JP6156869B2 - Position detection apparatus, substrate manufacturing apparatus, position detection method, and substrate manufacturing method - Google Patents

Description

  The present technology relates to a technology for accurately detecting the position of an alignment mark using a movable imaging unit.

  2. Description of the Related Art Conventionally, screen printing apparatuses that print cream solder on a substrate are widely known (see, for example, Patent Document 1).

  In the screen printing apparatus, a screen provided with pattern holes is used, a squeegee is disposed above the screen, and a substrate is disposed below the screen. Such a screen printing apparatus is configured such that when the squeegee slides on a screen supplied with cream solder, the cream solder is printed on the substrate through the pattern holes.

  In order to print cream solder on an accurate position of a substrate, a screen printing apparatus that adjusts the relative position between the screen and the substrate using an image obtained by capturing the screen and the alignment mark of the substrate with a camera is known.

JP2013-095051A

  In a screen printing apparatus that captures an alignment mark on a screen and a substrate with a camera, the actual position of the alignment mark on the screen or substrate is calculated from the position of the alignment mark in the image captured by the camera. Therefore, in such a screen printing apparatus, when there is an error in the setting value of the magnification of the image captured by the camera, an error also occurs in the adjustment of the relative position between the screen and the substrate.

  In view of the circumstances as described above, an object of the present technology is to provide a technology capable of more accurately calculating the actual position of the alignment mark from the position of the alignment mark in the image captured by the imaging unit.

In order to achieve the above object, a position detection device according to an embodiment of the present technology includes an imaging unit, a storage unit, and a control unit.
The imaging unit is movable along the reference plane while facing the reference plane, and images the alignment mark on the reference plane.
Conversion information configured to determine the magnification of an image captured by the imaging unit is recorded in the storage unit according to the position of the imaging unit.
The control unit calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit.

  With this configuration, the position detection device can calculate the position of the alignment mark on the reference plane from the position of the alignment mark in the image captured by the imaging unit using a magnification according to the position of the imaging unit. Therefore, an error in the magnification of the image due to the position of the imaging unit is suppressed, so that the position detection device can detect a more accurate position of the alignment mark.

The conversion information may include actual measurement values of magnifications of images captured by the imaging unit at a plurality of positions.
With this configuration, the position detection device can detect the position of the alignment mark more accurately than the position detection device in which only the representative value of the image magnification is set.

The plurality of positions may be regularly arranged along the reference plane.
With this configuration, the position detection device can detect a more accurate position of the alignment mark regardless of the position of the imaging unit along the reference plane.

The control unit may calculate the position of the alignment mark using the actual measurement value corresponding to the position closest to the position of the imaging unit among the plurality of positions.
Further, the control unit calculates a position of the alignment mark using a value calculated from the actual measurement value corresponding to two or more positions close to the position of the imaging unit among the plurality of positions. Also good.
With these configurations, the position detection device can detect a more accurate position of the alignment mark.

The position detection device may further include a holding unit that holds the substrate having the main surface on which the alignment mark is provided in accordance with the position of the main surface in accordance with the reference surface.
With this configuration, the position detection device can detect the accurate position of the substrate.

A substrate manufacturing apparatus according to an embodiment of the present technology includes a holding unit, a processing unit, an imaging unit, a storage unit, and a control unit.
The holding unit holds a substrate having a main surface provided with an alignment mark so that the position of the main surface matches the reference surface.
The processing unit processes the substrate held by the holding unit.
The imaging unit is movable along the reference plane in a state of facing the reference plane, and images the alignment mark.
Conversion information configured to determine the magnification of an image captured by the imaging unit is recorded in the storage unit according to the position of the imaging unit.
The control unit calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit. After the position of the substrate is recognized based on the determined position, the processing of the processing unit is performed on the substrate.

  With this configuration, the substrate manufacturing apparatus can calculate the position of the alignment mark on the substrate from the position of the alignment mark in the image captured by the imaging unit, using a magnification corresponding to the position of the imaging unit. Accordingly, since an error in the magnification of the image due to the position of the imaging unit is suppressed, the position detection device can adjust the relative position between the processing unit and the substrate more accurately.

A position detection method according to an embodiment of the present technology includes imaging an alignment mark on the reference plane by an imaging unit that is movable along the reference plane in a state of facing the reference plane.
The position detection method includes determining a magnification of an image captured by the imaging unit in accordance with a position of the imaging unit.
The position detection method includes calculating the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using a predetermined magnification.

  With this configuration, in the position detection method, the position of the alignment mark on the reference plane can be calculated from the position of the alignment mark in the image captured by the image capturing unit using a magnification according to the position of the image capturing unit. Accordingly, an error in the magnification of the image due to the position of the imaging unit is suppressed, so that the position detection method can detect a more accurate position of the alignment mark.

The manufacturing method of the board | substrate which concerns on one form of this technique includes arrange | positioning the board | substrate which has a main surface provided with the alignment mark according to the position of the said main surface to a reference plane.
The method for manufacturing the substrate includes imaging the alignment mark on the main surface arranged on the reference plane by an imaging unit movable along the reference plane in a state of facing the reference plane.
The method for manufacturing the substrate includes determining a magnification of an image captured by the imaging unit according to a position of the imaging unit.
The manufacturing method of the substrate calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using a predetermined magnification, and based on the calculated position Recognizing the position of the substrate.
The substrate manufacturing method includes performing processing on the substrate after recognizing the position of the substrate.

  With this configuration, the substrate manufacturing method can perform processing on a more accurate position of the substrate.

In the position detection method according to an aspect of the present technology, the imaging unit that is movable along the reference surface while facing the reference surface performs first imaging on the alignment mark on the reference surface. Including.
The position detection method includes a magnification of the first image obtained by the first imaging, a position of the imaging unit at the time of the first imaging, and a position of the alignment mark in the first image. Calculating a first position of the alignment mark on the reference plane.
The position detection method includes performing second imaging on the first position by the imaging unit.
The position detection method uses the magnification of the second image obtained by the second imaging, the position of the imaging unit in the second imaging, and the position of the alignment mark in the second image. Calculating a second position of the alignment mark on the surface.

  With this configuration, in the position detection method described above, the position of the alignment mark on the reference plane can be accurately calculated using an image obtained by the imaging unit capturing the alignment mark twice. Therefore, in the position detection method, a more accurate position of the alignment mark can be detected.

  As described above, according to the present technology, it is possible to provide a technology capable of more accurately calculating the actual alignment mark position from the alignment mark position in the image captured by the imaging unit.

It is a perspective view showing a screen printer concerning one embodiment of this art. It is a top view of the screen which can be attached to the screen printing apparatus shown in FIG. It is a partial schematic diagram of the screen printing apparatus shown in FIG. It is a partial schematic diagram of the screen printing apparatus shown in FIG. It is a block diagram which shows the structure of the screen printing apparatus shown in FIG. It is a perspective view for demonstrating operation | movement of the screen printing apparatus shown in FIG. It is a perspective view for demonstrating operation | movement of the screen printing apparatus shown in FIG. It is a top view of the calibration jig | tool relevant to this technique. It is a schematic diagram for demonstrating the measuring method of the magnitude | size of 1 pixel. It is a figure which shows the image for demonstrating the measuring method of the magnitude | size of 1 pixel. It is a figure which shows the image for demonstrating the measuring method of the magnitude | size of 1 pixel. It is a figure which shows the image for demonstrating the measuring method of the magnitude | size of 1 pixel. It is a top view of the calibration jig concerning this art. It is a mimetic diagram showing the state where the calibration jig concerning this art was installed. It is the figure which showed an example of the image which an imaging part images.

  Hereinafter, embodiments according to the present technology will be described with reference to the drawings. In the drawing, an X axis, a Y axis, and a Z axis that are orthogonal to each other are shown as appropriate. The X axis, the Y axis, and the Z axis are common in all drawings. The Z axis extends vertically in the direction of gravity.

[Overall Configuration of Screen Printing Apparatus 100 and Configuration of Each Unit]
FIG. 1 is a perspective view showing a screen printing apparatus 100 according to the present technology. FIG. 2 is a top view illustrating an example of the screen 10 that can be attached to the screen printing apparatus 100. 3A and 3B are partial schematic diagrams of the screen printing apparatus 100. FIG. FIG. 4 is a block diagram illustrating a configuration of the screen printing apparatus 100.

  In each drawing described in this specification, the size of each part of the screen printing apparatus 100 may be displayed differently from the actual size in order to display the drawing in an easy-to-read manner. In particular, in FIG. 1, the distance between the screen 10 side (upper side) and the conveyance unit 70 side (lower side) is shown to be separated from the actual distance in order to display the drawing in an easy-to-read manner (see FIG. 5 described later). The same).

  The screen printing apparatus 100 shown in these drawings is a screen printing apparatus 100 that prints cream solder on a substrate 8. The screen printing apparatus 100 is arranged in a mounting line for manufacturing a circuit board and constitutes a part of the mounting line.

  On the upstream side of the screen printing apparatus 100, for example, a substrate loading apparatus for loading the substrate 8 into the screen printing apparatus 100 is disposed. On the other hand, on the downstream side of the screen printing apparatus 100, a print inspection apparatus, a mounting apparatus, and the like are arranged.

  The printing inspection apparatus receives the substrate 8 (printed material) on which the cream solder is printed from the screen printing apparatus 100 and inspects the printing state of the cream solder. The print inspection apparatus transfers the substrate 8 that has been determined to be in a good printing state to the mounting apparatus disposed on the downstream side. The mounting apparatus receives from the print inspection apparatus the board 8 that has been determined to have a good printing state, and mounts electronic components on the board 8.

  As shown in the upper side of FIG. 1, the screen printing apparatus 100 according to this embodiment supplies a screen 10, a screen moving mechanism 20 for moving the screen 10, a squeegee unit 50, and cream solder on the screen 10. And a solder supply section 55 (see FIG. 4).

  As shown in the lower side of FIG. 1, the screen printing apparatus 100 includes an elevating base 60 and an elevating mechanism 61 that moves the elevating base 60 in the vertical direction. The screen printing apparatus 100 includes a transport unit 70 that transports the substrate 8 and a backup unit 62 (see FIGS. 3A, 3B, and 4) that is a holding unit that holds the substrate 8 from below.

  Furthermore, the screen printing apparatus 100 includes an imaging unit 80, an imaging unit moving mechanism 85 that moves the imaging unit 80, a cleaning unit 90 that cleans the lower surface of the screen 10, and a cleaning unit moving mechanism 95 that moves the cleaning unit 90. Is provided.

  As shown in FIG. 4, the screen printing apparatus 100 further includes a control unit 1, a storage unit 2, a display unit 3, an input unit 4, a communication unit 5, and the like.

  As shown in FIG. 2, the screen 10 includes a screen body 11 having a rectangular shape, and a screen frame body 12 that is provided along four sides of the screen body 11 and applies tension to the screen body 11. The screen body 11 is made of a metal such as stainless steel, for example.

  The screen body 11 has a plurality of pattern holes 13 corresponding to the print pattern in the central region. Also, two alignment marks 14 are provided in the vicinity of the corner of the screen body 11 that faces the substrate 8.

  In the present embodiment, since the imaging unit 80 is disposed on the lower side of the screen 10, the alignment mark 14 is provided toward the lower side of the screen body 11. When the imaging unit 80 is disposed on the upper side of the screen 10, the alignment mark 14 is provided toward the upper side of the screen body 11. In the example shown in the figure, the number of alignment marks 14 is two, but the number of alignment marks 14 may be two or more.

  The screen 10 is replaceable with the screen printing apparatus 100 and is replaced according to the type of the substrate 8. In the present embodiment, a plurality of types of screens 10 corresponding to the types of the substrates 8 are prepared. These various screens 10 differ in the number, shape, and size of the pattern holes 13. Further, the overall size of the screen 10 may be different (for example, L size, M size, etc.).

  As shown in the upper side of FIG. 1, the screen 10 is movably held by a screen moving mechanism 20. The screen moving mechanism 20 moves the screen 10 in the XYθ direction in order to align the screen 10 with the substrate 8.

  The screen moving mechanism 20 includes two screen holding members 21 that hold the screen 10, a table 25 that supports the two screen holding members 21 from above, and a table driving unit 30 that moves the table 25 in the XYθ direction. Have. In FIG. 1, in order to display the drawing in an easy-to-read manner, the table 25 is displayed with a one-dot chain line.

  The screen holding member 21 is made of, for example, a metal plate and holds the screen 10 in a detachable manner. The screen holding member 21 is formed symmetrically in the X-axis direction, and is disposed at a position where the screen 10 is sandwiched from both sides in the X-axis direction. The screen 10 can slide on the screen holding member 21 along the Y-axis direction.

  Each of the screen holding members 21 is provided with a side plate 22, a lower plate 23 attached perpendicularly to the side plate 22 at a position below the side plate 22, and a position above the side plate 22 perpendicular to the side plate 22. The upper plate 24 is provided.

  Although omitted in FIG. 1, the screen printing apparatus 100 includes a clamp member for fixing the screen 10 to the screen holding member 21. The clamp member clamps the screen frame body 12 and the lower plate 23 of the screen holding member 21 from above and below. The clamp member has a mechanism such as a cylinder, and can automatically clamp the screen frame body 12 and the screen holding member 21 by driving the cylinder.

  A width adjusting mechanism 26 for adjusting the distance between the two screen holding members 21 is provided between the screen holding member 21 and the table 25. The width adjusting mechanism 26 includes four guide rails 27 and four slide members 28 that engage with the four guide rails 27. The four guide rails 27 are fixed to the lower surface side of the table 25 along the X-axis direction. The four slide members 28 are fixed on the upper plate 24 of the screen holding member 21, are guided by guide rails, and are movable along the X-axis direction.

  The width adjusting mechanism 26 has a drive system such as a ball screw mechanism (not shown). The slide member 28 is moved along the X-axis direction by the drive of the drive system. Thereby, the distance between the screen holding members 21 can be automatically adjusted. For example, when the currently installed screen 10 is replaced with a screen 10 having an overall size different from that of the screen 10, the distance in the X-axis direction between the screen holding members 21 is adjusted.

  The table 25 can support the screen holding member 21 from above. In the center of the table 25, an opening for securing a space for arranging the squeegee unit 50 is provided.

  The squeegee unit 50 includes two squeegee mechanisms 51 provided so as to be symmetrical in the Y-axis direction. The squeegee unit 50 includes a Y-axis movement mechanism for moving the two squeegee mechanisms 51 integrally in the Y-axis direction, a vertical movement mechanism for moving the squeegee mechanism 51 in the vertical direction, and the like.

  Each of the two squeegee mechanisms 51 has a squeegee 52 at a lower position. The squeegee 52 is slid in the Y-axis direction on the screen 10 to which the cream solder is supplied. The squeegee 52 is placed on the substrate 8 disposed below the screen 10 through the pattern holes 13 provided in the screen 10. Cream solder is printed.

  When one of the two squeegee mechanisms 51 is slid on the screen 10, the other squeegee mechanism 51 is disposed above the screen 10. At this time, the other squeegee mechanism 51 is not in contact with the screen 10. The squeegee mechanism 51 that is slid on the screen 10 (that is, the squeegee mechanism 51 that performs printing) is switched alternately.

  Although omitted in FIG. 1, the Y-axis moving mechanism that moves the two squeegee mechanisms 51 in the Y-axis direction is provided on the table 25. Therefore, as the table drive unit 30 moves the table 25 and the screen 10 in the XYθ directions, the squeegee unit 50 is also moved in the XYθ directions.

  The table drive unit 30 as a drive source for moving the screen 10 in the XYθ direction includes two Y-axis drive mechanisms 31, one X-axis drive mechanism 32, and one interlocking mechanism 33. These four mechanisms 31, 32, 33 are arranged near the lower side of the four corners of the table 25.

  The two Y-axis drive mechanisms 31 are disposed in the vicinity of the two front corners among the four corners of the table 25. The X-axis drive mechanism 32 is disposed in the vicinity of the left rear corner of the four corners of the table 25. The interlocking mechanism 33 is disposed in the vicinity of the right rear corner of the four corners of the table 25.

  In addition, the position where these four mechanisms are arrange | positioned can be changed suitably. For example, the two Y-axis drive mechanisms 31 can be arranged on the rear side, and the X-axis drive mechanism 32 and the interlocking mechanism 33 can be arranged on the front side. Alternatively, the positions of the X-axis drive mechanism 32 and the interlocking mechanism 33 can be reversed.

  The four mechanisms 31, 32, and 33 are each fixed to a post (not shown) and the like, and support the table 25 from below while being fixed to the post. The Y-axis drive mechanism 31 moves the table 25 in the Y-axis direction by driving while supporting the table 25 from below. The X-axis drive mechanism 32 moves the table 25 in the X-axis direction by driving the table 25 while supporting the table 25 from below. Further, the Y-axis drive mechanism 31 and the X-axis drive mechanism 32 can rotate the table 25 around the Z axis (θ direction) by interlocking these drive mechanisms.

  The interlocking mechanism 33 does not have a drive source for moving the table 25. The interlocking mechanism 33 operates in conjunction with the driving of the table 25 by the Y-axis drive mechanism 31 and the X-axis drive mechanism 32 while supporting the table 25 from below.

  As shown in the lower side of FIG. 1, the transport unit 70 includes a first guide 71, a second guide 72, a conveyor belt 73, and a guide moving mechanism 75 (see FIG. 4). The first guide 71 and the second guide 72 extend along the X-axis direction (conveyance direction) and guide the substrate along the X-axis direction. The conveyor belt 73 is provided on the first guide 71 and the second guide 72 so as to face each other in the Y-axis direction.

  The substrate 8 is disposed on the conveyor belt 73 and is moved along the X-axis direction while being guided by the first guide 71 and the second guide 72 by driving the conveyor belt 73. The conveyance unit 70 can carry in the substrate 8 or deliver the substrate 8 that has been printed to another device by driving the conveyor belt 73.

  The transport unit 70 is provided with a stop mechanism for stopping the substrate 8 transported in the X-axis direction at a reference position determined for each type of the substrate 8. For example, the reference position of the substrate 8 is set in the vicinity of the central portion of the transport unit 70. Examples of the stop mechanism include a mechanism that mechanically stops the movement of the substrate 8 and a mechanism that detects the position of the substrate 8 with a sensor.

  The stop mechanism that mechanically stops the movement of the substrate 8 is constituted by a stopper, for example. The stopper is configured to be movable between a restriction position that protrudes from the first guide 71 and the second guide 72 in the Y-axis direction to restrict the movement of the substrate 8 and a release position that allows the movement of the substrate 8. Is done.

  The stop mechanism that stops the substrate 8 by detecting the position of the substrate 8 with a sensor includes, for example, an optical sensor that detects the substrate 8 (no stopper). This stop mechanism detects the position of the substrate 8 to be carried in by an optical sensor, and controls the driving of the conveyor belt 73 so that the substrate 8 stops at the reference position.

  3A and 3B are schematic diagrams illustrating the substrate 8, the transport unit 70, and the imaging unit 80 at the reference position.

  As shown in FIGS. 3A and 3B, the conveyance unit 70 is configured such that the second guide 72 is movable in the Y-axis direction, and the first guide 71 is fixed and does not move in the Y-axis direction. . Thereby, the distance between the guides 71 and 72 can be changed, and for example, as shown in FIG.

  Note that the position of the alignment mark 9 on the substrate 8 in the state shown in FIG. 3A is greatly different from the position of the alignment mark 9a on the substrate 8a in the state shown in FIG. 3B. Thus, the alignment marks are arranged at various positions depending on the type of the substrate. In the screen printing apparatus 100, the control unit recognizes the position of the alignment mark on the substrate at the reference position according to the information regarding the substrate input by the user.

  The transport unit 70 is configured such that at least one of the first guide 71 and the second guide 72 is movable in the Y-axis direction in order to change the distance between the guides 71 and 72. That's fine. That is, the transport unit 70 may have a configuration in which both the first guide and the second guide can move in the Y-axis direction, or a configuration in which only the first guide can move in the Y-axis direction.

  A backup unit 62 that holds the substrate 8 from below is disposed at the reference position. The backup unit 62 supports the substrate 8 transported to the reference position by driving the conveyor belt 73 from below. The backup unit 62 lifts the substrate 8 from the conveyor belt 73 and aligns the upper surface of the substrate 8 with the reference surface B. In this state, the substrate 8 is clamped by the guides 71 and 72 from both sides in the Y-axis direction. Thereby, the board | substrate 8 is positioned.

  In the screen printing apparatus 100, the reference plane B is set at a fixed position regardless of the type of the substrate 8. Therefore, in the screen printing apparatus 100, the height at which the substrate 8 is lifted by the backup unit 62 is changed according to the thickness information of the substrate 8, and the upper surface of the substrate 8 is made to coincide with the reference plane B. For example, as shown in FIG. 3B, in the substrate 8 a thicker than the substrate 8, the height lifted by the backup unit 62 is made lower than that of the substrate 8.

  As shown on the lower side of FIG. 1, an imaging unit moving mechanism 85 that moves the imaging unit 80 in the XY directions is provided on the elevating base 60. The imaging unit moving mechanism 85 includes two guide rails 86 arranged along the X-axis direction on the lifting base 60, and a slide member 87 provided to be slidable on each of the two guide rails 86, And a drive system for driving the slide member 87 in the X-axis direction.

  The imaging unit moving mechanism 85 includes a support frame 88 that is stretched over two slide members 87 so as to straddle the transport unit 70. The support frame 88 supports the imaging unit 80 so as to be movable in the Y-axis direction, and has a drive system for driving the imaging unit 80 in the Y-axis direction inside.

  The imaging unit 80 can move in an XY direction in a region below the screen 10 and above the substrate 8. The imaging unit 80 includes a camera capable of imaging the alignment mark 14 provided on the lower surface of the screen 10 and the alignment mark 9 provided on the upper surface of the substrate 8.

  The camera of the imaging unit 80 has a configuration capable of imaging both the alignment mark 14 on the screen 10 and the alignment mark 9 on the substrate 8. For example, the camera can employ an arrangement in which an image of an upper screen and an image of a substrate below can be simultaneously captured in one field of view using an optical member such as a half mirror.

  The camera having this configuration can take an image of one of the screen and the substrate when illuminated. More specifically, with this camera, the screen can be imaged when the screen is illuminated and the substrate is not illuminated. On the other hand, when the screen is not illuminated and the substrate is illuminated, the substrate can be imaged.

  On the elevating base 60, a cleaning unit 90 and a cleaning unit moving mechanism 95 that moves the cleaning unit 90 in the X-axis direction are provided. The cleaning unit moving mechanism 95 includes two guide rails 86 that are used in common with the imaging unit moving mechanism 85, a slide member 97 that is slidably provided on the two guide rails 86, and a slide member 97. And a drive system for driving in the axial direction.

  The cleaning unit moving mechanism 95 includes a support frame 98 that is stretched over two slide members 97 so as to straddle the transport unit 70. The support frame 98 supports the cleaning unit 90 from below.

  The cleaning unit 90 includes a feed roller 91 that feeds the cleaning paper 93 and a take-up roller 92 that winds the cleaning paper 93.

  The control unit 1 illustrated in FIG. 4 is configured by, for example, a CPU (Central Processing Unit) and the like, and comprehensively controls each unit of the screen printing apparatus 100.

  The storage unit 2 includes a non-volatile memory used as a work area for the control unit 1 and a non-volatile memory in which various data and programs necessary for the processing of the control unit 1 are stored. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The display unit 3 is configured by, for example, a liquid crystal display. The input unit 4 includes a keyboard, a mouse, a touch panel, and the like, and inputs various instructions from the operator. The communication unit 5 transmits information to other apparatuses such as a print inspection apparatus and a mounting apparatus, and receives information from other apparatuses.

[Operation of Screen Printing Apparatus 100]
Next, the operation of the screen printing apparatus 100 will be described. The operation of the screen printing apparatus 100 described here is executed under the control of the control unit 1. 5 and 6 are perspective views for explaining the basic operation of the screen printing apparatus 100. FIG.

  First, as shown in FIG. 5, the substrate 8 is transported to the reference position by driving the conveyor belt 73 of the transport unit 70. At this time, the imaging unit 80 is retracted to the right end position (standby position) of the lifting base 60 by the imaging unit moving mechanism 85 and is on standby. Further, the cleaning unit 90 is retracted to the left end position (standby position) of the lifting base 60 by the cleaning unit moving mechanism 95 and stands by.

  Next, the backup unit 62 is moved upward, and the substrate 8 is supported by the backup unit 62 from below. Then, the substrate 8 is lifted by the backup unit 62 so that the upper surface of the substrate 8 coincides with the reference plane B. In this state, the guide 72 moves to the guide 71 side, and the guides 71 and 72 clamp the substrate 8.

  Next, the imaging unit 80 is moved in the X and Y directions by the imaging unit moving mechanism 85, and the camera images the alignment marks 9 (two or more places) on the substrate 8. The imaging unit 80 transmits the captured image of the alignment mark 9 to the control unit 1. When the imaging of the alignment mark 9 on the substrate 8 is completed, the imaging unit 80 is moved to the standby position (the right end of the lifting base 60) by the imaging unit moving mechanism 85.

  Based on the image of the alignment mark 9 of the substrate 8 received from the imaging unit 80, the control unit 1 recognizes the position in the XY direction where the substrate 8 is disposed, the inclination of the substrate 8 around the Z axis, and the like. When recognizing the position of the substrate 8, the controller 1 drives the table driver 30 to move the table 25 in the XYθ direction. As a result, the screen 10 is moved in the XYθ direction and aligned with the substrate 8.

  In order for the control unit 1 to align the screen 10 with the substrate 8, the control unit 1 needs to recognize the position of the screen 10 and the position of the substrate. The control unit 1 detects the position of the screen 10 when the screen 10 is replaced, and detects the position of the substrate 8 every time the substrate 8 is transported. Details of the position detection of the substrate 8 and the screen 10 will be described later.

  The screen printing apparatus 100 according to the present embodiment has a configuration in which the screen moving mechanism 20 adjusts the position of the screen 10 with respect to the position of the substrate 8. However, the screen printing apparatus 100 may include a moving mechanism for the substrate 8 and adjust the position of the substrate 8 with respect to the position of the screen 10 by this moving mechanism.

  When the screen 10 is aligned with the substrate 8, the elevating mechanism 61 moves the elevating base 60 upward until the substrate 8 contacts the lower surface of the screen 10. FIG. 6 shows a state in which the elevating base 60 is moved upward. In FIG. 6, members such as the imaging unit 80 and the cleaning unit 90 are omitted for easy viewing of the drawing.

  When the substrate 8 comes into contact with the lower surface of the screen 10, one of the two squeegee mechanisms 51 descends and comes into contact with the screen 10. The descending squeegee mechanism 51 is determined in advance according to the direction in which the squeegee unit 50 moves. The squeegee mechanism 51 that does not descend is maintained in a state where it does not contact the screen 10.

  When one squeegee mechanism 51 abuts on the screen 10, the two squeegee mechanisms 51 are moved together in the Y-axis direction. Thereby, one squeegee mechanism 51 is slid on the screen 10 in the Y-axis direction, and cream solder is printed on the substrate 8 through the pattern holes 13. When the squeegee unit 50 moves to a portion that slightly exceeds the area where the pattern hole 13 is formed on the screen 10, one squeegee mechanism 51 that has been in contact with the substrate 8 moves upward, and the squeegee unit 50 is in this state. Wait at.

  When cream solder is printed on the substrate 8, the elevating base 60 is moved downward by the elevating mechanism 61. When the elevating base 60 moves downward, the second guide 72 (rear guide) of the transport unit 70 moves a predetermined amount to the rear side, and the fixed state of the substrate 8 is released. Next, the conveyor belt 73 of the conveyance unit 70 is driven, and the printed substrate 8 is transferred to the downstream print inspection apparatus.

  When cleaning the lower surface of the screen 10, the cleaning unit 90 is first moved in the X-axis direction by the cleaning unit moving mechanism 95. Thereafter, the height of the cleaning unit 90 is adjusted, and the feeding roller 91 and the take-up roller 92 rotate in conjunction with the movement of the cleaning unit 90 in the X-axis direction. Thereby, the lower surface of the screen 10 is cleaned by the cleaning paper 93.

  When the cleaning is completed, the cleaning unit 90 is moved to the standby position (the lift base left end) by the cleaning unit moving mechanism 95 and stands by at the standby position.

[Position detection function of substrate 8]
The function of detecting the position of the substrate 8 in the screen printing apparatus 100 will be described.

  In the screen printing apparatus 100, in order to cope with a fine print pattern provided on the screen 10, the alignment between the substrate 8 and the screen 10 needs to be precisely performed. As described above, the screen printing apparatus 100 includes the stop mechanism that stops the substrate 8 at the reference position when the substrate 8 is carried in, but in this state, the alignment is not accurate.

  Specifically, when the substrate 8 is stopped by the stopper, the position of the substrate 8 is shifted from the reference position due to a slight impact that the substrate 8 comes into contact with the stopper, or due to the influence of burrs at the end of the substrate 8. In some cases, the position of the substrate 8 is not exactly aligned with the reference position. In the stop mechanism using the sensor, the position of the substrate 8 may deviate from the reference position due to an error in the operation of the conveyor belt 73 or an inertial force applied when the substrate 8 is stopped.

  Therefore, in the screen printing apparatus 100, the shift of the position of the substrate 8 from the reference position is detected, and the screen 10 is moved so as to cancel the shift of the substrate 8 when the screen 10 is aligned with the substrate 8. The position of the substrate 8 is recognized by the position of the alignment mark 9 on the substrate 8.

  Here, the position of the alignment mark 9 on the substrate 8 at the correct reference position is also simply referred to as “reference position of the alignment mark 9”. When the imaging unit 80 captures the alignment mark 9 of the loaded substrate 8, the imaging unit 80 assumes that the alignment mark 9 of the substrate 8 exists at the reference position, and the actual position of the substrate 8 at the reference position of the alignment mark. The alignment mark 9 is imaged from above. If the alignment mark of the actual substrate is accurately positioned at the reference position of the alignment mark, the alignment mark is positioned at the center of the image. However, due to the above-described causes, in general, the alignment mark is slightly shifted from the center of the image. The imaging position of the alignment mark (reference position of the alignment mark 9) is a different position depending on the type of substrate.

  In order to obtain the distance between the position of the alignment mark 9 and the reference position from the image of the alignment mark 9 imaged by the imaging unit 80, the magnification of the image that associates the distance in the image with the actual distance in the reference plane B is It must be recorded in advance as conversion information. In the screen printing apparatus 100, as a value corresponding to the magnification of the image, a size on the reference plane B corresponding to one pixel of the image (hereinafter simply referred to as “the size of one pixel”). It is recorded in the storage unit 2.

  In the screen printing apparatus 100, the number of pixels between the position of the alignment mark 9 and the reference position in the image of the alignment mark 9 is detected, and the position of the alignment mark 9 and the reference position are multiplied by this pixel number. The distance between is calculated.

  A method for obtaining the size of one pixel recorded in the storage unit 2 of the screen printing apparatus 100 will be described with reference to FIGS.

  FIG. 7 is a plan view of a calibration jig f related to the present embodiment. The calibration jig f has a flat plate shape similar to that of the substrate 8, and an alignment mark f1 is provided at the center. FIG. 8 is a schematic diagram illustrating the position of the imaging unit 80. 9A to 9C are diagrams illustrating images captured by the imaging unit 80. 9A to 9C, the center of the image is displayed as C. 9A to 9C show the X axis, the Y axis, and the Z axis corresponding to the postures of the substrates displayed in the images.

  Note that the center C of the image corresponds to the optical axis of the imaging unit 80. In other words, the optical axis of the imaging unit 80 passes through the position on the substrate 8 displayed at the center C of the image. That is, the position on the substrate 8 corresponding to the center C of the image changes according to the position of the imaging unit 80.

  FIG. 8 shows a state in which the optical axis of the imaging unit 80 passes through the alignment mark f1 of the calibration jig f. In the state shown in FIG. 8, the upper surface of the calibration jig f coincides with the reference plane B. FIG. 9A shows an image obtained by imaging the alignment mark f1 in the state shown in FIG. The alignment mark f1 coincides with the center C of the image.

  From the state shown in FIG. 9A, the imaging unit 80 is moved 2 mm toward the front side in the X-axis direction in FIG. FIG. 9B is an image obtained by imaging the alignment mark f1 of the calibration jig f in this state. The alignment mark f1 is shifted by a pixel from the center C of the image to the upper side in the X-axis direction.

  Next, from the state illustrated in FIG. 9B, the imaging unit 80 is moved 4 mm toward the far side in the X-axis direction in FIG. 8. That is, from the state shown in FIG. 9A, the imaging unit 80 is moved 2 mm toward the back side in the X-axis direction in FIG. FIG. 9C is an image obtained by imaging the alignment mark f1 of the calibration jig f in this state. The alignment mark f1 is shifted by b pixels downward in the X-axis direction with respect to the center C of the image.

  From the above results, the actual measurement value of the size of one pixel in the X-axis direction can be obtained as the amount of movement of the camera per pixel, and is 4 / (a + b) [mm / pixel]. A measured value of the size of one pixel in the Y-axis direction can also be obtained by the same method. Thus, the size of one pixel when the imaging unit 80 is at the position shown in FIG. 8 is obtained. Note that when the size of one pixel is obtained, a distance for moving the imaging unit 80 can be arbitrarily selected.

  The size of one pixel obtained as described above can be set in the storage unit 2 of the screen printing apparatus 100 as a representative value corresponding to the magnification of the image captured by the imaging unit 80. However, in this embodiment, when the position of the imaging unit 80 is different from the position shown in FIG. 8, taking into account that an error may occur in the size of one pixel, conversion information to be recorded in the storage unit 2 is prepared. To do.

  The cause of an error in the size of one pixel of the image captured by the image capturing unit 80 depending on the position of the image capturing unit 80 is, for example, a minute change in posture (such as yawing, rolling, or pitching) when the image capturing unit 80 is moved. An up-and-down movement of the imaging unit 80 is exemplified. A slight change in posture and vertical movement during the movement of the imaging unit 80 are caused by a combination of mechanical configurations such as the slide member 87 and the support frame 88 shown in FIG. 1, and are difficult to eliminate. Further, the slide member 87 and the support frame 88 may be distorted due to deterioration over time.

  The distance between the imaging unit 80 and the reference plane B also changes as the posture of the imaging unit 80 changes or moves up and down. When the distance between the imaging unit 80 and the reference plane B changes, the size of one pixel of the image captured by the imaging unit 80 also changes. More specifically, the size of one pixel decreases as the distance between the imaging unit 80 and the reference plane B decreases. On the other hand, when the distance between the imaging unit 80 and the reference plane B increases, the size of one pixel increases.

  For example, when an error of about 0.5 to 1.0 mm occurs in the distance between the imaging unit 80 and the reference plane B due to a change in the orientation of the imaging unit, an error of about 0.02 μm is added to the size of one pixel. Is assumed to occur. The more the position of the alignment mark in the image is displaced from the center (the more the substrate 8 is displaced from the reference position), the greater the error in the detected position of the substrate 8.

  In the present embodiment, the size of one pixel is measured at a plurality of positions of the imaging unit 80 in order to suppress an error in the size of one pixel that may occur as described above. That is, conversion information configured so that the size of one pixel is determined according to the position of the imaging unit 80 is prepared, and the conversion information is recorded in the storage unit 2.

  FIG. 10 is a plan view of a calibration jig F for preparing such conversion information. The calibration jig F has a flat plate shape similar to the calibration jig f, and the alignment marks F1 are regularly arranged in a lattice pattern over almost the entire area thereof.

  The calibration jig F has a dimension in the X-axis direction of 400 mm and a dimension in the Y-axis direction of 500 mm. The size of the calibration jig F is equal to the maximum size of the substrate 8 applicable to the screen printing apparatus 100.

  The calibration jig F is made of, for example, stainless steel or glass. The alignment mark F1 provided on the calibration jig F only needs to be visible. For example, the alignment mark F1 is configured as a hole, a ruled line, or a step.

  In the present embodiment, each alignment mark F1 is configured as a round hole having a diameter of 1 mm. Each alignment mark F1 is provided at equal intervals in the X-axis direction and the Y-axis direction, and the interval between the centers of adjacent alignment marks F1 is 10 mm. The vicinity of the four sides of the calibration jig F is a margin where the alignment mark F1 is not provided. In FIG. 10, the alignment mark F1 is shown large for convenience of explanation.

  FIG. 11 shows a state where the calibration jig F is installed at the reference position of the screen printing apparatus 100. In the state shown in FIG. 11, the upper surface of the calibration jig F coincides with the reference plane B. That is, the height of the upper surface of the calibration jig F matches the height of the upper surface of the substrate. The size of one pixel is measured for all the alignment marks F1 of the calibration jig F in the manner of measuring the size of one pixel for the alignment mark f1 of the calibration jig f shown in FIG. Thereby, the size of one pixel in each case where the imaging unit 80 is in a position where the optical axis of the imaging unit 80 passes through each alignment mark F1 is obtained. Note that the height of the upper surface of the calibration jig F is matched with the height of the upper surface of the substrate (that is, the distance between the imaging unit 80 and the substrate and the distance between the imaging unit 80 and the jig F are matched). ), The size of one pixel at each position can be accurately obtained.

  The size of one pixel corresponding to each position of the imaging unit 80 obtained in this way is associated with the position of the imaging unit 80 and recorded in the storage unit 2 as conversion information.

  In the screen printing apparatus 100 according to the present embodiment, the reference position of the alignment mark 9 of the substrate 8 determined by the imaging unit 80 according to the type of the substrate 8 in a state where the substrate 8 is carried in, for example, the state shown in FIG. The alignment mark 9 is imaged with the optical axis passing through. At this time, the center C of the image captured by the imaging unit 30 corresponds to the reference position of the alignment mark on the substrate 8.

  FIG. 12 is a diagram illustrating an example of an image captured by the imaging unit 30. In this image, it is assumed that the alignment mark 9 on the substrate 8 is located at q pixels on the left side in the Y-axis direction and p pixels on the lower side in the X-axis direction with respect to the center C of the image.

  The control unit 1 acquires the size of one pixel corresponding to the position of the imaging unit 30 using the conversion information recorded in the storage unit 2. When the size of one pixel in the X-axis direction is multiplied by the value of p, a distance that the alignment mark 9 is actually displaced in the X-axis direction with respect to the reference position on the reference plane B is obtained. Similarly, when the size of one pixel in the Y-axis direction is multiplied by the value q, a distance in which the alignment mark 9 is actually displaced in the Y-axis direction with respect to the reference position on the reference plane B is obtained.

  As described above, when the distance between the two alignment marks 9 on the substrate 8 shifted in the X-axis direction and the Y-axis direction with respect to the reference position is obtained, the control unit 1 shifts the position of the substrate 8 in the XYθ direction. Can be recognized. The control unit 1 adjusts the position of the screen 10 so as to cancel out the displacement of the position of the substrate 8. Thereby, the relative position of the screen 10 and the board | substrate 8 comes to be adjusted correctly.

  As the size of one pixel corresponding to the position of the imaging unit 30 acquired by the control unit 1, for example, the size of one pixel at the position closest to the position of the imaging unit 30 in the conversion information recorded in the storage unit 2 Can be adopted. Since the interval between the alignment marks F1 of the calibration jig F shown in FIG. 10 is 10 mm, the position closest to the position of the imaging unit 30 in the conversion information recorded in the storage unit 2 is the position of the imaging unit 30. To 5 mm. Therefore, an error of the size of one pixel hardly occurs.

  Moreover, as a magnitude | size of 1 pixel corresponding to the position of the imaging part 30 which the control part 1 acquires, for example, in the conversion information recorded on the memory | storage part 2, in four positions close to the position of the imaging part 30 An average value of the size of one pixel can also be adopted. Also in this case, among the conversion information recorded in the storage unit 2, all four positions close to the position of the imaging unit 30 are within a range of 5 mm from the position of the imaging unit 30. Therefore, an error of the size of one pixel hardly occurs.

  Further, when a correlation is obtained between the position coordinates of the imaging unit 30 and the size of one pixel, the conversion information recorded in the storage unit 2 is a function of the position coordinates of the imaging unit 30 and the size of one pixel. There may be. In this case, the control unit 1 can calculate the size of one pixel from the position coordinates of the imaging unit 30 using the function.

[Screen 10 position detection function]
In the screen printing apparatus 100 according to the present embodiment, also for the screen 10, the size of one pixel when the imaging unit 80 is at each position is recorded in the storage unit 2 as conversion information in association with the position of the imaging unit 80. Has been. Although the substrate 8 and the screen 10 are upside down with respect to the imaging unit 80, conversion information is obtained using the same calibration jig as the calibration jig F shown in FIG. It is possible to prepare.

  The calibration jig is arranged so that the alignment mark faces downward, and the position of the lower surface of the calibration jig in the Z-axis direction is matched with the position of the lower surface of the screen 10 in the Z-axis direction. The height of the lower surface of the calibration jig F is matched with the height of the lower surface of the screen (that is, the distance between the imaging unit 80 and the screen and the distance between the imaging unit 80 and the jig are matched). ), The size of one pixel at each position can be obtained accurately.

  In the screen printing apparatus 100 according to the present embodiment, when the screen 10 is replaced, the imaging unit 80 is in a state where the optical axis passes through the reference position of the alignment mark 14 of the screen 10 determined according to the type of the screen 10. The alignment mark 14 is imaged. A deviation of the alignment mark 14 from the reference position is obtained from the image captured by the imaging unit 80 in the same manner as the substrate 8.

  When the two alignment marks 14 on the screen 10 are displaced from each other in the X-axis direction and the Y-axis direction with respect to the reference position, the control unit 1 recognizes the shift in the position of the screen 10 in the XYθ direction. it can. The control unit 1 adjusts the position of the screen 10 so as to cancel out this position shift.

  As described above, the screen printing apparatus 100 according to the present embodiment can accurately recognize the position of the substrate 8 and the position of the screen 10 by recording the conversion information in the storage unit 2.

[Other configurations]
In the screen printing apparatus 100 according to the present embodiment, a mode is set in which the imaging unit 80 captures the alignment mark 9 of the substrate 8 a plurality of times in order to detect the position of the substrate 8 very accurately.

  In this mode of the screen printing apparatus 100, first, the imaging unit 80 performs the first imaging of the alignment mark 9 on the substrate 8. From the image obtained by the first imaging, the distance that the alignment mark 9 is displaced in the X-axis direction and the Y-axis direction from the reference position as described above is calculated.

  Next, the control unit 1 moves the imaging unit 80 so that the optical axis passes through the position of the alignment mark 9 calculated from the image obtained by the first imaging of the imaging unit 80. The second imaging of the alignment mark 9 is performed. If the position of the alignment mark 9 is deviated from the center C even in the image obtained by the second shooting, the distance that the alignment mark 9 is deviated in the X axis direction and the Y axis direction from the reference position is calculated again. The

  Thus, in the screen printing apparatus 100, the position of the alignment mark 9 on the substrate 8 is recognized very accurately after the second shooting. Similarly, in the screen printing apparatus 100, the position of the alignment mark 9 on the substrate 8 can be more accurately recognized by setting the number of times of imaging of the alignment mark 9 by the imaging unit 8 to 3 or more.

  Note that in this mode of the screen printing apparatus 100, in order to calculate the deviation of the alignment mark 9 from the reference position, the magnification of the image is not used regardless of the position of the imaging unit 80 without using the conversion information according to the present embodiment. Even when the representative value was used, the position of the alignment mark 9 on the substrate 8 was accurately recognized after the second imaging.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, the position adjustment mechanism according to the present embodiment can be applied to apparatuses used for manufacturing a substrate such as a substrate inspection apparatus and a substrate mounting apparatus in addition to the screen printing apparatus. In the substrate inspection apparatus, it is possible to inspect an accurate position in the substrate by accurately recognizing the position of the substrate. In the board mounting apparatus, it is possible to mount a component at an appropriate position in the board by accurately recognizing the position of the board.

  Note that processing a substrate includes all operations on the substrate, such as screen printing on the substrate, inspecting the substrate, and mounting components on the substrate.

  In the calibration jig according to the present embodiment, alignment marks are arranged in a grid pattern. However, if the calibration jig is provided with at least two alignment marks, the effect of the present technology can be obtained. It is possible.

In addition, this technique can also take the following structures.
(1)
An imaging unit that is movable along the reference surface in a state of facing the reference surface, and that images an alignment mark on the reference surface;
A storage unit in which conversion information configured to determine a magnification of an image captured by the imaging unit is determined according to a position of the imaging unit;
A position detection unit comprising: a control unit that calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit. apparatus.
(2)
The position detection device according to (1) above,
The conversion information includes a measured value of a magnification of an image captured by the imaging unit at a plurality of positions, respectively.
(3)
The position detection device according to (2) above,
The plurality of positions are regularly arranged along the reference plane.
(4)
The position detection device according to (2) or (3) above,
The said control part calculates the position of the said alignment mark using the said measured value corresponding to the position nearest to the position of the said imaging part among the said several positions.
(5)
The position detection device according to (2) or (3) above,
The control unit calculates a position of the alignment mark using a value calculated from the measured value corresponding to two or more positions close to the position of the imaging unit among the plurality of positions. .
(6)
The position detection device according to any one of (1) to (5) above,
A position detection device further comprising a holding unit that holds a substrate having a main surface provided with the alignment mark so that a position of the main surface is aligned with the reference surface.
(7)
A substrate having a main surface provided with an alignment mark, and a holding unit for holding the main surface in accordance with a reference surface;
A processing unit for processing the substrate held by the holding unit;
An imaging unit that is movable along the reference surface in a state of facing the reference surface, and that images the alignment mark;
A storage unit in which conversion information configured to determine a magnification of an image captured by the imaging unit is determined according to a position of the imaging unit;
Using the conversion information recorded in the storage unit, the position of the alignment mark in the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image, and based on the calculated position A substrate manufacturing apparatus comprising: a control unit that executes processing on the substrate by the processing unit after recognizing the position of the substrate.
(8)
The alignment mark on the reference surface is imaged by an imaging unit that is movable along the reference surface in a state of facing the reference surface,
According to the position of the imaging unit, the magnification of the image captured by the imaging unit is determined,
A position detection method that calculates a position of the alignment mark on the reference plane from a position of the imaging unit and a position of the alignment mark in the image using a predetermined magnification.
(9)
A substrate having a main surface provided with an alignment mark is arranged with the position of the main surface aligned with a reference surface,
With the imaging unit movable along the reference surface in a state of facing the reference surface, the alignment mark of the main surface arranged on the reference surface is imaged.
According to the position of the imaging unit, the magnification of the image captured by the imaging unit is determined,
Using the determined magnification, the position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image, and the position of the substrate is recognized based on the calculated position. ,
A method for manufacturing a substrate, comprising: performing processing on the substrate after recognizing a position of the substrate.
(10)
First imaging is performed with respect to the alignment mark on the reference plane by an imaging unit movable along the reference plane in a state of facing the reference plane.
From the magnification of the first image obtained by the first imaging, the position of the imaging unit at the time of the first imaging, and the position of the alignment mark in the first image, the alignment on the reference plane Calculate the first position of the mark,
Second imaging is performed on the first position by the imaging unit,
From the magnification of the second image obtained by the second imaging, the position of the imaging unit in the second imaging, and the position of the alignment mark in the second image, the alignment mark on the reference plane A position detection method for calculating the second position.

DESCRIPTION OF SYMBOLS 1 ... Control part 2 ... Memory | storage part 8 ... Board | substrate 9 ... Alignment mark 10 ... Screen 14 ... Alignment mark 62 ... Backup part (holding part)
80 ... Imaging unit 100 ... Screen printing device B ... Reference plane F ... Calibration jig F1 ... Alignment mark

Claims (9)

An imaging unit that is movable along the reference surface in a state of facing the reference surface, and that images an alignment mark on the reference surface;
A storage unit in which conversion information configured to determine a magnification of an image captured by the imaging unit is determined according to a position of the imaging unit;
A position detection unit comprising: a control unit that calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit apparatus. The position detection device according to claim 1,
The conversion information includes a measured value of a magnification of an image captured by the imaging unit at a plurality of positions. The position detection device according to claim 2,
The plurality of positions are regularly arranged along the reference plane. The position detection device according to claim 2,
The said control part calculates the position of the said alignment mark in the said reference plane using the said measured value corresponding to the position nearest to the position of the said imaging part among these positions. The position detection device according to claim 2,
The control unit calculates a position of the alignment mark on the reference plane using values calculated from the actual measurement values corresponding to two or more positions close to the position of the imaging unit among the plurality of positions. Yes Position detection device. The position detection device according to claim 1,
A position detection device further comprising: a holding unit that holds a substrate having a main surface provided with the alignment mark so that a position of the main surface matches the reference surface. A substrate having a main surface provided with an alignment mark, and a holding unit for holding the main surface in accordance with a reference surface;
A processing unit for processing the substrate held by the holding unit;
An imaging unit that is movable along the reference surface in a state of facing the reference surface, and that images the alignment mark;
A storage unit in which conversion information configured to determine a magnification of an image captured by the imaging unit is determined according to a position of the imaging unit;
Using the conversion information recorded in the storage unit, the position of the alignment mark in the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image, and based on the calculated position A substrate manufacturing apparatus comprising: a control unit that executes processing on the substrate by the processing unit after recognizing the position of the substrate. The alignment mark on the reference surface is imaged by an imaging unit that is movable along the reference surface in a state of facing the reference surface,
According to the position of the imaging unit, the magnification of the image captured by the imaging unit is determined,
A position detection method that calculates a position of the alignment mark on the reference plane from a position of the imaging unit and a position of the alignment mark in the image using a predetermined magnification. A substrate having a main surface provided with an alignment mark is arranged with the position of the main surface aligned with a reference surface,
With the imaging unit movable along the reference surface in a state of facing the reference surface, the alignment mark of the main surface arranged on the reference surface is imaged.
According to the position of the imaging unit, the magnification of the image captured by the imaging unit is determined,
Using the determined magnification, the position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image, and the position of the substrate is recognized based on the calculated position. ,
A method for manufacturing a substrate, comprising: performing processing on the substrate after recognizing a position of the substrate.

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