JP2002064109A - Method and device for producing electronic parts - Google Patents

Method and device for producing electronic parts

Info

Publication number
JP2002064109A
JP2002064109A JP2000250775A JP2000250775A JP2002064109A JP 2002064109 A JP2002064109 A JP 2002064109A JP 2000250775 A JP2000250775 A JP 2000250775A JP 2000250775 A JP2000250775 A JP 2000250775A JP 2002064109 A JP2002064109 A JP 2002064109A
Authority
JP
Japan
Prior art keywords
electronic component
electronic components
storage
carrier
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000250775A
Other languages
Japanese (ja)
Other versions
JP4182504B2 (en
Inventor
Hiroki Abe
浩樹 阿部
Yoshihito Umetsu
吉仁 梅津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAGATA KOKU DENSHI KK
Original Assignee
YAMAGATA KOKU DENSHI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMAGATA KOKU DENSHI KK filed Critical YAMAGATA KOKU DENSHI KK
Priority to JP2000250775A priority Critical patent/JP4182504B2/en
Publication of JP2002064109A publication Critical patent/JP2002064109A/en
Application granted granted Critical
Publication of JP4182504B2 publication Critical patent/JP4182504B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for producing electronic parts by which a plurality of products can be housed simultaneously and processing cost can be reduced by improving productive efficiency. SOLUTION: The method for producing electronic parts includes an assembling step of assembling electronic parts in a state where the electronic parts are connected and fixed to a carrier in parallel with each other at prescribed intervals, a cutting step of cutting off the parts from the carrier, and a picking-up step of picking up two electronic parts by means of a picking-up section which picks up electronic parts by means of suction nozzles by chucking. The method also includes a transporting step of transporting the picked-up electronic parts to a prescribed position after one of the parts is turned by 180 deg., and a housing step of housing the transported electronic parts in a housing member.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品の生産時
(組立・切断工程から製品収納工程)における製品の配
置方法及び、生産設備に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for arranging products during the production of electronic components (from an assembling / cutting process to a product storage process) and a production facility.

【0002】[0002]

【従来の技術】従来、製品を組立・切断を行ない収納す
るには、次の方法がなされていた。
2. Description of the Related Art Conventionally, the following methods have been used to assemble, cut, and store products.

【0003】図11乃至図13は従来の生産工程の一例
の説明に供せられる図、図11は組立及び切断工程の前
工程における製品の配置を示す斜視図、図12は組立及
び切断工程を示す斜視図、図13はスティック収納工程
を示す斜視図、図14は製品取り出し及び吸着を行う第
1の収納工程を示す斜視図、図15は搬送及び製品収納
を行う第2及び第3の収納工程を示す斜視図である。
FIGS. 11 to 13 are views for explaining an example of a conventional production process, FIG. 11 is a perspective view showing an arrangement of products before a process of assembling and cutting, and FIG. FIG. 13 is a perspective view showing a stick storing step, FIG. 14 is a perspective view showing a first storing step of taking out and sucking a product, and FIG. 15 is a second and a third storing step of carrying and storing a product. It is a perspective view showing a process.

【0004】図11を参照すると、前工程と後工程との
間に、搬送方向103に沿って延在するように供給部材
としてのキャリア101が配置され、このキャリア10
1の一側に製品102の夫々結合して配置されている。
Referring to FIG. 11, a carrier 101 as a supply member is arranged to extend along a conveying direction 103 between a pre-process and a post-process.
One of the products 102 is connected to one side.

【0005】図12を参照すると、専用設備により製品
102を1ヶづつ組立て、不要部分101´が切断され
て除去される。
Referring to FIG. 12, the products 102 are assembled one by one by a dedicated facility, and unnecessary portions 101 'are cut and removed.

【0006】図13を参照すると、切り離された製品1
02を矢印104に示すようにスティック105に1ヶ
づつ収納する。
Referring to FIG. 13, a separated product 1
02 are stored one by one on a stick 105 as shown by an arrow 104.

【0007】図14を参照すると、前の工程の設備とは
別設備である専用設備として収納機構部106の吸着ノ
ズルを備えたピックアップ部107により、製品102
を1ヶづつスティック105から取出し、吸着し、収納
部材位置まで搬送する。
[0007] Referring to FIG. 14, a product 102 is provided by a pickup unit 107 having a suction nozzle of a storage mechanism 106 as a dedicated facility separate from the facility in the previous step.
Are taken out from the stick 105 one by one, adsorbed, and transported to the storage member position.

【0008】図15を参照すると、同じ収納機構部10
6のピックアップ部107によって、製品を1個づつ搬
送して、収納部材108の予め定められた位置に搬送さ
れた製品102を1ヶづつ収納する。
Referring to FIG. 15, the same storage mechanism 10
The products are conveyed one by one by the pickup unit 107, and the products 102 conveyed to the predetermined position of the storage member 108 are stored one by one.

【0009】図16乃至図19は従来の生産工程の他の
例の説明に供せられる図で、図16は組立及び切断工程
の前工程における製品の配置を示す斜視図、図17は組
立及び切断工程を示す斜視図、図18は製品を吸着し、
搬送する第1及び第2の収納工程を示す斜視図、図19
は製品を収納する第3の収納工程を示す斜視図である。
FIGS. 16 to 19 are views for explaining another example of the conventional production process. FIG. 16 is a perspective view showing an arrangement of products in a process before an assembling and cutting process, and FIG. FIG. 18 is a perspective view showing a cutting process, and FIG.
FIG. 19 is a perspective view showing the first and second storage steps for carrying.
FIG. 9 is a perspective view showing a third storing step of storing a product.

【0010】図16を参照すると、前工程と後工程との
間に、搬送方向103に沿って延在するように供給部材
としてのキャリア101が配置され、このキャリア10
1の一側に、予め定められたピッチP1’(製品ピッ
チ)で製品102の夫々結合して配置されている。
Referring to FIG. 16, a carrier 101 serving as a supply member is disposed between a pre-process and a post-process so as to extend along the transport direction 103.
1, the products 102 are connected to each other at a predetermined pitch P1 ′ (product pitch).

【0011】図17を参照すると、専用設備により製品
102が組立てられ、不要部分101´が、複数切断さ
れて除去され、複数の製品102が切り取られる。
Referring to FIG. 17, a product 102 is assembled by dedicated equipment, a plurality of unnecessary portions 101 'are cut and removed, and a plurality of products 102 are cut.

【0012】図18を参照すると、専用設備である複数
の収納機構部106の夫々の吸着ノズルを備えたピック
アップ部107によって、複数の製品を夫々吸着して、
搬送する。
Referring to FIG. 18, a plurality of products are respectively suctioned by a pickup unit 107 having a suction nozzle of each of a plurality of storage mechanism units 106 which are dedicated facilities.
Transport.

【0013】図19を参照すると、専用設備の同じ複数
の収納機構部106の夫々のピックアップ部107によ
って、複数の製品を搬送して、収納部材108に予め定
められたピッチP2’(収納ピッチ)で配置された収納
位置に搬送され、複数の製品102を夫々収納する。
Referring to FIG. 19, a plurality of products are transported by the respective pickup units 107 of the same plurality of storage mechanism units 106 of the dedicated equipment, and a predetermined pitch P2 ′ (storage pitch) is stored in the storage member 108. Are transported to the storage positions arranged in the storage area, and each of the plurality of products 102 is stored.

【0014】このように、従来の工程においても、専用
設備により製品の組立・切断工程までを行う。その後、
次工程で製品を一旦スティックに収納する。或いは、専
用設備で製品のスティック収納までを行なう。最後に別
工程で収用機により、製品を収納する。
As described above, even in the conventional process, the processes up to the assembling and cutting of the product are performed by the dedicated equipment. afterwards,
In the next step, the product is temporarily stored in a stick. Alternatively, the product can be stored in a dedicated facility up to the stick storage. Finally, the product is stored in the expropriation machine in a separate process.

【0015】次に、製品の組立・切断工程から収納まで
を一連で行なえる専用設備により生産を行なっている。
但し、この専用設備は1ヶの製品ピックアップ部を有す
る製品収納機構部を1ヶ備えている場合と、専用設備が
1ヶの製品ピックアップ部を有する製品収納機構部を複
数備えている場合とがある。
Next, the production is performed by a dedicated facility capable of performing a series of steps from the assembly / cutting process of the product to the storage.
However, there are cases where this dedicated facility has one product storage mechanism unit having one product pickup unit, and cases where this dedicated facility has multiple product storage mechanism units having one product pickup unit. is there.

【0016】[0016]

【発明が解決しようとする課題】しかしながら、これら
の従来の方法では各々、次のような欠点がある。
However, each of these conventional methods has the following disadvantages.

【0017】まず、製品の収納工程を別工程で行なって
いる為、製品の組立・切断を行なう専用機とは別に収納
機が必要になるので設備費が高い。又、生産効率も悪く
加工費が高い。
First, since the product storage process is performed in a separate process, a storage machine is required separately from a dedicated machine for assembling and cutting the product, so that equipment costs are high. Also, the production efficiency is poor and the processing cost is high.

【0018】次に、製品の組立・切断工程から収納まで
を一連で行なえるが、この設備では製品収納機構部が1
ヶしかなく製品を1ヶづつ収納する為、生産効率が悪く
加工費が高い。
Next, a series of steps from assembling / cutting of the product to storage can be performed in a series.
Since there are only one product and one product is stored one by one, the production efficiency is poor and the processing cost is high.

【0019】一方、製品収納機構部を複数有する設備に
おいては、製品を同時に、或いは、微妙な時間差で複数
個の製品を収納する為、生産効率が良く加工費を低く押
える事が出来る。しかし、製品収納機構部を複数必要と
するので設備費が高くなる。
On the other hand, in a facility having a plurality of product storage mechanisms, a plurality of products are stored at the same time or with a delicate time difference, so that the production efficiency is good and the processing cost can be kept low. However, equipment costs increase because a plurality of product storage mechanisms are required.

【0020】そこで、本発明の一技術的課題は、従来の
生産手法の問題を解決する為、複数の製品を同時に収納
出来、生産効率が向上し加工費を低下させることができ
る電子部品の生産方法及び生産装置を提供することにあ
る。
Therefore, one technical problem of the present invention is to solve the problem of the conventional production method, and to produce electronic parts capable of storing a plurality of products at the same time, improving the production efficiency and reducing the processing cost. It is to provide a method and a production device.

【0021】また、本発明のもう一つの技術的課題は、
設備費も抑えることが出来、寸法のバラツキや機械のミ
スフィードの影響を少なくすることができる電子部品の
生産方法と生産装置とを提供することにある。
Another technical problem of the present invention is that
An object of the present invention is to provide a method and an apparatus for producing an electronic component, which can reduce the cost of equipment and reduce the influence of dimensional variations and misfeeding of a machine.

【0022】[0022]

【課題を解決するための手段】本発明によれば、キャリ
アに所定のピッチで、かつ並列状に接続固定された状態
で電子部品を組み立てる組立工程と、電子部品をキャリ
アより切り離す切断工程と、吸着ノズルまたはチャッキ
ングにより電子部品をピックアップするピックアップ部
にて、2個の電子部品をピックアップするピックアップ
工程と、ピックアップした電子部品の一方を180゜回
転させた後、所定位置まで搬送する搬送工程と、搬送し
た電子部品を収納部材に収納する収納工程とを備えてい
ることを特徴とする電子部品の生産方法が得られる。
According to the present invention, there is provided an assembling step of assembling an electronic component while being fixedly connected to a carrier at a predetermined pitch and in parallel, a cutting step of separating the electronic component from the carrier, A pickup step of picking up two electronic components by a pickup unit that picks up electronic components by a suction nozzle or chucking; and a transfer step of rotating one of the picked up electronic components by 180 ° and then transferring it to a predetermined position. And a storage step of storing the transported electronic component in a storage member.

【0023】また、本発明によれば、キャリアに所定の
ピッチで、かつ1列状に接続固定された状態で電子部品
を組み立てる組立工程と、電子部品をキャリアより切り
離す切断工程と、吸着ノズルまたはチャッキングにより
電子部品をピックアップするピックアップ部にて、2個
の電子部品をピックアップするピックアップ工程と、ピ
ックアップした電子部品のそれぞれを同一方向に90゜
回転させた後、所定位置まで搬送する搬送工程と、搬送
した電子部品を収納部材に収納する収納工程とを備えて
いることを特徴とする電子部品の生産方法が得られる。
Further, according to the present invention, an assembling step of assembling electronic components in a state of being connected and fixed to the carrier at a predetermined pitch and in a line, a cutting step of separating the electronic components from the carrier, a suction nozzle or A pickup process of picking up two electronic components in a pickup unit for picking up electronic components by chucking, and a conveyance process of rotating each of the picked-up electronic components by 90 ° in the same direction and then conveying them to a predetermined position. And a storage step of storing the transported electronic component in a storage member.

【0024】また、本発明によれば、前記いずれかに記
載の電子部品の生産方法において、電子部品をピックア
ップするピックアップ部を複数有していることを特徴と
する電子部品の生産方法が得られる。
According to the present invention, there is provided a method for producing an electronic component according to any one of the above-mentioned methods, comprising a plurality of pickup units for picking up the electronic component. .

【0025】また、本発明によれば、キャリアに所定の
ピッチで、かつ並列状に接続固定された状態で電子部品
を組み立てる組立手段と、電子部品を前記キャリアより
切り離す切断手段と、吸着ノズルまたはチャッキングに
より電子部品をピックアップするピックアップ部を備え
前記ピックアップ部は2個の電子部品をピックアップす
るピックアップ手段と、ピックアップした2個の電子部
品の一方を180゜回転させた後、所定位置まで搬送す
る搬送手段と、搬送した2個の電子部品を夫々収納部材
に収納する収納手段とを備えていることを特徴とする電
子部品の生産装置が得られる。
Further, according to the present invention, assembling means for assembling electronic components while being connected and fixed to the carrier at a predetermined pitch and in parallel, cutting means for separating the electronic components from the carrier, a suction nozzle or A pick-up unit for picking up electronic components by chucking is provided. The pick-up unit picks up two electronic components and transports one of the two picked-up electronic components to a predetermined position after rotating one of them by 180 °. An electronic component production apparatus characterized by comprising a transporting means and a storage means for storing the two transported electronic components in respective storage members is obtained.

【0026】また、本発明によれば、キャリアに所定の
ピッチで、かつ1列状に接続固定された状態で電子部品
を組み立てる組立手段と、電子部品をキャリアより切り
離す切断手段と、吸着ノズルまたはチャッキングにより
電子部品をピックアップするピックアップ部を備え前記
ピックアップ部は2個の電子部品をピックアップするピ
ックアップ手段と、ピックアップした電子部品のそれぞ
れを同一方向に90゜回転させた後、所定位置まで搬送
する搬送手段と、搬送した電子部品を収納部材に収納す
る収納手段とを備えていることを特徴とする電子部品の
生産装置が得られる。
Further, according to the present invention, assembling means for assembling electronic components while being connected and fixed to the carrier at a predetermined pitch and in a line, cutting means for separating the electronic components from the carrier, suction nozzles or A pick-up unit for picking up electronic components by chucking is provided. The pick-up unit picks up two electronic components, and conveys the picked-up electronic components to a predetermined position after rotating each of the picked-up electronic components by 90 ° in the same direction. An electronic component production apparatus characterized by comprising a transporting means and a storage means for storing the transported electronic component in a storage member is obtained.

【0027】また、本発明によれば、前記いずれかの電
子部品の生産装置において、前記ピックアップ手段は、
前記電子部品を夫々ピックアップするピックアップ部を
複数有していることを特徴とする電子部品の生産装置が
得られる。
According to the invention, in any one of the above electronic component production apparatuses, the pickup means may include:
An electronic component production apparatus having a plurality of pickup units for picking up the electronic components, respectively, is obtained.

【0028】[0028]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0029】図1乃至図5は本発明の実施の形態による
電子部品の生産工程の説明に供せられる図で、図1は組
み立て及び切断工程の前工程における電子部品の製品の
配置を示す斜視図、図2は組立及び切断工程を示す斜視
図、図3は電子部品の製品を吸着する第1の収納工程を
示す斜視図、図4は電子部品の製品を反転し搬送する第
2の収納工程を示す斜視図、図5は電子部品の製品を収
納する第3の製品収納工程を示す斜視図である。
FIGS. 1 to 5 are views for explaining a production process of an electronic component according to an embodiment of the present invention. FIG. 1 is a perspective view showing an arrangement of products of the electronic component in a process before an assembling and cutting process. FIG. 2 is a perspective view showing an assembling and cutting process. FIG. 3 is a perspective view showing a first storing step of sucking a product of an electronic component. FIG. 4 is a second storing process of turning over and transporting the product of the electronic component. FIG. 5 is a perspective view showing a process, and FIG. 5 is a perspective view showing a third product housing process for housing a product of an electronic component.

【0030】図1を参照すると、前工程と後工程との間
に、搬送方向3に沿って延在するように供給部材とし
て、両側に一対のキャリア部1a,1bと、これらのキ
ャリア部を連絡する結合部1cとを備えたキャリア1が
配置され、各キャリア部1a,1bの夫々の内側に製品
2の夫々結合して、予め定められ間隔P1(製品ピッ
チ)を置いて対向して、並列となるように夫々配置され
ている。
Referring to FIG. 1, between a pre-process and a post-process, a pair of carrier parts 1a and 1b are provided on both sides as a supply member so as to extend along the conveyance direction 3, and these carrier parts are provided. A carrier 1 having a connecting portion 1c for communication is arranged, and a product 2 is connected to the inside of each of the carrier portions 1a and 1b, facing each other at a predetermined interval P1 (product pitch). Each is arranged so that it may become parallel.

【0031】図2を参照すると、専用設備により電子部
品の製品2を複数組立て(組立手段による組立工程)、
不要部分1´が切断されて除去されて、複数の製品2が
同時に切り取られる(切断手段による切断工程)。
Referring to FIG. 2, a plurality of electronic component products 2 are assembled by dedicated equipment (assembly process by assembling means).
Unnecessary portions 1 'are cut and removed, and a plurality of products 2 are cut out at the same time (cutting step by cutting means).

【0032】図3を参照すると、切り離された製品2
は、専用設備である収納機構部6の吸着ノズルを備える
とともに予め定められたピッチP1(製品ピッチと等し
い)で配置された複数のピックアップ部7により、複数
の製品2を同時に吸着する(ピックアップ工程)。ここ
で、収納機構部6は製品を搬送する搬送手段及び搬送さ
れた製品を収納する収納手段を構成している。
Referring to FIG. 3, the separated product 2
Is provided with a suction nozzle of a storage mechanism unit 6 which is a dedicated facility, and simultaneously suctions a plurality of products 2 by a plurality of pickup units 7 arranged at a predetermined pitch P1 (equal to the product pitch) (pickup process). ). Here, the storage mechanism 6 constitutes a transport unit for transporting the product and a storage unit for storing the transported product.

【0033】図4を参照すると、同じ収納機構部6の夫
々のピックアップ部7によって、吸着された夫々の製品
2の内の一方を矢印9で示すように、180度回転させ
て、製品を複数同時に搬送し、カット位置から、エンボ
ステープ位置まで搬送する(搬送工程)。
Referring to FIG. 4, one of the products 2 sucked by the respective pickup units 7 of the same storage mechanism unit 6 is rotated by 180 degrees as indicated by an arrow 9 so that a plurality of products are obtained. At the same time, they are conveyed, and conveyed from the cutting position to the embossed tape position (conveying step).

【0034】図5を参照すると、同じ収納機構部6のピ
ックアップ部7によって、製品を2個づつ同時に搬送し
て、収納部材8のP1と等しい予め定められたピッチP
2(製品ピッチ)の収納位置8aに搬送された製品2を
2個同時に収納する(収納工程)。
Referring to FIG. 5, two products are simultaneously conveyed by the pickup unit 7 of the same storage mechanism unit 6 at a predetermined pitch P equal to P1 of the storage member 8.
The two products 2 conveyed to the 2 (product pitch) storage position 8a are stored simultaneously (storage step).

【0035】このように、本発明の第1の実施の形態に
おいては、製品ピッチP1と収納ピッチP2とを同一に
し、且つ、専用設備のピックアップ部7も同一ピッチで
1ケの製品収納機構部6に複数設けている。よって、1
アクションで複数の製品2を同時に収納出来る。さら
に、ピックアップ部7を回転可能にしている為、製品2
のピッチ(製品の並ぶ間隔)さえ同一ならば、製品2の
並ぶ向きが同方向でなくとも同時収納が可能である。
As described above, in the first embodiment of the present invention, the product pitch P1 and the storage pitch P2 are made the same, and the pickup unit 7 of the dedicated equipment also has one product storage mechanism unit at the same pitch. 6 are provided. Therefore, 1
A plurality of products 2 can be stored simultaneously by an action. Further, since the pickup unit 7 is rotatable, the product 2
If the pitches (the intervals at which the products are lined up) are the same, the products 2 can be stored simultaneously even if the direction in which the products 2 are lined up is not the same direction.

【0036】図6乃至図10は本発明の第2の実施の形
態による電子部品の生産工程の説明に供せられる図で、
図6は組み立て切断工程の前工程における電子部品の製
品の配置を示す斜視図、図7は組立及び切断工程を示す
斜視図、図8は電子部品の製品を吸着する第1の収納段
階(ピックアップ工程)を示す斜視図、図9は製品を反転
し搬送する第2の収納段階(搬送工程)を示す斜視図、
図10は製品を収納する第3の収納段階(通常の収納工
程)を示す斜視図である。
FIGS. 6 to 10 are views for explaining a production process of an electronic component according to the second embodiment of the present invention.
FIG. 6 is a perspective view showing an arrangement of electronic component products in a process prior to the assembling / cutting process, FIG. 7 is a perspective view showing the assembling and cutting processes, and FIG. FIG. 9 is a perspective view showing a second storage stage (transportation step) for reversing and transporting the product,
FIG. 10 is a perspective view showing a third storing stage (normal storing process) for storing a product.

【0037】図6を参照すると、前工程と後工程との間
に、搬送方向3に沿って延在するように供給部材として
のキャリア11が配置され、このキャリア11の一側
に、予め定められたピッチP1(製品ピッチ)で製品2
の夫々結合して配置されている。
Referring to FIG. 6, a carrier 11 as a supply member is arranged to extend along the transport direction 3 between a pre-process and a post-process. Product 2 with given pitch P1 (product pitch)
Are connected to each other.

【0038】図7を参照すると、専用設備により製品2
が組立てられ(組立手段による組立工程)て、複数の製
品2が同時に切り取られ不要部分11´が切断されて除
去される(切断手段による切断工程)。
Referring to FIG. 7, a product 2 is provided by a dedicated facility.
Are assembled (assembly process by assembling means), a plurality of products 2 are cut out simultaneously, and unnecessary portions 11 'are cut and removed (cutting process by cutting means).

【0039】図8に示すように、第1の収納段階では、
切り取られた複数の製品2を同時に、専用設備である一
つの収納機構部6に夫々、製品ピッチと等しいピッチP
1で設けられたピックアップ7の吸着ノズルが、吸着す
る(ピックアップ工程)。ここで、収納機構部6は、製
品を搬送する搬送手段と、搬送された製品を収納する収
納手段を構成する。
As shown in FIG. 8, in the first storage stage,
At the same time, a plurality of cut products 2 are simultaneously stored in one storage mechanism unit 6 as a dedicated facility, with a pitch P equal to the product pitch.
The suction nozzle of the pickup 7 provided in 1 sucks (pickup step). Here, the storage mechanism 6 constitutes a transport unit for transporting the product and a storage unit for storing the transported product.

【0040】図9に示すように、第2の収納段階では、
ピックアップ部7が、矢印12に示すように、吸着され
た製品2を夫々90度回転させて、2つの製品2を同時
に搬送する。
As shown in FIG. 9, in the second storage stage,
As shown by an arrow 12, the pickup unit 7 rotates the sucked products 2 by 90 degrees, respectively, and conveys the two products 2 at the same time.

【0041】図10を参照すると、第2の収納段階の続
きとして、専用設備の同じ収納機構部6の夫々のピック
アップ部7によって、複数の製品を搬送して、収納部材
8に製品ピッチP1と等しいピッチP2(収納ピッチ)
で配置された収納位置8aに搬送され(搬送工程)、第
3の収納段階として、複数の製品2を同時に収納する
(収納工程)。
Referring to FIG. 10, as a continuation of the second storage stage, a plurality of products are transported by the respective pickup units 7 of the same storage mechanism unit 6 of the dedicated equipment, and the product pitch P1 and the product pitch P1 are stored in the storage member 8. Equal pitch P2 (storage pitch)
Are transported to the storage position 8a arranged at (3) (transportation step), and as a third storage step, a plurality of products 2 are stored simultaneously (storage step).

【0042】このように、本発明の第2の実施の形態に
おいては、製品配置が単列の場合でも各々のピックアッ
プ部7を回転可能にすることにより、複数の製品収納が
可能である。
As described above, in the second embodiment of the present invention, a plurality of products can be stored by making each pickup unit 7 rotatable even when the products are arranged in a single row.

【0043】また、本発明の第1及び第2の実施の形態
においては、収納部材8としてエンボステープ収納につ
いてのみ説明をしたが、トレー収納等、他の収納部材に
ついても本発明の第1及び第2の実施の形態による手法
を応用することで製品を一括収納が可能である。
Further, in the first and second embodiments of the present invention, only the embossed tape storage as the storage member 8 has been described. By applying the method according to the second embodiment, products can be stored collectively.

【0044】さらには、収納工程だけでなく、次工程に
製品の搬送及び、ホルダーへのセットとしても応用可能
である。
Further, the present invention can be applied not only to the storing process but also to the transfer of the product and the setting to the holder in the next process.

【0045】[0045]

【発明の効果】以上説明したように、本発明では、電子
部品の製品の組立、切断から収納工程までの生産工程に
おける製品ピッチ(製品の並ぶ間隔)と収納状態におけ
る製品収納ピッチを同一にし、且つ製品の組立、切断か
ら収納までを一連で行える生産設備の1個の製品収納機
構部に複数のピックアップ部を設けているので複数の製
品を同時に収納出来、生産効率が向上し加工費を低下さ
せることができ、生産設備の製品を収納するための収納
機構部も1個で済むので設備費も抑えることが出来る電
子部品の生産方法と生産装置とを提供することができ
る。
As described above, according to the present invention, the product pitch in the production process from the assembly and cutting of an electronic component product to the storage process is equal to the product storage pitch in the storage state. In addition, multiple pickup units are provided in one product storage mechanism of a production facility that can perform a series of processes from assembly, cutting, and storage of products, so that multiple products can be stored simultaneously, improving production efficiency and reducing processing costs. The present invention can provide an electronic component production method and a production apparatus that can reduce the cost of equipment because only one storage mechanism is required to store the products of the production equipment.

【0046】また、本発明においては、設備での製品を
収納する収納機構部が1個で済むので寸法のバラツキや
機械のミスフィードの影響を少なくすることができるい
電子部品の生産方法と生産装置とを提供することができ
る。
Also, in the present invention, since only one storage mechanism is required to store the products in the equipment, it is possible to reduce the effects of dimensional variations and misfeeding of the machine. Device can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 1 is a diagram which is used for explaining a production process of an electronic component according to a first embodiment of the present invention.

【図2】本発明の第1の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 2 is a diagram provided for explanation of a production process of an electronic component according to the first embodiment of the present invention.

【図3】本発明の第1の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 3 is a diagram which is used for describing a production process of the electronic component according to the first embodiment of the present invention.

【図4】本発明の第1の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 4 is a diagram which is used for describing a production process of the electronic component according to the first embodiment of the present invention.

【図5】本発明の第1の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 5 is a diagram which is used for describing a production process of the electronic component according to the first embodiment of the present invention.

【図6】本発明の第2の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 6 is a diagram which is used for describing a production process of an electronic component according to the second embodiment of the present invention.

【図7】本発明の第2の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 7 is a diagram which is used for describing a production process of an electronic component according to the second embodiment of the present invention.

【図8】本発明の第2の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 8 is a diagram which is used for describing a production process of an electronic component according to the second embodiment of the present invention.

【図9】本発明の第2の実施の形態による電子部品の生
産工程の説明に供せられる図である。
FIG. 9 is a diagram which is used for describing a production process of an electronic component according to the second embodiment of the present invention.

【図10】本発明の第2の実施の形態による電子部品の
生産工程の説明に供せられる図である。
FIG. 10 is a diagram which is used for describing an electronic component production process according to the second embodiment of the present invention.

【図11】従来の電子部品の生産工程の一例の説明に供
せられる図である。
FIG. 11 is a diagram which is used for describing an example of a conventional electronic component production process.

【図12】従来の電子部品の生産工程の一例の説明に供
せられる図である。
FIG. 12 is a diagram which is used for describing an example of a conventional electronic component production process.

【図13】従来の電子部品の生産工程の一例の説明に供
せられる図である。
FIG. 13 is a diagram which is used for describing an example of a conventional electronic component production process.

【図14】従来の電子部品の生産工程の一例の説明に供
せられる図である。
FIG. 14 is a diagram which is used for describing an example of a conventional electronic component production process.

【図15】従来の電子部品の生産工程の一例の説明に供
せられる図である。
FIG. 15 is a diagram which is used for describing an example of a conventional electronic component production process.

【図16】従来の電子部品の生産工程の他の例の説明に
供せられる図である。
FIG. 16 is a diagram which is used for describing another example of the conventional electronic component production process.

【図17】従来の電子部品の生産工程の他の例の説明に
供せられる図である。
FIG. 17 is a diagram which is used for describing another example of a conventional electronic component production process.

【図18】従来の電子部品の生産工程の他の例の説明に
供せられる図である。
FIG. 18 is a diagram which is used for describing another example of a conventional electronic component production process.

【図19】従来の電子部品の生産工程の他の例の説明に
供せられる図である。
FIG. 19 is a diagram which is used for describing another example of a conventional electronic component production process.

【符号の説明】[Explanation of symbols]

1 キャリア 1’ 不要部分 1a,1b キャリア部 1c 結合部 2 製品 3 搬送方向 6 収納機構部 7 ピックアップ部 8 収納部材 8a 収納位置 9,12 矢印 11 キャリア 11’ 不要部分 12 矢印 101 キャリア 101’ 不要部分 102 製品 103 搬送方向 104 矢印 105 スティック 106 収納機構部 107 ピックアップ部 108 収納部材 DESCRIPTION OF SYMBOLS 1 Carrier 1 'Unnecessary part 1a, 1b Carrier part 1c Coupling part 2 Product 3 Transport direction 6 Storage mechanism part 7 Pickup part 8 Storage member 8a Storage position 9, 12 Arrow 11 Carrier 11' Unnecessary part 12 Arrow 101 Carrier 101 'Unnecessary part 102 Product 103 Transport direction 104 Arrow 105 Stick 106 Storage mechanism unit 107 Pickup unit 108 Storage member

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 キャリアに所定のピッチで、かつ並列状
に接続固定された状態で電子部品を組み立てる組立工程
と、電子部品をキャリアより切り離す切断工程と、吸着
ノズルまたはチャッキングにより電子部品をピックアッ
プするピックアップ部にて、2個の電子部品をピックア
ップするピックアップ工程と、ピックアップした電子部
品の一方を180゜回転させた後、所定位置まで搬送す
る搬送工程と、搬送した電子部品を収納部材に収納する
収納工程とを備えていることを特徴とする電子部品の生
産方法。
1. An electronic component assembling step of assembling an electronic component while being fixedly connected to a carrier at a predetermined pitch and in parallel, a cutting step of separating the electronic component from the carrier, and picking up the electronic component by a suction nozzle or chucking. A pick-up unit for picking up two electronic components, a transport process of rotating one of the picked-up electronic components by 180 ° and then transporting it to a predetermined position, and storing the transported electronic components in a storage member A production process of an electronic component, comprising:
【請求項2】 キャリアに所定のピッチで、かつ1列状
に接続固定された状態で電子部品を組み立てる組立工程
と、電子部品をキャリアより切り離す切断工程と、吸着
ノズルまたはチャッキングにより電子部品をピックアッ
プするピックアップ部にて、2個の電子部品をピックア
ップするピックアップ工程と、ピックアップした電子部
品のそれぞれを同一方向に90゜回転させた後、所定位
置まで搬送する搬送工程と、搬送した電子部品を収納部
材に収納する収納工程とを備えていることを特徴とする
電子部品の生産方法。
2. An assembling step of assembling an electronic component in a state where the electronic component is connected and fixed to a carrier at a predetermined pitch and in a line, a cutting step of separating the electronic component from the carrier, and a step of suctioning or chucking the electronic component. A pickup step of picking up two electronic components in a pickup unit for picking up, a transporting step of rotating each of the picked up electronic components by 90 ° in the same direction, and then transporting the electronic components to a predetermined position; A method for producing an electronic component, comprising: a storage step of storing the electronic component in a storage member.
【請求項3】 請求項1又は2記載の電子部品の生産方
法において、電子部品をピックアップするピックアップ
部を複数有していることを特徴とする電子部品の生産方
法。
3. The method for producing an electronic component according to claim 1, further comprising a plurality of pickup units for picking up the electronic component.
【請求項4】 キャリアに所定のピッチで、かつ並列状
に接続固定された状態で電子部品を組み立てる組立手段
と、電子部品を前記キャリアより切り離す切断手段と、
吸着ノズルまたはチャッキングにより電子部品をピック
アップするピックアップ部を備え前記ピックアップ部は
2個の電子部品をピックアップするピックアップ手段
と、ピックアップした2個の電子部品の一方を180゜
回転させた後、所定位置まで搬送する搬送手段と、搬送
した2個の電子部品を夫々収納部材に収納する収納手段
とを備えていることを特徴とする電子部品の生産装置。
4. An assembling means for assembling an electronic component in a state where the electronic component is fixedly connected to the carrier at a predetermined pitch and in parallel, a cutting means for separating the electronic component from the carrier,
A pickup unit for picking up electronic components by a suction nozzle or chucking; a pickup unit for picking up two electronic components; and a predetermined position after rotating one of the two picked up electronic components by 180 °. An electronic component production apparatus, comprising: a transport unit for transporting the two electronic components; and a storage unit for storing the two transported electronic components in respective storage members.
【請求項5】 キャリアに所定のピッチで、かつ1列状
に接続固定された状態で電子部品を組み立てる組立手段
と、電子部品をキャリアより切り離す切断手段と、吸着
ノズルまたはチャッキングにより電子部品をピックアッ
プするピックアップ部を備え前記ピックアップ部は2個
の電子部品をピックアップするピックアップ手段と、ピ
ックアップした電子部品のそれぞれを同一方向に90゜
回転させた後、所定位置まで搬送する搬送手段と、搬送
した電子部品を収納部材に収納する収納手段とを備えて
いることを特徴とする電子部品の生産装置。
5. An assembling means for assembling an electronic component in a state of being connected and fixed to a carrier at a predetermined pitch and in a line, a cutting means for separating the electronic component from the carrier, and a suction nozzle or chucking for attaching the electronic component. A pickup unit for picking up two electronic components, a conveying unit for rotating each of the picked-up electronic components by 90 ° in the same direction, and then conveying the electronic components to a predetermined position; A storage device for storing an electronic component in a storage member.
【請求項6】 請求項4又は5記載の電子部品の生産装
置において、前記ピックアップ手段は、前記電子部品を
夫々ピックアップするピックアップ部を複数有している
ことを特徴とする電子部品の生産装置。
6. The electronic component production apparatus according to claim 4, wherein said pickup means has a plurality of pickup units for respectively picking up said electronic components.
JP2000250775A 2000-08-22 2000-08-22 Electronic component production method and production apparatus Expired - Fee Related JP4182504B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000250775A JP4182504B2 (en) 2000-08-22 2000-08-22 Electronic component production method and production apparatus

Publications (2)

Publication Number Publication Date
JP2002064109A true JP2002064109A (en) 2002-02-28
JP4182504B2 JP4182504B2 (en) 2008-11-19

Family

ID=18740294

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270622A (en) * 2001-03-09 2002-09-20 Ueno Seiki Kk Electronic component holding mechanism for automatic electronic component hardness, and electronic component holding method
JP2006080483A (en) * 2004-08-10 2006-03-23 Ueno Seiki Kk Electronic component process handling equipment, process handling method and process handling program
KR101305346B1 (en) 2007-02-09 2013-09-06 한미반도체 주식회사 Sawing and Handling Apparatus for Semiconductor Package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270622A (en) * 2001-03-09 2002-09-20 Ueno Seiki Kk Electronic component holding mechanism for automatic electronic component hardness, and electronic component holding method
JP2006080483A (en) * 2004-08-10 2006-03-23 Ueno Seiki Kk Electronic component process handling equipment, process handling method and process handling program
JP4683415B2 (en) * 2004-08-10 2011-05-18 上野精機株式会社 Electronic component process processing apparatus, process processing method, and process processing program
KR101305346B1 (en) 2007-02-09 2013-09-06 한미반도체 주식회사 Sawing and Handling Apparatus for Semiconductor Package

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JP4182504B2 (en) 2008-11-19

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