WO2022054191A1

WO2022054191A1 - Substrate work machine

Info

Publication number: WO2022054191A1
Application number: PCT/JP2020/034253
Authority: WO
Inventors: 敦志鳥居
Original assignee: 株式会社Fuji
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2022-03-17
Also published as: JPWO2022054191A1

Abstract

This substrate work machine is provided with: a support member that supports a substrate from the bottom surface thereof; a clamp device that clamps the substrate in a state of being supported by the support member; a lifting device that lifts and lowers the support member along with the clamp device; a contact body that comes into contact with the support member or the substrate supported on the support member as a result of the contact body being positioned at a prescribed height above the support member and the support member being lifted by the lifting device; and a computation device that computes the thickness of the substrate supported on the support member on the basis of the difference between the height of the support member when the support member comes into contact with the contact body, and the height of the support member when the substrate supported on the support member comes into contact with the contact body.

Description

Anti-board work machine

The present invention relates to a board-to-board working machine provided with a clamping device for clamping a board.

In a board-to-board working machine equipped with a clamping device that clamps the board, various operations are executed on the board in the clamped state. The following patent document describes an example of such a substrate working machine.

Japanese Unexamined Patent Publication No. 2012-066558 Japanese Unexamined Patent Publication No. 2013-071284

In a board-to-board working machine equipped with a clamping device that clamps the board, the work on the board can be appropriately performed by calculating the thickness of the board. Therefore, it is an object of the present invention to appropriately calculate the thickness of the substrate.

In order to solve the above problems, the present specification describes a support member that supports the substrate from the lower surface, a clamp device that clamps the substrate in a state of being supported by the support member, and the support member is moved up and down together with the clamp device. An elevating device and a contact body that is positioned at a predetermined height above the support member and that the support member is raised by the elevating device to come into contact with the support member or a substrate supported by the support member. , The support member is based on the difference between the height of the support member when the support member comes into contact with the contact body and the height of the support member when the substrate supported by the support member comes into contact with the contact body. Disclosed is an anti-board working machine provided with an arithmetic unit for calculating the thickness of a substrate supported by the above.

In the present disclosure, the support member is supported by the support member based on the difference between the height of the support member when the support member comes into contact with the contact body and the height of the support member when the substrate supported by the support member comes into contact with the contact body. The thickness of the board is calculated. This makes it possible to appropriately calculate the thickness of the substrate.

It is a side view which shows the printing machine. It is a top view which shows the printing machine. It is a perspective view which shows the substrate transfer holding apparatus. It is sectional drawing in the AA line of FIG. It is a block diagram which shows the control device. It is a figure which shows the circuit board in a clamped state. It is a figure which shows the circuit board in the state of being in close contact with a mask. It is a figure which shows the circuit board in the state which is not in close contact with a mask. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated. It is an operation diagram of the printing machine when the actual thickness dimension of a circuit board is calculated.

Hereinafter, examples of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.

FIGS. 1 and 2 show the printing machine 10. The printing machine 10 is a working machine for printing cream solder on a circuit board. The printing machine 10 includes a substrate transport holding device 20, a mask holding device 22, an image pickup device 23, a squeegee device 24, a solder supply device 26, and a control device (see FIG. 5) 28. Note that FIG. 1 is a diagram showing the printing press 10 from a side viewpoint, and FIG. 2 is a diagram showing the printing press 10 from a viewpoint from above.

As shown in FIGS. 3 and 4, the board transfer holding device 20 includes a conveyor device 50, a board holding device 52, and a board lifting device 54. FIG. 3 is a diagram showing the substrate transport holding device 20 from an obliquely upper viewpoint, and FIG. 4 is a diagram showing the substrate transport holding device 20 from a viewpoint from the AA line of FIG.

The conveyor device 50 has a pair of

guide rails

60 and 62 and a conveyor belt 66 provided on each of the

guide rails

60 and 62. A pair of

guide rails

60 and 62 are arranged in parallel with each other, and each

guide rail

60 and 62 is supported on the upper surface of the elevating table 72 via a pair of support legs 70. The extending direction of the

guide rails

60 and 62 is referred to as the X direction, the direction horizontally orthogonal to the X direction is referred to as the Y direction, and the direction orthogonal to both the X direction and the Y direction is referred to as the Z direction.

Further, on the side surface of each of the

guide rails

60 and 62, two

pulleys

74 and 76 are arranged with the Y direction as the axis. The two

pulleys

74 and 76 are arranged at both ends of the

guide rails

60 and 62, respectively. The guide rail 60 and the guide rail 62 are arranged so that the arrangement surfaces of the

pulleys

74 and 76 face each other. Then, the conveyor belt 66 is wound around the

pulleys

74 and 76 of the

guide rails

60 and 62, and the conveyor belt 66 is rotated by the drive of the electromagnetic motor (see FIG. 5) 78. The conveyor belt 66 orbits in the clockwise direction in FIG. As a result, the circuit board (see FIG. 9) 80 is placed on the conveyor belt 66, so that the circuit board is directed from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. 80 is transported.

Further, the board holding device 52 has an elevating table 90, a backup block 91, a table elevating mechanism 92, and a clamp device 93. The elevating table 90 is generally rectangular and is arranged below the

guide rails

60, 62 so as to extend between the pair of support legs 70 of the

guide rails

60, 62. Further, a backup block 91 is arranged on the upper surface of the elevating table 90. The backup block 91 is generally in the shape of a block, and the outer dimensions of the upper surface of the backup block 91 are slightly smaller than the outer dimensions of the circuit board 80. Further, the elevating table 90 is arranged on the upper surface of the elevating table 72 via the table elevating mechanism 92, and the table elevating mechanism 92 elevates the elevating table 90 by driving an electromagnetic motor (see FIG. 5) 96. ..

Further, the clamp device 93 has a fixed clamper 100, a movable clamper 102, and an air cylinder (see FIG. 5) 104. The fixed clamper 100 and the movable clamper 102 are generally rectangular, and the fixed clamper 100 is fixed to the upper surface of the guide rail 60 above the elevating table 90. On the other hand, the movable clamper 102 is slidably arranged on the upper surface of the guide rail 62 in the Y direction above the elevating table 90, and the elastic force of the coil spring (not shown) is provided in the direction away from the fixed clamper 100. Is being urged by. Then, the movable clamper 102 approaches the fixed clamper 100 against the elastic force of the coil spring by driving the air cylinder 104.

With such a structure, in the substrate transfer holding device 20, the circuit board 80 conveyed by the conveyor device 50 is clamped by the substrate holding device 52. Specifically, the circuit board 80 is carried into the printing machine 10 and conveyed to a predetermined working position by the conveyor device 50. When the circuit board 80 is conveyed to the working position, both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are located below the fixed clamper 100 and the movable clamper 102.

Next, when the circuit board 80 is conveyed to the working position, the elevating table 90 is raised by the drive of the electromagnetic motor 96. At this time, the upper surface of the backup block comes into contact with the lower surface of the circuit board 80, and the circuit board 80 also rises as the elevating table 90 rises. At this time, the circuit board 80 is lifted from the conveyor belt 66. Further, by raising the elevating table 90, the circuit board 80 is lifted to the same height as the fixed clamper 100 and the movable clamper 102. At this time, the movable clamper 102 approaches the fixed clamper 100 by driving the air cylinder 104, so that the circuit board 80 is sandwiched between the fixed clamper 100 and the movable clamper 102. As a result, the circuit board 80 is clamped by the clamping device 93 in a state of being lifted from the conveyor belt 66.

Further, the board elevating device 54 has the elevating table 72 and the table elevating mechanism 106. The table elevating mechanism 106 raises and lowers the elevating table 72 by driving an electromagnetic motor (see FIG. 5) 108. As a result, the conveyor device 50 and the board holding device 52 arranged on the elevating table 72 move up and down by the board elevating device 54. That is, the circuit board 80 in the state of being clamped by the clamp device 93 is moved up and down by the board elevating device 54.

Further, as shown in FIG. 1, the mask holding device 22 includes a mask support base 110 arranged above the substrate transport holding device 20 and a mask fixing mechanism 112 arranged on the upper surface of the mask support base 110. have. An opening (not shown) is formed in the central portion of the mask support base 110, and the mask 116 is placed on the mask support base 110 so as to cover the opening. Then, the mask 116 placed on the mask support base 110 is fixedly held by the mask fixing mechanism 112.

The opening formed in the mask support base 110 is larger than the circuit board 80 conveyed by the substrate transfer holding device 20. Then, the circuit board 80 clamped by the clamp device 93 is raised by the board elevating device 54, so that the circuit board 80 is brought into close contact with the lower surface of the mask 116 held by the mask fixing mechanism 112. Further, the circuit board 80 clamped by the clamp device 93 is lowered by the board elevating device 54, so that the circuit board 80 is separated from the lower surface of the mask 116.

Further, as shown in FIGS. 1 and 2, the image pickup device 23 has a camera moving device 120, a camera 122, a cylinder 123, and a stopper 124. The camera moving device 120 includes a pair of slide rails 126, a Y slider 128, and an X slider 130. The pair of slide rails 126 are arranged in the vertical direction between the substrate transport holding device 20 and the mask holding device 22 so as to be parallel to each other and extend in the Y-axis direction. The Y slider 128 is slidably held by a pair of slide rails 126, and slides in the Y direction by the operation of the electromagnetic motor (see FIG. 5) 132. The X slider 130 is slidably attached to the lower surface side of the Y slider 128 in the X direction, and slides in the X direction by the operation of the electromagnetic motor (see FIG. 5) 136. The slide rail 126 does not overlap with the board elevating device 54 of the board transfer holding device 20 in the vertical direction, and the Y slider 128 moves from above the board elevating device 54, so that the circuit board 80 is an image pickup device. It is raised by the board elevating device 54 without contacting the 23.

The camera 122 is attached to the lower surface side of the X slider 130 in a state of facing downward. Further, the cylinder 123 is attached to the lower surface side of the X slider 130, and the cylinder rod (see FIG. 9) 125 of the cylinder 123 extends downward. A stopper 124 is fixed to the lower end of the cylinder rod 125. Therefore, the stopper 124 descends as the cylinder 123 expands, and rises as the cylinder 123 contracts. Further, the cylinder 123 has a built-in contact sensor (see FIG. 5) 140, and the contact sensor 140 reacts when the cylinder 123 is fully extended. That is, when the cylinder 123 is most extended and the stopper 124 is lowered to the lowermost end, the contact sensor 140 is turned on, and when the stopper 124 is slightly raised from the lowermost end, it is turned off.

Further, the squeegee device 24 has a squeegee moving device 150, a pair of

squeegees

152 and 154, and a squeegee elevating device 156. The squeegee moving device 150 includes a pair of slide rails 158 and a slider 160. The pair of slide rails 158 are arranged above the mask holding device 22 so as to be parallel to each other and extend in the Y-axis direction. The slider 160 is slidably attached to a pair of slide rails 158 and slides in the Y direction by the operation of an electromagnetic motor (see FIG. 5) 162. Further, each of the pair of

squeegees

152 and 154 is generally plate-shaped and is made of a flexible material. The pair of

squeegees

152 and 154 are arranged so as to face each other and extend in the X-axis direction, and are held by the squeegee elevating device 156 below the slider 160. The squeegee elevating device 156 raises and lowers a pair of

squeegees

152 and 154 individually.

Further, the solder supply device 26 is a device for supplying cream solder, and a discharge port 170 for discharging cream solder is formed on the lower surface of the solder supply device 26. The solder supply device 26 is fixed to the substantially central portion of the side surface of the slider 160 in the Y-axis direction. As a result, the solder supply device 26 moves to an arbitrary position in the Y-axis direction by the operation of the squeegee moving device 150.

As shown in FIG. 5, the control device 28 includes a controller 180, a plurality of drive circuits 182, and an image processing device 186. The plurality of drive circuits 182 are connected to the

electromagnetic motors

78, 96, 108, 132, 136, 162, an air cylinder 104, a cylinder 123, a squeegee elevating device 156, and a solder supply device 26. The controller 180 includes a CPU, ROM, RAM, and the like, and is mainly a computer, and is connected to a plurality of drive circuits 182. As a result, the operation of the substrate transfer holding device 20, the squeegee device 24, and the like is controlled by the controller 180. The controller 180 is also connected to the image processing device 186. The image processing device 186 processes the image data obtained by the camera 122, and the controller 180 acquires various information from the image data. Further, the controller 180 is connected to the contact sensor 140 and acquires the detection value from the contact sensor 140.

In the printing machine 10, the circuit board 80 is conveyed to the working position and clamped by the clamping device 93 according to the above-described configuration. Subsequently, the clamped circuit board 80 is raised by the board elevating device 54 so as to be in close contact with the lower surface of the mask 116. The mask 116 is formed with through holes (not shown) in accordance with the pattern of the pads and the like of the circuit board 80. Then, by applying the cream solder to the mask 116, the cream solder is printed on the circuit board 80 through the through holes of the mask 116.

Specifically, before the circuit board 80 is carried into the printing press 10 and transported to the working position, the X slider 130 moves upward between the pair of conveyor belts 66 by the drive of the camera moving device 120. , The cylinder 123 attached to the X slider 130 extends. At this time, the stopper 124 fixed to the lower end of the cylinder rod 125 of the cylinder 123 descends until it is located below the upper surface of the conveyor belt 66. As a result, the circuit board 80 conveyed by the conveyor belt 66 comes into contact with the stopper 124. The lowering position of the stopper 124 is a position where the circuit board 80 conveyed to the working position comes into contact with the stopper 124. Therefore, the circuit board 80 conveyed by the conveyor belt 66 comes into contact with the stopper 124 and is positioned at the working position. Then, when the circuit board 80 comes into contact with the stopper 124, the operation of the conveyor belt 66 is stopped, so that the circuit board 80 is stopped at the working position.

When the circuit board 80 stops at the working position, the stopper 124 rises. Subsequently, in the substrate transfer holding device 20, the elevating table 90 is raised, the circuit board 80 is lifted from the conveyor belt 66, and is clamped by the clamping device 93. Then, when the circuit board 80 is clamped by the clamp device 93, the camera 122 attached to the X slider 130 images the circuit board 80 clamped by the clamp device 93. Then, based on the image pickup data, the stop position of the circuit board 80 and the like are analyzed by the controller 180. After that, the Y slider 128 retracts from above the elevating table 72, and the elevating table 72 rises by driving the board elevating device 54. As a result, the circuit board 80 clamped by the clamping device 93 rises together with the conveyor device 50 and the board holding device 52, and comes into close contact with the lower surface of the mask 116.

However, since the thickness dimension of the circuit board 80 varies, there is a possibility that the circuit board 80 cannot be properly brought into close contact with the mask 116. Specifically, before the work is executed in the printing machine 10, the operator inputs the thickness dimension of the circuit board 80 to the printing machine 10. At this time, the operator does not measure the thickness dimension of the circuit board 80 and input the measured value, but inputs the numerical value specified according to the type, lot, and the like of the circuit board 80. Here, the thickness dimension specified according to the type, lot, and the like of the circuit board 80 is T0. Further, the height of the lower surface of the mask 116 fixed to the mask support base 110 by the mask fixing mechanism 112 is a value peculiar to the printing machine 10, and is set in advance in the control device 28 of the printing machine 10. Here, the height of the lower surface of the mask 116 preset in the control device 28 is set to _XM as shown in FIG.

Then, in the conventional method, in the printing machine 10, the upper surface of the backup block 91 supporting the circuit board 80 clamped by the clamping device 93 is located below the lower surface of the mask 116 by a distance corresponding to T0. The board elevating device 54 is operated. That is, as shown in FIG. 7, the board elevating device 54 is operated so that the upper surface of the backup block 91 that supports the circuit board 80 rises to the position of XM _−T0 . The electromagnetic motor 108 of the board elevating device 54 is a servomotor, and feedback control is performed based on the output value of the encoder. Therefore, by operating the board elevating device 54, the upper surface of the backup block 91 can be appropriately raised to the position of XM- _T0 . When the upper surface of the backup block 91 rises to the position of XM- _T0 and the actual thickness dimension of the circuit board 80 is T0, the upper surface of the circuit board 80 is the mask 116 as shown in FIG. Adheres to the underside of the.

However, since the thickness dimension of the circuit board 80 varies, the actual thickness dimension of the circuit board 80 may be thinner than T0. For example, when the actual thickness dimension of the circuit board 80 is 9 mm even though T0 is 10 mm, the upper surface of the backup block 91 rises to the position of XM _−T0 as shown in FIG. Even so, the upper surface of the circuit board 80 does not come into close contact with the lower surface of the mask 116. In such a case, a clearance of 1 mm remains between the upper surface of the circuit board 80 and the lower surface of the mask 116. Further, even when the actual thickness dimension of the circuit board 80 is 9.5 mm, the upper surface of the circuit board 80 does not come into close contact with the lower surface of the mask 116, and the upper surface of the circuit board 80 and the lower surface of the mask 116 are formed. In the meantime, a clearance of 0.5 mm remains. As described above, when the clearance between the upper surface of the circuit board 80 and the lower surface of the mask 116 changes depending on the actual thickness dimension of the circuit board, the transfer amount of the cream solder to the circuit board 80 and the thickness of the cream solder are constant. Instead, the print quality of the cream solder deteriorates.

Further, the actual thickness dimension of the circuit board 80 may be thicker than T0. In such a case, when the upper surface of the backup block 91 rises to the position of XM _−T0 , the upper surface of the circuit board 80 comes into close contact with the lower surface of the mask 116, but the mask 116 is lifted by the circuit board 80. Therefore, the mask 116 may be warped. That is, for example, when the actual thickness dimension of the circuit board 80 is 11 mm even though T0 is 10 mm, the mask 116 faces upward at the position where the mask 116 is in close contact with the circuit board 80. It may be along 1 mm. Even in such a case, the print quality of the cream solder is deteriorated.

Further, conventionally, the operator visually confirms the gap between the mask 116 and the circuit board 80 by pressing the mask by hand, etc., but the judgment varies from worker to operator depending on the skill level of the operator. It occurs and the print quality cannot be stabilized.

In view of this, in the printing machine 10, the actual thickness dimension of the circuit board 80 is calculated by using the stopper 124. Specifically, as shown in FIG. 9, the stopper 124 is a stepped block body in which a part of the lower end surface of the rectangular parallelepiped block body is cut out. The stopper 124 has a lower end surface 200 facing downward, a contact surface 202 extending upward from one side of the lower end surface 200, and a step extending in the left-right direction from the upper end of the contact surface 202 in the direction opposite to the lower end surface 200. It has a surface 204. The stopper 124 is fixed to the tip of the cylinder rod 125 of the cylinder so that the lower end surface 200 and the stepped surface 204 extend in the horizontal direction and the contact surface 202 extends in the vertical direction.

Then, before the circuit board 80 is carried into the printing machine 10 and conveyed to the working position, the X slider 130 moves upward between the pair of conveyor belts 66 by the drive of the camera moving device 120, and the X slider The cylinder 123 attached to the 130 extends. At this time, the stopper 124 is lowered to a position where the contact surface 202 of the stopper 124 fixed to the lower end of the cylinder rod 125 of the cylinder 123 is at the same height as the upper surface of the conveyor belt 66. That is, the stopper 124 is positioned at the lowermost position by extending the cylinder 123, and the lowermost position of the stopper 124 is a position where the contact surface 202 is at the same height as the upper surface of the conveyor belt 66. Is. By lowering the stopper 124 to the lowermost position in this way, the circuit board 80 conveyed by the conveyor belt 66 comes into contact with the contact surface 202 of the stopper 124. As a result, the circuit board 80 conveyed by the conveyor belt 66 is positioned at the working position by the contact surface 202 of the stopper 124.

Then, after the operation of the conveyor belt 66 is stopped, as shown in FIG. 10, the elevating table 90 is raised, the circuit board 80 is lifted from the conveyor belt 66, and is clamped by the clamping device 93. After the circuit board 80 is positioned by the stopper 124, the stopper 124 is raised in the conventional method, but here, the stopper 124 is not raised. That is, the circuit board 80 is lifted and clamped by the clamping device 93 while the stopper 124 is located at the lowermost end. Even if the circuit board 80 is lifted by the elevating table 90 during clamping, the upper surface of the circuit board 80 does not come into contact with the stepped surface 204 of the stopper 124. That is, the position of the lowermost end of the stopper 124 is a position where the upper surface of the circuit board 80 does not come into contact with the stepped surface 204 of the stopper 124 even if the circuit board 80 is lifted by the elevating table 90 at the time of clamping.

Then, when the circuit board 80 is clamped by the clamping device 93, the elevating table 72 is raised by the operation of the board elevating device 54. As a result, the circuit board 80 in the clamped state rises, and as shown in FIG. 11, the upper surface of the circuit board 80 comes into contact with the stepped surface 204 of the stopper 124. At this time, the stopper 124 is lifted by the circuit board 80. That is, the stopper 124 rises from the position of the lowermost end. As described above, the cylinder 123 to which the stopper 124 is attached has a built-in contact sensor 140, and when the cylinder 123 is extended, that is, when the stopper 124 is located at the lowermost end. Output the ON value. Therefore, when the upper surface of the circuit board 80 comes into contact with the stepped surface 204 of the stopper 124 and the stopper 124 rises from the position of the lowermost end, the value detected by the contact sensor 140 is switched from the ON value to the OFF value. Then, at the timing when the value detected by the contact sensor 140 is switched from the ON value to the OFF value, the operation of the board elevating device 54 is stopped. At this time, the height _XA of the upper surface of the backup block 91 is calculated based on the output value of the encoder of the electromagnetic motor 108 of the board elevating device 54.

When the circuit board 80 in the clamped state is raised and the upper surface of the circuit board 80 is brought into contact with the stepped surface 204 of the stopper 124, the thickness dimension of the circuit board 80 input by the operator (hereinafter, "" The ascending speed of the circuit board 80 is adjusted by using T0 (described as "input thickness dimension"). Specifically, the height of the stepped surface 204 when the stopper 124 is located at the lowermost end is preset in the control device 28. Here, the height of the stepped surface 204 preset in the control device 28 is referred to as _XD as shown in FIG. Then, a predetermined multiple of the input thickness dimension T0, for example, 1.5 times, is calculated from the height _XD of the stepped surface 204. That is, the position _1.5T0 lower than the height XD of the step surface 204 is calculated. Then, when the upper surface of the backup block 91 is raised to that position, the board elevating device 54 is operated at high speed. When raising the upper surface of the backup block 91 to the calculated position, that is, the height of (XD- _1.5T0 ), the actual thickness dimension of the circuit board 80 is slightly thicker than the input thickness dimension T0. However, the upper surface of the circuit board 80 does not come into contact with the stepped surface 204 of the stopper 124. Then, after raising the upper surface of the backup block 91 to a height of (XD- _1.5T0 ), the circuit board 80 is raised by operating the board elevating device 54 at a low speed to raise the upper surface of the circuit board 80. It is brought into contact with the step surface 204. That is, the circuit board 80 is raised at a high speed in a range where the upper surface of the circuit board 80 does not come into contact with the stepped surface 204, and the circuit board 80 is raised in a range where the upper surface of the circuit board 80 may come into contact with the stepped surface 204. Raise at low speed. As a result, the tact time is shortened by raising the circuit board 80 at a high speed, and by raising the circuit board 80 at a low speed, the backup block 91 when the upper surface of the circuit board 80 comes into contact with the stepped surface 204 The height _XA of the upper surface can be calculated appropriately.

Further, for example, as shown in FIG. 12, the upper surface of the backup block 91 is in contact with the stepped surface of the stopper 124 located at the lowermost end in a state where the circuit board 80 is not placed on the upper surface of the backup block 91. In this case, the height of the upper surface of the backup block 91 becomes the height _XD of the stepped surface 204 preset in the control device 28. That is, when the top surface height of the backup block 91 on which the circuit board 80 is not mounted is _XD and the top surface height of the backup block 91 on which the circuit board 80 is mounted is _{XA, XD} _. Is higher than XA by a distance corresponding to the actual thickness dimension (hereinafter referred to as "actual thickness dimension") _T1 of the circuit board 80. Therefore, in the actual thickness dimension T1, the height of the upper surface of the backup block 91 on which the circuit board 80 is not mounted is _XD , and the height of the upper surface of the backup block 91 on which the circuit board 80 is mounted is _XA . The value is subtracted (T1 = _XD _- XA). This is also clear from FIG.

Therefore, when the height X _A of the upper surface of the backup block 91 when the upper surface of the circuit board 80 comes into contact with the stepped surface 204 is calculated, the calculated height X _A and the height X A set in advance in the control device 28 are set in advance. The actual thickness dimension T1 is calculated based on the difference from the height _XD . Then, when the actual thickness dimension T1 is calculated, the upper surface of the backup block 91 that supports the circuit board 80 clamped by the clamp device 93 is located below the lower surface of the mask 116 by a distance corresponding to T1. , The board elevating device 54 is operated. That is, as shown in FIG. 13, the board _elevating device 54 is operated so that the upper surface of the backup block 91 that supports the circuit board 80 rises to the position of XM-T1. Then, when the upper surface of the backup block 91 rises to the position of _XM -T1, the upper surface of the circuit board 80 comes into close contact with the lower surface of the mask 116 as shown in FIG. At this time, since the operation of the board elevating device 54 is controlled based on the actual thickness dimension T1, the circuit board 80 is masked even when the actual thickness dimension T1 is different from the input thickness dimension T0. It is possible to properly adhere to the 116.

In this way, by calculating the actual thickness dimension T1 of the circuit board 80 using the stopper 124, the circuit board 80 can be appropriately brought into close contact with the mask 116. In particular, the stopper 124 used when calculating the actual thickness dimension T1 is for positioning the circuit board 80 to be conveyed at the working position as described above, and the actual thickness is obtained by using a conventional mechanism. The dimension T1 is calculated. As a result, the circuit board 80 can be appropriately brought into close contact with the mask 116 at no cost.

However, with the above method, it may not be possible to properly calculate the thickness dimension of the circuit board depending on the shape of the circuit board. For example, as shown in FIG. 14, there is a circuit board 220 having a stepped upper surface. The upper surface of the circuit board 220 is a first upper surface 222 located at the edge of the circuit board 220 and a second upper surface 224 located at the center of the circuit board 220 and projecting upward from the first upper surface 222. It is composed of and. In such a circuit board 220, the thickness dimension T1 of the circuit board 220 at the edge is calculated as the actual thickness dimension by the above method, but the actual thickness dimension of the circuit board 220 is the edge of the circuit board 220. It is a thickness dimension T2 near the center, not a portion. That is, in the above method, the thickness dimension T1 on the first upper surface 222 is calculated, but it is necessary to calculate the thickness dimension T2 on the second upper surface 224 as the actual thickness dimension of the circuit board 220. .. Therefore, in the circuit board 220 having such a shape, the actual thickness dimension T2 is calculated using the contact surface 202 instead of the step surface 204 of the stopper 124.

Specifically, when the circuit board 220 is clamped by the clamping device 93, the elevating table 72 is lowered by the operation of the board elevating device 54. As a result, the circuit board 220 in the clamped state is lowered. At this time, the board elevating device 54 operates so that the circuit board 220 descends to a height lower than the height of the lower end surface 200 of the stopper 124 located at the lowermost end. As described above, when the circuit board 220 is lowered to a height lower than the height of the lower end surface 200 of the stopper 124, the stopper 124 is moved above the second upper surface 224 of the circuit board 220 by the operation of the camera moving device 120. Then, the elevating table 72 is raised by the operation of the board elevating device 54. As a result, the circuit board 220 rises below the stopper 124, and as shown in FIG. 15, the second upper surface 224 of the circuit board 220 comes into contact with the lower end surface 200 of the stopper 124. At this time, the value detected by the contact sensor 140 is switched from the ON value to the OFF value at the timing when the stopper 124 is lifted by the circuit board 220 and rises from the position of the lowermost end. Then, at the timing when the value detected by the contact sensor 140 is switched from the ON value to the OFF value, the operation of the board elevating device 54 is stopped. At this time, the height X _B of the upper surface of the backup block 91 is calculated based on the output value of the encoder of the electromagnetic motor 108 of the board elevating device 54. Even when the circuit board 220 is raised to bring the upper surface of the circuit board 220 into contact with the lower end surface 200, when the circuit board 80 is raised to bring the upper surface of the circuit board 80 into contact with the stepped surface 204. Similarly, the ascending speed of the circuit board is adjusted by using the input thickness dimension T0.

Further, the height of the lower end surface 200 when the stopper 124 is located at the lowermost end is also preset in the control device 28. Here, the height of the lower end surface 200 preset in the control device 28 is _XX , as shown in FIG. Then, for example, as shown in FIG. 16, in a state where the circuit board 220 is not placed on the upper surface of the backup block 91, the upper surface of the backup block 91 is placed on the lower end surface 200 of the stopper 124 located at the lowermost end. When brought into contact, the height of the upper surface of the backup block 91 becomes the height _XX of the lower end surface 200 preset in the control device 28. That is, when the height of the upper surface of the backup block 91 on which the circuit board 220 is not mounted is _XX , and the height of the upper surface of the backup block ₉₁ on which the circuit board 220 is mounted is _XX . Is higher than _XB by a distance corresponding to the actual thickness dimension T2 of the circuit board 220. Therefore, the actual thickness dimension T2 is obtained by subtracting the top surface height X _B of the backup block 91 on which the circuit board 220 is mounted from the top surface height X _K of the backup block 91 on which the circuit board 220 is mounted. (T2 = _XK _- XB). This is also clear from FIG.

Therefore, when the height X _B of the upper surface of the backup block 91 when the second upper surface 224 of the circuit board 220 comes into contact with the lower end surface 200 is calculated, the calculated height X _B and the control device 28 are calculated. The actual thickness dimension T2 is calculated based on the difference from the height XX _preset in. Then, when the actual thickness dimension T2 is calculated, the upper surface of the backup block 91 that supports the circuit board 220 clamped by the clamp device 93 is located below the lower surface of the mask 116 by a distance corresponding to T2. , The board elevating device 54 is operated. That is, as shown in FIG. 17, the board _elevating device 54 is operated so that the upper surface of the backup block 91 that supports the circuit board 220 rises to the position of XM-T2. Then, when the upper surface of the backup block 91 rises to the position of _XM -T2, the second upper surface 224 of the circuit board 220 comes into close contact with the lower surface of the mask 116 as shown in FIG. As described above, even if the circuit board 220 has a stepped upper surface, it can be appropriately brought into close contact with the mask 116 by calculating the actual thickness dimension T2 using the lower end surface 200 of the stopper 124. ..

Further, when the actual thickness dimension T2 is calculated using the lower end surface 200 of the stopper 124, as described above, the central portion of the circuit board 220 comes into contact with the lower end surface 200 of the stopper 124, so that the lower end surface is formed. It is suppressed by 200. This makes it possible to correct the warp of the circuit board when the circuit board 220 is warped so that the central portion of the circuit board 220 is located above the edge portion. The calculation of the actual thickness dimension T2 using the lower end surface 200 of the stopper 124 is executed not only for the circuit board 220 having a stepped upper surface but also for circuit boards of various shapes. For example, in a circuit board in which a notch is formed at an edge portion, the stepped surface 204 of the stopper 124 may not be appropriately brought into contact with the edge portion. Therefore, the lower end surface 200 of the stopper 124 is used for the actual thickness. The dimension T2 is calculated.

A method of calculating the thickness of the circuit board 80 using the stepped surface 204 of the stopper 124 (hereinafter referred to as “first mode”) and the thickness of the circuit board 220 using the lower end surface 200 of the stopper 124. (Hereinafter referred to as "second mode") is selectively executed according to the user operation. Specifically, an input interface (see FIG. 5) 240 such as a keyboard and operation buttons is connected to the controller 180, and the operator can use either the first mode or the second mode according to the circuit board to be worked on. It is input to the input interface 240 whether to calculate the thickness of the circuit board according to. Then, the control device 28 calculates the thickness of the circuit board according to the method according to the input mode. That is, the control device 28 selectively executes either the first mode or the second mode input by the user operation. This makes it possible to calculate the thickness of the circuit board by a method according to the intention of the operator.

Further, in the printing machine 10, if the calculated actual thickness dimensions T1 and T2 are significantly different from the input thickness dimensions T0, an error screen is displayed on the display panel (not shown). Specifically, a predetermined allowable range including the input thickness dimension T0 is set. For example, when the input thickness dimension T0 is 10 mm, the allowable range is set to 5 mm to 15 mm. Then, if the calculated actual thickness dimensions T1 and T2 are within the permissible range, the operation of the board elevating device 54 is controlled based on the actual thickness dimensions T1 and T2 as described above, and the circuit board 80 is masked. It is brought into close contact with 116. On the other hand, when the calculated actual thickness dimensions T1 and T2 are out of the allowable range, an error screen is displayed on the display panel. As a result, it is possible to recognize overlapping transfer of boards, setting mistakes of the backup block 91, dimensional input mistakes by the operator, and the like.

That is, for example, one circuit board is usually conveyed by the conveyor device 50, but there are cases where two circuit boards are mistakenly conveyed by the conveyor device 50 in a stacked state. In such a case, the actual thickness dimensions T1 and T2 are calculated as a numerical value approximately twice the input thickness dimension T0, and the actual thickness dimensions T1 and T2 are out of the allowable range. Therefore, by displaying the error screen on the display panel, the operator can recognize the overlapping transfer of the boards.

Further, the backup block 91 is different depending on the circuit board to be worked on, and the operator may set a backup block different from the backup block 91 according to the circuit board to be worked on in the printing machine 10. In such a case, the top surface heights X _A and X _B of the backup block 91 used when calculating the actual thickness dimensions T1 and T2 cannot be calculated appropriately, and the actual thickness dimensions T1 and T2 are acceptable. It is out of range. Therefore, the operator can recognize the backup block setting error by displaying the error screen on the display panel.

Further, the input thickness dimension T0 is input by the operator as described above, but an erroneous numerical value may be input at the time of input. Further, the allowable range is set in a range including the input thickness dimension T0. Therefore, if the operator originally inputs 10 mm and then inputs 20 mm, the permissible range is set to 15 mm to 25 mm. On the other hand, the actual thickness dimensions T1 and T2 are calculated as numerical values of about 10 mm. In such a case, since the actual thickness dimensions T1 and T2 are out of the allowable range, the error screen is displayed on the display panel, so that the operator can recognize the input error of the input thickness dimension. ..

Further, in the printing machine 10, the calculated actual thickness dimensions T1 and T2 are stored in the control device 28 in association with the board ID of the circuit board. By storing the calculated actual thickness dimension T1 in association with the board ID of the circuit board in this way, it becomes possible to appropriately manage the traceability of the circuit board. In other words, for example, when a defective product occurs, it is possible to manage whether or not the thickness dimension of the board is related to the cause of the defective product, and to control the variation in the thickness dimension according to the lot of the circuit board. Can be managed.

Further, as shown in FIG. 5, the controller 180 has a clamp unit 230, a rising unit 232, a measuring unit 234, and a calculation unit 236. The clamp unit 230 is a functional unit for clamping the circuit board by operating the substrate holding device 52. The raising unit 232 is a functional unit for raising the clamped circuit board by operating the board elevating device 54. The measuring unit 234 is a functional unit for measuring the heights X _A and X _B of the backup block 91 when the raised circuit board comes into contact with the stopper 124. The calculation unit 236 has an actual thickness based on the difference between the calculated heights X _A and X _B of the backup block 91 and the heights X _D and X _K of the backup block 91 preset in the control device 28. It is a functional unit for calculating the dimensions T1 and T2.

The printing machine 10 is an example of a board-to-board working machine. The control device 28 is an example of an arithmetic unit. The conveyor device 50 is an example of a conveyor device. The board holding device 52 is an example of a clamping device. The board elevating device 54 is an example of an elevating device. The backup block 91 is an example of a support member. The stopper 124 is an example of a contact body. The lower end surface 200 is an example of the lower end surface. The step surface 204 is an example of a step surface. Further, the process executed by the clamp unit 230 is an example of the clamp process. The step executed by the ascending section 232 is an example of the ascending step. The process executed by the measuring unit 234 is an example of the measuring process. The process executed by the arithmetic unit 236 is an example of the arithmetic process.

Further, the present invention is not limited to the above embodiment, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the heights X _A and X _B of the upper surface of the backup block 91 are calculated by using the stopper 124, but even if a dedicated contact body for measuring the height is used. good.

Further, in the above embodiment, the control device 28 selectively executes either the first mode or the second mode input by the user operation, but the control device 28 is a mode corresponding to the circuit board. Is determined, and either the determined first mode or the determined second mode may be selectively executed. That is, for example, as information on the circuit board, information indicating whether or not the upper surface of the circuit board is a stepped surface and whether or not there is a notch at the edge of the circuit board is input to the controller 180. Therefore, the control device 28 determines in which mode, the first mode or the second mode, the thickness of the circuit board is calculated for the circuit board to be worked, based on the information. Then, the control device 28 selectively executes either the determined first mode or the second mode. This makes it possible to reduce the burden on the operator.

Further, in the above embodiment, the circuit board is supported by the backup block 91, but it may be supported by the backup pin. In such a case, the height of the upper end of the backup pin is calculated using the stopper 124.

Further, in the above embodiment, the heights X _A and X _B of the upper surface of the backup block 91 are measured based on the output value of the encoder of the electromagnetic motor 108 of the board elevating device 54, but are measured by a distance sensor or the like. May

Further, in the above embodiment, the thickness dimension of the circuit board is calculated in the printing machine 10, but various working machines that perform work on the circuit board, for example, a working machine that executes mounting work of parts, and a circuit board. The thickness dimension of the circuit board may be calculated in a working machine or the like for inspection.

10: Printing machine (anti-board work machine) 28: Control device (calculation device) 50: Conveyor device (conveyor device) 52: Board holding device (clamp device) 54: Board lifting device (lifting device) 124: Stopper (contact body) ) 200: Lower end surface 204: Step surface 230: Clamp part (clamp process) 232: Rise part (rise process) 234: Measurement unit (measurement process) 236: Calculation unit (calculation process)

Claims

A support member that supports the board from the bottom surface,
A clamping device that clamps the substrate in a state of being supported by the support member, and
An elevating device that raises and lowers the support member together with the clamp device,
A contact body that is positioned above the support member at a predetermined height and that the support member is raised by the elevating device to come into contact with the support member or a substrate supported by the support member.
Based on the difference between the height of the support member when the support member comes into contact with the contact body and the height of the support member when the substrate supported by the support member comes into contact with the contact body, the support member An arithmetic unit that calculates the thickness of the supported substrate,
With anti-board working machine.
Equipped with a transport device to transport the board
The contact body
The anti-board working machine according to claim 1, which functions as a stopper that abuts on the substrate conveyed to the conveying device to the clamping position of the substrate by the clamping device.
The contact body has a lower end surface and a stepped surface located above the lower end surface.
The arithmetic unit
Based on the difference between the height of the support member when the support member contacts the lower end surface of the contact body and the height of the support member when the substrate supported by the support member contacts the lower end surface of the contact body. The thickness of the substrate supported by the support member is calculated, the height of the support member when the support member comes into contact with the stepped surface of the contact body, and the substrate supported by the support member are described above. 1. The anti-board working machine according to claim 2.
The clamping process for clamping the substrate supported by the support member,
In the ascending step of raising the clamped substrate together with the supporting member in the clamping step,
A measurement step of measuring the height of the support member when the substrate raised in the ascending step comes into contact with a contact body positioned above the support member at a predetermined height.
Supported by the support member based on the difference between the height of the support member when the support member in a state of not supporting the substrate comes into contact with the contact body and the height of the support member measured in the measurement step. An arithmetic process that calculates the thickness of the board,
Operation method including.