JP2024037231A - Support device and adjustment method - Google Patents

Abstract

To provide a technology for easily and precisely adjusting a flatness of a mask support surface by a mask support body.SOLUTION: A support device is arranged in a chamber and supports a mask for film deposition. The support device has: a plate shaped first member connected to the chamber; a second member that is supported by the first member and has a mask support surface for supporting a mask; an adjustment tool that is inserted between the first member and the second member and adjusts a height of the mask support surface; and a control part for determining an insertion position of the adjustment tool and an adjustment amount of height adjusted by the adjustment tool inserted. The control part obtains a displacement magnitude measured at multiple positions of the second member, calculates a flatness of the second member based on the displacement magnitude, and determines an insertion position and an adjustment amount of the adjustment tool such that the flatness meets a predetermined standard.SELECTED DRAWING: Figure 4

Description

The present invention relates to a support device and an adjustment method.

In Patent Document 1, film formation is performed by depositing a film forming material discharged from a film forming source onto a substrate supported by a substrate support through a mask supported by a mask support. In the film forming apparatus described above, if the mask is distorted, the degree of adhesion between the substrate and the mask decreases, leading to product defects.

As substrates have become larger in recent years, mask supports have also become larger, and machining requires a great deal of time and cost in order to ensure flatness. Therefore, Patent Document 1 provides a method for adjusting the flatness of a mask support that can easily ensure the flatness of the mask support surface even if the mask support is large.

Japanese Patent Application Publication No. 2018-003144

However, Patent Document 1 does not describe the measurement of flatness or the calculation of the height adjustment amount for each position according to the flatness, and it is necessary to adjust the mask support surface multiple times to the desired accuracy. There is a problem that adjustment is required and the time required for flatness adjustment is prolonged.

The present invention has been made in view of the above problems, and an object thereof is to provide a technique for accurately and easily adjusting the flatness of a mask support surface by a mask support.

The present invention employs the following configuration. That is,
A support device disposed in a chamber and supporting a mask for film formation,
a plate-shaped first member connected to the chamber;
a second member supported by the first member and having a mask support surface that supports the mask;
an adjustment tool inserted between the first member and the second member to adjust the height of the mask support surface;
a control unit that determines an insertion position of the adjusting tool and an amount of height adjustment by the inserted adjusting tool;
has
The control unit acquires the amount of displacement measured at a plurality of positions of the second member, calculates the flatness of the second member based on the amount of displacement, and controls the flatness so that the flatness satisfies a predetermined standard. The support device is characterized in that it determines the insertion position and adjustment amount of the adjustment tool.

The present invention also employs the following configuration. That is,
A method for adjusting a support device disposed in a chamber and supporting a mask for film formation, the method comprising:
The support device includes a plate-shaped first member connected to the chamber, a second member supported by the first member and having a mask support surface that supports the mask, and the first member and the second member. an adjustment tool that is inserted between members and adjusts the height of the mask support surface; a control section that determines the insertion position of the adjustment tool and the amount of height adjustment by the inserted adjustment tool; has
a step in which the control unit obtains displacement amounts measured at a plurality of positions of the second member, and calculates flatness of the second member based on the displacement amounts;
a step in which the control unit determines the insertion position and adjustment amount of the adjustment tool so that the flatness satisfies a predetermined standard;
This is an adjustment method characterized by having the following.

According to the present invention, it is possible to provide a technique for accurately and easily adjusting the flatness of a mask support surface by a mask support.

Schematic diagram of part of electronic device manufacturing equipment Schematic cross-sectional view of the inside of the film deposition apparatus when film deposition is performed Schematic cross-sectional view of the inside of the film deposition equipment when alignment is performed Exploded perspective view of mask support Explanatory diagram for supplying and discharging masks Explanatory diagram of flatness measurement jig Explanatory diagram of the installation position of the scale and flatness measurement jig Explanatory diagram of installing a flatness measurement tool across sides Explanatory diagram of the correction coefficient curve for height adjustment amount

Embodiments of the present invention will be described in detail below. However, the following embodiments merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, in the following description, the scope of the present invention is limited to the hardware configuration, software configuration, processing flow, manufacturing conditions, dimensions, materials, shape, etc. of the device, unless otherwise specified. It's not the purpose.

The present invention is suitable for a film forming apparatus that forms a thin film of a film forming material on the surface of a film forming object such as a substrate by sputtering or vapor deposition. In particular, it is suitable for a support that supports a planar member such as a mask used for film formation. More specifically, it is suitable for accurately flattening a mask support surface in a mask support used in a film forming apparatus that forms a film while rotating a mask. The present invention can be understood as a mask support, a mask support device, a mask support method, a method for adjusting a mask support device, and the like. Note that the present invention can be applied to any device that requires flattening of a support surface that supports a planar member, and the planar member is not limited to a mask, but may be a substrate or the like. Therefore, the present invention can also be understood simply as a support body, a support device, a support method, and an adjustment method.

The present invention can also be understood as a film forming apparatus, a method for adjusting the film forming apparatus, an electronic device manufacturing apparatus, and a method for adjusting the same. The present invention can also be understood as a program that causes a computer to execute an adjustment method, and a storage medium that stores the program. A storage medium may be a non-transitory computer readable storage medium.

The present invention can be preferably applied to a film forming apparatus that forms a thin film with a desired pattern on the surface of a substrate to be processed. Any material such as glass, resin, metal, silicon, etc. can be used as the material for the substrate. As the film-forming material, any material such as an organic material or an inorganic material (metal, metal oxide) can be used. The substrate may include one or more depositions already performed on the surface of the substrate material. The technique of the present invention is typically applied to manufacturing equipment for electronic devices and optical members. In particular, it is suitable for organic electronic devices such as organic EL displays including organic EL elements and organic EL display devices using the same. The present invention can also be used in thin film solar cells and organic CMOS image sensors.

[Example]
(overall structure)
FIG. 1 is a top view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus shown in FIG. 1 is used, for example, to manufacture a display panel of an organic EL display device for a smartphone. An electronic device manufacturing apparatus generally includes a plurality of film forming chambers 111 and 112 and a transfer chamber 110. A transport robot 119 that holds and transports the substrate 7 is provided in the transport chamber 110. The transport robot 119 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to a multi-jointed arm, and carries the substrate 7 into and out of each film forming chamber. Each of the film forming chambers 111 and 112 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus). A series of film forming processes such as transferring the substrate 7 to and from the transfer robot 119, adjusting the relative position of the substrate 7 and the mask (alignment), fixing the substrate 7 on the mask, and forming a film (evaporation) are carried out by the film forming apparatus. It is done automatically.

FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 100 disposed in the film forming chamber. In the following description, an XYZ orthogonal coordinate system is used in which the vertical direction is the Z direction and the directions orthogonal to the Z direction and mutually orthogonal are the XY directions. During film formation, the substrate and mask are fixed in a state parallel to a horizontal plane (XY plane). The lateral direction (direction parallel to the short side) of the substrate is the X direction, and the longitudinal direction (direction parallel to the long side) is the Y direction. Further, the rotation angle around the Z axis is expressed as θ.

In FIG. 2 , a film forming apparatus 100 includes a vacuum chamber 9 . The vacuum tank 9 is a vacuum chamber, and the inside thereof is maintained in a reduced pressure atmosphere such as a vacuum or an inert gas atmosphere such as nitrogen gas. Inside the vacuum chamber 9, a substrate support 8 that supports the substrate 7, a mask support 2 that supports the mask 1 for film formation, and a film formation source 6 (evaporation source) are arranged. Here, the film forming source 6 below the chamber emits the film forming material upward and the film forming material is deposited on the substrate 7 via the mask 1, but the direction in which the film forming material is released is not limited to this.

The film-forming source 6 has a structure in which a nozzle 6b is provided on a film-forming source main body 6a. The film-forming source body 6a includes a crucible (film-forming source container) in which a film-forming material is stored, a heater, a shutter, a film-forming rate monitor, and the like. When the heater heats the film forming material in the film forming source container, the film forming material is ejected from the nozzle 6b. As the film forming material, a desired material depending on the type of film to be formed can be used, such as a metal material for forming a metal film or an organic material for forming an organic film.

The film deposition apparatus 100 includes a control section 170. The control unit 170 controls the loading and unloading of the substrate 7 and the mask 1 into the vacuum chamber 9, the alignment of the substrate 7 and the mask 1, and the deposition source 6 for controlling the film thickness according to the measurement value of the deposition rate monitor. Controls a series of processes such as alignment and film formation. The control unit 170 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the functions of the control unit 170 are realized by a processor executing a program stored in memory or storage. Note that when a manufacturing line includes a plurality of film forming apparatuses, the control section 170 may be provided for each film forming apparatus, or one control section 170 may control the plurality of film forming apparatuses.

The substrate support 8 receives the substrate 7 carried in by the transfer robot 119 from outside the vacuum chamber 9, and moves it to a predetermined position. Then, fine positional adjustment (alignment) between the substrate 7 and the mask 1 is performed by moving the substrate 7 within the plane with the mask 1 and the substrate facing each other.

FIG. 3 shows the state of the vacuum chamber 9 when the substrate support 8 receives the substrate 7. Here, the alignment mechanism 20 disposed on the top surface of the vacuum chamber 9 is a mechanism including a base support section 21, an alignment base 22, and a base drive section 23. The alignment base 22 is fixed to the top surface of the vacuum chamber 9 by the base support part 21. The base drive section 23 adjusts the substrate position in the XY plane and in the Z direction via the connection section 10 and the substrate support 8. That is, the base drive unit 23 is a drive mechanism that includes an in-plane movement mechanism that moves the substrate 7 in the XY direction and a Z movement mechanism that moves the substrate 7 up and down in the Z direction.

In FIG. 3, the substrate 7 received from the transfer robot 119 is supported by the substrate support 8. As shown in FIG. The alignment mechanism 20 moves the substrate 7 in the Z direction to face the mask 1, and then moves the substrate 7 in the plane so that the substrate mark and the mask mark have a predetermined positional relationship in an image captured by a camera (not shown). let When the alignment is completed, the substrate 7 is lowered and placed on the mask 1. Thereafter, the substrate support 8 and the connecting portion 10 are evacuated to a position where the rotation of the mask 1 is not hindered. This results in a state as shown in FIG.

(Structure of mask support)
The mask support 2 has a first member 3, a second member 4 provided on the first member 3, and a height adjuster 5 provided between the first member 3 and the second member 4. be. The first member 3 is a plate-shaped member that supports the second member 4. The second member 4 is a plate-shaped member having a mask support surface that supports the mask 1. Here, at least one of the first member 3 and the second member 4 is composed of a plurality of members. Further, the height of the surface (mask support surface) of the second member 4 is adjusted by the height adjuster 5. The mask support body 2 may be considered to be a support device that supports a mask for film formation. Further, the mask support body 2 and the control unit 170 may be considered to be a support device together.

It should be noted that the mask 1 can also be carried into and out of the vacuum chamber 9 in the same way as the substrate 7, and the mask can be replaced under the control of the control unit 170 after the film formation process is completed on a predetermined number of substrates 7. be exposed. When supplying the mask 1 into the vacuum chamber, the mask 1 carried in using a carrying robot may be carried using a mask carrying section 108 connected to the connection section 10, which will be described later.

A rotating shaft support portion 15 is fixed to the top surface of the vacuum chamber 9. The rotating shaft support section 15 is connected to the rotating shaft 12 and the rotating shaft driving section 16 . The rotating shaft 12 is a shaft-shaped member, and is connected to the rotating shaft support portion 15 in a rotatable manner about a rotation center line N. The rotating shaft drive unit 16 is a drive mechanism including a motor and the like, and rotates the rotating shaft 12. A connecting member 11 is connected to the tip of the rotating shaft 12 . The connecting member 11 includes a rotating shaft connecting part 11a having a surface in the XY direction and connected to the rotating shaft 12, and a mask connecting part 11b having a plurality of shafts in the Z direction connected to the mask support 2.

The first member 3 of the mask support 2 is suspended from the top surface of the vacuum chamber 9 via a rotating shaft 12 and a connecting member 11 . Further, the second member 4 of the mask support 2 is supported by the first member 3 and also supports the mask 1. With such a configuration, when the rotating shaft 12 rotates, the mask support 2 also rotates. As a result, the mask 1 and the substrate 7 placed thereon also rotate. By performing film formation while rotating the mask 1 using such a rotary film forming apparatus, it becomes possible to uniformly form a film on the substrate 7. Note that the method of fixing the first member 3 is not limited to hanging, but it may be connected to the vacuum chamber 9 in a rotatable manner. For example, the mask support 2 may be installed on a rotating shaft protruding from the lower surface of the chamber.

In this manner, in the film forming apparatus 100 of this embodiment, film forming is performed while rotating the mask support 2. Therefore, it is necessary to create a structure in which each member of the mask support 2 and each member of the connecting member 11 does not interfere with other members during rotation. Specifically, the rotation shaft connecting portion 11a of the connecting member 11 is connected to only one pair of opposite sides among two pairs of opposite sides included in the four sides of the first member 3 of the mask support 2. . Hereinafter, the side to which the rotating shaft connecting portion 11a is connected will also be referred to as a connecting side, and the side to which the rotating shaft connecting portion 11a is not connected will also be referred to as a non-connecting side. Furthermore, in order to avoid interference with other members, the rotating shaft connecting portion 11a is arranged only at the center of the connecting side, as shown in FIG. As a result, both ends of the first member 3 have a cantilever structure.

That is, as shown in FIG. 3, the first member 3 includes a both-end support region 3f in which both ends are supported, and a cantilever region 3g in which only one end is supported. The both end support regions 3f are structurally stable and deform to a small degree even when the weight of the mask 1 and the substrate 7 is applied thereto. However, the cantilever region 3g having one free end is relatively easy to deform. When the first member 3 is deformed, the second member 4 disposed thereon is also likely to be deformed, leading to a decrease in the flatness of the mask support surface that supports the mask 1. In this embodiment, a substantially rectangular mask support 2 was used, but even if a mask support 2 having a shape other than a rectangle is used, the connection member 11 should be adjusted as long as the mask is rotated to avoid interference. Due to placement constraints, a cantilevered structure may occur.

The inventor studied the problems with the mask support 2 having a cantilevered structure as described above. For example, in Patent Document 1, both ends of the first member 3 of the mask support are suspended and supported from the top surface, so the stability of the first member 3 is high overall. Therefore, when the height adjuster 5 having a height h is inserted between the first member 3 and the second member 4, the mask support surface of the second member 4 rises by the height h. On the other hand, in this embodiment, the first member 3 of the mask support has a cantilever region 3g. In such a configuration, when the height adjuster 5 having a height h is inserted between the cantilever region 3g and the second member 4, the force is divided into a force pushing up the second member 4 and a force pushing down the cantilever region 3g. Because of this, the amount of rise of the mask support surface becomes less than the height h. Therefore, in this embodiment, it is necessary to make adjustments that take the cantilever structure into consideration.

FIG. 4 shows an exploded perspective view of the mask support 2 of this example. The lower first member 3 was a rectangular frame-shaped (frame-shaped) molded body. Note that a manufacturing method may be used in which each shaft of the mask connecting portion 11b is assembled to the first member 3, or the first member 3 and the mask connecting portion 11b may be formed as an integral molded body. The upper second member 4 is composed of a plurality of members (partial members 4a to 4d). When a plurality of partial members are combined to form the second member 4, the second member as a whole has a rectangular frame shape (frame shape) that is one size smaller than the first member 3. The mask 1 of this embodiment has a structure in which mask foil is stretched over a frame, and each partial member of the second member 4 supports each side of the mask frame.

When the upper second member 4 is composed of a plurality of members as in this embodiment, the height of each of the plurality of members can be adjusted using the height adjuster 5. As the height adjuster 5, a thin plate-shaped shim is used in this embodiment. That is, the heights of the plurality of members of the second member 4 can be adjusted by using the presence or absence of shims and the difference in thickness. In this embodiment, a plurality of height adjusters 5 can be applied to each of the partial members 4a to 4d. Thereby, the height can be adjusted for each position within each partial member. Note that when adjusting the thickness of the shims for each position, the number of shims of the same thickness may be changed, or the thickness of the shims themselves may be changed.

As a result, the mask 1 can be supported on the surfaces of the plurality of members whose heights are individually finely adjusted, so that the mask 1 can be supported on a flat surface without distortion.

The second member 4 of this embodiment is composed of a plurality of plate-shaped partial members for each side. The second member 4 of this embodiment includes partial members 4a and 4c corresponding to two opposing long sides, and partial members 4b and 4d corresponding to two opposing short sides.

As described above, the first member 3 is suspended in the vacuum chamber 9 via a connecting member, and the height can be adjusted by superimposing the second member 4 on the first member 3. The height is adjusted using tool 5. This height adjustment is typically performed during initial work when installing the film forming apparatus, periodic maintenance work, and troubleshooting work.

As shown in FIG. 4, notches 201 are provided in partial members 4a and 4c corresponding to the long sides of the second member 4. As shown in FIG. This notch portion 201 is arranged so as to avoid interference with the mask carrying portion 108 when the mask 1 is supplied onto and discharged from the second member 4 . That is, as shown in FIG. 5(b), the mask carrying section 108 includes a mask receiving surface 108a that receives the mask 1, and a receiving surface connecting section 108b that connects the mask receiving surface 108a and the connecting section 10. When the mask carrying section 108 receives the mask 1 carried into the vacuum chamber 9 on the mask receiving surface 108a, a driving force in the Z direction is supplied via the receiving surface connecting section 108b and the connecting section 10, and the mask 1 is transferred to the second Place it on member 4. FIG. 5A shows this state, where the mask receiving surface 108a moves downward while entering the notch 201, so that the mask 1 supported by the mask receiving surface 108a (indicated by a dotted line in the figure) is delivered to the second member 4. However, the mask supply means is not limited to this, and for example, a transport mechanism that moves on rails using rollers may be used. In that case, the cutout portion 201 is not necessarily required.

In this embodiment, the second member 4 is composed of a plurality of partial members. However, the present invention is not limited thereto, and the first member 3 may be composed of a plurality of partial members, or both the first member 3 and the second member 4 may be composed of a plurality of partial members. good. At least one of the first member 3 and the second member 4 is composed of a plurality of members, and the mask 1 is supported on the surface of the second member 4 whose height is adjusted by the height adjuster 5. Bye.

(Flatness measurement jig)
With reference to FIG. 6, a method of measuring the planar state of the surface of the second member 4 using the flatness measuring jig 106 in this embodiment will be described. The flatness measuring jig 106 is a jig having a structure in which a level 101 is sandwiched between a measuring plate 102 and a fixing plate 103, and the measuring plate 102 and the fixing plate 103 are connected by a fixing column 104. Lower members 105 are provided at two locations on the left and right sides of the lower portion of the measurement plate 102. In this embodiment, a digital level is used as the level 101.

A concave shape 107 is formed by the lower surface 102a of the measurement plate 102 and the side surfaces 105a of each of the two lower members 105. The lower surface 102a and the two side surfaces 105a together form a measurement surface. When using the flatness measuring tool 106, the measurement is performed while the measuring surface is in contact with the surface of the second member 4. The distance between the side surfaces 105a of the lower member 105 is set to a measurement interval that matches the arrangement of the height adjuster 5, and is set to 140 mm in this embodiment.

(Flatness measurement method)
The planar state of the second member 4 is confirmed by recording the values of a level 101 attached to the flatness measuring jig 106 at preset measurement intervals. In FIG. 7, a plurality of planned installation positions 109 are planned positions where the flatness measuring jig 106 is to be installed, and in this embodiment, they are provided every 140 mm. First, the scale 125 is installed on the surface of the second member 4. Markings 125a are written on the scale 125 at each measurement interval as a mark for the installation of the flatness measuring tool 106.

Next, the zero point of the level 101 assembled to the flatness measuring jig 106 is checked. As shown in FIG. 7, among the plurality of planned installation positions 109 on the partial member 4a corresponding to the long side of the second member 4, the partial member 4b corresponding to the short side of the second member 4 is located near the partial member 4b. The flatness measuring tool 106 is installed at the planned installation position 109a on the side. At this time, using the markings 125a of the scale 125 facilitates installation. Then, the value of the level gauge 101 is recorded.

Next, the surface of the second member 4 is moved so that the flatness measuring tool 106 approaches the partial member 4d corresponding to another short side of the second member 4. At this time, by using the markings 125a of the scale 125, it is possible to easily move the scale 125 by the measurement interval. The entire partial member 4a can be measured by sequentially moving the flatness measuring tool 106 along the markings.

Furthermore, the flatness of the partial members 4b to 4d is similarly measured. In this example, measurements are made at a total of 36 locations: 11 locations on the partial member 4a, 7 locations on the partial member 4b, 11 locations on the partial member 4c, and 7 locations on the partial member 4d.

It is preferable to measure the flatness of each side of the second member 4 twice for each location in order to reduce measurement errors. As a result of measuring twice, if there is a difference of 0.05 mm or more between the first and second measurement values, remeasure only the areas where there was an error. As a result of redoing the measurement, record the numerical value for which the measurement error is within 0.05 mm. For example, if the first measurement value is 0.50 mm and the second measurement value is 0.64 mm at a certain planned installation position 109, the measurement is redone. If the third measurement value is 0.64 mm, the second and third measurement values are used. On the other hand, if the third measurement value is 0.48 mm, the first and third measurement values are used.

When all sides of the second member 4 have been measured, the measured planar state is evaluated as flatness using spreadsheet software that automatically calculates flatness. The flatness evaluation is executed by the control unit 170 or another computer. The flatness in this embodiment is a value indicating the flatness of the support surface of the mask 1, which is determined for the entire second member 4. Further, the amount of adjustment refers to the degree of height adjustment required to make the support surface of the mask 1 have a desired flatness, and is indicated by the position and height at which adjustment by the height adjuster 5 is required. In this example, the calculation formula described in the flatness adjustment method is preset in the spreadsheet software, and by inputting the measured value into the measurement value input field, the flatness and adjustment amount can be automatically calculated. It can be calculated. For flatness, when all measured values for each side of the second member 4 are input, the flatness will be displayed in the flatness display field, and if the value displayed in the flatness display field has the desired accuracy, adjustment is possible. It will be completed. If the desired accuracy is not achieved, perform the following flatness adjustment. In this way, the control unit 170 determines the insertion position of the adjustment tool and the amount of height adjustment by the inserted adjustment tool.

(Flatness adjustment method)
In this embodiment, the flatness is calculated based on the planar state of the partial members 4a and 4c corresponding to the two long sides of the second member 4 and the partial members 4b and 4d corresponding to the two short sides of the second member 4. Then, determine whether adjustment is possible. When adjustment is necessary, the necessary number of height adjusters 5 are prepared based on the value displayed in the adjustment amount display field, and the height adjusters 5 are sandwiched between the first member 3 and the second member 4 to perform the adjustment.

In calculating the adjustment amount of the height adjuster 5, first, calculation of the flatness of the second member 4 will be explained. In the flatness calculation, the amount of displacement for each measurement position is calculated based on the values measured on the surface of each of the partial members 4a to 4d of the second member 4 using the flatness measuring tool 106. In this example, it is assumed that two measurement values are obtained for each location as described above. In the following explanation, the amount of displacement D indicates the amount of displacement at a certain measurement point, and the amount of displacement at the first point is D ₁ and the amount of displacement at the nth point is D _n . Furthermore, the first measurement value at the first location is M ₁₁ , the second measurement value is M ₁₂ , the first measurement value at the n-th location is M _n1 , and the second measurement value is M _n2 . Further, the measurement interval is assumed to be G (mm).

At this time, the displacement amount _D1 at the first location is calculated using the following equation (1).
D ₁ =(M ₁₁ +M ₁₂ )÷2×G...(1)
Further, the displacement amount D _n at the n-th location is calculated using the following equation (2).
D _n =(M _n1 +M _n2 )÷2×G+D _n-1 …(2)
By accumulating the amount of displacement for each measurement location, it is possible to obtain a value representing the amount of displacement on the entire plane.

Here, the second member 4 is composed of a plurality of plate-shaped members for each side. Therefore, it is necessary to take into account the connection of the sides when calculating the amount of displacement. Therefore, in this embodiment, as shown in FIG. 8, the planned installation position 109c is provided in such a way as to straddle the adjacent partial members 4a and 4b of the second member 4. Thereby, the long side and the short side can be connected and measured using the flatness measuring tool 106. Similarly, planned installation positions 109d, 109e, and 109f are provided at the joints of the sides. Thereby, the flatness of the entire second member 4 made up of a plurality of members can be measured.

Next, a plane is calculated using the least squares method from the displacement amount at each measurement position and the measurement position (hereinafter referred to as a least squares plane). Then, when the least squares plane is used as a reference plane, the maximum value and minimum value of the displacement amount are obtained, and the difference between the maximum value and the minimum value is calculated as the flatness. If the flatness meets a predetermined standard, the mask support surface is sufficiently flat; however, if the flatness does not meet the standard, height adjustment is required.

(Calculation of adjustment amount)
Next, calculation of the adjustment amount of the height adjuster 5 will be explained. In order to adjust the surface of the second member 4 from a state where the height adjuster 5 is not inserted between the first member 3 and the second member 4 to a state where the flatness of the second member 4 has a desired precision, it is necessary to It is necessary to insert the height adjuster 5 into a location where the amount of displacement is small and is low, based on a location where the amount of displacement is large and is high. Therefore, the difference between the amount of displacement at the insertion position and the maximum value of the measured data is calculated as the amount of adjustment by the height adjuster 5. Note that the amount of adjustment may be such that the flatness satisfies the standard.

If both ends of the mask support 2 do not have a cantilevered structure, the flatness of the second member 4 can be adjusted to a desired accuracy using only the adjustment amount determined from the difference between the maximum value and the minimum value of the measurement data. However, when both ends of the mask support 2 have a cantilever structure, when the height adjuster 5 is sandwiched between the first member 3 and the second member 4, not only the second member 4 but also the first member 3 It deforms it. In other words, when the height adjuster 5 is sandwiched in the cantilever region 3g, the surface of the second member 4 lifts upward and at the same time the surface of the first member 3 falls downward, so that the mask support surface is not lifted to the desired position. do not have. Therefore, in the case of a mask having a cantilever structure, the flatness of the second member 4 cannot be adjusted to the desired accuracy only by the adjustment amount determined from the difference from the maximum value of the measurement data.

In view of the above, in this embodiment, as shown in FIG. 9, a correction coefficient is calculated from the rigidity value of the first member 3 and the rigidity value of the second member 4 for each position where the height adjuster 5 is inserted. Then, a height adjuster 5 having a thickness equal to the adjustment amount multiplied by a correction coefficient is prepared. The rigidity value described here is the force required to deform the member at the position where the height adjuster 5 is inserted, and the unit is, for example, (N/m). Note that when the shape of the same member is changed (for example, when the notch 201 is provided in the middle), the calculated rigidity value differs depending on the position where the height adjuster 5 is inserted.

In this example, the rigidity values of the first member 3 and the second member 4 were calculated by simulation. Specifically, a simulation was performed in which only members appeared with restraint points at locations where they were fixed with supports or bolts. Apply a load to the position where the height adjuster 5 is inserted, express the reaction force when the height adjuster 5 is pinched, and calculate the ratio between the applied load and the displacement of the member at the point of application of the load. Based on this, the stiffness value was calculated. More preferably, a simulation is performed that includes the first member 3 and the second member 4, and includes structures such as supports that contribute to deformation. Note that the stiffness value may be determined experimentally instead of by simulation. Furthermore, if there is a predetermined value specific to the device, such as a value published by the manufacturer, that may be used.

The correction coefficient is calculated by the following formula (3), where A is the stiffness value of the first member 3, and B is the stiffness value of the second member 4.
Correction coefficient = (A+B)÷B...(3)

In this embodiment, since the mask support 2 has a cantilevered structure and the second member 4 has the notch 201 on the long side, the rigidity of the second member 4 on the distal side of the notch 201 increases. The value goes down. Therefore, a correction coefficient curve as shown in FIG. 9 is obtained. For example, in the height adjuster 5a on the distal end side near the notch 201, the stiffness values between the first member 3 and the second member 4 are approximately equal, so the correction coefficient approaches 2 (in this embodiment 2.1). Although the predetermined correction coefficients are shown here as a graph, they may be shown numerically for each position of the height adjuster 5.

Next, based on the correction coefficient curve, a height adjuster 5 having a thickness obtained by multiplying the value displayed in the adjustment amount display column by the correction coefficient is prepared. Adjustment is performed by inserting the prepared height adjuster 5 between the first member 3 and the second member 4. When the adjustment is completed, the flatness of the second member 4 is checked again using the flatness measuring jig 106, and if the desired accuracy is achieved, the adjustment is completed.

As explained above, according to the present invention, in the mask support 2 that supports the mask 1 using the first member 3 and the second member 4, the flatness of the mask support surface can be easily measured, and a desired flatness can be obtained. It is possible to calculate the amount of height adjustment at each position to achieve the desired height. Furthermore, by configuring at least one of the first member 3 and the second member 4 with a plurality of members, each member constituting the first member 3 or the second member 4 can be , it can be made large enough to be used in small-scale processing equipment that is widely available. Therefore, it is possible to shorten working time and reduce costs in flattening. In addition, by making fine adjustments using the height adjuster 5, even if the first member 3 and the second member 4 are overlapped and there is a slightly uneven part, the surface of the second member 4 (mask support surface ) can be flattened with high precision. In particular, in the present invention, even when the mask support has a cantilevered structure as in a rotary film forming apparatus, accurate planarization is possible by correcting the height adjustment amount.

1: Mask, 2: Mask support, 3: First member, 4: Second member, 5: Height adjuster, 9: Vacuum chamber, 170: Control unit

Claims (9)

A support device disposed in a chamber and supporting a mask for film formation,
a plate-shaped first member connected to the chamber;
a second member supported by the first member and having a mask support surface that supports the mask;
an adjustment tool inserted between the first member and the second member to adjust the height of the mask support surface;
a control unit that determines an insertion position of the adjustment tool and an amount of height adjustment by the inserted adjustment tool;
has
The control unit acquires the amount of displacement measured at a plurality of positions of the second member, calculates the flatness of the second member based on the amount of displacement, and controls the flatness so that the flatness satisfies a predetermined standard. The support device is characterized in that the insertion position and adjustment amount of the adjustment tool are determined. The control unit determines the adjustment amount based on the difference between the displacement amount at the insertion position and the maximum value of the displacement amounts measured at a plurality of positions, and The support device according to claim 1, wherein the adjustment amount is corrected based on a stiffness value of the second member. 3. The control unit corrects the adjustment amount based on a correction coefficient predetermined for each position based on stiffness values of the first member and the second member. Support device. The support device according to claim 2 or 3, wherein the first member has a cantilever region supported in a cantilever structure. 5. The support device is connected to the chamber by a rotating shaft, and in the chamber, the film is formed on the substrate through the mask while the support device rotates. support device. 4. The support device according to claim 2, wherein the second member is provided with a notch. Claims 1 to 3, wherein the displacement amount acquired by the control unit is a displacement amount measured while moving a plurality of positions on the surface of the second member using a jig and a tool equipped with a spirit level. The support device according to any one of the above. The support device according to any one of claims 1 to 3, wherein at least one of the first member and the second member is composed of a plurality of partial members. A method for adjusting a support device disposed in a chamber and supporting a mask for film formation, the method comprising:
The support device includes a plate-shaped first member connected to the chamber, a second member supported by the first member and having a mask support surface that supports the mask, and the first member and the second member. an adjustment tool that is inserted between members and adjusts the height of the mask support surface; a control section that determines the insertion position of the adjustment tool and the amount of height adjustment by the inserted adjustment tool; has
a step in which the control unit obtains displacement amounts measured at a plurality of positions of the second member, and calculates flatness of the second member based on the displacement amounts;
a step in which the control unit determines the insertion position and adjustment amount of the adjustment tool so that the flatness satisfies a predetermined standard;
An adjustment method characterized by having the following.

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