JP2016207912A - Component mounting method and component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method capable of suppressing reduction of mounting quality caused by pushing up a mounted component with a lower receiving pin, and a component mounting device.SOLUTION: In the component mounting method for mounting a component on a second surface at a rear side of a first surface on which a component has been mounted already, between two surfaces forming front and rear sides of a substrate, a substrate conveyance mechanism conveys a substrate in an attitude where the first surface is turned down, and stops the substrate within a stop range. Next, in the state where the substrate is supported by the lower receiving pin, a height sensor measures heights at a measuring position for substrate warpage and a measuring position for component push-up confirmation. Based on measurement results by the height sensor, a virtual height calculation part then calculates a virtual height at the measuring position for component push-up confirmation. A discrimination part then discriminates whether a difference between the virtual height at the measuring position for component push-up confirmation and an actual height is equal to or more than a predetermined level. If it is discriminated in the discrimination step that the difference between the virtual height and the actual height is equal to or more than the predetermined level, the lower receiving and support of the substrate by the lower receiving pin is cancelled.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a component mounting method and a component mounting apparatus for mounting a component on a second surface, which is the opposite surface of the first surface on which components are already mounted, of the two surfaces forming the front and back of a substrate.

  In the mounting field, a component mounting apparatus is known that mounts a component on the upper surface of a substrate that has been transported by a substrate transport mechanism having a transport conveyor and stopped within a predetermined stop range. As the substrate transport mechanism, for example, there is a sensor system that controls the drive of the transport conveyor so that the substrate is stopped in the stop range by detecting the edge of the substrate with a sensor in the process of transporting the substrate on the transport conveyor. It is used. In addition, as a method of supporting the substrate stopped in the stop range from the lower surface side, for example, a lower receiving pin method is used in which the lower substrate receives and supports the substrate (see, for example, Patent Document 1).

  In the example shown in Patent Document 1, the lower receiving base portion on which a plurality of lower receiving pins are erected is raised with respect to the substrate, and the lower receiving pins are brought into contact with the lower surface of the substrate. As a result, the substrate is supported by the lower receiving pins. In this state, the lower position of the substrate is fixed by further raising the lower base portion to lift the substrate, and pressing both ends of the substrate with the pressing members provided above the substrate. The component is mounted on the upper surface of the substrate with the position of the substrate fixed in this manner.

  In the base pin method, if there is a component mounted in the previous process on the back side of the board (hereinafter referred to as “mounted component”), the position must be adjusted so as not to cause positional interference with the mounted component. It is necessary to determine the arrangement of the receiving pins. However, on the other hand, with the demand for high-density mounting, there is a situation that the receiving pins must be arranged at positions adjacent to the mounted components. Therefore, in the example shown in Patent Literature 1, a composite image obtained by superimposing a board image indicating the shape / arrangement of mounted parts and an arrangement image of the receiving pin is displayed on the display device, and the receiving pin and The arrangement of the receiving pins is determined while judging whether or not interference with the mounted parts has occurred. Thereby, even when a plurality of components are mounted on the lower surface of the substrate with high density, the arrangement of the receiving pins can be determined so as not to cause interference with these components.

JP 2014-146728 A

  However, the prior art including Patent Document 1 has the following problems. That is, under the form in which the substrate is transported by the substrate transport mechanism using the sensor system, variation in the stop position of the substrate in the substrate transport direction is unavoidable. Therefore, depending on the stop position of the board, the lower receiving pin interferes with the mounted component, and in this state, the lower receiving pin further rises and pushes up the mounted component. State) may occur. Such a situation becomes more prominent as components are mounted on the lower surface of the board with higher density. If mounting work is performed with the board warped and deformed, the mounted parts are abutted against the board and damaged by the receiving pins, and the mounted parts pushed up by the receiving pins are not mounted. There was a risk of mounting failure due to the mounting height, such as damage due to the load. As described above, the conventional technique has a problem that the mounting quality is deteriorated due to the push-up of the mounted component by the receiving pin.

  In view of the above, an object of the present invention is to provide a component mounting method and a component mounting apparatus that can suppress a decrease in mounting quality caused by pushing up a mounted component by a receiving pin.

  The component mounting method of the present invention is a component mounting method for mounting a component on a second surface that is opposite to the first surface on which the component has already been mounted, of the two surfaces forming the front and back of the board, A substrate stopping step of transporting the substrate with the first surface facing downward to stop the substrate within a predetermined stop range, and a lower receiving pin that can be raised and lowered with respect to the substrate stopped in the stop range from below. A substrate support step for receiving and supporting the substrate; a measurement point for measuring a substrate warpage for measuring the substrate warpage set on the second surface of the substrate in a state where the substrate is supported by the support pins; A measuring step for measuring the height of a measurement part for confirming whether the component has been pushed up to confirm whether the component already mounted on the first surface has been pushed up by the receiving pin; Measurement Based on the results, a virtual height calculation step for calculating a virtual height of the measurement point for checking the component push-up, a virtual height of the measurement point for checking the component push-up, and the measurement point for checking the component push-up in the measurement step In the determination step for determining whether or not the difference between the actual height obtained by actual measurement is greater than or equal to a predetermined value, and in the determination step, it is determined that the difference between the virtual height and the actual height is greater than or equal to a predetermined value. A lower support support releasing step of releasing lower support of the substrate by the lower support pins.

  The component mounting apparatus of the present invention is a component mounting apparatus that mounts a component on a second surface that is opposite to the first surface on which the component is already mounted, of the two surfaces forming the front and back of the board, A substrate transport mechanism that transports the substrate in a posture with the first surface facing downward, and a lower receiving pin that can be moved up and down with respect to the substrate transported by the substrate transport mechanism and stopped in a predetermined stop range, from below. A substrate support mechanism for receiving and supporting the substrate; a measurement point for measuring the substrate warpage for measuring the substrate warpage set on the second surface of the substrate in a state where the substrate is supported by the support pins; and A height measuring means for measuring a height of a part push-up confirmation measurement part for confirming whether or not a part already mounted on the first surface is pushed up by the receiving pin; and the board warp measurement part In A virtual height calculation unit that calculates a virtual height of the measurement point for checking the component push-up based on the measurement result, a virtual height of the measurement point for checking the component push-up, and the component push-up confirmation by the height measuring unit. And a determination unit that determines whether or not a difference from an actual height obtained by actually measuring a measurement point is greater than or equal to a predetermined value, wherein the determination unit has a difference between the virtual height and the actual height or greater than a predetermined value If it is determined that there is, the support for the underside of the substrate by the underpin is released.

  According to the present invention, it is possible to suppress deterioration in mounting quality due to pushing up of mounted components by the receiving pins.

The top view which shows the structure of the component mounting apparatus in one embodiment of this invention Structure explanatory drawing of the mounting head with which the component mounting apparatus in one embodiment of this invention is equipped (A) Structure explanatory drawing of the board | substrate conveyance mechanism which comprises the component mounting apparatus in one embodiment of this invention (b) Structure of the board | substrate conveyance mechanism and board | substrate support mechanism which comprise the component mounting apparatus in one embodiment of this invention Illustration (A) (b) Structure explanatory drawing of the board | substrate conveyance mechanism and board | substrate support mechanism which comprise the component mounting apparatus in one embodiment of this invention The top view of the board in one embodiment of the present invention (A) (b) (c) (d) Explanatory drawing which shows the presence or absence of interference with the components 3 mounted in the board | substrate in one embodiment of this invention, and a receiving pin The block diagram which shows the structure of the control system of the component mounting apparatus in one embodiment of this invention (A) (b) Explanatory drawing of the board | substrate data in one embodiment of this invention (A) Explanatory drawing of operation | movement which measures the height of the upper surface of a board | substrate with the height sensor with which the component mounting apparatus in one embodiment of this invention is equipped. (B) Explanatory drawing which shows the approximated curved surface in one embodiment of this invention. (A) Explanatory drawing which shows the curvature deformation | transformation state of the board | substrate in one embodiment of this invention (b) Explanatory drawing which shows the approximate curved surface in this Embodiment The flowchart of the component mounting method in one embodiment of this invention (A) (b) (c) (d) (e) (f) Explanatory drawing of the board | substrate conveyance operation | movement in one embodiment of this invention. (A) Explanatory drawing of measurement operation of board height in one embodiment of the present invention (b) Explanatory drawing of component mounting operation in one embodiment of the present invention (A) Explanatory drawing of substrate support release operation in one embodiment of the present invention (b) Explanatory diagram of imaging operation in one embodiment of the present invention The flowchart which shows the modification of the component mounting method in one embodiment of this invention

  First, a component mounting apparatus according to an embodiment of the present invention will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting the component 3 (FIG. 2) on the substrate 2, and constitutes a component mounting system together with another device (not shown) connected via the communication network 4 and the host computer 5. Hereinafter, the conveyance direction of the substrate 2 is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the direction orthogonal to the horizontal plane is defined as the Z direction. In FIG. 1, the left side of the drawing is defined as upstream, and the right side of the drawing is defined as downstream.

  A substrate transport mechanism 7 is disposed substantially at the center of the base 6. The substrate transport mechanism 7 includes a pair of transport rails 8 extending in parallel in the X direction, receives the substrate 2 to be mounted from the upstream side, transports it in the X direction, and positions it at a predetermined mounting work position. . A pressing member 9 is provided on the upper portion of the transport rail 8. The pressing member 9 presses the side edges of the two opposite sides of the substrate 2 lifted by the substrate support mechanism 28 described later from above.

  On both sides of the substrate transport mechanism 7 in the Y direction, component supply units 10 are arranged, respectively. In the component supply unit 10, a plurality of tape feeders 11 are arranged in parallel in the X direction. The tape feeder 11 intermittently feeds the component 3 held on the carrier tape and supplies it to a component take-out position by a mounting head 14 to be described later.

  A Y-axis beam 12 is provided at one end of the base 6 in the X direction, and two X-axis beams 13 are coupled to the Y-axis beam 12 so as to be movable in the Y direction. A mounting head 14 is mounted on the two X-axis beams 13 so as to be movable in the X direction. The mounting head 14 moves in the horizontal direction by driving the Y-axis beam 12 and the X-axis beam 13.

  In FIG. 2, the mounting head 14 includes a plurality of unit mounting heads 14a. The unit mounting head 14a has a suction nozzle 15 capable of sucking the component 3 at the lower end. The suction nozzle 15 moves up and down by driving a nozzle lifting mechanism 16 provided above the suction nozzle 15. The mounting head 14 picks up and takes out the component 3 supplied from the tape feeder 11 by the suction nozzle 15 and mounts it on the substrate 2 positioned at the mounting work position.

  A height sensor 17 is attached to the mounting head 14. The height sensor 17 is a measuring instrument that can measure displacement in the measuring axis direction without contact, such as a laser displacement system, and can move horizontally with the mounting head 14. The height sensor 17 projects a laser beam on the upper surface of the substrate 2 and receives the reflected light (arrow a) in a state where the substrate 2 is positioned at the mounting work position. Thereby, the height sensor 17 measures the height (position in the Z direction) of the position where the laser light is incident on the substrate 2. The measurement result is used when measuring the warpage of the upper surface of the substrate 2.

  In FIG. 1, a substrate recognition camera 18 that moves integrally with the mounting head 14 is provided on the lower surface of the X-axis beam 13. The board recognition camera 18 images a mark (not shown) of the board 2 positioned at the mounting work position. A component recognition camera 19 is disposed between the substrate transport mechanism 7 and the component supply unit 10. When the mounting head 14 that has taken out the component 3 from the component supply unit 10 moves above the component recognition camera 19, the component recognition camera 19 images the component 3 sucked by the suction nozzle 15 from below.

  Next, the structure of the substrate transport mechanism 7 will be described with reference to FIG. In FIG. 3A, the substrate transport mechanism 7 includes the pair of transport rails 8 described above and a transport belt 20 provided along the transport direction of the substrate 2 inside the transport rail 8. In FIG. 3B, the transport belt 20 is tuned to two pulleys 21 disposed at both ends of the transport rail 8 and a drive pulley 23 of the motor 22. The conveyor belt 20 moves along the conveyor rail 8 by driving the motor 22. Thereby, the board | substrate 2 mounted on the conveyance belt 20 is conveyed toward a downstream. In addition, illustration of the pressing member 9 is abbreviate | omitted in FIG.

  In FIG. 4A, a clamp portion 24 extending in the vertical direction is provided inside the conveyor belt 20 so as to be movable up and down. The clamp portion 24 abuts on both sides of the substrate 2 from below when the sides of the substrate 2 are pressed from above by the pressing member 9. Thereby, both side portions of the substrate 2 are clamped by the pressing member 9 and the clamp portion 24.

  In FIG. 3A, the mounting stage [S] is set in the transport path of the substrate 2 by the substrate transport mechanism 7 in correspondence with the movable range of the mounting head 14. After the board 2 is carried into the mounting stage [S], the board 2 is conveyed and positioned so that the front end face 2a enters the stop range [R]. A first substrate stop sensor 25 is disposed on the transport rail 8 at a position upstream of the stop range [R], and a second substrate stop sensor 26 is disposed at a position downstream of the stop range [R]. Yes. The target stop position E is set at a substantially central position of the stop range [R]. Further, a substrate deceleration sensor 27 is disposed on the transport rail 8 on the upstream side of the first substrate stop sensor 25.

  The substrate deceleration sensor 27, the first substrate stop sensor 25, and the second substrate stop sensor 26 are all transmissive optical sensors. Each of the sensors 25 to 27 is embedded in the transport rail 8 so that the inspection optical axes (arrows b1, b2, and b3) projected from each sensor enter the substrate 2 transported on the transport belt 20. The front end surface 2a of the substrate 2 transported on the transport belt 20 passes through the inspection optical axis projected from the substrate deceleration sensor 27, the first substrate stop sensor 25, and the second substrate stop sensor 26. The sensors 25 to 27 detect the front end surface 2 a of the substrate 2. Detection signals from the sensors 25 to 27 are transmitted to the control unit 40 (FIG. 7) provided in the component mounting apparatus 1.

  When the substrate deceleration sensor 27 detects the front end surface 2 a of the substrate 2, the control unit 40 issues a deceleration command to the motor 22, thereby decelerating the conveyance speed of the substrate 2. When the first substrate stop sensor 25 detects the front end face 2a, the control unit 40 issues a stop command to the motor 22 and thereby the substrate 2 stops. When the second substrate stop sensor 26 detects the front end face 2a, the control unit 40 determines that the substrate 2 has overrun and exceeds the stop range [R].

  As described above, under the form in which the substrate 2 is transported using the optical sensor system, variation in the stop position of the substrate 2 in the transport direction is unavoidable due to contamination of the transport belt 20 or deterioration with time. Therefore, a stop range [R] that allows a predetermined error in the transport direction is set with reference to the target stop position E. When the first substrate stop sensor 25 detects the front end surface 2a and the second substrate stop sensor 26 does not detect the front end surface 2a, the control unit 40 stops the substrate 2 in the stop range [R]. Judge.

  A substrate support mechanism 28 shown in FIGS. 3B and 4 is provided at a position substantially in the center of the substrate transport mechanism 7 and corresponding to the mounting stage [S]. The substrate support mechanism 28 is configured to include a horizontal plate-like lower base portion 29 and a base portion lifting mechanism 30 that raises and lowers the lower base portion 29. The upper surface of the lower receiving base portion 29 is covered with a magnetic material such as a copper plate.

  On the upper surface of the lower receiving base portion 29, a plurality of lower receiving pins 31 that are in contact with the substrate 2 from below and support the lower receiving are detachably provided. In FIG. 3B, the lower receiving pin 31 includes a base portion 32 that contacts the lower receiving base portion 29, a shaft portion 33 that extends above the base portion 32, and an upper end portion of the shaft portion 33. It includes a circular flange portion 34 that extends and a pin-shaped contact portion 35 that extends above the flange portion 34. The base portion 32 has a built-in magnet member 36, and the base portion 32 is fixed to the lower receiving base portion 29 by the attractive force of the magnet member 36.

  When the substrate 2 is stopped in the stop range [R], the lower base portion 29 is raised (arrow c shown in FIG. 4B), so that the contact portion 35 of the lower support pin 31 contacts the substrate 2. Touch. Then, the lower receiving base portion 29 is further raised, so that both side portions of the substrate 2 are in contact with the lower surface of the pressing member 9. Further, in the process of raising the lower receiving base portion 29, the clamp portion 24 is pushed up by the lower receiving base portion 29 and comes into contact with the substrate 2 from below. As a result, the substrate 2 is clamped by the pressing member 9 and the clamp portion 24 at the mounting operation position and is also supported by the lower receiving pins 31. As described above, the substrate support mechanism 28 supports the substrate 2 from below by the lower receiving pins 31 that can be moved up and down with respect to the substrate 2 that is transported by the substrate transport mechanism 7 and stopped within the predetermined stop range [R]. To do.

  In the present embodiment, the substrate 2 to be supported by the support includes a mounting substrate in which the component 3 is mounted on one of the first surface 2b and the second surface 2c forming the front and back of the substrate 2. . In the present embodiment, the first surface 2b will be described as a lower receiving surface supported by the lower receiving pins 31 and the second surface 2c as a mounting target surface.

  FIG. 5 shows a plan view of the substrate 2 on which a plurality of types of components 3 (DIP type components 3a and chip type components 3b) are mounted on the lower receiving surface. When the component 3 is mounted on the mounting target surface of the substrate 2 on which the plurality of components 3 are mounted on the lower receiving surface in the previous process, the arrangement of the lower receiving pins 31 is determined so as not to cause interference with the mounted component 3. There is a need to. That is, the operator determines the position of the lower receiving pin 31 with respect to the lower receiving base portion 29 so that the abutting portion 35 comes into contact with a predetermined portion of the substrate 2 avoiding the mounted component 3. The arrangement of the receiving pins 31 is determined on the assumption that the substrate 2 is accurately stopped at the target stop position E.

  Further, the operator needs to properly arrange the lower receiving pins 31 on the lower receiving base portion 29 so that the substrate 2 can be stably received and supported. However, when a plurality of components 3 are mounted at a high density as in the substrate 2 shown in FIG. 5, some of the lower receiving pins 31 (31 </ b> A) must be arranged at positions adjacent to the mounted components 3. I do not get. Therefore, even if the substrate 2 stops within the stop range [R], when the front end surface 2a of the substrate 2 stops at a position shifted from the target stop position E, the substrate 2 is supported by the support pins 31 so that The following problems occur.

  With reference to FIG. 6, the case where the board | substrate 2 stops correctly at the target stop position E and the case where it is not so are demonstrated and divided. For convenience, the component 3 mounted on the substrate 2 is referred to as a “mounted component”. FIG. 6A shows the substrate 2 that has been accurately stopped at the target stop position E. FIG. When the lower receiving pin 31 is raised (arrow d) as shown in FIG. 6 (b) with respect to the substrate 2 stopped at this position, the contact portion 35 does not interfere with the mounted component 3 * on the lower receiving surface. Abut.

  FIG. 6C shows the substrate 2 whose front end face 2a is shifted by a predetermined amount x1 upstream from the target stop position E, but stopped within the stop range [R]. When the lower receiving pin 31 is raised (arrow e) as shown in FIG. 6D with respect to the substrate 2 stopped at this position, the contact portion 35 interferes with the mounted component 3 *. In this state, when the lower receiving base portion 29 further rises, the lower receiving pins 31 push up the substrate 2 through the mounted component 3 *. The mounted component 3 * may be damaged by the load at the time of pushing up. Further, since both side portions of the substrate 2 are clamped by the pressing member 9 and the clamp portion 24, the substrate 2 is warped upward and convex.

  As described above, when the mounting operation is performed on the substrate 2 that has been warped upward, the component 3 held by the suction nozzle 15 may be pressed against the substrate 2 and be damaged. When the mounting point of the component 3 to be mounted on the mounting target surface is located above the mounted component 3 * on the lower receiving surface, the mounted component 3 * pushed up by the lower receiving pin 31 is There is a risk of damage due to load. The component mounting apparatus 1 according to the present embodiment is intended to prevent a situation in which the mounting operation is performed while the mounted component 3 * is pushed up by the receiving pin 31 in advance.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 40 included in the component mounting apparatus 1 includes a storage unit 41, a mechanism driving unit 42, a recognition processing unit 43, a warpage measurement unit 44, a virtual height calculation unit 45, and a determination unit 46. The control unit 40 includes a substrate transport mechanism 7, a Y-axis beam 12, an X-axis beam 13, a mounting head 14, a nozzle lifting mechanism 16, a height sensor 17, a substrate recognition camera 18, a component recognition camera 19, and a base portion lifting mechanism. 30, connected to the display unit 47.

  The storage unit 41 stores mounting data 48, component data 49, height measurement data 50, backing pin arrangement data 51, and the like. The mounting data 48 is data for mounting the component 3 on the board 2 and includes, for example, information such as the XY coordinates of the mounting point of the component 3 and the mounting angle of the component 3. The component data 49 is data including information on the component 3. For example, the size and shape of the component 3, the descending stroke when the suction nozzle 15 descends and mounts the component 3 on the substrate 2, that is, the mounting height of the component 3. Contains information about security.

  As shown in FIG. 8A, the height measurement data 50 includes the XY coordinates of the measurement points S1 to S9 for the substrate warpage for measuring the substrate warpage set on the mounting target surface of the substrate 2, the lower surface ( Including the XY coordinates of the measurement points T1 to T4 for confirming whether or not the component 3 (mounted component 3 *) already mounted on the first surface 2b) is thrust by the receiving pin 31 . The measurement points S1 to S9 for substrate warpage are locations set in order to measure warpage of the upper surface of the substrate 2. The height sensor 17 measures the height of the substrate 2 by projecting a laser beam to the measurement points S1 to S9 for substrate warpage and receiving the reflected light.

  In the measurement points T1 to T4 for confirming the component push-up, the component 3 (mounted component 3 *) mounted on the lower receiving surface is pushed up by the lower receiving pin 31 when the substrate 2 is supported by the lower receiving pin 31. It is a part set to confirm whether it is not done. In addition to the measurement points S1 to S9 for board warpage, the height sensor 17 also measures the height of the board 2 at the measurement points T1 to T4 for checking component push-up. The height sensor 17 includes the measurement points S1 to S9 for substrate warpage set on the mounting target surface (first surface 2b) of the substrate 2 in a state where the support is supported by the support pins 31, and the support pins 31. This is a height measuring means for measuring the height of the substrate 2 at the measurement points T1 to T4 for confirming the component push-up.

  Next, an example of setting the measurement points T1 to T4 for confirming the component push-up will be described. FIG. 8B shows the positional relationship between the component 3 (DIP type component 3a, chip type component 3b) mounted on the lower receiving surface of the substrate 2, the lower receiving pin 31, and the measurement locations S1 to S9 and T1 to T4. Indicates. For example, the component 3b1 is mounted at a position very close to the lower receiving pin 31A (strictly, the contact portion 35). Even when the front end face 2a is within the stop range [R], when the substrate 2 that has stopped from the target stop position E is supported by the support pins 31A, such a component 3b1 is supported by the support pins 31A. There is a risk of being pushed up by interference. The operator sets a component push-up confirmation measurement location on the mounting target surface corresponding to the mounting position of the component 3 that may be pushed up by the receiving pin 31A, like the component 3b1. In this way, the measurement points T1 to T4 for confirming the component push-up are set to locations where the lower receiving pins 31 may interfere with the component 3 mounted on the first surface 2b as the lower receiving surface. Further, whether or not the mounted component 3 is likely to be pushed up by the lower receiving pin 31 is determined based on the adjacent distance between the mounted component 3 and the lower receiving pin 31 (contact portion 35).

  Note that the measurement points S1 to S9 for board warpage are locations where interference between the mounted component 3 and the receiving pin 31 is assumed not to occur, in other words, the adjacent distance between the mounted component 3 and the receiving pin 31 is It is preferable to select a large portion. Accordingly, even when the mounted component 3 and the receiving pin 31 interfere with each other when the substrate 2 is supported by the support, the influence of the substrate 2 can be suppressed as much as possible and the warpage of the substrate 2 can be measured more accurately. Can do.

  The support pin arrangement data 51 is data indicating position information of the individual support pins 31 with respect to the support base portion 29, and is prepared for each type of the substrate 2.

  The mechanism driving unit 42 is controlled by the control unit 40 to drive the substrate transport mechanism 7, the Y-axis beam 12, the X-axis beam 13, the mounting head 14, the nozzle lifting mechanism 16, and the base lifting mechanism 30. As a result, a conveyance / stop operation for conveying the substrate 2 and stopping it within the stop range [R] and a mounting operation for mounting the component 3 on the substrate 2 are executed.

  The recognition processing unit 43 detects the mark and the component 3 on the substrate 2 by performing recognition processing on the imaging data acquired by the substrate recognition camera 18 and the component recognition camera 19. The detection result of the mark on the substrate 2 and the component 3 is used when the mounting head 14 is aligned with the substrate 2.

  The warpage measurement unit 44 measures the warpage of the upper surface of the substrate 2 based on the height measurement results of the measurement points S1 to S9 for substrate warpage. More specifically, as shown in FIG. 9A, the warpage measurement unit 44 calculates the height of the substrate 2 at the measurement points S1 to S9 for substrate warpage measured by the height sensor 17. Thus, the displacement amount h in the Z direction from the reference surface 2d in each of the measurement points S1 to S9 for substrate warpage is obtained. The reference surface 2d refers to the mounting target surface of the substrate 2 in a state where the flat substrate 2 without warping or deformation is transported on the transport belt 20. And the curvature measurement part 44 calculates the approximate curved surface 52 which approximates the shape of the upper surface of the board | substrate 2 based on the displacement amount h in measurement location S1-S9 for board | substrate curvature (FIG.9 (b)).

  In FIG. 9B, the approximate curved surface 52 is a numerical formula obtained by analyzing the tendency of the overall warpage and deformation of the upper surface of the substrate 2 based on the displacement amount h from the reference surface 2d at the measurement points S1 to S9 for substrate warpage. It has become. The approximate curved surface 52 is such that all locations are represented by the XYZ coordinate system.

  The virtual height calculation unit 45 refers to the approximate curved surface 52 and calculates the virtual height of the measurement points T1 to T4 for confirming the part push-up. Using FIG. 9B as an example, the measurement point T1 for confirming the component push-up is taken as an example. The virtual height calculation unit 45 calculates the approximate curved surface 52 from the XY coordinates (xt1, yt1) of the mounting target surface corresponding to the point T1. The Z coordinate (zt1), which is the displacement amount h in the XY coordinates, is calculated. This Z coordinate (zt1) is the value of the virtual height of the measurement point T1 for confirming the component push-up. As described above, by using the approximate curved surface 52 calculated based on the measurement results of the measurement points S1 to S6 for board warpage, the virtual height of each of the measurement points T1 to T4 for confirming the push-up of components can be calculated. . That is, the virtual height calculation unit 45 calculates the virtual heights of the measurement points T1 to T4 for confirming component push-up based on the measurement results at the measurement points S1 to S6 for board warpage.

  The determination unit 46 determines whether the receiving pin 31 is based on the difference between the virtual height of the measurement points T1 to T4 for confirming the component push-up and the actually measured height obtained by the height sensor 17. It is determined whether or not it interferes with the mounted component 3 *, in other words, whether or not the mounted component 3 * is pushed up by the receiving pin 31.

  Here, the details of the determination method by the determination unit 46 will be described with reference to FIG. FIG. 10A shows a state in which the mounted component 3 * mounted at a predetermined position on the lower surface corresponding to the measurement point T1 for confirming the component push-up interferes with the lower pin 31. FIG. FIG. 10B is an approximate curved surface 52 of the substrate 2 shown in FIG. As shown in FIGS. 10A and 10B, the actual height (the Z direction from the reference surface 2d), which is the height obtained by actually measuring the measurement point T1 for checking the component push-up by the height sensor 17. And the virtual height calculated based on the approximate curved surface 52 (displacement amount h2 in the Z direction from the reference surface 2d), there is a difference ha due to the thrust by the receiving pin 31. Arise. The determination unit 46 determines the presence or absence of interference of the receiving pin 31 based on whether or not the difference ha is greater than or equal to a predetermined value. When the difference ha is greater than or equal to a predetermined value, the control unit 40 determines that the receiving pin 31 interferes with the mounted component 3 *. Thus, the determination part 46 is the height obtained by actually measuring the measurement points T1 to T4 for checking the component push-up by the virtual height of the measurement points T1 to T4 for checking the component push-up and the height measuring means. It is determined whether or not the difference from the measured height is greater than or equal to a predetermined value.

  The display unit 47 is a display device such as a monitor, and is used to notify an operator of an error when an error occurs during production or a guidance screen necessary for producing the board 2 on which the component 3 is mounted. Display the screen.

  The component mounting apparatus 1 in the present embodiment is configured as described above. Next, referring to the flowchart of FIG. 11 and the operation explanatory diagrams shown in FIGS. 12 to 14, the first surface 2 b opposite to the first surface 2 b on which the component 3 has already been mounted out of the two surfaces forming the front and back of the substrate 2. A component mounting method for mounting the component 3 on the second surface 2c will be described. First, as shown in FIG. 12A, the substrate transport mechanism 7 loads the substrate 2 from the upstream side. And the board | substrate conveyance mechanism 7 conveys the board | substrate 2 of the attitude | position which turned the 1st surface 2b downward (arrow f) (ST1: conveyance process).

  Next, the control unit 40 controls the substrate transport mechanism 7 to execute a stop operation for stopping the substrate 2 within the stop range [R] (ST2: substrate stop step). That is, as shown in FIG. 12B, if the substrate deceleration sensor 27 detects the front end surface 2 a of the substrate 2 in the process of continuously transporting the substrate 2 to the downstream side (arrow g), the control unit 40 controls the motor 22 to decelerate the conveyance speed of the substrate 2 to a preset stopping speed. Next, as shown in FIG. 12 (c), if the first substrate stop sensor 25 detects the front end surface 2a of the substrate 2 in the process in which the substrate 2 is continuously conveyed downstream (arrow i), The control unit 40 stops driving the motor 22. That is, in this step (ST2), the substrate 2 with the first surface 2b facing downward is transported and stopped so as to fall within the predetermined stop range [R].

  After stopping the driving of the motor 22, the control unit 40 determines whether the first substrate stop sensor 25 and the second substrate stop sensor 26 have detected the front end surface 2a of the substrate 2 or not. It is determined whether or not the stop position is within the stop range [R] (ST3: first determination step). That is, when the first substrate stop sensor 25 detects the front end surface 2a of the substrate 2 and the second substrate stop sensor 26 does not detect the front end surface 2a of the substrate 2, as shown in FIG. The control unit 40 determines that the actual stop position of the substrate 2 is within the stop range [R]. 12E, when the second substrate stop sensor 26 detects the front end surface 2a of the substrate 2, the control unit 40 determines that the actual stop position of the substrate 2 exceeds the stop range [R]. Judge that The substrate 2 may stop before the front end face 2a enters the stop range [R]. That is, when the first substrate stop sensor 25 does not detect the front end surface 2a of the substrate 2, the control unit 40 determines that the actual stop position of the substrate 2 is not within the stop range [R].

  When it is determined in (ST3) that it is not within the stop range [R], the adjustment operation of the stop position of the substrate 2 is executed (ST4: stop position adjustment step). That is, as shown in FIG. 12 (f), the control unit 40 drives the motor 22 to return the substrate 2 so that the front end surface 2 a is positioned upstream of the substrate deceleration sensor 27 (arrow j). Next, the substrate transport mechanism 7 transports the substrate 2 again downstream. And the control part 40 performs the stop operation | movement of the board | substrate 2 based on the detection result of the front-end surface 2a of the board | substrate 2 by the board | substrate deceleration sensor 27 and the board | substrate stop sensor 25 as above-mentioned. Thereafter, returning to (ST3), the control unit 40 determines whether or not the actual stop position of the substrate 2 is within the stop range [R].

  When it is determined in (ST3) that the actual stop position of the substrate 2 is within the stop range [R], the substrate support mechanism 28 performs the support support of the substrate 2 (ST5: support support step). That is, the lower base portion 29 rises with respect to the substrate 2. Then, in the process of raising the lower receiving base portion 29, the lower receiving surface (first surface 2 b) of the substrate 2 is supported by the lower receiving pins 31, and both sides of the substrate 2 are clamped with the pressing member 9. Clamped by part 24. That is, in this step (ST5), the substrate 2 is received and supported from below by the lower receiving pins 31 that can move up and down with respect to the substrate 2 stopped within the stop range [R].

  Next, as shown in FIG. 13A, the height sensor 17 is a measurement for substrate warpage set on the mounting target surface (second surface 2c) of the substrate 2 in a state where the height sensor 17 is supported by the lower receiving pins 31. The height of the board | substrate 2 of location S1-S9 and measurement location T1-T4 for component pushing-up confirmation is measured (ST6: measurement process). The measurement order of the measurement points S1 to S9 for substrate warpage and the measurement points T1 to T4 for confirming the part push-up is arbitrary. Further, the height sensor 17 may appropriately select and measure the measurement points close to the actually measured measurement points without distinguishing between the measurement points S1 to S9 for board warpage and the measurement points T1 to T4 for confirming the part push-up. Good. Taking the substrate 2 shown in FIG. 8A as an example, the height sensor 17 measures S1, S2, S3, T2, S6, S5, T1, S4, S7, T3, S8, T4, and S9 in this order. May be. Thereby, the work tact for height measurement is improved.

  Next, the warpage measurement unit 44 calculates the approximate curved surface 52 based on the measurement results of the heights of the measurement points S1 to S9 for substrate warpage (ST7: approximate curved surface calculation step). Next, the virtual height calculation unit 45 refers to the approximate curved surface 52 and calculates Z coordinates corresponding to the individual component push-up confirmation measurement locations T1 to T5. That is, in this step (ST8), the virtual heights of the measurement points T1 to T5 for confirming the component push-up are calculated based on the measurement results of the heights of the measurement points S1 to S9 for board warpage.

  Next, the determination unit 46 actually uses the virtual height of the component push-up confirmation measurement points T1 to T4 calculated in the virtual height calculation step (ST8) and the component push-up confirmation measurement points T1 to T4 in the measurement step (ST6). It is determined whether or not the difference from the actually measured height obtained by measurement is greater than or equal to a predetermined value (ST9: second determination step). Here, the determination is made for each of the measurement points T1 to T4 for confirming the push-up of each component.

  When it is determined in (ST9) that the difference between the virtual height and the actually measured height is not greater than a predetermined value, the control unit 40 determines that the mounted component 3 * is not pushed up by the receiving pin 31. Next, a component mounting operation by the mounting head 14 is executed (ST10: mounting process). That is, the mounting head 14 moves to the upper side of the substrate 2 after taking out the component 3 from the tape feeder 11. Next, as shown in FIG. 13B, the suction nozzle 15 descends with respect to the substrate 2 (arrow k), and the component 3 is mounted on the mounting target surface of the substrate 2. At this time, the control unit 40 calculates the correction amount of the mounting height of the component 3 with reference to the approximate curved surface 52, and controls the driving of the nozzle lifting mechanism 16 based on the correction amount. As described above, in (ST10), if the difference between the virtual height and the actually measured height is not a predetermined value or more as a result of the determination in the second determination step (ST9), the component 3 is mounted on the substrate 2.

  If it is determined in (ST9) that the difference between the virtual height and the actually measured height is greater than or equal to a predetermined value, an operation for releasing the support under the substrate 2 is executed (ST11: support support releasing step). That is, as shown in FIG. 14A, the lower base portion 29 is lowered with respect to the substrate 2 (arrow l). Then, in the process of lowering the lower receiving base portion 29, the clamps on both sides of the substrate 2 by the pressing member 9 and the clamp portion 24 are released, and then the substrate 2 is placed on the conveyor belt 20. Thereafter, the lower receiving base portion 29 is further lowered, so that the contact portion 35 of the lower receiving pin 31 is separated from the lower receiving surface of the substrate 2. That is, in this step (ST11), when it is determined in the second determination step (ST9) that the difference between the virtual height and the actually measured height is greater than or equal to a predetermined value, the support support of the substrate 2 by the support pins 31 is supported. To release. As a result, it is possible to avoid a situation in which the component 3 is mounted on the substrate 2 in a state where the receiving pin 31 and the mounted component 3 * interfere with each other, and it is possible to suppress a decrease in mounting quality.

  Next, the control unit 40 determines whether or not the number of times of releasing the support for the specific substrate 2 has reached a predetermined number (ST12: third determination step). If the number of cancellations has not reached the predetermined number, the process returns to (ST4) and the adjustment operation of the stop position of the substrate 2 is executed again. Since the specific operation is as described above, the description is omitted. That is, in the stop position adjustment step (ST4), after the support of the substrate 2 is released in the support support release step (ST11), the stop position of the substrate 2 is adjusted.

  In addition, when the number of times of releasing the support of the specific substrate 2 in the support support releasing step (ST11) reaches a predetermined number, the control unit 40 notifies an error via the display unit 47 (ST13: notification process). . When the number of times of release occurs more than a predetermined number, it is assumed that the position of the lower receiving pin 31 with respect to the lower receiving base portion 29 is shifted. Therefore, the operator who has received the error notification interrupts the production and inspects whether the position of the receiving pin 31 is shifted. Thus, the control unit 40 and the display unit 47 also function as notification means for notifying an operator of an error. Note that the error notification configuration is not limited to the above, and for example, a warning lamp may be lit.

  Next, a modified example of the component mounting method will be described with reference to the flowchart of FIG. In addition, the same step number is attached | subjected about the already demonstrated process, and detailed description is abbreviate | omitted. The component mounting method described in the present embodiment is different from the modification described below in that the following steps are newly added before error notification (ST13). That is, in (ST12), after it is determined that the number of times the support for receiving the substrate 2 has been released has reached a predetermined number, as shown in FIG. In the returned state, the board recognition camera 18 images the receiving pins 31 corresponding to the component push-up confirmation measurement points T1 to T4 for which it is determined that the difference between the virtual height and the mounting height is greater than or equal to a predetermined value (ST14: Imaging process). ). Next, the recognition processing unit 43 identifies the position of the receiving pin 31 by performing a recognition process on the imaging data. Then, the control unit 40 determines, based on the receiving pin arrangement data 51, whether or not the specified receiving pin 31 has been displaced with respect to the receiving base unit 29 (ST15: fourth determination step). . Thereafter, the control unit 40 notifies the error via the display unit 47 and displays the determination result (ST13). As a result, the operator can easily determine the cause of the interference of the receiving pin 31 with the mounted component 3 *.

  The present invention is not limited to the embodiments described so far, and can be modified without departing from the spirit of the invention. For example, the host computer 5 may be provided with the functions of the warp measurement unit 44, the virtual height calculation unit 45, and the determination unit 46. In addition, various data such as the mounting data 48 may be stored in a storage unit included in the host computer 5, and the component mounting apparatus 1 may read various data as necessary. Further, the lower receiving pin 31 may have a simplified structure by omitting the flange portion 34.

  According to the present invention, it is possible to suppress a reduction in mounting quality, which is useful in the field of electronic component mounting.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 2b 1st surface 2c 2nd surface 3 Components 7 Board | substrate conveyance mechanism 17 Height sensor 28 Board support mechanism 29 Bottom receiving base part 30 Base part raising / lowering mechanism 31 Bottom receiving pin 45 Virtual height calculation part 46 Judgment part R Stopping range S1 to S9 Measurement points for substrate warpage T1 to T4 Measurement points for confirming component push-up

Claims (4)

A component mounting method for mounting a component on a second surface that is opposite to the first surface on which the component has already been mounted, of the two surfaces forming the front and back of the board,
A substrate stopping step of transporting the substrate in a posture in which the first surface is directed downward and stopping the substrate within a predetermined stop range;
A substrate support step of receiving and supporting the substrate from below by a receiving pin that can be raised and lowered with respect to the substrate stopped in the stop range;
A board warpage measurement point for measuring board warpage set on the second face of the board in a state of being supported by the lower support pin and a component already mounted on the first face. A measuring step for measuring the height of the measurement point for confirming whether or not the component has been pushed up to confirm whether it has been pushed up by the receiving pin;
Based on the measurement result at the measurement point for substrate warpage, a virtual height calculation step for calculating the virtual height of the measurement point for checking the component push-up,
A determination step of determining whether or not there is a difference between a virtual height of the measurement point for confirmation of component push-up and an actual height obtained by actually measuring the measurement portion for confirmation of component push-up in the measurement step; ,
In the determination step, when it is determined that the difference between the virtual height and the actually measured height is greater than or equal to a predetermined value, a lower support support releasing step of releasing the lower support of the substrate by the lower support pins;
A component mounting method including:   The component mounting method according to claim 1, further comprising a stop position adjustment step of adjusting a stop position of the substrate after releasing the support support of the substrate in the support support release step.   3. The component mounting method according to claim 1, further comprising a notifying step of notifying an error when the number of times of releasing the under-support of the board reaches a predetermined number in the under-support support releasing step. A component mounting apparatus that mounts a component on a second surface that is the opposite surface of the first surface on which the component is already mounted, of the two surfaces forming the front and back of the board,
A substrate transport mechanism for transporting the substrate in a posture in which the first surface is directed downward;
A substrate support mechanism for receiving and supporting the substrate from below by a lower receiving pin that can be raised and lowered with respect to the substrate that has been transferred by the substrate transfer mechanism and stopped within a predetermined stop range;
A board warpage measurement point for measuring board warpage set on the second face of the board in a state of being supported by the lower support pin and a component already mounted on the first face. Height measuring means for measuring the height of the measurement part for confirming whether or not the component is pushed up to confirm whether or not it is pushed up by the receiving pin,
Based on the measurement result at the measurement point for board warpage, a virtual height calculation unit that calculates the virtual height of the measurement point for checking the component push-up,
Determining whether or not the difference between the virtual height of the part push-up confirmation measurement location and the actual height obtained by actually measuring the part push-up confirmation measurement location by the height measurement means is greater than or equal to a predetermined value With
The component mounting apparatus, wherein when the determination unit determines that the difference between the virtual height and the actually measured height is greater than or equal to a predetermined value, the base support of the substrate by the base pins is released.

Images