JP2005252118A - Electronic component packaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus capable of measuring failures in the energization force of a suction nozzle, and preventing the suction failures of electronic components due to a defective suction nozzle. <P>SOLUTION: In the electronic component packaging apparatus provided with a load-measuring device for measuring the energizing force of a nozzle slider of the suction nozzle, the energizing force of the nozzle slider is measured, by depressing the nozzle slider of the suction nozzle to the load-measuring device, the measured energizing force is compared with the energizing force of a standard suction nozzle which has previously been stored in a storage device, and is notification is given of the defective suction nozzle. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus for mounting various electronic components at predetermined positions on a substrate.

  2. Description of the Related Art Conventionally, an electronic component mounting apparatus supports a suction nozzle that vacuum-sucks an electronic component and supports this suction nozzle in order to mount an electronic component supplied by an electronic component supply device such as a tape feeder at a predetermined position on a substrate. An electronic component mounting head that is moved in the Z direction and rotated about an axis in the Z direction, and an XY moving mechanism that supports the mounting head and moves it in the XY direction.

  Electronic components are mounted by selecting a suction nozzle having a tip shape suitable for the electronic component to be sucked and mounting it on the head shaft of the mounting head, and the other suction nozzles are stored in a nozzle exchange station.

  These suction nozzles generally have a holding member and a hollow nozzle slider that is supported so as to be slidable up and down with respect to the holding member, and is always biased and held at the lowermost protruding position by a coil spring. In the vicinity, it is detachable from the head shaft, and an electronic component is vacuum-sucked at the tip of the nozzle slider.

  When the electronic component is mounted on the substrate, the electronic component is sandwiched between the substrate and the nozzle slider. At this time, the nozzle slider is pulled toward the holding member to avoid damage to the electronic component.

  If the urging force of the nozzle slider is too strong, the electronic components may be damaged. If it is too weak, the vertical position of the nozzle slider may not be constant.

  In order to avoid such an inconvenience, a coil spring having an appropriate biasing force is mounted on each suction nozzle.

Japanese Patent Laid-Open No. 2002-36160

  However, according to the electronic component mounting apparatus provided with this kind of electronic component suction nozzle, when the electronic component is sucked into the electronic component supply device or when the electronic component is mounted on the substrate, it is caused by the vertical movement of the holding member of the nozzle slider. The nozzle slider is damaged by wear and its sliding resistance value changes, which changes the urging force of the nozzle slider to the electronic components, and in the worst case, the nozzle slider may lock. Since the electronic component cannot be pressed with a constant urging force, for example, there is a problem that the component is easily damaged in an ultrathin electronic component or a low-load electronic component.

  The present invention has been made to solve such problems, and by measuring the biasing force of the nozzle slider in the suction nozzle, the electronic component mounting that can prevent the electronic component from being damaged due to sliding wear of the suction nozzle. An object is to provide an apparatus.

In order to solve this object, the invention described in claim 1 is provided with a plurality of suction nozzles that are supported by a holding member so as to be movable up and down and that are provided with a nozzle slider that presses the electronic component with a predetermined biasing force. ,
A head that is supported above the substrate so as to be movable in the XY direction, and that the suction nozzle is supported so as to be movable up and down and detachable;
A load measuring device that is disposed at a position facing the head and detects a biasing force when the nozzle slider is pressed;
A storage device for storing a reference urging force of the plurality of suction nozzles;
The reference urging force value for each suction nozzle stored in the storage device is compared with the detection value of the suction nozzle from the load measuring device, and if the detection value is outside the range of the reference value, the suction nozzle is selected. An electronic component mounting apparatus comprising: an informing means for informing.

According to the first aspect of the present invention, it is possible to find a defect in the suction nozzle by simply moving and pressing the nozzle slider to the load measuring device, and to replace the defective suction nozzle at an early stage. There is an effect that it is possible to prevent damage to electronic parts and low-load electronic parts.

Next, an embodiment of the electronic component mounting apparatus of the present invention will be described.
FIG. 1 shows a main part of a mounting apparatus 1 which is an embodiment of an electronic component mounting apparatus according to the present invention. In FIG. 1, reference numeral 2 denotes a substrate transfer device for transferring a substrate P. As is well known, this substrate transfer device 2 positions and fixes the substrate P transferred to the arrow X in FIG. ing.
A plurality of head shafts 5 </ b> A that detachably support a suction nozzle 5 (see FIG. 2) capable of vacuum-sucking electronic components and move in the vertical direction (Z direction) and the rotational direction are provided on the upper part of the substrate transport device 2. A head 6 provided; an XY movement mechanism 7 that moves the head 6 in the horizontal direction (XY direction); a component supply device 8 that supplies electronic components; and a motor that drives the head 6 and the XY movement mechanism 7. A driving means M such as is provided.
As shown in FIG. 2, the suction nozzle 5 is supported by a holding member 4 and a holding member 4 so as to be movable up and down, and includes a nozzle slider N that is always urged downward by a coil spring S with a constant urging force. .

  The drive means M shown in FIG. 1 is controlled by the mounter control unit 9 to move the head 6 to a predetermined position on the component supply device 8 to lower the suction nozzle 5, and at the tip of the nozzle slider N. The electronic component is pressed and vacuum-adsorbed. At this time, the electronic component is prevented from being damaged by the urging force of the coil spring S of the nozzle slider N. Thereafter, the head 6 is moved to a predetermined position on the substrate P, the suction nozzle 5 is lowered, the vacuum suction of the nozzle slider N is released, and the electronic component is pressed and mounted on the substrate P.

Also at this time, the electronic component is prevented from being damaged by the urging force of the coil spring S.
As shown in FIG. 4, the mounter control unit 9 is equipped with a CPU and is connected to an input unit and an output unit such as a storage unit K and a keyboard 10 (see FIG. 3). The CPU of the mounter control unit 9 controls each driving unit included in the mounting apparatus 1.
The storage means K stores various mounting programs necessary for mounting electronic components on a substrate and producing the substrate. This mounting program is composed of board data, mounting data, component data, suction data, and the like, and can be output for each of these components. Further, the reference urging force value by the spring S for each suction nozzle 5 and the head 6 are driven, and the suction nozzle 5 is taken out from the nozzle replacement station 13 (see FIG. 1) and is loaded onto the load cell 14 (load measuring device). The suction nozzle 5 is guided and pressed against the load cell 14, and the biasing force of the spring S of the suction nozzle 5 is detected and compared with a reference biasing force value for each suction nozzle 5, and outside the range of the reference biasing force value. If there is, a suction nozzle discriminating program for registering and notifying this information is stored.

  FIG. 3 shows the external appearance of the mounting apparatus 1 as a whole. Reference numeral 11 denotes a casing of the mounting apparatus 1. The casing 11 includes a keyboard 10 as an input unit connected to the mounter control unit 9 (see FIG. 1), a display lamp R as a notification unit, and an output unit as a notification unit. A liquid crystal monitor 12 is provided.

  As shown in FIG. 1, the main part of the mounting apparatus 1 having such a configuration is provided with the nozzle exchange station 13 at an appropriate location on the base adjacent to the substrate transfer apparatus 2. A plurality of suction nozzles 5 are accommodated, and at the time of nozzle replacement, the head 6 is positioned above the nozzle replacement station 13 and lowered, and the suction nozzle 5 is detached from the head shaft 5A of the head 6 to the nozzle replacement station 13, and this suction is performed. The nozzle is housed in the nozzle exchange station 13, and then another suction nozzle 5 is mounted on the head shaft 5 </ b> A of the head 6 from the nozzle exchange station 13.

  In the vicinity of the nozzle exchange station 13, a load measuring device 14 made of, for example, a load cell is installed.

  Next, with reference to FIG. 1 and FIG. 5, the operation of the suction nozzle measurement of the electronic component mounting apparatus will be described.

The measurement of the urging force of the suction nozzle 5 is performed after the setup such as the replacement of the suction nozzle when the electronic component is switched.
1 and 5, the head 6 moves onto the nozzle exchange station 13, the suction nozzle 5 at the nozzle exchange station 13 is attached (FIG. 5, steps 1 and 2), and moved onto the load cell 14 (FIG. 5). Step 3).
Next, the suction nozzle 5 is lowered, and the tip of the nozzle slider N of the suction nozzle 5 is pressed against the load cell 14.
Thereby, the load cell 14 detects the urging force of the spring S of the nozzle slider N (FIG. 5, step 4). The detected value is compared with the reference nozzle data of the suction nozzle 5 stored in the storage means of the mounter control unit 9, thereby determining whether or not there is an error in the suction nozzle 5 (FIG. 5, step 5). . If the suction nozzle is determined to be in error, error information is registered in the storage means (FIG. 5, step 6).
When it is determined that there is no error, and after the error information registration, the presence or absence of an undetected suction nozzle is determined (FIG. 5, step 7), and the suction nozzle 5 is returned to the original nozzle replacement station 13 position. An uninspected suction nozzle in the nozzle exchange station 13 is sucked. (Fig. 5, steps 1 and 2)
Thereafter, the inspection is repeated until the inspection of the suction nozzles 5 in all the nozzle replacement stations 13 is completed, and error information registration is performed each time an error of the suction nozzles 5 is detected. At this time, when the error information is registered, the display lamp R is turned on, and the type of the suction nozzle in which the error has occurred is displayed on the monitor 12 as the notification means.

It is a perspective view which shows the principal part of the electronic component mounting apparatus of this invention. It is sectional drawing of the suction nozzle used by this invention. It is an external appearance perspective view of the electronic component mounting apparatus of this invention. It is a block diagram which shows the control system in the electronic component mounting apparatus of this invention. It is a flowchart which shows the effect | action in the electronic component mounting apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Adsorption nozzle N Nozzle slider S Coil spring 6 Head 14 Load measuring apparatus

Claims (1)

A plurality of suction nozzles that are supported by the holding member so as to be movable up and down and that have a nozzle slider that presses the electronic component with a predetermined biasing force when sucking the electronic components;
A head which is supported above the substrate so as to be movable in the X-Y direction, and the suction nozzle is supported so as to move up and down and detachably;
A load measuring device that is disposed at a position facing the head and detects a biasing force when the nozzle slider is pressed;
A storage device for storing a reference urging force of the plurality of suction nozzles;
The reference urging force value for each suction nozzle stored in the storage device is compared with the detection value of the suction nozzle from the load measuring device, and if the detection value is outside the range of the reference value, the suction nozzle is selected. An electronic component mounting apparatus comprising: an informing means for informing.

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