JP2008041712A - Method and apparatus for packaging electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent dislocation due to pressing or suction failure or mounting error when sucking components or when mounting the sucked components, even when using a double-structure nozzle or the like wherein a nozzle slider slides in a nozzle inner. <P>SOLUTION: In the double-structure nozzle, displacement corresponding to a quantity of pressing occurs in the directions of X, Y and θ. Therefore, the displacement is found in a step 208. The correction quantity of position corresponding to the obtained displacement is calculated in a step 210 for a reference of mounting the component to the substrate. In a step 212, the mounting position (coordinate) is corrected based on the calculated correction quantity, and a head unit is moved in the directions of X and Y axes, so as to mount the component on the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method and apparatus for adsorbing a component to a nozzle mounted on a head unit movable on an XY plane over a component supply position and a component mounting position, and moving and mounting in a Z direction. Even with a double-structured nozzle where the nozzle slider slides against the nozzle inner, it is possible to suppress misalignment due to pressing, suction errors, and mounting errors when picking up components or mounting sucked components. The present invention relates to a component mounting method and apparatus.

  FIG. 1 is a perspective view showing an appearance of an entire electronic component mounting apparatus 1 of a conventional example.

  The electronic component mounting apparatus 1 is covered with a casing 3. On the front surface of the casing 3, a keyboard 5 for input operation by an operator and a liquid crystal monitor 6 for screen display are provided. In addition, a display lamp 7 as a notification means is provided at the upper rear of the casing 3.

  FIG. 2 is a perspective view of the main part 1 a of the electronic component mounting apparatus 1 inside the casing 3.

  In FIG. 2, reference numeral 12 denotes a substrate transport device that transports the substrate 10. As is well known, the substrate transport device 12 positions and fixes the substrate 10 transported to the arrow X in FIG. 2 at the component mounting position 13. It has become. In addition, a plurality of component supply devices 18 are arranged before and after the electronic component mounting apparatus 1.

  A suction nozzle 50 capable of vacuum-sucking electronic components is detachably supported on the upper part of the substrate transfer device 12 described above, and is operated in the Z direction (vertical direction in the figure) by the motor 11Z, and is rotated θ by the motor 11θ. A head unit 16 including a plurality of head shafts 20 that are operated in the direction is provided. The suction nozzle 50 from the nozzle exchange station 23 is attached to and detached from each of the head shafts 20. Nozzles 1 to 3 to be described later are examples of such a suction nozzle 50 in the nozzle replacement station 23. These head shafts 20 are five in total, and are called nozzles L1 to L4 and R, respectively. In each head shaft 20, the θ rotation direction is an axial direction that rotates around an axis in the Z direction, and is an axial direction that rotates around an axis perpendicular to the pressing position of the component when the component is mounted.

  The head 16 is moved on an XY plane extending from a component supply position for picking up components from a component supply device 18 for supplying electronic components and a component mounting position 13 on the substrate 10 by an XY moving mechanism 17 driven by motors 11X and 11Y. , XY direction (horizontal direction) is freely movable. Note that the range of the XY plane in which the head unit 16 can move is the position where the component recognition device 30 recognizes the component and the load measurement device 24 in addition to the component supply position and the component mounting position 13. The position to do is also included.

  FIG. 3 is a sectional view showing the suction nozzle 50 of the conventional example.

  The suction nozzle 50 includes a nozzle inner (holding member) 52, a coil spring 54, and a nozzle slider 56. The nozzle slider 56 is supported by the nozzle inner 52 so as to be movable up and down, and is always urged downward by a coil spring 54 with a constant urging force.

  When picking up a component from the component supply device 18 or mounting a component on the substrate 10, if the error in the height of the suction nozzle 50 in the Z direction is within the above-described range of vertical movement, The error can be absorbed by movement. At this time, the load applied to the suction nozzle 50, the head unit 16, and the sucked parts and the substrate 10 becomes the magnitude of the urging force by the coil spring 54, and is significantly suppressed as compared with the case where there is no vertical movement. . Therefore, a load from the tip of the suction nozzle 50 applied to the component is suppressed, and damage to the component, the substrate 10, the component supply device 18, and the like can be prevented.

  In addition, if the head unit 16 approaches the substrate 10 and the pushing amount of the vertical movement of the nozzle slider 56 in the nozzle inner 52 becomes large, the compression amount of the coil spring 54 becomes large and the urging force becomes large. The load that presses the component against the substrate 10 also becomes large. On the contrary, if the approach is less, the pushing amount of the vertical movement of the nozzle slider 56 in the nozzle inner 52 becomes smaller, the compression amount of the coil spring 54 becomes smaller, and the urging force thereof becomes smaller, and the component is attached to the substrate 10. The pressing load is also small.

  FIG. 4 is a perspective view showing the component recognition device 30 and the camera unit 35 of this conventional example.

  As shown in FIG. 2, the component recognition device 30 is provided at a position that does not interfere with the substrate 10 within the range of the XY plane in which the head unit 16 can move. The component recognition device 30 includes an illumination unit 31, an imaging lens unit 32, and a camera unit 33.

  The camera unit 35 is attached to the head unit 16 and moves in the X, Y, and Z directions together with the head unit 16. The camera unit 35 includes an illumination unit 36, an imaging lens unit 37, and an imaging unit 38. Further, the camera unit 35 can recognize a substrate mark indicating the reference position on the substrate 10 attached to the substrate 10, the suction component 21, and the like.

  In order to accurately mount the sucked component 21 on the substrate 10, it is necessary to accurately recognize the positional relationship between the sucked component 21 and the nozzle. It is necessary to recognize the exact position. The former recognition is performed in the component recognition apparatus 30 by picking up an image of the component 21 sucked by the suction nozzle 50 from below by the camera unit 33 and based on the image of the picked-up image. The latter recognition is performed in the camera unit 35 based on the image of the image of the substrate mark on the substrate 10 captured by the imaging unit 38 from above.

  In such a conventional example, the outline of the operation of electronic component mounting will be described. First, the head unit 16 moves to the corresponding component suction position in the component supply device 18, lowers the suction nozzle 50, and the tip of the nozzle slider 56. The electronic parts are pressed and sucked in vacuum. Thereafter, the head 16 is moved to the corresponding mounting position on the substrate 10, the suction nozzle 50 is lowered, the vacuum suction of the nozzle slider 56 is released while pressing the electronic component against the substrate 10, and the electronic component is placed on the substrate. Attach to 10.

  The component mounting operation as described above is performed for each component to be mounted. In addition, the mounting program required when mounting electronic components on a board to produce a board is composed of board data, mounting data, parts data, suction data, etc., and can be output for each of these components. Yes.

  Here, in Patent Document 1, in particular, the urging force of the coil spring 54 of the suction nozzle 50 is detected by the load measuring device 24.

  Specifically, the head 16 is driven to take out the suction nozzle 50 from the nozzle exchange station 23, guide it onto the load measuring device 24, press the suction nozzle 50 against the load measuring device 24, and The urging force of the spring 54 is detected. Further, the value of the detected urging force is compared with a reference urging force value for each suction nozzle 50, and if it is out of the range of the reference urging force value, this information is registered, and the suction nozzle discrimination for informing this is registered. The program is stored.

JP-A-2005-252118

  However, in the case of the suction nozzle 50 having a double structure as shown in FIG. 3, in order to slide the nozzle slider 56 with respect to the nozzle inner 52, some play is required. There are cases where the components are displaced from the suction nozzle 50. In particular, when the component suction surface at the tip of the nozzle 50 is not parallel to the substrate 10 but is inclined, the component contacts the substrate 10 from one corner during mounting, and then the entire lower surface of the component contacts thereafter. When one corner of the component comes into contact with the substrate, the nozzle slider 56 is displaced from the nozzle inner 52 by the amount of play of the nozzle slider 56, and the mounting position of the component is also displaced from the substrate by the amount of displacement. It will be.

  In addition, when there is little said play, such a shift | offset | difference becomes small. However, the sliding movement of the nozzle slider 56 in the nozzle inner 52 becomes awkward, and the sliding movement becomes caught.

  When the component is sucked from the component supply device 18 or when the component is mounted on the substrate 10, if the sliding becomes awkward or the catch occurs, the suction nozzle 50, the head unit 16, The load applied to the adsorbed component or the substrate 10 becomes large, and there is a possibility that the component, the substrate 10, the component supply device 18 or the like may be damaged.

  Alternatively, if the nozzle slider 52 is caught in the nozzle inner 52 while being pushed, when the component is sucked from the component supply device 18, the suction nozzle 50 does not come into contact with the component and is therefore not picked up. Occur. Alternatively, when the sucked component is mounted on the substrate 10, the component suction is canceled and a mounting error occurs even though the component is not yet in contact with the substrate 10.

  The present invention was made in order to solve the above-mentioned conventional problems, and even when a nozzle having a double structure in which a nozzle slider slides with respect to a nozzle inner or the like, at the time of adsorbing a component or mounting an adsorbed component, It is an object of the present invention to provide an electronic component mounting method and apparatus capable of suppressing positional displacement caused by pressing, suction mistakes, and mounting errors.

  In the electronic component mounting method according to the first invention of the present application, a nozzle slider mounted on a head unit movable on the XY plane over a component supply position and a component mounting position is pressed with a predetermined urging force in the Z direction. In an electronic component mounting method in which a component is attracted to the suction nozzle provided by the component supply position and then moved to the component mounting position and mounted, the X direction, the Y direction, and the pressing position at the time of the pressing are A load measuring device for measuring the load at the pressed position of at least one component in the θ direction with the vertical axis as the rotation axis is disposed within the moving range of the head unit, and the load measuring device is used. Thus, the correlation between the load of the measurement result and the mounting position deviation amount in the axial direction of the measurement is grasped, and when the component is mounted, the mounting position deviation amount at this time is calculated from the load at this time. Based on the correlation There predicted, by which is adapted to correct the component mounting position on the basis of the predicted load is obtained by solving the above problems.

  In the electronic component mounting method, a nozzle whose measurement result load exceeds a reference value may not be used or may be unused.

  Alternatively, the electronic component mounting apparatus according to the second invention of the present application is a nozzle that is mounted on a head unit that can move on the XY plane across the component supply position and the component mounting position, and presses the component in the Z direction with a predetermined urging force. In an electronic component mounting apparatus that picks up a component from a suction nozzle having a slider at the component supply position and then moves to the component mounting position and mounts the electronic component mounting apparatus, the holding member supports the component in a vertically movable manner. A plurality of suction nozzles each having a nozzle slider that presses with an urging force when sucking an electronic component, and supports the suction nozzles so as to be freely movable in the XY plane, and the suction nozzles are movable in the Z direction; and A head unit that is detachably supported, and located at a position facing the head unit within the range of movement of the head unit, when the nozzle slider is pressed , X direction, Y direction, and a load measuring device that detects a load at the pressed position of a component in at least one of the θ directions with the axis perpendicular to the pressing position as a rotation axis, and the load measuring device The correlation between the load of the measurement result and the mounting position shift amount in the axial direction of the measurement, which is grasped using the above, is stored, and when the component is mounted, the load at this time is calculated from the load at this time. By providing a control device that predicts the amount of mounting position deviation based on the correlation and corrects the component mounting position based on the predicted load, the problem is solved.

  As described above, according to the present invention, the nozzle at the time of component mounting of at least one direction component in the X direction, the Y direction, and the θ direction with the axis perpendicular to the pressing position as the rotation axis is provided. By measuring the load, it is possible to predict the amount of mounting position deviation, and by not using a nozzle that is expected to have a large amount of mounting position deviation, the amount of mounting position deviation caused by the nozzle can be suppressed to the standard value. . Further, the mounting accuracy can be improved by correcting the mounting position from the result of predicting the mounting position deviation amount of the component.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 5 is a side view of the load measuring device 40 used in the embodiment to which the present invention is applied.

  The electronic component mounting apparatus according to this embodiment uses the load measuring device 40 instead of the load measuring device 24 in the above-described conventional example, and the control program is related to the load measuring device 40 to which the present invention is applied. It is a replacement. In FIG. 2, the load measuring device 40 is shown in a state of being housed in an outer cover. In the present embodiment, the external appearance is the same as in FIG. 1 described above, the main part thereof is FIG. 2, the suction nozzle 50 is the same as in FIG. 3, and the component recognition device 30 and the camera unit 35 are the same as those in FIG. It has become.

  As shown in FIG. 5, the load measuring device 40 according to the present embodiment includes a contact plate 41 that presses the tip of the suction nozzle 50 from above, a plate mounting portion 42 that supports the contact plate 41, and one or more load cells. 45 and a base plate portion 48 on which the load cell 45 is disposed.

  Here, FIG. 6 is a perspective view showing a load cell main body 46Z that detects a load in the Z direction and a load cell 45Z that incorporates the load cell main body 46Z and can detect a load in the Z direction.

  FIG. 7 shows the load cell main body 46X, the load cell main body 46Z, the load cell main body 46Y, and the load cell main body 46X, the load cell main body 46Z, and the load cell main body 46Y, and individually and simultaneously detect loads in the X, Z, and Y directions. It is a perspective view which shows the load cell 45XYZ which can be done.

  FIG. 8 is a perspective view showing a load cell main body 46θ that detects a load in the θ direction and a load cell 45θ that incorporates the load cell main body 46θ and can detect a load in the Z direction.

  In the present embodiment, in the load cell 45, for example, the load cell main body 46θ of FIG. 8 and the load cell 45XYZ of FIG. 7 are stacked in order on the base plate portion 49, so that in addition to the X direction, the Z direction, and the Y direction, θ The load in each direction can be detected individually and simultaneously.

  In the load measuring device 24 of the conventional example described above, it can be said that only the load cell 45Z in FIG. 6 is used in the load measuring device 40.

  FIG. 9 is a block diagram showing the configuration of the control relationship in this embodiment.

  A control device 19 that performs overall control of the electronic component mounting apparatus includes a CPU (Central Processing Unit) 151 that executes various programs, and a RAM (Random Access Memory) 152 that serves as a main storage unit that stores programs to be executed. A large-capacity external storage device 153 such as a hard disk device, and an I / O (Input Output) device 157 for connecting various devices. Further, these can be accessed from the CPU 151 by the bus 160.

  The I / O device 157 includes a substrate transfer device control unit 112 built in the substrate transfer device 12, an XY movement mechanism control unit 117 of the XY movement mechanism 17, a component supply device control unit 118 of the component supply device 18, and a component recognition device. 30 parts recognition device control unit 130 and load measurement device control unit 140 of load measurement device 40 are connected. The board transfer device control unit 112, the XY movement mechanism control unit 117, the component supply device control unit 118, the component recognition device control unit 130, and the load measurement device control unit 140 are provided for realizing the operations and functions of the built-in components. Take control.

  The I / O device 157 is connected to an L1 nozzle control unit 131, an L2 nozzle control unit 132, an L3 nozzle control unit 133, an L4 nozzle control unit 134, and an R nozzle control unit 135. These perform rotation of the head shaft 20 in the θ direction, ascending / descending in the Z direction, and other controls related to the corresponding nozzles L1 to L4 and R, respectively. Further, the I / O device 157 is connected to a camera control unit 150 that performs control for realizing operations and functions related to the camera unit 35.

  The RAM 152 and the external storage device 153 which are storage means of this embodiment store programs executed by the CPU 151 and various files and data accessed in this embodiment, and can be accessed electronically. . In addition, an application program for performing control for realizing operations and functions as an electronic component mounting apparatus according to the present embodiment, and a program such as an OS (Operating System) are stored in the external storage device 153. At the time of execution, the data is read into the RAM 152 and executed by the CPU 151.

  Hereinafter, the operation of the present embodiment will be described.

  A load cell is generally used as a force sensor capable of measuring a load in the Z-axis direction, and this is realized by arranging a strain gauge so that a load in the vertical direction can be measured. The load measuring device 40 of the conventional example also uses such a load cell.

  On the other hand, in this embodiment, by arranging a strain gauge so that the load in the horizontal direction can be measured, the load in the X, Y, and θ directions can be measured according to the arrangement direction. Yes. Some quartz crystal piezoelectric sensors can simultaneously measure loads in three directions of X, Y, and Z by combining crystal elements. In this embodiment, such a thing can also be used. Conventionally, even in such a quartz crystal piezoelectric sensor that can measure loads in multiple directions, only the load in the Z-axis direction is measured, and load control during suction and mounting is performed.

  When the suction nozzle 50 applies a load in the X direction or the Y direction, even when the component is mounted on the substrate, the suction nozzle applies a load to the component, and the mounting position of the component shifts in the direction of the load. It becomes. Further, the direction and amount of the deviation are in accordance with the direction and magnitude of the load. For this reason, by measuring the load, it is possible to predict in advance the amount of displacement of the component in the X direction or the Y direction.

  The same applies to the case where the suction nozzle applies a load in the rotational direction to the component. Therefore, by using a torque sensor that can also measure the torque in the rotation direction and measuring the load in the rotation direction applied to the component by the suction nozzle, the amount of deviation in the rotation direction of the component according to the load can be predicted.

  More specifically, prior to production, the correlation shown in FIG. 10 between the pushing amount of each suction nozzle 50 and the load in the X, Y, and θ directions is preliminarily determined as a force sensor such as the load measuring device 40. And stored in a data storage area in the external storage device 153. Here, the nozzles 1 to 3 are the suction nozzles 50, and the strength (spring constant) of the coil spring 54 is different from each other.

Here, FIG. 11 is a graph showing the correlation of the nozzle 1 of FIG. In this graph, the horizontal axis is the push amount, and the vertical axis is the load in the corresponding direction. Also, the ■ mark plot shows the measured values (measured data) of the indentation amount and the load in the X direction, the ♦ mark plots in the Y direction, and the Δ mark plot in the θ direction, respectively. The pressing amount and L, X direction, Y direction, the load of f _x in each direction theta _direction, when f _y, f _theta, measured values described above can be approximated by a linear formula. The line format is indicated by a solid line in the graph of FIG.

f _x = 0.0007 × L−0.0007 (1)
f _y = 0.0008 × L−0.0006 (2)
_{f θ = 0.0024 × L-0.0024} ...... (3)

  The contact of the tip of the suction nozzle 50 lowered by movement in the Z direction with the contact plate 41 of the load measuring device 40 can also be detected by a change in the signal from the load cell main body 46. Therefore, the amount of movement in the Z direction after the contact is detected can be set as the amount of pushing. Therefore, if the load in the X, Y, and θ directions at each push amount is detected by the load cell main body 46 while the push amount is sequentially changed while moving in the Z direction, a large number of measured values of the push amount and the load are automatically obtained. The correlation as shown in FIG. 10 can be measured automatically. Further, if a large number of actual measurement values are obtained, a linear form such as the above formulas (1) to (3) can be automatically obtained by a mathematical method.

  Further, the amount of displacement of the mounting position varies depending on the load at the time of mounting depending on the adhesive medium interposed between the substrate and the component. For this reason, for each adhesive medium, the shift amount when each load is applied is stored in the data storage area in the external storage device 153. For example, FIG. 12 shows the amount of displacement in the X and Y directions according to the load at the time of mounting. FIG. 13 shows the amount of displacement in the θ direction according to the load at the time of mounting.

  Here, a calculation example of the mounting correction amount when the mounting push-in amount at the nozzle 1 is 0.7 mm and the adhesive medium is solder is shown. From FIG. 10, the load when the pushing tatami of the nozzle 1 is 0.7 mm is X: 0.004N, Y: 0.005N, and θ: 0.018N. From FIG. 12 and FIG. 13, the positional deviation amounts in this case are X: 6 μm, Y: 7 μm, and θ: 0.4 °. Since the amount of displacement of the component due to the backlash of the suction nozzle in each direction has been obtained, the mounting coordinates are corrected by the amount of displacement. By predicting the component mounting position deviation amount, the mounting positions in the X, Y, and θ directions can be corrected, and the mounting accuracy can be greatly improved. Also, the load applied by each suction nozzle in the X direction, Y direction, and θ direction during component mounting operation is measured, and mounting positions that are caused by the suction nozzles are not used by using suction nozzles whose load exceeds the standard value. The amount can be kept within the standard value.

  Furthermore, even if the force sensor can measure only in the X direction or the Y direction instead of the two directions of X and Y, the suction nozzle direction θ at the time of measurement is set to 0 ° and 90 °. In other words, measurement in two directions can be performed by measuring twice.

  If the upper surface of the contact plate 41 is not parallel to the upper surface of the substrate 10 on which the component is mounted, an error may occur in the load detected by the load cell main body 46. If the orientation θ of the suction nozzle at the time of measurement is changed to 0 ° and 180 °, measurement is performed twice, and these measured values are averaged, for example, such an error can be suppressed.

  FIG. 14 is a flowchart showing the operation in the present embodiment.

  In this figure, first, in step 200, the component is supplied from the corresponding component supply device 18 with the suction nozzle 50, for example, the nozzle L1 to which the suction nozzle 1 is attached (hereinafter, this suction nozzle 1 or nozzle L1 will be described in the explanation of FIG. To adsorb. In Step 202, after the suction, the nozzle L <b> 1 is raised and then the XY axes of the head unit 16 are moved to move the nozzle L <b> 1 above the component recognition device 30.

  In step 204, in the component recognition apparatus 30, the component picked up by the nozzle L1 is imaged from below by the camera unit 33, and the positional deviation amount of the component is measured.

  In step 206, the external storage device 153 stores the magnitudes of loads in the X, Y, and θ directions corresponding to the pushing amount of the nozzle L1 when the component is to be mounted this time. 10 is read out from a table of actual measurement values as shown in FIG. Or you may make it obtain | require the magnitude | size of the load of each direction of X, Y, (theta) from this pushing amount based on approximate expression like Formula (1)-Formula (3) mentioned above.

  In step 208, for each direction of X, Y, and θ, the amount of deviation in that direction corresponding to the type of the adhesive medium this time and the load obtained in step 206 is stored in the external storage device 153. And reading from the table as shown in FIG. In step 210, a position correction amount for mounting a component on the board 10 is calculated according to the amount of deviation of the reading.

  In step 212, the mounting position (coordinates) is corrected according to the correction amount of the calculation, and the XY axis of the head unit 16 is moved. In step 214, components are mounted on the substrate 10.

  Note that the correction described above is not limited to the correction based on the table format data as shown in FIG. 10, FIG. 12, or FIG. For example, an approximate expression is obtained based on the previously obtained data such as FIG. 10, FIG. 12, and FIG. 13, a load corresponding to the push-in amount is obtained using the approximate expression, and further, from the load A correction amount may be obtained. Alternatively, the correction amount corresponding to the push-in amount may be directly obtained using an approximate expression.

The perspective view which showed the external appearance of the whole electronic component mounting apparatus of a prior art example The perspective view of the principal part of the said electronic component mounting apparatus in a casing inside Sectional drawing which shows the suction nozzle of the said prior art example The perspective view which shows the components recognition apparatus and camera unit of the said prior art example Side view of a load measuring device used in an embodiment to which the present invention is applied A perspective view showing a load cell main body for detecting a load in the Z direction used in the above-described embodiment, and a load cell 45Z that incorporates the load cell main body 46Z and can detect a load in the Z direction. Load cell main body 46X in X direction, load cell main body 46Z in Z direction, load cell main body 46Y in Y direction, and load cell main body 46X, load cell main body 46Z, load cell main body 46Y, and load in X direction, Z direction and Y direction are individually The perspective view which shows the load cell 45XYZ which can be simultaneously detected simultaneously A perspective view showing a load cell main body 46θ that detects a load in the θ direction and a perspective view showing the load cell 45θ that incorporates the load cell main body 46θ and can detect a load in the Z direction. The block diagram which shows the structure of the control relation in the said embodiment. A diagram showing the correlation between the pushing amount of the suction nozzles L1 to L3 and the load in the X, Y, and θ directions Graph showing the above correlation Diagram showing the amount of displacement in the X and Y directions according to the load at the time of mounting Diagram showing the amount of misalignment in the θ direction according to the load at the time of mounting Flowchart showing operation in the embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus 3 ... Casing 5 ... Keyboard 6 ... Liquid crystal monitor 7 ... Display lamp 10 ... Board | substrate 11X, 11Y, 11Z, 11 (theta) ... Motor 12 ... Board | substrate conveyance apparatus 13 ... Component mounting position 16 ... Head unit 17 ... XY movement Mechanism 18 ... Part supply device 19 ... Control device 20 ... Head shaft 21 ... Suction component 23 ... Nozzle exchange station 24 ... Load measuring device 30 ... Part recognition device 31 ... Illumination unit 32 ... Imaging lens unit 33 ... Camera unit 35 ... Camera unit 36 ... Illuminating unit 37 ... Imaging lens unit 38 ... Imaging unit 40 ... Load measuring device 41 ... Contact plate 42 ... Plate mounting unit 45, 45X, 45Y, 45Z, 45θ ... Load cell 46, 46X, 46Y, 46Z, 46θ ... Load cell body 48 ... Base plate part 50 ... Suction nozzle 52 ... Nozzle inner Holding member)
54 ... Coil spring 56 ... Nozzle slider 112 ... Substrate transport device controller 117 ... XY movement mechanism controller 118 ... Component feeder controller 130 ... Component recognition device controller 140 ... Load measuring device controller 151 ... CPU
153 ... External storage device 157 ... I / O device

Claims (3)

A suction nozzle equipped with a nozzle slider that presses a component in the Z direction with a predetermined urging force mounted on a head unit that can move on the XY plane across the component supply position and the component mounting position is placed at the component supply position. In the electronic component mounting method of mounting after moving to the component mounting position after suction,
A load measuring device that measures a load at the pressed portion of at least one component of the X direction, the Y direction, and the θ direction with the axis perpendicular to the pressed position as the rotation axis at the time of the pressing. Placed within the movement range of the head unit,
Using the load measuring device, grasp the correlation between the load of the measurement result and the amount of displacement of the mounting position in the axial direction of the measurement,
At the time of component mounting, the mounting position deviation amount at this time is predicted based on the correlation from the load at this time,
An electronic component mounting method, wherein a component mounting position is corrected based on the predicted load.   2. The electronic component mounting method according to claim 1, wherein a nozzle with a load of the measurement result exceeding a reference value is not used or is not used. A suction nozzle equipped with a nozzle slider that presses a component in the Z direction with a predetermined urging force mounted on a head unit that can move on the XY plane across the component supply position and the component mounting position is placed at the component supply position. In the electronic component mounting apparatus that moves to the component mounting position and mounts after the suction,
A plurality of suction nozzles that are supported by a holding member so as to be movable up and down and that include a nozzle slider that presses with a predetermined urging force when sucking an electronic component at the component supply position;
A head unit that supports the movably movable member in the XY plane, and supports the suction nozzle so as to be movable in the Z direction and detachable;
Within the movement range of the head unit, it is arranged at a position facing the head unit, and when the nozzle slider is pressed, it is within the X direction, the Y direction, and the θ direction with the axis perpendicular to the pressing position as the rotation axis. A load measuring device that detects a load at the pressed position of at least one direction component;
The correlation between the load of the measurement result grasped by using the load measuring device and the mounting position shift amount in the axial direction of the measurement is stored, and when the component is mounted, from the load at this time, A control device that predicts the mounting position deviation amount at this time based on the correlation, and corrects the component mounting position based on the predicted load;
An electronic component mounting apparatus comprising:

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