152b is opposed to the semiconductor package S. As a result, it is possible to prevent a large amount of air from being sucked from the gap between the semiconductor packages S. Therefore, it is possible to suppress the decrease in the negative pressure for suction and the decrease in the suction force.

As described above, the groove portion 152b of this embodiment is formed obliquely with respect to the direction in which the semiconductor packages S are arranged.

By configuring in this manner, the semiconductor package S can be dried efficiently. That is, by making at least a part of the groove portion 152b opposed to the semiconductor package S, it is possible to suppress a decrease in the negative pressure, and further, it is possible to suppress a decrease in the suction force.

<The third embodiment> Next, the third embodiment will be described using FIGS. 11 and 12.

The cutting device 1 of the third embodiment includes a spray drying mechanism 60 in addition to the suction drying mechanism 50 (refer to FIG. 11 ). The spray drying mechanism 60 sprays gas to the semiconductor package S to dry the semiconductor package S. The spray drying mechanism 60 mainly includes a spray nozzle 61.

The spray nozzle 61 is a member that sprays gas. Inside the spray nozzle 61, holes for guiding gas are formed. The spray nozzle 61 is connected to a compressor (not shown) such as a blower. When the compressor is used to pressurize air, the air is injected through the injection nozzle 61. In this embodiment, the injection nozzle 61 is arranged to inject gas upward.

Next, a method of manufacturing a cut product using the cutting device 1 of the third embodiment will be described. As shown in FIG. 12, the method of manufacturing a cut product of the third embodiment differs from the method of manufacturing a cut product of the first embodiment (see FIG. 2) in that it includes a third drying step as a spray drying step. S17.

The third drying step S17 is performed after the second drying step S16. In the third drying step S17, in a state where the spray nozzle 61 is opposed to the lower surface of the semiconductor package S, gas is sprayed from the spray nozzle 61 to the semiconductor package S. Thereby, the water droplets adhering to the semiconductor package S can be removed and drying can be performed. At this time, by appropriately moving the semiconductor package S (the transport mechanism 20) or the spray nozzle 61 (the spray drying mechanism 60), it is also possible to spray gas into a wide area of the semiconductor package S.

As described above, the cutting device 1 of the present embodiment further includes the spray drying mechanism 60 that sprays gas to the semiconductor package S cleaned by the cleaning mechanism 40 to dry the semiconductor package S.

By configuring in this way, the semiconductor package S can be dried more efficiently. That is, by using the spray drying mechanism 60 in addition to the suction drying mechanism 50 for drying, the semiconductor package S can be dried more effectively.

In addition, the method of manufacturing a cut article of the present embodiment further includes a spray drying step (third drying step S17). The spray drying step (third drying step S17) is performed in the suction drying step (second drying step S16). ) Then, the semiconductor package S that has been cleaned in the cleaning step (the second cleaning step S14) is sprayed with gas to be dried.

By configuring in this way, the semiconductor package S can be dried more efficiently.

In addition, in this embodiment, although the example which performed the 3rd drying step S17 after the 2nd drying step S16 was shown, it is not limited to this. For example, like the modification shown in FIG. 13, you may perform the 3rd drying step S17 before the 2nd drying step S16.

<Fourth Embodiment> Next, the fourth embodiment will be described using FIG. 14.

The manufacturing method of the cut product of the fourth embodiment is different from the first embodiment in the operation of the transport mechanism 20 in the second drying step S16. Specifically, in the second drying step S16 of the fourth embodiment, when the air in the suction base 51 is sucked through the through hole 51b, the suction of the semiconductor package S by the transport mechanism 20 is released. That is, the suction device (not shown) connected to the conveyance base 21 is stopped.

By releasing the suction of the semiconductor package S as described above, as the air in the suction base 51 is sucked through the through hole 51b, the air in the suction hole 22a of the resin sheet 22 is also removed from the resin sheet 22 and the semiconductor package S. The gap is sucked downward. Thereby, the moisture, impurities, etc. that have penetrated into the adsorption holes 22a of the resin sheet 22 can be discharged to the outside.

In addition, in order to more easily discharge moisture and the like in the adsorption hole 22a, a compressor (not shown) such as a blower may be connected to the adsorption hole 22a, and air may be sent downward.

The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and can be appropriately changed within the scope of the technical idea of the invention described in the claims.

For example, the configuration of the cutting device 1 illustrated in the above embodiment is an example, and the specific configuration can be changed as appropriate.

For example, in the above-mentioned embodiment, the cutting module A and the inspection module B each include a control unit (control unit 9 and control unit 16), but the present invention is not limited to this, and the respective control units may also be integrated into one The control unit, or the control unit divided into three or more. In addition, the cutting device 1 of the present embodiment has a dual cutting table configuration including two cutting tables 4, but the present invention is not limited to this, and only one cutting table 4 may be included. In addition, the cutting device 1 of the present embodiment has a dual-spindle configuration including two spindles 5. However, the present invention is not limited to this, and only the spindle 5 may be included.

In addition, the configuration of the suction plate 52 and the suction plate 152 (hereinafter referred to as the “suction plate 52 and the like”) shown in the above-mentioned embodiment is an example, and the present invention is not limited to this. For example, the shape of the groove portion 52b may not be linear but may be an arbitrary shape. As an example, by forming grooves of a shape (lattice shape) corresponding to the gap between the semiconductor packages S, it is also possible to suck moisture in the gap between the semiconductor packages S at one time.

In addition, a plurality of members may be combined to form the suction plate 52 and the like shown in the above-mentioned embodiment. For example, a plate-shaped member formed with the suction hole 52a and a plate-shaped member formed with the groove portion 52b may be combined (fixed to each other) to form the suction plate 52.

In addition, in the said embodiment, the example which formed the suction hole 52a and the groove part 52b in the suction plate 52 was shown, but this invention is not limited to this, For example, you may form only the suction hole 52a.

In addition, in the above-mentioned embodiment, the example in which the semiconductor package S is brought into contact with the suction plate 52 is subjected to suction drying, but the present invention is not limited to this. For example, the semiconductor package S may be combined with the suction plate 52. With the plate 52 separated, suction drying is performed.

In addition, in the said embodiment, the example which supported the suction plate 52 etc. from below by the support member 53 was shown, but this invention is not limited to this, It is not necessary to use the support member 53.

In addition, in the above-mentioned embodiment, an example is shown in which the gap between the conveying base 21 and the suction base 51 is filled with the sealing member 51c to ensure airtightness, but the present invention is not limited to this. For example, it is also possible to perform suction drying without using the sealing member 51c. In this case, although the suction force (negative pressure) will decrease, it can be expected that the flow (wind pressure, etc.) of the air flowing from the outside of the suction base 51 into the inside (the recessed portion 51a) will promote the drying of the semiconductor package S.

In addition, in the above-mentioned embodiment, the example in which the cleaning liquid is sucked through the suction plate 52 etc. is shown, but it is not necessary to use the suction plate 52 etc. as long as it can dry by suction.

In addition, the operation of the transport mechanism 20 in the second drying step S16 of the above-mentioned embodiment is an example, and the present invention is not limited to this. In other words, the conveying mechanism 20 can move any distance in any direction, and the number of times of movement can also be set arbitrarily.

1: Cut off device 2: Substrate supply mechanism 3: positioning mechanism 3a: Track part 4: Cut off the table 4a: Holding member 4b: Rotating mechanism 4c: mobile mechanism 4d: Confirm the camera in the first position 5: Spindle 5a: Rotary knife 5b: The second position confirms the camera 6: The first cleaner 9: Control Department 11: Inspection table 11a: Holding member 12: The first optical inspection camera 13: The second optical inspection camera 14: Configuration organization 15: extraction agency 15a: Good product tray 15b: Defective product tray 16: Control Department 20: Transport mechanism 21: Transport base 22: Resin sheet 22a: Adsorption hole 30: second cleaner 40: Cleaning mechanism 50: Suction drying mechanism 51: Suction base 51a: recess 51b: Through hole 51c: Sealing member 52: Suction plate 52a: Suction hole 52b: Groove 53: Supporting member 60: Jet drying mechanism 61: Jet nozzle 152: Suction plate 152a: Suction hole 152b: Groove A: Cut off the module B: Check the module M: Material box P: Package substrate S: Semiconductor package S2: Supply step S4: Positioning steps S6: Cut off step S8: The first cleaning step S10: First drying step S12: Transport steps S14: Second cleaning step S16: Second drying step S17: Third drying step S18: check steps S20: Containment procedures

Fig. 1 is a schematic plan view showing the overall configuration of the cutting device of the first embodiment. Fig. 2 is a diagram showing a method of manufacturing a cut product. Fig. 3 is a front cross-sectional view showing the configuration of the conveying mechanism and the suction-drying mechanism. Fig. 4 is a bottom view showing the resin sheet. Fig. 5 is a plan view showing the suction drying mechanism. Fig. 6(a) is a plan view showing the suction plate. Fig. 6(b) is a cross-sectional view of A-A. Fig. 7(a) is a front cross-sectional view showing a state where the conveying mechanism moves downward. Fig. 7(b) is a front cross-sectional view showing a state where the conveying mechanism moves upward and right. Fig. 7(c) is a front cross-sectional view showing a state where the conveying mechanism moves downward again. Fig. 8 is a front cross-sectional view showing the conveying mechanism and the suction-drying mechanism during suction drying. Fig. 9 is a plan view showing the suction plate of the second embodiment. FIG. 10(a) is a plan view showing the positional relationship between the groove portion and the semiconductor package in the second embodiment. FIG. 10(b) is a plan view showing the positional relationship between the groove portion and the semiconductor package in the first embodiment. Fig. 11 is a front cross-sectional view showing a state in which the spray drying mechanism of the third embodiment is used for drying. Fig. 12 is a diagram showing a method of manufacturing a cut product of the third embodiment. Fig. 13 is a diagram showing a method of manufacturing a cut product according to a modification. Fig. 14 is a front cross-sectional view showing the conveying mechanism and the suction-drying mechanism when suction drying is performed in the fourth embodiment.

20: Transport mechanism

21: Transport base

22: Resin sheet

22a: Adsorption hole

50: Suction drying mechanism

51: Suction base

51a: recess

51b: Through hole

51c: Sealing member

52: Suction plate

52a: Suction hole

52b: Groove

S: Semiconductor package

Claims (6)

A cutting device that cuts a resin-sealed packaging substrate into a plurality of semiconductor packages, and includes: a cutting mechanism to cut the packaging substrate; a conveying mechanism to suck, hold, and convey the cut by the cutting mechanism The semiconductor package; a cleaning mechanism for cleaning the semiconductor package transported by the transport mechanism; and a suction drying mechanism for suction drying the semiconductor package that has been cleaned by the cleaning mechanism, wherein The suction drying mechanism includes a suction plate having a plurality of suction holes, and the suction plate includes a groove portion formed to connect the plurality of suction holes on a surface opposite to the semiconductor package. The cutting device according to claim 1, wherein the groove portion is formed obliquely with respect to the direction in which the semiconductor packages are arranged. The cutting device according to claim 1 or claim 2, further comprising: a spray drying mechanism that sprays gas to dry the semiconductor package that has been cleaned by the cleaning mechanism. A method of manufacturing a cut product, comprising: a cutting step of cutting a resin-sealed package substrate into a plurality of semiconductor packages; a conveying step of conveying the semiconductor package that has been cut in the cutting step; and cleaning Step, cleaning the semiconductor package transported in the transport step; and a suction drying step, using a suction drying mechanism to suction dry the semiconductor package that has been cleaned in the cleaning step, wherein The suction drying mechanism includes A suction plate having a plurality of suction holes, the suction plate including a groove portion formed to connect the plurality of suction holes to each other on a surface opposite to the semiconductor package. The method of manufacturing a cut product according to claim 4, wherein in the suction drying step, the semiconductor package is moved in a predetermined direction. The method of manufacturing a cut product according to claim 4 or claim 5, further comprising: a spray drying step of, before or after the suction drying step, treating the semiconductor package that has been cleaned in the cleaning step Spray air for drying.

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