KR20150001675A - Position detecting apparatus, substrate manufacturing apparatus, position detecting method, and manufacturing method of substrate - Google Patents

Abstract

The present invention provides technology capable of accurately calculating an actual position of an alignment mark from a position of an alignment mark on an image imaged by an imaging unit. A position detecting apparatus of the present invention includes: an imaging unit, a memory unit and a control unit. The imaging unit is movable along a reference plane in a state of being opposite to the reference plane, and images an alignment mark on the reference plane. The memory unit is recorded by a conversion information to set a magnification of an image imaged by the imaging unit in accordance to the position of the imaging unit. The control unit calculates the position of the alignment mark on the reference plane using the conversion information recorded in the memory unit from the position of the imaging unit and the position of the alignment mark on the image.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a position detecting device, a position detecting method, and a substrate manufacturing method,

The present technology relates to a technique for accurately detecting the position of an alignment mark using a movable imaging unit.

2. Description of the Related Art Conventionally, a screen printing apparatus for printing cream solder on a substrate is widely known (see, for example, Patent Document 1).

In the screen printing apparatus, a screen having a patterned hole is used, a squeegee is disposed on the upper side of the screen, and a substrate is disposed on the lower side of the screen. In such a screen printing apparatus, when the squeegee slides on the screen to which the cream solder is supplied, the cream solder is printed on the substrate through the pattern hole.

A screen printing apparatus is known in which a relative position between a screen and a substrate is adjusted by using an image of a screen and an alignment mark of the substrate taken by a camera in order to print the cream solder at the correct position of the substrate.

Japanese Patent Application Laid-Open No. 2013-095051

In a screen printing apparatus for photographing an alignment mark of a screen and a substrate with a camera, the position of an alignment mark on an actual screen or substrate is calculated from the position of the alignment mark in the image captured by the camera. For this reason, in such a screen printing apparatus, when there is an error in the set value of the magnification of the image picked up by the camera, there is an error in adjusting the relative position between the screen and the substrate.

In view of the above circumstances, an object of the present invention is to provide a technique that can more accurately calculate the position of an actual alignment mark from the position of the alignment mark in an image captured by the image pickup unit.

In order to achieve the above object, a position detecting device according to an aspect of the present invention includes an image pickup section, a storage section, and a control section.

The imaging unit is movable along the reference plane in a state of being opposed to the reference plane, and captures an alignment mark on the reference plane.

The storage unit stores conversion information that is configured so that a magnification of an image captured by the imaging unit is determined according to the position of the imaging unit.

The control unit calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image, using the conversion information recorded in the storage unit.

With this configuration, the position detecting device can calculate the position of the alignment mark on the reference surface from the position of the alignment mark in the image captured by the image pickup section, using the magnification depending on the position of the image pickup section. Therefore, since the error of the magnification of the image according to the position of the imaging unit is suppressed, the position detecting device can detect a more accurate position of the alignment mark.

The conversion information may include an actual value of a magnification of an image captured by the imaging unit at a plurality of positions.

With this configuration, the position detecting device can detect a more accurate position of the alignment mark than the position detecting device in which only the representative value of the magnification of the image is set.

The plurality of positions may be regularly arranged along the reference plane.

With this configuration, the position detecting device can detect a more accurate position of the alignment mark even when the imaging section is at any position along the reference plane.

The control unit may calculate the position of the alignment mark by using the measured value corresponding to the position closest to the position of the imaging unit among the plurality of positions.

The control unit may calculate the position of the alignment mark using a value calculated from the measured values corresponding to two or more positions near the position of the imaging unit among the plurality of positions.

With this configuration, the position detecting device can detect a more accurate position of the alignment mark.

The position detecting device may further comprise a holding portion for holding the substrate having the main surface provided with the alignment mark so as to align the position of the main surface with the reference surface.

With this configuration, the position detecting device can detect the precise position of the substrate.

A substrate manufacturing apparatus according to one aspect of the present invention includes a holding section, a processing section, an image pickup section, a storage section, and a control section.

The holding section holds the substrate having the main surface provided with the alignment marks so as to align the position of the main surface with the reference surface.

The processing section processes the substrate held by the holding section.

The imaging unit is movable along the reference plane in a state of being opposed to the reference plane, and captures the alignment mark.

The storage unit stores conversion information constituted so that a magnification of an image to be imaged by the imaging unit is determined in accordance with the position of the imaging unit.

The control unit calculates the position of the alignment mark on the reference plane from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit, And recognizes the position of the substrate based on the position of the substrate.

With this configuration, the substrate manufacturing apparatus can calculate the position of the alignment mark on the substrate from the position of the alignment mark in the image picked up by the image pickup section, using the magnification depending on the position of the image pickup section. Therefore, since the error of the magnification of the image according to the position of the imaging unit is suppressed, the position detecting apparatus can more accurately adjust the relative position between the processing unit and the substrate.

A position detection method according to an aspect of the present invention includes capturing an alignment mark on the reference plane by an imaging section that can move along the reference plane in a state opposed to the reference plane. The position detection method includes determining a magnification of an image to be imaged by the imaging unit according to the position of the imaging unit.

The position detection method includes calculating a position of the alignment mark on the reference plane from a position of the imaging unit and a position of the alignment mark in the image using a fixed magnification.

With this configuration, in the position detection method, the position of the alignment mark on the reference plane can be calculated from the position of the alignment mark in the image captured by the imaging unit, using the magnification depending on the position of the imaging unit. Therefore, since the error of the magnification of the image according to the position of the imaging unit is suppressed, the position detection method can detect a more accurate position of the alignment mark.

A method of manufacturing a substrate according to an aspect of the present invention includes disposing a substrate having a main surface provided with alignment marks so that the position of the main surface is aligned with the reference surface.

The manufacturing method of the substrate includes imaging the alignment mark on the main surface disposed on the reference surface by the imaging unit that can move along the reference surface in a state opposed to the reference surface.

The substrate manufacturing method includes determining a magnification of an image to be imaged by the imaging unit according to the position of the imaging unit.

Wherein the position of the alignment mark on the reference plane is calculated from the position of the imaging section and the position of the alignment mark in the image using a fixed magnification and based on the calculated position, And recognizing the position of the substrate.

The manufacturing method of the substrate includes performing processing on the substrate after recognizing the position of the substrate.

According to this configuration, in the method of manufacturing a substrate, it is possible to perform a process with respect to a more accurate position of the substrate.

The position detection method according to an aspect of the present invention includes performing a first image pickup with respect to an alignment mark on the reference plane by an image pickup section that can move along the reference plane in a state opposed to the reference plane.

Wherein the position detection method further comprises a step of calculating a position of the alignment mark on the reference plane from the magnification of the first image obtained by the first imaging, the position of the imaging unit in the first imaging, And calculating a first position of the alignment mark. The position detection method includes performing, by the imaging unit, a second image pickup with respect to the first position.

Wherein the position detection method further comprises a step of calculating a position of the alignment mark on the reference plane based on the magnification of the second image obtained by the second imaging, the position of the imaging unit in the second imaging and the position of the alignment mark in the second image And calculating a second position of the alignment mark of the first alignment mark.

With this configuration, in the position detection method, it is possible to accurately calculate the position of the alignment mark on the reference surface by using the image of the imaging section picking up the alignment mark twice. Therefore, in the position detection method, a more accurate position of the alignment mark can be detected.

As described above, according to the present technique, it is possible to provide a technique that can more accurately calculate the position of an actual alignment mark from the position of the alignment mark in the image captured by the image pickup unit.

1 is a perspective view showing a screen printing apparatus according to an embodiment of the present technology.
2 is a plan view of a screen that can be attached to the screen printing apparatus shown in Fig.
3A is a partial schematic view of the screen printing apparatus shown in Fig.
3B is a partial schematic view of the screen printing apparatus shown in Fig.
4 is a block diagram showing the configuration of the screen printing apparatus shown in Fig.
5 is a perspective view for explaining the operation of the screen printing apparatus shown in Fig.
6 is a perspective view for explaining the operation of the screen printing apparatus shown in Fig.
7 is a plan view of a calibration jig associated with the present technique.
8 is a schematic diagram for explaining a method of measuring the size of one pixel.
9A is a diagram showing an image for explaining a method of measuring the size of one pixel.
9B is a diagram showing an image for explaining a method of measuring the size of one pixel.
9C is a diagram showing an image for explaining a method of measuring the size of one pixel.
10 is a plan view of a calibration jig according to the present technique.
11 is a schematic diagram showing a state where a calibration jig according to the present technology is installed.
12 is a diagram showing an example of an image captured by the image pickup section.

Hereinafter, embodiments of the present technology will be described with reference to the drawings. Further, the drawings show X-axis, Y-axis and Z-axis which are mutually orthogonal to each other. The X-axis, the Y-axis, and the Z-axis are common to all the drawings. The Z axis extends vertically in the direction of gravity.

[Overall Configuration of Screen Printing Apparatus 100 and Configuration of Each Part]

1 is a perspective view showing a screen printing apparatus 100 according to the present technology. Fig. 2 is a top view showing an example of the screen 10 that can be attached to the screen printing apparatus 100. Fig. 3A and 3B are partial schematic views of the screen printing apparatus 100. Fig. Fig. 4 is a block diagram showing the configuration of the screen printing apparatus 100. As shown in Fig.

In the drawings described in the present specification, there are cases where the size of each part of the screen printing apparatus 100 is displayed differently from the actual one in order to easily display the drawings. 1, the distance between the side of the screen 10 (upper side) and the side of the carry section 70 (lower side) is shown to be smaller than the actual distance being).

The screen printing apparatus 100 shown in these drawings is a screen printing apparatus 100 that prints cream solder on a substrate 8. The screen printing apparatus 100 is disposed in a mounting line for manufacturing a circuit board, and constitutes a part of the mounting line.

On the upstream side of the screen printing apparatus 100, for example, a substrate feeding apparatus for feeding the substrate 8 to the screen printing apparatus 100 is disposed. On the other hand, on the downstream side of the screen printing apparatus 100, a printing inspection apparatus, a mounting apparatus, and the like are disposed.

The printing inspection apparatus receives the substrate 8 (printed matter) on which the cream solder is printed from the screen printing apparatus 100, and checks the printing state of the cream solder. The printing inspection apparatus transfers the substrate 8 determined to be in a good printing state to a mounting apparatus disposed on the downstream side. The mounting apparatus receives the substrate 8 judged to be in a good printing state from the printing inspection apparatus and mounts the electronic parts on the substrate 8. [

1, the screen printing apparatus 100 according to the present embodiment includes a screen 10, a screen moving mechanism 20 for moving the screen 10, a squeegee 50, And a solder supply portion 55 (see Fig. 4) for supplying cream solder on the screen 10.

1, the screen printing apparatus 100 includes a lifting base 60 and a lifting mechanism 61 for moving the lifting base 60 in the up and down direction. The screen printing apparatus 100 further includes a transport section 70 for transporting the substrate 8 and a backup section 62 (see FIGS. 3A, 3B, and 4) which is a holding section for holding the substrate 8 from below .

The screen printing apparatus 100 further includes an imaging section 80, an imaging section moving mechanism 85 for moving the imaging section 80, a cleaning section 90 for cleaning the lower surface of the screen 10, And a cleaning portion moving mechanism 95 for moving the cleaning portion 90.

4, the screen printing apparatus 100 further includes a control unit 1, a storage unit 2, a display unit 3, an input unit 4, a communication unit 5, and the like.

2, the screen 10 is provided with a screen main body 11 having a rectangular shape and a plurality of projections 11 provided along the four sides of the screen main body 11 to apply tension to the screen main body 11. [ And a screen frame body 12 to which the frame body 12 is attached. The screen main body 11 is made of, for example, a metal such as stainless steel.

The screen main body 11 has a plurality of pattern holes 13 corresponding to the print pattern in the central area. Two alignment marks 14 are provided in the vicinity of the corner portion of the portion of the screen main body 11 which faces the substrate 8.

In this embodiment, since the imaging section 80 is disposed below the screen 10, the alignment marks 14 are provided toward the lower side of the screen main body 11. When the image sensing unit 80 is disposed on the upper side of the screen 10, the alignment mark 14 is provided toward the upper side of the screen main body 11. [ In the example shown in the drawing, the number of alignment marks 14 is two, but the number of alignment marks 14 may be two or more.

The screen 10 is interchangeable with respect to the screen printing apparatus 100 and is exchanged according to the type of the substrate 8. [ In this embodiment, a plurality of kinds of screens 10 according to the type of the substrate 8 are prepared. These various screens 10 differ in the number, shape and size of the pattern holes 13. In addition, the overall size of the screen 10 may be different (e.g., L size, M size, etc.).

As shown in the upper side of Fig. 1, the screen 10 is movably held by the screen moving mechanism 20. The screen moving mechanism 20 moves the screen 10 in the XY &thetas; direction so as to align the screen 10 with respect to the substrate 8. [

The screen moving mechanism 20 includes two screen holding members 21 for holding the screen 10, a table 25 for supporting the two screen holding members 21 from above, And a table drive unit 30 for moving the table drive unit 30 in the direction indicated by the arrow. In Fig. 1, the table 25 is indicated by a dash-dotted line in order to facilitate the display of the drawings.

The screen holding member 21 is constituted by, for example, a metal plate or the like, and detachably holds the screen 10. [ The screen holding member 21 is symmetrically formed in the X-axis direction and is disposed at a position where the screen 10 is sandwiched from both sides in the X-axis direction. The screen 10 can slide on the screen holding member 21 along the Y-axis direction.

The screen holding member 21 includes a side plate 22 and a lower plate 23 vertically attached to the side plate 22 at a lower position of the side plate 22 and at a position above the side plate 22 And an upper plate 24 provided perpendicularly to the side plate 22.

1, the screen printing apparatus 100 has a clamp member for fixing the screen 10 to the screen holding member 21. [ The clamp member clamps the screen frame 12 and the lower plate 23 of the screen holding member 21 from the up and down direction. The clamp member has a mechanism such as a cylinder and can automatically clamp the screen frame member 12 and the screen holding member 21 by driving the cylinder.

Between the screen holding member 21 and the table 25, a width adjusting mechanism 26 for adjusting the distance between the two screen holding members 21 is provided. The width adjusting mechanism 26 includes four guide rails 27 and four slide members 28 which engage with the four guide rails 27. [ The four guide rails 27 are fixed to the lower surface of the table 25 along the X-axis direction. The four slide members 28 are fixed on the upper plate 24 of the screen holding member 21 and can be guided by the guide rails to move along the X-axis direction.

The width adjusting mechanism 26 has a driving system such as a ball screw mechanism not shown. The slide member 28 is moved along the X-axis direction by driving the drive system. Thereby, the distance between the screen holding members 21 can be automatically adjusted. For example, when the currently attached screen 10 is replaced with a screen 10 having a different size from the screen 10, the distance in the X-axis direction between the screen holding members 21 is adjusted.

The table 25 can support the screen holding member 21 from above. In the center of the table 25, an opening for securing a space for arranging the squeegee portion 50 is formed.

The squeegee portion 50 has two squeegee mechanisms 51 provided so as to be symmetrical in the Y-axis direction. The squeegee unit 50 includes a Y-axis moving mechanism for moving the two squeegee mechanisms 51 integrally in the Y-axis direction and a vertical moving mechanism for moving the squeegee mechanism 51 in the vertical direction .

The two squeegee mechanisms 51 each have a squeegee 52 at a lower position. The squeegee 52 is slid toward the Y axis direction on the screen 10 supplied with the cream solder and passes through the pattern hole 13 formed in the screen 10 to the substrate 8 disposed on the lower side of the screen 10, Cream solder is printed on the surface.

The other squeegee mechanism 51 is disposed above the screen 10 when the squeegee mechanism 51 of one of the two squeegee mechanisms 51 is sliding on the screen 10 . At this time, the other squeegee mechanism 51 is not in contact with the screen 10. The squeegee mechanism 51 (that is, the squeegee mechanism 51 for printing) sliding on the screen 10 is alternately switched.

Although not shown in Fig. 1, the Y-axis moving mechanism for moving the two squeegee mechanisms 51 in the Y-axis direction is installed on the table 25 in a standing manner. The squeegee portion 50 is also moved in the XY &thetas; direction with the movement of the table 25 or the screen 10 in the XY &thetas; direction by the table driving portion 30. [

The table drive unit 30 as a drive source for moving the screen 10 in the XY? Direction includes two Y-axis drive mechanisms 31, one X-axis drive mechanism 32, and one interlocking mechanism 33). These four mechanisms 31, 32, and 33 are disposed in the vicinity of the four corners of the table 25.

The two Y-axis driving mechanisms 31 are disposed in the vicinity of the two front sides of the four corners of the table 25. The X-axis driving mechanism 32 is disposed in the vicinity of the left rear corner of the four corners of the table 25. The interlocking mechanism 33 is disposed in the vicinity of the right rear corner of the four corners of the table 25.

In addition, the positions where these four mechanisms are disposed can be appropriately changed. For example, the two Y-axis drive mechanisms 31 may be disposed on the rear side, and the X-axis drive mechanism 32 and the interlock mechanism 33 may be disposed on the front side. Alternatively, the positions of the X-axis driving mechanism 32 and the interlocking mechanism 33 may be reversed.

Each of the four mechanisms 31, 32, 33 is fixed to a support column or the like, not shown, and supports the table 25 from the lower side while being fixed to the support column. The Y-axis driving mechanism 31 moves the table 25 in the Y-axis direction by driving the table 25 while supporting the table 25 from below. The X-axis driving mechanism 32 moves the table 25 in the X-axis direction by driving the table 25 while supporting the table 25 from below. The Y-axis driving mechanism 31 and the X-axis driving mechanism 32 can rotate the table 25 around the Z-axis (? Direction) by interlocking of these driving mechanisms.

Further, the interlocking mechanism 33 does not have a driving source for moving the table 25. The interlocking mechanism 33 operates in conjunction with the driving of the table 25 by the Y-axis driving mechanism 31 and the X-axis driving mechanism 32 while supporting the table 25 from below.

1, the carry section 70 includes a first guide 71, a second guide 72, a conveyor belt 73, a guide moving mechanism 75 (see Fig. 4) . The first guide 71 and the second guide 72 extend along the X-axis direction (transport direction) and guide the substrate along the X-axis direction. The conveyor belt 73 is provided so as to face the first guide 71 and the second guide 72 in the Y axis direction, respectively.

The substrate 8 is disposed on the conveyor belt 73 and is moved along the X axis direction while being guided by the first guide 71 and the second guide 72 by the driving of the conveyor belt 73. [ The conveying unit 70 can convey the substrate 8 by driving the conveyor belt 73 or transfer the substrate 8 on which printing has been completed to another apparatus.

The transfer section 70 is provided with a stop mechanism for stopping the substrate 8 conveyed in the X-axis direction at a reference position determined for each type of the substrate 8. The reference position of the substrate 8 is set near the center of the carry section 70, for example. Examples of the stopping mechanism include a mechanism for mechanically stopping the movement of the substrate 8 and a mechanism for detecting the position of the substrate 8 with a sensor.

The stop mechanism for mechanically stopping the movement of the substrate 8 is constituted by, for example, a stopper. The stopper is provided between a regulating position protruding from the first guide 71 and the second guide 72 in the Y axis direction to regulate the movement of the substrate 8 and a releasing position permitting movement of the substrate 8 As shown in FIG.

The stop mechanism for stopping the substrate 8 by detecting the position of the substrate 8 with a sensor includes, for example, an optical sensor for detecting the substrate 8 (not including a stopper). The stop mechanism detects the position of the substrate 8 to be carried by the optical sensor and controls the driving of the conveyor belt 73 so that the substrate 8 stops at the reference position.

3A and 3B are schematic diagrams showing the substrate 8, the carry section 70, and the image pickup section 80 at the reference position.

3A and 3B, in the carry section 70, the second guide 72 is movable in the Y-axis direction, and the first guide 71 is fixed so as not to move in the Y-axis direction have. As a result, the distance between the guides 71 and 72 can be changed. For example, as shown in Fig. 3B, it is possible to correspond to the substrate 8a having a wider width in the Y-axis direction than the substrate 8.

The position of the alignment mark 9 of the substrate 8 in the state shown in Fig. 3A differs greatly from the position of the alignment mark 9a of the substrate 8a in the state shown in Fig. 3B. As described above, depending on the type of the substrate, the alignment marks are arranged at various positions. In the screen printing apparatus 100, the control unit recognizes the position of the alignment mark on the substrate at the reference position in accordance with the information about the substrate inputted by the user.

The carry section 70 is configured such that at least one of the first guide 71 and the second guide 72 can move in the Y axis direction in order to change the distance between the guides 71 and 72 It should be. That is, the carry section 70 may be configured such that both the first guide and the second guide are movable in the Y-axis direction, and only the first guide may be movable in the Y-axis direction.

At the reference position, a backup unit 62 for holding the substrate 8 from below is disposed. The backup unit 62 supports the substrate 8 conveyed to the reference position by driving the conveyor belt 73 from below. The backup unit 62 lifts the substrate 8 from the conveyor belt 73 so that the upper surface of the substrate 8 and the reference surface B coincide with each other. In this state, the substrate 8 is clamped by the guides 71 and 72 from both sides in the Y-axis direction. Thereby, the substrate 8 is positioned.

In the screen printing apparatus 100, the reference plane B is set at a constant position irrespective of the type of the substrate 8. Therefore, in the screen printing apparatus 100, the height at which the substrate 8 is lifted by the backup unit 62 is changed in accordance with the thickness information of the substrate 8 so that the upper surface of the substrate 8 is moved to the reference plane B Match. 3B, the height of the substrate 8a raised by the backup unit 62 is made lower than that of the substrate 8 in the substrate 8a thicker than the substrate 8, for example.

1, an imaging unit moving mechanism 85 for moving the imaging unit 80 in the XY directions is provided on the lifting base 60. As shown in Fig. The image pickup portion moving mechanism 85 includes two guide rails 86 arranged on the elevating base 60 along the X axis direction and a slide member 86 slidably mounted on the two guide rails 86, (87), and a drive system for driving the slide member (87) in the X-axis direction.

The image pickup portion moving mechanism 85 has a support frame 88 spanning over the two slide members 87 so as to extend over the carry section 70. The support frame 88 supports the image sensing unit 80 so as to be movable in the Y axis direction and has a drive system for driving the image sensing unit 80 in the Y axis direction therein.

The imaging section 80 can move a region lower than the screen 10 and higher than the substrate 8 in the X and Y directions. The imaging section 80 has a camera capable of imaging an alignment mark 14 provided on the lower surface of the screen 10 and an alignment mark 9 provided on the upper surface of the substrate 8.

The camera of the imaging section 80 has a configuration capable of imaging both the alignment mark 14 of the screen 10 and the alignment mark 9 of the substrate 8. [ The camera employs an optical member such as a half mirror, for example, and can adopt an arrangement in which an image of an upper screen and an image of a substrate below can be simultaneously introduced into one field of view can do.

When a camera having such a configuration illuminates one side (one side) of a screen and a substrate, it is possible to capture one side of the screen. More specifically, in the camera, when a light is projected on a screen and a light is not projected on the substrate, the screen can be picked up. Conversely, when illuminating the substrate without illuminating the screen, the substrate can be imaged.

On the lifting base 60, a cleaning portion 90 and a cleaning portion moving mechanism 95 for moving the cleaning portion 90 in the X axis direction are provided. The cleaning section moving mechanism 95 includes two guide rails 86 commonly used with the imaging section moving mechanism 85 and slide members 97 provided on the two guide rails 86 so as to be slidable respectively And a driving system for driving the slide member 97 in the X-axis direction.

The cleaning part moving mechanism 95 has a support frame 98 that extends over the two slide members 97 so as to extend over the carry section 70. [ The support frame 98 supports the cleaning portion 90 from below.

The cleaning section 90 has a delivery roller 91 for delivering the cleaning paper 93 and a winding roller 92 for winding the cleaning paper 93.

The control unit 1 shown in Fig. 4 is constituted by, for example, a CPU (Central Processing Unit) or the like, and controls each unit of the screen printing apparatus 100 in a general manner.

The storage section 2 includes a nonvolatile memory used as a work area of the control section 1 and a nonvolatile memory in which various data and programs necessary for the processing of the control section 1 are stored . The various programs may be read from a recording medium such as an optical disk or a semiconductor memory.

The display section 3 is constituted by, for example, a liquid crystal display or the like. The input unit 4 is constituted by a keyboard, a mouse, a touch panel, and the like, and inputs various instructions from the operator. The communication unit 5 transmits information to another apparatus such as a printing inspection apparatus or a mounting apparatus, or receives information from another apparatus.

[Operation of Screen Printing Apparatus 100]

Next, the operation of the screen printing apparatus 100 will be described. Here, the operation of the screen printing apparatus 100 described below is executed under the control of the control unit 1. [ Figs. 5 and 6 are perspective views for explaining the basic operation of the screen printing apparatus 100. Fig.

First, as shown in Fig. 5, the substrate 8 is conveyed to the reference position by driving the conveyor belt 73 of the conveying unit 70. Fig. At this time, the image pickup section 80 is retracted to the position (standby position) of the right end (standby position) of the lifting base 60 by the image pickup section moving mechanism 85 and waits. The cleaning portion 90 is retracted to the position (standby position) of the left end (standby position) of the lifting base 60 by the cleaning portion moving mechanism 95 and waits.

Next, the backup section 62 is moved upward, and the substrate 8 is supported from the lower side by the backup section 62. Then, The substrate 8 is lifted up by the backup unit 62 such that the upper surface of the substrate 8 coincides with the reference surface B. [ In this state, the guide 72 moves to the guide 71 side, and the guides 71 and 72 clamp the substrate 8.

Next, the imaging section 80 is moved in the X and Y directions by the imaging section moving mechanism 85, and the camera captures the alignment marks 9 (two or more positions) on the substrate 8. The image sensing unit 80 transmits the image of the captured alignment mark 9 to the control unit 1. [ When the imaging of the alignment mark 9 of the substrate 8 is completed, the imaging unit 80 moves to the standby position (right end of the lifting base 60) by the imaging unit moving mechanism 85.

The control unit 1 controls the position of the substrate 8 in the XY direction and the position of the substrate 8 around the Z axis based on the image of the alignment mark 9 of the substrate 8 received from the image pickup unit 80 8), and the like. When the position of the substrate 8 is recognized, the control section 1 drives the table driving section 30 to move the table 25 in the XY &thgr; Thereby, the screen 10 is moved in the XY &thetas; direction and aligned with respect to the substrate 8. [

In order for the control section 1 to align the screen 10 with respect to the substrate 8, the control section 1 needs to recognize the position of the screen 10 and the position of the substrate. The control unit 1 detects the position of the screen 10 at the time of replacement of the screen 10 and detects the position of the substrate 8 every time the substrate 8 is transported. Details of the detection of the position of the substrate 8 and the screen 10 will be described later.

The screen printing apparatus 100 according to the present embodiment has a structure for adjusting the position of the screen 10 with respect to the position of the substrate 8 by the screen moving mechanism 20. [ However, the screen printing apparatus 100 may have a mechanism for moving the substrate 8, and the position of the substrate 8 may be adjusted with respect to the position of the screen 10 by the moving mechanism.

When the screen 10 is aligned with respect to the substrate 8, the lifting base 60 is moved upward by the lifting mechanism 61 until the substrate 8 comes into contact with the lower surface of the screen 10. 6 shows a state in which the lifting base 60 is moved upward. 6, members such as the imaging unit 80, the cleaning unit 90, and the like are omitted in order to easily view the drawings.

When the substrate 8 comes into contact with the lower surface of the screen 10, one squeegee mechanism 51 of the two squeegee mechanisms 51 descends and abuts on the screen 10. The descending squeegee mechanism 51 is predetermined in accordance with the direction in which the squeegee portion 50 moves. Further, the squeegee mechanism 51 which does not descend remains in a state in which it is not in contact with the screen 10.

When one of the squeegee mechanisms 51 comes into contact with the screen 10, the two squeegee mechanisms 51 move integrally in the Y-axis direction. Thereby, the one-sided squeegee mechanism 51 slides on the screen 10 in the Y-axis direction, and cream solder is printed on the substrate 8 through the pattern holes 13. [ When the squeegee portion 50 moves to a portion slightly exceeding the region where the pattern hole 13 is formed in the screen 10, the squeegee mechanism 51 of one side abutting on the substrate 8 And the squeegee portion 50 waits in this state.

When the cream solder is printed on the substrate 8, the lifting base 60 is moved downward by the lifting mechanism 61. When the lifting base 60 moves downward, the second guide 72 (rear guide) of the carry section 70 moves rearward by a predetermined amount, and the fixed state of the substrate 8 is released. Next, the conveyor belt 73 of the carry section 70 is driven, and the printed substrate 8 is transferred to the printing inspection apparatus on the downstream side.

When the lower surface of the screen 10 is cleaned, first, the cleaning portion 90 is moved in the X-axis direction by the cleaning portion moving mechanism 95. The height of the cleaning portion 90 is adjusted and the delivery roller 91 and the winding roller 92 rotate in conjunction with the movement of the cleaning portion 90 in the X axis direction. As a result, the lower surface of the screen 10 is cleaned by the cleaning paper 93.

When the cleaning is completed, the cleaning portion 90 is moved to the standby position (left-hand end of the lifting base) by the cleaning portion moving mechanism 95 and waits at the standby position.

[Position Detection Function of Substrate 8]

The position detecting function of the substrate 8 in the screen printing apparatus 100 will be described.

In the screen printing apparatus 100, it is necessary to precisely align the substrate 8 and the screen 10 in order to cope with a fine print pattern provided on the screen 10. [ As described above, the screen printing apparatus 100 has a stop mechanism for stopping the substrate 8 at the reference position at the time of loading the substrate 8, but the alignment is not accurate in this state.

More specifically, when the substrate 8 is stopped by the stopper, the position of the substrate 8 is displaced from the reference position due to a slight impact with which the substrate 8 contacts the stopper, The position of the substrate 8 may not be precisely aligned with the reference position due to the influence of burrs at the ends of the substrate 8. In the above-described stop mechanism using the sensor, the position of the substrate 8 may be displaced from the reference position due to an error in the operation of the conveyor belt 73 or an inertia force applied when the substrate 8 is stopped .

Therefore, in the screen printing apparatus 100, a deviation of the position of the substrate 8 from the reference position is detected, and when the screen 10 is aligned with the substrate 8, the deviation of the substrate 8 The screen 10 is moved so as to cancel out. The position of the substrate 8 is recognized by the position of the alignment mark 9 of the substrate 8.

Here, the position of the alignment mark 9 of the substrate 8 at the correct reference position is also simply referred to as " reference position of the alignment mark 9 ". When the imaging unit 80 picks up the alignment mark 9 of the loaded substrate 8, the imaging unit 80 assumes that the alignment mark 9 of the substrate 8 exists at the reference position, At the reference position of the alignment mark, the alignment mark 9 of the actual substrate 8 is picked up from above. Further, when the alignment mark of the actual substrate is accurately located at the reference position of the alignment mark, the alignment mark is located at the center of the image. However, due to the above-described causes, in general, the alignment marks are slightly shifted from the center of the image. The imaging position of the alignment mark (reference position of the alignment mark 9) is different depending on the type of the substrate.

In order to obtain the distance between the position of the alignment mark 9 and the reference position from the image of the alignment mark 9 imaged by the imaging section 80, the distance in the image and the distance in the actual reference plane B It is necessary that the magnification of the image to which the image is related is previously recorded as the conversion information. In the screen printing apparatus 100, as a value corresponding to a magnification of an image, a size (hereinafter simply referred to as "the size of one pixel") on the reference plane B corresponding to one pixel of the image is stored (2).

The screen printing apparatus 100 detects the number of pixels between the position of the alignment mark 9 and the reference position in the image of the alignment mark 9 and multiplies the size of one pixel by the number of pixels to obtain an alignment mark 9 ) And the reference position is calculated.

A method of determining the size of one pixel to be recorded in the storage unit 2 of the screen printing apparatus 100 will be described with reference to Figs.

7 is a plan view of the calibration jig f according to the present embodiment. The calibration jig f has a flat plate shape similar to that of the substrate 8 and has an alignment mark f1 at the center thereof. 8 is a schematic diagram showing the position of the image sensing unit 80. Fig. 9A to 9C are views showing images captured by the imaging unit 80. Fig. 9A to 9C, the center of the image is indicated by C. 9A to 9C show X-axis, Y-axis, and Z-axis corresponding to the posture of the substrate displayed in the image.

The center C of the image corresponds to the optical axis of the image sensing unit 80. [ In other words, the optical axis of the image sensing unit 80 passes the position on the substrate 8 displayed at the center C of the image. That is, the position on the substrate 8 corresponding to the center C of the image changes depending on the position of the image pickup section 80. [

8 shows a state in which the optical axis of the image sensing unit 80 passes the alignment mark f1 of the calibration jig f. In the state shown in Fig. 8, the upper surface of the calibration jig f coincides with the reference plane B. Fig. 9A shows an image obtained by imaging the alignment mark f1 in the state shown in Fig. The alignment mark f1 coincides with the center C of the image.

From the state shown in Fig. 9A, the imaging section 80 is moved 2 mm forward in the X-axis direction in Fig. Fig. 9B is an image of the alignment mark f1 of the calibration jig f in this state. The alignment mark f1 is shifted by a pixel to the image side in the X-axis direction with respect to the center C of the image.

Next, from the state shown in Fig. 9B, the imaging section 80 is moved 4 mm inward in the X-axis direction in Fig. That is, from the state shown in Fig. 9A, the imaging section 80 is moved 2 mm inward in the X-axis direction in Fig. Fig. 9C is an image of the alignment mark f1 of the calibration jig f in this state. The alignment mark f1 is shifted by b pixels to the lower side in the X-axis direction with respect to the center C of the image.

From the above results, the measured value (actual measurement value) of the size of one pixel in the X-axis direction can be obtained as the moving amount of the camera per pixel, and becomes 4 / (a + b) [mm / pixel]. By the same method, an actual value of the size in the Y-axis direction of one pixel is also obtained. Thus, the size of one pixel when the image sensing unit 80 is at the position shown in Fig. 8 is obtained. In determining the size of one pixel, the distance for moving the image sensing unit 80 can be arbitrarily selected.

The size of one pixel obtained as described above may be set in the storage unit 2 of the screen printing apparatus 100 as a representative value of a value corresponding to the magnification of the image captured by the image pickup unit 80. [ However, in the present embodiment, in consideration of the possibility that an error may occur in the size of one pixel when the position of the imaging section 80 is different from the position shown in Fig. 8, the conversion information to be recorded in the storage section 2 is Prepare.

The cause of the error in the size of one pixel of the image captured by the image sensing unit 80 depending on the position of the image sensing unit 80 includes a change in the minute posture at the time of moving the image sensing unit 80, (Yawing, rolling, pitching, and the like), and up-and-down movement of the imaging unit 80 can be exemplified. The change in the minute posture and the vertical movement at the time of the movement of the imaging section 80 are caused by the combination of the mechanical structures of the slide member 87 and the support frame 88 shown in Fig. In addition, the slide member 87 and the support frame 88 may be distorted by deterioration with the lapse of time.

The distance between the imaging unit 80 and the reference plane B also changes in accordance with the change of the posture of the imaging unit 80 or the up and down movement. When the distance between the imaging section 80 and the reference plane B changes, the size of one pixel of the image picked up by the imaging section 80 also changes. More specifically, as the distance between the image pickup section 80 and the reference plane B becomes closer, the size of one pixel becomes smaller. Conversely, if the distance between the image sensing unit 80 and the reference plane B is increased, the size of one pixel becomes large.

For example, when an error of about 0.5 to 1.0 mm is generated in the distance between the imaging unit 80 and the reference plane B due to the change of the posture of the imaging unit, an error of about 0.02 mu m is generated in the size of one pixel It is assumed. As the position of the alignment mark in the image largely deviates from the center (the more the substrate 8 is shifted from the reference position), the error of the position of the detected substrate 8 becomes large.

In this embodiment, the size of one pixel is measured at a plurality of positions of the image pickup section 80 in order to suppress the error of the size of one pixel as described above. That is, conversion information constituted so that the size of one pixel is determined according to the position of the image sensing unit 80 is prepared, and the conversion information is recorded in the memory unit 2. [

10 is a plan view of the calibration jig F for preparing such conversion information. The calibration jig F has a flat plate shape similar to that of the calibration jig f and the alignment marks F1 are regularly arranged in a lattice form over almost the entire area thereof.

The calibration jig F has a dimension in the X-axis direction of 400 mm and a dimension in the Y-axis direction of 500 mm. The size of the calibration jig F becomes equal to the maximum size of the substrate 8 applicable to the screen printing apparatus 100. [

The calibration jig F is formed of, for example, stainless steel or glass. The alignment mark F1 provided in the calibration jig F may be any one that can be visually confirmed. The alignment mark F1 is formed, for example, as a point or a line or a step by a hole or a scriber.

In the present embodiment, each of the alignment marks F1 is formed as a round hole having a diameter of 1 mm. Each of the alignment marks F1 is formed at equal intervals in the X-axis direction and the Y-axis direction, and the interval between the centers of the adjacent alignment marks F1 is 10 mm. The vicinity of the four sides of the calibration jig F is a margin in which the alignment mark F1 is not formed. In Fig. 10, for convenience of explanation, the alignment mark F1 is shown largely.

Fig. 11 shows a state in which the calibration jig F is installed at the reference position of the screen printing apparatus 100. Fig. 11, the upper surface of the calibration jig F coincides with the reference surface B. In the state shown in Fig. That is, the height of the upper surface of the calibration jig F coincides with the height of the upper surface of the substrate. The size of one pixel is measured with respect to all the alignment marks F1 of the calibration jig F by the measure of the size of one pixel with respect to the alignment mark f1 of the calibration jig f shown in Fig. Thereby, the size of one pixel in each case in which the imaging section 80 is located at a position where the optical axis of the imaging section 80 passes the respective alignment mark F1 is obtained. By matching the height of the upper surface of the calibration jig F with the height of the upper surface of the substrate (that is, by matching the distance between the imaging unit 80 and the substrate and the distance between the imaging unit 80 and the jig F ), It is possible to accurately obtain the size of one pixel at each position.

The size of one pixel corresponding to each position of the imaging unit 80 obtained as described above is recorded in the storage unit 2 as conversion information in association with the position of the imaging unit 80. [

The screen printing apparatus 100 according to the present embodiment has the substrate 8 in which the imaging unit 80 is determined according to the type of the substrate 8 in a state in which the substrate 8 is brought in, The alignment mark 9 is picked up with the optical axis passing through the reference position of the alignment mark 9 of the lens barrel. At this time, the center C of the image picked up by the image pickup section 30 corresponds to the reference position of the alignment mark on the substrate 8.

12 is a diagram showing an example of an image captured by the image pickup section 30. Fig. In this image, the alignment mark 9 of the substrate 8 is assumed to be located at the position of q pixels to the left in the Y axis direction and p pixels to the bottom side in the X axis direction with respect to the center C of the image.

The control unit 1 acquires the size of one pixel corresponding to the position of the image pickup unit 30 using the conversion information recorded in the storage unit 2. [ When the magnitude of one pixel in the X-axis direction is multiplied by the value of p, a distance in which the alignment mark 9 actually deviates in the X-axis direction with respect to the reference position in the reference plane B is obtained. Likewise, when the size of one pixel in the Y-axis direction is multiplied by the value of q, a distance in which the alignment mark 9 actually deviates in the Y-axis direction with respect to the reference position in the reference plane B is obtained.

As described above, when the distance that the two alignment marks 9 of the substrate 8 are shifted with respect to the reference position in the X-axis direction and the Y-axis direction is obtained, the control section 1 moves the substrate 8 in the XY- The positional deviation can be recognized. The control unit (1) adjusts the position of the screen (10) so as to offset the positional deviation of the substrate (8). As a result, the relative position between the screen 10 and the substrate 8 is precisely adjusted.

The size of one pixel corresponding to the position of the image pickup section 30 acquired by the control section 1 is set to be the size of one pixel among the conversion information recorded in the storage section 2 at the position closest to the position of the image pickup section 30 The size of one pixel of the pixel can be adopted. The distance between the alignment marks F1 of the calibration jig F shown in Fig. 10 is 10 mm, so that the position closest to the position of the image sensing unit 30 among the conversion information recorded in the storage unit 2, Is within a range of 5 mm from the position of the movable member 30. Therefore, an error in the size of one pixel hardly occurs.

As the size of one pixel corresponding to the position of the imaging section 30 acquired by the control section 1, for example, among the conversion information recorded in the storage section 2, four The average value of the size of one pixel at the positions of the pixels may be employed. Even in this case, of the conversion information recorded in the storage unit 2, all four positions near the position of the image pickup unit 30 are within a range of 5 mm from the position of the image pickup unit 30. [ Therefore, an error in the size of one pixel hardly occurs.

When the correlation between the position coordinates of the image pickup section 30 and the size of one pixel is obtained, the conversion information recorded in the storage section 2 is a function between the position coordinates of the image pickup section 30 and the size of one pixel It is also acceptable. In this case, the control unit 1 can calculate the size of one pixel from the position coordinates of the imaging unit 30 using the function.

[Position Detection Function of Screen 10]

In the screen printing apparatus 100 according to the present embodiment, the size of one pixel when the image sensing unit 80 is at each position is associated with the position of the image sensing unit 80 And recorded in the storage unit 2 as conversion information. In the substrate 8 and the screen 10, the calibration jig as shown in FIG. 10 is used to perform the conversion similar to that of the substrate 8, Can be prepared.

The calibration jig is disposed so that the alignment mark faces downward, and the position of the lower surface of the calibration jig in the Z-axis direction coincides with the Z-axis direction position of the lower surface of the screen. The height of the lower surface of the calibration jig F matches the height of the lower surface of the screen (that is, by matching the distance between the imaging unit 80 and the screen and the distance between the imaging unit 80 and the jig) It is possible to accurately obtain the size of one pixel in the position.

The screen printing apparatus 100 according to the present embodiment is characterized in that when the screen 10 is exchanged, the image capturing unit 80 displays the image of the alignment mark 14 of the screen 10, which is determined according to the type of the screen 10 The alignment mark 14 is imaged in a state in which the optical axis passes the reference position. A deviation of the alignment mark 14 with respect to the reference position can be obtained from the image captured by the imaging section 80 in the same manner as the substrate 8. [

If the distance that the two alignment marks 14 of the screen 10 are displaced with respect to the reference position in the X-axis direction and the Y-axis direction is obtained, the control unit 1 determines that the position of the screen 10 in the XY- Can be recognized. The control unit 1 adjusts the position of the screen 10 so as to cancel such positional deviation.

As described above, in the screen printing apparatus 100 according to the present embodiment, the position of the substrate 8 and the position of the screen 10 can be accurately recognized by recording the conversion information in the storage unit 2 .

[Other configurations]

The screen printing apparatus 100 according to the present embodiment is provided with a mode in which the imaging section 80 picks up an image of the alignment mark 9 on the substrate 8 a plurality of times in order to detect the position of the substrate 8 very accurately, Is set.

In the corresponding mode of the screen printing apparatus 100, first, the imaging section 80 performs imaging of the alignment mark 9 of the substrate 8 for the first time. From the image obtained by the first imaging, the distance that the alignment mark 9 is displaced in the X-axis direction and the Y-axis direction from the reference position is calculated as described above.

Next, the control unit 1 moves the imaging unit 80 so that the position of the alignment mark 9 calculated from the image obtained by the first imaging of the imaging unit 80 passes the optical axis, 80 perform the second image pick-up of the alignment mark 9 of the substrate 8. When the position of the alignment mark 9 deviates from the center C even in the image obtained by the second imaging, the distance that the alignment mark 9 is shifted again in the X-axis direction and the Y-axis direction from the reference position is .

As described above, in the screen printing apparatus 100, the position of the alignment mark 9 of the substrate 8 can be recognized very accurately after the second photographing. Likewise, in the screen printing apparatus 100, the position of the alignment mark 9 of the substrate 8 can be detected more accurately by setting the number of times of imaging of the alignment mark 9 by the imaging section 8 to three or more times .

In order to calculate the deviation of the alignment mark 9 from the reference position in the corresponding mode of the screen printing apparatus 100, the conversion information according to the present embodiment is not used, The position of the alignment mark 9 of the substrate 8 is accurately recognized even after the second photographing, even when the representative value of the magnification of the image is used.

Although the embodiments of the present invention have been described, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the gist of the present invention.

For example, the position adjustment mechanism according to the present embodiment is applicable to an apparatus used for manufacturing a substrate such as a substrate inspection apparatus and a substrate mounting apparatus, in addition to a screen printing apparatus. In the substrate inspecting apparatus, as the position of the substrate is correctly recognized, it is possible to inspect an accurate position in the substrate. In the substrate mounting apparatus, as the position of the substrate is accurately recognized, it becomes possible to mount the component at a proper position in the substrate.

In addition, the processing of the substrate includes the entirety of performing operations on the substrate, such as screen printing on the substrate, inspection of the substrate, mounting of components on the substrate, and the like.

In the calibration jig according to the present embodiment, although the alignment marks are arranged in a lattice form, the effect of the present technology can be obtained when at least two alignment marks are provided in the calibration jig.

The present invention can also adopt the following configuration.

(1) an imaging unit movable along the reference plane in a state opposed to the reference plane, the imaging unit capturing an alignment mark on the reference plane;

A storage unit in which conversion information configured to determine a magnification of an image to be captured by the imaging unit is recorded according to a position of the imaging unit;

A control section for calculating the position of the alignment mark on the reference plane from the position of the imaging section and the position of the alignment mark in the image using the conversion information recorded in the storage section,

And the position detecting device.

(2) The position detecting device according to (1)

Wherein the conversion information includes an actual value of a magnification of an image captured by the imaging unit at a plurality of positions respectively.

(3) The position detecting device according to (2)

Wherein the plurality of positions are regularly arranged along the reference plane.

(4) The position detecting device according to (2) or (3)

Wherein the control section calculates the position of the alignment mark using the measured value corresponding to a position closest to the position of the imaging section among the plurality of positions.

(5) The position detecting device according to (2) or (3)

Wherein the control unit calculates the position of the alignment mark by using a value calculated from the measured value corresponding to two or more positions near the position of the imaging unit among the plurality of positions.

(6) The position detecting device according to any one of (1) to (5) above,

And a holding section for holding the substrate having the main surface provided with the alignment marks so as to match the position of the main surface with the reference surface.

(7) a holding unit for holding the substrate having the main surface provided with the alignment marks so as to align the position of the main surface with the reference surface,

A processing unit for processing the substrate held by the holding unit,

An imaging unit that is movable along the reference plane in a state of being opposed to the reference plane, the imaging unit capturing the alignment mark;

A storage unit in which conversion information configured to determine a magnification of an image to be imaged by the imaging unit is recorded according to a position of the imaging unit;

The position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit, And a control section that executes processing on the substrate of the processing section after recognizing the position of the substrate.

(8) imaging the alignment mark on the reference surface by an imaging section capable of moving along the reference plane in a state of being opposed to the reference plane,

A magnification of an image to be imaged by the imaging unit is determined according to a position of the imaging unit,

Wherein the position of the alignment mark on the reference plane is calculated from the position of the imaging section and the position of the alignment mark in the image using the fixed magnification.

(9) A substrate having a main surface provided with an alignment mark is arranged so that the position of the main surface is aligned with the reference surface,

An imaging section that is movable along the reference plane in a state of being opposed to the reference plane, images the alignment mark of the main surface disposed on the reference plane,

A magnification of an image to be imaged by the imaging unit is determined in accordance with the position of the imaging unit,

The position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image using the fixed magnification and the position of the substrate is recognized based on the calculated position In addition,

And performing processing on the substrate after recognizing the position of the substrate.

(10) a first imaging is performed with respect to the alignment mark on the reference plane by an imaging section that can move along the reference plane in a state of being opposed to the reference plane,

From the position of the alignment mark in the first image and the magnification of the first image obtained by the first imaging, the position of the imaging unit in the first imaging, and the position of the alignment mark in the first image, Calculating the position,

The second imaging is performed with respect to the first position by the imaging unit,

From the magnification of the second image obtained by the second imaging, the position of the imaging section in the second imaging, and the position of the alignment mark in the second image, 2 position.

One; The control unit
2; The storage unit
8; Board
9; Alignment mark
10; screen
14; Alignment mark
62; The backup unit (maintenance unit)
80; The image-
100; Screen printing device
B; Reference plane
F; Calibration jig
F1; Alignment mark

Claims (10)

An imaging unit that is movable along the reference plane in a state of being opposed to the reference plane, and captures an alignment mark on the reference plane;
A storage unit in which conversion information configured to determine a magnification of an image to be captured by the imaging unit is recorded according to a position of the imaging unit;
And a control section for calculating the position of the alignment mark on the reference plane from the position of the imaging section and the position of the alignment mark in the image using the conversion information recorded in the storage section Device. The method according to claim 1,
Wherein the conversion information includes an actual value of a magnification of an image captured by the imaging unit at a plurality of positions respectively. 3. The method of claim 2,
Wherein the plurality of positions are regularly arranged along the reference plane. 3. The method of claim 2,
Wherein the control section calculates the position of the alignment mark on the reference surface by using the measured value corresponding to a position closest to the position of the imaging section among the plurality of positions. 3. The method of claim 2,
Wherein the control unit calculates the position of the alignment mark on the reference plane by using a value calculated from the measured value corresponding to two or more positions close to the position of the imaging unit among the plurality of positions, . The method according to claim 1,
And a holding section for holding the substrate having the main surface provided with the alignment marks so as to match the position of the main surface with the reference surface. A holding portion for holding a substrate having a main surface provided with an alignment mark so as to align the position of the main surface with a reference surface,
A processing unit for processing the substrate held by the holding unit,
An imaging unit capable of moving along the reference plane in a state of being opposed to the reference plane and imaging the alignment mark;
A storage unit in which conversion information configured to determine a magnification of an image to be captured by the imaging unit is recorded according to a position of the imaging unit;
The position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image using the conversion information recorded in the storage unit, And a control section that executes processing on the substrate of the processing section after recognizing the position of the substrate. An imaging unit that is movable along the reference plane in a state of being opposed to the reference plane, images the alignment mark on the reference plane,
A magnification of an image to be imaged by the imaging unit is determined in accordance with the position of the imaging unit,
Wherein the position of the alignment mark on the reference plane is calculated from the position of the imaging section and the position of the alignment mark in the image using the fixed magnification. A substrate having a main surface provided with an alignment mark is arranged so that the position of the main surface is aligned with the reference surface,
An imaging section that is movable along the reference plane in a state of being opposed to the reference plane, images the alignment mark of the main surface disposed on the reference plane,
A magnification of an image to be imaged by the imaging unit is determined in accordance with the position of the imaging unit,
The position of the alignment mark on the reference plane is calculated from the position of the imaging unit and the position of the alignment mark in the image using the fixed magnification and the position of the substrate is recognized based on the calculated position and,
And performing processing on the substrate after recognizing the position of the substrate. The first imaging is performed on the alignment mark on the reference plane by the imaging section that can move along the reference plane in a state opposed to the reference plane,
From the position of the alignment mark in the first image and the magnification of the first image obtained by the first imaging, the position of the imaging unit in the first imaging, and the position of the alignment mark in the first image, Calculating the position,
The second imaging is performed with respect to the first position by the imaging unit,
From the magnification of the second image obtained by the second imaging, the position of the imaging section in the second imaging, and the position of the alignment mark in the second image, 2 position.

Images