CN104604359A - Mounting device, mounting head replacement method, and substrate manufacturing method - Google Patents
Mounting device, mounting head replacement method, and substrate manufacturing method Download PDFInfo
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- CN104604359A CN104604359A CN201380036429.XA CN201380036429A CN104604359A CN 104604359 A CN104604359 A CN 104604359A CN 201380036429 A CN201380036429 A CN 201380036429A CN 104604359 A CN104604359 A CN 104604359A
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- mounting head
- head
- support portion
- height
- described mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
This mounting device is equipped with: a head support unit; a movement mechanism; and a control unit. The head support unit is capable of supporting a mounting head that mounts electronic components on a substrate, and is capable of replacing the supported mounting head with another mounting head. The movement mechanism moves the head support unit in the height direction. When a mounting head is replaced the control unit adjusts the height of the head support unit by means of the movement mechanism, thereby adjusting the height of the mounting head. Thus, the workability can be improved when a mounting head is replaced.
Description
Technical field
This technology relates to the technology of the erecting device be arranged on by electronic unit on substrate etc.
Background technology
In the past, the erecting device that various to resistor, capacitor etc. electronic unit is arranged on substrate was widely known by the people.This erecting device generally comprises: trucking department, carrying substrate; Supply unit, supply electronic unit; Mounting head, is adsorbed by adsorption mouth and keeps, from the electronic unit of supply unit supply, the electronic unit of maintenance being arranged on substrate first-class.
Now, there is various mounting head in mounting head.Be configured to the erecting device known (for example, referring to patent documentation 1) can changing so various mounting heads to erecting device.Like this, by can mounting head be changed, such as can according to the variety exchanging mounting head of substrate.
Prior art document
Patent documentation 1: Japanese Unexamined Patent Publication 2003-218589 publication
But by making the adsorption mouth of mounting head move in the vertical direction, mounting head keeps electronic unit at supply unit, or on substrate mounting electronic parts.Therefore, the installation rate of the electronic unit of the close together from the upper surface of substrate to adsorption mouth leading section improves.That is, the installation rate of the electronic unit that the height and position of mounting head is lower improves.
But if the height and position of mounting head is set as lower, then when changing mounting head, trucking department, supply unit etc. are in the way, and there is the problem of operability difference.In worst case, also there is mounting head and contact with trucking department or supply unit, cause producing damaged situation.
Summary of the invention
In view of the above circumstances, the object of this technology is to provide a kind of technology that can improve the erecting device of operability when changing mounting head etc.
Erecting device in this technology comprises: head support portion, travel mechanism, control part.
Described head support portion can be supported on the mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced with other mounting head.
Described travel mechanism makes described head support portion move in the height direction.
Described control part, when changing described mounting head, is adjusted the height of described head support portion, thus adjusts the height of described mounting head by described travel mechanism.
In this erecting device, when changing mounting head, the height of mounting head can be adjusted.Therefore, when changing mounting head, because mounting head can be made to move to suitable height and position, so operability when mounting head is changed can be improved.
In described erecting device, the described mounting head supported can be replaced by other mounting head different types of by described head support portion.
In described erecting device, described control part can judge the kind by replacing by the described mounting head of the up-to-date support in described head support portion, when described electronic unit is installed on the substrate, by the Height Adjustment of described mounting head to the height corresponding with the kind of described mounting head.
Thereby, it is possible to adjust various mounting head to suitably highly, by the mounting head mounting electronic parts on substrate being adjusted to this suitable height.
In described erecting device, described mounting head can have the memory of the kind storing described mounting head.
In this case, described control part from the kind being read described mounting head by changing by the described memory of the described mounting head of the up-to-date support in described head support portion, can judge the kind of described mounting head.
Thus, control part suitably can distinguish the kind of mounting head.
In described erecting device, described mounting head can have the recording medium of the kind recording described mounting head.
In this case, described erecting device also comprises reading part, described reading part reads the kind of information of described mounting head from the described recording medium by changing by the described mounting head of the up-to-date support in described head support portion, and exports the kind of information of described mounting head to described control part.
Thus, control part suitably can distinguish the kind of mounting head.
In described erecting device, described control part when changing described mounting head, can adjust the height of described mounting head to certain altitude, and without the need to the kind according to described mounting head.
Thus, operating personnel operability can change mounting head well, and without the need to the kind according to mounting head.
The replacing options of the mounting head in this technology comprises the height of adjustment head support portion, thus adjust the height of described mounting head, described head support portion can be supported on the mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head.
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head described.
The manufacture method of the substrate in this technology comprises the height of adjustment head support portion, thus adjust the height of described mounting head, described head support portion can be supported on the mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced with other mounting head.
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head described.
Utilization by the described mounting head of the up-to-date support in described head support portion, installs described electronic unit by replacing on the substrate.
Invention effect
As described above, adopt this technology, operability during replacing mounting head can be made to improve.
Accompanying drawing explanation
Fig. 1 is the front view of the erecting device of the execution mode representing this technology;
Fig. 2 is the end view of erecting device;
Fig. 3 is the vertical view of erecting device;
Fig. 4 is the block diagram of the formation representing erecting device;
Fig. 5 is the figure of the appearance represented when changing mounting head;
Fig. 6 is the figure of the example representing mounting head kind;
Fig. 7 is the figure of the replacing Job Operations of the process operation representing that erecting device (control part) carries out and the mounting head of being undertaken by operating personnel;
Fig. 8 is the figure of the mounting head height represented when changing mounting head.
Symbol description
1 ... substrate
2 ... electronic unit
3 ... control part
30,30A, 30B, 30C, 30D ... mounting head
33a ... rotating turret
33b ... adsorption mouth
34 ... handling part
35 ... head control part
36 ... head storage part
40 ... head moving mechanism
52 ... head support portion
100 ... erecting device
Embodiment
Hereinafter, with reference to accompanying drawing, the execution mode in this technology is described.
(the first execution mode)
The overall structure of erecting device 100 and Each part
Fig. 1 is the front view of the erecting device 100 of the first execution mode representing this technology.Fig. 2 is the end view of erecting device 100, and Fig. 3 is the vertical view of erecting device 100.Fig. 4 is the block diagram of the structure representing erecting device 100.Fig. 5 is the figure of the appearance represented when changing mounting head 30.
As shown in these figures, erecting device 100 comprises frame structure body 10 and trucking department 15, and this trucking department 15 is arranged along X-direction in the inside of erecting device 100, to X-direction carrying substrate 1.In addition, erecting device 100 comprises support portion 20 and supply unit 25, this support portion 20 supports the substrate 1 being carried to assigned position by trucking department 15 from below, and this supply unit 25 is arranged on the fore-and-aft direction both sides of erecting device 100 in the mode clipping trucking department 15, supply electronic unit 2.
In addition, erecting device 100 comprises mounting head 30 and head moving mechanism 40, and this mounting head 30 keeps the electronic unit 2 supplied by supply unit 25, and installs on substrate 1 by the electronic unit 2 of maintenance, and this head moving mechanism 40 makes mounting head 30 move on XYZ direction.
With reference to Fig. 4, erecting device 100 also comprises: control part 3, storage part 4, display part 5, input part 6, shoot part 7, Department of Communication Force 8, air compressor 9 etc.
Frame structure body 10 (referring to figs. 1 through Fig. 3) has: base 11, is arranged on bottom; Four vertical frameworks 12, fix on the pedestal 11; Two horizontal frames 13, set up along X-direction on the top of vertical framework 12.
Trucking department 15 (with reference to Fig. 2, Fig. 3, Fig. 4) comprising: guiding piece 16, arranges along X-direction; Conveyer belt 17, is arranged on the inner face side of guiding piece 16.Trucking department 15, by driving conveyer belt 17, is moved into substrate 1 and is positioned at assigned position, or has discharged the substrate 1 of installation of electronic unit 2.Guiding piece 16 is formed as upper end towards inner side bending, and when being moved upward substrate 1 by support portion 20, the upper end of guiding piece can from upside supporting substrate 1.
Support portion 20 (with reference to Fig. 2) comprising: supporting bracket 21, multiple supporting pin 22, plate elevating mechanism 23, the plurality of supporting pin 22 is arranged in this supporting bracket 21 vertically, and this plate elevating mechanism 23 makes supporting bracket 21 be elevated.
When the substrate 1 of predetermined mounting electronic parts 2 is carried to assigned position by trucking department 15, be moved upward supporting bracket 21 by plate elevating mechanism 23.Thus, substrate 1 is clipped between the upper end of support portion 20 and guiding piece 16, and substrate 1 is fixed on assigned position.In this condition, mounting electronic parts 2 on substrate 1.
Supply unit 25 (referring to figs. 1 through Fig. 4) is made up of the multiple tape drums 26 arranged along X-direction.This tape drum 26 can load and unload relative to erecting device 100, housed inside with carrier band (not shown).Tape drum 26 comprises spool and the delivering mechanism of winding carrier band separately, and this delivering mechanism sends carrier band in the mode of step feed.
The electronic unit 2 of the identical types such as such as resistor, capacitor, inductor, IC chip (IC:IntegratedCircuit: integrated circuit) is accommodated in the inside of carrier band.Be formed with supply window 27 at the upper surface of the end (center side of erecting device 100) of tape drum 26, supply electronic unit 2 via this supply window 27 to mounting head 30.
Head moving mechanism 40 (with reference to Fig. 1, Fig. 2, Fig. 4, Fig. 5) has for making mounting head 30 Y-axis moving mechanism 41 of movement in Y direction, X-direction and Z-direction, X-axis travel mechanism 44 and Z axis travel mechanism 51 respectively.
Y-axis moving mechanism 41 comprises Y-axis framework 42 and y-axis shift kinetoplast 43, and this Y-axis framework 42 is set up along Y direction relative to two horizontal frames 13 of frame structure body 10; This y-axis shift kinetoplast 43 is can be assemblied in the lower position of Y-axis framework 42 relative to the mode of Y-axis framework 42 movement in the Y-axis direction.In addition, Y-axis moving mechanism 41 has Y-axis drive division, and this Y-axis drive division is used for driving y-axis shift kinetoplast 43 along Y direction.
X-axis travel mechanism 44 has X-axis framework 45 and X-axis moving body 46, this X-axis framework 45 has shape longer in the X-axis direction, be assemblied on the side of y-axis shift kinetoplast 43, this X-axis moving body 46 being assemblied in the lateral location of this X-axis framework 45 relative to the mode of X-axis framework 45 movement in the X-axis direction.In addition, X-axis travel mechanism 44 has X-axis drive division, and this X-axis drive division is used for driving X-axis moving body 46 along X-direction.On the side of X-axis framework 45, be provided with two guide rails 47 abreast along X-direction, this guide rail 47 is provided with the slide unit 48 that can slide on guide rail 47.X-axis moving body 46 is assemblied in the lateral location of X-axis framework 45 via guide rail 47 and slide unit 48.
Z axis travel mechanism 51 has a support portion 52, and this support portion 52 is can be assemblied in the lateral location of X-axis moving body 46 relative to the mode of X-axis moving body 46 in Z-direction (short transverse: the direction vertical with the installed surface of substrate 1) movement.In addition, Z axis travel mechanism 51 has Z axis drive division, and this Z axis drive division is used for driving this support portion 52 along Z-direction.
On the side of X-axis moving body 46, be provided with two guide rails 53 abreast along Z-direction, this guide rail 53 is provided with the slide unit 54 that can slide on guide rail 53.Head support portion 52 is assemblied in the lateral location of X-axis moving body 46 via guide rail 53 and slide unit 54.
Head support portion 52 can support mounting head 30, and this mounting head 30 supported can be replaced by other mounting head 30 different types of.In the present embodiment, head support portion 52 is the modes can changing mounting head 30 between different types of mounting head 30.But be not limited thereto, head support portion 52 also can be the form only can changing mounting head 30 between the mounting head 30 of identical type.
As X-axis drive division, Y-axis drive division and Z axis drive division, such as, ball screw drive mechanism, tape drive mechanism, linear electric motor mechanism etc. can be enumerated.Head moving mechanism 40 makes mounting head 30 move in the x-y directions by driving X-axis drive division and Y-axis drive division, by driving Z axis drive division, makes mounting head 30 upper mobile in Z-direction (short transverse: the direction vertical with the installed surface of substrate 1).
Mounting head 30 (referring to figs. 1 through Fig. 5) can be loaded and unloaded relative to head support portion 52.This mounting head 30 has: head framework 31, standard shaft 32, head 33, and this standard shaft 32 is arranged in a framework 31 in the mode tilted to this incline direction, and this head 33 is assembled into and can rotates relative to standard shaft 32.In addition, mounting head 30 has handling part 34, and this handling part 34 is arranged on the lateral location of casing 31, can load and unload relative to head support portion 52.And then mounting head 30 has: head control part 35, head storage part 36, rotating turret drive division 37, mouth drive division 38.
Head 33 has rotating turret 33a and multiple adsorption mouth 33b, and this rotating turret 33a is assembled into and can rotates relative to standard shaft 32, the plurality of adsorption mouth 33b along the circumference of rotating turret 33a to be assemblied at equal intervals on rotating turret 33a.
The standard shaft 32 that adipping can configure by rotating turret 33a obliquely rotates as rotary middle spindle.By driving rotating turret drive division 37, rotating turret 33a, this standard shaft 32 is rotated as central shaft.
The mode that adsorption mouth 33b tilts relative to the rotary middle spindle of rotating turret 33a separately with the axis of adsorption mouth 33b, is assemblied on rotating turret 33a.So that adsorption mouth 33b can be supported relative to rotating turret 33a along the mode of above-mentioned axis direction movement, in addition, support adsorption mouth 33b in the mode that can rotate relative to rotating turret 33a.By driving mouth drive division 38, adsorption mouth 33b with (above-below direction) movement in the axial direction of the sequential of regulation, rotate at axis with the sequential specified.
The adsorption mouth 33b of extreme lower position is positioned at, its axis vertically direction in multiple adsorption mouth 33b.Hereinafter, the position of such axis vertically adsorption mouth 33b in direction is called operating position.By moving the adsorption mouth 33b being positioned at this operating position at above-below direction, at supply unit 25 attract electrons parts 2, or mounting electronic parts 2 on substrate 1.The adsorption mouth 33b being positioned at operating position is switched successively by the rotation of rotating turret 33a.
Adsorption mouth 33b is connected with air compressor 9 (with reference to Fig. 4).Along with the negative pressure of this air compressor 9 and the switching of malleation, adsorption mouth 33b can adsorb or depart from electronic unit 2.
Head control part 35 accepts the instruction from control part 3, controls each several part (head storage part 36, mouth drive division 38, rotating turret drive division 37) of mounting head 30 together with control part 3 uniformly.
Head storage part 36 has nonvolatile memory and volatile memory, and the necessary various program of process of this nonvolatile memory head memory control unit 35, this volatile memory head uses as the operating area of control part 35.Further, store the information representing head kind in head storage part 36, thus, the control part 3 of erecting device 100 can identify that the mounting head 30 be loaded in now in erecting device 100 is mounting heads 30 of which kind of class.
With reference to Fig. 5, the handling part 34 of mounting head 30 has the first connector 34a of power supply supply and the first connector 34b communicated.On the other hand, head support portion 52 have to supply with power supply with the power supply that is connected of the first connector 34a supply with the second connector 52a and with communication with communication the second connector 52b of being connected of the first connector 34b.If mounting head 30 is loaded on a support portion 52, then these connectors 34a, connector 34b, connector 52a, connector 52b connect.Thus, to mounting head 30 supply power, in addition, erecting device 100 becomes the state that can communicate with mounting head 30.
Be provided with the first engaging piece 34c of convex in the lower position of the handling part 34 of mounting head 30, be provided with the second engaging piece 52c of the recess engaged with the first engaging piece 34c in the lower position of head support portion 52.When changing mounting head 30, using the first engaging piece 34c as the central axis mounting head 30 of rotating.
The upper side position of head support portion 52 is provided with lockable mechanism 52d, and this lockable mechanism 52d is used for mounting head 30 to be fixed on a support portion 52.Lockable mechanism 52d has the first lock part 52f of bar 52e and convex, and this bar 52e can rotate, and the first lock part 52f of this convex moves in the vertical direction along with the action of the bar 52e rotated.Be provided with the second lock part 34d of recess on the top, handling part 34 of mounting head 30, the second lock part 34d of this recess engages with the first lock part 52f of side, head support portion 52.
If bar 52e rotates to downside, then the first downward side of lock part 52f is moved, and the first lock part 52f engages with the second lock part 34d, becomes lockup state.On the other hand, if bar 52e rotates to upside, then the lock part 52f of first upwards moves side, removes lockup state.
Control part 3 (with reference to Fig. 4) is such as made up of CPU (Central processing Unit: central processing unit).Control part 3 performs various calculating based on the various programs be stored in storage part 4, thus controls each several part of erecting device 100 uniformly.The process of this control part 3 is described in detail hereinafter.
Storage part 4 (with reference to Fig. 4) has nonvolatile memory and volatile memory, and the necessary various program of process of this nonvolatile memory memory control unit 3, this volatile memory uses as the operating area of control part 3.Also above-mentioned various program can be read from the mobility such as CD, semiconductor memory recording medium.
Display part 5 (with reference to Fig. 4) is made up of liquid crystal display, EL (Electro-Luminescence: electroluminescent) display etc., picture shows the various data relevant to erecting device 100, for operating the operation icon of erecting device 100.Input part 6 is such as made up of the touch sensor be configured on picture, hardware button etc., the various instructions of input operation personnel.
Shoot part 7 (with reference to Fig. 4) comprises that shooting is arranged on the shoot part 7 of the alignment mark of substrate 1, shooting is adsorbed on the various shoot parts 7 such as the shoot part 7 of the electronic unit 2 of the leading section of adsorption mouth 33b.These shoot parts 7 are such as arranged in the head framework 31 of mounting head 30, along with the movement of mounting head 30, move together with mounting head 30.Shoot part 7 such as by CCD (Charge Coupled Device: charge coupled device) transducer, CMOS (Complementary Metal Oxide Semiconductor: complementary metal oxide semiconductors (CMOS)) sensor capturing element, makes the imaging len etc. of image imaging in capturing element.
Department of Communication Force 8 (with reference to Fig. 4) sends information to other device in hookup wire such as other erecting device 100, base board checking device etc., and receives information from other device.
The kind of mounting head 30
As described above, the erecting device 100 in this technology can change the mounting head 30 supported by head support portion 52.At this, an example of the kind of mounting head 30 is described.
Fig. 6 is the figure of an example of the kind representing mounting head 30.In figure 6, from left, represent the mounting head 30 of type A, type B, Type C, type D successively.The mounting head 30 illustrated hereinbefore is corresponding with the mounting head 30B of type B in figure 6.Further, also show the height of the mounting head 30 of all types of mounting heads 30 when mounting electronic parts 2 in figure 6.
Mounting head 30A, the mounting head 30C of type A, Type C are decided to be the mode that head 33 can rotate in the same manner as the mounting head 30B of type B., mounting head 30A, the mounting head 30C of type A, Type C are different at the mounting head 30B of rotating shaft vertically direction this point and the type B of head 33.The mounting head 30 of the mounting head 30D of type D and other type is different, and head 33 self is non rotating also, in addition, compared with the mounting head 30 of other type, and the negligible amounts of adsorption mouth 33b.
The mounting head 30A of type A is the mounting head 30 for the relatively little electronic unit 2 of installation dimension.Compared with the electronic unit 2 installed with the mounting head 30A of type A, the mounting head 30B of type B, Type C, type D, mounting head 30C, mounting head 30D are the mounting heads 30 for the relatively large electronic unit 2 of installation dimension.
By making adsorption mouth 33b move in the vertical direction, each mounting head 30 keeps electronic unit 2 on supply unit 25, and mounting electronic parts 2 on substrate 1.Therefore, the installation rate of the electronic unit 2 of the close together from the upper surface of substrate 1 to the leading section of adsorption mouth 33b is very fast.Therefore, install compared with mounting head 30B, the mounting head 30C of mounting head 30A with type B, Type C, type D of the type A of the electronic unit 2 of comparing little with other erecting device 100, mounting head 30D, the height of the mounting head 30 when mounting electronic parts 2 is set as lower.Further, in this instance, mounting head 30B, the mounting head 30C of type B, Type C, type D, the height of the mounting head 30 of mounting head 30D when the installation of electronic unit 2 are decided to be common.
Each mounting head 30 has handling part 34 in the side of casing 31.The structure of this handling part 34 is common in each mounting head 30.In addition, the height from the leading section of adsorption mouth 33b to handling part 34 is also common in each mounting head 30.
Operating instruction
Next, the replacing Job Operations of the mounting head 30 that the process carried out erecting device 100 (control part 3) operates and undertaken by operating personnel is described.Fig. 7 is the figure of the replacing Job Operations of the mounting head 30 that the process operation that represents that erecting device 100 (control part 3) carries out and operating personnel carry out.
First, the control part 3 of erecting device 100 judges whether the replacing notifying mounting head 30 via input part 6 by operating personnel (step 101).In this case, such as, control part 3 shows on the picture of display part 5 changes start button (icon), and judges whether to be detected changing the operation of start button by touch sensor (input part 6).
When the mounting head supported by head support portion 52 30 being replaced by mounting head 30 of other kind, operating personnel start to change mounting head 30 (step 201) to erecting device 100 notice via input part 6.Such as, user touches the position shown by replacing start button shown on picture.
If change mounting head 30 ("Yes" of step 101) by operating personnel notify, control part 3 makes mounting head 30 move to replacing position, while the height (step 102) of adjustment mounting head 30.Change the position that position is such as decided to be the front side at erecting device 100, and be easy to the position of operation operating personnel.
In step 102, control part 3, by controlling X-axis travel mechanism 44 and Y-axis moving mechanism 41, makes mounting head 30 move in the x-y directions, thus makes mounting head 30 move to replacing position in XY plane.The while of with this operation, control part 3 controls Z axis travel mechanism 51, the height of adjustment head support portion 52, thus the height of adjustment mounting head 30.
Fig. 8 is the height map of the mounting head 30 represented when changing mounting head 30.As shown in Figure 8, the height (distance from substrate 1 upper surface to adsorption mouth 33b leading section) of the mounting head 30 of each mounting head 3 when changing mounting head 30 is set as common height.Therefore, touched by operating personnel change button to change mounting head 30 first watch time, the kind of control part 3 no matter mounting head 30, by the Height Adjustment of mounting head 30 to certain altitude.Further, because the height of mounting head 30 is common when first watch changes, so the height of head support portion 52 is also common when first watch changes.
With reference to Fig. 6 and Fig. 8, typically, the height (common in each mounting head 30) of the mounting head 30 when changing mounting head 30 is set as height compared with the height of the mounting head 30 during at mounting electronic parts 2.But, the height of the mounting head 30 when changing mounting head 30 without the need to must be set as the mounting head 30 when installing with electronic unit 2 height compared with height.Such as, height compared with height when the mounting head 30A of height (common) and the type A of the mounting head 30 when changing mounting head 30 is at mounting electronic parts 2, further, mounting head 30B, the mounting head 30C of type B, Type C, type D, mounting head 30D can be set as position low compared with the height of mounting electronic parts 2.
If mobile mounting head 30 is to changing position and adjusting the height of mounting head 30, then the present mounting head 30 supported by head support portion 52 is replaced by the mounting head 30 (step 202) of other kind by operating personnel.
As an example, the mounting head 30A of type A is replaced by the situation of the mounting head 30B of type B by imagination operating personnel.Now, first, the bar 52e of user operation lockable mechanism 52d, removes the lockup state of the mounting head 30A of type A, then, from the beginning support portion 52 is taken off the mounting head 30A of type A.Now, because the mounting head 30A of type A moves to suitable height and position, operating personnel operability can take off the mounting head 30A of type A well.In addition, also can not there is leading section and other component contact such as trucking department 15, supply unit 25 of the adsorption mouth 33b of mounting head 30A, cause producing damaged situation.
From the beginning operating personnel support portion 52 are taken off the mounting head 30A of type A, next, are assemblied on a support portion 52 by the mounting head 30B of type B.Now, first, the second engaging piece 52c of operating personnel's recess that the downside of the first engaging piece 34c insert head support portion 52 of the convex of the downside of the handling part 34 being arranged on mounting head 30B is arranged engages to make it.Then, the first engaging piece 34c as fulcrum, makes the mounting head 30B of type B rotate by operating personnel, thus promotes the mounting head 30B of type B to side, head support portion 52.
Now, power supply supply with the first connector 34a and the second connector 52a connect, thus to the mounting head 30B supply power of type B.In addition, communicate with the first connector 34b and the second connector 52b connect, erecting device 100 and mounting head 30B become the state that can communicate.If operating personnel promote the mounting head 30B of type B to side, head support portion 52, then make the bar 52e of lockable mechanism 52d rotate, thus make the mounting head 30B of type B be in lockup state.
As described above, in the present embodiment, in all types of mounting heads 30, the height (height of head support portion 52) of the mounting head 30 when changing mounting head 30 is decided to be common.Therefore, operating personnel can the operability mounting head 30B of fitting-type B on head support portion 52 well.That is, operating personnel can regardless of the kind of the most newly assembled mounting head 30 on head support portion 52, and operability assembles this mounting head 30 well on head support portion 52.
The control part 3 of erecting device 100, after making mounting head 30 move to change position, is changed mounting head 30, and is judged whether new mounting head 30 has been assemblied on a support portion 52 (step 103).Be assemblied in the situation ("Yes" of step 103) on a support portion 52 in new mounting head 30 under, control part 3 has judged the kind (step 104) of the up-to-date mounting head 30 be assemblied on a support portion 52.
At step 104, first, the correct control part 35 of control part 3 sends the command signal of the kind of information reading mounting head 30.If head control part 35 receives this signal, then read the kind of information of the mounting head 30 be stored in a storage part 36, and information is sent to control part 3.Thus, control part 3 can identify the kind of the most newly assembled mounting head 30.
Next, control part 3 judges whether to notify that the replacing of mounting head 30 completes (step 105) by operating personnel via input part 6.In this case, such as, control part 3 shows replacing and completes button (icon) on the picture of display part 5, and judges whether operation to having changed button to be detected by touch sensor (input part 6).
When completing the replacing of mounting head 30, to erecting device 100, operating personnel notify that the replacing of mounting head 30 completes (step 203) via input part 6.Such as, user touches the position shown by replacing start button shown on picture.
If notify that the replacing of mounting head 30 completes ("Yes" of step 105) by operating personnel, then control part 3 enters next step 106.In step 106, control part 3 makes mounting head 30 move to holding fix from replacing position, while the height of adjustment mounting head 30 is to the height (with reference to Fig. 6) (step 102) corresponding with the kind of mounting head 30.As long as holding fix such as mounting head 30 is easy to the position of restarting fitting operation, can be any position.The relation (Fig. 6) of the kind of mounting head 30 and the height of mounting head 30 is stored in advance in storage part 4.If electronic unit 2 restarts fitting operation, then mounting head 30 is with the height corresponding with the kind of mounting head 30 mounting electronic parts 2 on substrate 1.
Various variation
In above-mentioned example, the situation mounting head 30 supported head support portion 52 being replaced by different types of mounting head 30 is illustrated.On the other hand, between the mounting head 30 of identical type, also can carry out the replacing of mounting head 30.Such as, also the mounting head 30A of type A can be replaced by the mounting head 30A of other type A.Even if in this case, when changing mounting head 30, by adjusting the height of mounting head 30, also can improve the operability when changing mounting head 30.And then, also can prevent the leading section of the adsorption mouth 33b of mounting head 30 and other component contact such as trucking department 15, supply unit 25 and produce breakage.
In above-mentioned example, although using replacing start button, has changed button and be illustrated as the icon shown on picture, replacing start button, change the hardware button that button also can be push type.
In above-mentioned example, identify the method for the kind of the up-to-date mounting head 30 be assemblied on a support portion 52 as control part 3, enumerated the example that control part 3 reads the method for the kind of information being stored in mounting head 30 in a storage part 36 and be described., the method is not limited to.
As other method, such as, the recording medium arranging in mounting head 30 side and stored the kind of mounting head 30 can be enumerated, and then, arrange in erecting device 100 side and read record information in the recording medium, export the method for this information to the reading part of control part 3.As recording medium, such as, bar code, non-contact type IC etc. can be enumerated.In addition, as reading part, barcode reader can be enumerated, contactless ic reader etc.Typically, reading part is grasped by operating personnel, can move to the mode of the position of recording medium.
As long as out of the way position, the position arranging recording medium, can be arranged on any position in mounting head 30, such as, recording medium is arranged on the side of a framework 31.The position arranging reading part is also out of the way position, can be arranged on any position on erecting device 100, and such as, reading part is arranged on a support portion 52.
And then, as other method, can enumerate in mounting head 30 side, the face of the side, head support portion 52 of handling part 34 arranges the mode of transducer.When mounting head 30 being assemblied on a support portion 52, this transducer becomes on-state.The position of transducer is different based on the kind of each mounting head 30.By the address of I/O substrate determining to be connected with this transducer with the kind of each mounting head 30, the kind of mounting head 30 can be distinguished.
This technology also can adopt following structure.
(1) erecting device, comprising:
Head support portion, can be supported on the mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head;
Travel mechanism, makes described head support portion move in the height direction;
Altitude control portion, when changing described mounting head, being adjusted the height of described head support portion, thus adjusting the height of described mounting head by described travel mechanism.
(2) as described in erecting device as described in (1),
The described mounting head supported can be replaced by other mounting head different types of by described head support portion.
(3) as described in erecting device as described in (2),
Described control part judges the kind by replacing by the described mounting head of the up-to-date support in described head support portion, when being installed on the substrate by described electronic unit, adjusts the height of described mounting head to the height corresponding with the kind of described mounting head.
(4) as described in erecting device as described in (3),
Described mounting head has the memory of the kind storing described mounting head,
Described control part reads the kind of described mounting head from the described memory by changing by the described mounting head of the up-to-date support in described head support portion, and judges the kind of described mounting head.
(5) as described in erecting device as described in (3),
Described mounting head has the recording medium of the kind recording described mounting head,
Described erecting device also comprises reading part, described reading part reads the kind of information of described mounting head from the described recording medium by changing by the described mounting head of the up-to-date support in described head support portion, and exports the kind of information of described mounting head to described control part.
(6) as described in erecting device in (2) ~ (5) as described in any one,
Described control part, when changing described mounting head, adjusts the height of described mounting head to certain altitude, and without the need to the kind according to described mounting head.
(7) replacing options for mounting head,
The height of adjustment head support portion, thus the height of adjustment mounting head, described head support portion can be supported on the described mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head,
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head.
(8) manufacture method for substrate,
The height of adjustment head support portion, thus the height of adjustment mounting head, described head support portion can be supported on the described mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head,
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head described,
Utilization by the described mounting head of the up-to-date support in described head support portion, installs described electronic unit by replacing on the substrate.
Claims (8)
1. an erecting device, is characterized in that, comprising:
Head support portion, can be supported on the mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head;
Travel mechanism, makes described head support portion move in the height direction;
Altitude control portion, when changing described mounting head, being adjusted the height of described head support portion, thus adjusting the height of described mounting head by described travel mechanism.
2. erecting device as claimed in claim 1, wherein,
The described mounting head supported can be replaced by other mounting head different types of by described head support portion.
3. erecting device as claimed in claim 2, wherein,
Described control part judges the kind by replacing by the described mounting head of the up-to-date support in described head support portion, when being installed on the substrate by described electronic unit, adjusts the height of described mounting head to the height corresponding with the kind of described mounting head.
4. erecting device as claimed in claim 3, wherein,
Described mounting head has the memory of the kind storing described mounting head,
Described control part reads the kind of described mounting head from the described memory by changing by the described mounting head of the up-to-date support in described head support portion, judges the kind of described mounting head.
5. erecting device as claimed in claim 3, wherein,
Described mounting head has the recording medium of the kind recording described mounting head,
Described erecting device also comprises reading part, described reading part reads the kind of information of described mounting head from the described recording medium by changing by the described mounting head of the up-to-date support in described head support portion, and exports the kind of information of described mounting head to described control part.
6. erecting device as claimed in claim 2, wherein,
Described control part, when changing described mounting head, adjusts the height of described mounting head to certain altitude, and without the need to the kind according to described mounting head.
7. a replacing options for mounting head, is characterized in that,
The height of adjustment head support portion, thus the height of adjustment mounting head, described head support portion can be supported on the described mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head,
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head.
8. a manufacture method for substrate, is characterized in that,
The height of adjustment head support portion, thus the height of adjustment mounting head, described head support portion can be supported on the described mounting head of mounting electronic parts on substrate, and the described mounting head supported can be replaced by other mounting head,
After the height of the described mounting head of adjustment, the described mounting head that described head support portion supports is replaced by other mounting head described,
Utilization by the described mounting head of the up-to-date support in described head support portion, installs described electronic unit by replacing on the substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012176533 | 2012-08-08 | ||
| JP2012-176533 | 2012-08-08 | ||
| PCT/JP2013/003505 WO2014024368A1 (en) | 2012-08-08 | 2013-06-04 | Mounting device, mounting head replacement method, and substrate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104604359A true CN104604359A (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380036429.XA Pending CN104604359A (en) | 2012-08-08 | 2013-06-04 | Mounting device, mounting head replacement method, and substrate manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2014024368A1 (en) |
| CN (1) | CN104604359A (en) |
| WO (1) | WO2014024368A1 (en) |
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| CN109324279A (en) * | 2017-07-31 | 2019-02-12 | 精工爱普生株式会社 | Press device, electronic component handling apparatus and electronic component inspection device |
| CN110557938A (en) * | 2018-05-30 | 2019-12-10 | 松下知识产权经营株式会社 | Component mounting device |
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| JP6299716B2 (en) * | 2015-09-30 | 2018-03-28 | ダイキン工業株式会社 | Air conditioning indoor unit |
| JP7008175B2 (en) * | 2017-09-25 | 2022-01-25 | パナソニックＩｐマネジメント株式会社 | Parts mounting device |
| JP7223928B2 (en) * | 2017-09-25 | 2023-02-17 | パナソニックＩｐマネジメント株式会社 | Parts mounting device |
| DE102018122593B3 (en) * | 2018-09-14 | 2020-02-06 | Asm Assembly Systems Gmbh & Co. Kg | Placement head with intermeshing rotors, placement machine, method for loading a component carrier |
| WO2020110286A1 (en) * | 2018-11-30 | 2020-06-04 | 株式会社Ｆｕｊｉ | Unit management device and unit management method |
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Also Published As
| Publication number | Publication date |
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| JPWO2014024368A1 (en) | 2016-07-25 |
| WO2014024368A1 (en) | 2014-02-13 |
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