WO2022230099A1

WO2022230099A1 - Printing device, and method for calculating unit consumption amount in printing device

Info

Publication number: WO2022230099A1
Application number: PCT/JP2021/016951
Authority: WO
Inventors: 英一玉木
Original assignee: ヤマハ発動機株式会社
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2022-11-03
Also published as: CN117098666A; DE112021006428T5; JPWO2022230099A1; JP7430293B2

Abstract

In this invention, prior to a first printing for executing printing of a coating material on m sheets (where m is a natural number of 1 or greater) of a substrate using a coating material on a mask, a coating material transfer part that has scooped up the coating material from the top of the mask is measured by a first weight measuring unit. Pre-printing information expressing the weight of the coating material prior to the first printing is acquired on the basis of a pre-printing measurement value. After the first printing as well, post-printing information expressing a post-first printing weight of the coating material is acquired in the same manner. The difference between the pre-printing information and the post-printing information corresponds to a reduction amount of the coating material due to the first printing, more specifically, the difference corresponds to a consumption amount, and the unit consumption amount of the coating material can be accurately calculated by dividing the consumption amount by the number of printed sheets m of the substrate in the first printing.

Description

PRINTING DEVICE AND UNIT CONSUMPTION CALCULATION METHOD IN PRINTING DEVICE

This invention relates to a printing technique in which a squeegee is slid against a mask to print a coating material on a mask onto a substrate through an opening provided in the mask, particularly consumption of the coating material consumed per substrate. It relates to technology for calculating quantity.

By sliding a squeegee over the mask while the board is set on the lower surface of the mask to which the coating material such as cream solder is supplied, the coating material is printed on the board in a pattern corresponding to the openings provided in the mask. Printing devices are known. In this printing apparatus, the coating material on the mask is gradually consumed as the printing is repeated. Therefore, in order to control the amount of coating material on the mask, it is desirable to accurately grasp the amount of coating material consumed per substrate and to replenish the appropriate amount of coating material at appropriate timing.

Therefore, for example, in the printing system described in Patent Document 1, when the number of substrates printed reaches a set number, the photoelectric switch detects the width of the solder roll present on the mask. Based on the roll width detection result, the amount of solder consumption is estimated, and based on this, the solder replenishment timing is controlled.

JP 2008-74054 A

In the printing system described in Patent Document 1 above, the shape of the solder roll on the mask is cylindrical, and the volume of solder is calculated on the assumption that the shape is maintained. However, the solder roll has a characteristic of being easily deformed in the width direction, and the solder roll may be deformed in the width direction more than expected when the roll width is detected by the photoelectric switch. As a result, the measurement error of the amount of solder consumed increases, making it difficult to accurately calculate the amount of solder consumed per board (corresponding to the "unit consumption amount" of the present invention).

The present invention has been made in view of the above problems, and provides a printing apparatus that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask. The purpose is to accurately calculate

A first aspect of the present invention is a printing apparatus for printing a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, the printing apparatus comprising: a coating material transfer unit that scoops up the coating material from the coating material and returns the scooped coating material onto the mask; a first weight measurement unit that is connected to the coating material transfer unit and measures the weight; Before executing the first printing for printing the coating material on the mask onto m substrates (m is a natural number equal to or greater than 1), the coating material transfer section that scoops up the coating material from the mask is subjected to a first weight measurement. A pre-printing information acquisition unit that acquires pre-printing information indicating the weight of the coating material before the first printing based on the pre-printing measurement value obtained by measuring in the unit; Post-printing information acquisition for acquiring post-printing information indicating the weight of the coating material after the first printing based on the post-printing measurement value obtained by measuring the coating material transfer section that scooped up the coating material by the first weight measurement section By dividing the amount of decrease in the coating material before and after the first printing based on the number of copies and the pre-printing information and the post-printing information by the number of substrates printed in the first printing m, the coating material consumed per substrate and a unit consumption amount calculation unit that calculates the unit consumption amount of.

A second aspect of the present invention provides a printing apparatus for printing a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, wherein A coating material unit consumption amount calculation method for calculating a unit consumption amount of a coating material to be applied, wherein the first printing is performed to print the coating material on the mask on m substrates (m is a natural number of 1 or more) and a pre-printing measurement value obtained by measuring the coating material transfer unit by the first weight measurement unit after the coating material is scooped up from the mask by the coating material transfer unit before the first printing. a step of acquiring pre-printing information indicating the weight of the coating material before the first printing based on the above; A step of obtaining post-printing information indicating the weight of the coating material after the first printing based on the post-printing measurement value obtained by measuring the at the first weight measuring unit, and based on the pre-printing information and the post-printing information and calculating the unit consumption amount by dividing the reduction amount of the coating material before and after the first printing by the number of printed substrates m in the first printing.

In the invention configured in this way, before the first printing for printing the coating material on m substrates (m is a natural number of 1 or more) using the coating material on the mask, The coating material transfer section that has scooped up the coating material is measured by the first weight measurement section. Based on the pre-printing measurement value, pre-printing information indicating the weight of the coating material before the first printing is acquired. Post-printing information indicating the weight of the coating material after the first printing is similarly obtained after the first printing. The difference between the pre-printing information and the post-printing information corresponds to the amount of decrease in the coating material due to the first printing, that is, the consumption amount. Consumption is calculated accurately.

Here, when the coating material transfer section that has scooped up the coating material is measured by the first weight measurement section, the measured value includes the weight of the scooped coating material and the weight of the coating material transfer section. Therefore, when determining the amount of decrease in the coating material in the first printing, the pre-printing measurement value and the post-printing measurement value may be used as the pre-printing information and the post-printing information, respectively, and the difference between the two may be used. In addition, since the first weight measuring section is connected to the coating material transfer section, the weight of the coating material transfer section is subtracted in advance, that is, the so-called zero point adjustment is performed, and then the coating material is scooped up. Alternatively, the coating material transfer portion may be measured. In this case, the measured value by the first weight measuring unit is the weight of the scooped-up coating material itself, and similarly to the above, the pre-printing measurement value and the post-printing measurement value are used as the pre-printing information and the post-printing information, respectively. can be done.

Also, if the zero point adjustment is not performed, it may be considered that the weight of the coating material transfer section is included in the measured value by the first weight measurement section. In other words, by subtracting the weight of the coating material transfer section from the pre-printing measurement value, the pre-printing weight of the coating material is obtained as pre-printing information. As information, the post-printing weight of the coating material may be obtained. As a result, the weight of the coating material before and after the first printing can be accurately obtained, and the unit consumption of the coating material can be accurately calculated.

In addition, while the coating material is repeatedly scooped up and returned onto the mask, the coating material may remain and adhere to the coating material transfer section, and the amount of the remaining coating material may fluctuate. In this case, it is preferable to take into account the weight of the remaining adhering coating material. More specifically, for the pre-printing information acquisition section, before the first printing and before the coating material transfer section scoops up the coating material from the mask, the pre-printing information of the coating material adhering to the coating material transfer section is obtained. A pre-printing total value of the adhesion weight and the weight of the coating material on the mask may be acquired as the pre-printing information. In addition, the post-printing information acquisition section calculates the post-printing adhesion weight of the coating material adhering to the coating material transfer section after the first printing and before the coating material transfer section scoops up the coating material from the mask. , and the weight of the coating material on the mask after printing may be obtained as the pre-printing information. By doing this, the weight of the coating material before and after the first printing can be obtained with high accuracy without being affected by the residual coating material, and the unit consumption of the coating material can be calculated more accurately. be able to.

In order to obtain the pre-printing total value in this way, the weight of the coating material transfer section may be subtracted from the pre-printing measurement value. Further, in order to obtain the post-printing total value, the weight of the coating material transfer section may be subtracted from the post-printing measurement value. The difference between the pre-printing total value and the post-printing total value obtained in this way is the decrease amount. Unit consumption can be determined accurately.

In addition, a squeegee may be included in the solder attachment destination. If the weight of the solder adhering to the squeegee fluctuates before and after the first printing, the amount of fluctuation may affect the calculation of the unit consumption. In consideration of this point, a second weight measurement unit connected to the squeegee and measuring the weight is further provided, and the pre-printing information acquisition unit performs the second weight measurement of the squeegee separated from the mask before executing the first printing. The pre-printing information is added to the pre-printing information to correct the pre-printing information, and the post-printing information acquisition unit performs the second weight measurement of the squeegee separated from the mask after the first printing. Post-printing information obtained by measuring the squeegee is added to the post-printing information to correct the post-printing information. Preferably, it is configured to calculate the unit consumption of material. With this, the weight of the solder adhering to the squeegee is taken into consideration, and as a result, it is possible to calculate the unit consumption with higher accuracy.

Also, when the solder is scooped up from the mask, the solder may remain on the mask, and the amount of residual may vary. In consideration of this point, a third weight measurement section is further provided for measuring the total weight of the mask and the coating material adhering to the mask, and the pre-printing information acquisition section measures the total weight of the mask and the coating material adhering to the mask. After the coating material is scooped up from the mask by the placing section, the mask pre-printing information measured by the third weight measuring section is added to the pre-printing information to correct the pre-printing information, and the post-printing information acquisition section After executing one printing and after the coating material is scooped up from the mask by the coating material transfer unit, the post-printing information is obtained by adding the post-printing information of the mask measured by the third weighing unit to the post-printing information. It is desirable that the unit consumption amount calculation section calculates the unit consumption amount of the coating material based on the corrected pre-printing information and the corrected post-printing information. As a result, the weight of the solder remaining on the mask when the solder is scooped up from the mask is taken into account, and as a result, the unit consumption can be calculated with higher accuracy.

Also, a storage unit for storing a threshold value of the total consumption amount of the coating material, a total consumption amount calculation unit for calculating the total consumption amount of the coating material based on the unit consumption amount and the number of printed substrates, and the consumption calculated by the total consumption amount calculation unit and a replenishment requesting unit for requesting replenishment of the coating material when the total amount exceeds a threshold value. As a result, the coating material is replenished at appropriate timing, the coating material can be smoothly printed on the substrate, and the operating rate of the printing apparatus can be increased.

In addition, in the second printing after the first printing, there is no timing to directly measure the weight of the coating material. It is desirable to request replenishment only when the threshold is exceeded. As a result, in the second printing, the coating material is replenished at an appropriate timing, the coating material can be smoothly printed on the substrate, and the operating rate of the printing apparatus can be increased.

Furthermore, when requesting replenishment of the coating material, the amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of substrates printed in the first printing and the second printing is used as replenishment information. desirable to add. Such a replenishment request optimizes the amount of coating material on the mask after replenishment, resulting in high print quality.

According to the present invention, in a printing apparatus that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, the unit consumption of the coating material is accurately calculated. can do.

1 is a schematic plan view showing the overall configuration of a printing apparatus according to a first embodiment of the present invention; FIG. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1; 3 is a block diagram showing an electrical configuration of the printing apparatus shown in FIGS. 1 and 2; FIG. 2 is a flowchart showing print processing executed in the printing apparatus shown in FIG. 1; FIG. 5 is a flowchart showing a unit consumption acquisition process executed in the printing process of FIG. 4; FIG. FIG. 10 is a diagram showing a unit consumption amount table that associates mask types of production masks with solder consumption amounts per sheet; FIG. 4 is a diagram showing the relationship between the number of printed sheets and the total consumption of solder in the first embodiment; FIG. 11 is a schematic diagram showing a solder scooping operation in the printing apparatus according to the fourth embodiment of the present invention; FIG. 14 is a flow chart showing a unit consumption acquisition process in the printing apparatus according to the fourth embodiment of the present invention; FIG. FIG. 12 is a diagram showing the relationship between the number of prints and the total consumption of solder in the fifth embodiment of the printing apparatus according to the present invention; FIG. 14 is a schematic diagram showing information acquisition operation in the printing apparatus according to the sixth embodiment of the present invention; FIG. 12 is a schematic diagram showing information acquisition operation in the eighth embodiment of the printing apparatus according to the present invention;

FIG. 1 is a schematic plan view showing the overall configuration of the first embodiment of the printing apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view along line II-II of FIG. FIG. 3 is a block diagram showing the electrical configuration of the printing apparatus shown in FIGS. 1 and 2. As shown in FIG. As shown in FIG. 1, the printing apparatus 1 transports the board B (see FIG. 2) in the X1 direction by a pair of conveyors 12, and prints solder (reference numerals S1 and S2 in FIG. 8) on the board B at the printing position. It is a device that The board B is a printed board on which components (electronic components) are mounted. Also, solder is a bonding material for bonding components onto the substrate B. FIG. Further, in the following description, the direction in which the substrate B is transported by the pair of conveyors 12 (belt conveyor) (X1 direction) and its opposite direction (X2 direction) are defined as the X direction, and the direction substantially perpendicular to the X direction in the horizontal plane is defined as the Y direction. direction. A direction substantially orthogonal to the X direction and the Y direction is defined as the Z direction (vertical direction).

The printing apparatus 1 carries in the substrate B by the carry-in conveyor 1a, performs printing on the surface of the carried-in substrate B according to the printing pattern Pa formed on the mask M, and then prints the printed substrate B. It is configured to be carried out by the carry-out conveyor 1b. In the first embodiment, as will be described in detail later, there is a special mask used for solder rolling in addition to the mask M used for printing to produce the board B as described above. Therefore, when the two are separately explained, the mask directly used for the production of the board B will be referred to as "production mask Mp", and the dedicated mask used for solder rolling will be referred to as "rolling mask Mr". called. On the other hand, when explaining without distinguishing both, it is simply referred to as "mask M".

Among these two kinds of mask types, the production mask Mp has a rectangular flat plate shape in plan view (as seen from the Z1 direction side), as shown in FIG. The production mask Mp has a plurality of openings P1 that form the printing pattern Pa, and non-openings P2 that are regions other than the plurality of openings P1. A frame F is attached to the outer periphery of the production mask Mp. 1 to 3 show a state in which the production mask Mp is moved from the work position W for performing printing processing using the production mask Mp to a mask exchange unit 7, which will be described later. On the other hand, the rolling mask Mr has a flat plate shape having the same plane size as the production mask Mp. However, the rolling mask Mr has no openings and is thicker than the production mask Mp, and as a result has a relatively high rigidity.

As shown in FIG. 2, the printing apparatus 1 includes a base 2, a printing table unit 3, a camera unit 4, a mask clamping member 5, a squeegee unit 6, a mask exchange unit 7,

detection sensors

81 and 82. and a control unit 9 (see FIG. 3).

The printing table unit 3 is provided on the base 2 and configured to hold the substrate B and align it with the production mask Mp. Specifically, the print table unit 3 includes an X-axis movement mechanism (not shown), a Y-axis movement mechanism (not shown), an R-axis movement mechanism (not shown), and a Z-axis movement mechanism (not shown). not shown), a printing table 11 and a pair of conveyors 12 (see FIG. 1).

The X-axis movement mechanism has an X-axis drive unit 13 (see FIG. 3) as a drive source, and moves the print table 11 in the X direction. The Y-axis movement mechanism has a Y-axis drive unit 14 (see FIG. 3) as a drive source, and moves the printing table 11 in the Y direction. The R-axis movement mechanism has an R-axis drive unit 15 (see FIG. 3) as a drive source, and rotates the print table 11 around a rotation axis extending in the Z direction. The Z-axis movement mechanism has a Z-axis drive unit 16 (see FIG. 3) as a drive source, and moves the print table 11 in the Z direction.

The printing table 11 includes a table body 21, a pair of bracket members 22 provided on the table body 21, a support plate 23 on which a plurality of backup pins 23a are arranged, and a support plate drive for moving the support plate 23 in the Z direction. 24. A conveyor 12 (see FIG. 1) is provided above each of the pair of bracket members 22 . The backup pin 23a is configured to support the substrate B from below when the support plate 23 is moved in the Z1 direction (upward) by the support plate drive unit 24. As shown in FIG.

As shown in FIG. 1, a pair of conveyors 12 are provided to extend along the X direction. A pair of conveyors 12 are arranged parallel to each other with a predetermined distance in the Y direction. Also, the pair of conveyors 12 is configured so that the interval in the Y direction can be adjusted according to the width of the substrate B to be conveyed. Specifically, the pair of conveyors 12 are configured such that the Y-direction spacing (width) is adjusted by a substrate width axis driving portion 12a (see FIG. 3).

The camera unit 4 is configured to image the production mask Mp and the substrate B, as shown in FIGS. Specifically, the camera unit 4 has a camera X-axis movement mechanism 31, a camera Y-axis movement mechanism 32, and an imaging section 33 having a substrate camera 33a and a mask camera 33b. The camera X-axis movement mechanism 31 has an X-axis motor 31a and a ball screw 31b extending in the X direction. The camera Y-axis movement mechanism 32 has a Y-axis motor 32a and a ball screw 32b extending in the Y direction. The substrate camera 33 a is configured to capture an image of the substrate B and recognize the relative position of the substrate B with respect to the printing table 11 . The mask camera 33b is configured to capture an image of the mask M and recognize the position of the mask M. As shown in FIG.

As described above, in the printing apparatus 1, after recognizing the relative position of the substrate B with respect to the production mask Mp using the substrate camera 33a and the mask camera 33b, the X-axis movement mechanism, the Y-axis movement mechanism, and the X-axis movement mechanism of the printing table unit 3 are detected. The relative position (position and tilt in the horizontal plane) of the substrate B with respect to the production mask Mp is accurately positioned by the R-axis movement mechanism. Then, in the printing apparatus 1, the substrate B is raised by the Z-axis movement mechanism of the printing table unit 3 in a state where the relative position of the substrate B with respect to the production mask Mp is accurately positioned, and is brought into contact with the lower surface of the production mask Mp. be done. Also, after confirming that the rolling mask Mr is positioned at the working position W using the mask camera 33b, the rolling process is performed.

As shown in FIG. 3, the mask clamping member 5 clamps the mask M when solder is printed on the substrate B according to the print pattern Pa using the production mask Mp or when the rolling process is performed using the rolling mask Mr. It is configured to be held in the working position W. Specifically, the mask clamp member 5 includes a first mask holding portion 41 that holds the end portion of the mask M on the X1 direction side, and a second mask holding portion 42 that holds the end portion of the mask M on the X2 direction side. , and a pressing portion (not shown) provided in the first mask holding portion 41 to press the mask M in the X2 direction.

As shown in FIG. 2, the squeegee unit 6 is configured to reciprocate in the Y direction to scrape the solder supplied onto the upper surface of the mask M along the upper surface of the mask M. Specifically, the squeegee unit 6 includes a squeegee 51, a squeegee Y-axis drive unit 52 that moves the squeegee 51 in the printing direction (Y direction), and a squeegee Z-axis drive unit that moves the squeegee 51 in the vertical direction (Z direction). 53 (see FIG. 3) and a squeegee R-axis driving part 54 (see FIG. 3) that rotates the squeegee 51 around the rotation axis extending in the X direction.

The squeegee 51 is formed to extend in the X direction. The squeegee 51 is configured to print the solder supplied to the production mask Mp while applying a predetermined printing pressure (load) to the mask M, and knead the solder supplied to the rolling mask Mr. . The squeegee Y-axis drive unit 52 has a Y-axis motor 52a and a ball screw 52b extending in the Y direction. The squeegee Z-axis drive unit 53 has a Z-axis motor, a belt, and a ball screw extending in the Z direction, although not shown in the drawings.

The squeegee unit 6, as shown in FIG. 2, includes a mask slider 55 that slides the mask M in the Y direction to perform an exchange operation for exchanging the mask M. As shown in FIG. Here, the squeegee unit 6 is provided with a single mask slider 55 . The mask slider 55 has a sliding portion 55a that can move in the Z direction (vertical direction), and an accommodating portion 55b that accommodates the sliding portion 55a. The mask slider 55 is composed of, for example, an air cylinder, the slide portion 55a is composed of an air cylinder rod, and the accommodating portion 55b is composed of an air cylinder.

The mask slider 55 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction with the squeegee Y-axis drive unit 52 . In addition, the mask slider 55 is moved in the Z2 direction (Z2 direction) so that the slide portion 55a protrudes from the accommodation portion 55b to a position where the slide portion 55a can contact the frame F of the mask M at the working position W in the horizontal direction (Y direction). down). In the mask slider 55, the sliding portion 55a is accommodated in the accommodating portion 55b in the Z1 direction (upward) to a position where the sliding portion 55a does not contact the frame F of the mask M at the working position W in the horizontal direction (Y direction). direction).

Thus, the squeegee 51 and the mask slider 55 are provided integrally with the squeegee unit 6 . Further, the squeegee 51 and the mask slider 55 are configured to move integrally in the Y direction as the squeegee unit 6 moves. The slide portion 55a of the mask slider 55 contacts the frame F of the mask M from the Y1 direction or the Y2 direction to move the mask M in the Y1 direction or the Y2 direction.

The squeegee unit 6 includes a solder scooping unit 56 that scoops up the solder on the mask M. The solder scooping unit 56 has a scooping portion 56a that scoops up and holds the solder on the mask M. As shown in FIG. The scoop-up portion 56a moves between a lowered position for scooping up the solder on the mask M or lowering the scooped-up solder onto the mask M and a raised position for not scooping up the solder on the mask M. (vertical direction) is configured to be movable. The solder scooping-up unit 56 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction with the squeegee Y-axis drive unit 52 . The solder scooping unit 56 scoops up the solder on the mask M to the scooping part 56a and holds it by being moved in the Y2 direction with the scooping part 56a arranged at the lowered position. In addition, the solder scooping unit 56 is moved in the Y1 direction with the scooping part 56a disposed at the lowered position, thereby dropping the scooped solder onto the mask M from the scooping part 56a. Thus, in this embodiment, the scooping portion 56a corresponds to an example of the "coating material transfer portion" of the present invention.

A first weight measurement unit 56b (FIG. 3) configured by a load cell or the like is connected to the scooping unit 56a. When the scooping part 56a scoops up the solder on the mask M, the first weight measuring part 56b measures the total weight of the weight Ws0 of the scooping part 56a alone and the weight of the solder. On the other hand, in the state where the scooped solder is lowered onto the mask M and when the solder on the mask M is not scooped up, the first weight measuring section 56b measures only the weight Ws0 of the scooping section 56a. In the present embodiment, the weight Ws0 of the scooping portion 56a is measured by the first weight measuring portion 56b immediately after installation of a new product or immediately after replacement and repair, and is stored in the storage portion 92 of the control unit 9. FIG.

The mask exchange unit 7 is configured to accommodate a plurality (two) of masks M. Specifically, the mask exchange unit 7 includes a first storage section 61, a second storage section 62, and an elevating section 63 (FIG. 3). The 1st storage part 61 and the 2nd storage part 62 are each comprised so that the mask M of 1 sheet can be accommodated. The first storage portion 61 and the second storage portion 62 are arranged side by side in the vertical direction. The first storage section 61 is an upper storage section arranged above the second storage section 62 . The second storage section 62 is a lower storage section arranged below the first storage section 61 . The lifting section 63 is configured to move the first storage section 61 and the second storage section 62 in the vertical direction. In the mask exchange unit 7 , an elevating section 63 is attached to the base 2 . In the mask exchange unit 7 , the second storage section 62 is attached to the lifting section 63 . In the mask exchange unit 7 , the first storage section 61 is attached to the second storage section 62 . As a result, the first storage section 61 and the second storage section 62 move up and down integrally as the lifting section 63 moves up and down.

The first storage portion 61 and the second storage portion 62 have a lowered position for putting the production mask Mp in and out of the first storage portion 61 and an elevated position for taking in and out the rolling mask Mr from the second storage portion 62 . between and is configured to be movable in the Z direction (vertical direction).

The detection sensor 81 is configured to detect the production mask Mp straddling the mask clamp member 5 and the mask exchange unit 7, as shown in FIG. The detection sensor 82 is configured to detect the rolling mask Mr straddling the mask clamping member 5 and the mask exchange unit 7, as shown in FIG. Specifically, when the production mask Mp is moved between the work position W and the first storage section 61, the detection sensor 81 provided in the first storage section 61 detects the mask clamp member 5 and the first storage section 61. 61, and is configured to detect the stopped production mask Mp. When the rolling mask Mr is moved between the working position W and the second storage portion 62, the detection sensor 82 provided in the second storage portion 62 straddles the mask clamp member 5 and the second storage portion 62. It is configured to detect the rolling mask Mr stopped in the state. The

detection sensors

81 and 82 are, for example, transmissive sensors, and include a light projecting portion (not shown) that emits light and a light receiving portion (not shown) that receives the light emitted from the light projecting portion. have.

1 to 3, the cleaning unit 10 (FIG. 3) for cleaning the lower surface of the production mask Mp fixed at the working position W by the mask clamping member 5 is provided. ing. The cleaning unit 10 includes a cleaner (not shown) and a cleaner Y-axis movement mechanism 102 (FIG. 3). The cleaner is arranged at a height where it can come into contact with the lower surface of the production mask Mp. It is provided so as to freely reciprocate between. A cleaner Y-axis moving mechanism 102 is connected to this cleaner, and a cleaner Y-axis moving portion (not shown) of the cleaner Y-axis moving mechanism 102 operates according to a command from the drive control portion 93 of the control unit 9 . to move the cleaner in the Y direction. The lower surface of the production mask Mp fixed at the working position W is moved by the cleaner Y-axis moving mechanism 102 while the cleaner is in contact with the lower surface of the production mask Mp, thereby cleaning the lower surface of the production mask Mp.

The control unit 9 has a main control section 91, a storage section 92, a drive control section 93, an IO control section 94, and a camera control section 95, as shown in FIG. The main control unit 91 is configured by a computer including a CPU (Central Processing Unit). The storage unit 92 includes a hard disk device and the like, and stores the weight Ws0 of the scooping unit 56a, various data tables including the unit consumption amount table, various data set by the operator, substrate data, machine data, printing programs, and the like. is doing. The main control section 91 has a function of controlling each section of the printing apparatus 1 based on the printing program stored in the storage section 92 . Here, the board data includes information on the type of board B, information on the size of board B, information corresponding to the type of board B, information on rolling mask Mr used for rolling solder, and printing for each type of board B. It includes information such as the number of sheets. The machine data includes Y-direction movement limit position information of the squeegee unit 6, X-direction and Y-direction movement limit position information of the camera unit 4, and Y-direction movement limit position information of the cleaner.

The main control section 91 is configured to control the squeegee unit 6 by means of the drive control section 93 . Specifically, the drive control unit 93 controls the driving of the squeegee Y-axis driving unit 52, the squeegee Z-axis driving unit 53, and the squeegee R-axis driving unit 54 to move the squeegee 51 in the Y and Z directions. At the same time, the squeegee 51 is rotated around the rotation axis extending in the X direction.

The main control section 91 is configured to control the printing table unit 3 by means of the drive control section 93 . Specifically, the main control unit 91 causes the drive control unit 93 to drive the X-axis driving unit 13, Y-axis driving unit 14, R-axis driving unit 15, and Z-axis driving unit 16, and and Z-direction, and rotates the substrate B around the rotation axis extending in the Z-direction. Further, the main control unit 91 drives the support plate driving unit 24 by the drive control unit 93 to move the support plate 23, thereby moving the backup pin 23a in the Z direction (vertical direction). Further, the main control unit 91 causes the drive control unit 93 to drive the substrate width axis drive unit 12a to adjust the Y-direction spacing (width) between the pair of conveyors 12 . Further, the main control unit 91 causes the drive control unit 93 to drive the substrate transport shaft driving unit 17 to transport the substrate B in the X direction.

The main control section 91 is configured to control the camera unit 4 by means of the drive control section 93 . Specifically, the main control unit 91 causes the drive control unit 93 to drive the camera X-axis movement mechanism 31 and the camera Y-axis movement mechanism 32 to move the imaging unit 33 (substrate camera 33a and mask) in the X and Y directions. Move the camera 33b).

The main control section 91 is configured to control the cleaning unit 10 by means of the drive control section 93 . Specifically, the main control section 91 causes the drive control section 93 to drive the cleaner Y-axis driving section (not shown) of the cleaner Y-axis moving mechanism 102 to reciprocate the cleaner in the Y direction.

The main control section 91 is configured to control the camera unit 4 by the camera control section 95 . Specifically, the main control unit 91 controls the imaging operation of the substrate B by the substrate camera 33a through the camera control unit 95 . The main control section 91 controls the imaging operation of the mask M by the mask camera 33b by the camera control section 95 .

Also, the main control section 91 is configured to control the squeegee unit 6 by means of the IO control section 94 . Specifically, the main controller 91 uses the IO controller 94 to control the upward/downward movement of the slide portion 55 a of the mask slider 55 . The main control unit 91 also acquires information about the weight of the solder scooped up by the scooping unit 56a and the weight of the solder scooped up by the scooping unit 56a measured by the first weight measuring unit 56b via the IO control unit 94 .

Also, the main control section 91 is configured to control the mask exchange unit 7 by means of the IO control section 94 . Specifically, the main control section 91 controls the elevating operation of the first storage section 61 and the second storage section 62 of the mask exchange unit 7 by the elevating section 63 by the IO control section 94 . Further, the main control unit 91 receives the detection signal of the detection sensor 81 when the production mask Mp stopped straddling the mask clamping member 5 and the first storage unit 61 is detected by the IO control unit 94 . is configured as The main control unit 91 receives the detection signal of the detection sensor 82 when the rolling mask Mr stopped while straddling the mask clamping member 5 and the second storage unit 62 is detected by the IO control unit 94 . It is configured.

In this manner, the main control unit 91 is configured to control each unit of the apparatus, and as will be described later with reference to FIGS. The pre-printing information and the post-printing information are acquired before and after the first printing performed on m sheets (m is a natural number of 1 or more and is specified by the operator). The pre-printing information is pre-printing information indicating the weight W1 of the solder on the production mask Mp before the first printing. On the other hand, the post-printing information is pre-printing information indicating the weight W2 of the solder on the production mask Mp after the first printing. In this manner, the main control section 91 functions as the "pre-printing information acquisition section" and the "post-printing information acquisition section" of the present invention.

Further, the main control unit 91 calculates the amount of solder reduction before and after the first printing based on the pre-printing information (solder weight W1) and the post-printing information (solder weight W2). Divide by the number m, that is,
Wu = (W1-W2)/m
Then, the unit consumption Wu of solder consumed per board is calculated. In this manner, the main control section 91 also functions as the "unit consumption calculation section" of the present invention.

Furthermore, the main control unit 91 calculates the total amount of solder consumption based on the total number of prints of the board B in the first printing and the second printing executed subsequent to the first printing, and the unit consumption amount Wu, and It has a function of requesting replenishment of solder when the total amount of consumption exceeds a threshold value Wth (see FIG. 7) stored in advance in the storage unit 92 . In this way, the main control section 91 also functions as the "total consumption calculation section" and the "replenishment request section" of the present invention.

Furthermore,

reference numerals

96 and 97 in FIG. 3 denote an input section and a display section, respectively. The input unit 96 is composed of various switches, a touch panel, etc., and receives various input setting instructions such as the number of prints m for the first printing and the threshold value Wth set by the operator. The display unit 97 is composed of a liquid crystal display device, a lamp, etc., and displays various information under the control of the main control unit 91 .

FIG. 4 is a flow chart showing print processing executed by the printing apparatus shown in FIG. FIG. 5 is a flow chart showing a unit consumption acquisition process executed in the printing process of FIG. FIG. 6 is a diagram showing an example of a unit consumption amount table that associates mask types of production masks with solder consumption amounts per sheet. Furthermore, FIG. 7 is a diagram showing the relationship between the number of prints and the total consumption of solder.

In this printing apparatus 1, the main control section 91 controls each section of the apparatus as follows according to the printing program stored in the storage section 92, and the printing of solder on the board B is repeated. When the main control unit 91 receives a print command, it acquires print conditions (step S1). The printing conditions include information on the type of production mask Mp to be used, in addition to the type of substrate B and solder. Based on this mask type information, the main control section 91 determines whether or not the unit consumption Wu corresponding to the production mask Mp used for printing is recorded in the unit consumption table shown in FIG. 6 (step S2).

Here, if the unit consumption Wu corresponding to the production mask Mp is recorded ("YES" in step S2), the processing for obtaining the unit consumption (step S3) is skipped and the process proceeds to step S4. On the other hand, when the unit consumption Wu corresponding to the production mask Mp is unknown ("NO" in step S2), the main control section 91 controls each section of the apparatus as follows, thereby Calculation of the weights W1 and W2 of the solder before and after the first printing, and calculation of the unit consumption are performed in the procedure.

In the unit consumption acquisition process, the solder is scooped up by the scooping unit 56 (step S31). More specifically, the main controller 91 moves the scooping unit 56 in the Y direction to position it above the edge region of the production mask Mp placed at the working position W where the solder is positioned. Then, the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y2 direction (the direction in which the solder S is scooped up) while the scooping section 56a is located at the lowered position. As a result, the solder S on the production mask Mp moves onto the scooping portion 56a of the solder scooping unit 56 and is held there. Thereafter, the main control section 91 raises the scooping section 56a of the solder scooping unit 56 holding the solder S to the raised position. In this way, all the solder on the production mask Mp is transferred to the scooping portion 56a.

The main control section 91 receives the measurement result of the load cell that constitutes the first weight measurement section 56b as the measurement value before the first printing (hereinafter referred to as "pre-printing measurement value"). This pre-printing measurement value is the sum of the weight Ws0 of the scooping portion 56a and the weight W1 of the solder. Therefore, the main control unit 91 reads the weight Ws0 from the storage unit 92 and subtracts the weight Ws0 from the pre-printing measurement value to calculate the weight W1 of the solder (step S32).

In this way, when the weight W1 of the roll-shaped solder existing on the production mask Mp is obtained before the first printing, the solder scooped up by the scooping unit 56 is unloaded onto the production mask Mp. (step S33). More specifically, the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y1 direction (the direction in which the solder S is unloaded) while the scooping section 56a is located at the lowered position. As a result, the solder on the scooping portion 56a of the solder scooping unit 56 is taken down onto the production mask Mp. Thereafter, the main control section 91 raises the scooping section 56a of the solder scooping unit 56 from which the solder has been unloaded to the raised position.

In the next step S34, the main control unit 91 executes printing of the substrate B by the number of printed sheets m designated in advance by the operator via the input unit 96. That is, each time solder printing is performed on the substrate B using the production mask Mp (step S34a), the main control unit 91 increments the total number of prints by "1" and then specifies the total number of prints. It is determined whether or not the specified number of printed sheets m has been reached (step S34b). Printing is repeated while the total number of printed sheets does not reach the number of printed sheets m. In this way, during the first printing, the solder is consumed by the unit consumption Wu each time one substrate B is printed, as shown in FIG. 7, for example. Therefore, when printing is completed for the specified number of printed sheets m, the total amount of solder consumption Wm is (Wu×m), while the weight W2 of the solder on the production mask Mp is the weight W1 before printing. less than

Therefore, in this embodiment, the main control section 91 calculates the unit consumption Wu by executing the following steps S35 to S38. That is, when the total number of printed sheets reaches the specified number of printed sheets m, steps (steps S35 and S36) similar to steps S31 and S32 are executed to calculate the weight W2 of the solder after the first printing. That is, after the solder is scooped up by the scooping unit 56 (step S35), the main control section 91 converts the measurement result of the load cell constituting the first weight measuring section 56b to the measured value after the first printing (hereinafter referred to as (referred to as "measured value after printing"). Since this post-printing measurement value is the sum of the weight Ws0 of the scooping portion 56a and the weight W2 of the solder, the main control section 91 reads the weight Ws0 from the storage section 92 and uses it from the post-printing measurement value. By subtracting the weight Ws0, the weight W2 of the solder is calculated (step S36).

Thus, when the weight W2 of the rolled solder existing on the production mask Mp is obtained after the first printing, the solder scooped up by the scooping unit 56 is unloaded onto the production mask Mp. (step S37). In parallel with this, the main control unit 91 performs the following formula,
Wu = (W1-W2)/m
Then, the unit consumption Wu of solder consumed per board is calculated (step S38). Further, the main control unit 91 additionally records the unit consumption Wu in the unit consumption table shown in FIG. 6 while associating it with the product type of the production mask Mp, and updates the unit consumption table in the storage unit 92 (step S39). .

When the unit consumption acquisition process (step S3) is completed, as shown in FIG. 4, the production mask Mp is used to continue printing the (m+1)th and subsequent sheets. On the other hand, when the unit consumption Wu has been recorded ("YES" in step S2), the first printing is skipped and the second printing is performed. Although the presence or absence of the first printing is thus different, the second printing (step S4) is always performed while monitoring the total amount of solder consumption based on the unit consumption amount Wu. That is, when the solder printing on the board B (step S4a) is completed in step S4, the main control unit 91 calculates the following formula (total solder consumption)=unit consumption Wu×(number of prints)
The total amount of solder consumption is calculated based on and compared with the threshold value Wth (step S4b). Here, for example, as shown in FIG. 7, when the total solder consumption W(n-1) for the number of prints (n-1) is equal to or less than the threshold value Wth ("YES" in step S4b), the main control unit 91 determines that sufficient solder remains on the production mask Mp to print at least one substrate B, and repeats the second printing (step S4a).

On the other hand, as shown in the figure, when the total solder consumption Wn exceeds the threshold value Wth when the number of prints is n ("NO" in step S4), the main control unit 91 puts the following on the production mask Mp: It is determined that there is not enough solder left to print the next board B, that is, the (n+1)th board B, and the second printing (step S4a) is stopped. Then, the main control unit 91 calculates the weight Wn (=Wu×n) of the same solder consumed for printing the n boards B as the replenishment amount (step S5). Subsequently, the main control unit 91 instructs the operator to replenish solder by displaying on the display unit 97 that the weight of solder corresponding to the total consumption Wn calculated in step S5 is to be replenished (step S6).

As shown in FIG. 7, when printing is resumed after solder supply is performed based on the instruction, the main control unit 91 does not perform the first printing after printing is resumed, and the unit consumption The second printing is repeatedly performed while monitoring the total amount of solder consumption based on the total consumption amount Wn recorded in the amount table. Then, for example, as shown in the figure, when p sheets are printed from the resumption of printing and the total amount of solder consumption Wp exceeds the threshold value Wth, the main control unit 91 calculates the solder replenishment amount (step S5). The operator is instructed to supply solder (step S6).

As described above, in the present embodiment, the solder weights W1 and W2 before and after the first printing are calculated as pre-printing information and post-printing information, respectively, and the difference between them is divided by the number of printed sheets m in the first printing. A unit consumption Wu of solder is calculated. Therefore, it is possible to calculate the amount of solder consumed each time one substrate B is printed, that is, the unit consumption amount Wu, with higher accuracy than in the prior art.

Also, the solder replenishment timing is obtained by calculating the total amount of solder consumption for each second printing and comparing it with the threshold value Wth. Therefore, solder can be replenished at appropriate timing. As a result, the solder can be smoothly printed on the substrate B, and the operating rate of the printing apparatus 1 can be increased.

Further, when requesting solder replenishment, an amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of boards printed in the first printing and the second printing is used as replenishment information. It is desirable to notify the operator together with With such a replenishment request with replenishment information, the amount of solder on the production mask Mp after replenishment is optimized, and high print quality is obtained.

Thus, in the first embodiment, the production mask Mp corresponds to an example of the "mask" of the present invention. Moreover, solder corresponds to an example of the "coating material" of the present invention. The weights W1 and W2 of the solder correspond to examples of the "weight of the coating material before printing" and the "weight of the coating material after printing", respectively.

It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in the above embodiment, the measurement result of the load cell is used as it is as the pre-printing measurement value and the post-printing measurement value. Good (second embodiment). In this case, the measurement results of the load cells are the solder weights W1 and W2 as they are, and the pre-printing measurement value and the post-printing measurement value correspond to the "pre-printing information" and the "post-printing information", respectively.

In addition, since the weight change over time of the scooping portion 56a is zero or minimal, the pre-printing measurement value (=W1+Ws0) and the post-printing measurement value (=W2+Ws0) of the load cell are used as they are in the "pre-printing information" and "post-printing information." information" (third embodiment).

In addition, in the above embodiment, it is assumed that there is no residual adhesion of solder to the scooping portion 56a before the solder is scooped up, or that even if solder is adhered, the amount of residual adhesion is extremely small. However, the amount of residual adhesion is relatively large, or, for example, as shown in FIG. and are different. In these cases, it is desirable to obtain the unit consumption after considering residual adhesion of solder (fourth embodiment). The weight Ws1 and the weight Ws2 respectively correspond to examples of the "adherence weight before printing" and the "adherence weight after printing" in the present invention.

FIG. 9 is a flowchart showing a unit consumption amount acquisition process in the fourth embodiment of the printing apparatus according to the present invention. The fourth embodiment will be described below with reference to FIGS. 8 and 9. FIG. The fourth embodiment greatly differs from the first embodiment in that the weight of the solder is calculated including not only the solder on the production mask Mp but also the solder adhering to the scooping portion 56a. be. Other configurations are basically the same as those of the first embodiment. The following description will focus on the points of difference, while the same components will be denoted by the same reference numerals, and the description thereof will be omitted.

In the acquisition process of the unit consumption amount in the fourth embodiment, as in the first embodiment, the scooping up unit 56 scoops up the solder (step S31). The main control section 91 receives the measurement result of the load cell constituting the first weight measurement section 56b as the pre-printing measurement value. Here, as shown in FIG. 8A, the solder Ss1 adheres to the scooping portion 56a immediately before the scooping. Therefore, the pre-printing measurement values measured by the first weight measuring portion 56b immediately after the solder is scooped up are the weight Ws0 of the scooped up portion 56a, the weight Ws1 of the residual solder Ss1, and the weight of the scooped up solder S1. The total value with W1 (hereinafter referred to as "total value before printing") is WL1. Therefore, the main control unit 91 calculates the weight of the solder (W1+Ws1) by subtracting the weight Ws0 from the pre-printing measurement value (step S32A).

Subsequently, similarly to step S33, the solder (S1+Ss1) scooped up by the scooping unit 56 is unloaded onto the production mask Mp. However, part of the solder remains and adheres to the scooped-up portion 56a as shown in the column "immediately before scooping up" in FIG. may differ from

Subsequently, as in the first embodiment, the main control unit 91 executes printing of the substrate B by the number m of printed sheets designated in advance by the operator (step S34), executing the first printing. As a result, as shown in FIG. 8, part of the solder S1' is used for printing, and the weight W2 of the solder S2 on the production mask Mp becomes smaller than the weight of the solder S1' before printing. On the other hand, the weight Ws2 of the solder Ss2 remaining on the scooping portion 56a varies depending on the viscosity of the solder and the wettability of the solder to the scooping portion 56a.

Therefore, in the fourth embodiment, the main control unit 91 scoops up the solder S2 on the production mask Mp with the scooping unit 56, as in step S35 of the first embodiment. As a result, the solder held in the scooping portion 56a becomes the solder S2 and the residual adhered solder Ss2, as shown in the column "immediately after scooping up" in FIG. 8(b). Then, the main control section 91 receives the measurement result of the load cell constituting the first weight measurement section 56b as the post-printing measurement value. Here, as shown in the same column, the solder Ss2 adheres to the scooping portion 56a just before the scooping. Therefore, the pre-printing measurement values measured by the first weight measuring portion 56b immediately after the solder is scooped up are the weight Ws0 of the scooped up portion 56a, the weight Ws2 of the residual solder Ss2, and the weight of the scooped up solder S2. The total value with W2 (hereinafter referred to as "post-printing total value") is WL2. Therefore, the main control unit 91 calculates the weight of the solder (W2+Ws2) by subtracting the weight Ws0 from the measured value after printing (step S36A).

Thus, when the weight (W2+Ws2) of the solder (S2+Ss2) after the first printing is obtained, the solder scooped up by the scooping unit 56 is unloaded onto the production mask Mp (step S37). In parallel with this, the main control unit 91 performs the following formula Wu=((W1+Ws1)-(W2+Ws2))/m
Then, the unit consumption Wu is calculated (step S38A). Further, the main control unit 91 additionally records the unit consumption Wu in the unit consumption table shown in FIG. 6 while associating it with the product type of the production mask Mp, and updates the unit consumption table in the storage unit 92 (step S39). .

As described above, according to the fourth embodiment, the unit solder consumption Wu can be calculated more accurately without being affected by the residual solders Ss1 and Ss2.

Also, in the above embodiment, as shown in FIG. 7, the total amount of solder consumption Wm does not exceed the threshold value Wth when the first printing is performed. However, as shown in FIG. 10, the total consumption Wm may exceed the threshold value Wth. Therefore, after calculating the post-printing information (step S36), it is determined whether or not the total consumption amount Wm exceeds the threshold value Wth. Step S5) and solder replenishment instruction (step S6) may be executed (fifth embodiment). According to the fifth embodiment, the solder is replenished at appropriate timing, the solder can be smoothly printed on the board B, and the operating rate of the printing apparatus 1 can be increased.

Further, in the first to third embodiments, the unit consumption amount is obtained based on the pre-printing information and the post-printing information corresponding to the weight of the solder scooped up from the production mask Mp before and after the first printing, and the fourth embodiment. In the form, the unit consumption amount is obtained based on the pre-printing total value and the post-printing total value corresponding to the total value of the solder scooped up from the production mask Mp before and after the first printing and the solder adhering to the scooped-up portion 56a. . Here, the squeegee 51 may be included in the attachment destination of the solder. Therefore, if the weight of the solder adhering to the squeegee 51 fluctuates before and after the first printing, the amount of fluctuation may affect the calculation of the unit consumption.

Therefore, it may be configured to calculate the unit consumption in consideration of this point. For example, as shown in FIG. 11, information ( hereinafter referred to as "pre-squeegee printing information") and information related to the weight of the solder S51' adhering to the squeegee 51 after the first printing (hereinafter referred to as "post-squeegee printing information"). Therefore, in the first to third embodiments, the unit consumption is based on the value corrected by adding the pre-squeegee printing information to the pre-printing information and the corrected value by adding the post-squeegee printing information to the post-printing information. You can ask for quantity. More specifically, the unit consumption may be obtained based on the difference between the corrected pre-printing information and the corrected post-printing information (sixth embodiment). Further, in the fourth embodiment, the unit consumption may be obtained based on the value corrected by adding the information before squeegee printing to the total value before printing and the value corrected by adding the information after squeegee printing to the total value after printing. Good (seventh embodiment). In this way, by further considering the information before squeegee printing and the information after squeegee printing, it is possible to calculate the unit consumption with higher accuracy.

In addition, when the solder is scooped up from the production mask Mp, the solder remaining on the production mask Mp (for example, symbols Smp and Smp' in FIG. 12) is also taken into account and corrected to obtain the unit consumption amount. is preferred. For example, as shown in FIG. 12, by providing a third weight measurement unit 57 configured by a load cell or the like capable of measuring the weight of the production mask Mp and the solder adhering to the production mask Mp, Information related to the weight of the solder Smp remaining on the production mask Mp in the raising operation (hereinafter referred to as "pre-mask printing information") and solder Smp' remaining on the production mask Mp in the scooping operation after the first printing. Information related to weight (hereinafter referred to as "information after mask printing") can be obtained. Then, in the first to third embodiments and the sixth embodiment, a value corrected by further adding pre-mask printing information (corresponding to the "corrected pre-printing information" of the present invention) and a value after mask printing The unit consumption amount may be obtained based on the difference from the corrected value (corresponding to the "corrected post-printing information" of the present invention) that is corrected by further adding information (eighth embodiment). Further, in the fourth and seventh embodiments, values corrected by further adding mask pre-printing information (corresponding to "corrected pre-printing information" of the present invention) and corrected by further adding mask post-printing information The unit consumption amount may be obtained based on the calculated value (corresponding to the "corrected post-printing information" of the present invention) (ninth embodiment). In this manner, the unit consumption amount can be calculated with higher accuracy by further considering the information before mask printing and the information after mask printing.

Furthermore, in the above embodiment, the present invention is applied to a printing apparatus that uses solder as the "coating material" of the present invention. The present invention can be applied.

The present invention can be applied to general printing techniques in which a coating material on a mask is printed onto a substrate through openings provided in the mask by sliding a squeegee on the mask.

REFERENCE SIGNS LIST 1 printing device 51a second weight measuring unit 56a scooping unit (coating material transfer unit)
56b First weight measurement unit 57 Third weight measurement unit 91 Main control unit (pre-printing information acquisition unit, post-printing information acquisition unit, unit consumption calculation unit, total consumption calculation unit, replenishment request unit)
92... Memory section B... Board m... Number of prints P1... Opening S1, S1', S2... Solder (on production mask) S51, S51'... Solder (attached to squeegee) Ss1... (Residual adhesion before printing) ) Solder Ss2...Solder (residually attached after printing) Smp, Smp'...Solder (residually attached to the mask after scooping up the solder) W1...Weight before printing W2...Weight after printing WL1...Total value before printing WL2 …Total value after printing Mp…Mask (for production) Ws0…Weight (of scooping part) Ws1…Applied weight before printing Ws2…Applied weight after printing Wu…Unit consumption Wth…Threshold

Claims

A printing apparatus for printing a coating material on the mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask,
a coating material transfer unit that scoops up the coating material from the mask and returns the scooped coating material onto the mask;
a first weight measurement unit that is connected to the coating material transfer unit and measures weight;
Before executing the first printing for printing the coating material on the mask onto m substrates (m is a natural number equal to or greater than 1), the coating material is scooped up from the mask and the coating material is transferred. a pre-printing information acquiring unit that acquires pre-printing information indicating the weight of the coating material before the first printing based on the pre-printing measurement value obtained by measuring the part by the first weight measuring unit;
After executing the first printing, the first printing is performed based on the post-printing measurement value obtained by measuring the coating material transfer unit that scoops up the coating material from the mask by the first weight measurement unit. a post-printing information acquisition unit that acquires post-printing information indicating the weight of the coating material afterward;
Based on the pre-printing information and the post-printing information, the reduction amount of the coating material before and after the first printing is divided by the number m of printed substrates in the first printing, and the consumption per substrate is a unit consumption calculation unit that calculates the unit consumption of the coating material to be applied;
A printing device comprising:
The printing device according to claim 1, wherein
The pre-printing information acquisition unit uses the pre-printing measurement value as the pre-printing information,
The post-printing information acquisition unit uses the post-printing measurement value as the pre-printing information,
The unit consumption amount calculation unit sets the difference between the pre-printing measurement value and the post-printing measurement value as the decrease amount.
printer.
The printing device according to claim 1, wherein
The pre-printing information acquisition unit obtains the pre-printing weight of the coating material as the pre-printing information by subtracting the weight of the coating material transfer unit from the pre-printing measurement value,
The post-printing information acquisition unit obtains the post-printing weight of the coating material as the post-printing information by subtracting the weight of the coating material transfer unit from the post-printing measurement value,
The unit consumption amount calculation unit sets the difference between the pre-printing weight and the post-printing weight as the decrease amount.
printer.
The printing device according to claim 1, wherein
The pre-printing information acquisition unit is configured to obtain a pre-printing information of the coating material adhering to the coating material transfer unit before the first printing and before the coating material transfer unit scoops up the coating material from the mask. Acquiring the pre-printing total value of the adhesion weight and the weight of the coating material on the mask as the pre-printing information,
After the first printing and before the coating material transfer section scoops up the coating material from the mask, the post-printing information acquisition section prints the coating material adhering to the coating material transfer section. Obtaining the post-printing total value of the adhesion weight and the weight of the coating material on the mask as the pre-printing information;
printer.
The printing device according to claim 4,
The pre-printing information acquisition unit obtains the pre-printing total value by subtracting the weight of the coating material transfer unit from the pre-printing measurement value,
The post-printing information acquisition unit obtains the post-printing total value by subtracting the weight of the coating material transfer unit from the post-printing measurement value,
The unit consumption amount calculation unit sets the difference between the pre-printing total value and the post-printing total value as the decrease amount.
printer.
The printing apparatus according to any one of claims 1 to 4,
further comprising a second weight measurement unit connected to the squeegee to measure weight;
The pre-printing information acquisition unit adds squeegee pre-printing information obtained by measuring the squeegee separated from the mask by the second weight measurement unit to the pre-printing information before executing the first printing. correcting the pre-printing information;
The post-printing information acquisition unit adds post-printing information on the squeegee obtained by measuring the squeegee separated from the mask by the second weight measurement unit to the post-printing information after performing the first printing. Correct the information after printing,
The unit consumption amount calculation unit calculates the unit consumption amount of the coating material based on the corrected pre-printing information and the corrected post-printing information.
printer.
A printing device according to any one of claims 1 to 4 and 6,
further comprising a third weight measuring unit that measures the total weight of the mask and the coating material adhering to the mask;
The pre-printing information acquisition unit measures the mask measured by the third weight measurement unit before executing the first printing and after the coating material is scooped up from the mask by the coating material transfer unit. correcting the pre-printing information by adding pre-printing information to the pre-printing information;
The post-printing information acquisition unit measures the mask measured by the third weight measurement unit after the first printing is performed and after the coating material is scooped up from the mask by the coating material transfer unit. correcting the post-printing information by adding post-printing information to the post-printing information;
The unit consumption amount calculation unit calculates the unit consumption amount of the coating material based on the corrected pre-printing information and the corrected post-printing information.
printer.
The printing device according to any one of claims 1 to 7,
a storage unit that stores a threshold for the total amount of consumption of the coating material;
a total consumption calculation unit that calculates the total consumption of the coating material based on the unit consumption and the number of printed substrates;
a replenishment request unit that requests replenishment of the coating material when the total consumption calculated by the total consumption calculation unit exceeds the threshold;
printer.
9. The printing device according to claim 8,
In the second printing after the first printing, the replenishment requesting unit compares the total consumption amount with the threshold value each time the coating material on the mask is printed on the substrate, and the total consumption amount exceeds the threshold value. requesting said resupply only when exceeding;
printer.
10. The printing device according to claim 9,
When determining that the total consumption amount exceeds the threshold, the replenishment requesting section adds the substrate printed in the first printing and the second printing to the unit consumption amount calculated by the unit consumption amount calculating section. requesting a replenishment of said coating material in an amount multiplied by the total number of
printer.
A unit of the coating material consumed per substrate in a printing apparatus that prints the coating material on the mask onto a substrate through an opening provided in the mask by sliding a squeegee against the mask. A unit consumption calculation method for calculating consumption,
a step of performing a first printing of printing the coating material on the mask onto m substrates (m is a natural number of 1 or more);
Before the first printing, after the coating material is scooped up from the mask by the coating material transfer unit, the coating material transfer unit is measured by the first weight measurement unit. obtaining pre-printing information indicating the weight of the coating material before the first printing based on
After the first printing, the post-printing measurement value obtained by scooping up the coating material from the mask by the coating material transfer unit and then measuring the coating material transfer unit by the first weight measurement unit obtaining post-printing information indicating the weight of the coating material after the first printing based on
The unit consumption amount is calculated by dividing the decrease amount of the coating material before and after the first printing by the number of printed substrates m in the first printing based on the pre-printing information and the post-printing information. process and
A unit consumption calculation method for a printing device, comprising: