JP2014078580A - Electronic component mounting apparatus and board positioning method in the electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus handing a high packaging density double-sided mounting board capable of reliably avoiding interference between lower receiving pins and mounted components and a board positioning method in the electronic component mounting apparatus.SOLUTION: The electronic component mounting apparatus controls a board conveying mechanism 3 to stop a board 4 at a target stop position E on a mounting stage [S]. A board recognition camera 11 which moves together with the mounting head recognizes a position detection portion formed on the stopped board 4 to detect a displacement error from the target stop position E. The electronic component mounting apparatus controls the board conveying mechanism 3 to correct the detected displacement error. After performing a displacement correction so that the stop position of the board 4 coincide with the target stop position E, lower receiving pins 15c is raised to support the board 4 with no displacement error from the bottom thereof.

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate and a substrate positioning method in the electronic component mounting apparatus.

  An electronic component mounting apparatus that mounts electronic components on a substrate is provided with a substrate positioning mechanism for positioning the substrate transferred by the substrate transfer mechanism, and is positioned at a predetermined mounting work position and is lowered by a substrate lower receiving portion. A component mounting operation is performed on the received and supported board. Such a substrate positioning mechanism includes a mechanical stopper method in which the end portion of the substrate is brought into contact with a stopper disposed at a fixed position, and a sensor method in which the stop position is controlled by detecting the end portion of the substrate with a substrate detection sensor. In addition, various methods such as an optical recognition method that performs stop position control by optically recognizing the position reference portion of the substrate are used (see, for example, Patent Document 1). In the prior art shown in this patent document example, a measurement process for obtaining a positional deviation amount from a specified stop position based on a position recognition result obtained by picking up and recognizing a positioning mark of a board stopped by a board positioning unit with a board recognition camera. The process is executed for a predetermined number of substrates, and the substrate stop position is controlled using a feedback value obtained from these measurement results.

JP 2006-229095 A

  As the mounting density of a substrate increases, a double-sided mounting substrate on which electronic components are mounted on both sides tends to be adopted as a mounting form of the substrate. In the substrate of this mounting form, after the component mounting operation on the first surface to be mounted first is completed, the substrate is inverted, and the component mounting operation is executed on the second surface opposite to the first surface. . In the component mounting work on the second surface, the substrate that has been carried into the substrate receiving portion has the already mounted surface on which the electronic component has already been mounted as the receiving target surface. In this way, when receiving the already mounted surface, use a receiving mechanism with a receiving pin whose arrangement position is variable, and select the parts that can be received on the substrate surface where there are no already mounted components. The arrangement of the receiving pin is changed every time.

  When the board stop position control shown in the above-mentioned prior art is applied to a mounting form in which a double-sided mounting board having a high mounting density is received by a receiving mechanism of a receiving pin method, the following is caused due to the stop position accuracy. Such troubles occur. In other words, in a high mounting density board, the parts that can be received are limited to a narrow range. Therefore, in order to hold the board normally without causing interference between the already mounted parts and the receiving pins, the mounting work position must be It is necessary to ensure the accuracy of the substrate stop position with high accuracy.

  However, in the above-described prior art, since the actual substrate stop position originally has a variation, the median value of the variation range is only set as the target stop position. Does not necessarily match, and some displacement is inevitable. Depending on the degree of this positional deviation, a situation occurs in which the receiving pin and the already mounted component interfere with each other. As described above, the conventional technique has a problem that it is difficult to avoid the interference between the receiving pin and the already mounted component when a high-density double-sided mounting board is targeted.

  Accordingly, the present invention provides an electronic component mounting apparatus and a substrate positioning method in the electronic component mounting apparatus capable of reliably avoiding interference between a receiving pin and an already mounted component, targeting a high mounting density double-sided mounting substrate. With the goal.

  The electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that mounts an electronic component taken out from a component supply unit on at least the opposite surface of the surface on which the electronic component has already been mounted out of the two surfaces forming the front and back of the substrate. A substrate transport mechanism that transports the substrate in a posture in which the mounted surface is faced down, and a substrate that is loaded into a mounting work area set in a transport path by the substrate transport mechanism and stopped at a predetermined target stop position And a substrate mounting portion for receiving and supporting the substrate from below by a movable receiving pin, and a component mounting mechanism for transferring and mounting the electronic component from the component supply unit to the substrate positioned in the mounting work area. Board recognition means that moves integrally with the mounting head and picks up and recognizes the substrate from above, the substrate transport mechanism, the substrate receiving portion, the component mounting mechanism, and the substrate A control unit that controls a recognition unit, and the control unit controls the substrate transport mechanism to stop the substrate at a target stop position in the mounting work area, and the substrate recognition unit. By controlling, a position shift detection processing unit that recognizes a position detection portion provided on the stopped substrate and detects a position shift error from the target stop position, and corrects the detected position shift error. By controlling the substrate transport mechanism, the misalignment correction processing unit that matches the stop position of the substrate with the target stop position, and the substrate lower receiving unit are controlled to raise the lower receiving pin and And a support support processing unit for receiving and supporting the substrate in a state in which the positional deviation error is corrected.

  The substrate positioning method in the electronic component mounting apparatus according to the present invention is an electronic device in which the electronic component taken out from the component supply unit is mounted on at least the opposite surface of the already mounted surface on which the electronic component is already mounted out of the two surfaces forming the front and back of the substrate. In the component mounting apparatus, a board positioning method for positioning the board, wherein the electronic component mounting apparatus transports the board in a posture in which the mounted surface is faced down, and transport by the board transport mechanism. A substrate lower receiving portion that supports a substrate that has been loaded into the mounting work area set in the path and stopped at a predetermined target stop position from below by a lower receiving pin that can be moved up and down, and a mounting head from the component supply portion. A component mounting mechanism for picking up electronic components and transporting and mounting them on a substrate positioned in the mounting work area; Board recognition means for imaging and recognizing, and a control unit for controlling the board transfer mechanism, the board receiving part, the component mounting mechanism, and the board recognition means, and controlling the board transfer mechanism to thereby implement the mounting work area. A positioning step of stopping the substrate at a target stop position and controlling the substrate recognition means, thereby recognizing a position detection portion provided on the stopped substrate and generating a positional deviation error from the target stop position. A positional deviation detecting step for detecting, a positional deviation correcting step for matching the stop position of the substrate with the target stop position by controlling the substrate transport mechanism so as to correct the detected positional deviation error, and the substrate A lower support supporting step of supporting the substrate in a state in which the position error is corrected by raising the lower support pin by controlling the lower support; Including.

  According to the present invention, the substrate transport mechanism is controlled to stop the substrate at the target stop position in the mounting work area, and the position detection portion provided on the stopped substrate is recognized to thereby prevent the position deviation error from the target stop position. After detecting and correcting the misalignment by controlling the substrate transport mechanism to correct the detected misalignment error and making the stop position of the substrate coincide with the target stop position, the receiving pin is raised and the misalignment error is raised. By supporting the substrate in a state in which the correction has been made, interference between the receiving pin and the already mounted component can be reliably avoided for a high mounting density double-sided mounting substrate.

The top view of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the board | substrate conveyance mechanism of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the board | substrate positioning function in the electronic component mounting apparatus of one embodiment of this invention The flowchart which shows the board | substrate positioning method in the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the board | substrate positioning method in the electronic component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transport mechanism 3 is disposed at the center of a base 2. The substrate transport mechanism 3 includes two transport rails 3a, receives the substrate 4 to be mounted from the upstream side, transports it in the X direction (substrate transport direction), and positions it. Component supply units 5 are arranged on both sides of the substrate transport mechanism 3, and a plurality of tape feeders 6 are arranged in parallel on the component supply unit 5. The tape feeder 6 feeds a carrier tape holding an electronic component to be mounted to a take-out position by a component mounting mechanism described below by pitch feeding.

  A Y-axis movement table 7 is disposed at the X-direction end of the upper surface of the base 2, and two X-axis movement tables 8 are mounted on the Y-axis movement table 7 so as to be movable in the Y direction. . Further, the mounting heads 9 are mounted on the X-axis movement table 8 so as to be movable in the X direction. The mounting head 9 is a multiple head including a plurality of unit mounting heads 9a, and the unit mounting head 9a includes a suction nozzle (not shown) for sucking and holding electronic components at the lower end.

  By driving the Y-axis moving table 7 and the X-axis moving table 8, the mounting head 9 moves in the X direction and the Y direction, and the electronic component is taken out from the tape feeder 6 of the component supply unit 5 by the suction nozzle to carry the substrate. This electronic component is transferred and mounted on the substrate 4 positioned and held by the mechanism 3. In the electronic component mounting apparatus 1 shown in the present embodiment, the electronic component taken out from the component supply unit 5 is mounted on at least the surface opposite to the already mounted surface on which the electronic component is already mounted out of the two surfaces forming the front and back of the substrate 4. The substrate 4 carried in by the substrate transport mechanism 3 is subjected to substrate transport and component mounting work with the already mounted surface facing the lower surface. In the above configuration, the Y-axis moving table 7, the X-axis moving table 8 and the mounting head 9 are components that are taken out from the component supply unit 5 by the mounting head 9 and are transferred and mounted on the substrate 4 positioned and held by the substrate transport mechanism 3. The mounting mechanism 10 is configured.

  A substrate recognition camera 11 that moves integrally with the mounting head 9 is attached to the lower surface of the Y-axis moving table 8. 11 images an arbitrary position of the substrate 4. In the present embodiment, the board recognition camera 11 recognizes the position recognition mark 4 a formed on the board 4 to recognize the position of the component mounting point, and the board recognition camera 11 is formed at the front end of the board 4. The position reference mark 4c is imaged and the position is recognized by the recognition processing unit 16 (see FIG. 2), thereby detecting a position shift at the time of positioning the substrate 4.

  A component recognition camera 12 is disposed on a moving path along which the mounting head 9 moves from the component supply unit 5 to the substrate transport mechanism 3. When the mounting head 9 holding and holding the electronic component moves above the component recognition camera 12, the electronic component held by the suction nozzle is recognized by the component recognition camera 12. At the time of component mounting by the component mounting mechanism 10, the mounting position on the substrate 4 is corrected based on the substrate recognition result by the substrate recognition camera 11 and the component recognition result by the component recognition camera 12. In the above configuration, the substrate recognition camera 11 is a substrate recognition unit that moves integrally with the mounting head 9 and recognizes the substrate 4 by imaging from above.

  Next, the configuration and function of the substrate transport mechanism 3 will be described with reference to FIG. In FIG. 2A, the substrate transport mechanism 3 includes a transport belt 13 disposed in the X direction along two transport rails 3a. As shown in FIG. 2B, the transport belt 13 is tuned to two pulleys 13a disposed at both ends of the transport rail 3a and a drive pulley 14a of the motor 14. By driving the motor 14, the transport belt 13 moves horizontally along the transport rail 3a, and the substrate 4 placed on the upper surface of the transport belt 13 is transported in the X direction.

  A mounting stage [S] is set in the transport path by the substrate transport mechanism 3 in accordance with the range in which the mounting head 9 can move, that is, the mounting work area in which the component mounting mechanism 10 can mount components. The mounting stage [S] is provided with a substrate lower receiving portion 15 configured to move the lower receiving member 15a up and down by an elevating mechanism 15b (arrow b). On the upper surface of the lower receiving member 15a, a plurality of lower receiving pins 15c are provided so as to contact the lower surface of the substrate 4 and support the lower receiving.

  The lower support member 15a is placed on the substrate 4 that has been brought into the mounting stage [S] and stopped by aligning the front end face 4b with a predetermined target stop position E (the front edge line of the mounting stage [S] in this example). By raising, the substrate 4 is supported by the lower receiving pins 15c that can be raised and lowered from the lower surface side. The lower receiving pin 15c is detachably attached to the lower receiving member 15a. When the lower surface of the substrate 4 is an already mounted surface on which an electronic component has already been mounted in the previous process, the lower receiving member 15a has a lower surface. The mounting position of the receiving pin 15c is set to a lower receiving portion that does not cause interference with the already mounted component on the lower surface of the target substrate 4.

  A first substrate stop sensor 18 and a second substrate stop sensor 19 are disposed on the transport rail 3 a of the substrate transport mechanism 3 at two positions spaced apart from the target stop position E in both upstream and downstream directions by a distance d. Yes. That is, the target stop position E is set at the center position of the first substrate stop sensor 18 and the second substrate stop sensor 19. Further, a substrate deceleration sensor 17 is disposed on the upstream side of the first substrate stop sensor 18.

  The substrate deceleration sensor 17, the first substrate stop sensor 18, and the second substrate stop sensor 19 are all transmissive optical sensors, and the front end face 4 b (see FIG. 3) of the substrate 4 transported by the transport belt 13. By passing through the detection optical axes of the substrate deceleration sensor 17, the first substrate stop sensor 18, and the second substrate stop sensor 19, the front end surface 4 b of the substrate 4 becomes the substrate deceleration sensor 17 and the first substrate stop sensor 18. Then, it is detected that the position of the second substrate stop sensor 19 has been reached. Detection signals from the substrate deceleration sensor 17, the first substrate stop sensor 18, and the second substrate stop sensor 19 are transmitted to the control unit 20 provided in the main body of the electronic component mounting apparatus 1.

  When the substrate deceleration sensor 17 detects the front end face 4b, the control unit 20 issues a deceleration command to the motor 14, thereby decelerating the conveyance speed of the substrate 4. When the first substrate stop sensor 18 detects the front end face 4b, the control unit 20 issues a stop command to the motor 14, whereby braking for stopping the substrate 4 is turned on and the substrate 4 stops. When the second substrate stop sensor 19 detects the front end face 4b, it is determined that the substrate 4 has overrun despite the stop operation and exceeds the allowable limit of the stop position, and the substrate 4 after the stop is moved backward. Thus, a misalignment correction operation for bringing the target stop position E close is performed.

  That is, the substrate deceleration sensor 17 defines the start timing of the deceleration operation for decelerating the conveyance speed of the substrate 4 being conveyed by the substrate conveyance mechanism 3. The first substrate stop sensor 18 defines the start timing of the stop operation for stopping the substrate 4 after being decelerated. The second substrate stop sensor 19 defines an allowable limit range of an actual stop position where the substrate 4 actually stops after the stop operation is started.

  The control unit 20 controls the component mounting operation by the component mounting mechanism 10, and the control unit 20 controls the motor 14 and the lifting mechanism 15 b based on these detection signals, whereby the substrate recognition camera 11 in the substrate transport mechanism 3. The substrate 4 is positioned at a predetermined target stop position E on the basis of the position recognition result of the substrate 4 by the above, and the lower surface of the positioned substrate 4 is received from below. That is, the control unit 20 controls the board transport mechanism 3, the board lower receiving part 15, the component mounting mechanism 10, and the board recognition unit.

  The control unit 20 includes a positioning processing unit 20a, a positional deviation detection processing unit 20b, a positional deviation correction processing unit 20c, and a lower support processing unit 20d as internal control processing functions. The positioning processing unit 20 a controls the substrate transport mechanism 3. Processing for stopping the substrate 4 at the target stop position E in the mounting work area S is performed. The misregistration detection processing unit 20b controls the substrate recognizing unit to recognize the position reference mark 4c, which is a position detection portion provided on the stopped substrate 4, and detect a misalignment error with respect to the target stop position E. Perform the process. The misalignment correction processing unit 20c performs a process of matching the stop position of the substrate 4 with the target stop position E by controlling the substrate transport mechanism 3 so as to correct the detected misalignment error. The lower support processing unit 20d controls the substrate lower support 15 to perform the process of raising the lower support pins 15c and supporting the substrate 4 in a state in which the positional deviation error is corrected.

  FIG. 3 shows functions of the positional deviation detection processing unit 20b and the positional deviation correction processing unit 20c. That is, as shown in FIG. 3B, when the substrate 4 is transported and stopped in a state where the reference position in the optical coordinate system of the substrate recognition camera 11 positioned above coincides with the target stop position E, the substrate recognition camera 11 is stopped. Thus, the vicinity of the front end face 4b is imaged. As a result, the position of the position reference mark 4c, which is a position detection part, is recognized, and a recognized positional deviation amount Δx indicating a position error from the target stop position E is detected. Instead of providing the position reference mark 4c on the substrate surface as the position detection portion, the front end face 4b of the substrate 4 may be used as the position detection portion.

  A value obtained by adding a distance c indicating the distance between the position reference mark 4c and the front end face 4b to the recognized positional deviation amount Δx is a positional deviation error Δ1 indicating a positioning error when the substrate 4 is stopped. Then, as shown in FIG. 3B, the front end surface 4b of the substrate 4 is moved by controlling the motor 14 of the substrate transport mechanism 3 by the control unit 20 and moving the substrate 4 by the obtained positional deviation error Δ1. In accordance with the target stop position E, the substrate 4 is positioned at the correct position without any misalignment error.

  Next, a substrate positioning method for positioning the substrate 4 in the electronic component mounting apparatus 1 will be described with reference to FIGS. Here, an example is shown in which the electronic component taken out from the component supply unit 5 is mounted on at least the surface opposite to the already mounted surface on which the electronic component is already mounted out of the two surfaces forming the front and back of the substrate 4.

  In FIG. 4, first, the substrate recognition camera 11 is moved above the target stop position E of the mounting stage [S] (ST1). Thereby, as shown in FIG. 5A, the substrate recognition camera 11 is positioned above the target stop position E in the substrate transport mechanism 3. At this time, the substrate 4 is carried from the upstream side to the substrate transport mechanism 3 with the mounted surface 4d on which the mounted component P has already been mounted facing downward, and is transported downstream (arrow c). In this transport process, a positioning process for stopping the substrate 4 at the target stop position E at the mounting stage [S] by controlling the substrate transport mechanism 3 is performed (ST2).

  Here, as shown in FIG. 5B, first, the substrate deceleration sensor 17 detects the already mounted surface 4d of the substrate 4 in the process in which the substrate 4 is continuously conveyed downstream (arrow d). Thus, the conveyance speed of the substrate 4 in the middle of conveyance is reduced to a preset stop speed (ST2A). Next, as shown in FIG. 5C, at the timing when the first substrate stop sensor 18 detects the front end surface 4 b of the substrate 4 in the process in which the substrate 4 is continuously conveyed downstream (arrow e). Then, a stop operation for stopping the substrate 4 is started (ST2B). After the stop operation is started, whether or not the actual stop position at which the substrate 4 actually stops is within the allowable limit range is determined depending on whether or not the substrate 4 is detected by the second substrate stop sensor 19. .

  That is, the substrate 4 is stopped by braking the transport belt 13, and at this time, as shown in FIG. 5D, the substrate 4 is stopped after moving somewhat in the transport direction due to inertia, and the front end surface in the stopped state. 4b is in a state of being displaced from the target stop position E by a displacement error Δ1. Here, when the positional deviation error Δ1 exceeds the position of the second substrate stop sensor 19, the substrate transport mechanism 3 is controlled so that the front end surface 4 b returns to the upstream side of the second substrate stop sensor 19. Then, misalignment detection is performed in a state where the front end face 4 b is located between the second substrate stop sensor 19 and the first substrate stop sensor 18. That is, the position detection part (position reference mark 4c) provided on the stopped substrate 4 is imaged by the substrate recognition camera 11, and a positional deviation error Δ1 between the front end face 4b and the target stop position E is detected (ST3) (position Deviation detection step).

  Next, it is determined whether or not the actual stop position of the substrate 4 coincides with the target stop position E, that is, whether or not the positional deviation error Δ1 is within an allowable limit that does not interfere with normal support of the substrate 4. (ST4). Here, if NO, that is, if the displacement error Δ1 exceeds the allowable limit that does not interfere with the normal support of the substrate 4, the substrate transfer mechanism 3 is controlled so as to correct the detected displacement error Δ1. By doing so, the stop position of the substrate 4 is made to coincide with the target stop position E (position shift correction step) (ST5).

  Thereafter, the process returns to (ST3), and the positional deviation detection and the positional deviation correction are repeatedly executed. If it is confirmed in (ST4) that the actual stop position of the substrate 4 coincides with the target stop position E, in this state. The substrate 4 is clamped and controlled, and the substrate receiving portion 15 is controlled to raise the lower receiving pin 15c and to support the substrate 4 in a state in which the positional deviation error is corrected (lower receiving support step). Then, the component mounting operation by the component mounting mechanism 10 is executed on the mounting surface of the substrate 4 that is positioned and clamped and fixed in this way, that is, the surface opposite to the already mounted surface 4d.

  As described above, in the substrate positioning shown in the present embodiment, the substrate transport mechanism 3 is controlled to stop the substrate 4 at the target stop position E in the mounting work area, and the position provided on the stopped substrate 4 The position reference mark 4c as a detection part is recognized, a positional deviation error Δ1 from the target stop position E is detected, and the substrate transport mechanism 3 is controlled to correct the detected positional deviation error Δ1 to stop the substrate 4. After performing the positional deviation correction to make the position coincide with the target stop position E, the lower support pin 15c is raised to support the substrate 4 in a state where the positional deviation error is corrected.

  As a result, the position accuracy of the actual stop position of the substrate 4 can be ensured with high accuracy, and the already mounted surface is lowered by the substrate lower receiving portion 15 including the lower receiving pins 15c for a high-density double-sided mounting substrate. Even in the case of receiving and supporting, interference between the lower receiving pin 15c and the already mounted component P can be reliably avoided.

  The electronic component mounting apparatus and the substrate positioning method in the electronic component mounting apparatus according to the present invention have an effect that the interference between the receiving pin and the already mounted component can be reliably avoided for a high mounting density double-sided mounting substrate. In addition, it is useful in the field of manufacturing a mounting substrate by mounting electronic components on the substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Substrate conveyance mechanism 4 Substrate 4c Position reference mark 4d Already mounted surface 5 Component supply part 9 Mounting head 10 Component mounting mechanism 13 Conveyance belt 15 Substrate lower receiving part 15c Lower receiving pin 17 Substrate deceleration sensor 18 First Substrate stop sensor 19 Second substrate stop sensor [S] Mounting stage E Target stop position Δ1 Misalignment error P Mounted parts

Claims (4)

An electronic component mounting apparatus that mounts an electronic component taken out from a component supply unit on at least the surface opposite to the already mounted surface on which the electronic component is already mounted, of the two surfaces forming the front and back of the substrate
A substrate transport mechanism for transporting the substrate in a posture with the mounted surface facing downward;
A substrate lower receiving portion that supports the substrate that has been loaded into the mounting work area set in the conveying path set by the substrate conveying mechanism and stopped at a predetermined target stop position from below by a lower receiving pin that can be raised and lowered;
A component mounting mechanism for taking out an electronic component from the component supply unit by a mounting head and transporting and mounting the electronic component on a substrate positioned in the mounting work area;
Substrate recognition means that moves integrally with the mounting head and images the substrate from above to recognize it;
A controller for controlling the substrate transport mechanism, the substrate receiving portion, the component mounting mechanism, and the substrate recognition means,
The control unit is configured to stop the substrate at a target stop position in the mounting work area by controlling the substrate transport mechanism; and
By controlling the substrate recognition means, a displacement detection processing unit that recognizes a position detection portion provided on the stopped substrate and detects a displacement error from the target stop position;
A misregistration correction processing unit that matches the stop position of the substrate with the target stop position by controlling the substrate transport mechanism so as to correct the detected misalignment error;
And an under-supporting support processing unit that under-supports the substrate in a state where the misalignment error is corrected by raising the under-support pin by controlling the under-substrate receiving portion. Component mounting equipment. The substrate transport mechanism defines a substrate deceleration sensor that defines a start timing of a deceleration operation for decelerating the transport speed of a substrate being transported, and a start timing of a stop operation for stopping the substrate after being decelerated. And a second substrate stop sensor that defines an allowable limit range of an actual stop position at which the substrate actually stops after the stop operation is started.
2. The electronic component mounting apparatus according to claim 1, wherein the target stop position is set at a center position of the first board stop sensor and the second board stop sensor. A substrate positioning method for positioning the substrate in an electronic component mounting apparatus for mounting an electronic component taken out from a component supply unit on at least the surface opposite to the already mounted surface of the two surfaces forming the front and back of the substrate Because
The electronic component mounting apparatus includes a substrate transport mechanism that transports the substrate in a posture in which the mounted surface is faced down, and a predetermined work stop position that is loaded into a mounting work area set in a transport path by the substrate transport mechanism The board that has stopped in this way is supported by a lower receiving pin that can be moved up and down from below, and the electronic component is taken out from the component supply part by the mounting head and transferred to the board positioned in the mounting work area. A component mounting mechanism, a substrate recognition unit that moves integrally with the mounting head and picks up and recognizes the substrate from above, and a control that controls the substrate transport mechanism, the substrate receiving portion, the component mounting mechanism, and the substrate recognition unit With
A positioning step of stopping the substrate at a target stop position in the mounting work area by controlling the substrate transport mechanism;
A displacement detection step of recognizing a position detection portion provided on the stopped substrate and detecting a displacement error from the target stop position by controlling the substrate recognition means;
A misalignment correcting step of matching the stop position of the substrate with the target stop position by controlling the substrate transport mechanism to correct the detected misalignment error;
An electronic component comprising: a support supporting step of supporting the substrate in a state in which the position error is corrected by raising the support pin by controlling the substrate receiving portion. A substrate positioning method in a mounting apparatus. In the substrate positioning step, the transport speed of the substrate being transported is decelerated at the timing when the substrate deceleration sensor detects the substrate, and the substrate after the deceleration is detected by the first substrate stop sensor. Whether or not the actual stop position at which the substrate actually stops is within an allowable limit range depending on whether or not the substrate is detected by the second substrate stop sensor after the stop operation is started. Determine whether
4. The substrate positioning method in the electronic component mounting apparatus according to claim 3, wherein the target stop position is set at a center position between the first substrate stop sensor and the second substrate stop sensor.

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