WO2022230099A1 - Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression - Google Patents

Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression Download PDF

Info

Publication number
WO2022230099A1
WO2022230099A1 PCT/JP2021/016951 JP2021016951W WO2022230099A1 WO 2022230099 A1 WO2022230099 A1 WO 2022230099A1 JP 2021016951 W JP2021016951 W JP 2021016951W WO 2022230099 A1 WO2022230099 A1 WO 2022230099A1
Authority
WO
WIPO (PCT)
Prior art keywords
printing
coating material
unit
mask
weight
Prior art date
Application number
PCT/JP2021/016951
Other languages
English (en)
Japanese (ja)
Inventor
英一 玉木
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN202180096514.XA priority Critical patent/CN117098666A/zh
Priority to DE112021006428.2T priority patent/DE112021006428T5/de
Priority to JP2023516943A priority patent/JP7430293B2/ja
Priority to PCT/JP2021/016951 priority patent/WO2022230099A1/fr
Publication of WO2022230099A1 publication Critical patent/WO2022230099A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F31/00—Inking arrangements or devices
    • B41F31/02—Ducts, containers, supply or metering devices
    • B41F31/022—Ink level control devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/0009—Central control units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/02—Arrangements of indicating devices, e.g. counters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/02—Arrangements of indicating devices, e.g. counters
    • B41F33/025—Counters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B41F15/423—Driving means for reciprocating squeegees
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/16—Programming systems for automatic control of sequence of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F35/00—Cleaning arrangements or devices
    • B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
    • B41F35/005—Cleaning arrangements or devices for screen printers or parts thereof for flat screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/11—Registering devices
    • B41P2215/114—Registering devices with means for displacing the article
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Definitions

  • This invention relates to a printing technique in which a squeegee is slid against a mask to print a coating material on a mask onto a substrate through an opening provided in the mask, particularly consumption of the coating material consumed per substrate. It relates to technology for calculating quantity.
  • the coating material is printed on the board in a pattern corresponding to the openings provided in the mask.
  • Printing devices are known. In this printing apparatus, the coating material on the mask is gradually consumed as the printing is repeated. Therefore, in order to control the amount of coating material on the mask, it is desirable to accurately grasp the amount of coating material consumed per substrate and to replenish the appropriate amount of coating material at appropriate timing.
  • the photoelectric switch detects the width of the solder roll present on the mask. Based on the roll width detection result, the amount of solder consumption is estimated, and based on this, the solder replenishment timing is controlled.
  • the shape of the solder roll on the mask is cylindrical, and the volume of solder is calculated on the assumption that the shape is maintained.
  • the solder roll has a characteristic of being easily deformed in the width direction, and the solder roll may be deformed in the width direction more than expected when the roll width is detected by the photoelectric switch. As a result, the measurement error of the amount of solder consumed increases, making it difficult to accurately calculate the amount of solder consumed per board (corresponding to the "unit consumption amount" of the present invention).
  • the present invention has been made in view of the above problems, and provides a printing apparatus that prints a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask.
  • the purpose is to accurately calculate
  • a first aspect of the present invention is a printing apparatus for printing a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, the printing apparatus comprising: a coating material transfer unit that scoops up the coating material from the coating material and returns the scooped coating material onto the mask; a first weight measurement unit that is connected to the coating material transfer unit and measures the weight; Before executing the first printing for printing the coating material on the mask onto m substrates (m is a natural number equal to or greater than 1), the coating material transfer section that scoops up the coating material from the mask is subjected to a first weight measurement.
  • a pre-printing information acquisition unit that acquires pre-printing information indicating the weight of the coating material before the first printing based on the pre-printing measurement value obtained by measuring in the unit;
  • Post-printing information acquisition for acquiring post-printing information indicating the weight of the coating material after the first printing based on the post-printing measurement value obtained by measuring the coating material transfer section that scooped up the coating material by the first weight measurement section
  • a second aspect of the present invention provides a printing apparatus for printing a coating material on a mask onto a substrate through an opening provided in the mask by sliding a squeegee on the mask, wherein A coating material unit consumption amount calculation method for calculating a unit consumption amount of a coating material to be applied, wherein the first printing is performed to print the coating material on the mask on m substrates (m is a natural number of 1 or more) and a pre-printing measurement value obtained by measuring the coating material transfer unit by the first weight measurement unit after the coating material is scooped up from the mask by the coating material transfer unit before the first printing.
  • the coating material transfer section that has scooped up the coating material is measured by the first weight measurement section. Based on the pre-printing measurement value, pre-printing information indicating the weight of the coating material before the first printing is acquired. Post-printing information indicating the weight of the coating material after the first printing is similarly obtained after the first printing. The difference between the pre-printing information and the post-printing information corresponds to the amount of decrease in the coating material due to the first printing, that is, the consumption amount. Consumption is calculated accurately.
  • the measured value includes the weight of the scooped coating material and the weight of the coating material transfer section. Therefore, when determining the amount of decrease in the coating material in the first printing, the pre-printing measurement value and the post-printing measurement value may be used as the pre-printing information and the post-printing information, respectively, and the difference between the two may be used.
  • the first weight measuring section is connected to the coating material transfer section, the weight of the coating material transfer section is subtracted in advance, that is, the so-called zero point adjustment is performed, and then the coating material is scooped up. Alternatively, the coating material transfer portion may be measured.
  • the measured value by the first weight measuring unit is the weight of the scooped-up coating material itself, and similarly to the above, the pre-printing measurement value and the post-printing measurement value are used as the pre-printing information and the post-printing information, respectively. can be done.
  • the weight of the coating material transfer section is included in the measured value by the first weight measurement section.
  • the pre-printing weight of the coating material is obtained as pre-printing information.
  • the post-printing weight of the coating material may be obtained.
  • the coating material may remain and adhere to the coating material transfer section, and the amount of the remaining coating material may fluctuate. In this case, it is preferable to take into account the weight of the remaining adhering coating material. More specifically, for the pre-printing information acquisition section, before the first printing and before the coating material transfer section scoops up the coating material from the mask, the pre-printing information of the coating material adhering to the coating material transfer section is obtained. A pre-printing total value of the adhesion weight and the weight of the coating material on the mask may be acquired as the pre-printing information.
  • the post-printing information acquisition section calculates the post-printing adhesion weight of the coating material adhering to the coating material transfer section after the first printing and before the coating material transfer section scoops up the coating material from the mask. , and the weight of the coating material on the mask after printing may be obtained as the pre-printing information. By doing this, the weight of the coating material before and after the first printing can be obtained with high accuracy without being affected by the residual coating material, and the unit consumption of the coating material can be calculated more accurately. be able to.
  • the weight of the coating material transfer section may be subtracted from the pre-printing measurement value. Further, in order to obtain the post-printing total value, the weight of the coating material transfer section may be subtracted from the post-printing measurement value.
  • the difference between the pre-printing total value and the post-printing total value obtained in this way is the decrease amount. Unit consumption can be determined accurately.
  • a squeegee may be included in the solder attachment destination. If the weight of the solder adhering to the squeegee fluctuates before and after the first printing, the amount of fluctuation may affect the calculation of the unit consumption.
  • a second weight measurement unit connected to the squeegee and measuring the weight is further provided, and the pre-printing information acquisition unit performs the second weight measurement of the squeegee separated from the mask before executing the first printing.
  • the pre-printing information is added to the pre-printing information to correct the pre-printing information, and the post-printing information acquisition unit performs the second weight measurement of the squeegee separated from the mask after the first printing.
  • Post-printing information obtained by measuring the squeegee is added to the post-printing information to correct the post-printing information.
  • it is configured to calculate the unit consumption of material. With this, the weight of the solder adhering to the squeegee is taken into consideration, and as a result, it is possible to calculate the unit consumption with higher accuracy.
  • a third weight measurement section is further provided for measuring the total weight of the mask and the coating material adhering to the mask, and the pre-printing information acquisition section measures the total weight of the mask and the coating material adhering to the mask.
  • the mask pre-printing information measured by the third weight measuring section is added to the pre-printing information to correct the pre-printing information
  • the post-printing information acquisition section After executing one printing and after the coating material is scooped up from the mask by the coating material transfer unit, the post-printing information is obtained by adding the post-printing information of the mask measured by the third weighing unit to the post-printing information. It is desirable that the unit consumption amount calculation section calculates the unit consumption amount of the coating material based on the corrected pre-printing information and the corrected post-printing information. As a result, the weight of the solder remaining on the mask when the solder is scooped up from the mask is taken into account, and as a result, the unit consumption can be calculated with higher accuracy.
  • a storage unit for storing a threshold value of the total consumption amount of the coating material, a total consumption amount calculation unit for calculating the total consumption amount of the coating material based on the unit consumption amount and the number of printed substrates, and the consumption calculated by the total consumption amount calculation unit and a replenishment requesting unit for requesting replenishment of the coating material when the total amount exceeds a threshold value.
  • the coating material is replenished at an appropriate timing, the coating material can be smoothly printed on the substrate, and the operating rate of the printing apparatus can be increased.
  • the amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of substrates printed in the first printing and the second printing is used as replenishment information. desirable to add.
  • Such a replenishment request optimizes the amount of coating material on the mask after replenishment, resulting in high print quality.
  • the unit consumption of the coating material is accurately calculated. can do.
  • FIG. 1 is a schematic plan view showing the overall configuration of a printing apparatus according to a first embodiment of the present invention
  • FIG. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1
  • 3 is a block diagram showing an electrical configuration of the printing apparatus shown in FIGS. 1 and 2
  • FIG. 2 is a flowchart showing print processing executed in the printing apparatus shown in FIG. 1
  • FIG. 5 is a flowchart showing a unit consumption acquisition process executed in the printing process of FIG. 4
  • FIG. FIG. 10 is a diagram showing a unit consumption amount table that associates mask types of production masks with solder consumption amounts per sheet
  • FIG. 4 is a diagram showing the relationship between the number of printed sheets and the total consumption of solder in the first embodiment
  • FIG. 11 is a schematic diagram showing a solder scooping operation in the printing apparatus according to the fourth embodiment of the present invention
  • FIG. 14 is a flow chart showing a unit consumption acquisition process in the printing apparatus according to the fourth embodiment of the present invention
  • FIG. 12 is a diagram showing the relationship between the number of prints and the total consumption of solder in the fifth embodiment of the printing apparatus according to the present invention
  • FIG. 14 is a schematic diagram showing information acquisition operation in the printing apparatus according to the sixth embodiment of the present invention
  • FIG. 12 is a schematic diagram showing information acquisition operation in the eighth embodiment of the printing apparatus according to the present invention
  • FIG. 1 is a schematic plan view showing the overall configuration of the first embodiment of the printing apparatus according to the present invention.
  • FIG. 2 is a schematic cross-sectional view along line II-II of FIG.
  • FIG. 3 is a block diagram showing the electrical configuration of the printing apparatus shown in FIGS. 1 and 2.
  • the printing apparatus 1 transports the board B (see FIG. 2) in the X1 direction by a pair of conveyors 12, and prints solder (reference numerals S1 and S2 in FIG. 8) on the board B at the printing position.
  • the board B is a printed board on which components (electronic components) are mounted.
  • solder is a bonding material for bonding components onto the substrate B.
  • FIG. 1 is a schematic plan view showing the overall configuration of the first embodiment of the printing apparatus according to the present invention.
  • FIG. 2 is a schematic cross-sectional view along line II-II of FIG.
  • FIG. 3 is a block diagram showing the electrical configuration of the printing apparatus shown in FIGS. 1 and
  • the direction in which the substrate B is transported by the pair of conveyors 12 (belt conveyor) (X1 direction) and its opposite direction (X2 direction) are defined as the X direction, and the direction substantially perpendicular to the X direction in the horizontal plane is defined as the Y direction. direction.
  • a direction substantially orthogonal to the X direction and the Y direction is defined as the Z direction (vertical direction).
  • the printing apparatus 1 carries in the substrate B by the carry-in conveyor 1a, performs printing on the surface of the carried-in substrate B according to the printing pattern Pa formed on the mask M, and then prints the printed substrate B. It is configured to be carried out by the carry-out conveyor 1b.
  • the mask M used for printing to produce the board B as described above. Therefore, when the two are separately explained, the mask directly used for the production of the board B will be referred to as "production mask Mp", and the dedicated mask used for solder rolling will be referred to as "rolling mask Mr”. called.
  • mask M when explaining without distinguishing both, it is simply referred to as "mask M".
  • the production mask Mp has a rectangular flat plate shape in plan view (as seen from the Z1 direction side), as shown in FIG.
  • the production mask Mp has a plurality of openings P1 that form the printing pattern Pa, and non-openings P2 that are regions other than the plurality of openings P1.
  • a frame F is attached to the outer periphery of the production mask Mp. 1 to 3 show a state in which the production mask Mp is moved from the work position W for performing printing processing using the production mask Mp to a mask exchange unit 7, which will be described later.
  • the rolling mask Mr has a flat plate shape having the same plane size as the production mask Mp. However, the rolling mask Mr has no openings and is thicker than the production mask Mp, and as a result has a relatively high rigidity.
  • the printing apparatus 1 includes a base 2, a printing table unit 3, a camera unit 4, a mask clamping member 5, a squeegee unit 6, a mask exchange unit 7, detection sensors 81 and 82. and a control unit 9 (see FIG. 3).
  • the printing table unit 3 is provided on the base 2 and configured to hold the substrate B and align it with the production mask Mp.
  • the print table unit 3 includes an X-axis movement mechanism (not shown), a Y-axis movement mechanism (not shown), an R-axis movement mechanism (not shown), and a Z-axis movement mechanism (not shown). not shown), a printing table 11 and a pair of conveyors 12 (see FIG. 1).
  • the X-axis movement mechanism has an X-axis drive unit 13 (see FIG. 3) as a drive source, and moves the print table 11 in the X direction.
  • the Y-axis movement mechanism has a Y-axis drive unit 14 (see FIG. 3) as a drive source, and moves the printing table 11 in the Y direction.
  • the R-axis movement mechanism has an R-axis drive unit 15 (see FIG. 3) as a drive source, and rotates the print table 11 around a rotation axis extending in the Z direction.
  • the Z-axis movement mechanism has a Z-axis drive unit 16 (see FIG. 3) as a drive source, and moves the print table 11 in the Z direction.
  • the printing table 11 includes a table body 21, a pair of bracket members 22 provided on the table body 21, a support plate 23 on which a plurality of backup pins 23a are arranged, and a support plate drive for moving the support plate 23 in the Z direction. 24.
  • a conveyor 12 (see FIG. 1) is provided above each of the pair of bracket members 22 .
  • the backup pin 23a is configured to support the substrate B from below when the support plate 23 is moved in the Z1 direction (upward) by the support plate drive unit 24. As shown in FIG.
  • a pair of conveyors 12 are provided to extend along the X direction.
  • a pair of conveyors 12 are arranged parallel to each other with a predetermined distance in the Y direction.
  • the pair of conveyors 12 is configured so that the interval in the Y direction can be adjusted according to the width of the substrate B to be conveyed.
  • the pair of conveyors 12 are configured such that the Y-direction spacing (width) is adjusted by a substrate width axis driving portion 12a (see FIG. 3).
  • the camera unit 4 is configured to image the production mask Mp and the substrate B, as shown in FIGS.
  • the camera unit 4 has a camera X-axis movement mechanism 31, a camera Y-axis movement mechanism 32, and an imaging section 33 having a substrate camera 33a and a mask camera 33b.
  • the camera X-axis movement mechanism 31 has an X-axis motor 31a and a ball screw 31b extending in the X direction.
  • the camera Y-axis movement mechanism 32 has a Y-axis motor 32a and a ball screw 32b extending in the Y direction.
  • the substrate camera 33 a is configured to capture an image of the substrate B and recognize the relative position of the substrate B with respect to the printing table 11 .
  • the mask camera 33b is configured to capture an image of the mask M and recognize the position of the mask M. As shown in FIG.
  • the printing apparatus 1 After recognizing the relative position of the substrate B with respect to the production mask Mp using the substrate camera 33a and the mask camera 33b, the X-axis movement mechanism, the Y-axis movement mechanism, and the X-axis movement mechanism of the printing table unit 3 are detected.
  • the relative position (position and tilt in the horizontal plane) of the substrate B with respect to the production mask Mp is accurately positioned by the R-axis movement mechanism.
  • the substrate B is raised by the Z-axis movement mechanism of the printing table unit 3 in a state where the relative position of the substrate B with respect to the production mask Mp is accurately positioned, and is brought into contact with the lower surface of the production mask Mp. be done.
  • the rolling process is performed after confirming that the rolling mask Mr is positioned at the working position W using the mask camera 33b.
  • the mask clamping member 5 clamps the mask M when solder is printed on the substrate B according to the print pattern Pa using the production mask Mp or when the rolling process is performed using the rolling mask Mr. It is configured to be held in the working position W.
  • the mask clamp member 5 includes a first mask holding portion 41 that holds the end portion of the mask M on the X1 direction side, and a second mask holding portion 42 that holds the end portion of the mask M on the X2 direction side. , and a pressing portion (not shown) provided in the first mask holding portion 41 to press the mask M in the X2 direction.
  • the squeegee unit 6 is configured to reciprocate in the Y direction to scrape the solder supplied onto the upper surface of the mask M along the upper surface of the mask M.
  • the squeegee unit 6 includes a squeegee 51, a squeegee Y-axis drive unit 52 that moves the squeegee 51 in the printing direction (Y direction), and a squeegee Z-axis drive unit that moves the squeegee 51 in the vertical direction (Z direction). 53 (see FIG. 3) and a squeegee R-axis driving part 54 (see FIG. 3) that rotates the squeegee 51 around the rotation axis extending in the X direction.
  • the squeegee 51 is formed to extend in the X direction.
  • the squeegee 51 is configured to print the solder supplied to the production mask Mp while applying a predetermined printing pressure (load) to the mask M, and knead the solder supplied to the rolling mask Mr. .
  • the squeegee Y-axis drive unit 52 has a Y-axis motor 52a and a ball screw 52b extending in the Y direction.
  • the squeegee Z-axis drive unit 53 has a Z-axis motor, a belt, and a ball screw extending in the Z direction, although not shown in the drawings.
  • the squeegee unit 6, as shown in FIG. 2, includes a mask slider 55 that slides the mask M in the Y direction to perform an exchange operation for exchanging the mask M.
  • the squeegee unit 6 is provided with a single mask slider 55 .
  • the mask slider 55 has a sliding portion 55a that can move in the Z direction (vertical direction), and an accommodating portion 55b that accommodates the sliding portion 55a.
  • the mask slider 55 is composed of, for example, an air cylinder
  • the slide portion 55a is composed of an air cylinder rod
  • the accommodating portion 55b is composed of an air cylinder.
  • the mask slider 55 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction with the squeegee Y-axis drive unit 52 .
  • the mask slider 55 is moved in the Z2 direction (Z2 direction) so that the slide portion 55a protrudes from the accommodation portion 55b to a position where the slide portion 55a can contact the frame F of the mask M at the working position W in the horizontal direction (Y direction). down).
  • the sliding portion 55a is accommodated in the accommodating portion 55b in the Z1 direction (upward) to a position where the sliding portion 55a does not contact the frame F of the mask M at the working position W in the horizontal direction (Y direction). direction).
  • the squeegee 51 and the mask slider 55 are provided integrally with the squeegee unit 6 . Further, the squeegee 51 and the mask slider 55 are configured to move integrally in the Y direction as the squeegee unit 6 moves.
  • the slide portion 55a of the mask slider 55 contacts the frame F of the mask M from the Y1 direction or the Y2 direction to move the mask M in the Y1 direction or the Y2 direction.
  • the squeegee unit 6 includes a solder scooping unit 56 that scoops up the solder on the mask M.
  • the solder scooping unit 56 has a scooping portion 56a that scoops up and holds the solder on the mask M. As shown in FIG.
  • the scoop-up portion 56a moves between a lowered position for scooping up the solder on the mask M or lowering the scooped-up solder onto the mask M and a raised position for not scooping up the solder on the mask M. (vertical direction) is configured to be movable.
  • the solder scooping-up unit 56 is configured to move integrally in the Y direction by moving the squeegee 51 in the Y direction with the squeegee Y-axis drive unit 52 .
  • the solder scooping unit 56 scoops up the solder on the mask M to the scooping part 56a and holds it by being moved in the Y2 direction with the scooping part 56a arranged at the lowered position.
  • the solder scooping unit 56 is moved in the Y1 direction with the scooping part 56a disposed at the lowered position, thereby dropping the scooped solder onto the mask M from the scooping part 56a.
  • the scooping portion 56a corresponds to an example of the "coating material transfer portion" of the present invention.
  • a first weight measurement unit 56b (FIG. 3) configured by a load cell or the like is connected to the scooping unit 56a.
  • the first weight measuring part 56b measures the total weight of the weight Ws0 of the scooping part 56a alone and the weight of the solder.
  • the first weight measuring section 56b measures only the weight Ws0 of the scooping section 56a.
  • the weight Ws0 of the scooping portion 56a is measured by the first weight measuring portion 56b immediately after installation of a new product or immediately after replacement and repair, and is stored in the storage portion 92 of the control unit 9.
  • the mask exchange unit 7 is configured to accommodate a plurality (two) of masks M.
  • the mask exchange unit 7 includes a first storage section 61, a second storage section 62, and an elevating section 63 (FIG. 3).
  • the 1st storage part 61 and the 2nd storage part 62 are each comprised so that the mask M of 1 sheet can be accommodated.
  • the first storage portion 61 and the second storage portion 62 are arranged side by side in the vertical direction.
  • the first storage section 61 is an upper storage section arranged above the second storage section 62 .
  • the second storage section 62 is a lower storage section arranged below the first storage section 61 .
  • the lifting section 63 is configured to move the first storage section 61 and the second storage section 62 in the vertical direction.
  • an elevating section 63 is attached to the base 2 .
  • the second storage section 62 is attached to the lifting section 63 .
  • the first storage section 61 is attached to the second storage section 62 .
  • the first storage portion 61 and the second storage portion 62 have a lowered position for putting the production mask Mp in and out of the first storage portion 61 and an elevated position for taking in and out the rolling mask Mr from the second storage portion 62 . between and is configured to be movable in the Z direction (vertical direction).
  • the detection sensor 81 is configured to detect the production mask Mp straddling the mask clamp member 5 and the mask exchange unit 7, as shown in FIG.
  • the detection sensor 82 is configured to detect the rolling mask Mr straddling the mask clamping member 5 and the mask exchange unit 7, as shown in FIG. Specifically, when the production mask Mp is moved between the work position W and the first storage section 61, the detection sensor 81 provided in the first storage section 61 detects the mask clamp member 5 and the first storage section 61. 61, and is configured to detect the stopped production mask Mp. When the rolling mask Mr is moved between the working position W and the second storage portion 62, the detection sensor 82 provided in the second storage portion 62 straddles the mask clamp member 5 and the second storage portion 62.
  • the detection sensors 81 and 82 are, for example, transmissive sensors, and include a light projecting portion (not shown) that emits light and a light receiving portion (not shown) that receives the light emitted from the light projecting portion. have.
  • the cleaning unit 10 (FIG. 3) for cleaning the lower surface of the production mask Mp fixed at the working position W by the mask clamping member 5 is provided.
  • the cleaning unit 10 includes a cleaner (not shown) and a cleaner Y-axis movement mechanism 102 (FIG. 3).
  • the cleaner is arranged at a height where it can come into contact with the lower surface of the production mask Mp. It is provided so as to freely reciprocate between.
  • a cleaner Y-axis moving mechanism 102 is connected to this cleaner, and a cleaner Y-axis moving portion (not shown) of the cleaner Y-axis moving mechanism 102 operates according to a command from the drive control portion 93 of the control unit 9 . to move the cleaner in the Y direction.
  • the lower surface of the production mask Mp fixed at the working position W is moved by the cleaner Y-axis moving mechanism 102 while the cleaner is in contact with the lower surface of the production mask Mp, thereby cleaning the lower surface of the production mask Mp.
  • the control unit 9 has a main control section 91, a storage section 92, a drive control section 93, an IO control section 94, and a camera control section 95, as shown in FIG.
  • the main control unit 91 is configured by a computer including a CPU (Central Processing Unit).
  • the storage unit 92 includes a hard disk device and the like, and stores the weight Ws0 of the scooping unit 56a, various data tables including the unit consumption amount table, various data set by the operator, substrate data, machine data, printing programs, and the like. is doing.
  • the main control section 91 has a function of controlling each section of the printing apparatus 1 based on the printing program stored in the storage section 92 .
  • the board data includes information on the type of board B, information on the size of board B, information corresponding to the type of board B, information on rolling mask Mr used for rolling solder, and printing for each type of board B. It includes information such as the number of sheets.
  • the machine data includes Y-direction movement limit position information of the squeegee unit 6, X-direction and Y-direction movement limit position information of the camera unit 4, and Y-direction movement limit position information of the cleaner.
  • the main control section 91 is configured to control the squeegee unit 6 by means of the drive control section 93 .
  • the drive control unit 93 controls the driving of the squeegee Y-axis driving unit 52, the squeegee Z-axis driving unit 53, and the squeegee R-axis driving unit 54 to move the squeegee 51 in the Y and Z directions.
  • the squeegee 51 is rotated around the rotation axis extending in the X direction.
  • the main control section 91 is configured to control the printing table unit 3 by means of the drive control section 93 .
  • the main control unit 91 causes the drive control unit 93 to drive the X-axis driving unit 13, Y-axis driving unit 14, R-axis driving unit 15, and Z-axis driving unit 16, and and Z-direction, and rotates the substrate B around the rotation axis extending in the Z-direction.
  • the main control unit 91 drives the support plate driving unit 24 by the drive control unit 93 to move the support plate 23, thereby moving the backup pin 23a in the Z direction (vertical direction).
  • main control unit 91 causes the drive control unit 93 to drive the substrate width axis drive unit 12a to adjust the Y-direction spacing (width) between the pair of conveyors 12 . Further, the main control unit 91 causes the drive control unit 93 to drive the substrate transport shaft driving unit 17 to transport the substrate B in the X direction.
  • the main control section 91 is configured to control the camera unit 4 by means of the drive control section 93 . Specifically, the main control unit 91 causes the drive control unit 93 to drive the camera X-axis movement mechanism 31 and the camera Y-axis movement mechanism 32 to move the imaging unit 33 (substrate camera 33a and mask) in the X and Y directions. Move the camera 33b).
  • the main control section 91 is configured to control the cleaning unit 10 by means of the drive control section 93 . Specifically, the main control section 91 causes the drive control section 93 to drive the cleaner Y-axis driving section (not shown) of the cleaner Y-axis moving mechanism 102 to reciprocate the cleaner in the Y direction.
  • the main control section 91 is configured to control the camera unit 4 by the camera control section 95 . Specifically, the main control unit 91 controls the imaging operation of the substrate B by the substrate camera 33a through the camera control unit 95 . The main control section 91 controls the imaging operation of the mask M by the mask camera 33b by the camera control section 95 .
  • the main control section 91 is configured to control the squeegee unit 6 by means of the IO control section 94 .
  • the main controller 91 uses the IO controller 94 to control the upward/downward movement of the slide portion 55 a of the mask slider 55 .
  • the main control unit 91 also acquires information about the weight of the solder scooped up by the scooping unit 56a and the weight of the solder scooped up by the scooping unit 56a measured by the first weight measuring unit 56b via the IO control unit 94 .
  • the main control section 91 is configured to control the mask exchange unit 7 by means of the IO control section 94 . Specifically, the main control section 91 controls the elevating operation of the first storage section 61 and the second storage section 62 of the mask exchange unit 7 by the elevating section 63 by the IO control section 94 . Further, the main control unit 91 receives the detection signal of the detection sensor 81 when the production mask Mp stopped straddling the mask clamping member 5 and the first storage unit 61 is detected by the IO control unit 94 . is configured as The main control unit 91 receives the detection signal of the detection sensor 82 when the rolling mask Mr stopped while straddling the mask clamping member 5 and the second storage unit 62 is detected by the IO control unit 94 . It is configured.
  • the main control unit 91 is configured to control each unit of the apparatus, and as will be described later with reference to FIGS.
  • the pre-printing information and the post-printing information are acquired before and after the first printing performed on m sheets (m is a natural number of 1 or more and is specified by the operator).
  • the pre-printing information is pre-printing information indicating the weight W1 of the solder on the production mask Mp before the first printing.
  • the post-printing information is pre-printing information indicating the weight W2 of the solder on the production mask Mp after the first printing.
  • the main control section 91 functions as the "pre-printing information acquisition section" and the "post-printing information acquisition section" of the present invention.
  • the main control unit 91 calculates the total amount of solder consumption based on the total number of prints of the board B in the first printing and the second printing executed subsequent to the first printing, and the unit consumption amount Wu, and It has a function of requesting replenishment of solder when the total amount of consumption exceeds a threshold value Wth (see FIG. 7) stored in advance in the storage unit 92 .
  • the main control section 91 also functions as the "total consumption calculation section" and the "replenishment request section" of the present invention.
  • reference numerals 96 and 97 in FIG. 3 denote an input section and a display section, respectively.
  • the input unit 96 is composed of various switches, a touch panel, etc., and receives various input setting instructions such as the number of prints m for the first printing and the threshold value Wth set by the operator.
  • the display unit 97 is composed of a liquid crystal display device, a lamp, etc., and displays various information under the control of the main control unit 91 .
  • FIG. 4 is a flow chart showing print processing executed by the printing apparatus shown in FIG.
  • FIG. 5 is a flow chart showing a unit consumption acquisition process executed in the printing process of FIG.
  • FIG. 6 is a diagram showing an example of a unit consumption amount table that associates mask types of production masks with solder consumption amounts per sheet.
  • FIG. 7 is a diagram showing the relationship between the number of prints and the total consumption of solder.
  • the main control section 91 controls each section of the apparatus as follows according to the printing program stored in the storage section 92, and the printing of solder on the board B is repeated.
  • the main control unit 91 receives a print command, it acquires print conditions (step S1).
  • the printing conditions include information on the type of production mask Mp to be used, in addition to the type of substrate B and solder. Based on this mask type information, the main control section 91 determines whether or not the unit consumption Wu corresponding to the production mask Mp used for printing is recorded in the unit consumption table shown in FIG. 6 (step S2).
  • step S3 the processing for obtaining the unit consumption (step S3) is skipped and the process proceeds to step S4.
  • the main control section 91 controls each section of the apparatus as follows, thereby Calculation of the weights W1 and W2 of the solder before and after the first printing, and calculation of the unit consumption are performed in the procedure.
  • the solder is scooped up by the scooping unit 56 (step S31). More specifically, the main controller 91 moves the scooping unit 56 in the Y direction to position it above the edge region of the production mask Mp placed at the working position W where the solder is positioned. Then, the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y2 direction (the direction in which the solder S is scooped up) while the scooping section 56a is located at the lowered position. As a result, the solder S on the production mask Mp moves onto the scooping portion 56a of the solder scooping unit 56 and is held there. Thereafter, the main control section 91 raises the scooping section 56a of the solder scooping unit 56 holding the solder S to the raised position. In this way, all the solder on the production mask Mp is transferred to the scooping portion 56a.
  • the main control section 91 receives the measurement result of the load cell that constitutes the first weight measurement section 56b as the measurement value before the first printing (hereinafter referred to as "pre-printing measurement value").
  • This pre-printing measurement value is the sum of the weight Ws0 of the scooping portion 56a and the weight W1 of the solder. Therefore, the main control unit 91 reads the weight Ws0 from the storage unit 92 and subtracts the weight Ws0 from the pre-printing measurement value to calculate the weight W1 of the solder (step S32).
  • step S33 when the weight W1 of the roll-shaped solder existing on the production mask Mp is obtained before the first printing, the solder scooped up by the scooping unit 56 is unloaded onto the production mask Mp.
  • the main control section 91 lowers the scooping section 56a of the solder scooping unit 56 to the lowered position. Further, the main control section 91 moves the solder scooping unit 56 in the Y1 direction (the direction in which the solder S is unloaded) while the scooping section 56a is located at the lowered position. As a result, the solder on the scooping portion 56a of the solder scooping unit 56 is taken down onto the production mask Mp. Thereafter, the main control section 91 raises the scooping section 56a of the solder scooping unit 56 from which the solder has been unloaded to the raised position.
  • step S34 the main control unit 91 executes printing of the substrate B by the number of printed sheets m designated in advance by the operator via the input unit 96. That is, each time solder printing is performed on the substrate B using the production mask Mp (step S34a), the main control unit 91 increments the total number of prints by "1" and then specifies the total number of prints. It is determined whether or not the specified number of printed sheets m has been reached (step S34b). Printing is repeated while the total number of printed sheets does not reach the number of printed sheets m. In this way, during the first printing, the solder is consumed by the unit consumption Wu each time one substrate B is printed, as shown in FIG. 7, for example. Therefore, when printing is completed for the specified number of printed sheets m, the total amount of solder consumption Wm is (Wu ⁇ m), while the weight W2 of the solder on the production mask Mp is the weight W1 before printing. less than
  • the main control section 91 calculates the unit consumption Wu by executing the following steps S35 to S38. That is, when the total number of printed sheets reaches the specified number of printed sheets m, steps (steps S35 and S36) similar to steps S31 and S32 are executed to calculate the weight W2 of the solder after the first printing. That is, after the solder is scooped up by the scooping unit 56 (step S35), the main control section 91 converts the measurement result of the load cell constituting the first weight measuring section 56b to the measured value after the first printing (hereinafter referred to as (referred to as "measured value after printing").
  • this post-printing measurement value is the sum of the weight Ws0 of the scooping portion 56a and the weight W2 of the solder
  • the main control section 91 reads the weight Ws0 from the storage section 92 and uses it from the post-printing measurement value. By subtracting the weight Ws0, the weight W2 of the solder is calculated (step S36).
  • step S37 when the weight W2 of the rolled solder existing on the production mask Mp is obtained after the first printing, the solder scooped up by the scooping unit 56 is unloaded onto the production mask Mp.
  • step S38 the unit consumption Wu of solder consumed per board is calculated.
  • the main control unit 91 additionally records the unit consumption Wu in the unit consumption table shown in FIG. 6 while associating it with the product type of the production mask Mp, and updates the unit consumption table in the storage unit 92 (step S39). .
  • step S3 When the unit consumption acquisition process (step S3) is completed, as shown in FIG. 4, the production mask Mp is used to continue printing the (m+1)th and subsequent sheets.
  • step S2 when the unit consumption Wu has been recorded ("YES" in step S2), the first printing is skipped and the second printing is performed. Although the presence or absence of the first printing is thus different, the second printing (step S4) is always performed while monitoring the total amount of solder consumption based on the unit consumption amount Wu.
  • the total amount of solder consumption is calculated based on and compared with the threshold value Wth (step S4b).
  • Wth the threshold value Wth
  • the main control unit 91 determines that sufficient solder remains on the production mask Mp to print at least one substrate B, and repeats the second printing (step S4a).
  • the main control unit 91 when printing is resumed after solder supply is performed based on the instruction, the main control unit 91 does not perform the first printing after printing is resumed, and the unit consumption The second printing is repeatedly performed while monitoring the total amount of solder consumption based on the total consumption amount Wn recorded in the amount table. Then, for example, as shown in the figure, when p sheets are printed from the resumption of printing and the total amount of solder consumption Wp exceeds the threshold value Wth, the main control unit 91 calculates the solder replenishment amount (step S5). The operator is instructed to supply solder (step S6).
  • the solder weights W1 and W2 before and after the first printing are calculated as pre-printing information and post-printing information, respectively, and the difference between them is divided by the number of printed sheets m in the first printing.
  • a unit consumption Wu of solder is calculated. Therefore, it is possible to calculate the amount of solder consumed each time one substrate B is printed, that is, the unit consumption amount Wu, with higher accuracy than in the prior art.
  • the solder replenishment timing is obtained by calculating the total amount of solder consumption for each second printing and comparing it with the threshold value Wth. Therefore, solder can be replenished at appropriate timing. As a result, the solder can be smoothly printed on the substrate B, and the operating rate of the printing apparatus 1 can be increased.
  • an amount obtained by multiplying the unit consumption amount calculated by the unit consumption amount calculation unit by the total number of boards printed in the first printing and the second printing is used as replenishment information. It is desirable to notify the operator together with With such a replenishment request with replenishment information, the amount of solder on the production mask Mp after replenishment is optimized, and high print quality is obtained.
  • the production mask Mp corresponds to an example of the "mask” of the present invention.
  • solder corresponds to an example of the "coating material” of the present invention.
  • the weights W1 and W2 of the solder correspond to examples of the "weight of the coating material before printing” and the “weight of the coating material after printing”, respectively.
  • the measurement result of the load cell is used as it is as the pre-printing measurement value and the post-printing measurement value.
  • the measurement results of the load cells are the solder weights W1 and W2 as they are, and the pre-printing measurement value and the post-printing measurement value correspond to the "pre-printing information" and the "post-printing information", respectively.
  • the weight Ws1 and the weight Ws2 respectively correspond to examples of the "adherence weight before printing" and the "adherence weight after printing” in the present invention.
  • FIG. 9 is a flowchart showing a unit consumption amount acquisition process in the fourth embodiment of the printing apparatus according to the present invention.
  • the fourth embodiment will be described below with reference to FIGS. 8 and 9.
  • FIG. The fourth embodiment greatly differs from the first embodiment in that the weight of the solder is calculated including not only the solder on the production mask Mp but also the solder adhering to the scooping portion 56a. be.
  • Other configurations are basically the same as those of the first embodiment. The following description will focus on the points of difference, while the same components will be denoted by the same reference numerals, and the description thereof will be omitted.
  • the scooping up unit 56 scoops up the solder (step S31).
  • the main control section 91 receives the measurement result of the load cell constituting the first weight measurement section 56b as the pre-printing measurement value.
  • the solder Ss1 adheres to the scooping portion 56a immediately before the scooping. Therefore, the pre-printing measurement values measured by the first weight measuring portion 56b immediately after the solder is scooped up are the weight Ws0 of the scooped up portion 56a, the weight Ws1 of the residual solder Ss1, and the weight of the scooped up solder S1.
  • the total value with W1 (hereinafter referred to as "total value before printing") is WL1. Therefore, the main control unit 91 calculates the weight of the solder (W1+Ws1) by subtracting the weight Ws0 from the pre-printing measurement value (step S32A).
  • step S33 the solder (S1+Ss1) scooped up by the scooping unit 56 is unloaded onto the production mask Mp. However, part of the solder remains and adheres to the scooped-up portion 56a as shown in the column "immediately before scooping up" in FIG. may differ from
  • the main control unit 91 executes printing of the substrate B by the number m of printed sheets designated in advance by the operator (step S34), executing the first printing.
  • step S34 executing the first printing.
  • part of the solder S1' is used for printing, and the weight W2 of the solder S2 on the production mask Mp becomes smaller than the weight of the solder S1' before printing.
  • the weight Ws2 of the solder Ss2 remaining on the scooping portion 56a varies depending on the viscosity of the solder and the wettability of the solder to the scooping portion 56a.
  • the main control unit 91 scoops up the solder S2 on the production mask Mp with the scooping unit 56, as in step S35 of the first embodiment.
  • the solder held in the scooping portion 56a becomes the solder S2 and the residual adhered solder Ss2, as shown in the column "immediately after scooping up" in FIG. 8(b).
  • the main control section 91 receives the measurement result of the load cell constituting the first weight measurement section 56b as the post-printing measurement value.
  • the solder Ss2 adheres to the scooping portion 56a just before the scooping.
  • the pre-printing measurement values measured by the first weight measuring portion 56b immediately after the solder is scooped up are the weight Ws0 of the scooped up portion 56a, the weight Ws2 of the residual solder Ss2, and the weight of the scooped up solder S2.
  • the total value with W2 (hereinafter referred to as "post-printing total value") is WL2. Therefore, the main control unit 91 calculates the weight of the solder (W2+Ws2) by subtracting the weight Ws0 from the measured value after printing (step S36A).
  • the unit solder consumption Wu can be calculated more accurately without being affected by the residual solders Ss1 and Ss2.
  • the total amount of solder consumption Wm does not exceed the threshold value Wth when the first printing is performed.
  • the total consumption Wm may exceed the threshold value Wth. Therefore, after calculating the post-printing information (step S36), it is determined whether or not the total consumption amount Wm exceeds the threshold value Wth.
  • Step S5) and solder replenishment instruction (step S6) may be executed (fifth embodiment). According to the fifth embodiment, the solder is replenished at appropriate timing, the solder can be smoothly printed on the board B, and the operating rate of the printing apparatus 1 can be increased.
  • the unit consumption amount is obtained based on the pre-printing information and the post-printing information corresponding to the weight of the solder scooped up from the production mask Mp before and after the first printing
  • the fourth embodiment is obtained based on the pre-printing total value and the post-printing total value corresponding to the total value of the solder scooped up from the production mask Mp before and after the first printing and the solder adhering to the scooped-up portion 56a.
  • the squeegee 51 may be included in the attachment destination of the solder. Therefore, if the weight of the solder adhering to the squeegee 51 fluctuates before and after the first printing, the amount of fluctuation may affect the calculation of the unit consumption.
  • pre-squeegee printing information information ( hereinafter referred to as "pre-squeegee printing information") and information related to the weight of the solder S51' adhering to the squeegee 51 after the first printing (hereinafter referred to as "post-squeegee printing information"). Therefore, in the first to third embodiments, the unit consumption is based on the value corrected by adding the pre-squeegee printing information to the pre-printing information and the corrected value by adding the post-squeegee printing information to the post-printing information. You can ask for quantity.
  • the unit consumption may be obtained based on the difference between the corrected pre-printing information and the corrected post-printing information (sixth embodiment). Further, in the fourth embodiment, the unit consumption may be obtained based on the value corrected by adding the information before squeegee printing to the total value before printing and the value corrected by adding the information after squeegee printing to the total value after printing. Good (seventh embodiment). In this way, by further considering the information before squeegee printing and the information after squeegee printing, it is possible to calculate the unit consumption with higher accuracy.
  • the solder remaining on the production mask Mp (for example, symbols Smp and Smp' in FIG. 12) is also taken into account and corrected to obtain the unit consumption amount. is preferred.
  • a third weight measurement unit 57 configured by a load cell or the like capable of measuring the weight of the production mask Mp and the solder adhering to the production mask Mp
  • pre-mask printing information Information related to the weight of the solder Smp remaining on the production mask Mp in the raising operation
  • Information related to weight (hereinafter referred to as "information after mask printing") can be obtained.
  • a value corrected by further adding pre-mask printing information (corresponding to the "corrected pre-printing information” of the present invention) and a value after mask printing
  • the unit consumption amount may be obtained based on the difference from the corrected value (corresponding to the "corrected post-printing information” of the present invention) that is corrected by further adding information (eighth embodiment).
  • values corrected by further adding mask pre-printing information corresponding to "corrected pre-printing information” of the present invention
  • corrected by further adding mask post-printing information may be obtained based on the calculated value (corresponding to the "corrected post-printing information" of the present invention) (ninth embodiment). In this manner, the unit consumption amount can be calculated with higher accuracy by further considering the information before mask printing and the information after mask printing.
  • the present invention is applied to a printing apparatus that uses solder as the "coating material" of the present invention.
  • the present invention can be applied.
  • the present invention can be applied to general printing techniques in which a coating material on a mask is printed onto a substrate through openings provided in the mask by sliding a squeegee on the mask.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Dans la présente invention, avant une première impression pour exécuter l'impression d'un matériau de revêtement sur m feuilles (m étant un entier naturel supérieur ou égal à 1) d'un substrat en utilisant un matériau de revêtement sur un masque, une partie de transfert de matériau de revêtement qui a récupéré le matériau de revêtement depuis le haut du masque est mesurée par une première unité de mesure de poids. Des informations de pré-impression exprimant le poids du matériau de revêtement avant la première impression sont acquises sur la base d'une valeur de mesure de pré-impression. Après la première impression également, des informations de post-impression exprimant un poids post-première impression du matériau de revêtement sont acquises de la même manière. La différence entre les informations de pré-impression et les informations de post-impression correspond à une quantité de réduction du matériau de revêtement due à la première impression, plus spécifiquement, la différence correspond à une quantité de consommation, et la quantité de consommation unitaire du matériau de revêtement peut être calculée avec précision en divisant la quantité de consommation par le nombre de feuilles imprimées m du substrat dans la première impression.
PCT/JP2021/016951 2021-04-28 2021-04-28 Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression WO2022230099A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202180096514.XA CN117098666A (zh) 2021-04-28 2021-04-28 印刷装置及印刷装置中的单位消耗量计算方法
DE112021006428.2T DE112021006428T5 (de) 2021-04-28 2021-04-28 Druckvorrichtung und Verfahren zum Berechnen eines Einheitsverbrauchs in der Druckvorrichtung
JP2023516943A JP7430293B2 (ja) 2021-04-28 2021-04-28 印刷装置および印刷装置における単位消費量算出方法
PCT/JP2021/016951 WO2022230099A1 (fr) 2021-04-28 2021-04-28 Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/016951 WO2022230099A1 (fr) 2021-04-28 2021-04-28 Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression

Publications (1)

Publication Number Publication Date
WO2022230099A1 true WO2022230099A1 (fr) 2022-11-03

Family

ID=83848036

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/016951 WO2022230099A1 (fr) 2021-04-28 2021-04-28 Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression

Country Status (4)

Country Link
JP (1) JP7430293B2 (fr)
CN (1) CN117098666A (fr)
DE (1) DE112021006428T5 (fr)
WO (1) WO2022230099A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09138156A (ja) * 1995-11-16 1997-05-27 Sony Corp 半田印刷量測定方法及び装置
US5649479A (en) * 1994-10-13 1997-07-22 M & R Printing Equipment, Inc. Ink recovery device
JPH11179879A (ja) * 1997-12-24 1999-07-06 Matsushita Electric Ind Co Ltd 定量半田印刷機
JP2011189673A (ja) * 2010-03-16 2011-09-29 Panasonic Corp スクリーン印刷機及びスクリーン印刷機におけるマスクのテンション計測方法
WO2014091546A1 (fr) * 2012-12-10 2014-06-19 富士機械製造株式会社 Machine d'impression de soudure
JP2020116824A (ja) * 2019-01-24 2020-08-06 ヤマハ発動機株式会社 印刷装置および印刷方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4921907B2 (ja) 2006-09-25 2012-04-25 富士機械製造株式会社 スクリーン印刷方法およびスクリーン印刷システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5649479A (en) * 1994-10-13 1997-07-22 M & R Printing Equipment, Inc. Ink recovery device
JPH09138156A (ja) * 1995-11-16 1997-05-27 Sony Corp 半田印刷量測定方法及び装置
JPH11179879A (ja) * 1997-12-24 1999-07-06 Matsushita Electric Ind Co Ltd 定量半田印刷機
JP2011189673A (ja) * 2010-03-16 2011-09-29 Panasonic Corp スクリーン印刷機及びスクリーン印刷機におけるマスクのテンション計測方法
WO2014091546A1 (fr) * 2012-12-10 2014-06-19 富士機械製造株式会社 Machine d'impression de soudure
JP2020116824A (ja) * 2019-01-24 2020-08-06 ヤマハ発動機株式会社 印刷装置および印刷方法

Also Published As

Publication number Publication date
JPWO2022230099A1 (fr) 2022-11-03
JP7430293B2 (ja) 2024-02-09
DE112021006428T5 (de) 2023-09-28
CN117098666A (zh) 2023-11-21

Similar Documents

Publication Publication Date Title
US8230785B2 (en) Method and apparatus for applying an accurate print pressure during production
JP5635879B2 (ja) 付着材料塗布装置
US8230784B2 (en) Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production
US20090255426A1 (en) Method and apparatus for placing substrate support components
CN104249547A (zh) 位置检测装置、基板制造装置、位置检测方法及基板的制造方法
CN112105504B (zh) 印刷装置
JP6934955B2 (ja) スクリーン印刷機
WO2022230099A1 (fr) Dispositif d'impression, et procédé de calcul de quantité de consommation unitaire dans un dispositif d'impression
JP7144523B2 (ja) 実装ライン
JP4907478B2 (ja) 部品取付方法
JP2008041712A (ja) 電子部品実装方法及び装置
JP3343284B2 (ja) スクリーン印刷機
JP5350686B2 (ja) スクリーン印刷装置
EP3680105B1 (fr) Machine de sérigraphie
JP2012196824A (ja) スクリーン印刷機およびスクリーン印刷方法
WO2022054191A1 (fr) Machine d'usinage de substrat
JP2024032468A (ja) 基板生産システム
JP2008140859A (ja) 電子部品装着装置
CN105082732A (zh) 焊料印刷机

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21939260

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2023516943

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 112021006428

Country of ref document: DE

WWE Wipo information: entry into national phase

Ref document number: 202180096514.X

Country of ref document: CN

122 Ep: pct application non-entry in european phase

Ref document number: 21939260

Country of ref document: EP

Kind code of ref document: A1