KR20080074530A - Sawing and handling apparatus for semiconductor package - Google Patents

Abstract

An apparatus for sawing and handling a semiconductor package is provided to the overall structure of the apparatus and to dramatically reduce a process by correcting a direction and a position of a pick-up nozzle at an unloading picker. A sawing process unit(20) saws a strip on which a plurality of semiconductor packages are integrated and then individualizes the semiconductor package. An intermediate process unit receives the individualized semiconductor packages transferred from the sawing process unit. An unloading unit(70) accommodates the individualized semiconductor packages transferred from the intermediate process unit. A vision inspection unit(51,52) vision-photographs the individualized semiconductor packages received in the intermediate process unit to inspect an alignment status and a position of the individualized semiconductor packaged. An unloading picker(60) picks up and fixes the individualized semiconductor packages in the intermediate process unit, and has at least one pick-up nozzle that is capable of being rotated in a certain angle centering a vertical shaft. The unloading picker rotates the pick-up nozzle according to the alignment status and the position of the individualized semiconductor packages that are acquired from the vision inspection unit, or picks up the individualized semiconductor packages in the intermediate process unit by correcting relative positions in X-Y directions with respect to the individualized semiconductor packages.

Description

Semiconductor package cutting and handling device {Sawing and Handling Apparatus for Semiconductor Package}

1 is a plan view schematically showing an example of the configuration of a conventional semiconductor package cutting and handling device;

2A to 2C are cross-sectional views illustrating main parts of a semiconductor package aligned with a pocket of a turntable for alignment of a conventional semiconductor package cutting and handling apparatus.

3 is a plan view schematically showing the configuration of a semiconductor package cutting and handling device according to a first embodiment of the present invention;

4 through 6 are views sequentially illustrating a process of arranging semiconductor packages of a drying block by an unloading picker in the semiconductor package cutting and handling apparatus of FIG. 3;

7 is a plan view schematically showing the configuration of a semiconductor package cutting and handling device according to a second embodiment of the present invention;

8 is a plan view schematically showing the configuration of a semiconductor package cutting and handling device according to a third embodiment of the present invention;

9 is a plan view schematically showing the configuration of a semiconductor package cutting and handling device according to a fourth embodiment of the present invention;

10 is a plan view schematically showing the configuration of a semiconductor package cutting and handling apparatus according to a fifth embodiment of the present invention

Explanation of symbols on the main parts of the drawings

10: loading unit 12: inlet rail

14 strip picker 15 first X-axis guide rail

20: cutting part 21: cutting chuck table

22: cutting spindle 30: cleaning part

35 unit picker 40 drying unit

41: drying block 45: the first Y-axis guide rail

51: first vision inspection unit 52: second vision inspection unit

55: second X-axis guide rail 60: unloading picker

61: pickup nozzle 65: 3rd X-axis guide rail

70: unloading unit 72: tray picker

75: second Y-axis guide rail P: semiconductor package

T: Tray

The present invention relates to a semiconductor package cutting and handling device, and more particularly, to a semiconductor package cutting and handling device for performing a series of operations for cutting a semiconductor package on a strip per package basis and storing the same in a tray during a semiconductor package manufacturing process. It is about.

In general, a semiconductor package is subjected to a process of molding a resin paper on an upper surface of a semiconductor substrate after attaching a semiconductor chip having a high integrated circuit such as a transistor and a capacitor formed on a semiconductor substrate made of silicon. After the molding process, a process of bonding a ball grid array (BGA), which acts as a lead frame, to the surface of the semiconductor substrate so as to conduct electricity with a chip, and then cutting it into individual semiconductor package units using a cutting device, that is, a singer It goes through a singulation process. After the singulation process, cleaning and drying are performed to remove foreign substances on the surface of the semiconductor package. As such, the semiconductor package, which has undergone the drying process, is transferred to the package transfer device, and the defect is inspected by the vision inspection device, and then stored in the tray.

FIG. 1 of the accompanying drawings shows a conventional semiconductor package cutting and handling device which is configured to sequentially perform a singulation process, a cleaning and drying process, a vision inspection process, and a storing process in a tray of the process of manufacturing such a semiconductor package. have.

Referring to FIG. 1, a conventional semiconductor package cutting and handling apparatus includes a loading unit 1 on which a semiconductor package strip (not shown) is loaded, and a cutting chuck table on which a strip inserted from the loading unit 1 is seated. 2a) and a cutting spindle 2b for cutting the strip on the cutting chuck table 2a into semiconductor package units, a cleaning part 3 for cleaning the cut semiconductor package, and Drying unit 4 for drying the completed semiconductor package, and an alignment turntable 6 arranged on one side of the drying unit 4 to align semiconductor packages conveyed from the drying unit 4 at regular intervals. And a unit picker 3a for conveying the individual cut semiconductor packages on the cutting chuck table 2a to the cleaning section 3 and the drying section 4.

In addition, a turntable picker 7, which picks up individual semiconductor packages from the drying unit 4 and conveys them to the turntables 6 for alignment, is installed on the upper sides of the turntables 6 for alignment. A first vision inspection unit 5a for vision inspection of defects and defects of semiconductor packages seated on each alignment turntable 6 is fixed to one side of the turntable picker 7.

The turntables 6 for alignment carry semiconductor packages under the unloading picker 8 while moving along the Y-axis guide rail 6d extending in the Y-axis direction.

The unloading picker 8 vacuum-adsorbs the semiconductor packages of the alignment turntable 6 while moving in the X-axis direction along the X-axis guide rail 8a to an empty tray T of the unloading unit 9. Function to store.

A second vision inspection unit 5b is disposed below the movement path of the unloading picker 8 for vision inspection of a mark engraved on a lower surface of each semiconductor package adsorbed by the unloading picker 8.

Meanwhile, as shown in FIG. 2A, the size of the semiconductor package P is arranged on each of the alignment turntables 6 such that the semiconductor packages P conveyed from the drying unit 4 (see FIG. 1) are aligned at regular intervals. A plurality of pockets 6a corresponding to and are formed at regular intervals.

The pocket 6a has an inclined surface 6b converging downwards at each edge so that the semiconductor packages separated from the turntable picker 7 naturally align as they enter the pocket 6a.

Accordingly, the semiconductor packages P which are placed in a slightly disturbed state in the drying unit 4 (see FIG. 1) and adsorbed by the turntable picker 7 are separated from the turntable picker 7 to be pockets of the turntable 6 for alignment. When inserted into (6a) it is guided by the inclined surface (6b) and seated on the lower surface of the pocket (6a), thereby allowing the semiconductor packages inserted in each pocket (6a) can be aligned at a desired interval.

The conventional semiconductor package cutting and handling apparatus configured as described above operates as follows.

When the semiconductor package strip is transported from the loading part 1 onto the cutting chuck table 2a of the cutting processing part 2 and seated, the cutting chuck table 2a moves to the cutting spindles 2b so that the strip is semiconductor. Cut into package units.

Subsequently, while the unit picker 3a moves horizontally, the semiconductor package on the cutting chuck table 2a is picked up and conveyed to the cleaning unit 3, and the cleaning unit 3 sprays water and / or air to the semiconductor package. 뭍 Remove and clean foreign substances.

The semiconductor package, which has been cleaned in the cleaning unit 3, is transferred to the drying unit 4 by the unit picker 3a and seated thereon, and dried by heating and / or blowing thereon to the turntable picker 7. It is conveyed onto the turntable 6 for alignment, and is aligned at a fixed interval.

Thereafter, the first vision inspection unit 5a inspects whether the ball forming surface of the semiconductor package is defective or defective. Subsequently, the alignment turntable 6 moves to the lower side of the unloading picker 8, and the unloading picker 8 picks up the semiconductor packages on the alignment turntable 6 to the upper side of the second vision inspection unit 5b. After moving, the semiconductor packages are accommodated in the tray T of the unloading unit 9 after vision inspection of the marking surface of the semiconductor package.

However, such a conventional semiconductor package cutting and handling device has the following problems.

Firstly, as described above, the conventional semiconductor package cutting and handling apparatus includes the semiconductor package cutting and handling apparatus before the unloading picker 8 picks up the semiconductor packages in order to accurately house the cut semiconductor packages in the tray T of the unloading section 9. The semiconductor packages were aligned at regular intervals on the turntable 6 for alignment.

Therefore, the configuration and the process of the entire equipment is complicated by the configuration of the turntable 6 for alignment, there is a problem that the size of the equipment also increases.

Secondly, as shown in FIG. 2B, although the inclined surface 6b is formed in the pocket 6a of the turntable 6 for alignment, the semiconductor package P is inclined because the semiconductor package P is very light. It occurs in the middle, not completely guided along 6b). In this case, an error is likely to occur when the unloading picker 8 vacuum-adsorbs the semiconductor package P on the pocket 6a.

In particular, when the thickness of the semiconductor package P is thick, the semiconductor package P is more likely to be guided along the inclined surface 6b and rolled out or misaligned.

Third, as shown in FIG. 2C, the pockets 6a formed in the conventional alignment turntable 6 have the size of the lower mounting surface on which the semiconductor package P is seated is completely equal to the size of the semiconductor package P. FIG. It is not matched and is slightly larger than the size of the semiconductor package. This is to allow the semiconductor package P to be seated while being completely accommodated in the lower surface of the pocket 6a. Therefore, when the semiconductor package P is actually accommodated in the pocket 6a, a minute gap g exists between the edge of the semiconductor package P and the edge of the pocket 6a.

If the semiconductor package is large in size and the free space for the unloading picker 8 to vacuum-adsorb the semiconductor package is large, the gap g between the semiconductor package P and the pocket 6a hinders the progress of the work. It doesn't affect you enough. However, in recent years, since the semiconductor package has been increasingly densified with high density, the size of the semiconductor package has gradually decreased, and when the gap g occurs between the semiconductor package P and the pocket 6a, the unloading picker 8 has a pocket ( When picking up the semiconductor package P in 6a), an error occurs because the semiconductor package is not picked up, or when it is picked up, it is picked up slightly out of position and the unloading picker 8 holds the semiconductor package in the tray. It is more likely that an error will occur.

The occurrence of such errors leads to process interruptions and problems that lead to lower production yields.

The present invention is to solve the above problems, an object of the present invention is to perform a realignment of the semiconductor package cut by a simple configuration and operation accurately and quickly, to reduce the overall size, improve the productivity of the semiconductor package It is to provide a cutting and handling device.

According to an aspect of the present invention for achieving the above object, a cutting processing unit for cutting a strip in which a plurality of semiconductor packages are integrated to individualize the semiconductor packages; An intermediate process unit in which individual semiconductor packages conveyed from the cutting process unit are seated; An unloading unit accommodating semiconductor packages conveyed from the intermediate process unit; A vision inspection unit for vision imaging the upper surfaces of the semiconductor packages seated on the intermediate process unit to inspect the alignment and position of the semiconductor packages; And an unloading picker having at least one pickup nozzle configured to pick up and fix the semiconductor packages on the intermediate process unit and to be rotatable about a vertical axis; The unloading picker rotates each pickup nozzle at an angle according to the alignment state and position information of each semiconductor package obtained by the vision inspection unit, or the XY direction position of each semiconductor package on the intermediate process unit. Provided is a semiconductor package cutting and handling device adapted to pick up semiconductor packages in an intermediate process section.

According to another aspect of the present invention, a cutting processing unit for cutting a strip in which a plurality of semiconductor packages are integrated to individualize semiconductor packages; An intermediate process unit in which individual semiconductor packages conveyed from the cutting process unit are seated; An unloading unit accommodating semiconductor packages conveyed from the intermediate process unit; An unloading picker having at least one pick-up nozzle for picking up the semiconductor package on the intermediate process portion, and carrying the semiconductor package of the intermediate process portion to the unloading portion; A vision inspection unit configured to perform vision imaging of lower surfaces of semiconductor packages picked up by the unloading picker to inspect alignment and positions of the semiconductor packages; The unloading picker rotates the pick-up nozzles at an angle according to the alignment state and position information of each semiconductor package obtained by the vision inspection unit to correct alignment of the semiconductor packages or to the unloading unit. There is provided a semiconductor package cutting and handling apparatus adapted to be accommodated in an unloading portion by correcting the position of the semiconductor packages fixed to the respective pickup nozzles while moving in the XY direction.

According to still another aspect of the present invention, there is provided a cutting processing unit which cuts a strip in which a plurality of semiconductor packages are integrated to individualize semiconductor packages; An unloading unit accommodating semiconductor packages conveyed from the cutting process unit; An unloading picker having at least one pick-up nozzle for picking up the semiconductor package on the cutting part, and for conveying the semiconductor package of the cutting part to the unloading part; A vision inspection unit for vision imaging the lower surface of the semiconductor packages picked up by the unloading picker or the upper surface of the semiconductor package on the cutting process unit to inspect the alignment and position of the semiconductor packages; The unloading picker rotates the pick-up nozzles at an angle according to the alignment state information of each semiconductor package obtained by the vision inspection unit, thereby correcting the alignment direction of the semiconductor packages or adjusting the XY direction position of the semiconductor package. A semiconductor package cutting and handling apparatus is provided that is adapted to be corrected and stored in an unloading portion.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the semiconductor package cutting and handling apparatus according to the present invention.

First, a first embodiment of a semiconductor package cutting and handling apparatus according to the present invention will be described with reference to FIGS. 3 to 6.

As shown in FIG. 3, a loading unit 10 on which a semiconductor package strip (not shown) is loaded is disposed on one side of the main body, and a strip is loaded from the loading unit 10 on one side of the loading unit 10. Guided inlet rail 12 is installed.

One side of the inlet rail 12 is a cutting processing unit 20 for cutting the strip into individual semiconductor packages. The cutting processing unit 20 is provided with a cutting chuck table 20 to which the strip is seated and fixed so as to be movable in the Y-axis direction, and separates the strip on the cutting chuck table 21 behind the cutting processing unit 20. Cutting spindles 22 are cut into semiconductor packages.

A strip picker for conveying a strip from the inlet rail 12 to the cutting chuck table 21 while horizontally moving along the first X-axis guide rail 15 on the upper side of the inlet rail 12 and the cutting processing unit 20. 14 is installed.

A cleaning unit 30 for cleaning the semiconductor package cut on one side of the cutting processing unit 25 and a drying unit 40 for drying the cleaned semiconductor package are disposed, and the cutting processing unit 20 and the cleaning unit ( 30 and a unit picker 35 for transporting the semiconductor packages individually cut on the drying unit 40 are installed to move horizontally along the first X-axis guide rail 15. The drying unit 40 is configured to horizontally reciprocate the drying block 41 along the first Y-axis guide rail 45 in which a plurality of vacuum holes arranged to vacuum-absorb semiconductor packages are arranged.

In addition, the first vision inspection unit 51, which vision-assembles the semiconductor packages on the drying block 41 by vision photographing the semiconductor packages on the drying block 41 on one side of the rear portion of the main body, has a second X-axis. It is comprised so that horizontal movement to arbitrary X-axis position along the guide rail 55 is possible. The first vision inspection unit 51 may be configured using, for example, a CCD camera.

In addition, an unloading unit 70 having an empty tray T for storing the individual semiconductor packages P conveyed from the drying unit 40 is disposed at one side of the drying unit 40.

Two unloading pickers picking up the semiconductor package on the drying block 41 between the first vision inspection unit 51 and the drying unit 40 and transporting the semiconductor package to the unloading unit 70 to be stored in the tray T ( 60) is installed. The unloading pickers 60 carry semiconductor packages while independently moving horizontally along a pair of third X-axis guide rails 65 formed parallel to each other.

In addition, each of the unloading pickers 60 includes a plurality of pick-up nozzles 61 (see FIG. 4) capable of vacuum suction of semiconductor packages individually (see FIG. 4), and each pick-up nozzle ( 61 are all individually rotatable at any angle about the vertical axis.

A second vision inspection unit 52 for vision inspection a mark engraved on a lower surface of each semiconductor package adsorbed by the unloading picker 60 is disposed below the moving path of the unloading picker 60.

Meanwhile, two second Y-axis guide rails 75 are installed in the unloading part 70 so as to extend in the Y-axis direction, and each of the second Y-axis guide rails 75 is horizontally moved at different heights. Two tray feeders 71 for carrying the trays T are provided. Therefore, the tray feeders 71 cross-move along the second Y-axis guide rail 75 and simultaneously move the empty tray or the tray filled with the semiconductor package to accommodate the semiconductor package and efficiently store the semiconductor package. To be performed.

In the unloading unit 70, semiconductor packages of the unloading picker 60 are moved by the X-axis movement of the unloading picker 60 and the Y-axis movement of the tray T by the tray feeder 71. The semiconductor package is sequentially stored in an empty pocket (not shown) of the tray T while the relative position between the pocket and the pocket (not shown) of the tray T is adjusted.

And, on the upper side of the unloading unit 70, a tray picker 72 for transporting the tray T is installed to reciprocate horizontally along the first X-axis guide rail 15.

The semiconductor package cutting and handling apparatus according to this embodiment operates as follows.

When a strip (not shown) is withdrawn from the loading part 10 onto the inlet rail 12, the strip picker 14 picks up the strip of the inlet rail 12 to cut the chuck table for cutting the cutting part 20. It is seated on 21 and fixed.

Subsequently, the cutting chuck table 21 is moved to the cutting spindle 22 position, and the strip is cut into individual semiconductor packages by the relative movement between the cutting chuck table 21 and the cutting spindle 22.

Subsequently, the cutting chuck table 21 moves forward to return to its original position, and the unit picker 35 vacuum-adsorbs the individual semiconductor packages on the cutting chuck table 21 to clean the washing unit 30 and the drying unit. Return to 40 in order.

The cleaning unit 30 removes foreign substances by spraying water and / or air to the cut semiconductor package. In the drying unit 40, the semiconductor packages are mounted on the drying block 41 and dried by heating and / or blowing in a vacuum-adsorbed state. At this time, the semiconductor package (P) on the drying block 41 is in the process of being transferred to the drying block 41 after cutting or drying on the drying block 41 as shown in FIG. do.

As shown in FIG. 3 again, when the drying of the semiconductor packages is completed in the drying block 41, the drying block 41 moves backward along the first Y-axis guide rail 45 to form the first vision inspection unit ( It is located under 51). Then, the first vision inspection unit 51 moves along the second X-axis guide rail 55 to perform vision imaging of the upper surface (for example, the surface on which the ball is formed) of the semiconductor packages on the drying block 41, and inspects the alignment state. . At this time, the alignment state information of each of the semiconductor packages photographed, that is, the orientation of the semiconductor package, the X-axis direction and the Y-axis offset, etc. are stored in the controller (not shown).

Then, the drying block 41 again moves forward along the first Y-axis guide rail 45 to be positioned below the unloading picker 60.

In this case, as shown in FIGS. 4 and 5, the controller (not shown) moves the pickup nozzles 61 of the unloading picker 60 along a vertical axis according to the alignment state information of the stored semiconductor packages P. FIG. By rotating at a predetermined angle to adjust to match the orientation of the respective semiconductor packages (P).

Subsequently, the unloading picker 60 moves to the lower side of the drying block 41 to adsorb the semiconductor packages P placed on the upper surface of the drying block 41. At this time, the controller (not shown) is arranged in each semiconductor package of the drying block 41 according to the alignment state information on the position of the stored semiconductor packages P, that is, the X-axis direction and the Y-axis direction offset information. The unloading picker 60 is horizontally moved while correcting the relative positions of the pick-up nozzles 61 in the X-axis and Y-axis directions, and vacuum-suctions the semiconductor packages on the drying block 41. In other words, the X-axis position correction among the relative positions between the pick-up nozzles 61 of the semiconductor package P and the unloading picker 60 is performed by the X-axis movement of the unloading picker 60, and the Y-axis position. The correction is made by the Y-axis movement of the drying block 41, the alignment direction (orientation) correction, that is, the rotation in the θ direction is made by the rotation of the pickup nozzle (61). Therefore, when the unloading picker 60 picks up the semiconductor packages P on the drying block 41, the respective semiconductor packages P can be picked up to the pick-up nozzle 61 accurately.

When the semiconductor package P is adsorbed to the pickup nozzle 61 of the unloading picker 60 as described above, as shown in FIG. 6, each of the pickup nozzles 61 of the unloading picker 60 has been previously described. Rotate in reverse to adjust the alignment directions of the semiconductor packages P to coincide with each other.

Then, as shown in FIG. 3 again, the unloading picker 60 moves along the third X-axis guide rail 65 and is positioned above the second vision inspection unit 52. Subsequently, the second vision inspection unit 52 vision photographs the lower surface (the surface without the ball) of the semiconductor packages adsorbed on the unloading picker 60 and inspects a state of a mark or the like printed on the surface.

The unloading picker 60 moves upward of the unloading part 70 to accommodate the semiconductor packages in the tray T.

As described above, the semiconductor package cutting and handling apparatus of the present invention acquires the alignment direction and position information of each semiconductor package P located on the drying block 41 by using the first vision inspection unit 51, and then obtains the alignment direction. The pick-up nozzle 61 of the unloading picker 60 is rotated according to the alignment direction and the position information, and the relative position of the pick-up nozzle 61 with respect to the semiconductor package on the drying block 41 is corrected. The vacuum adsorption on the drying block 41 is accurately, and is stored in the tray (T) in the unloading unit (70). Therefore, according to the present invention, since the alignment of the semiconductor packages in the unloading picker 60 is precisely performed, there is no need for a separate configuration for realigning positions as in the conventional alignment turntable 6 (see FIG. 1). As a result, the alignment accuracy is further improved.

Meanwhile, in the above-described embodiment of the semiconductor package, the first vision inspection unit 51 photographs the semiconductor packages on the dry block 41 to obtain the alignment state information, and based on this, each semiconductor is unloaded by the unloading picker 60. The alignment and position of the packages were corrected.

However, in contrast, the first vision inspection unit 51 simply performs a defect inspection and defect inspection of the semiconductor package, and the second vision inspection unit 52 photographs the semiconductor packages absorbed by the unloading picker 60 from the lower side thereof. The alignment state and the position information may be obtained, and the alignment direction of the semiconductor package and the relative position of the unloading unit 70 with the tray T may be corrected. In this case, the pick-up nozzle 61 of the unloading picker 60 may be formed in a shape that can fix the semiconductor package even when the alignment of the semiconductor package is disturbed, for example, in a circular shape.

Of course, even in this case, the alignment state and position information of the semiconductor packages can be detected relatively accurately, but as in the previous embodiment, the first vision inspection unit 51 photographs the ball forming surface of the semiconductor package to obtain alignment state and position information. In the case of detecting, since the ball grid array of the semiconductor package may be a reference for detecting the alignment state and the position, the alignment state and the position may be more accurately and easily detected.

Meanwhile, although the above-described embodiment of the semiconductor package cutting and handling apparatus includes a drying unit 40 for cleaning and drying the cut semiconductor package P, the unloading picker immediately after cleaning without forming the drying unit ( 60 may pick up and transport the semiconductor package, or alternatively, the drying unit 40 may function as a mounting block in which the individualized semiconductor package is simply mounted without performing the drying function.

In addition, the above-described embodiment of the semiconductor package cutting and handling device has been exemplified as one drying block 41 is configured in the drying unit 40.

However, as shown in FIG. 7, two or more drying blocks 41 in the drying unit 40 may be configured to move independently along the Y axis, thereby further improving work efficiency.

8 shows another embodiment of a semiconductor package cutting and handling apparatus according to the present invention, wherein the semiconductor package cutting and handling apparatus of this embodiment has the same basic configuration as the semiconductor package cutting and handling apparatus of the first embodiment described above. Do. However, the semiconductor package cutting and handling apparatus of this embodiment is different in that the first vision inspection unit 51 is not located behind the main body, but in front of the main body, strictly speaking, immediately behind the drying block 41.

As such, when the first vision inspection unit 51 is positioned above the immediate vicinity of the drying block 41, the inspection may be performed at the current position without moving the drying block 41 to the rear of the main body. The advantage is that the work path and time can be further shortened.

9 illustrates another embodiment of a semiconductor package cutting and handling apparatus according to the present invention. The semiconductor package cutting and handling apparatus of this embodiment also has the same basic configuration as the semiconductor package cutting and handling apparatus of the first embodiment described above. Do. However, the semiconductor package cutting and handling apparatus of this embodiment differs in that the first vision inspection unit 51 is integrally fixed to one side of the tray picker 72 of the unloading unit 70.

In this way, when the first vision inspection unit 51 is fixed to one side of the tray picker 72, an additional configuration for moving the first vision inspection unit 51 in the X-axis direction is unnecessary, thus further improving the overall configuration. It can be simplified and further reduced in size.

In addition, unlike this embodiment, the first vision inspection unit 51 may be fixedly installed at one side of the unloading picker 60 to move together with the unloading picker 60.

In the above-described embodiments of the semiconductor package cutting and handling apparatus, all of the semiconductor packages cut by the cutting processing unit 20 are sequentially transferred to the cleaning unit 30 and the drying unit 40, and then the unloading picker 60 is dried. Configured to return the packages.

However, as shown in FIG. 10, two X-axis guide rails 65 intersecting the upper side of the cutting part 20 and the unloading part 70 are formed in front of the main body, and the respective X-axis guide rails. The unloading pickers 60 are individually movable at 65, and the cleaning unit 30 and the first vision inspection unit 51 are arranged inline on the movement path of the unloading pickers 60. To configure the semiconductor package cutting and handling device.

Here, the cleaning part 30 is a brush part 31 in which the semiconductor package is in contact with the brush to shake off foreign substances, and a cleaning / drying unit for removing and drying foreign substances by spraying water and / or air on the semiconductor package ( 32).

In this fifth embodiment, the tray picker 72 for conveying the trays from the unloading unit 70 is configured behind the main body so as not to interfere with the unloading picker 60.

In the semiconductor package cutting and handling apparatus of this embodiment, the unloading pickers 60 immediately pick up the semiconductor packages on the cutting chuck table 21 and return them to the cleaning unit 30 for cleaning and / or drying, The vision inspection unit 51 photographs the lower surface of the semiconductor packages picked up by the unloading picker 60 to examine the alignment direction and position of the semiconductor packages, and then picks up the nozzle 61 according to the alignment direction and position information (see FIG. 4). ), The alignment direction is corrected, and the relative position of the unloading unit 70 with the tray T is corrected to be accommodated in the tray T.

When the semiconductor package cutting and handling device is configured as in this embodiment, the overall configuration and the process can be further simplified, and the overall size can be significantly reduced.

Meanwhile, in the fifth embodiment, the first vision inspection unit 51 photographs the lower surface of the semiconductor packages conveyed by the unloading picker 60 to obtain information about the alignment state and the position thereof. The first vision inspection unit is integrally fixed to the upper side of the 20 or to one side of the unloading picker 60 so that the upper surfaces of the semiconductor packages on the cutting chuck table 21 are photographed, and the alignment state and position information are acquired. You could do it.

In addition, although the above-described embodiments of the semiconductor package cutting and handling apparatus are configured to accommodate the semiconductor elements in the tray T in the unloading unit 70, the semiconductor packages may be placed in an elongated tube or reel-tape tape in addition to the tray. It can also be stored.

As described above, according to the present invention, the semiconductor package is picked up by correcting the direction and position of the pick-up nozzle in the unloading picker without configuring an additional alignment device such as an existing turntable for alignment, and the alignment state and position thereof. Or the semiconductor packages are picked up in the unloading picker and the alignment and position of the semiconductor packages are corrected and rearranged and stored in the tray, which greatly simplifies the overall configuration and process of the apparatus and greatly increases the overall size. There is an advantage to reduce.

In addition, since the alignment direction and position of the semiconductor package are readjusted and aligned based on the vision-photographed alignment state and position information, the alignment of the semiconductor packages can be accurately performed, and when the semiconductor package on the drying block is picked up or stored in a tray This can greatly reduce the likelihood of error and thus increase productivity.

Claims (12)

A cutting part for cutting the strip in which the plurality of semiconductor packages are integrated to individualize the semiconductor packages; An intermediate process unit in which individual semiconductor packages conveyed from the cutting process unit are seated; An unloading unit accommodating semiconductor packages conveyed from the intermediate process unit; A vision inspection unit for vision imaging the semiconductor packages mounted on the intermediate process unit to inspect the alignment and position of the semiconductor packages; And an unloading picker having at least one pickup nozzle configured to pick up and fix the semiconductor packages on the intermediate process portion and to be rotatable at an angle about a vertical axis; The unloading picker rotates the pick-up nozzles at an angle according to the alignment state and position information of each of the semiconductor packages obtained by the vision inspection unit, or the XY direction relative to each of the semiconductor packages on the intermediate process unit. A semiconductor package cutting and handling device adapted to pick up semiconductor packages in an intermediate process section by correcting their position. A cutting part for cutting the strip in which the plurality of semiconductor packages are integrated to individualize the semiconductor packages; An intermediate process unit in which individual semiconductor packages conveyed from the cutting process unit are seated; An unloading unit accommodating semiconductor packages conveyed from the intermediate process unit; An unloading picker for picking up the semiconductor package on the intermediate process portion and having at least one pickup nozzle rotatable at any desired angle about a vertical axis to convey the semiconductor package of the intermediate process portion to the unloading portion; A vision inspection unit for vision imaging the semiconductor packages picked up by the unloading picker to inspect the alignment and position of the semiconductor packages; The unloading picker rotates the pick-up nozzles at an angle according to the alignment state and position information of each semiconductor package obtained by the vision inspection unit to correct alignment of the semiconductor packages or to the unloading unit. And a semiconductor package cutting and handling device for correcting the positions of the semiconductor packages fixed to the respective pickup nozzles while being relatively moved in the XY direction and storing them in the unloading unit. A cutting part for cutting the strip in which the plurality of semiconductor packages are integrated to individualize the semiconductor packages; An unloading unit accommodating semiconductor packages conveyed from the cutting process unit; An unloading picker which picks up the semiconductor package on the cutting part and has at least one pickup nozzle which is rotatable at an angle about a vertical axis to convey the semiconductor package of the cutting part to the unloading part; A vision inspection unit for vision imaging the semiconductor package picked up by the unloading picker or the semiconductor packages on the cutting process unit to inspect the alignment and position of the semiconductor packages; The unloading picker rotates the pick-up nozzles at an angle according to the alignment state information of each semiconductor package obtained by the vision inspection unit, thereby correcting the alignment direction of the semiconductor packages or adjusting the XY direction position of the semiconductor package. A semiconductor package cutting and handling device adapted to be corrected and stored in an unloading unit. The semiconductor package cutting according to claim 1, wherein the intermediate process unit is a drying unit including at least one drying block having a heater for cleaning and drying individual semiconductor packages cut in the cutting processing unit. And handling device. The semiconductor package cutting and handling apparatus of claim 4, wherein the drying block of the drying unit is configured to reciprocate horizontally to a lower position of the unloading picker. The semiconductor package cutting and handling apparatus of claim 1, wherein the vision inspection unit is positioned above the intermediate process unit. The semiconductor package cutting and handling apparatus of claim 1, wherein the vision inspection unit is positioned above the intermediate process unit. The tray conveying picker for transporting a tray for accommodating semiconductor elements in the unloading part is installed to be movable horizontally to an upper position of the intermediate process part, and the vision inspection part is fixed to the tray conveying picker. The semiconductor package cutting and handling device, characterized in that installed to move horizontally with the tray transport picker. The semiconductor package cutting and handling apparatus of claim 1, wherein the vision inspection unit is fixedly installed at one side of the unloading picker and moves together with the unloading picker. The semiconductor package cutting and handling apparatus of claim 1, wherein a plurality of intermediate process units are formed. A cutting part for cutting the strip in which the plurality of semiconductor packages are integrated to individualize the semiconductor packages; An intermediate process unit in which individual semiconductor packages conveyed from the cutting process unit are seated; An unloading unit accommodating semiconductor packages conveyed from the intermediate process unit; A vision inspection unit for vision imaging the semiconductor packages mounted on the intermediate process unit to inspect the alignment and position of the semiconductor packages; And an unloading picker having at least one pickup nozzle configured to pick up and fix the semiconductor packages on the intermediate process unit and to be rotatable at any desired angle about a vertical axis. A cutting part for cutting the strip in which the plurality of semiconductor packages are integrated to individualize the semiconductor packages; An unloading unit accommodating semiconductor packages conveyed from the cutting process unit; An unloading picker which picks up the semiconductor package on the cutting part and has at least one pickup nozzle which is rotatable at any desired angle about a vertical axis to convey the semiconductor package of the cutting part to the unloading part; And a vision inspection unit for vision imaging the semiconductor package picked up by the unloading picker or the semiconductor packages on the cutting processing unit to inspect the alignment and position of the semiconductor packages.

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