JP4182504B2 - Electronic component production method and production apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a product placement method and production equipment during production of electronic components (from assembly / cutting process to product storage process).
[0002]
[Prior art]
Conventionally, the following methods have been used to assemble and cut products and store them.
[0003]
FIGS. 11 to 13 are views for explaining an example of a conventional production process, FIG. 11 is a perspective view showing the arrangement of products in the previous process of the assembly and cutting process, and FIG. 12 is a perspective view showing the assembly and cutting process. 13 is a perspective view showing the stick storing step, FIG. 14 is a perspective view showing the first storing step for taking out and sucking the product, and FIG. 15 shows the second and third storing steps for carrying and storing the product. It is a perspective view.
[0004]
Referring to FIG. 11, a carrier 101 as a supply member is disposed between the pre-process and the post-process so as to extend along the conveyance direction 103, and the product 102 is coupled to one side of the carrier 101. Are arranged.
[0005]
Referring to FIG. 12, the products 102 are assembled one by one using dedicated equipment, and unnecessary portions 101 'are cut and removed.
[0006]
Referring to FIG. 13, the separated products 102 are stored one by one in the stick 105 as indicated by an arrow 104.
[0007]
Referring to FIG. 14, the products 102 are taken out from the stick 105 one by one by the pickup unit 107 having the suction nozzle of the storage mechanism unit 106 as a dedicated facility that is different from the equipment in the previous process, and is sucked and stored. Transport to the member position.
[0008]
Referring to FIG. 15, the products are conveyed one by one by the pickup unit 107 of the same storage mechanism unit 106, and the products 102 conveyed to a predetermined position of the storage member 108 are stored one by one.
[0009]
FIGS. 16 to 19 are views for explaining another example of the conventional production process. FIG. 16 is a perspective view showing the arrangement of products in the previous process of the assembly and cutting process. FIG. 17 shows the assembly and cutting process. FIG. 18 is a perspective view showing first and second storage steps for sucking and transporting the product, and FIG. 19 is a perspective view showing a third storage step for storing the product.
[0010]
Referring to FIG. 16, a carrier 101 as a supply member is disposed between the pre-process and the post-process so as to extend along the conveyance direction 103, and a predetermined pitch is set on one side of the carrier 101. The products 102 are connected and arranged at P1 ′ (product pitch).
[0011]
Referring to FIG. 17, the product 102 is assembled by dedicated equipment, and unnecessary portions 101 ′ are cut and removed, and the plurality of products 102 are cut out.
[0012]
Referring to FIG. 18, a plurality of products are sucked and transported by pickup units 107 each having a suction nozzle of a plurality of storage mechanisms 106 that are dedicated facilities.
[0013]
Referring to FIG. 19, a plurality of products are transported by the respective pickup units 107 of the same plurality of storage mechanism units 106 of the dedicated equipment, and are arranged on the storage member 108 at a predetermined pitch P2 ′ (storage pitch). The plurality of products 102 are respectively stored.
[0014]
In this way, even in the conventional process, the assembly and cutting process of the product is performed by the dedicated equipment. Thereafter, the product is temporarily stored in a stick in the next step. Alternatively, the product can be stored in a dedicated facility. Finally, by Osamu pay machine in a separate process, to accommodate the product.
[0015]
Next, production is performed with dedicated equipment that can perform a series of processes from assembly / cutting to storage of products. However, there are cases where this dedicated equipment has one product storage mechanism section having one product pickup section and cases where the dedicated equipment has a plurality of product storage mechanism sections having one product pickup section. is there.
[0016]
[Problems to be solved by the invention]
However, each of these conventional methods has the following drawbacks.
[0017]
First, since the product storage process is performed in a separate process, a storage machine is required in addition to a dedicated machine for assembling and cutting the product, resulting in high equipment costs. Also, the production efficiency is poor and the processing cost is high.
[0018]
Next, a series of steps from product assembly / cutting to storage can be performed, but this equipment has only one product storage mechanism and stores products one by one, resulting in poor production efficiency and high processing costs.
[0019]
On the other hand, in a facility having a plurality of product storage mechanisms, a plurality of products are stored at the same time or with a slight time difference, so that production efficiency is high and processing costs can be kept low. However, since a plurality of product storage mechanisms are required, the equipment cost increases.
[0020]
Therefore, one technical problem of the present invention is to solve the problems of the conventional production method, and to store a plurality of products at the same time, to improve the production efficiency and reduce the processing cost, and the production method and production of electronic parts To provide an apparatus.
[0021]
In addition, another technical problem of the present invention is to provide an electronic component production method and production apparatus that can reduce equipment costs and reduce the influence of dimensional variations and machine misfeeds. It is in.
[0022]
[Means for Solving the Problems]
According to the present invention, the assembly of assembling an electronic component in a state where two rows of parallel components separated from each other by a storage pitch on the carrier are connected and fixed so that the electronic components in one row and the other row are symmetrical to each other. a step, and the second column the corresponding two electronic components of the cutting step of disconnecting from the carrier at the two pick-up unit for each pick up two electronic component by the suction nozzle or chucking, the two electronic components a pickup step for picking up, after the one of the two electronic components picked up by rotating 180 degrees, a conveying step of conveying to a predetermined position, stored for accommodating the two electronic components conveyed to the housing member The assembly step, the cutting step, the pick-up step, the transporting step, and the storing step, wherein the two electronic components are separated at the storing pitch. Thus, a method for producing an electronic component can be obtained.
[0023]
In addition, according to the present invention, an assembling process for assembling the electronic components in a state of being connected and fixed in a line at a storage pitch in the carrier, a cutting process for separating the two electronic components from the carrier, a suction nozzle or a chuck. Therefore King at two pickup unit for each pick up two electronic components, separated, the pickup step of the two electronic components to each pickup, two each the same direction of the electronic component picked up And a transporting process for transporting the transported electronic parts to a predetermined position, and a storing process for storing the transported two electronic components in a storage member, the assembling process, the cutting process, the picking process, and the transporting process. , and the storage step, the two electronic components is performed while keeping the separated state by the storing pitch of the electronic components, characterized in Rukoto Production method.
[0024]
In addition, according to the present invention, the electronic components are connected in a fixed manner so that the electronic components in one row and the other row are symmetrical with each other in two rows arranged in parallel at a storage pitch in the carrier. comprising an assembly means for assembling, cutting means for two rows corresponding to the two electronic components disconnected from the carrier, I by the suction nozzle or chucking, a pickup unit for picking up two electronic components, separated, the a pickup means pickup unit to respectively pick up two electronic components, after one of the two electronic components picked up by rotating 180 degrees, a transfer means for transferring to a predetermined position, two electrons transported Storage means for storing the components in storage members, respectively, the assembly means, the cutting means, the pick-up means, the transport means, and the storage means An electronic component production apparatus is obtained in which the two electronic components operate while being kept apart at the storage pitch .
[0025]
Further, according to the present invention, the assembling means for assembling the electronic components in the state of being connected and fixed in a line at a storage pitch in the carrier, the cutting means for separating the two electronic components from the carrier, the suction nozzle or the chuck. Therefore King, includes a pickup unit for picking up two electronic components, separated, the pickup unit includes a pickup means for each pick up two electronic components, each of the two electronic components picked up in the same direction And a transporting means for transporting the transported electronic parts to a predetermined position after being rotated by 90 °, and a storage means for storing the transported two electronic components in a storage member, the assembly means, the cutting means, the pickup means, and the transporting means. And the storage means operates while the two electronic components are kept apart from each other at the storage pitch. An electronic device production apparatus is obtained.
[0026]
Further, according to the present invention, in the production apparatus of an electronic component according the any one, the pickup means, that has two pickup unit for each pick up the two electronic components A characteristic electronic component production apparatus is obtained.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0028]
FIG. 1 to FIG. 5 are diagrams used for explaining the production process of the electronic component according to the embodiment of the present invention .
[0029]
Specifically, FIG. 1 is a perspective view showing the arrangement of products of electronic parts in the pre-process of the assembly and cutting process, FIG. 2 is a perspective view showing the assembly and cutting processes, and FIG. FIG. 4 is a perspective view showing a second storage step for reversing and transporting the electronic component product, and FIG. 5 is a perspective view showing a third product storage step for storing the electronic component product. It is.
[0030]
Referring to FIG. 1, a pair of carrier portions 1 a and 1 b are connected to both sides as supply members so as to extend along the conveying direction 3 between the pre-process and the post-process, and these carrier parts are connected to each other. disposed carrier 1 is provided with a parts 1c, each carrier portion 1a, the product 2 inside the respective 1b are then respectively bonded, opposed at intervals P1 predetermined (product pitch), parallel and It is arranged so that it becomes.
[0031]
Referring to FIG. 2, a plurality of electronic component products 2 are assembled by an exclusive facility (an assembling process by an assembling means), unnecessary portions 1 ′ are cut and removed, and a plurality of products 2 are simultaneously cut (cut by a cutting means). Process).
[0032]
Referring to FIG. 3, the separated product 2 is provided with a suction nozzle of a storage mechanism unit 6 that is a dedicated facility, and a plurality of pickup units 7 arranged at a predetermined pitch P <b> 1 (equal to the product pitch), A plurality of products 2 are adsorbed simultaneously (pickup process). Here, the storage mechanism unit 6 constitutes a transport unit that transports the product and a storage unit that stores the transported product.
[0033]
Referring to FIG. 4, one of the adsorbed products 2 is rotated 180 degrees as indicated by an arrow 9 by each pickup unit 7 of the same storage mechanism unit 6 to convey a plurality of products simultaneously. Then, it conveys from the cutting position to the embossed tape position (conveying process).
[0034]
Referring to FIG. 5, two products are simultaneously transported by the pickup unit 7 of the same storage mechanism unit 6 and transported to a storage position 8 a having a predetermined pitch P2 (product pitch) equal to P1 of the storage member 8. Two of the finished products 2 are stored at the same time (storage process).
[0035]
As described above, in the first embodiment of the present invention, the product pitch P1 and the storage pitch P2 are the same, and the pickup unit 7 of the dedicated equipment is also provided in one product storage mechanism unit 6 at the same pitch. Provided. Therefore, a plurality of products 2 can be stored simultaneously with one action. Further, since the pickup unit 7 is rotatable, if the pitches of the products 2 (the intervals at which the products are arranged) are the same, the products 2 can be simultaneously stored even if the orientations of the products 2 are not the same direction.
[0036]
FIGS. 6 to 10 are views for explaining an electronic component production process according to the second embodiment of the present invention. FIG. 6 is a perspective view showing an arrangement of electronic component products in the pre-process of the assembly cutting process. 7 is a perspective view showing an assembling and cutting process, FIG. 8 is a perspective view showing a first storage stage (pickup process) for adsorbing a product of electronic components, and FIG. 9 is a second storage for inverting and transporting the product. FIG. 10 is a perspective view showing a third storage stage (normal storage process) for storing products.
[0037]
Referring to FIG. 6, a carrier 11 as a supply member is disposed between the pre-process and the post-process so as to extend along the transport direction 3, and a predetermined pitch is set on one side of the carrier 11. Products 2 are connected and arranged at P1 (product pitch).
[0038]
Referring to FIG. 7, the product 2 is assembled by the dedicated equipment (assembly process by the assembling means), and the plurality of products 2 are simultaneously cut out and unnecessary portions 11 ′ are cut and removed (cutting process by the cutting means).
[0039]
As shown in FIG. 8, in the first storage stage, a plurality of products 2 that have been cut out are simultaneously stored in one storage mechanism section 6 that is a dedicated facility, with the pickup 7 provided at a pitch P1 equal to the product pitch. The suction nozzle sucks (pickup process). Here, the storage mechanism unit 6 constitutes a transport unit that transports the product and a storage unit that stores the transported product.
[0040]
As shown in FIG. 9, in the second storage stage, the pickup unit 7 rotates the sucked products 2 by 90 degrees and conveys the two products 2 at the same time, as indicated by an arrow 12.
[0041]
Referring to FIG. 10, as a continuation of the second storage stage, a plurality of products are conveyed by the respective pickup units 7 of the same storage mechanism unit 6 of the dedicated equipment, and the pitch P2 equal to the product pitch P1 is transferred to the storage member 8. It is conveyed to the storage position 8a arranged at (storage pitch) (conveying process), and as a third storage stage, a plurality of products 2 are stored simultaneously (storage process).
[0042]
As described above, in the second embodiment of the present invention, a plurality of products can be stored by making each pickup section 7 rotatable even when the product arrangement is a single row.
[0043]
In the first and second embodiments of the present invention, only the embossed tape storage has been described as the storage member 8. However, the other storage members such as the tray storage are also described in the first and second embodiments of the present invention. By applying the method according to the embodiment, the products can be collectively stored.
[0044]
Furthermore, it can be applied not only to the storage process but also to the transfer of the product to the next process and the setting to the holder.
[0045]
【The invention's effect】
As described above, in the present invention, the product pitch in the production process from the assembly and cutting of the electronic component product to the storage process is the same as the product storage pitch in the storage state, and the product assembly, Since a single product storage mechanism in a production facility that can perform a series of operations from cutting to storage has multiple pickup units, multiple products can be stored simultaneously, improving production efficiency and reducing processing costs. Since only one storage mechanism unit for storing the product of the production facility is required, it is possible to provide an electronic component production method and a production apparatus that can reduce the equipment cost.
[0046]
Further, in the present invention, a product receiving mechanism portion is a method of producing dimensional variations and mechanical misfeed influence less can Ru electronic components to the so requires only one for housing in equipment and production equipment Can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram which is used for describing an electronic component production process according to a first embodiment of the invention.
FIG. 2 is a diagram for explaining an electronic component production process according to the first embodiment of the invention.
FIG. 3 is a diagram for explaining a production process of an electronic component according to the first embodiment of the present invention.
FIG. 4 is a diagram which is used for describing an electronic component production process according to the first embodiment of the invention.
FIG. 5 is a diagram which is used for describing an electronic component production process according to the first embodiment of the invention.
FIG. 6 is a diagram for explaining an electronic component production process according to the second embodiment of the present invention.
FIG. 7 is a diagram which is used for describing an electronic component production process according to the second embodiment of the invention.
FIG. 8 is a diagram for explaining an electronic component production process according to the second embodiment of the present invention;
FIG. 9 is a diagram which is used for describing an electronic component production process according to the second embodiment of the invention.
FIG. 10 is a diagram which is used for describing an electronic component production process according to the second embodiment of the invention.
FIG. 11 is a diagram for explaining an example of a production process of a conventional electronic component.
FIG. 12 is a diagram for explaining an example of a production process of a conventional electronic component.
FIG. 13 is a diagram for explaining an example of a production process of a conventional electronic component.
FIG. 14 is a diagram for explaining an example of a production process of a conventional electronic component.
FIG. 15 is a diagram for explaining an example of a production process of a conventional electronic component.
FIG. 16 is a diagram for explaining another example of the production process of a conventional electronic component.
FIG. 17 is a diagram for explaining another example of the production process of the conventional electronic component.
FIG. 18 is a diagram for explaining another example of the production process of a conventional electronic component.
FIG. 19 is a diagram for explaining another example of the production process of a conventional electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Carrier 1 'Unnecessary part 1a, 1b Carrier part 1c Coupling part 2 Product 3 Conveying direction 6 Storage mechanism part 7 Pickup part 8 Storage member 8a Storage position 9,12 Arrow 11 Carrier 11' Unnecessary part 12 Arrow 101 Carrier 101 'Unnecessary part 102 Product 103 Conveying direction 104 Arrow 105 Stick 106 Storage mechanism 107 Pick-up part 108 Storage member

Claims (5)

An assembly process for assembling the electronic components in a state where the electronic components in one row and the other row are connected and fixed so as to be symmetrical with each other in two rows arranged in parallel at a storage pitch on the carrier ; a cutting step for disconnecting the corresponding two electronic components from the carrier, and a pickup step for picking up at two pickup, the two electronic components to each pick up two electronic component by the suction nozzle or chucking after the one of the two electronic components picked up by rotating 180 °, comprising a conveying step of conveying to a predetermined position, and a storage step of storing the two electronic components conveyed to the housing member, wherein In the assembly process, the cutting process, the pick-up process, the transporting process, and the storing process, the two electronic components should not be kept separated at the storing pitch. An electronic component production method characterized by being carried out . In the storing pitch in the carrier, and the assembly process of assembling the electronic parts connected and fixed state in a row-like, and a cutting step of disconnecting the two electronic components from the carrier, depending on the suction nozzle or chucked, detached 2 number of electronic components in two pickup unit for each pickup, and a pickup step for each pick up the two electronic components, after each of the two electronic components picked up is rotated 90 degrees in the same direction, A transporting process for transporting to a predetermined position; and a housing process for housing the transported two electronic components in a housing member, wherein the assembly process, the cutting process, the pick-up process, the transporting process, and the housing process are described in 2 number of electronic components, carried out while maintaining the state of being spaced apart in the storing pitch method for producing an electronic component according to claim Rukoto. An assembly means for assembling the electronic components in a state where the electronic components in one row and the other row are connected to each other so as to be symmetrical with each other in parallel with two rows separated by a storage pitch on the carrier ; cutting means for disconnecting the corresponding two electronic components from the carrier, I by the suction nozzle or chucking, includes a pickup unit for picking up two electronic components, separated, the pickup unit 2 of the electronic component a pickup means for each pickup, after one of the two electronic components picked up by rotating 180 degrees, a transfer means for transferring to a predetermined position, for housing the two electronic components conveyed to the respective housing member Storage means, the assembly means, the cutting means, the pick-up means, the transport means, and the storage means, the two electronic components are An electronic component production apparatus that operates while maintaining a separated state at a storage pitch . In the storing pitch in the carrier, and an assembly means for assembling the electronic parts connected and fixed state in a row-like, and cutting means to separate the two electronic components from the carrier, depending on the suction nozzle or chucked, detached 2 A pick-up unit for picking up the electronic parts, and the pick-up part rotates each of the two electronic parts picked up by 90 ° in the same direction, A transport unit that transports to a position; and a storage unit that stores the transported two electronic components in a storage member. The assembly unit, the cutting unit, the pickup unit, the transport unit, and the storage unit include: Two electronic parts operate while maintaining a state of being separated at the storage pitch. Place. In the production apparatus for an electronic component according to claim 3 or 4, wherein the pickup means, electronic parts production apparatus characterized in that it has two pick-up unit for each pick up the two electronic components .

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