JP4226715B2 - Surface mount component mounting machine and electronic component supply method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a surface mount component mounting machine that sequentially supplies electronic components from an electronic component supply apparatus, sucks them by a suction nozzle, and mounts them at a specified position on a circuit board, and a method of supplying electronic components to the surface mount component mounting machine About.
[0002]
[Prior art]
As shown in FIG. 10, the conventional electronic component mounting machine 1 receives electronic components from a reel 2 wound in a reel shape by storing the electronic components in a hole of paper or a plastic sheet. One by one is supplied, and the supplied electronic components are sucked by the head unit 4 and mounted on the circuit board 5.
[0003]
The head unit 4 is moved in the XY direction within a plane parallel to the circuit board 5 by the XY robot device 6.
[0004]
As shown in an enlarged view in FIG. 11, the head unit 4 is usually supported by the XY robot device 6 with two or more sets of component suction units 7, 7... Yes.
[0005]
The component suction unit 7 includes a structural member 9 fixed to the surface of the mechanical interface member 8, a bracket 11 supported on the structural member 9 by a straight guide 10 in a vertical direction, and the bracket 11. A motor 13 that drives the bracket 11 up and down via a ball screw / nut 12, a suction nozzle 15 supported on the bracket 11 via a vertical shaft 14 at the lower end thereof, Attached to the bracket 11 and rotated around the axis of the shaft 14, the motor 16 for positioning the suction nozzle 15 in the rotational direction and the structural member 9 are attached to the suction nozzle 15. A position detector 18 for detecting the position of the electronic component 17 and the structural member 9 are mounted on the circuit board. Its position when adsorbing the mark recognition and the electronic components 17 on the 5, and a like camera 19 for confirming the position of the electronic component 17 mounted on the circuit board 5.
[0006]
The plurality of component suction units 7 have the same timing by matching the distance between the suction nozzles 15 in each component suction unit 7 and the distance between the electronic component supply tips in the plurality of electronic component supply devices 3. A plurality of electronic components can be picked up, and for each XY operation of the XY robot device 6, as many electronic parts as the number of the component picking units 7 are simultaneously mounted on the circuit board 5 to shorten the mounting time. Can do.
[0007]
[Problems to be solved by the invention]
As described above, if as many component suction units 7 as possible are provided for one XY robot apparatus 6, the cycle time of electronic component suction and mounting is theoretically reduced and productivity is increased. become.
[0008]
However, even if the number of component suction units 7 is increased, productivity cannot be improved in proportion to the increased number, but rather the degree of improvement is reduced.
[0009]
Furthermore, an increase in the number of component suction units causes an increase in the transfer mass by the XY robot apparatus 6, making it difficult to maintain the moving speed and acceleration, and conversely, the suction mounting cycle time may be worsened. There is a problem.
[0010]
On the other hand, the head portion is moved only in the X direction (circuit board moving direction), and the circuit board is moved in the Y direction orthogonal to the head, and two beams are provided in the X direction. There is a thing which provided a part.
[0011]
However, the former has a problem that the installation area of the apparatus becomes large and high speed cannot be exhibited. In the latter case, there are problems that the electronic component supply device must be arranged at the front and back, the structure becomes complicated, the cost for incorporation into the production line increases, and the cost of the entire device is high.
[0012]
In addition, in the conventional electronic component mounting machine, the electronic component supply device has a plurality of chip feeders arranged in parallel in the substrate transport direction for sending a plurality of electronic components in a row one by one to the suction position by the suction nozzle. It is arranged so that a large number of electronic components can be sucked at once by a large number of suction nozzles. After the production of one type of substrate is completed, it is necessary to replace all the component feeders in principle. Therefore, there is a problem that the loss time until the production of the next type of substrate is started becomes large.
[0013]
In particular, in the configuration in which two beams are provided in the X direction and separate head portions are provided in the X direction as described above, more time is required for setting up the following types of electronic components for board production. There is a problem that it becomes.
[0014]
The present invention has been made in view of the above-described conventional problems, has a simple structure, and does not increase the installation area and cost, and can mount electronic components at high speed. An object of the present invention is to provide a surface mounting component mounting machine and a surface mounting component mounting method that do not take time to set up electronic components to be supplied when the type of substrate to be produced changes.
[0015]
[Means for Solving the Problems]
According to a first aspect of the present invention, a substrate transfer device that transfers and stops a substrate in the order of a transfer region, a positioning region, and a carry-out region, and the substrate transfer device are arranged along the substrate transfer device. A plurality of electronic component supply devices in which a plurality of component feeders that are sent out one by one are arranged in parallel in the substrate conveyance direction, and a plurality of components that each receive electronic components from the component feeder of the electronic component supply device and mount them on the substrate stopped in the positioning region And a head portion having a component suction unit including a suction nozzle angle positioning device, and supporting the head portion and moving the head portion in the X direction parallel to the substrate transport direction and the Y direction orthogonal thereto A surface mount component mounting machine having a robot device, wherein the head unit is independently slid into the same X direction guide movable in the Y direction. Each of the moving units is movable in the X direction independently of the other moving units, and is equipped with at least one component suction unit. the positioning region are arranged two side by side in the X direction and these positioning areas sac Chi one positioning regions are relatively moved and positionable in the Y direction with respect to the other positioning region, The electronic component supply device is provided with one or two in the Y direction with respect to the one positioning region, and each electronic component supply device is a feeder mount capable of mounting the plurality of component feeders in parallel . and it is configured to include a carriage for supporting the feeder mount, the feeder mount, as the component feeder is an electronic component suction position by the suction nozzle, the surface It is attachable to the instrumentation component mounting machine main body, and, as a universal and outer collected, is to achieve the above object.
[0016]
Before starting to mount electronic components on the next type of substrate in the positioning region where mounting of the electronic components on the preceding type of substrate is completed, of the two positioning regions in the surface mount component mounting machine. All of the component feeders for supplying electronic components for mounting on the next type of substrate are mounted in advance on a feeder mount on a replacement carriage, and an electronic component supply apparatus including the feeder mount and the carriage is provided. The above object is achieved by an electronic component supply method characterized in that the electronic component supply device is replaced with an electronic component supply device for a positioning area in which electronic component mounting has been completed and is mounted on a surface mount component mounting machine body.
[0017]
In the present invention, each independently supported slidably on two mobile units are the same in the X direction guide that constitutes the head portion, and, one of the positioning area, relative to other positioning region Since it is possible to move independently in the Y direction, when electronic components are mounted on two substrates at the same time, the X and Y position deviations between the two substrates can be easily corrected, Electronic components can be mounted at high speed. When changing the type of substrate to be produced, the electronic component supply device including all the component feeders previously mounted on the replacement feeder mount must be replaced with the electronic component supply device for the substrate that has been produced. Thus, the setup time of the electronic components to be supplied can be greatly shortened.
[0018]
Further, since the moving unit is supported by the same guide, the apparatus does not become complicated and large.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0020]
As shown in FIG. 1, an electronic component mounting machine 20 according to an example of an embodiment of the present invention transports and stops substrates 22A and 22B in one direction (X direction), and the substrate transport device. An electronic component supply device 26A, 26B, 27A, 27B which is arranged on both sides of the device 24 and sequentially supplies the electronic components, and each receives electronic components from the electronic component supply devices 26A and 27A, 26B and 27B. The two moving units 28A and 28B for mounting them on the substrate 22 and the X-direction guide 30 for slidably supporting the moving units 28A and 28B in the X direction parallel to the conveying direction of the substrate 22 are provided. The XY robot device 32 is configured to drive the X direction guide 30 in the Y direction orthogonal to the X direction guide 30.
[0021]
Each of the moving units 28A and 28B includes three component suction units 34 and one camera 36 similar to those shown in FIG. 1 (the position detector is not shown). Further, the moving units 28A and 28B are supported by the X guide 30 via plates 29A and 29B (see FIG. 3) serving as mechanical interface members.
[0022]
As shown in FIG. 2 in an enlarged manner, the substrate transfer device 24 has a substrate carry-in area 24A, a second positioning area 24B, a first positioning area 24C, and a substrate carry-out area 24D sequentially in the substrate transfer direction. , Conveyors 25 </ b> A to 25 </ b> D capable of transporting and stopping the substrate 22 independently of each other are provided.
[0023]
The first and second positioning regions 24C and 24B are configured so that electronic components can be mounted from the two moving units 28A and 28B when the loading of the substrates 22A and 22B is stopped here.
[0024]
As shown in FIGS. 1 and 2, the entire first positioning region 24C is supported by a U-shaped frame 38 that supports the conveyor 25C so that it can move horizontally in the Y direction by a straight guide 40 in the Y direction. Further, the Y motor 42 can move in the Y direction along the linear guide 40 via the ball screw 42A.
[0025]
Reference numerals 44A and 44B in FIG. 1 denote motors for independently driving the moving units 28A and 28B along the X-direction guide 30 via belts 46A and 46B, respectively.
[0026]
Both ends in the axial direction of the X-direction beam member 31 supporting the X-direction guide 30 are slidably supported in the Y direction on the Y-direction guide 48 in the XY robot apparatus 32 together with the motors 44A and 44B, and a motor (illustrated). Is omitted).
[0027]
The component suction units 34 on the moving units 28A and 28B are respectively provided with suction nozzles 50A, 52A, 54A and 50B, 52B, 54B whose rotational angles around the vertical axis are positioned by the same motor as shown in FIG. (See FIG. 3).
[0028]
The electronic component supply devices 26A and 27A are arranged on both sides of the first positioning region 24C, and the moving unit 28A attracts electronic components from the electronic component supply devices 26A and 27A and is positioned in the first positioning region 24C. An electronic component is mounted on the substrate 22A.
[0029]
Similarly, the electronic component supply devices 26B and 27B are arranged on both sides of the second positioning region 24B, and the moving unit 28B sucks the electronic components from these electronic component supply devices 26B and 27B and thereby the second positioning region 24B. Is mounted on the substrate 22B which has been positioned and stopped.
[0030]
Next, the electronic component supply devices 26A to 27B will be described. Since these configurations are the same, only the electronic component supply device 26B will be described, and the other description will be omitted.
[0031]
As shown in an enlarged view in FIG. 2, the electronic component supply device 26 </ b> B has a feeder mount 58 on which a plurality of component feeders can be mounted in parallel in the substrate transport direction, and the feeder mount 58 is supported by a carriage 60. , and is capable externally collected mounted and the electronic component mounting machine main body. The other electronic component supply devices 26A, 27A, and 27B are similarly configured to include the feeder mount 58 and the carriage 60, but are not shown.
[0032]
The component feeder 56 is a so-called chip feeder, has a transport means (not shown) for transporting electronic components in a row, and places the electronic component 1 at a position where it can be sucked by the suction nozzle from the tip. Each electronic component supply device 26B is detachably attached to the feeder mount 58 with the same number or more as the suction nozzles 50B, 52B, 54B in the moving unit 28B. It has been.
[0033]
Therefore, as shown in FIG. 2, a component feeder 56 for electronic components for the next type of substrate is mounted in advance on a feeder mount 58 in the spare electronic component supply device 26b, and this is replaced with the electronic component. By replacing the electronic component supply device 26B mounted on the main body of the mounting machine 20, the plurality of component feeders 56 can be replaced at once in a short time.
[0034]
Next, the process of mounting electronic components on the boards 22A and 22B by the electronic component mounting machine 20 will be described in detail with reference to FIGS.
[0035]
First, as shown in FIG. 4, in step 101, the substrates 22 </ b> A and 22 </ b> B are loaded into the substrate transport apparatus 24 from the substrate carry-in area 24 </ b> A.
[0036]
Next, in step 102, the preceding substrate 22A is stopped from positioning in the first positioning region 24C, and in step 103, the subsequent substrate 22B is transported and positioned in the second positioning region 24B.
[0037]
At this time, in step 104, the mounting posture of the boards 22A and 22B is measured by the camera 36.
[0038]
In step 105, the moving units 28 </ b> A and 28 </ b> B are moved to the upper part of the pick position of the electronic component supply device 26 by the XY robot device 32.
[0039]
Next, in step 106, the electronic components 51A, 53A, 55A and 51B, 53B, 55B are simultaneously sucked by the suction nozzles 50A, 52A, 54A and 50B, 52B, 54B, respectively.
[0040]
In most cases, as shown in FIG. 6, for example, the sucked electronic component is picked up by shifting in the X direction, the Y direction, and the rotation direction with respect to the center of the nozzle. There must be. The suction nozzles 50A and 50B, 52A and 52B, and 54A and 54B have the same Y-direction coordinates.
[0041]
Prior to the correction, the process proceeds to step 107, where the position detector detects the position of each electronic component in the XY direction and the orientation in the rotation direction. Next, in steps 108 to 112, the suction nozzles 50A and 50B In order to be able to mount the electronic components 51A and 51B on the boards 22A and 22B at the same time, the shift amount of each electronic component is corrected, and the angle of the electronic components 51A and 51B is corrected to the designated mounting angle. These corrections are actually performed in parallel at the same time.
[0042]
The correction process will be described in detail. First, in step 108, the mounting coordinates of the electronic component 51A on the substrate 22A and the electronic component 51B on the substrate 22B (at the mounting positions A and B in FIGS. 6 to 9). The displacement of the X direction, the Y direction, and the rotation direction with respect to the mounting position of the electronic components 51A and 51B is calculated based on the distance to the mounting position of the electronic components 51A and 51B obtained by the position detector.
[0043]
Next, in step 109 (refer to FIG. 5 until the final step), the rotation angles of the suction nozzles 50A and 50B are corrected so that the angles of the electronic components 51A and 51B become the specified mounting angles (see FIG. 7). ).
[0044]
In step 110, the displacement units δXA and δXB in the X direction with respect to the mounting positions on the electronic components 51A and 51B and the substrates 22A and 22B attracted by the respective nozzles are moved to the moving unit 28A and the moving unit 28B (see FIG. 7). The XY robot device 32 drives the moving units 28A and 28B through the plates 29A and 29B serving as the mechanical interface members so that the X direction is positioned (see FIG. 8).
[0045]
Next, in step 111, the difference δYB between the electronic component 51B and its Y-direction mounting coordinates and the difference δYC in the Y direction when the electronic components 51A and 51B are attracted are obtained. In step 112, the XY robot apparatus 32 moves the moving unit. 28A and 28B are moved by δYB in the Y direction, and the electronic component 51B and its Y-direction mounting coordinates are matched. At the same time, the first positioning region 24C including the frame 38 is moved by δYC in the Y direction together with the substrate 22A by the Y motor 42, so that the electronic component 51A and its Y direction mounting coordinates are matched (see FIG. 9).
[0046]
In step 113, the electronic components 51A and 51B are simultaneously mounted on the substrates 22A and 22B by the suction nozzles 50A and 50B.
[0047]
In step 114, steps 108 to 113 are repeated for the other electronic components 53A, 53B and 55A, 55B.
[0048]
Further, in step 115, the steps 105 to 114 are repeated until all electronic components are mounted.
[0049]
After all the electronic components are mounted, in step 116, the boards 22A and 22B are started to be carried out via the board carry-out area 24D, and if there is a change in the type of the next board, the electronic component supply devices 26A, 26B, 27A, and 27B. Any or all of the above are replaced with a replacement electronic component supply apparatus prepared in advance outside the line, and then the process returns to step 101.
[0050]
At this time, if there is no change in the type of the next substrate carried into the first positioning region 24C and the type of the next substrate 22B carried into the second positioning region 24B is changed, the second positioning region Only the electronic component supply devices 26B and 27B corresponding to 24B are replaced, and the electronic component supply devices 26A and 27A in the first positioning region 24C are replaced when the next substrate is carried.
[0051]
In the example of the above embodiment, only two moving units are provided, but the present invention is not limited to this and may be three or more. Further, the number of component suction units in each moving unit is not limited to three, and at least one is sufficient.
[0052]
The electronic component supply device is disposed on both sides of one positioning region. However, the present invention is not limited to this, and for example, the electronic component supply device may be only one side of the electronic component supply devices 26A and 26B. Good.
[0053]
Moreover, in the said board | substrate conveyance apparatus, although the number of the positioning area | region and the said movement unit is provided, this invention is not limited to this, The number of both may differ .
[0054]
Further, in the example of the above embodiment, the same components are simultaneously and sequentially mounted on the two substrates 22A and 22B. However, the present invention is not limited to this. Alternatively, the mounting of the components on the preceding and succeeding boards may be borne by the moving units 28A and 28B in half in the board traveling direction.
[0055]
Specifically, for example, in the moving unit 28A, the electronic components on the first half of the traveling direction are mounted on the boards 22A and 22B, and the electronic components on the second half in the moving direction of the boards 22A and 22B are mounted by the moving unit 28B. You may make it do.
[0056]
Further, the XY robot device 32 is driven by a motor, and this motor includes a linear motor.
[0057]
【The invention's effect】
Since the present invention is configured as described above, it is possible to mount electronic components on two substrates simultaneously at high speed with a simple configuration, and to quickly supply electronic components when changing the type of substrate. It has an excellent effect that the loss time can be reduced by exchanging it.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component mounting machine according to an example of an embodiment of the present invention. FIG. 2 is an enlarged perspective view showing a substrate transfer device in the electronic component mounting machine. FIG. FIG. 4 is a flowchart showing the first half of the electronic component mounting process by the electronic component mounting machine. FIG. 5 is a flowchart showing the second half of the mounting process. FIG. 6 is an electronic component using the electronic component mounting machine. FIG. 7 is a plan view showing the positional relationship between the substrate and the electronic component when the electronic component is picked up when mounting the electronic component. FIG. 8 is a plan view showing the positional relationship between the board and the electronic component after correcting the position of the electronic component in the X direction when the electronic component is mounted by the electronic component mounting machine. ] Same electronic parts FIG. 10 is a perspective view showing an outline of a conventional electronic component mounting machine. FIG. 11 is a plan view showing a positional relationship between a board and an electronic component when electronic component position correction is completed. The perspective view which expands and shows the head part in the conventional electronic component mounting machine
DESCRIPTION OF SYMBOLS 20 ... Electronic component mounting machine 22 ... Board | substrate 24 ... Board | substrate conveyance apparatus 24A ... Substrate carrying-in area | region 24B ... 2nd positioning area | region 24C ... 1st positioning area | region 24D ... Substrate carrying-out area | region 26A, 26B, 27A, 27B ... Electronic component supply apparatus 28A, 28B ... Moving unit 30 ... X direction guide 31 ... X direction beam member 32 ... XY robot device 34 ... Part suction unit 36 ... Camera 38 ... Frame 40 ... Straight guide 42 ... Y motors 44A, 44B ... Motors 50A, 52A, 54A ... Adsorption nozzles 50B, 52B, 54B ... Adsorption nozzles 46A, 46B ... Belt 56 ... Parts feeder 58 ... Feeder mount 60 ... Cart

Claims (2)

A substrate transport device for transporting and stopping the substrate in the order of the transport region, positioning region, and unloading region, and a plurality of component feeders arranged along the substrate transport device for sending electronic components one by one to the suction position in the substrate transport direction Electronic component supply device, a plurality of suction nozzles each receiving an electronic component from a component feeder of the electronic component supply device, and mounting the electronic component on a substrate stopped in the positioning region, and an angle positioning device for the suction nozzle And a XY robot apparatus that supports the head unit and moves the head unit in the X direction parallel to the substrate transport direction and the Y direction orthogonal thereto. In component mounting machines,
The head portion is composed of a plurality of moving units each supported independently and slidable on the same X-direction guide that is movable in the Y direction, and each moving unit is relative to the other moving units. It is movable independently in the X direction, and, become wearing at least one component adsorption unit, the positioning region are arranged two side by side in the X direction and these positioning areas sac Chi one One positioning area can be moved and positioned in the Y direction relative to the other positioning areas, and one or two electronic component supply devices are provided in the Y direction with respect to the one positioning area. And each electronic component supply apparatus is comprised including the feeder mount which can mount | wear with the said some component feeder in parallel , and the trolley | bogie which supports this feeder mount , The said feeder mount , The so parts feeder is an electronic component suction position by the suction nozzle is attachable to a surface mount component mounting machine body, and purified by preparative outer surface mount component mounting machine, characterized in that it is freely . 2. Before starting to mount electronic components on the next type of substrate in the positioning region in which mounting of the electronic components on the previous type of substrate is completed among the two positioning regions in the surface mount component mounting machine according to claim 1. In addition, all the component feeders for supplying the electronic components for mounting on the next type of substrate are mounted in advance on a feeder mount on a replacement carriage, and the electronic component supply apparatus including the feeder mount and the carriage Is replaced with an electronic component supply device for a positioning area in which electronic component mounting has been completed, and is mounted on the surface mount component mounting machine main body.

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