JP2016152236A - Component mounting apparatus and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method capable of precisely recognizing the position of an insertion hole while preventing increase in device cost and device size.SOLUTION: The component mounting apparatus includes: a board transfer mechanism 2 for positioning a board 3 (board positioning part); a support plate 21 on which a bottom support pin module 22 (bottom support pin) is disposed for supporting the bottom face of the board 3 positioned by the board transfer mechanism 2; an illumination unit 12a which is disposed above the board 3 to emit light downward; and a reflection module 30 (reflection member) which is detachably disposed on the support plate 21 to reflect upward the light emitted from the illumination unit 12a. The reflection module 30 is disposed below an insertion hole H which is formed in the board 3 positioned by the board transfer mechanism 2.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting an insertion component on a substrate.

  A component mounting apparatus that manufactures a mounting board in which an insertion component is mounted on a board recognizes the position of an insertion hole for inserting a lead of the insertion part provided on the board, and the insertion part is placed on the board based on the recognition result. Inserting. When recognizing the insertion hole, in order to recognize the insertion hole with high accuracy, light is irradiated from below the substrate toward the insertion hole (see, for example, Patent Document 1). In the image recognition device described in Patent Document 1, illumination for irradiating light toward the insertion hole is provided below the substrate, a line sensor for imaging the insertion hole is provided above the substrate, and the line sensor and illumination are at a constant speed. The position of the insertion hole is recognized on the entire surface of the substrate while being moved.

Japanese Patent Laid-Open No. 10-4296

  In recent years, a mounting board in which an insertion component and a surface mounting component are mixedly mounted on a single substrate (hereinafter referred to as “mixed mounting substrate”) has been manufactured. Such a mixed mounting board is manufactured by a component mounting apparatus for surface mounting components, but it is necessary to accurately recognize the position of the insertion hole also in this component mounting apparatus. However, the structure of the component mounting apparatus for surface mounting components and the conventional component mounting apparatus for insertion components are greatly different. For this reason, it is difficult to provide the illumination mechanism for recognizing the insertion hole of Patent Document 1 as it is in the component mounting apparatus due to problems such as apparatus cost and increase in apparatus size.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method for mounting an insertion component on a substrate, which can accurately recognize the position of the insertion hole while suppressing an increase in device cost and device size.

  A component mounting apparatus according to the present invention is disposed above a board, a board positioning part that positions the board, a support plate on which a lower receiving pin that supports the lower surface of the board positioned by the board positioning part is disposed. An irradiating unit that irradiates light downward, and a reflective member that is detachably disposed on the support plate and reflects light emitted from the irradiating unit upward, the reflective member including the substrate It arrange | positions under the insertion hole provided in the said board | substrate positioned by the positioning part.

  The component mounting method according to the present invention includes a lower receiving pin arrangement step of arranging a lower receiving pin for supporting a lower surface of a positioned board on a support plate, and an upper side of the positioned board and light downwardly. A reflection member arranging step of arranging, on the support plate, a reflection member that reflects light irradiated from the irradiation unit that irradiates the reflection plate, and in the reflection member arrangement step, the reflection member is placed on the positioned substrate. It arrange | positions under the insertion hole provided in.

  According to the present invention, the position of the insertion hole can be recognized with high accuracy while suppressing the device cost and the device size.

The top view which shows the structure of the component mounting apparatus of embodiment of this invention Structure explanatory drawing of the board | substrate conveyance mechanism and board | substrate holding | maintenance part in the component mounting apparatus of embodiment of this invention (A) Configuration explanatory diagram of a receiving pin module, (b) Configuration explanatory diagram of a reflection module, which is arranged on a board holding portion of a component mounting apparatus according to an embodiment of the present invention. (A) Explanatory drawing of arrangement | positioning operation | work of receiving pin module arrange | positioned at the board | substrate holding part of the component mounting apparatus of embodiment of this invention, (b) Explanatory drawing of arrangement | positioning operation | work of a reflection module The (a) partial sectional view explaining the imaging operation of the insertion hole in the component mounting device of an embodiment of the invention, (b) partial top view The block diagram which shows the structure of the control system of the component mounting apparatus of embodiment of this invention The flowchart which shows the component mounting operation | work by the component mounting apparatus of embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. Hereinafter, the substrate transport direction (left-right direction of the paper surface of FIG. 1) is the X direction, the X-axis direction is orthogonal to the horizontal plane (the vertical direction of the paper surface of FIG. 1), the Y direction, and the horizontal direction (FIG. 2). The vertical direction) is defined as the Z direction.

  First, the overall configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting components on a board held by a board holding unit. In FIG. 1, the board | substrate conveyance mechanism 2 is arrange | positioned along the X direction in the center part of the base 1a. The board transport mechanism 2 has a function of transporting the board 3 that is the target of the component mounting work carried in from the upstream side, and is positioned and held at the mounting work position where the component mounting work is performed by the component mounting mechanism described below. I have. That is, the substrate transport mechanism 2 serves as a substrate positioning unit that positions the substrate 3 at the mounting work position.

  On both outer sides along the Y direction of the substrate transport mechanism 2, component supply units 4 that supply components to be mounted are arranged. The component supply unit 4 includes a plurality of types of components P (including a surface mount component PS to be mounted on the surface of the substrate 3 and an insert component PT to be mounted by inserting the lead TT into an insertion hole H provided in the substrate 3. (See FIG. 5A). A plurality of tape feeders 5 are arranged in parallel in the one-side component supply unit 4A. The tape feeder 5 has a function of pitch-feeding the component P held on the carrier tape to the take-out position by the component mounting mechanism.

  A tray feeder 6 is arranged in the component supply unit 4B on the other side. The tray feeder 6 supplies the tray 6a in which the component P is stored to the take-out position by the component mounting mechanism. A Y-axis moving table 7 is disposed at one end in the X direction on the upper surface of the base 1a. Two X-axis movement tables 8A and 8B are coupled to the Y-axis movement table 7 so as to be slidable in the Y direction. A mounting head 9 is mounted on each of the X-axis moving tables 8A and 8B so as to be slidable in the X direction.

  The mounting head 9 is a multiple head composed of a plurality of unit holding heads 10. At the lower end of the unit holding head 10, a suction nozzle 10a (see FIG. 5) for component suction mounted on the nozzle holder is mounted. The suction nozzle 10a holds the component P to be mounted by vacuum suction from the tape feeder 5 or the tray 6a. The Y-axis moving table 7 and the X-axis moving tables 8A and 8B constitute a head moving mechanism that moves the mounting head 9.

  By driving the head moving mechanism, the mounting head 9 moves between the component supply unit 4 and the substrate 3 positioned and held by the substrate holding unit 2c. As the suction nozzle 10 a moves up and down, the mounting head 9 takes out the component P from the component supply unit 4 and holds it by suction, and mounts the sucked and held component P on the substrate 3. The head moving mechanism that moves the mounting head 9 and the mounting head 9 constitutes a component mounting mechanism 11 that takes out the component P from the component supply unit 4 and mounts it on the substrate 3.

  A substrate recognition camera 12 and an irradiation unit 12a that move integrally with the mounting head 9 are mounted on the lower surfaces of the X-axis moving tables 8A and 8B (see FIG. 5A). By driving the head moving mechanism to move the substrate recognition camera 12 above the substrate 3 held by the substrate transport mechanism 2, the substrate recognition camera 12 images the substrate 3 from above. The irradiation unit 12a includes a light source that emits light, such as an LED, and is disposed above the substrate and has a function of irradiating light downward. As the light source, any light source such as a fluorescent lamp or an organic EL illumination can be used in addition to the LED.

  A component recognition camera 13, a first nozzle storage unit 14, and a second nozzle storage unit 15 are disposed between the component supply unit 4 and the substrate transport mechanism 2. The component recognition camera 13 images the component P held by the mounting head 9 by performing a scanning operation in which the mounting head 9 taking out the component from the component supply unit 4 passes above the component recognition camera 13 in a predetermined direction. To do.

  In the first nozzle storage portion 14, a plurality of suction nozzles 10a mounted on the nozzle holder of the unit holding head 10 are stored and held corresponding to the component types. Similarly, the second nozzle storage unit 15 is provided with a pin holding nozzle 10b (FIG. 4A) that is mounted on the nozzle holder of the unit holding head 10 and is used for transferring a receiving pin module and a reflection module described later. Is stored and held. The mounting head 9 accesses the first nozzle storage portion 14 and the second nozzle storage portion 15 to perform the nozzle replacement operation, so that the nozzle mounted on the unit holding head 10 is in accordance with the purpose and the target component type. Can be exchanged.

  With reference to FIG. 2, the structure and function of the substrate transport mechanism 2 will be described. As shown in FIG. 2A, the substrate transport mechanism 2 is composed of two transport rails 2a arranged in parallel. A conveyor mechanism 2d is provided inside the transport rail 2a along the transport direction. By driving the conveyor mechanism 2d with both end portions of the substrate 3 in contact with the upper surface of the conveyor mechanism 2d, the substrate 3 is transported in the substrate transport direction.

  A holding member 2b is provided at the upper end of each transport rail 2a. A substrate holding portion 2 c is disposed at the center of the substrate transport mechanism 2 in correspondence with the mounting work position by the component mounting mechanism 11. The substrate holding part 2 c includes a lifting mechanism 20 and a support plate 21. The elevating mechanism 20 moves the horizontal plate-like support plate 21 up and down (arrow a).

  The support plate 21 is configured such that the upper surface of a plate member made of a nonmagnetic material such as aluminum is covered with a magnetic material such as a steel plate. A lower receiving pin module 22 (lower receiving pin) that supports the lower surface of the substrate 3 positioned by the substrate transfer mechanism 2 (substrate positioning unit) is disposed on the upper surface of the support plate 21. A magnet member (not shown) is built in the base 23 of the lower receiving pin module 22 that contacts the support plate 21.

  The lower receiving pin module 22 is detachably disposed at an arbitrary position on the support plate 21 according to the lower receiving position of the substrate 3 to be received. The arranged lower receiving pin module 22 is fixed to the support plate 21 by attractive force acting between the magnet member built in the base 23 and the magnetic body on the surface of the support plate 21.

  In addition, as a fixed form of the support pin module 22 (the reflection module mentioned later is also the same), it is not necessarily limited to the method using the printing magnetic force by a magnet member. For example, a method of holding the position of the lower receiving pin module 22 by its own weight or a mounting hole for holding the position of the lower receiving pin module 22 in the support plate 21 so that the lower receiving pin module 22 is inserted and fixed. It may be.

  A clamp portion 2e is disposed on the support plate 21 below the pressing member 2b. As shown in FIG. 2 (b), by driving the lifting mechanism 20 to raise the support plate 21 (arrow b), the upper end portion of the lower receiving pin module 22 and the upper end portion of the clamp portion 2 e are placed on the lower surface of the substrate 3. Abut. When the support plate 21 is further raised, the substrate 3 is received and held by the substrate holding portion 2c, and both end portions of the substrate 3 are pressed against the lower surface of the pressing member 2b to be fixed in position.

  Next, the configuration of the receiving pin module 22 will be described with reference to FIG. The underpinning pin module 22 is disposed at an arbitrary position on the support plate 21 and has a function of receiving and supporting the substrate 3 from the lower surface side. The lower receiving pin module 22 has a lower shaft portion 24 </ b> A extending upward from a base portion 23 that contacts the support plate 21. A hook-like portion 25 is provided on the upper end portion of the lower shaft portion 24A. The hook-like portion 25 is used when the lower receiving pin module 22 is sucked and held by the pin holding nozzle 10b that is detachably attached to the unit holding head 10. An upper shaft portion 24B having a smaller diameter than the lower shaft portion 24A extends above the bowl-shaped portion 25.

  Next, the configuration of the reflection module 30 will be described with reference to FIG. The reflection module 30 (reflection member) is detachably disposed at an arbitrary position on the support plate 21, and has a function of reflecting light emitted from the irradiation unit 12a disposed above upward. The reflection module 30 includes a base portion 31 and a main body portion 32 that are in contact with the support plate 21. The base 31 contains a magnet member (not shown). The reflection module 30 is fixed to the support plate 21 by an attractive force acting between the magnet member and the magnetic body on the surface of the support plate 21.

  A main body 32 is erected on the base 31. A mirror 33 (reflecting part) that reflects light upward is provided on the upper part of the main body part 32. The mirror 33 at the upper part of the main body 32 may be a plate-shaped mirror that is separately prepared, or may be formed by processing the upper surface of the main body 32 into a mirror surface by polishing or plating. The pin holding nozzle 10b attached to the unit holding head 10 contacts the mirror 33 from above and sucks and holds the reflection module 30.

  Next, with reference to FIG. 4, the arrangement | positioning operation | work of the receiving pin module 22 and the reflection module 30 is demonstrated. These arrangement operations are performed using a transfer function by the mounting head 9 in which the pin holding nozzle 10b is mounted on the nozzle holder of the unit holding head 10 without holding the substrate 3 on the substrate transport mechanism 2.

  As shown in FIG. 4A, in the placement work of the lower receiving pin module 22, the component mounting mechanism 11 moves in a state where the upper surface of the hook-like portion 25 of the lower receiving pin module 22 is sucked and held by the pin holding nozzle 10b. Thus, the lower receiving pin module 22 is arranged at a desired position on the support plate 21 (arrow c). That is, the mounting head 9 in which the pin holding nozzle 10 b is mounted on the nozzle holder of the unit holding head 10 becomes a lower receiving pin holding head that holds the lower receiving pin module 22 (lower receiving pin) and is arranged on the support plate 21.

  As shown in FIG. 4B, in the placement operation of the reflection module 30, the component mounting mechanism 11 supports the reflection module 30 by moving in a state where the upper surface of the reflection module 30 is sucked and held by the receiving pin holding head. It arrange | positions in the desired position on the plate 21 (arrow d). That is, the reflection module 30 (reflection member) is held on the support pin holding head and disposed on the support plate 21. By this arrangement work, the reflection module 30 (reflection member) is positioned below the insertion hole H into which the lead TT of the insertion part PT provided on the substrate 3 positioned and held by the substrate transport mechanism 2 (substrate positioning unit) is inserted. It is arranged at the position.

  Next, the position recognition process of the insertion hole H will be described with reference to FIG. As shown in FIG. 5A, when the insertion part PT is mounted on the substrate 3, the insertion hole is moved by the board recognition camera 12 moved above the insertion hole H (H *) into which the lead TT of the insertion part PT is inserted. H * is imaged. At the time of imaging, light is irradiated downward from the irradiation unit 12a (arrow e). Light irradiated from the irradiation unit 12a, passing through the insertion hole H * provided in the substrate 3 and entering the lower portion of the substrate 3 is reflected upward by the reflection module 30 disposed below the insertion hole H *. (Arrow f).

  In FIG. 5B, the light reflected by the reflection module 30 leaks above the substrate 3 through the insertion hole H * in the reflected light irradiation region R (inside the circle indicated by the two-dot chain line). Then, the image is picked up by the board recognition camera 12. That is, the reflection module 30 (reflection member) is disposed on the support plate 21 based on the irradiation region R of the light reflected by the reflection module 30 and the position of the insertion hole H to be imaged on the substrate 3.

  The imaging data of the board recognition camera 12 is transmitted to the recognition processing unit 43 (see FIG. 6), and the recognition processing unit 43 performs recognition processing to detect the position of the insertion hole H *. In mounting the insertion part PT, the insertion position is corrected so that the lead TT of the insertion part PT is inserted into the insertion hole H * based on the detected position of the insertion hole H *. In this way, by taking an image while irradiating light reflected from below the insertion hole H *, the position can be detected with high accuracy even with a small insertion hole H *.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 40 is an arithmetic device and controls each unit described below based on various programs and data stored in the storage unit 41. In addition to the mounting data 41a for mounting the component P on the substrate 3, the storage unit 41 stores pin arrangement data 41b and member arrangement data 41c.

  The pin arrangement data 41 b is position coordinate data for arranging the receiving pin module 22 on the support plate 21, and is stored for each type of substrate 3. The member arrangement data 41 c is position coordinate data for arranging the reflection module 30 (reflection member) on the support plate 21, and the substrate 3 is based on the irradiation area R of the light reflected by the reflection module 30 and the position of the insertion hole H. It is memorized for each kind.

  The mechanism driving unit 42 is controlled by the control unit 40 to drive the substrate transport mechanism 2, the substrate holding unit 2 c, and the component mounting mechanism 11. Thereby, the board | substrate 3 conveyance operation | movement by the board | substrate conveyance mechanism 2, the board | substrate holding | maintenance operation | movement by the board | substrate holding part 2c, the component mounting operation | work by the component mounting mechanism 11, the arrangement | positioning operation | work of the receiving pin module 22, and the arrangement | positioning operation | work of the reflection module 30 are performed. The

  The recognition processing unit 43 performs recognition processing on the imaging results obtained by the board recognition camera 12 and the component recognition camera 13. As a result, the position of the insertion hole H provided in the substrate 3 is detected, and the position of the component P held by the mounting head 9 is detected. When the component P is mounted on the board 3 by the component mounting mechanism 11, the mounting position is corrected based on these recognition results.

  The irradiation unit 12 a is controlled by the control unit 40 and irradiates light toward the lower substrate 3. The display unit 44 is a display device such as a liquid crystal panel, and displays an image acquired by the substrate recognition camera 12 and a recognition image processed by the recognition processing unit 43. The operation / input unit 45 is an input device such as a keyboard or a touch panel provided on the display screen of the display unit 44, and performs operations for operating instructions and data input.

  Next, a component mounting operation (component mounting method) by the component mounting apparatus 1 of the present embodiment will be described with reference to the flowchart of FIG. First, the control unit 40 controls the mechanism driving unit 42 based on the pin arrangement data 41b, and performs the arrangement work of the lower receiving pin module 22 that arranges the lower receiving pin module 22 (lower receiving pin) on the support plate 21 (ST1). : Receiving pin placement process).

  Next, the control unit 40 controls the mechanism driving unit 42 based on the member arrangement data 41 c and arranges the reflection module 30 (reflection member) that reflects the light emitted from the irradiation unit 12 a upward on the support plate 21. 30 arrangement | positioning work is performed (ST2: reflection member arrangement | positioning process). In the reflection member arrangement step (ST2), the control unit 40 holds the reflection module 30 by the receiving pin holding head and arranges it at a position below the insertion hole H provided in the substrate 3 after positioning. Thus, if the reflection module 30 is held and arranged by the receiving pin holding head, it is not necessary to separately provide a head dedicated to the reflection module 30, and an increase in apparatus cost and apparatus size can be suppressed.

  Next, the control unit 40 controls the mechanism driving unit 42 to drive the substrate transport mechanism 2 to carry in the substrate 3 and position and hold it at the mounting work position (ST3: substrate carrying-in process). Next, the control unit 40 controls the mechanism driving unit 42 based on the mounting data 41a to perform a component mounting operation, and mounts a predetermined surface mounting component PS on the substrate 3 (ST4: surface mounting component mounting step). Next, the control unit 40 controls the mechanism driving unit 42 based on the mounting data 41a to move the board recognition camera 12 above the insertion hole H * into which the lead TT of the insertion part PT is inserted, and downward from the irradiation unit 12a. Light is irradiated toward the substrate 3.

  Next, the recognition processing section 43 detects the position of the insertion hole H * by imaging the insertion hole H * irradiated with light reflected from below by the reflection module 30 by the substrate recognition camera 12 (ST5: insertion hole position detection). Process). In the insertion hole position detection step (ST5), after the substrate 3 is carried in, before the surface mount component PS is mounted on the substrate 3 (between ST3 and ST4), or after the surface mount component PS is mounted, the insertion component PT It may be done before holding.

  Next, the control unit 40 controls the mechanism driving unit 42 based on the mounting data 41a to perform a component mounting operation, and determines the insertion position based on the position of the insertion hole H * detected in the insertion hole position detection step (ST5). Correction is made and the insertion component PT is mounted on the substrate 3 (ST6: insertion component mounting step). Next, the control unit 40 determines whether or not all the insertion parts PT are mounted (ST7). When there is an unmounted insertion part PT (No in ST7), the process returns to the insertion hole position detection step (ST5) to mount the next insertion part PT on the substrate 3.

  When all the insertion parts PT are mounted (Yes in ST7), the control unit 40 controls the mechanism driving unit 42 to drive the substrate transport mechanism 2, and unloads the substrate 3 from the mounting work position (ST8: substrate unloading step). ). Next, the control unit 40 determines whether or not a predetermined number of mounting boards have been produced (ST9). If the predetermined number of productions has not been reached (No in ST9), the process returns to the board carry-in process (ST3) and the next component mounting of the board 3 is executed. When a predetermined number of mounting boards have been produced (Yes in ST9), the component mounting operation is terminated.

  The position detection of the insertion hole H may be performed every time one insertion part PT is inserted as described above, but the position of all insertion holes H to be inserted is detected before the insertion part PT is inserted. Later, the insertion part PT may be started to be inserted. In the above-described embodiment, the example in which the surface mounting component PS and the insertion component PT are mounted on the substrate 3 with the same component mounting apparatus 1 is shown. However, the present invention is not limited to this, and the surface mounting component PS has already been mounted. The same effect can be obtained even in a case where the insertion part PT is inserted into the substrate 3 that has been formed.

  As described above, the component mounting apparatus 1 according to the present embodiment includes the substrate transport mechanism 2 (substrate positioning unit) that positions the substrate 3 and the underside support that supports the lower surface of the substrate 3 positioned by the substrate transport mechanism 2. A support plate 21 on which a pin module 22 (underpin) is disposed, an irradiation unit 12a that is disposed above the substrate 3 and irradiates light downward, and is detachably disposed on the support plate 21, and an irradiation unit And a reflection module 30 (reflection member) that reflects light emitted from 12a upward. The reflection module 30 is disposed below the insertion hole H provided in the substrate 3 positioned by the substrate transport mechanism 2.

  The component mounting method according to the present embodiment includes a lower receiving pin arrangement step (ST1) in which the lower receiving pin module 22 (lower receiving pin) that supports the lower surface of the positioned substrate 3 is arranged on the support plate 21; A reflection member arrangement in which a reflection module 30 (reflection member) that reflects light emitted from the irradiation unit 12a that is disposed above the positioned substrate 3 and emits light downward is disposed on the support plate 21. Step (ST2). In the reflection member arrangement step (ST2), the reflection module 30 is arranged below the insertion hole H provided in the positioned substrate 3.

  Thereby, the position of the insertion hole H of the board 3 can be recognized with high accuracy while suppressing the device cost and the device size of the component mounting apparatus 1. Furthermore, since the arrangement of the reflection module 30 can be changed according to the position of the insertion hole H of the substrate 3, it can correspond to various substrates 3 having different shapes and positions of the insertion holes H.

  The component mounting apparatus and the component mounting method of the present invention can recognize the position of the insertion hole with high accuracy while suppressing the apparatus cost and the apparatus size, and thus are useful in the component mounting field in which the insertion component is mounted on the substrate.

1 Component mounting device 2 Board transport mechanism (board positioning part)
3 Substrate 9 Mounting head (underpin holding head)
10 Unit holding head (base pin holding head)
10b Pin holding nozzle (underpin holding pin head)
12a Irradiation part 21 Support plate 22 Lower receiving pin module (lower receiving pin)
30 Reflective module (reflective member)
33 Mirror (reflective part)
H Insertion hole R Irradiation area

Claims (8)

A substrate positioning unit for positioning the substrate;
A support plate on which a receiving pin that supports the lower surface of the substrate positioned by the substrate positioning unit is disposed;
An irradiating unit disposed above the substrate and irradiating light downward;
A reflection member that is detachably disposed on the support plate and reflects light emitted from the irradiation unit upward;
The component mounting apparatus, wherein the reflecting member is disposed below an insertion hole provided in the board positioned by the board positioning unit. A lower holding pin holding head for holding the lower receiving pin and arranging the holding pin on the support plate;
The component mounting apparatus according to claim 1, wherein the reflecting member is held by the receiving pin holding head and disposed on the support plate.   The component mounting apparatus according to claim 1, wherein the reflection member includes a reflection portion that reflects light upward.   The component mounting apparatus according to claim 3, wherein the reflection unit is a mirror.   The component mounting apparatus according to claim 1, wherein the reflecting member is disposed on the support plate based on an irradiation area of light reflected by the reflecting member and a position of the insertion hole. A support pin placement step of placing a support pin that supports the lower surface of the positioned substrate on the support plate;
A reflecting member arranging step of arranging a reflecting member, which is arranged above the positioned substrate and reflects light emitted from an irradiation unit that emits light downward, on the support plate;
A component mounting method in which, in the reflection member arranging step, the reflection member is arranged below an insertion hole provided in the positioned substrate.   The component mounting method according to claim 6, wherein in the reflecting member arranging step, the reflecting member is held by a lower receiving pin holding head that holds the lower receiving pin and is arranged on the supporting plate, and is arranged on the supporting plate. .   8. The component mounting method according to claim 6, wherein, in the reflection member arranging step, the reflection member is arranged on the support plate based on a light irradiation region reflected by the reflection member and a position of the insertion hole.

Images