JP6439138B2 - Electronic component mounting system - Google Patents

Description

  The present invention relates to an electronic component mounting system that is configured by connecting a plurality of electronic component mounting apparatuses and that mounts electronic components on a substrate to manufacture a mounting substrate.

  In the mounting field, an electronic component mounting apparatus that takes out an electronic component with a suction nozzle and lowers the suction nozzle with respect to a substrate to mount the electronic component is widely used. In recent years, due to demands for quality assurance of mounting boards manufactured by such electronic component mounting apparatuses, it is required to ensure traceability that enables retrospective tracking of the production history of individual mounting boards. For example, if a defect is found after the manufacturing process of a mounting board or after shipment, it is required to identify the board on which the defect has been found or the electronic components mounted on the board so that the cause can be investigated. .

  In order to respond to such a request, a method of storing predetermined work data executed in the manufacturing process of the mounting board has been proposed (see, for example, Patent Documents 1 and 2). In the example shown in Patent Document 1, history data of mounting work executed in an electronic component mounting apparatus (work machine) is created and stored. According to this, by reading the history data when a defect is found, the cause can be investigated and appropriate measures can be taken. In the example shown in Patent Document 2, work data in which an approximate curved surface representing the appearance of a substrate generated based on the three-dimensional data of the substrate and ID information of the substrate are associated with each other is stored. According to this, when a failure occurs in a board over time, the approximate curved surface data of the board is acquired based on the ID information of the board, and the warping state of the board in the mounting process is grasped from the approximate curved surface data and effective. Measures can be taken.

JP 2000-124692 A JP 2009-260101 A

  However, in the work data created in the prior art including Patent Documents 1 and 2, it is difficult to find out the cause of a problem such as damage to an electronic component mounted on a substrate or a displacement of the mounting position. In recent years, with the diversification of products in which mounting substrates are incorporated, mounting substrates in which electronic components are mounted on a substrate with a curved mounting surface, or so-called three-dimensional mounting in which multiple electronic components are stacked and mounted at the same mounting point There are an increasing number of cases where a mounting board having a special aspect such as a mounting board manufactured by mounting is manufactured. With respect to such a mounting substrate, it has been more difficult to investigate the cause of the above-described problems.

  Accordingly, an object of the present invention is to provide an electronic component mounting system capable of easily investigating the cause of a failure of a mounting board on which electronic components are mounted.

  An electronic component mounting system according to the present invention is an electronic component mounting system configured by connecting a plurality of mounting devices, and manufacturing a mounting substrate by mounting the electronic component on a substrate, and is movable up and down with respect to the substrate. An electronic component mounting apparatus having a mounting head for mounting the electronic component on the substrate by lowering the suction nozzle holding the electronic component, and a mounting point where the electronic component is mounted on the substrate; A mounting history data creation unit that creates mounting history data in which unit mounting history corresponding to the operation information of the mounting head when mounting an electronic component at a mounting point is arranged in chronological order, and the mounting history data is mounted A storage unit that stores the information in association with the substrate, and the operation information of the mounting head includes the suction nozzle when the electronic component is mounted on the substrate by lowering the suction nozzle. It includes information about the lowered height position.

  According to the present invention, it is possible to easily investigate the cause of a failure of a mounting board on which electronic components are mounted.

1 is an overall configuration diagram of an electronic component mounting system according to an embodiment of the present invention. The top view of the board in one embodiment of the present invention The top view of the electronic component mounting apparatus which comprises the electronic component mounting system in one embodiment of this invention The partial perspective view of the electronic component mounting apparatus which comprises the electronic component mounting system in one embodiment of this invention (A) Functional explanatory diagram of the height sensor provided in the electronic component mounting apparatus constituting the electronic component mounting system in one embodiment of the present invention (b) set on the substrate in one embodiment of the present invention Illustration of sampling station The block diagram which shows the structure of the control system of the electronic component mounting system in one embodiment of this invention (A) Explanatory drawing about descent | fall height correction | amendment of the suction nozzle with which the electronic component mounting apparatus which comprises the electronic component mounting system in one embodiment of this invention was equipped. (B) On the board | substrate in one embodiment of this invention Illustration of sampling stations and mounting points set in Explanatory drawing about the descent | fall height of the suction nozzle with which the electronic component mounting apparatus which comprises the electronic component mounting system in one embodiment of this invention was equipped Explanatory drawing of the mounting history data in one embodiment of the present invention Explanatory drawing of mounting head operation data included in mounting history data in an embodiment of the present invention The flowchart of the electronic component mounting method in one embodiment of this invention Flowchart of execution history data registration processing in an embodiment of the present invention Structure explanatory drawing of the board | substrate with which the electronic component was mounted by three-dimensional mounting in one embodiment of this invention Explanatory drawing of the modification of the mounting head operation | movement data contained in the mounting history data in one embodiment of this invention

  First, an electronic component mounting system according to an embodiment of the present invention will be described with reference to FIG. The electronic component mounting system 1 has a function of manufacturing a mounting substrate by mounting electronic components on a substrate, and connects the mounting line 3 and the management unit 4 via a communication network 2 such as a LAN (Local Area Network). Configured. Hereinafter, the substrate transport direction is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the direction perpendicular to the XY plane is defined as the Z direction.

  The mounting line 3 is configured by connecting a plurality of mounting apparatuses that perform various operations for mounting electronic components on a substrate in the X direction. In the present embodiment, the mounting apparatus includes a printing apparatus M1, a printing state inspection apparatus M2, and a plurality of electronic component mounting apparatuses M3, M4, and M5. The printing apparatus M1 prints a solder paste on the electrodes on the board. The printing state inspection device M2 inspects the printing state of the solder paste printed on the board. The electronic component mounting apparatuses M3 to M5 mount electronic components on a board on which a solder paste is printed. The management unit 4 manages the mounting line 3 by collecting various information sequentially transmitted from these mounting apparatuses and storing work data necessary for the mounting apparatus.

  In FIG. 2, a plurality of mounting points R (R1 to R5) are set on the mounting surface 5a (upper surface) of the substrate 5. An electronic component 6 is mounted on each mounting point R. On one side of the substrate 5, a barcode label 7 on which a substrate ID (substrate identification information) that is individual identification information of the substrate 5 is recorded is provided. In addition, a recognition mark 8 for position recognition is provided at each position on the diagonal line of the substrate 5.

  Next, configurations of the electronic component mounting apparatuses M3 to M5 will be described with reference to FIGS. On the upper surface of the base 9, a substrate transport mechanism 10 having a pair of transport conveyors extending in the X direction is provided. The substrate transport mechanism 10 transports the substrate 5 and positions it at a predetermined mounting work position (the position of the substrate 5 shown in FIG. 3). A substrate ID reading unit 11 is provided above the substrate 5 transported by the substrate transport mechanism 10 and on the carry-in side of the substrate 5 (the left side in FIG. 3). The substrate ID reading unit 11 reads the substrate ID from the barcode label 7 of the substrate 5 transported by the substrate transport mechanism 10. The read board ID is transmitted to the management unit 4.

  Component supply units 12 are provided at positions on both sides of the substrate transport mechanism 10 in the Y direction. The component supply unit 12 is provided with a plurality of tape feeders 13 arranged in parallel in the X direction. The tape feeder 13 intermittently feeds the carrier tape 14 (FIG. 4) in which the electronic components 6 are stored at regular intervals in the longitudinal direction, and supplies the electronic components 6 to a component pick-up position 13a by a suction nozzle 19 described later. The carrier tape 14 is wound and stored on the supply reel 15. The supply reel 15 is rotatably held by a reel holding member provided on a cart (not shown).

  The end of the base 9 in the X direction is provided with a Y-axis moving beam 16Y, and the Y-axis moving beam 16Y is provided with two X-axis moving beams 16X that are movable in the Y direction. A mounting head 18 is mounted on each X-axis moving beam 16X via a flat plate member 17 so as to be movable in the X direction. By driving the Y-axis moving beam 16Y and the X-axis moving beam 16X, the mounting head 18 moves in a horizontal XY direction within a predetermined range including the upper part of the component supply unit 12 and the upper part of the substrate 5 positioned at the mounting work position. Can be moved to. The Y-axis moving beam 16Y and the X-axis moving beam 16X constitute a head moving mechanism 16 (FIG. 6) that moves the mounting head 18 between the component supply unit 12 and the substrate 5.

  4 and 5A, the mounting head 18 has a suction nozzle 19 that sucks the electronic component 6 downward. The suction nozzle 19 is raised and lowered by a nozzle raising / lowering mechanism 20 provided above, and horizontally rotated by a rotation mechanism (not shown). The suction nozzle 19 descends with respect to the component take-out position 13a, and the electronic component 6 supplied to the component take-out position 13a is taken out by vacuum suction at this position. Further, the suction nozzle 19 is lowered by a predetermined amount with respect to an arbitrary mounting point R on the substrate 5 while holding the electronic component 6, and the electronic component 6 is mounted on the substrate 5 by releasing the vacuum suction at this position. To do. As described above, the mounting head 18 has the suction nozzle 19 that can move up and down with respect to the substrate 5, and the electronic component 6 is mounted on the substrate 5 by lowering the suction nozzle 19 that holds the electronic component 6.

  4 and 5A, the mounting head 18 includes a load cell 21 therein. The load cell 21 is a load measuring device using a resistance strain meter. When the electronic component 6 held by the suction nozzle 19 contacts the substrate 5 and the load detection surface of the load cell 21 detects the reaction force received by the suction nozzle 19, the resistance value of the strain gauge built in the load cell 21 changes. . As a result, an analog signal corresponding to the magnitude of the load is detected by a measurement amplifier (not shown), further AD-converted, and output to the control unit 30. As described above, the load cell 21 is a load value measuring unit that measures the load value of the suction nozzle 19 with respect to the substrate 5 when the suction nozzle 19 is lowered and the electronic component 6 is mounted on the substrate 5.

  The mounting head 18 includes a height sensor 22. The height sensor 22 is a measuring instrument that can detect displacement in the measurement axis direction without contact, such as a laser displacement meter, and moves together with the mounting head 18 by driving the head moving mechanism 16. As shown in FIG. 5A, the height sensor 22 scans the mounting surface 5a of the substrate 5 with light, and the height (Z) of the sampling point A according to the position where the light reflected by the mounting surface 5a is received. (Coordinate value) is measured (arrow a). As shown in FIG. 5B, the horizontal positions (XY coordinate values) are set in advance so that the sampling measurement points A are appropriately distributed on the mounting surface 5a of the substrate 5. The measurement result obtained by the height sensor 22 is used to detect distortion of the mounting surface 5a.

  3 and 4, the mounting head 18 includes a first recognition camera 23 whose imaging field of view is directed downward. The first recognition camera 23 images the recognition mark 8 on the substrate 5 and the component removal position 13 a of the tape feeder 13. A second recognition camera 24 is provided on the base 9 and between the board transport mechanism 10 and the component supply unit 12 with the imaging field of view facing upward. The second recognition camera 24 images the electronic component 6 taken out from the component supply unit 12 and held by the suction nozzle 19 from below. The imaging data acquired by the first recognition camera 23 and the second recognition camera 24 is subjected to recognition processing by the recognition processing unit 35 (FIG. 6), and thereby the positions of the substrate 5 and the electronic component 6 are detected. The position of the suction nozzle 19 on the XY plane when the electronic component 6 is mounted on the substrate 5 is corrected in consideration of the amount of displacement calculated based on the detection results of the substrate 5 and the electronic component 6.

  3, 4, and 5, the projector 25 and the line sensor camera unit 26 move above the base 9 so that the mounting head 18 reciprocates between the substrate 5 and the component supply unit 12 for mounting work. It is arranged to face each other across the route. Note that both the projector 25 and the line sensor camera unit 26 are disposed outside the range of the movement stroke S (FIG. 3) of the mounting head 18 in the X direction, so that the movement of the mounting head 18 is not hindered. ing.

  The projector 25 has a function of irradiating a strip-shaped inspection light 25a having a strong directivity such as a laser beam. The line sensor camera unit 26 has a function of receiving the strip-shaped inspection light 25 a projected from the projector 25 and outputting image data (one-dimensional image) indicating the state of the lower end portion of the suction nozzle 19. During the mounting operation, the line sensor camera unit 26 moves the mounting head 18 so that the lower end portion of the suction nozzle 19 crosses the inspection light 25a, so that the line sensor camera unit 26 displays image data indicating the state of the lower end portion of the suction nozzle 19 (one-dimensional image). ) To the control unit 30. This image data is used to determine the quality of the electronic component 6 held by the suction nozzle 19.

Next, the configuration of the control system of the electronic component mounting system 1 will be described with reference to FIG. Here, only the configurations of the electronic component mounting apparatuses M3 to M5 and the management unit 4 will be described. The control unit 30 included in the electronic component mounting apparatuses M3 to M5 includes a communication unit 31, a storage unit 32, a mechanism drive unit 33, a camera control unit 34, a recognition processing unit 35, a determination unit 36, a distortion detection unit 37, and a correction amount calculation unit. 38 is comprised. The control unit 30 also includes a substrate transport mechanism 10, a substrate ID reading unit 11, a head moving mechanism 16, a mounting head 18, a nozzle lifting mechanism 20, a load cell 21, a height sensor 22, a first recognition camera 23, and a second recognition. The camera 24, the projector 25, and the line sensor camera unit 26 are connected. The control unit 50 included in the management unit 4 includes a communication unit 51, a storage unit 52, and a mounting history data creation unit 53.

  The communication units 31 and 51 are connected via the LAN 2, whereby control signals and various data are transmitted and received between the electronic component mounting apparatuses M <b> 3 to M <b> 5 and the management unit 4. The storage unit 32 stores mounting data 39, component data 40, and the like. These data are read from the management unit 4. The mounting data 39 is data for mounting the electronic component 6 on the substrate 5 and includes XY coordinates of the mounting point R set on the substrate 5, the mounting angle of the electronic component 6, the position information of the tape feeder 13, and the like.

  The component data 40 is data including various types of information regarding the electronic component 6, and is configured by combining “control parameters” for each “component ID” of each electronic component 6. The “control parameter” includes the size of the electronic component 6, the feed pitch of the carrier tape 14, the XY coordinates of the component removal position, the acceleration that defines the operation of the suction nozzle 19, and the lowering position of the suction nozzle 19 during mounting Such information is included.

  The mechanism driving unit 33 is controlled by the control unit 30 to drive the substrate transport mechanism 10, the head moving mechanism 16, the mounting head 18, and the nozzle lifting mechanism 20. Thereby, the conveyance / positioning operation of the substrate 5 and the mounting operation of the electronic component 6 are executed.

  The camera control unit 34 controls imaging by the first recognition camera 23 and the second recognition camera 24. Further, the camera control unit 34 controls light projection by the projector 25 and output of image data by the line sensor camera unit 26.

  The recognition processing unit 35 performs recognition processing on the image data acquired by the first recognition camera 23 and the second recognition camera 24. Thereby, the position detection of the mounting point R on the substrate 5 and the positional deviation of the electronic component 6 held by the mounting head 18 are detected. In addition, the recognition processing unit 35 acquires two-dimensional image data indicating the state of the lower ends of the plurality of suction nozzles 19 of the mounting head 18 by combining the one-dimensional images output from the line sensor camera unit 26. The determination unit 36 determines whether the posture of the electronic component 6 at the lower end portion of the suction nozzle 19 is acceptable based on the image data output from the line sensor camera unit 26.

  The distortion detection unit 37 generates approximate curved surface data indicating the appearance of the substrate 5 to be mounted, using the three-dimensional data that is the measurement result of the plurality of sampling measurement points A acquired by the height sensor 22. Thereby, the distortion of the mounting surface 5a of the substrate 5, in other words, the warped deformation state is detected. The approximate curved surface data is formed by superposing the curved surface shape of the mounting surface 5a of the substrate 5 by superimposing a plurality of three-dimensional curved surface data. About the location which is not actually measured, it analyzes and calculates from several 3D data of the surrounding sampling station A. As described above, the distortion detection unit 37 detects the distortion of the mounting surface 5a based on the three-dimensional data of the mounting surface 5a of the substrate 5 to be mounted. The generated approximate curved surface data is stored in the storage unit 32.

  The correction amount calculation unit 38, based on the result of the recognition processing unit 35 recognizing the image data acquired by the first recognition camera 23 and the second recognition camera 24, the X direction, Y direction, A correction amount of the mounting position in the θ direction is calculated. The correction amount calculation unit 38 calculates a correction amount for the descending height of the suction nozzle 19 based on the detection result by the distortion detection unit 37.

  Here, with reference to FIGS. 7A and 7B, a method of calculating the correction amount of the descending height of the suction nozzle 19 when the electronic component 6 is mounted at the mounting point R1 will be described. First, the correction amount calculation unit 38 refers to the approximate curved surface data and specifies the heights of the plurality of sampling measurement points A1, A2, A3, A4 set near the mounting point R1. Next, the correction amount calculation unit 38 analyzes and calculates the height of the mounting point R1 based on the heights of the specified sampling measurement points A1 to A4. Then, the correction amount calculation unit 38 obtains a difference Δh1 between the analyzed height of the mounting point R1 and the normal height (the height of the mounting point R1 when the substrate 5 is assumed to be flat). This difference Δh1 becomes a correction amount, and the suction nozzle 19 descends to a height position that takes the correction amount into consideration and mounts the electronic component 6. Here, as shown in FIG. 8, the suction nozzle 19 is lowered to the height position H <b> 3 raised by Δh <b> 1 from the normal lowering height to mount the electronic component 6 (arrow b). Thereby, the electronic component 6 can be prevented from being pressed against the substrate 5 and damaged. Further, in the case where the substrate 5 is warped and deformed in a downwardly convex state, the suction nozzle 19 releases the suction in a state where there is a gap between the substrate 5 and the electronic component 6. It is possible to prevent the mounting position from shifting. In this way, the correction amount calculation unit 38 calculates the correction amount for the descending height of the suction nozzle 19 based on the detection result by the distortion detection unit 37. 7 and 8, for the sake of convenience, the distortion of the substrate 5 is greatly expressed, but actually, such a substrate 5 is excluded from the mounting line 3 upon receiving a defect determination at the inspection stage.

  The storage unit 52 of the management unit 4 stores mounting history data 54 in addition to the mounting data 39 and the component data 40 described above. The mounting history data 54 is data indicating the mounting history of the electronic component 6 in units of the board 5 and is stored in association with the board 5 to be mounted. The mounting history data creation unit 53 creates the mounting history data 54 for each board 5.

  Next, the mounting history data 54 will be described with reference to FIG. The mounting history data 54 is configured by associating the board ID 55, the distortion detection data 56, the suction posture data 57, and the mounting head operation data 58. The board ID 55 is identification information of the board 5 for which the mounting history data 54 is to be created. The distortion detection data 56 is data indicating a detection result by the distortion detector 37, and includes, for example, approximate curved surface data of the mounting surface 5a of the substrate 5. The suction posture data 57 is data relating to the suction posture of the electronic component 6 held by the suction nozzle 19. The suction posture data 57 is configured by associating the image data output from the line sensor camera unit 26 with the determination result of the suction posture of the electronic component 6 by the determination unit 36 for each component ID of the electronic component 6.

  The mounting head operation data 58 is data indicating operation information of the mounting head 18 (more precisely, the suction nozzle 19 included in the mounting head 18) when the electronic component 6 is mounted on the substrate 5. As shown in FIG. 10, the mounting head operation data 58 includes a board ID 59 and a unit mounting history 60. The board ID 59 indicates the board ID of the board 5 that is the work target of the mounting head 18.

  The unit mounting history 60 includes “mounting point” 61, “year / month / day” 62, “device number” 63, “nozzle ID” 64, “nozzle lowering height” 65, “lowering height correction amount” 66, “distortion”. The items of “amount” 67 and “load value” 68 are included. “Mounting point” 61 is information for identifying individual mounting points R on the substrate 5. “Date” 62 indicates the date on which the electronic component 6 was mounted on the mounting point R. The “device number” 63 is a unique number for identifying the electronic component mounting devices M3 to M5 that have performed the mounting operation. The “nozzle ID” 64 is information for identifying the suction nozzle 19 used for mounting the electronic component 6. The “nozzle lowering height” 65 indicates a height position where the suction nozzle 19 is lowered when the electronic component 6 is mounted at the mounting point R. “Descent height correction amount” 66 indicates the correction amount of the descending height of the suction nozzle 19 calculated by the correction amount calculation unit 38. The “distortion amount” 67 is a predetermined region where the target mounting point R exists, and indicates the distortion amount of the mounting surface 5 a used when correcting the descending height of the suction nozzle 19. The “load value” 68 indicates a load value measured by the load cell 21 (load value measuring means) when the electronic component 6 is mounted at the mounting point R. The unit mounting history 60 including these items is created for all mounting points R (R1, R2,... Rn) set on the substrate 5 and arranged in time series. Further, each item of “nozzle lowering height” 65, “lowering height correction amount” 66, and “load value” 68 is positioned as operation information of the mounting head 18. The operation information of the mounting head 18 only needs to include information that can specify the descending height of the suction nozzle 19, that is, information related to the descending height. For example, as the information, the distance from the mounting surface 5a of the substrate 5 positioned at the mounting work position to the lower end of the suction nozzle 19 may be used, or the descending amount of the suction nozzle 19 may be used.

  As described above, the mounting history data creation unit 53 associates the mounting point R where the electronic component 6 is mounted on the board 5 with the operation information of the mounting head 18 when the electronic component 6 is mounted on the mounting point R. The mounting history data 54 including information in which the unit mounting history 60 is arranged in time series is created. In addition, the operation information of the mounting head 18 includes information regarding the lowered height position of the suction nozzle 19 when the suction nozzle 19 is lowered and the electronic component 6 is mounted on the substrate 5. Note that only the mounting head operation data 58 may be created as the mounting history data 54 and may be stored in the storage unit 52 in association with the board 5 to be mounted.

  As described above, the mounting history data 54 including the mounting head operation data 58 is created and stored for all the boards 5 manufactured by the electronic component mounting apparatuses M3 to M5. Therefore, when a problem occurs in a product that finally has a certain substrate 5 mounted thereon, the mounting history data 54 stored in the storage unit 52 can be traced back from the substrate ID. In particular, since the mounting history data 54 records information about the lowering height of the suction nozzle 19 when the electronic component is mounted, the causal relationship between the lowering height of the suction nozzle 19 and a product defect is shown in the manufacturing process of the substrate 5. Can be analyzed along.

  Specifically, when the electronic component 6 mounted at a certain mounting point R on the substrate 5 is damaged, the descending height of the suction nozzle 19 when the electronic component 6 is mounted is referred to. . As a result, for example, when the suction nozzle 19 is further lowered by a predetermined amount from the normal descending height position and the electronic component 6 is mounted, the suction nozzle 19 presses the electronic component 6 against the substrate 5 more than necessary. Can be assumed to have caused damage. Further, the correction amount and the load value of the lowering height of the suction nozzle 19 indicated by the mounting head operation data 58 can be used as effective judgment materials for supporting the assumption. In this case, it is possible to take a measure to review the setting of the descending height position of the suction nozzle 19. Further, in recent years, there are increasing cases of manufacturing a mounting board in which the electronic component 6 is mounted on the board 5 having a curved mounting surface 5a, or a mounting board in which a plurality of electronic components 6 are stacked and mounted on one mounting point R. ing. In such a mounting substrate, the lowered height position of the suction nozzle 19 at the time of mounting can greatly affect the mounting quality. Even when a product having such a mounting board has a problem, it is possible to trace back mounting history data including information on the height of the suction nozzle 19 (that is, three-dimensional data) and refer to it. It is possible to support the investigation of the cause of defects on the board side.

  The electronic component mounting system 1 in the present embodiment is configured as described above. Next, an electronic component mounting method will be described with reference to the flowchart of FIG. First, the substrate transport mechanism 10 transports the substrate 5 and positions it at the mounting work position (ST1: substrate positioning step). Next, the height sensor 22 sequentially measures a plurality of sampling measurement points A set on the substrate 5 (ST2: sampling measurement measurement process). Next, the distortion detection unit 37 generates approximate curved surface data from the measurement result acquired in the above-described step (ST2), and detects the distortion of the mounting surface 5a (ST3: distortion detection step).

  Next, the electronic component 6 is mounted on the substrate 5 by the mounting head 18 (ST4: mounting process). That is, the mounting head 18 takes out the electronic component 6 supplied from the tape feeder 13 by the suction nozzle 19 and mounts it on the mounting point R of the substrate 5. At this time, the mounting head 18 is aligned with the substrate 5 after correcting the positions in the X, Y, and θ directions. Further, the suction nozzle 19 descends to the corrected height position calculated based on the distortion of the mounting surface 5a. When the electronic components 6 are mounted at all the mounting points R in charge of the electronic component mounting apparatuses M3 to M4 that are the transfer destinations, the substrate transfer mechanism 10 transfers the substrate 5 downstream, and then the substrate 5 is downstream. (ST5: Unloading process).

  Next, the registration process of the mounting history data 54 will be described with reference to FIG. The mounting history data 54 is performed in parallel with the mounting work based on the electronic component mounting method described above. First, the substrate ID reading unit 11 reads the substrate ID from the barcode label 7 in the process in which the substrate 5 is transported toward the mounting work position by the substrate transport mechanism 10. The read board ID is transmitted to the management section 4, and the control section 50 (mounting history data creating section 53) registers the received board ID in the mounting history data 54 (ST11: first registration step).

  Next, the control unit 50 receives the detection result of the distortion of the mounting surface 5a of the substrate 5 from the target electronic component mounting apparatuses M3 to M5 and registers it in the mounting history data 54 (ST12: second registration step). Next, when one electronic component 6 is mounted in the process of performing the mounting operation by the mounting head 18, the control unit 50 each time the electronic component mounting apparatus M3 targeted for various information including the operation information of the mounting head 18 is mounted. Receive from ~ M5. Then, based on the received various information, the control unit 50 registers the operation information of the mounting head 18 when the electronic component 6 is mounted at the mounting point R in the mounting history data 54 (ST13: third registration step). . That is, the control unit 50 has a mounting point R on which the electronic component 6 is mounted, a mounting date, a device number, a used nozzle ID, a lowering height of the suction nozzle 19 at the time of mounting, a correction amount for the lowering height, The distortion amount of the mounting surface 5a used when correcting the descending height and the load value at the time of mounting are written in the mounting head operation data 58.

  Next, the control unit 50 determines whether or not the electronic component 6 is mounted on all the mounting points R of one board 5 (ST14: determination process), and if there is an unmounted part, the process returns to (ST13). If it is determined in (ST14) that the electronic components 6 are mounted on all mounting points R, the control unit 50 stores the mounting history data 54 in the storage unit 52 in a state associated with the board ID (ST15). : Memory step). Through the above steps, mounting history data 54 per unit of 5 substrates is created.

  Next, a modified example of the mounting history data created according to the structure of the mounting board will be described with reference to FIGS. FIG. 13 is manufactured by so-called three-dimensional mounting in which a plurality of electronic components 6 (first electronic component 6A, second electronic component 6B, and third electronic component 6C) are stacked and mounted on one mounting point RA. A side view of the substrate 5A is shown. Briefly explaining the three-dimensional mounting, first, the suction nozzle 19 of the mounting head 18 is lowered to the height position H4, the first electronic component 6A is mounted at the mounting point R1, and then lowered to the height position H5. The second electronic component 6B is mounted on the upper surface of the first electronic component 6A. Finally, the second electronic component 6B is lowered to the height position H6 and the third electronic component 6C is mounted on the upper surface of the second electronic component 6B. A plurality of solder bumps 70 as connection portions are formed on the lower surfaces of these electronic components 6 </ b> A to 6 </ b> B, and are mounted on an object below through the solder bumps 70.

  FIG. 14 shows mounting head operation data 58A in the mounting history data 54 corresponding to the substrate 5A manufactured by the above-described three-dimensional mounting. Note that the same components as those of the mounting head operation data 58 already described are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 14, the unit mounting history 60 constituting the mounting head operation data 58A newly includes an item “component ID” 69. “Component ID” 69 is identification information for identifying each electronic component 6.

  Since a plurality of electronic components 6 are stacked on one mounting point R, the substrate 5A manufactured by three-dimensional mounting has a plurality of common mounting points Rn (n = 1, 2, 3,.・ ・) Is shown in part. In FIG. 14, the mounting point R1 and the mounting point R4 correspond to this. In this way, by including the component ID in the unit mounting history 60, it is possible to easily and in detail understand the operation information of the mounting head 18 when mounting the individual electronic components 6 stacked at one mounting point R. it can.

  More specifically, a plurality of electronic components 6A to 6C stacked on one mounting point RA are represented as the same XY coordinate value. Therefore, in order to analyze the manufacturing process of the mounting board manufactured by the three-dimensional mounting, for example, even if the two-dimensional data of only the XY coordinate values on which the electronic components 6A to 6B are mounted is traced back, each electronic component 6A Specific information specific to ˜6C cannot be grasped. Therefore, when a problem occurs in a product on which a mounting board is mounted, there may be a problem that it is difficult to investigate the cause.

  However, according to the electronic component mounting system 1 in the present embodiment, when a failure occurs in a product finally mounted with the board 5A produced by three-dimensional mounting, the mounting history data 54 including the mounting head operation data 58A. By tracing back and referring to the descending height of the suction nozzle 19 when the electronic components 6A to 6B are stacked and mounted, specific information specific to the electronic components 6A to 6C is grasped. The causal relationship between the descending height of the suction nozzle 19 and the product defect can be easily analyzed. That is, according to the electronic component mounting system 1 in the present embodiment, it is possible to easily investigate the cause of the problem of the mounting board on which the electronic component is mounted in various aspects.

  The electronic component mounting system of the present invention is not limited to the embodiments described so far, and can be modified without departing from the spirit of the invention. For example, a function for creating the mounting history data 54 may be provided in the electronic component mounting apparatuses M3 to M5, and the mounting history data 54 may be generated by each of the electronic component mounting apparatuses M3 to M5. Further, the mounting history data 54 in the present embodiment is an example, and other information such as information indicating correction amounts of the suction nozzle 19 in the X direction, the Y direction, and the θ direction when the electronic component is mounted may be added. .

  Alternatively, the distortion of the mounting surface 5a of the substrate 5 may be detected by a mounting apparatus other than the electronic component mounting apparatuses M3 to M5, and the detection result may be registered in the mounting history data 54. For example, since the detection of the distortion of the mounting surface 5a of the substrate 5 is also performed by the printing state inspection apparatus M2, the detection result here may be transmitted to the management unit 4 and registered in the mounting history data 54.

  ADVANTAGE OF THE INVENTION According to this invention, the cause of the malfunction of the mounting substrate in which the electronic component was mounted can be investigated easily, and it is useful in the electronic component mounting field.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 5,5A Board | substrate 5a Mounting surface 6,6A, 6B, 6C Electronic component 18 Mounting head 19 Adsorption nozzle 21 Load cell 37 Distortion detection part 38 Correction amount calculation part 52 Storage part 54 Mounting history data 60 Unit mounting history M3 , M4, M5 Electronic component mounting equipment R, RA, R1, R2, R3, R4, R5 Mounting point

Claims (3)

An electronic component mounting system configured by connecting a plurality of mounting devices and manufacturing a mounting substrate by mounting electronic components on the substrate,
An electronic component mounting apparatus having a suction nozzle that can be raised and lowered relative to the substrate, and a mounting head that mounts the electronic component on the substrate by lowering the suction nozzle holding the electronic component;
Implementation that creates mounting history data in which unit mounting histories are arranged in chronological order by associating mounting points where electronic components are mounted on a board and operation information of the mounting head when electronic components are mounted on the mounting points. A history data creation unit;
A storage unit for storing the mounting history data in association with the board to be mounted;
Wherein the operation information of the mounting head, an electronic component mounting system, characterized in that it contains information about the lowered height position of the suction nozzle at the time of mounting electronic components on the mounting point is lowered the suction nozzle. A strain detector that detects strain of the mounting surface based on three-dimensional data of the mounting surface of the substrate to be mounted;
A correction amount calculation unit that calculates a correction amount of the lowering height of the suction nozzle based on a detection result by the distortion detection unit;
2. The mounting history data creation unit creates the mounting history data further including a detection result by the distortion detection unit and a correction amount calculated by the correction amount calculation unit. Electronic component mounting system. A weight value measuring means for measuring a weight value of the suction nozzle with respect to the substrate when the suction nozzle is lowered to mount an electronic component on the substrate;
The electronic component mounting system according to claim 1, wherein the mounting history data creating unit creates the mounting history data further including a weight value measured by the weight value measuring unit.

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