KR20140055376A - Apparatus for singulating semiconductor packages - Google Patents

Apparatus for singulating semiconductor packages Download PDF

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Publication number
KR20140055376A
KR20140055376A KR1020120122090A KR20120122090A KR20140055376A KR 20140055376 A KR20140055376 A KR 20140055376A KR 1020120122090 A KR1020120122090 A KR 1020120122090A KR 20120122090 A KR20120122090 A KR 20120122090A KR 20140055376 A KR20140055376 A KR 20140055376A
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KR
South Korea
Prior art keywords
semiconductor package
unit
semiconductor
strip
stacking
Prior art date
Application number
KR1020120122090A
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Korean (ko)
Inventor
길지선
Original Assignee
세메스 주식회사
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Publication date
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Priority to KR1020120122090A priority Critical patent/KR20140055376A/en
Publication of KR20140055376A publication Critical patent/KR20140055376A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

In a method for singulating a semiconductor package, a strip is cut into each semiconductor package. The semiconductor package is cleaned in a first pickup state and transfers the cleaned semiconductor package. And, a second pickup process is performed on the inversed semiconductor package. The semiconductor package in the pickup state is rotated to make the semiconductor package inclined. The inclined semiconductor package can be dried. Also, the inclined semiconductor package can be inspected.

Description

[0001] Apparatus for singulating semiconductor packages [0002]

The present invention relates to a semiconductor package singulation apparatus. More particularly, the present invention relates to a semiconductor package singulation apparatus for cutting and individualizing semiconductor strips on which a plurality of semiconductor packages are mounted, and for stacking the individualized semiconductor packages on trays.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be formed into semiconductor strips by a dicing process, a die bonding process, and a molding process .

As described above, the semiconductor strip on which the plurality of semiconductor packages are mounted can be individualized through a sawing & sorting process and classified according to good or defective judgment. The cutting and sorting process loads the semiconductor strip onto a chuck table and then individualizes it into a plurality of semiconductor packages using a cutting blade, and the individualized semiconductor packages are collectively picked up by a pick-up device to be cleaned and dried .

Studies are underway to improve the productivity of the semiconductor packages. In addition, researches have been made on a device capable of performing the sorting process of the semiconductor packages by increasing the number of the cutting modules.

It is an object of the present invention to provide a semiconductor singulation method capable of producing individualized semiconductor packages from a plurality of semiconductor strips in a shorter time.

It is an object of the present invention to provide a semiconductor singulation apparatus capable of producing individualized semiconductor packages from a plurality of semiconductor strips in a shorter time.

In a semiconductor package singulation method according to an embodiment of the present invention, strips are cut and individualized into individual semiconductor packages, and the semiconductor packages are firstly picked up, and the washed semiconductor packages are reversed. Next, the inverted semiconductor package is secondarily picked up, and the semiconductor package is rotated in a picked-up state to tilt the semiconductor package in the horizontal direction, thereby drying the semiconductor package in a tilted state. Further, the semiconductor package can be inspected in a tilted state. Here, when inspecting the semiconductor package in an inclined state, it is possible to inspect the back surface of the semiconductor package with the solder balls formed thereon.

In the semiconductor package singulation method according to an embodiment of the present invention, the step of loading the dried semiconductor packages on the first and second stacking tables in which the stacking region and the non-stacking region are alternately arranged in a matrix form Can be performed additionally.

Further, in order to dry the semiconductor package in an inclined state, air can be jetted toward the semiconductor package.

A semiconductor package singulation apparatus according to an embodiment of the present invention includes a loader portion for supplying a strip, a cutting portion disposed adjacent to the loader portion and adapted to cut the strip into individual semiconductor packages, A first unit picker portion disposed adjacent to the first unit picker portion and configured to move in a first direction to pick up and reverse the semiconductor package from the cut portion; A second unit picker portion that is rotatably provided to pick up the inverted semiconductor package from the first Unic pickler portion, and a second unit picker portion that is rotatably mounted on the semiconductor package in an inclined state, And a drying unit for drying the water.

The semiconductor package singulation apparatus according to an embodiment of the present invention may further include a first vision inspection unit disposed adjacent to the drying unit and in a tilted state of the semiconductor package. Here, the first vision inspection unit may inspect the back surface of the semiconductor package on which the solder balls are formed.

In an embodiment of the present invention, the drying unit may include an air jet nozzle for jetting air toward the semiconductor package.

A semiconductor package singulation apparatus according to an embodiment of the present invention is characterized in that the semiconductor package singulation apparatus is disposed adjacent to the drying unit and includes first and second And may further include load tables. Here, a second vision inspection unit for inspecting semiconductor packages mounted on the first and second mounting tables may be additionally provided.

Also, a first stacker for stacking the good-quality trays, a second stacker for stacking the defective-product trays, and a third stacker on which the empty trays are stacked may be provided on one side of the first and second stacking tables.

In one embodiment of the present invention, the loader portion includes a support plate for supporting a magazine for receiving the strip, a rotary table for rotating the support plate and for moving the strip in the first direction, And a guide rail for guiding the converted strip in a second direction perpendicular to the first direction.

According to the embodiments of the present invention as described above, the first unit picker is provided so as to reverse the semiconductor packages, so that a separate inversion process for reversing the semiconductor package And a separate reverse unit for implementing this can be omitted, thereby simplifying the process and simplifying the mechanism. In addition, by air blowing toward the semiconductor package in a state where the drying section is tilted, water can be more effectively removed by gravity on the semiconductor package. Furthermore, the semiconductor package singulation apparatus can load the magazine to the loader section from the front side more easily. Further, since the guide rails are disposed in the loader portion, the maintenance of the guide rails can be made easier.

1 is a block diagram illustrating a semiconductor package singulation apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating the cleaning unit shown in FIG. 1. FIG.
3 is a plan view for explaining the first and second loading tables shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

1 is a block diagram illustrating a semiconductor package singulation apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating the cleaning unit shown in FIG. 1. FIG. 3 is a plan view for explaining the first and second loading tables shown in FIG.

Referring to FIG. 1, a semiconductor package sorting apparatus 100 according to an embodiment of the present invention cuts a semiconductor strip 10 on which a plurality of semiconductor packages are mounted to individualize them into the semiconductor packages, Can be used in the cutting and sorting process of the semiconductor package for classifying the semiconductor chips by grade. In addition, the semiconductor package may include a resin-molded front surface, which is a molding surface, and a back surface formed with a solder ball.

1, a semiconductor package sorting apparatus 1000 according to an embodiment of the present invention includes a loader unit 100, a cutting unit 200, a first unit picker unit 300, a cleaning unit 400, 2 unit picker unit 500 and a drying unit 600. [

The loader unit 100 can take out the strip 10 from a magazine (not shown) containing a plurality of strips 10 and supply the strip 10 to the cutting unit 200.

The cutting unit 200 is disposed on one side of the loader unit 100. The cutting portion 200 includes a chuck table 210 and cutting blades 220 and 230.

The chuck table 210 supports a strip drawn out from the magazine of the loader unit 100. The chuck table 210 may be configured to be movable in the Y-axis direction as shown in FIG. Accordingly, the chuck table 210 moves in the Y-axis direction while supporting the strip, approaches the cutting blades 220 and 230, and the cutting blades 220 and 230 cut the strip 10, Package customization. Thereafter, the chuck table 210 is provided to retreat from the cutting blade.

As shown in the figure, the chuck table 210 may be provided in a plurality of chuck tables, or may be provided as one chuck table.

The first unit picker unit 300 may be configured to be movable along a conveying path 310 extending in the X axis direction shown in FIG. The first unit picker 300 picks up the individualized semiconductor package from the chuck table 210. The first unit picker unit 300 may include a plurality of pickers (not shown) provided to vacuum adsorb the semiconductor package and a picker body (not shown) connected to the pickers.

Also, the first unit picker unit 300 is provided to invert the semiconductor packages. For example, the first unit picker 300 may rotate the picker about the picker body to invert the semiconductor package. As a result, a separate inversion process for inverting the semiconductor package and a separate reverse unit for implementing the inversion process for inspecting the front and the bottom of the semiconductor package can be omitted, thereby simplifying the process and simplifying the structure.

The cleaning unit 400 is disposed on the transport path 310 of the first unit picker 300. Further, the cleaning unit 400 is disposed adjacent to the cutting unit 200. The cleaning unit 400 may remove foreign matter from the semiconductor packages individualized by the cutting unit 200. For example, the cleaning unit 400 may clean the semiconductor package while the first unit picker 300 is transporting the semiconductor package in the X-axis direction.

1 and 2, in an embodiment of the present invention, the cleaning unit 400 may be mounted on the semiconductor package (not shown) while the semiconductor package 12 vacuum- A brush 410 for removing foreign matter from the semiconductor package 12 and a plurality of nozzles 420 for spraying water and air to the semiconductor package 12.

For example, a plurality of the brushes 410 may be provided so that the first unit picker 300 passes over the brush 410 to remove foreign matter remaining on the semiconductor package 12. Furthermore, the nozzle 420 can sufficiently remove the foreign matter by injecting water and air into the semiconductor package 12.

Referring again to FIG. 1, the second unit picker portion 500 is disposed adjacent to the cleaning portion 400. The second unit picker unit 500 is provided movably in the X-axis direction. The second unit picker 500 picks up the inverted semiconductor package from the first unit picker 300 directly from the first unit picker 300.

In addition, the second unit picker unit 500 is provided to be able to rotate the inverted package. The second unit picker unit 500 may include a picker (not shown) and a picker body (not shown) connected to the picker. Here, the picker may be rotated to rotate the inverted semiconductor package so as to maintain the inclined state with respect to the horizontal plane. Thus, the semiconductor package may be disposed to face the air jet nozzle 610 of the drying unit 600. Therefore, when the drying unit 600 blows air through the air injection nozzle 610, it is possible to effectively remove the water on the inclined semiconductor package by gravity effectively.

The drying unit 600 is disposed on one side of the cleaning unit 400. The second unit picker unit 500 may blow air in a state in which the semiconductor package is rotated and tilted to remove the residual moisture from the semiconductor package. For example, the drying unit 600 may include a plurality of air injection nozzles 610 arranged in the Y-axis direction. As a result, the second unit picker 500 rotates the semiconductor package and is tilted with respect to the horizontal plane, the air jet nozzle 610 ejects air, thereby effectively removing the residual moisture.

The semiconductor package singulation apparatus 1000 according to an embodiment of the present invention may further include a first vision inspection unit 710.

The first vision inspection unit 710 is disposed adjacent to the drying unit 600. The first vision inspection unit 710 may inspect the semiconductor package in a state where the second unit picker unit 500 is adsorbing the semiconductor package in a tilted state. For example, the first vision inspection unit 610 may inspect the back surface of the semiconductor package while the second unit picker unit 500 has the semiconductor package standing at about 90 degrees. Here, the back surface corresponds to the surface on which the solder ball is formed on the semiconductor package.

The semiconductor package singulating apparatus 1000 according to an embodiment of the present invention may further include first and second stacking tables 810 and 820. [

Referring to FIGS. 1 and 3, the first and second stacking tables 810 and 820 are disposed on one side of the drying unit 600. The second unit picker unit 500 loads the semiconductor package on the first and second stacking tables 810 and 820. At this time, the first and second stacking tables 810 and 820 can load the semiconductor package with the front surface of the semiconductor package, that is, the molding surface exposed.

For example, the first loading table 810 may be arranged in a matrix form with loading areas 811 for loading the semiconductor packages and non-loading areas 813 for loading the semiconductor packages. That is, the loading area 811 and the non-loading area 813 may be alternately arranged in the row direction and the column direction. In addition, the second loading table 820 may have the loading areas 821 and the non-loading areas 823 arranged in a manner opposite to the arrangement of the first loading tables 810.

Meanwhile, the mounting areas 811 and 821 may be provided with vacuum holes for vacuum adsorption of the semiconductor packages, respectively.

By alternately arranging the stacking areas 811 and 821 and the non-stacking areas 813 and 823 as described above, it is possible to easily pick up the semiconductor packages when the semiconductor packages are sorted and housed in a good or defective tray .

1, the first and second stacking tables 810 and 820 may include first and second movement paths 810 and 820 extending in parallel to each other in a second horizontal direction, for example, (815, 825).

Referring again to FIG. 1, the semiconductor package singulating apparatus 1000 according to an embodiment of the present invention may further include a second vision inspection unit 721, 723.

The second vision inspection units 721 and 723 are disposed on the first and second movement paths 815 and 825, respectively. Accordingly, the second vision inspection units 721 and 723 can inspect the front surface, i.e., the molding surface, of the semiconductor package mounted on the first and second mounting tables 810 and 820. [ The second vision inspection units 721 and 723 may include a vision camera for inspecting a molding surface of the semiconductor packages. For example, the vision camera may be disposed in each of the first and second movement paths 815, 825.

Referring again to FIG. 1, a semiconductor package singulating apparatus according to an embodiment of the present invention may further include first to third stackers 910, 920, and 930.

The first and third stackers 910, 920, and 930 are disposed on one side of the first and second movement paths 815 and 825.

The first stacker 910 is provided to load the defective tray 51 and the second stacker 920 is provided to load the good tray 52. The third stacker 930 is provided with an empty The trays 53 can be loaded. Further, a tray transfer unit 950 for transferring the reject tray 51, the good tray 52, and the empty tray 53 may be provided. The tray transfer unit 950 may be configured to be movable in the X-axis direction.

The tray transfer unit 950 can supply the empty tray 53 from the third stacker 930 along the third movement path 955 as the reject tray 51 and the good tray 52, The reject tray 51 containing the packages and the good tray 53 containing the good semiconductor packages can be moved to the first stacker 180 and the second stacker 182, respectively.

The good and defective trays may be configured to be movable along third and fourth movement paths 915 and 925 extending in parallel with the first and second movement paths. .

The semiconductor package singulating apparatus 1000 according to an embodiment of the present invention may include a first classified peak portion 851 and a second classified peak portion 853. [

The first and second sorted picker portions 851 and 853 may transport the semiconductor packages classified into the trays from the first and second stacking plates 810 and 820. The first and second classified picker portions 851 and 853 may be configured to be movable along sixth and seventh movement paths 852 and 854 extending in parallel in the X-axis direction.

In an embodiment of the present invention, the loader unit 100 may include a support plate 110, a rotary table 120, and a guide rail 130.

The support plate 110 supports a magazine (not shown) for receiving the strip. The support plate 110 is provided to transfer the magazine in the Y-axis direction.

The rotary table 120 rotates the support plate 110 while supporting the magazine. Whereby the direction of the strip is switched. For example, the direction of the strip can be switched so that the long side extends in the X-axis direction in a state where the long side of the strip extends in the Y-axis direction. Therefore, when the strip is cut and transported to the cut portion, a separate strip direction switching process can be omitted.

Further, the rotary table 120 may move in the X-axis direction to move the magazine.

The guide rails 130 extend in the Y-axis direction. The guide rail 130 is drawn out from the magazine and can guide the converted strip in the Y-axis direction.

Although not shown, the loader unit 100 may further include a gripper. The gripper is provided between the rails included in the guide rail 130. The gripper can reciprocate along a direction parallel to the guide rail 130. The gripper fixes the strip 10 supplied to the guide rail 130, and then transfers the strip to be positioned adjacent to the cut portion.

Thus, the semiconductor package singulating apparatus can load the magazine to the loader section from the front side, thereby making it easier to supply the magazine. Further, since the guide rails are disposed in the loader portion, the maintenance of the guide rails can be made easier.

Hereinafter, the semiconductor package singulation method will be described.

Referring again to FIG. 1, a strip is taken out from a magazine mounted on a loader section 100, and the strip is cut into individual semiconductor packages. At this time, the chuck plate 210 and the cutting scriber 220, 230 included in the cutting unit 200 may be used in the strip cutting process. Thereafter, the individual semiconductor packages are firstly picked up and cleaned. At this time, in order to perform the primary pick-up process, the first unit picker 300 picks up the semiconductor package and moves while the cleaner 400 cleans the semiconductor package to remove the foreign substance. Next, the cleaned semiconductor package is inverted. At this time, the first unit picker unit 300 can reverse the semiconductor package. Thereafter, the inverted semiconductor package is secondarily picked up. In this case, the second unit picker section 500 can directly pick up the inverted semiconductor package from the first unit picker section 300. Then, the semiconductor package is rotated in a picked up state to tilt the semiconductor package in the horizontal direction. In this case, the semiconductor package can be tilted by rotating the second unit picker unit 500. For example, the second unit picker section 500 may tilt the semiconductor package at an angle of about 90 degrees with respect to the horizontal plane.

The semiconductor package is dried in a tilted state. In this case, it is possible to remove residual material remaining on the semiconductor package by spraying air onto the semiconductor package. Also, the semiconductor package may be inspected while the semiconductor package is tilted. In this case, the back surface of the semiconductor package, on which the solder balls are formed, can be inspected.

In one embodiment of the present invention, the step of loading the dried semiconductor packages into the first and second loading tables 810 and 820, which are alternately arranged in a matrix form, are additionally performed . In this case, the second unit picker unit 500 may load the semiconductor packages in the first and second stacking tables 810 and 820, respectively.

In another embodiment of the present invention, the reverse of the semiconductor package is inverted to reverse the front and the bottom of the semiconductor package, Can be implemented. In addition, by drying the semiconductor package in a tilted state, the residue remaining on the semiconductor package can be removed more effectively.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: Strip 1000: Semiconductor package singulation device
100: loading section 200:
300: first unit picker part 400:
500: second unit picker part 600: drying part

Claims (13)

Cutting the strip into individual semiconductor packages;
Cleaning the semiconductor package with the semiconductor package being firstly picked up;
Inverting the cleaned semiconductor package;
Secondly picking up the inverted semiconductor package;
Rotating the semiconductor package in a picked up state to tilt the semiconductor package in a horizontal direction; And
And drying the semiconductor package in an inclined state. 2. The method of claim 1, further comprising inspecting the semiconductor package in a tilted state. The semiconductor package singulation method according to claim 2, wherein the step of inspecting the semiconductor package in a tilted state includes inspecting a back surface of the semiconductor package with a solder ball formed thereon 2. The semiconductor package of claim 1, further comprising the step of loading the dried semiconductor packages into first and second stacking tables, which are alternately arranged in a matrix form, Method. 2. The method of claim 1, wherein drying the semiconductor package in an inclined state comprises injecting air toward the semiconductor package. A loader section for supplying a strip;
A cutting portion disposed adjacent to the loader portion and adapted to cut the strip into individual semiconductor packages;
A first unit picker portion disposed adjacent to the cutout portion and configured to move in a first direction and to pick up and reverse the semiconductor package from the cutout portion;
A cleaning unit disposed on a movement path of the first unit picker unit and configured to clean the first unit picker unit while picking up the semiconductor package;
A second unit picker portion rotatably provided to pick up the inverted semiconductor package from the first Unik pickup portion; And
And a drying unit for drying the semiconductor package in an inclined state. 7. The semiconductor package singulating apparatus of claim 6, further comprising a first vision inspection unit disposed adjacent to the drying unit and tilted at the semiconductor package. 8. The semiconductor package singulating apparatus according to claim 7, wherein the first vision inspection unit inspects a back surface of the semiconductor package on which the solder balls are formed. 7. The semiconductor package singulating apparatus according to claim 6, wherein the drying unit includes an air jet nozzle for jetting air toward the semiconductor package. 7. The semiconductor package according to claim 6, further comprising first and second stacking tables arranged adjacent to the drying section, the stacking areas and the non-stacking areas being alternately arranged in a matrix form so as to stack the dried semiconductor packages To the semiconductor package. The semiconductor package singulating apparatus according to claim 10, further comprising a second vision inspection unit for inspecting the semiconductor packages mounted on the first and second stacking tables. 11. The apparatus of claim 10, wherein a first stacker for stacking the good-quality trays, a second stacker for stacking the defective-product trays, and a third stacker for stacking empty trays are provided on one side of the first and second stacking tables Wherein the semiconductor package is a semiconductor package. 7. The apparatus of claim 6, wherein the loader portion comprises: a support plate for supporting a magazine for receiving the strip;
A rotary table for rotating the support unit and switching the direction of the strip and moving in the first direction; And
And a guide rail which is drawn out from the magazine and guides the converted strip in a second direction perpendicular to the first direction.
KR1020120122090A 2012-10-31 2012-10-31 Apparatus for singulating semiconductor packages KR20140055376A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101627336B1 (en) * 2015-04-01 2016-06-08 한미반도체 주식회사 Aligning Apparatus of Semiconductor Package and Method of Aligning of Semiconductor Package
KR20170047958A (en) * 2015-10-26 2017-05-08 세메스 주식회사 Apparatus for sawing and sorting semiconductor packages
KR20170090795A (en) * 2016-01-29 2017-08-08 한미반도체 주식회사 Semiconductor Package Processing Apparatus
KR102070957B1 (en) * 2019-01-22 2020-01-29 제너셈(주) Package singulation system
KR20200108157A (en) * 2019-03-06 2020-09-17 세메스 주식회사 Cleaning apparatus and system for manufacturing semiconductor package including the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101627336B1 (en) * 2015-04-01 2016-06-08 한미반도체 주식회사 Aligning Apparatus of Semiconductor Package and Method of Aligning of Semiconductor Package
KR20170047958A (en) * 2015-10-26 2017-05-08 세메스 주식회사 Apparatus for sawing and sorting semiconductor packages
KR20170090795A (en) * 2016-01-29 2017-08-08 한미반도체 주식회사 Semiconductor Package Processing Apparatus
KR102070957B1 (en) * 2019-01-22 2020-01-29 제너셈(주) Package singulation system
KR20200108157A (en) * 2019-03-06 2020-09-17 세메스 주식회사 Cleaning apparatus and system for manufacturing semiconductor package including the same

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