JP4248066B2 - Surface mount component mounting machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mount component mounting machine that sequentially supplies electronic components from an electronic component supply device, sucks them by a suction nozzle, and mounts them at a specified position on a circuit board.
[0002]
[Prior art]
As shown in FIG. 10, the conventional electronic component mounting machine 1 receives electronic components from a reel 2 wound in a reel shape by storing the electronic components in a hole of paper or a plastic sheet. One by one is supplied, and the supplied electronic components are sucked by the head unit 4 and mounted on the circuit board 5.
[0003]
The head unit 4 is moved in the XY direction within a plane parallel to the circuit board 5 by the XY robot device 6. The XY robot apparatus 6 is provided with sensors 6a and 6b for recognizing the origin positions in the X direction and the Y direction, respectively, so as to detect the mechanical position of the XY robot apparatus.
[0004]
As shown in an enlarged view in FIG. 11, the head unit 4 is usually supported by the XY robot device 6 with two or more sets of component suction units 7, 7... Yes.
[0005]
The component suction unit 7 includes a structural member 9 fixed to the surface of the mechanical interface member 8, a bracket 11 supported on the structural member 9 by a straight guide 10 in a vertical direction, and the bracket 11. A motor 13 that drives the bracket 11 up and down via a ball screw / nut 12, a suction nozzle 15 supported on the bracket 11 via a vertical shaft 14 at the lower end thereof, Attached to the bracket 11 and rotated around the axis of the shaft 14, the motor 16 for positioning the suction nozzle 15 in the rotational direction and the structural member 9 are attached to the suction nozzle 15. A position detector 18 for detecting the position of the electronic component 17 and the structural member 9 are mounted on the circuit board. Its position when adsorbing the mark recognition and the electronic components 17 on the 5, and a like camera 19 for confirming the position of the electronic component 17 mounted on the circuit board 5.
[0006]
A mark 19 </ b> A that can be recognized by the camera 19 is fixed to the main body of the surface mount component mounting machine 1 within the movable range of the XY robot device 6. The XY robot device 6 moves to a position of the mark 19A from the position detected by the sensor moved to the sensors 6a and 6b in order to recognize the origin position, moves to a position of the mark 19A, and performs the mark recognition by the camera 19. The recognized mark position is always used as the reference of the coordinate system of the XY robot, so that the deviation of the coordinate system of the XY robot apparatus due to the error of the sensor detection position is eliminated. Further, since the distance between the camera 19 and the suction nozzle 15 is mechanically adjusted and the adjustment error is stored in software, the camera 19 recognizes the mark 19A and the coordinate system of the XY robot apparatus 6 is used. At this point, the moving position of each suction nozzle is also determined on the coordinate system.
[0007]
The plurality of component suction units 7 have the same timing by matching the distance between the suction nozzles 15 in each component suction unit 7 and the distance between the electronic component supply tips in the plurality of electronic component supply devices 3. A plurality of electronic components can be picked up, and for each XY operation of the XY robot device 6, as many electronic parts as the number of the component picking units 7 are simultaneously mounted on the circuit board 5 to shorten the mounting time. Can do.
[0008]
[Problems to be solved by the invention]
As described above, if as many component suction units 7 as possible are provided for one XY robot apparatus 6, the cycle time of electronic component suction and mounting is theoretically reduced and productivity is increased. become.
[0009]
However, even if the number of component suction units 7 is increased, productivity cannot be improved in proportion to the increased number, but rather the degree of improvement is reduced.
[0010]
Furthermore, an increase in the number of component suction units causes an increase in the transfer mass by the XY robot apparatus 6, making it difficult to maintain the moving speed and acceleration, and conversely, the suction mounting cycle time may be worsened. There is a problem.
[0011]
On the other hand, there is one in which two beams are provided in the X direction, and separate head portions are provided for them.
[0012]
However, the former has a problem that the installation area of the apparatus becomes large and high speed cannot be exhibited. In the latter case, there are problems that the electronic component supply device must be arranged at the front and back, the structure becomes complicated, the cost for incorporation into the production line increases, and the cost of the entire device is high.
[0013]
On the other hand, it has been proposed to provide a plurality of head portions (component suction units) having separate drive mechanisms for one beam in the X direction (unknown).
[0014]
However, in order to control the XY robot apparatus in an independent coordinate system, these multiple head sections must be provided with separate marks for each head section, which increases the installation area of the apparatus and the entire apparatus. There is a problem that the cost of the system becomes high. Furthermore, in order to ensure the accuracy of electronic component mounting, it is necessary to adjust the position of each mark with a strict accuracy, which makes it extremely difficult to adjust.
[0015]
The present invention has been made in view of the above-described conventional problems. Even when the XY robot apparatus is controlled by an independent coordinate system having a plurality of head portions on the same axis , the head portions are separately provided. It is an object of the present invention to provide an electronic component mounting machine and an electronic component mounting method that can reduce the installation area of the apparatus and reduce the cost of the entire apparatus.
[0016]
[Means for Solving the Problems]
This invention, as claimed in claim 1, the transfer area of the substrate, a plurality of positioning areas, carried in the order of the unloading area, the board conveying device Ru is stopped, is disposed along the substrate transfer apparatus, sequentially electronic components An electronic component supply device to be supplied, an adsorption nozzle for receiving each electronic component from the electronic component supply device and mounting the electronic component on each substrate stopped in the plurality of positioning regions, and an angle positioning device for the adsorption nozzle are provided. Surface mount component mounting comprising a plurality of head portions on the same axis and an XY robot device that supports the head portions and moves them in the X direction parallel to the substrate transport direction and the Y direction perpendicular thereto In the machine, each of the plurality of head portions is independently movable in one direction, and a common movement region is included in a movement range in the XY direction of the plurality of head portions including each positioning region. Only, to the common movement area, by disposing the one mark as a reference of the coordinate system of the XY robot, it is to achieve the above object.
[0017]
In the present invention, the plurality of head portions are slidably supported independently in the X direction, and one mark is provided in these common movement regions, so that the installation area of the apparatus can be reduced, and the plurality of head portions can be reduced. When this mark is provided, strict position adjustment between both marks becomes unnecessary.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0019]
As shown in FIG. 1, an electronic component mounting machine 20 according to an example of an embodiment of the present invention transports and stops substrates 22A and 22B in one direction (X direction), and the substrate transport device. An electronic component supply device 26 which is arranged along the device 24 and sequentially supplies electronic components; and two head portions 28A each receiving an electronic component from the electronic component supply device 26 and mounting it on the substrate 22; 28B and an X-direction guide 30 that slidably supports the head portions 28A and 28B in the X-direction parallel to the transport direction of the substrate 22, and drives the X-direction guide 30 in the Y-direction orthogonal thereto. And an XY robot device 32 configured to detect the mechanical positions of the XY robot device 32 in the X direction and the Y direction, respectively. A single mark 50 serving as a reference for the coordinate system of the XY robot device 32 is arranged in a common area where the respective head portions 28A and 28B can move, and a camera 36A provided in each head portion 28A and 28B. , 36B (described later), the mark 50 is recognized, and the coordinate system of the XY robot apparatus 32 is determined.
[0020]
Each of the head portions 28A and 28B includes three component suction units 34 and cameras 36A and 36B similar to those shown in FIG. 3 (position detectors are not shown). The head portions 28A and 28B are supported by the X guide 30 via plates 29A and 29B (see FIG. 3) serving as mechanical interface members.
[0021]
As shown in FIG. 2 in an enlarged manner, the substrate transfer device 24 has a substrate carry-in area 24A, a second positioning area 24B, a first positioning area 24C, and a substrate carry-out area 24D sequentially in the substrate transfer direction. , Conveyors 25 </ b> A to 25 </ b> D capable of transporting and stopping the substrate 22 independently of each other are provided.
[0022]
The first and second positioning regions 24C and 24B are configured so that electronic components can be mounted from the two head portions 28A and 28B when the loading of the substrates 22A and 22B is stopped here.
[0023]
As shown in FIGS. 1 and 2, the entire first positioning region 24C is supported by a U-shaped frame 38 that supports the conveyor 25C so that it can move horizontally in the Y direction by a straight guide 40 in the Y direction. Further, the Y motor 42 can move in the Y direction along the linear guide 40 via the ball screw 42A.
[0024]
Reference numerals 44A and 44B in FIG. 1 denote motors for independently driving the head portions 28A and 28B along the X-direction guides 30 via belts 46A and 46B, respectively.
[0025]
Both ends in the axial direction of the X-direction beam member 31 supporting the X-direction guide 30 are slidably supported in the Y direction on the Y-direction guide 48 in the XY robot apparatus 32 together with the motors 44A and 44B, and a motor (illustrated). Is omitted).
[0026]
The component suction units 34 on the head portions 28A and 28B are respectively provided with suction nozzles 50A, 52A, 54A and 50B, 52B, 54B whose rotational angles around the vertical axis are positioned by the same motor as shown in FIG. (See FIG. 3).
[0027]
First, a procedure for determining the XY coordinate system of the XY robot apparatus 32 having the head portions 28A and 28B of the surface mount component mounting machine 20 having the above-described mechanism configuration will be described.
[0028]
The XY robot device 32 is moved in the direction of the Y direction position sensor 61 by a Y motor (not shown) and the Y belt 47, and the time point detected by the sensor is defined as the Y direction origin. Next, the head portion 28A is moved in the direction of the X-direction position sensor 60A by the X motor 44A and the X belt 46A, and the time point detected by the sensor is set as the XA direction origin. Further, the head portion 28B is moved in the direction of the X direction position sensor 60B by the X motor 44B and the X belt 46B, and the time point detected by the sensor is defined as the XB direction origin.
[0029]
In this state, first, the XY robot device 32 is moved by a predetermined amount (X1, Y1) for the camera 36A provided on the head portion 28A to move onto the mark 50, and the mark 50 is recognized by the camera 36A. The amount of deviation from the amount (X1, Y1) is calculated, and the coordinate system for the XY movement of the head portion 28A is determined. Here, the XY robot apparatus 32 is moved by a predetermined amount (X2, Y2) for moving the head portion 28A in the direction of the X direction position sensor 60A and then moving the camera 36B provided on the head portion 28B onto the mark 50. , The mark 50 is recognized by the camera 36B, the amount of deviation from the specified amount (X2, Y2) is calculated, and the coordinate system for the XY movement of the head portion 28B is determined.
[0030]
Through the above operation, each head unit 28A, 28B can obtain an individual XY movement coordinate system by one mark.
[0031]
Next, the process of mounting electronic components on the boards 22A and 22B by the electronic component mounting machine 20 will be described in detail with reference to FIGS.
[0032]
First, as shown in FIG. 4, in step 101, the substrates 22 </ b> A and 22 </ b> B are loaded into the substrate transport apparatus 24 from the substrate carry-in area 24 </ b> A.
[0033]
Next, in step 102, the preceding substrate 22A is stopped from positioning in the first positioning region 24C, and in step 103, the subsequent substrate 22B is transported and positioned in the second positioning region 24B.
[0034]
At this time, in step 104, the mounting posture of the boards 22A and 22B is measured by the camera 36.
[0035]
In step 105, the head units 28 </ b> A and 28 </ b> B are moved above the pick position of the electronic component supply device 26 by the XY robot device 32.
[0036]
Next, in step 106, the electronic components 51A, 53A, 55A and 51B, 53B, 55B are simultaneously sucked by the suction nozzles 50A, 52A, 54A and 50B, 52B, 54B, respectively.
[0037]
In most cases, as shown in FIG. 6, for example, the sucked electronic component is picked up by shifting in the X direction, the Y direction, and the rotation direction with respect to the center of the nozzle. There must be. The suction nozzles 50A and 50B, 52A and 52B, and 54A and 54B have the same Y-direction coordinates.
[0038]
Prior to the correction, the process proceeds to step 107, where the position detector detects the position of each electronic component in the XY direction and the orientation in the rotation direction. Next, in steps 108 to 112, the suction nozzles 50A and 50B In order to be able to mount the electronic components 51A and 51B on the boards 22A and 22B at the same time, the shift amount of each electronic component is corrected, and the angle of the electronic components 51A and 51B is corrected to the designated mounting angle. These corrections are actually performed in parallel at the same time.
[0039]
The correction process will be described in detail. First, in step 108, the mounting coordinates of the electronic component 51A on the substrate 22A and the electronic component 51B on the substrate 22B (at the mounting positions A and B in FIGS. 6 to 9). The displacement of the X direction, the Y direction, and the rotation direction with respect to the mounting position of the electronic components 51A and 51B is calculated based on the distance to the mounting position of the electronic components 51A and 51B obtained by the position detector.
[0040]
Next, in step 109 (refer to FIG. 5 until the final step), the rotation angles of the suction nozzles 50A and 50B are corrected so that the angles of the electronic components 51A and 51B become the specified mounting angles (see FIG. 7). ).
[0041]
In step 110, the head portions 28A and 28B are displaced in the X direction relative to their mounting positions on the electronic components 51A and 51B and the substrates 22A and 22B adsorbed by the respective nozzles δXA and δXB (see FIG. 7). The XY robot device 32 drives the head portions 28A and 28B via the plates 29A and 29B serving as the mechanical interface members so that the X direction is positioned (see FIG. 8).
[0042]
Next, in step 111, a difference δYB between the electronic component 51B and its Y-direction mounting coordinate and a difference δYC in the Y direction when the electronic components 51A and 51B are attracted are obtained. In step 112, the head portion 28A and 28B are moved by δYB in the Y direction, and the electronic component 51B and its Y-direction mounting coordinates are matched. At the same time, the first positioning region 24C including the frame 38 is moved by δYC in the Y direction together with the substrate 22A by the Y motor 42, so that the electronic component 51A and its Y direction mounting coordinates are matched (see FIG. 9).
[0043]
In step 113, the electronic components 51A and 51B are simultaneously mounted on the substrates 22A and 22B by the suction nozzles 50A and 50B.
[0044]
In step 114, steps 108 to 113 are repeated for the other electronic components 53A, 53B and 55A, 55B.
[0045]
Further, in step 115, the steps 105 to 114 are repeated until all electronic components are mounted.
[0046]
After all the electronic components are mounted, in step 116, the substrates 22A and 22B are unloaded through the substrate unloading region 24D, and the process returns to step 101.
[0047]
In the example of the above embodiment, only two head portions are provided, but the present invention is not limited to this, and may be three or more. Further, the number of component suction units in each head portion is not limited to three, and it is sufficient that there is at least one.
[0048]
In the substrate transfer apparatus, the same number of positioning regions as the number of the head portions are provided. However, the present invention is not limited to this, and the number of both may be different. . In addition, the positioning region in the substrate transfer device is not limited as long as a plurality of head portions can be relatively displaced in the Y direction. Therefore, all the head portions can be moved in the Y direction by a ball screw or the like. Only the head portion may be fixed in the Y direction, and the others may be movable in the Y direction.
[0049]
Further, in the example of the above embodiment, the same components are simultaneously and sequentially mounted on the two substrates 22A and 22B. However, the present invention is not limited to this. Instead, the mounting of the components on the preceding and succeeding boards may be borne by the head portions 28A and 28B in half in the board traveling direction.
[0050]
Specifically, for example, in the head portion 28A, the electronic components on the first half of the traveling direction on the substrates 22A and 22B are mounted, and the electronic components on the second half in the moving direction of the substrates 22A and 22B are mounted by the head portion 28B. You may make it do.
[0051]
Further, the XY robot device 32 is driven by a motor, and this motor includes a linear motor.
[0052]
Moreover, although the example of the said embodiment supports two head parts in one X direction guide, this invention is not limited to this, You may provide multiple X direction guides. In addition, although an independent XY movement coordinate system is provided for each of the plurality of head units, each head unit can recognize the same mark and can be moved individually in one coordinate system.
[0053]
【The invention's effect】
Since the present invention is configured as described above, a separate mark is provided for each head unit even in a surface mount component mounting machine that has a plurality of head units on the same axis and controls the XY robot apparatus using an independent coordinate system. Since there is no need, the installation area of the device can be reduced, the overall cost of the device can be reduced, and furthermore, it is not necessary to adjust the distance between each of the marks with strict accuracy, and manufacturing is also simplified. It has an excellent effect of being able to.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component mounting machine according to an example of an embodiment of the present invention. FIG. 2 is an enlarged perspective view showing a substrate transfer device in the electronic component mounting machine. FIG. FIG. 4 is a flowchart showing the first half of the electronic component mounting process by the electronic component mounting machine. FIG. 5 is a flowchart showing the second half of the mounting process. FIG. 6 is an electronic component using the electronic component mounting machine. FIG. 7 is a plan view showing the positional relationship between the substrate and the electronic component when the electronic component is picked up when mounting the electronic component. FIG. 8 is a plan view showing the positional relationship between the board and the electronic component after correcting the position of the electronic component in the X direction when the electronic component is mounted by the electronic component mounting machine. ] Same electronic parts FIG. 10 is a perspective view showing an outline of a conventional electronic component mounting machine. FIG. 11 is a plan view showing a positional relationship between a board and an electronic component when electronic component position correction is completed. The perspective view which expands and shows the head part in the conventional electronic component mounting machine
DESCRIPTION OF SYMBOLS 20 ... Electronic component mounting machine 22 ... Board | substrate 24 ... Board | substrate conveyance apparatus 24A ... Board | substrate carrying-in area | region 24B ... 2nd positioning area | region 24C ... 1st positioning area | region 24D ... Board | substrate carrying-out area | region 26 ... Electronic component supply apparatus 28A, 28B ... Head part 30 ... X direction guide 32... XY robot device 34... Component adsorption unit 36... Camera 40.

Claims (1)

Conveying region of the substrate, and a plurality of positioning areas, carried in the order of the unloading area, board conveying device Ru is stopped, it is disposed along the substrate transfer apparatus, and the electronic component feeding device sequentially supplying the electronic components, each electronic A plurality of head units on the same axis, each having an adsorption nozzle for receiving an electronic component from the component supply device and mounting the electronic component on each of the substrates stopped in the plurality of positioning regions, and an angle positioning device for the adsorption nozzle; In a surface mount component mounting machine having an XY robot apparatus that supports a head part and moves it in an X direction parallel to the substrate transport direction and a Y direction perpendicular thereto,
Each of the plurality of head portions is independently movable in one direction, and a common movement region is provided in a movement range in the XY direction of the plurality of head portions including each positioning region. A surface mount component mounting machine, wherein one mark serving as a reference of a coordinate system of an XY robot apparatus is arranged in a moving area.

Images