JP2019216129A - Component mounting device - Google Patents

Abstract

To provide a component mounting device capable of preventing productivity loss, while ensuring mounting quality by using an appropriate nozzle.SOLUTION: A component mounting device 1 for suctioning a component by means of a nozzle attached to a mounting head and pushing down to mount the component into a board 3, comprises: a storage section 21 as a component information storage section for storing a first lower limit value 24a and a first upper limit value 24b, i.e., a lower limit value and an upper limit value of push-in load applied to the component; a load measurement section consisting of a load measurement unit 14 for measuring the push-in load applied by the nozzle and a load measurement processing section 26; and a nozzle assignment section 27 for assigning a nozzle, different from a one already attached to the component when the push-in load measured by the load measurement section is smaller than the first lower limit value 24a or larger than the first upper limit value 24b.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus that mounts components on a substrate by sucking components with a nozzle.

  In a component mounting apparatus that mounts components on a board, a component mounting operation of taking out components from a component supply unit by a mounting head and mounting the components on the board is repeatedly performed. In this component mounting operation, the component is sucked and held by a nozzle attached to the mounting head, and the held component is mounted at the mounting position by pressing the component against the board (for example, see Patent Document 1). . In the prior art shown in this patent document example, a configuration is described in which a component having a light mounting load, which has a small mounting load for pressing the component against the substrate, can be included in a mounting target. In general, the mounting load of components mounted on a board differs depending on the type of component, and in a component mounting system targeting multiple types of components with different mounting loads, the target load range is set so that different mounting loads can be handled. Are prepared.

  Then, as another conventional technology example, in the process of performing the component mounting operation, the mounting head is accessed by the load measuring unit provided in the component mounting apparatus, the pressing load of the nozzle is measured for each nozzle, and the correct nozzle is used. It is known to judge whether or not there is. Here, if the measurement result is out of the range of the mounting load of the component to which the nozzle is assigned in advance, the nozzle is determined to be a “bad nozzle” that cannot be used, and the nozzle is excluded from use. ing.

JP-A-2002-151893

  However, the prior art example of performing the above-described load measurement has the following inconveniences due to the difference in the purpose and meaning of the load measurement. That is, the purpose of load measurement in the prior art is to determine whether the sliding state of the sliding portion that holds the elevation of the nozzle is normal. As a result, it is possible to prevent mounting quality from deteriorating due to excessive load acting on the component due to poor sliding. However, in this operation example, as a result of the above-described determination, only two choices of using or not using the nozzle are allowed. For this reason, when it is determined that the nozzle is not used as a “bad nozzle”, this nozzle is excluded from the use target. As a result, the number of nozzles that can be used is reduced although there is a possibility that other components can be used without any problem, and the operation tact time is delayed to lower the productivity. As described above, in the related art, it has been difficult to prevent a decrease in productivity while securing mounting quality by using an appropriate nozzle.

  Therefore, an object of the present invention is to provide a component mounting apparatus that can prevent a decrease in productivity while securing mounting quality by using an appropriate nozzle.

  The component mounting apparatus of the present invention is a component mounting apparatus which mounts a component on a board by sucking a component with a nozzle attached to a mounting head and pushing the component downward, wherein a lower limit value and an upper limit value of a pushing load received by the component. A component information storage unit that stores a certain first lower limit value and a first upper limit value, a load measurement unit that measures the indentation load applied by the nozzle, and the indentation load measured by the load measurement unit is the first indentation load. A nozzle allocating unit that allocates a nozzle different from the nozzle to the component when the value is smaller than the lower limit value or larger than the first upper limit value.

  ADVANTAGE OF THE INVENTION According to this invention, a fall of productivity can be prevented, ensuring mounting quality using an appropriate nozzle.

The top view of the component mounting apparatus of one embodiment of this invention Configuration explanatory diagram of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is a block diagram illustrating a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. Explanatory drawing of load measurement in the component mounting apparatus according to one embodiment of the present invention Explanatory diagram of nozzle information and component information in a component mounting apparatus according to an embodiment of the present invention. Flow chart of processing for assigning nozzles to components in the component mounting apparatus according to one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, an overall configuration of the component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transfer mechanism 2 is provided in the center of the base 1a in the X direction (substrate transfer direction). The board transfer mechanism 2 transfers the board 3 transferred from the upstream device to the downstream side in the X direction, and positions and holds the board 3 at a mounting work position by the component mounting mechanism 17 (see FIG. 3).

  On both sides of the substrate transport mechanism 2, component supply units 4 for supplying components mounted on the substrate 3 are provided. A plurality of tape feeders 5 are arranged in the component supply unit 4, and the tape feeder 5 feeds these components to a component take-out position by a component mounting mechanism by feeding a carrier tape storing and holding the components at a pitch.

  At one end of the base 1a in the X direction, a Y-axis moving table 7 having a linear drive mechanism is horizontally disposed in the Y direction. Similarly, two X-axis moving tables 8 each having a linear drive mechanism are connected to the Y-axis moving table 7 so as to be slidable in the Y direction. On the X-axis moving table 8, a multiple mounting head 9 having a plurality of nozzle units 10 is slidably mounted in the X direction.

  As shown in FIG. 2, a plurality of nozzle units 10 provided in the mounting head 9 are provided with nozzle holders 15, respectively. A nozzle 16 is detachably attached to a lower end portion of the nozzle holder 15. The nozzle unit 10 can individually raise and lower the nozzle holder 15. By driving the nozzle unit 10 to lower the nozzle 16, the components held by the nozzle 16 are pushed into the substrate 3. .

  In FIG. 1, by driving the Y-axis moving table 7 and the X-axis moving table 8, the mounting head 9 moves horizontally in the X direction and the Y direction. Thereby, the mounting head 9 sucks and takes out the component from the tape feeder 5 of the component supply unit 4 by the nozzle 16. Then, the mounting head 9 moved to the substrate 3 pushes the component downward, thereby mounting the component on the substrate 3 positioned and held by the substrate transport mechanism 2. The Y-axis moving table 7, the X-axis moving table 8 and the mounting head 9 constitute a component mounting mechanism 17 for mounting components on the board 3.

  On the lower surface side of the X-axis moving table 8, a board recognition camera 11 that moves integrally with the mounting head 9 is arranged. When the mounting head 9 moves on the substrate 3 of the substrate transport mechanism 2, the substrate recognition camera 11 captures an image of the substrate 3. A load measuring unit 14 including a load sensor such as a component recognition camera 12, a nozzle changer 13, and a load cell is disposed between the component supply unit 4 and the substrate transport mechanism 2.

  When the mounting head 9 that has taken out the component from the component supply unit 4 is positioned above the component recognition camera 12, the component recognition camera 12 captures an image of the component held by the mounting head 9. Then, a recognition processing unit (not shown) performs recognition processing on the image pickup result of the board recognition camera 11, whereby the component mounting position on the board 3 is recognized. In addition, by performing recognition processing of the imaging result of the component recognition camera 12, identification of the component held by the mounting head 9 and detection of a position shift are performed. In the component mounting operation by the component mounting mechanism 17, the mounting position is corrected in consideration of these recognition results.

  The load measurement unit 14 is a load measurement sensor such as a load cell. By moving the mounting head 9 with the nozzle 16 attached thereto above the load measuring unit 14 and lowering the nozzle 16 and pressing it against the load measuring unit 14, the load measuring unit 14 performs measurement according to the sliding load of the nozzle 16. Output a signal. The measurement signal is subjected to measurement processing by the load measurement processing unit 26 (see FIG. 3), so that the pressing load of the component by the nozzle 16 can be measured.

  In order to ensure good mounting quality in the component mounting operation by the component mounting mechanism 17, it is necessary to set the pushing load by the nozzle 16 to an appropriate value according to the characteristics of the component. For this reason, nozzle assignment for allocating the nozzle 16 having an appropriate pushing load to the component to be mounted is performed. In this nozzle assignment, nozzle assignment data indicating a combination of a part and a nozzle 16 is created from production data created prior to the execution of production. At the time of the component mounting operation, the component mounting operation is performed according to the nozzle assignment data.

  However, the sliding load is not always constant in the operation state of the nozzle 16, and the sliding load tends to fluctuate due to contamination due to use. If the component mounting operation is performed in such a state of poor sliding, the indentation load cannot be controlled to an appropriate load value suitable for the component, resulting in poor mounting quality.

  For the purpose of preventing such poor mounting quality, in the present embodiment, when starting a new production, all the nozzles 16 mounted on the mounting head 9 are slid using the load measuring unit 14 using the load measuring unit 14. By executing the load measurement, it is possible to prevent poor mounting quality due to poor sliding of the nozzle 16. That is, if the result of the measurement of the sliding load deviates from the load threshold set for the component, the nozzle 16 is reassigned to the component. As a result, while controlling the indentation load of parts, the so-called "bad nozzle", which is not used for production and goes into an idle state due to the sliding load being out of the appropriate value, is prevented as much as possible. can do.

  Next, a configuration of a control system of the component mounting apparatus 1 will be described with reference to FIG. 3, the component mounting apparatus 1 includes a mounting control unit 20, a storage unit 21, a load measurement processing unit 26, a nozzle allocation unit 27, an operation / input unit 28, and a display unit 29. The mounting control unit 20 controls the component mounting mechanism 17 based on the data stored in the storage unit 21 to execute a component mounting operation for mounting components on the board 3. In the storage unit 21, equipment configuration information 22, production data 23, part information 24, and nozzle information 25 are input from an external host device and stored.

  The equipment configuration information 22 is information indicating the equipment configuration in the component mounting apparatus 1, and in the present embodiment, includes information for specifying the presence or absence of the load measuring unit 14 in the apparatus (see FIG. 4). The production data 23 is information on boards and components required for producing a mounting board to be produced. The production data 23 includes component information 24 on components mounted by the component mounting apparatus 1.

  The component information 24 includes information on the load range of the indentation load received by the component (see FIG. 5B), and here, the first lower limit which is the lower limit and the upper limit of the indentation load received by the component 24a and a first upper limit 24b are stored. That is, the storage unit 21 is a component information storage unit that stores the component information 24 described above. In the present embodiment, the component information 24 further includes nozzle assignment data for specifying a combination of the component and the nozzle 16.

  The nozzle information 25 is information on the nozzle 16 attached to the mounting head 9, and the nozzle information 25 includes information on the load range of the pushing load applied by the nozzle 16 (see FIG. 4A). Here, a second lower limit 25a and a second upper limit 25b which are the lower limit and the upper limit of the pushing load applied by the plurality of nozzles 16 are stored. That is, the storage unit 21 is a nozzle information storage unit that stores the nozzle information 25 described above.

  The load measurement unit 14 is a load measurement sensor such as a load cell. As shown in FIG. 4, the mounting head 9 to which the plurality of nozzles 16 are attached is moved above the load measuring unit 14, and the nozzles 16 * to be measured are sequentially lowered and pressed against the load measuring unit 14, so that the load is measured. The measurement unit 14 outputs a measurement signal according to the sliding load of the nozzle 16. The measurement signal is subjected to measurement processing by the load measurement processing unit 26 (see FIG. 3), so that the indentation load of the component by the nozzle 16 can be measured for each of the plurality of nozzles 16. The load measurement unit 14 and the load measurement processing unit 26 constitute a load measurement unit that measures a pushing load applied by the nozzle 16.

  The nozzle assignment unit 27 has a nozzle reassignment function of changing the assignment of the nozzles 16 to components. In the present embodiment, when the indentation load measured by the above-described load measurement unit is out of the load range specified by the component information 24, that is, from the first lower limit 24a for the component of the nozzle 16 Is smaller than or larger than the first upper limit 24b, nozzle reassignment for assigning a nozzle 16 different from the already attached nozzle 16 to the component is performed.

  The operation / input unit 28 is an input device such as a touch panel, and performs operation input and data input to the component mounting apparatus. The display unit 29 is a display device such as a liquid crystal panel, and displays a guidance screen and various notification screens at the time of operation input by the operation / input unit 28. The notification screen includes a screen for notifying that production cannot be performed because appropriate nozzle reassignment cannot be performed (see FIG. 6).

  Here, the nozzle information 25 and the component information 24 stored in the storage unit 21 will be described with reference to FIG. In the description of the component information 24, an execution mode of the nozzle allocation performed by the nozzle allocation unit 27 based on the nozzle information 25 and the component information 24 is exemplified by a “nozzle option” 24d.

  FIG. 5A shows the configuration of the nozzle information 25. Here, for the four types of nozzles 16 of A, B, C, and D, a “second lower limit” 25a and a “second upper limit” 25b are defined. In the following description, the nozzles 16 indicated by A, B, C, and D are simply abbreviated as nozzles A, B, C, and D.

  The “second lower limit” 25a and the “second upper limit” 25b correspond to the “second lower limit” 25a and the “second upper limit” 25b stored in the storage unit 21 in FIG. A, B, C, and D are set as a pair. That is, each of the nozzles A, B, C, and D applies an indentation load in a load range of (0.5 to 3N), (1 to 3N), (0.5 to 5N), and (5 to 100N). Is allowed to be used.

  FIG. 5B shows the configuration of the component information 24. Here, “load setting” 24c, “first lower limit” 24a, and “first upper limit” 24b are defined for five types of components a, b, c, d, and e. The “nozzle option” 24d shows an example of a nozzle option that is allowed when the nozzle 16 shown in FIG. 5A is assigned to these components.

  The “load setting” 25c is a pushing load recommended by the component supplier. In the example shown here, fixed values of 1N, 1N, 8N, and 50N are set for each of b, c, d, and e other than the component a, which is a general-purpose component.

  The “first lower limit” 24a and the “first upper limit” 24b correspond to the “first lower limit” 24a and the “first upper limit” 24b stored in the storage unit 21 in FIG. And a pair is set for each of b, c, d, and e. That is, each of the components indicated by b, c, d, and e receives the indentation load in the load ranges of (0.5 to 1N), (1 to 3N), (3 to 10N), and (50 to 100N). It is allowed.

  When the nozzle 16 is reassigned to a component, the nozzle assigning unit 27 stores the first lower limit 24a and the first upper limit 24b stored in the component information storage unit and the nozzle information storage unit. A function of selecting a nozzle 16 that can be used for a component among the plurality of nozzles 16 and assigning the selected nozzle 16 to the component based on the second lower limit 25a and the second upper limit 25b of the plurality of nozzles 16 that have been set. are doing.

  Here, a description will be given of an execution mode of the nozzle selection shown in the “nozzle option” 24d of FIG. For the component a, since there is no load setting in the “load setting” 24c, it is allowable to assign all the nozzles 16 indicated by the nozzle information 25, that is, any of the nozzles A, B, C, and D to the component a. Is done.

  Further, in the part b, the load range is (0.5 to 1N), and there is a range that partially overlaps with the load range of the nozzle C (0.5 to 5N). Thus, the nozzle C is given as a nozzle choice for the component b. Further, in the part c, the load range is (1-3N), completely overlaps with the load range (1-3N) of the nozzle B, and partially overlaps with the load range (0.5-5N) of the nozzle C. Range exists. Accordingly, nozzles B and C are listed as nozzle options for the component c.

  Also, in the part d, the load range is (3 to 10N), there is a range that partially overlaps with the load range of the nozzle C (0.5 to 5N), and the load range of the nozzle D (5 to 100N) There is a partially overlapping range. Thus, nozzles C and D are listed as nozzle options for component d. Further, in the component e, the load range is (50 to 100 N), and there is a range that partially overlaps with the load range of the nozzle D (5 to 100 N). Thus, the nozzle D is given as a nozzle choice for the component e.

  In the above-described embodiment of the nozzle selection, in the example where the nozzle B is assigned to the component c, the load range for the component c is completely included in the load range for the nozzle B. That is, in this embodiment, the nozzle assignment unit 27 selects the nozzle 16 that satisfies the condition that the second lower limit 25a is equal to or greater than the first lower limit 24a and the second upper limit 25b is equal to or less than the first upper limit 24b. It has become.

  In the nozzle selection, it is desirable that the load range of the component is included in the load range of the nozzle, but such assignment is not always possible. In such a case, the nozzles are assigned to the components in such a combination that there is a range overlapping the load range for the components and the load range for the nozzles.

  For example, in the example of the nozzle options shown in FIG. 5B, in the example of allocating the nozzle C to the component b, the example of allocating the nozzles C and D to the component d, and the example of allocating the nozzle D to the component e Has a form in which the load range for the part and the load range for the nozzle partially overlap. That is, in these embodiments, the nozzle allocating unit 27 selects the nozzle 16 that satisfies the condition that the second lower limit 25a is equal to or less than the first upper limit 24b or the second upper limit 25b is equal to or greater than the first lower limit 24a. It has become.

  Next, a process of reassigning the nozzles 16 to components in the component mounting apparatus 1 will be described with reference to FIG. First, production data of a target substrate is obtained (ST1). That is, the production data 23 stored in the storage unit 21 in advance is read. Next, with reference to the production data 23, it is determined whether or not the indentation load is set for the component to be mounted (ST2). Here, when the pushing load is not set, the following processing is determined to be unnecessary and the processing is skipped.

  Next, the equipment configuration information of the target component mounting line is acquired (ST3). That is, the equipment configuration information 22 similarly stored in advance in the storage unit 21 is read and referred to, and it is determined whether or not the apparatus has the load measurement unit 14 (ST4). If the apparatus has the load measurement unit 14, the measurement of the pushing load by the nozzles 16 is performed for all the nozzles 16 (ST5).

  Then, it is determined whether or not there is a nozzle whose measurement result does not fall within the load threshold of the target component (ST6). Here, if there is a corresponding nozzle, it is determined whether there is a nozzle that can be substituted for this nozzle. That is, it is determined whether or not there is another nozzle whose measurement result is within the load threshold of the target component (ST7). Here, if there is a corresponding nozzle, the nozzle assignment unit 27 performs the nozzle reassignment so as to fall within the range of the load threshold of the target component (ST9).

  If there is no other corresponding nozzle in (ST7), the operator is notified via the display unit 29 that the board to be produced cannot be produced by the apparatus (ST8). If none of (ST2), (ST4), and (ST6) apply, it is determined that there is no reallocation in any case (ST10), and the component mounting work is executed based on the initial allocation.

  As described above, in the present embodiment, in the component mounting apparatus 1 which mounts the component on the board 3 by sucking the component with the nozzle 16 attached to the mounting head 9 and pushing the component downward, the pressing load received by the component is reduced. A storage unit 21 as a component information storage unit for storing a first lower limit 24a and a first upper limit 24b, which are a lower limit and an upper limit, a load measuring unit 14 for measuring a pushing load applied by the nozzle 16, and a load. A load measuring unit composed of a measurement processing unit 26, and a nozzle already mounted when the pushing load measured by the load measuring unit is smaller than the first lower limit 24a or larger than the first upper limit 24b. A nozzle allocating unit 27 that allocates a different nozzle 16 from the nozzle 16 to a component is provided.

  As a result, it becomes possible to perform an operation for re-distribution including a nozzle 16 determined as a “bad nozzle” out of an appropriate load range in a combination of the nozzle 16 and the component by the initial nozzle distribution. As a result, the number of usable nozzles can be ensured as much as possible, and a reduction in productivity can be prevented while securing mounting quality by using appropriate nozzles.

  The component mounting apparatus of the present invention has an effect that it is possible to prevent a decrease in productivity while securing the mounting quality by using an appropriate nozzle, and in the field of mounting a component on a substrate by suctioning the component with the nozzle. Useful.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Substrate 9 Mounting head 14 Load measuring unit 16 Nozzle

Claims (4)

In a component mounting apparatus that mounts a component on a board by sucking a component with a nozzle attached to a mounting head and pushing the component downward,
A component information storage unit that stores a first lower limit and a first upper limit that are a lower limit and an upper limit of the indentation load received by the component;
A load measurement unit that measures the indentation load applied by the nozzle,
When the indentation load measured by the load measuring unit is smaller than the first lower limit or larger than the first upper limit, a nozzle assigning unit that assigns a different nozzle to the part from the nozzle, A component mounting apparatus comprising: A nozzle information storage unit that stores a second lower limit and a second upper limit that are a lower limit and an upper limit of the pushing load applied by the plurality of nozzles,
The nozzle allocating unit includes a first lower limit value and a first upper limit value stored in the component information storage unit, and a second lower limit value and a second lower limit value of the plurality of nozzles stored in the nozzle information storage unit. 2. The component mounting apparatus according to claim 1, wherein a nozzle usable for the component is selected from the plurality of nozzles based on the upper limit of the component mounting.   3. The nozzle assignment unit according to claim 2, wherein the nozzle assignment unit selects a nozzle that satisfies a condition that the second lower limit is equal to or greater than the first lower limit and the second upper limit is equal to or less than the first upper limit. Component mounting equipment.   3. The nozzle assignment unit according to claim 2, wherein the nozzle assignment unit selects a nozzle that satisfies a condition that the second lower limit is equal to or less than the first upper limit or the second upper limit is equal to or greater than the first lower limit. Component mounting equipment.

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