JP2011165912A - Component mounting apparatus and method for judging operating state of substrate supporting mechanism in the component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus which can judge the quality of an operating state for lower receiving a substrate in a substrate supporting mechanism by a simple method, and to provide a method for judging the operating state of the substrate supporting mechanism in the component mounting apparatus. <P>SOLUTION: Substrate supporting mechanisms 12A and 12B are provided in substrate transport conveyors 2A and 2B respectively in a component mounting apparatus 1 to hold a substrate 3 at a position of an operating height by allowing a plurality of substrate support pins 14 to abut on the back face of the substrate 3. In the substrate supporting mechanisms 12A and 12B, the height positions of the upper ends 14a of the substrate support pins 14 are time sequentially measured by the existing height sensors 10A and 10B in the apparatus in the state of synchronously operating the substrate supporting mechanisms 12A and 12B. By comparing a difference Δh between a first pin height measurement result h1 and a second pin height measurement result h2 with a threshold value, the quality of the operating state of the substrate supporting mechanisms 12A and 12B is judged. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus used in a component mounting line for manufacturing a mounting board by mounting components on a board, and a method for determining an operation state of a substrate support mechanism that receives a board in the component mounting apparatus. is there.

  A component mounting apparatus such as a component mounting apparatus that constitutes a component mounting line is provided with a substrate transport mechanism for transporting a substrate from the upstream side to the downstream side. There are provided a positioning mechanism for positioning the substrate and a substrate support mechanism for receiving and supporting the positioned substrate from the lower surface side (see, for example, Patent Document 1). In the prior art shown in this patent document example, in two sets of substrate transfer conveyors arranged in parallel, the inner guide rails are configured to be movable in the transfer width direction, so that a small substrate having a small width dimension and a width can be obtained. Any large substrate with large dimensions can be transported. An elevator platform is disposed below these substrate conveyors, and the loaded substrate is lifted and supported by the elevator platform in the raised state.

JP 2001-163428 A

  By the way, the characteristics of the mounting form, size, rigidity, etc. of the board to be worked on in the component mounting line are not uniform, and the component mounting apparatus used is versatile enough to target these various types of boards. It is required to have. For this reason, as a configuration of the substrate support mechanism for supporting the substrate from the lower surface side, not only the substrate on which no component is mounted but also the substrate on which the component is already mounted on one side in the previous process can be supported from the already mounted surface side. In some cases, a pin support type substrate support mechanism in which substrate support pins are erected is used. As shown in the prior art example as a configuration of the substrate transport mechanism, as a substrate support mechanism in the case of including two rows of substrate transport conveyors with variable transport widths, mounting-related work is independently performed on each substrate transport conveyor. An apparatus configuration having a high degree of freedom of operation is provided, which is provided with an independent lifting drive mechanism for each conveyor so that it can be executed.

  However, in order to continuously operate such a substrate support mechanism having a high degree of freedom of operation and a complicated configuration without any problems, it is essential that each element constituting the elevating drive mechanism operates stably. For example, a low-cost and simple structure air cylinder is generally used as the lifting drive source for this application, but the operation of the air cylinder is caused by contamination of components, deterioration over time, and clogged piping systems. There is a characteristic that the state becomes unstable, and a uniform ascending / descending operation characteristic is not always ensured. For this reason, there arises a problem such that rattling occurs at the time of raising and lowering and damage is caused by impacting against the substrate.

  A more serious problem occurs when a substrate having a large conveyance width is targeted in a configuration including an independent lifting drive mechanism for each conveyor. That is, in this case, it is necessary to support one substrate by the two substrate support mechanisms. However, if the synchronization state of the operation of each drive mechanism is not good, each substrate is supported because it rises at a different height. As a result, the substrate becomes greatly inclined, and normal substrate support becomes impossible. In order to prevent such a situation, it is necessary to frequently perform complicated maintenance work such as operation check after the apparatus is stopped and the internal substrate support mechanism is disassembled and inspected. As described above, the conventional component mounting apparatus used in the component mounting line has a problem that it takes time and labor to confirm the quality of the lifting / lowering operation state for receiving the substrate in the substrate support mechanism. .

  Accordingly, the present invention provides a component mounting apparatus and a method for determining an operation state of a substrate support mechanism in a component mounting apparatus that can determine whether or not an operation state for receiving a substrate in a substrate support mechanism is simple. The purpose is to provide.

  A component mounting apparatus according to the present invention is a component mounting apparatus that is used in a component mounting line for manufacturing a mounting board by mounting a component on a board, and performs a predetermined work operation, and the work operation for executing the work operation is performed. A mechanism, a substrate transport mechanism for transporting the substrate in a first direction and positioning the substrate at a work position by the work operation mechanism, and a plurality of substrate support pins provided upright at the work position. The lower receiving base is raised from below with respect to the substrate carried into the work position, and the plurality of substrate support pins are brought into contact with the back surface of the substrate. A substrate support mechanism that is held in a vertical position, and a height that can be measured relative to the substrate held by the substrate support mechanism in a horizontal direction so that the height of the upper surface of the substrate can be measured. A measurement unit; and a control unit that controls the substrate support mechanism and the height measurement unit, wherein the control unit is configured to increase a height of an upper end portion of the substrate support pin by the height measurement unit in an operation state of the substrate support mechanism. Whether or not the operation state of the substrate support mechanism is good is determined based on the pin height measurement result obtained by measuring the height position in time series.

  In the component mounting apparatus according to the present invention, a method for determining an operation state of a substrate support mechanism includes: a work operation mechanism that performs a predetermined operation in a component mounting line for manufacturing a mounting substrate by mounting components on the substrate; A substrate transport mechanism for transporting in a first direction and positioning at a work position by the work motion mechanism; and a lower receiving base disposed below the substrate at the work position and provided with a plurality of substrate support pins. A substrate that holds the substrate at a work height position by the work operation mechanism by raising the substrate carried into the work position from below and bringing the plurality of substrate support pins into contact with the back surface of the substrate. A support mechanism, and a height measuring means provided so as to be relatively movable in the horizontal direction with respect to the substrate held by the substrate support mechanism and capable of measuring the height of the upper surface of the substrate; A method for determining an operation state of a substrate support mechanism for determining an ascending / descending operation state of the lower receiving base in a component mounting apparatus including a substrate support mechanism and a control unit for controlling a height measuring unit, the control unit The operation of the substrate support mechanism is based on the pin height measurement result obtained by measuring the height positions of the upper end portions of the plurality of substrate support pins in time series by the height measurement means in the operation state of the substrate support mechanism. The state is judged as good or bad.

  According to the present invention, in a substrate support mechanism that holds a substrate at a working height position by bringing a plurality of substrate support pins into contact with the back surface of the substrate, the upper end of the substrate support pin is provided by an existing height measuring means in the apparatus. Based on the pin height measurement result obtained by measuring the height position of the part in time series, it is possible to easily determine the quality of the operation state of the substrate support mechanism by receiving the substrate by determining the quality of the substrate support mechanism. It can be determined by the method.

The top view of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the determination method of the operation state of the board | substrate support mechanism in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the determination method of the operation state of the board | substrate support mechanism in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the rising pattern of a board | substrate support mechanism used for determination of the operation state of the board | substrate support mechanism in the component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 has a function of mounting an electronic component such as a semiconductor component on a substrate, and is used in a component mounting line for manufacturing a mounting substrate by mounting the component on the substrate and performing a predetermined work operation. It is a mounting device.

  In FIG. 1, a substrate transport mechanism 2 is disposed on a base 1a in the X direction (first direction). The substrate transport mechanism 2 transports the substrate 3 supplied from the upstream device and subjected to component mounting work by the device in the X direction, and positions it at a component mounting work position by the component mounting mechanism described below. In the present embodiment, the substrate transport mechanism 2 has a configuration in which a pair of substrate transport conveyors 2A and 2B having a variable transport width B are arranged symmetrically and parallel to the apparatus center line CL.

  That is, each of the board conveyors 2A and 2B has a pair of a fixed guide rail 21 and a movable guide rail 22, and the position of the fixed guide rail 21 is fixed, and the movable guide rail 22 has a rail width. It is provided so as to be movable in the Y direction (second direction) orthogonal to the X direction (see arrow a in FIG. 1 and arrow b in FIG. 2) by a shifting mechanism (not shown). In the configuration of the substrate transport mechanism 2 described above, the substrate transport conveyors 2A and 2B are arranged so that the movable guide rails 22 are positioned adjacent to each other inside the apparatus.

  By configuring the substrate transport mechanism 2 as described above, as will be described later, by moving the movable guide rails 22 of the substrate transport conveyors 2A and 2B in the same direction side, Such a conveyance width can be significantly enlarged as compared with the conveyance width B in the normal state shown in FIG. As a result, as shown in FIG. 1, the board 103 (see FIG. 4) whose width dimension is larger than the board 3 corresponding to the normal carrying width of the board carrying conveyors 2 </ b> A and 2 </ b> B is to be mounted by the component mounting apparatus 1. Is possible.

  As shown in FIG. 2, board support mechanisms 12 </ b> A and 12 </ b> B are disposed below the board 3 at the component mounting work positions of the board conveyors 2 </ b> A and 2 </ b> B. Each of the substrate support mechanisms 12A and 12B is supported by holding a plurality of substrate support pins 14 by two plate-like pin support members 15 on a lower receiving base 12a that is moved up and down by a lift drive unit 13 using an air cylinder. It has a configuration. Driving air is supplied from the air supply source 17 to the elevating drive unit 13 via the air switching unit 16, and the air switching unit 16 is controlled by the control device 30 (FIG. 3), so that the substrate support mechanisms 12 </ b> A and 12 </ b> B The raising / lowering operation of the substrate support pins 14 is controlled.

  The substrate 3 is moved together with the substrate support pins 14 by driving the elevating drive unit 13 to raise the lower receiving base 12 a from below with respect to the substrate 3 and bringing the plurality of substrate support pins 14 into contact with the back surface of the substrate 3. It rises and stops at a position where the upper surface of the substrate 3 is in contact with the lower surface of the pressing member 23 provided in the substrate transport mechanism 2. Thereby, the board | substrate 3 is hold | maintained in the working height position by the component mounting mechanism demonstrated below.

  In FIG. 1, component supply units 4A and 4B are provided on both sides of the substrate transfer mechanism 2 corresponding to the substrate transfer conveyors 2A and 2B, and a plurality of tape feeders 5 are provided in the component supply units 4A and 4B. It is installed. A Y-axis moving table 7 having a linear drive mechanism is disposed horizontally in the Y direction at one end of the base 1a in the X direction. Similarly, two X-axis movement tables 8A and 8B having a linear drive mechanism are coupled to the Y-axis movement table 7, and the mounting heads 9A and 9B move in the X direction to the X-axis movement tables 8A and 8B, respectively. It is installed freely. Each of the mounting heads 9A and 9B is a multiple head having a plurality of holding heads, and suction nozzles 9a capable of sucking and holding components and individually moving up and down are attached to the lower ends of the respective holding heads. ing.

  The Y-axis moving table 7 and the X-axis moving tables 8A and 8B constitute a head moving mechanism, and the mounting heads 9A and 9B move in the X direction and the Y direction by driving the head moving mechanism. As a result, the mounting heads 9A and 9B take out the components from the tape feeders 5 of the corresponding component supply units 4A and 4B by the suction nozzle 9a, and are positioned by the substrate transfer conveyors 2A and 2B of the substrate transfer mechanism 2 to be mounted on the substrate support mechanism. The substrate is transferred and mounted on the substrate 3 received by 12A and 12B. Therefore, the Y-axis moving table 7, the X-axis moving tables 8A and 8B, and the mounting heads 9A and 9B transfer and mount the components on the substrate 3 by moving the mounting heads 9A and 9B holding the components by the head moving mechanism. Configure the component mounting mechanism. The component mounting mechanism is a work operation mechanism that executes a predetermined operation in the component mounting line.

  A component recognition device 6 is disposed between the component supply units 4A and 4B and the corresponding substrate transport conveyors 2A and 2B, and the mounting heads 9A and 9B that take out components from the component supply units 4A and 4B recognize the components. When moving above the device 6, the component recognition device 6 picks up and recognizes the components held by the mounting heads 9A and 9B. The mounting heads 9A and 9B are mounted with board recognition cameras 11A and 11B, which are positioned on the lower surface side of the X-axis moving tables 8A and 8B and move integrally with the mounting heads 9A and 9B, respectively. As the mounting heads 9A and 9B move, the board recognition cameras 11A and 11B move above the board 3 held by the board support mechanisms 12A and 12B, and the board 3 is imaged and recognized. In the component mounting operation on the substrate 3 by the mounting heads 9A and 9B, the mounting position correction is performed in consideration of the component recognition result by the component recognition device 6 and the substrate recognition result by the substrate recognition cameras 11A and 11B.

  Height sensors 10A and 10B are mounted on the X-axis moving tables 8A and 8B as height measuring means that move integrally with the mounting heads 9A and 9B and can measure the height of the upper surface of the substrate 3. The height sensors 10A and 10B are measuring instruments such as laser displacement meters that can detect displacement in the measurement axis direction in a non-contact manner, and are height sensors for the substrate 3 held by the substrate support mechanisms 12A and 12B, respectively. By measuring the height of the upper surface of the substrate 3 with the height sensors 10A and 10B (see arrow c) while relatively moving the 10A and 10B in the horizontal direction, the three-dimensional shape of the upper surface of the substrate 3, that is, the warped deformation state Can be measured. That is, in the above-described configuration, the substrate support mechanism 12A and the height sensor 10A are provided corresponding to the substrate transport conveyor 2A, and the substrate support mechanism 12B and the height sensor 10B are provided corresponding to the substrate transport conveyor 2B. That is, the substrate support mechanism and the height measuring means are provided for each pair of substrate transport conveyors.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 3, a control device 30 (control unit) includes a head moving mechanism including a Y-axis moving table 7, X-axis moving tables 8A and 8B, mounting heads 9A and 9B, component supply units 4A and 4B, and a board conveyor 2A and 2B. The operation of the substrate support mechanisms 12A and 12B is controlled. Thereby, conveyance and positioning of the board | substrate 3, and the component mounting operation | work with respect to the board | substrate 3 are performed. In this component mounting operation, the control device 30 controls the board transfer conveyors 2A and 2B and moves the movable guide rails 22 in the Y direction, whereby the transfer width B of the board transfer conveyors 2A and 2B is changed. .

  Further, when the control device 30 controls the head moving mechanism and the height sensors 10A and 10B described above, warpage measurement of the upper surface of the substrate 3 supported by the substrate support mechanisms 12A and 12B is executed. And a measurement result is transmitted to the control apparatus 30, and the control apparatus 30 changes the mounting height in component mounting operation | movement as needed based on this measurement result. Further, in the operation state of the substrate support mechanisms 12A and 12B, the control device 30 uses the height sensor 10A and the height sensor 10B to height the upper end portions 14a of the substrate support pins 14 attached to the substrate support mechanisms 12A and 12B, respectively. Based on the pin height measurement result obtained by measuring the position in time series, an operation state determination process is performed to determine whether the operation state of the substrate support mechanisms 12A and 12B is good or bad. The determination result is notified by the notification unit 33 provided on the display panel or the like.

  The storage unit 31 is determination standard data used for determining the quality of the above-described operation state together with various data necessary for component mounting operation such as mounting data, and operation state determination data including a Δh threshold value 32a and a rising pattern 32b. 32 is stored. The Δh threshold value 32a indicates whether or not the difference Δh between the height positions of the substrate support pins 14 when the substrate support mechanisms 12A and 12B are operated in synchronization is within an allowable range that does not cause an operation failure. This is threshold data used as a criterion for determination. The rising pattern 32b is reference data indicating a rising pattern of the substrate support pins 14 in a normal operation state of the substrate support mechanisms 12A and 12B, that is, a correct relationship between the elapsed time from the operation start timing and the height position.

  FIG. 4 shows a substrate receiving state in the component mounting apparatus 1 when a substrate 103 whose width dimension is significantly larger than the normal size substrate 3 shown in FIG. In other words, in this case, as shown in FIG. 4A, the movable guide rails 22 of the substrate transport conveyors 2A and 2B are matched with the width of the target substrate 103 on one side (here, the substrate transport conveyor). 2A side). Thereby, the conveyance width of the substrate conveyance conveyor 2B on the other side is enlarged, and the substrate 103 having a large width dimension can be conveyed by the substrate conveyance mechanism 2. When the board 103 is positioned at the component mounting work position, the board support pins 14 of the board support mechanisms 12A and 12B are brought into contact with the back surface of the board 103 to hold the board 103 at the work height position.

  At the time of receiving the substrate, the substrate support mechanisms 12A and 12B drive the elevation drive unit 13 to raise the substrate support pins 14 together with the substrate receiving base 12a. At this time, since the substrate support mechanisms 12A and 12B are raised by the lift drive units 13 provided individually, as shown in FIG. 4B, the raising operation (arrow d) in the substrate support mechanism 12A and the substrate The ascending operation (arrow e) in the support mechanism 12B is not completely synchronized, and a difference Δh may occur in the height position of the upper end portion of each substrate support pin 14 in some cases.

  When the substrate support pins 14 are lifted with such a height position difference Δh, the substrate 103 is inclined with respect to the horizontal plane. Depending on the degree of the inclination angle θ at this time, the substrate 103 is not normally received and a mounting defect occurs, or the end portion of the substrate 103 rises and rattles while being caught by the apparatus member during the raising operation. A phenomenon may occur, and an impact may be applied to the substrate to cause a serious problem such as breakage. Such malfunction of the substrate support mechanism is caused by the unstable operation state of the substrate support mechanisms 12A and 12B. In particular, when an air cylinder having a simple mechanism and a low cost is used as the elevating drive unit 13, the operating state may vary depending on various factors such as contamination of the sliding surface of the component parts, deterioration with time, and clogging of the piping system. It is difficult to ensure stable and stable operating characteristics.

  In order to prevent such problems as described above, it is necessary to constantly monitor the operation state of the substrate support mechanisms 12A and 12B, detect signs of abnormal operation as early as possible, and perform appropriate maintenance work. However, in order to detect such an operation abnormality, conventionally, it has been necessary to check the operation after stopping the operation of the apparatus and newly confirming the operation. This inspection / confirmation work is a troublesome work that requires labor and time, and if such maintenance work is executed at a high frequency, productivity will be reduced.

  In order to monitor the operation state of the board support mechanisms 12A and 12B, in this embodiment, as shown in FIG. 5, whether the synchronization state of the operation of the board support mechanisms 12A and 12B is good or bad is determined. Are detected by an operation state determination process in which the heights of the substrate support pins 14 of the substrate support mechanisms 12A and 12B are measured in time series by the height sensors 10A and 10B already provided. This operation state determination process is executed at a preset monitoring timing such as at the start of device operation or at predetermined monitoring intervals.

  In the operation state determination process, as shown in FIG. 5, after moving the movable guide rails 22 of the substrate transport conveyors 2A and 2B to the positions shown in FIG. 4A, the height sensors 10A and 10B are respectively moved. The substrate is moved above the substrate support mechanisms 12A and 12B. Then, in a state where the measurement positions of the height sensors 10A and 10B are aligned with the upper end portions 14a of the respective substrate support pins 14, the respective lift drive units 13 of the substrate support mechanisms 12A and 12B are driven in synchronization to support the substrate. The mechanisms 12A and 12B are caused to perform ascending operations (arrows f and g), respectively.

  In this ascending process, the height positions of the upper end portions 14a of the substrate support pins 14 of the substrate support mechanisms 12A and 12B are measured by the height sensor 10A and the height sensor 10B, respectively, and the first pin height measurement results h1, Obtained as the second pin height measurement result h2. Then, the control device 30 obtains a difference Δh (= h1−h2) between the first pin height measurement result h1 and the second pin height measurement result h2 measured at the same timing, and compares it with the Δh threshold value 32a. If the difference Δh is equal to or less than the Δh threshold value 32a, it is determined that the operating state is good, and if the difference Δh exceeds the Δh threshold value 32a, it is determined that the operating state is defective. Notification is made by the notification unit 33.

  The height measurement of the upper end portion 14a by the height sensors 10A and 10B may be performed continuously during the ascending process by the substrate support mechanisms 12A and 12B, or discretely performed at preset time intervals. Also good. In any case, if the difference Δh exceeds the Δh threshold value 32a, it is determined that the operation state is defective at that time. The Δh threshold value 32a is individually set based on experience values according to the characteristics of the substrate 3 to be mounted.

  That is, in the above example, the control device 30 operates the substrate support pins 14 of the substrate support mechanism on either one of the substrate support mechanisms 12A and 12B in a state where the pair of substrate support mechanisms 12A and 12B are operated in synchronization. Is obtained by measuring the first pin height measurement result h1 obtained by measuring by the corresponding height measuring means and the substrate support pin 14 of the other side substrate support mechanism by the corresponding height measuring means. The second pin height measurement result h2 is compared to obtain a height position difference Δh, and the difference Δh is compared with a predetermined Δh threshold value 32a, thereby operating the substrate support mechanisms 12A and 12B. The quality is judged.

  In the above embodiment, in the component mounting apparatus 1 having a configuration in which the substrate transport mechanism 2 includes a pair of substrate transport conveyors 2A and 2B, and each includes a corresponding substrate support mechanism and height measuring means, Although an example in which the operation state when the support mechanisms 12A and 12B are operated in synchronization is shown, the present invention can also be applied to the case where the operation state of the substrate support mechanism that operates independently is targeted. . An example of determining the operation state in this case will be described with reference to FIGS.

  A component mounting apparatus 1A shown in FIG. 6 includes a substrate transport mechanism 2 and a single substrate support mechanism 12, each of which includes a single substrate transport conveyor having a fixed guide rail 21 and a movable guide rail 22. The configuration includes a single mounting head 9 for mounting components on the substrate supported and supported, and a single height sensor 10 for measuring the height of the upper surface of the substrate. In such an operation state determination process for the substrate support mechanism 12, the height position of the upper end portion 14 a is similarly determined by the height sensor 10 in the process of driving the elevating drive unit 13 to raise the substrate support pin 14. measure. And the quality of the operation state of the board | substrate support mechanism 12 is determined by comparing this pin height measurement result with the rising pattern 32b memorize | stored previously.

  That is, the rising pattern of the substrate support pins 14 in the normal operation state of the substrate support mechanism 12 is stored in advance as a reference rising pattern (indicated by a broken line in FIG. 7), and the control device 30 determines the height position of the upper end portion 14a. By comparing the pin height measurement results obtained by measuring the time series with respect to each other, that is, the actually measured ascending pattern with the reference ascending pattern, the quality of the operation state of the substrate support mechanism 12 is determined. In the example shown in FIG. 7, d1, d2, and d3 indicating the height difference between the reference rising pattern and the actually measured rising pattern at timings t1, t2, and t3 set in advance in the rising process of the substrate support pins 14 are determined in advance. If the allowable value is exceeded, it is determined that the operation state is defective. The allowable values in this case are also individually set based on experience values according to the characteristics of the board to be mounted.

  That is, also in the example shown here, the pin height measurement result obtained by measuring the height position of the upper end portion 14a of the substrate support pin 14 by the height sensor 10 in the operation state of the substrate support mechanism 12 by the control device 30 in time series. Based on the above, the quality of the operation state of the substrate support mechanism 12 is determined. By performing the quality determination of the operation state of the substrate support mechanism 12 for the component mounting apparatus 1 and the component mounting apparatus 1A having the above-described configuration by using such a method, the height measuring means already provided in these apparatuses is effectively used. In this way, it is possible to automatically check the operation state, which conventionally requires a troublesome and time-consuming work. Therefore, it is possible to improve the productivity by shortening the time for the maintenance and inspection work, and it is possible to reduce the product defects caused by the defective operation state, thereby ensuring the quality and improving the product yield.

  In the above embodiment, an example of a component mounting apparatus that mounts a component on a board is shown as the component mounting apparatus used in the component mounting line, but the present invention is not limited to this. For example, a device used in a component mounting line, such as a screen printing device or an inspection device, which measures the height of the upper surface of the substrate support mechanism and the substrate support mechanism in which the substrate is received and supported by the substrate support pins from the lower surface side. Any device provided with a height measuring means to be used is an application target of the present invention.

  The component mounting apparatus and the method for determining the operation state of the substrate support mechanism in the component mounting apparatus according to the present invention can determine whether the operation state for receiving the substrate in the substrate support mechanism is a simple method. It is effective and is useful in the field of manufacturing a mounting board by mounting electronic components on a board.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Substrate conveyance mechanism 2A, 2B Substrate conveyance conveyor 3, 103 Substrate 4A, 4B Component supply part 7 Y axis movement table 8, 8A, 8B X axis movement table 9, 9A, 9B Mounting head 10, 10A, 10B Height sensor 12, 12A, 12B Substrate support mechanism 13 Elevating drive unit 14 Substrate support pin 14a Upper end 21 Fixed guide rail 22 Movable guide rail h1 First pin height measurement result h2 Second pin height measurement result Δh Difference

Claims (4)

A component mounting apparatus that is used in a component mounting line for manufacturing a mounting substrate by mounting a component on a substrate and executes a predetermined work operation,
A work operation mechanism for performing the work operation; a substrate transport mechanism for transporting the substrate in a first direction and positioning the work position by the work operation mechanism;
The plurality of substrate support pins are disposed below the substrate at the working position and raised from below with respect to the substrate carried into the work position with a lower receiving base on which a plurality of substrate support pins are erected. A substrate support mechanism for holding the substrate at a work height position by the work operation mechanism by contacting the back surface of the substrate,
A height measuring means provided so as to be relatively movable in the horizontal direction with respect to the substrate held by the substrate supporting mechanism, and capable of measuring the height of the upper surface of the substrate; the substrate supporting mechanism and the height measuring means And a control unit for controlling
The control unit is configured based on a pin height measurement result obtained by measuring a height position of an upper end portion of the substrate support pin in a time series by the height measurement unit in an operation state of the substrate support mechanism. A component mounting apparatus characterized by determining whether the operating state is good or bad. The substrate transport mechanism includes a pair of substrate transport conveyors each having a pair of guide rails movably provided in a second direction orthogonal to the first direction and having a variable transport width. The guide rails are arranged inside the device and arranged in parallel to each other,
The substrate support mechanism and the height measuring means are provided for each pair of substrate transport conveyors,
The control unit is configured to measure a first pin height obtained by measuring a substrate support pin of a substrate support mechanism on one side by a corresponding height measurement unit in a state where the pair of substrate support mechanisms are operated in synchronization. Comparing the height measurement result with the second pin height measurement result obtained by measuring the substrate support pin of the substrate support mechanism on the other side by the corresponding height measurement means, and obtaining the difference in the height position, 2. The component mounting apparatus according to claim 1, wherein the quality of the operating state of the two board support mechanisms is determined by comparing the difference with a predetermined threshold value. A work operation mechanism for executing a predetermined work operation in a component mounting line for mounting a component on a substrate to manufacture a mounting substrate, and substrate transport for transporting the substrate in a first direction and positioning the work position by the work operation mechanism A mechanism, and a lower receiving base disposed below the substrate at the working position and provided with a plurality of substrate support pins raised from below with respect to the substrate carried into the working position; A substrate support mechanism for holding the substrate at a work height position by the work operation mechanism by bringing a substrate support pin into contact with the back surface of the substrate, and the substrate held by the substrate support mechanism A component unit provided with a height measuring means provided so as to be relatively movable in the horizontal direction and capable of measuring the height of the upper surface of the board, and a control unit for controlling the board supporting mechanism and the height measuring means. A method of determining the operating state of the determining substrate supporting mechanism elevating operation state of the lower receiving base in the use device,
The control unit is configured to support the substrate based on a pin height measurement result obtained by measuring a height position of upper end portions of the plurality of substrate support pins in time series by the height measurement unit in an operation state of the substrate support mechanism. A method for determining an operating state of a substrate support mechanism in a component mounting apparatus, wherein the operating state of the mechanism is determined. The substrate transport mechanism includes a pair of substrate transport conveyors each having a pair of guide rails movably provided in a second direction orthogonal to the first direction and having a variable transport width. The guide rails are arranged inside the device and arranged in parallel to each other,
The substrate support mechanism and the height measuring means are provided for each pair of substrate transport conveyors,
The control unit is configured to measure a first pin height obtained by measuring a substrate support pin of a substrate support mechanism on one side by a corresponding height measurement unit in a state where the pair of substrate support mechanisms are operated in synchronization. Comparing the height measurement result with the second pin height measurement result obtained by measuring the substrate support pin of the substrate support mechanism on the other side by the corresponding height measurement means, and obtaining the difference in the height position, 4. The operation of the board support mechanism in the component mounting apparatus according to claim 3, wherein the quality of the operation state of the two board support mechanisms is determined by comparing the difference with a predetermined threshold value. How to determine the state.

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