JP6442593B2 - Mounting processing apparatus and method for controlling mounting processing apparatus - Google Patents

Description

  The present invention relates to an inspection control device, a mounting system, and an inspection control method.

  Conventionally, an inspection device detects that an abnormality has occurred in a component mounted on a board, and abnormal data indicating the abnormality is transmitted to a plurality of mounting machines. One that analyzes the cause and performs corresponding processing to eliminate the abnormality according to the analysis result has been proposed (see, for example, Patent Document 1). This device stores statistical values of deviations for each part, missing items, polarity correctness, etc., displays the location where an abnormality has occurred according to the analysis result, and gives an alarm to immediately notify the abnormality. It is possible to respond to.

JP 2007-194249 A

  However, in the mounting processing apparatus described in Patent Document 1, statistical values and the like are managed for each component, and the state of the entire mounting machine is not considered. For example, in a mounting machine, if the mounting process is continued, a component mounting position may be shifted due to thermal expansion of a member of the apparatus. In such a case, since all components mounted on a specific mounting machine are displaced, there is a problem that the worker requires a lot of work man-hours such as reanalyzing the cause of the abnormality. In addition, there is a problem that it takes time for the handling process and the mounting process cannot be performed efficiently.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide an inspection control device, a mounting system, and an inspection control method that can execute more efficient mounting processing.

  The present invention adopts the following means in order to achieve the main object described above.

That is, the inspection control device of the present invention is
In a mounting system comprising: one or more mounting processing devices that execute mounting processing for mounting one or more components on a substrate; and an inspection device that executes inspection processing for inspecting a mounting state of the mounted components. An inspection control apparatus for processing information in the inspection process,
Statistical means for obtaining statistical information of the mounting state for each mounting processing device based on the result of the inspection processing;
An output control means for notifying the corresponding mounting processing apparatus to perform a countermeasure process when the statistical information is outside a predetermined countermeasure determination range;
It is equipped with.

  In this inspection control device, statistical information on the mounting state of each mounting processing device is obtained based on the result of the inspection processing, and when the statistical information falls outside a predetermined countermeasure determination range, the corresponding processing processing device is processed. Notice. In the mounting processing apparatus, for example, when the mounting process is continued, the mounting position may be shifted due to thermal expansion of a member of the mounting processing apparatus. Such a shift in the mounting position affects the entire component mounted by the mounting processing apparatus. Since this inspection control apparatus obtains statistical information for each mounting processing apparatus, it is possible to obtain statistical information reflecting the state of the mounting processing apparatus. The mounting processing apparatus can perform a handling process related to the entire apparatus. Therefore, it is possible to perform the handling process more appropriately, and thus it is possible to execute a more efficient mounting process. Here, the “mounting state” may include, for example, a mounting position shift amount. “Mounting” includes placing, mounting, inserting, joining, adhering components, etc. on a substrate.

  In the inspection control apparatus of the present invention, the output control means may notify the mounting processing apparatus to perform a predetermined calibration process as the countermeasure process. In this way, it is possible to correct the mounting position shift and the like by executing the calibration process for correcting the position shift of the components in the entire mounting processing apparatus as a countermeasure process, and thus execute a more efficient mounting process. be able to. Here, in the “calibration process”, for example, a process for adjusting the actual moving distance to the reference distance based on the measured value of the moving distance of the moving means for moving the component on the substrate on the substrate and the reference distance is performed. It may be a thing.

  In the inspection control apparatus of the present invention, the statistical means may obtain a variance value based on the deviation amount of the component as the statistical information. Since the variance value based on the amount of component displacement in each mounting processing apparatus reflects the displacement of the entire component mounted in the mounting processing device, it can correspond to, for example, mounting position displacement due to thermal expansion of the apparatus member. As a result, more efficient mounting processing can be executed.

  In the inspection control apparatus of the present invention, the countermeasure determination range may be determined based on a deviation amount of the component that is smaller than an error range determined as a mounting error by the inspection apparatus. In this way, since it is possible to execute the handling process based on the statistical information for each mounting processing apparatus before the mounting error is determined, more efficient mounting processing can be performed.

  The inspection control apparatus of the present invention may be mounted on the inspection apparatus. In this case, since the inspection apparatus also serves as the inspection control apparatus, a more efficient mounting process can be executed by omitting the configuration.

  The mounting system according to the present invention includes one or more mounting processing devices that execute mounting processing for mounting one or more components on a substrate, and an inspection device that executes inspection processing for inspecting the mounting state of the components subjected to the mounting processing. The inspection control device according to any one of the above. Since this mounting system includes the above-described inspection control apparatus, more efficient mounting processing can be executed. Moreover, if the aspect of any one of the inspection control apparatuses described above is employed, an effect corresponding to the aspect employed can be obtained.

  In the mounting system of the present invention, when the mounting processing apparatus acquires a notification to perform the handling process, the mounting processing apparatus performs the calibration process using a moving distance and a reference distance of a moving unit that moves the component onto the board. It is good. In this way, the mounting processing apparatus can execute the calibration process based on the statistical information of the entire mounting processing apparatus. Therefore, by making the execution frequency of the calibration process more appropriate, more efficient mounting processing can be performed. Can be executed.

The inspection control method of the present invention includes:
In a mounting system comprising: one or more mounting processing devices that execute mounting processing for mounting one or more components on a substrate; and an inspection device that executes inspection processing for inspecting a mounting state of the mounted components. An inspection control method for processing information in the inspection process,
(A) obtaining statistical information of the mounting state for each mounting processing device based on the result of the inspection processing;
(B) notifying the corresponding mounting processing device to perform a handling process when the statistical information is out of a predetermined handling determination range;
Is included.

  In this inspection control method, similar to the above-described inspection control device, since the statistical information for each mounting processing device is obtained, statistical information reflecting the state of the mounting processing device can be obtained, and in the mounting processing device, The coping process related to the entire apparatus can be performed. Therefore, it is possible to perform the handling process more appropriately, and thus it is possible to execute a more efficient mounting process. In this inspection control method, various aspects of the above-described inspection control apparatus may be adopted, and steps for realizing each function of the above-described inspection control apparatus may be added.

The block diagram which shows the outline of a structure of the component mounting system 10 of this invention. 4 is a block diagram showing an electrical connection relationship of the component mounting system 10. FIG. The flowchart which shows an example of a mounting process routine. The flowchart which shows an example of an inspection process routine.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of a configuration of a component mounting system 10 according to an embodiment of the present invention. FIG. 2 is a block diagram illustrating an electrical connection relationship between the mounting processing device 20, the inspection device 50, and the management computer 80. The component mounting system 10 includes a plurality of mounting processing devices 20 that are connected to a LAN 12 as a network and mount one or more electronic components (components P) on a substrate S, and 1 that is connected to the LAN 12 and inspects the mounting state of the components P. The above-described inspection apparatus 50 and a management computer 80 that is connected to the LAN 12 and manages information related to the mounting of each mounting processing apparatus 20 are provided. The component mounting system 10 is connected to a plurality of mounting processing apparatuses 20 mounted with reels or the like that accommodate various components P, and is configured as a mounting line that transports the substrate S and mounts the components P. In addition, the component mounting system 10 includes one inspection device 50 for the plurality of mounting processing devices 20, and inspects the mounting state such as a shift or a defect of the component P mounted in the previous process. In FIG. 1, the component mounting system 10 includes three mounting processing devices 20 and one inspection device 50, but may include a further mounting processing device 20 and an inspection device 50. “Mounting” includes placing, mounting, inserting, joining, adhering the component P on the substrate S, and the like.

  As shown in FIG. 2, the mounting processing apparatus 20 includes a mounting machine controller 21 that controls the entire apparatus, and an input / output interface 26 that communicates with devices connected to the LAN 12. In addition, the mounting processing apparatus 20 includes a substrate processing unit 30 that performs transportation and fixing of the substrate S, a mounting processing unit 32 that performs processing for placing the component P on the substrate S, and a reel as units for performing the mounting processing. And a supply unit 38 for supplying the component P accommodated in the tray to a predetermined take-out position, and a camera unit 39 for imaging the adsorbed component P.

  The mounting machine controller 21 is configured as a microprocessor centered on the CPU 22, and includes a ROM 23 that stores processing programs, a RAM 24 that is used as a work area, an HDD 25 that stores various data, and exchange of electrical signals with connected units. An input / output interface 26 is provided, and these are connected via a bus. The mounting machine controller 21 outputs signals for controlling the substrate processing unit 30, the mounting processing unit 32, the supply unit 38, and the camera unit 39, and sends information to an external device such as the management computer 80 via the input / output interface 26. Or send. The mounting machine controller 21 acquires image data captured by the camera unit 39 and receives information from an external device such as the management computer 80 via the input / output interface 26. The HDD 25 stores mounting condition information including conditions for mounting the component P on the substrate S. The input / output interface 26 is also configured as an interface for exchanging information with an external device connected to a network or the like, and transmits information to the LAN 12 and receives information from the LAN 12.

  The mounting machine controller 21 includes a mounting control unit 27 and a calibration processing unit 28 as functional blocks. The mounting control unit 77 executes a process of mounting the component P based on mounting condition information including conditions such as the size and arrangement position of each component P. The mounting condition information includes, for example, information such as the shape and size of the component P and the arrangement position on the substrate S, and is managed by the management computer 80. The calibration processing unit 28 has a function of executing a calibration process relating to the movement of the mounting head 33 and the operation of the suction nozzle 34. For example, the calibration processing unit 28 moves the mounting head 33 over a movement region from a predetermined movement start position to a movement stop position, measures the movement distance with a counter, and sets the length of the movement region. Based on the height (reference distance) and the counter value (measured distance), the amount of movement of the mounting head 33 is adjusted so that the mounting head 33 is positioned at an appropriate position. That is, the calibration processing unit 28 performs a calibration process using the moving distance of the head moving unit 35 that moves the component P onto the substrate S and the reference distance. This calibration process may be performed in the X-axis, Y-axis, and Z-axis directions.

  The substrate processing unit 30 includes a substrate transport unit that transports the substrate S to a predetermined mounting position where the component P is disposed, and a substrate holding unit that fixes the transported substrate S at the mounting position. The substrate transport unit is configured as a device that transports the substrate S by a belt conveyor, for example, and includes a guide member provided in each of the pair of side frames and a conveyor belt provided in each of the pair of side frames. And a belt rotating device that drives the conveyor belt to rotate. The substrate holding unit is disposed at each predetermined mounting position, and includes, for example, a support device that supports the substrate S from below and a clamp device that clamps the edge of the substrate S.

  The mounting processing unit 32 includes a mounting head 33, a suction nozzle 34 attached to the mounting head 33 via a nozzle holder, and a head moving unit 35 that moves the mounting head 33 in the XY directions. As shown in FIG. 1, the mounting head 33 incorporates a Z-axis motor 44, and adjusts the height of the suction nozzle 34 attached to the ball screw 46 in the Z-axis direction by the Z-axis motor 44. Note that the XY direction refers to two orthogonal directions in the horizontal plane, and the Z axis refers to a vertical axis (see FIG. 1). The suction nozzle 34 uses pressure to suck the component P at the nozzle tip, or to release the component P sucked at the nozzle tip. A pipe (not shown) is connected to the suction nozzle 34. When the component P is sucked to the nozzle tip, negative pressure is supplied to the nozzle tip through the pipe, and the component P sucked to the nozzle tip is removed. When separating, a positive pressure is supplied to the tip of the nozzle through a pipe. The suction nozzle 34 can be replaced with one that matches the size and shape of the component P. The head moving unit 35 includes an X-axis slider 36 that can move in the X direction, a Y-axis slider 37 that can move in the Y direction, a pair of upper and lower guide rails 40 and 40 that extend in the left-right direction, and a left-right that extends in the front-rear direction. A pair of guide rails 42 and 42 are included. The X-axis slider 36 is attached to the front surface of a Y-axis slider 37 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 37 is slidably attached to the guide rails 42 and 42. The guide rails 42 and 42 are fixed inside the component mounter 11. Guide rails 40 and 40 are provided on the front surface of the Y-axis slider 37, and an X-axis slider 36 is slidably attached to the guide rails 40 and 40 in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 36 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 37 moves in the front-rear direction. Each slider 36, 37 is driven by a drive motor.

  The supply unit 38 includes a reel supply unit that supplies the component P from the reel. The reel supply unit includes a mounting unit for mounting the reel, a tape feeder unit that feeds the tape from the wound reel to a suction position, and a cutting unit that cuts and removes the tape from which the component P has been taken out. By this reel supply unit, the part P accommodated in the reel is sent out to the take-out position where it is picked up by the suction nozzle 34. In addition to the reel supply unit, the mounting processing device 20 can be replaced with a tray supply unit that accommodates a plurality of trays on which a plurality of components P are placed. The tray supply unit includes a mounting unit that mounts a magazine cassette containing a plurality of trays, and a tray moving unit that sends out a desired tray from the magazine cassette mounted in the mounting unit.

  The inspection apparatus 50 is an apparatus that is connected to the rear stage side of the mounting processing apparatus 20 and inspects the mounting state of the mounted component P. As shown in FIG. 2, the inspection apparatus 50 includes an inspection machine controller 51 that controls the entire apparatus, and an input / output interface 56 that communicates with devices connected to the LAN 12. In addition, the inspection device 50 detects and determines the mounting state by imaging the component P on the substrate S and the substrate processing unit 60 that performs transportation and fixing of the mounted substrate S as a unit that performs inspection processing. And an inspection processing unit 62.

  The inspection machine controller 51 is configured as a microprocessor centered on a CPU 52. The ROM 53 stores a processing program, the RAM 54 is used as a work area, the HDD 55 stores various data, and exchanges electrical signals with connected units. An input / output interface 56 is provided, and these are connected via a bus. The inspection machine controller 51 outputs a signal for controlling the substrate processing unit 60 and the inspection processing unit 62, and transmits information to an external device such as the management computer 80 via the input / output interface 56. The inspection machine controller 51 receives information from an external device such as the management computer 80 via the input / output interface 56. The HDD 55 stores inspection condition information including an inspection condition of the component P mounted on the substrate S, inspection result information including an inspection result such as a deviation amount of the component P associated with the substrate S, and the like. . The inspection condition information includes, as inspection conditions, for example, imaging conditions of the inspection processing unit 62, moving conditions for moving the imaging unit 63, inspection areas (XY coordinates) in which the inspection apparatus 50 is in charge, types of parts, Information such as the arrangement position (XY coordinates) of the component, the number of components, the shape data of the component, and the size of the component is included. The inspection condition information 43 is stored in the inspection apparatus 50 and is also stored and managed in the management computer 80. The input / output interface 56 is also configured as an interface for exchanging information with an external device connected to a network or the like, and transmits information to the LAN 12 and receives information from the LAN 12.

  The inspection machine controller 51 includes an inspection control unit 57, an inspection determination unit 58, a statistical processing unit 66, and an output control unit 67 as functional blocks as the inspection control device of the present invention. The inspection control unit 57 performs a process of imaging the substrate S by the imaging unit 63 based on inspection condition information including conditions such as the size and arrangement position of each component P. The inspection determination unit 58 compares the captured image of the component P with the image for determination of the component P that is normally arranged to determine whether or not the component P is normally mounted (the position of the component P is appropriate). Whether or not there is) is executed. The statistical processing unit 66 executes processing for obtaining statistical information on the mounting state of each mounting processing device 20 based on the result of the inspection processing. The statistical processing unit 66 obtains a variance value based on the deviation amount of the component P as statistical information. The output control unit 67 executes a process of notifying the corresponding mounting processing device 20 via the input / output interface 56 so that the calibration process is performed as a countermeasure process when the obtained statistical information is out of a predetermined countermeasure determination range. To do. Note that the handling determination range is determined based on an amount that is smaller than an error range that is determined to be a mounting error by the inspection device 50 when compared as a deviation amount.

  The substrate processing unit 60 includes a substrate transport unit that transports the substrate S to a predetermined inspection position, and a substrate holding unit that fixes the transported substrate at the mounting position. Since the configuration of the substrate processing unit 60 is the same as that of the substrate processing unit 30, the description thereof is omitted here. The inspection processing unit 62 includes an imaging unit 63 including a digital camera that captures an image of the component P mounted on the substrate S, and an imaging unit to a position where the component P on the substrate S to be inspected can be imaged. An X-axis slider 64 and a Y-axis slider 65 that move 63 are provided. The imaging unit 63 includes an illuminating unit that irradiates the component P with light, an imaging element that generates charges by receiving light and outputs the generated charges, and an image processing unit that generates image data based on the output charges. ing. The X-axis slider 64 and the Y-axis slider 65 have the same mechanism as the X-axis slider 36 and the Y-axis slider 37 of the head moving unit 35 described above. Similar to the mounting head 33, the imaging unit 63 moves in the left-right direction as the X-axis slider 64 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 65 moves in the front-rear direction. To do. Each slider 64, 65 is driven by a drive motor.

  The management computer 80 is configured as a server that manages a plurality of mounting processing apparatuses 20, and as shown in FIG. 2, a management controller 81 that controls the entire apparatus, and a keyboard and a mouse for inputting various commands by an operator , An input device 82 for displaying various information, and an input / output interface 86 for communicating with external devices such as the mounting processing device 20 and the inspection device 50. The management computer 80 manages mounting condition information corresponding to each mounting processing apparatus 20, inspection condition information corresponding to each inspection apparatus 50, and the like.

  Next, the operation of the component mounting system 10 of the present embodiment configured as described above, first, the mounting processing for mounting the component P on the substrate S by the mounting processing apparatus 20 will be described. FIG. 3 is a flowchart illustrating an example of a mounting process routine executed by the mounting machine controller 21 of the mounting processing apparatus 20. This routine is stored in the HDD 25, and is executed after a mounting process execution input is made by an operator on a mounting process screen (not shown). This routine is executed using each functional block or each unit of the mounting machine controller 21. When this routine is started, the CPU 22 of the mounting machine controller 21 first acquires mounting condition information from the management computer 80 and stores it in the HDD 25 (step S100). Next, the CPU 22 determines whether or not a calibration processing execution command has been acquired from the inspection device 50 (step S110). When the execution instruction for the calibration process is acquired, the CPU 22 executes the calibration process (step S120). In the calibration process, the calibration processing unit 28 moves the mounting head 33 by a predetermined reference distance, and the mounting head 33 is positioned at an appropriate position based on the measured moving distance (measured distance) and the reference distance. Thus, the movement amount of the mounting head 33 is adjusted. For example, if the mounting processing is continued in the mounting processing device 20, the guide rail 40, the guide rail 42, and the like may thermally expand due to the heat of the device. Here, the shift in the movement of the mounting head 33 due to this thermal expansion or the like is corrected by a calibration process.

  After executing the calibration process, or when the calibration process execution command has not been acquired in step S110, the CPU 22 executes the transfer and fixing process of the substrate S (step S130) and sucks it (mounts it on the substrate S). ) The component P is set (step S140). The mounting order of the component P is obtained by reading information stored in the mounting condition information. Next, the CPU 22 executes a component P mounting process (step S150). In the mounting process, the CPU 22 moves the mounting head 33 to the extraction position of the component P arranged on the substrate S based on the extraction position, arrangement position, movement condition, etc. of the component P stored in the mounting condition information. Then, the CPU 22 supplies negative pressure to the suction nozzle 34 to suck the component P, moves the mounting head 33 to the arrangement position of the substrate S, and then supplies positive pressure to the suction nozzle 34 to place the component P. To be mounted at the position. At this time, when the calibration process is performed, the mounting head 33 can move the component P to a more appropriate position.

  Subsequently, the CPU 22 determines whether or not the mounting process of the current board S has been completed based on whether or not all the components P to be mounted on the board S are mounted by the mounting processing apparatus 20 (step S160). When the process is not completed, the processes after step S140 are executed. That is, the CPU 22 discharges the substrate S or transports a new substrate S, sets the components P to be mounted according to the predetermined order of the components P, and executes the mounting process. On the other hand, when the mounting process is completed in step S160, the CPU 22 carries out the mounted board S (step S170), and whether or not the production has been completed is performed for all the boards S. Based on the determination (step S180). When the production is not completed, the CPU 22 repeats the processes after step S110. That is, when the production is not completed, if there is a calibration processing execution command, the calibration processing is executed and the mounting processing is executed. On the other hand, when this process is executed for all the substrates S, the CPU 22 ends this routine as it is.

  Next, an inspection process in which the inspection apparatus 50 inspects the substrate S on which the component P is mounted will be described. FIG. 4 is a flowchart illustrating an example of an inspection processing routine executed by the inspection machine controller 51 of the inspection apparatus 50. This routine is stored in the HDD 55 of the inspection apparatus 50 and executed when the substrate S for which the previous mounting process has been completed is transported. Here, the point which inspects about the deviation | shift amount of the components P on the board | substrate S is demonstrated mainly. When this routine is started, the CPU 52 of the inspection machine controller 51 first reads the inspection condition information to acquire the inspection condition (inspection range, etc.) (step S200), and executes the transport and fixing process of the substrate S (step S200). Step S210). Next, the CPU 52 moves the imaging unit 63 to a position where the component P arranged on the substrate S can be photographed based on the inspection conditions such as the mounting position of the component P and the imaging condition stored in the inspection condition information. The component P mounted on the board S in the inspection range is imaged (step S220).

  Next, the CPU 52 sets a determination target component P to be inspected among one or more components P in the imaged range (step S230), calculates a deviation amount of the set component P, and stores it in the RAM 54. Store (step S240). The inspection order of the component P is acquired by reading information stored in the inspection condition information. The amount of deviation is calculated, for example, by determining the distance between the coordinates of the center point on the substrate S where the part P is placed and the coordinates of the center point of the part P on the image. Next, the CPU 52 determines whether or not the calculated deviation amount is within a predetermined error range (step S250). For example, the error range may be determined in such a range that a deviation amount (such as a coordinate difference) that causes a problem when the substrate S is completed is empirically obtained. When the deviation amount is within the error range, that is, when the deviation amount exceeds a predetermined allowable amount, the CPU 52 displays an abnormality display screen notifying that there is an abnormality in the component P mounted on the board S. Displayed on the display unit (step S260), the deviation amount and the abnormal state of the component P determined to be abnormal are stored in the inspection result information (step S270).

  After step S270 or when the deviation amount of the component P is not within the error range in step S250, the CPU 52 determines whether or not the inspection of the current substrate S is completed (step S280), and the inspection is completed. When there is not, the process after step S230 is performed. That is, the next determination target part P is set, and it is determined whether the arrangement position of the part P is an error based on the deviation amount of the part P. On the other hand, when the inspection of the current substrate S is completed in step S280, the CPU 52 ejects the inspected substrate S (step S290), and sets a variance value for each mounting processing device 20 on which each of the inspected components P is mounted. A calculation process is performed (step S300). Here, it is assumed that the variance value of the mounting processing device 20 is calculated from the deviation amounts of all the components P mounted by one mounting processing device 20.

  Subsequently, the CPU 52 sets the mounting processing apparatus 20 to be determined (step S310), and determines whether or not the set variance value of the mounting processing apparatus 20 is outside a predetermined handling determination range (step S320). . This countermeasure determination range can be determined empirically, for example, as a dispersion value within a range in which it can be determined that the entire mounted component P has a certain amount of deviation and the calibration process should be executed. For example, when the member of the mounting processing unit 32 of the mounting processing device 20 is thermally expanded due to continuous use, the mounted component P is mounted in a state of being shifted to some extent over the whole. Here, by using a variance value, it is distinguished from a deviation of only one component, and the component mounting deviation due to this thermal expansion is determined. This countermeasure determination range is for performing calibration processing before a mounting deviation that is determined to be a mounting error, and is smaller than the error range determined to be a mounting error when compared as a deviation amount. It is determined based on the quantity. When it is determined that the set variance value of the mounting processing device 20 is outside the predetermined handling determination range, the CPU 52 determines that the corresponding mounting processing device 20 should perform calibration processing, A calibration process execution command is output (step S330). In the mounting processing apparatus 20 that has received the calibration processing execution command, the calibration processing is executed.

  After step S330 or when it is determined in step S320 that the variance value is not outside the predetermined countermeasure determination range, that is, the variance value is within the predetermined countermeasure determination range, the CPU 52 determines all the implementation processes that are the determination targets. It is determined whether or not the variance value has been determined for the device 20 (step S340). When the determination has not been completed for all the mounting processing apparatuses 20, the CPU 52 executes the processes after step S310. That is, the CPU 52 sets the next determination target (the mounting processing apparatus 20), and outputs a calibration processing execution command when the variance value is outside the handling determination range. On the other hand, when the determination is completed for all the mounting processing devices 20, the CPU 52 ends this routine as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The statistical processing unit 66 of the present embodiment corresponds to statistical means of the present invention, the output control unit 67 corresponds to output control means, and the variance value corresponds to statistical information. In the present embodiment, an example of the mounting system and the inspection control method of the present invention is also clarified by describing the operation of the component mounting system 10.

  According to the component mounting system 10 described above, the dispersion value (statistical information) of the mounting state for each mounting processing device 20 is obtained based on the result of the inspection processing, and when the dispersion value is out of the predetermined countermeasure determination range, The mounting processing device 20 is notified to perform the calibration process (coping process). In the mounting processing device 20, for example, when the mounting processing is continued, the mounting position may be shifted due to thermal expansion of a member of the mounting processing device. Such a shift in the mounting position affects the entire component P mounted by the mounting processing device 20, and thus the state of the mounting processing device 20 can be grasped by obtaining a dispersion value for each mounting processing device 20. In the mounting processing device 20, calibration processing can be performed. Therefore, the calibration process as the countermeasure process can be performed more appropriately, and as a result, a more efficient mounting process can be executed. Further, by performing the calibration process for correcting the positional deviation of the component P in the entire mounting processing apparatus as a countermeasure process, it is possible to correct the positional deviation of the mounting position, and thus to execute a more efficient mounting process. Can do. Further, since the variance value based on the deviation amount of the component P is obtained as statistical information, it is possible to cope with, for example, a deviation in the mounting position due to thermal expansion of the apparatus member, and thus more efficient mounting processing is executed. be able to.

  In addition, since the handling determination range is determined based on an amount that is smaller than the error range determined to be a mounting error by the inspection device 50, the variance value for each mounting processing device 20 is determined before the mounting error is determined. Can be executed, and more efficient mounting processing can be executed. Furthermore, since the inspection control apparatus is mounted on the inspection apparatus 50, and the inspection apparatus 50 also serves as the inspection control apparatus, a more efficient mounting process can be executed by omitting the configuration. Furthermore, since the calibration processing of the mounting processing device 20 is executed based on the variance value of the whole mounting processing device 20, more efficient mounting processing is executed by making the execution frequency of the calibration processing more appropriate. can do.

  In addition, since the component mounting system 10 aggregates statistical information (distributed values) from the inspection results, the operator does not need to investigate the cause of the error or operate the mounting processing device 20, so that the efficiency of the mounting processing is improved. Good. Furthermore, based on the dispersion value for each mounting processing device 20, only the specific mounting processing device 20 can perform calibration processing, and it is not necessary to stop the entire production line, so that mounting processing can be performed more efficiently. Furthermore, since the calibration process is executed at an appropriate timing, the execution of unnecessary calibration processes is suppressed more efficiently than, for example, a case where the calibration process is periodically performed without grasping the state of the apparatus. Implementation process can be executed. And since a calibration process is performed for every mounting processing apparatus 20 at a suitable timing, the shift | offset | difference of the components P can be suppressed to the minimum and the production of a mounting board with few defects can be performed. Further, in the component mounting system 10, it is generally considered to employ a method of feeding back the inspection result in the inspection device 50 to the mounting processing device 20. At this time, if the inspection apparatus 50 misrecognizes, incorrect data is fed back to the mounting processing apparatus 20 side, which may cause unnecessary mounting displacement. In the component mounting system 10 of the present invention, the mounting processing device 20 only performs a calibration process, and does not perform feedback of a control value change that prevents mounting displacement from the inspection device 50 to the mounting processing device 20. For this reason, even if the inspection apparatus 50 misrecognizes, the mounting system on the mounting processing apparatus 20 side is not affected.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the inspection control device of the present invention is included in the inspection machine controller 51 and mounted on the inspection device 50. It may be mounted on any device, for example, may be mounted on the management computer 80 or may be mounted on another computer. Moreover, you may mount in either of the mounting processing apparatuses 20. FIG. Even in this case, since the handling processing of the mounting processing apparatus can be performed based on the statistical information, the handling processing can be performed more appropriately, and thus more efficient mounting processing can be executed.

  In the embodiment described above, the calibration of the mounting head 33 in the X and Y directions has been described as the handling process. However, the present invention is not particularly limited, and for example, the mounting head 33 may be calibrated in the Z-axis direction, The unit 30 may be calibrated. Even in this case, the same effect as that of the above-described embodiment can be obtained.

  In the embodiment described above, the variance value is obtained as the statistical information. However, for each mounting processing device 20, other statistical information capable of grasping the state of the specific mounting processing device 20 may be used. Even in this case, since the state can be grasped for each mounting processing device 20, the countermeasure processing can be executed for each mounting processing device 20.

  In the above-described embodiment, the dispersion value is obtained by statistically processing the deviation amounts of the positions of all the components mounted by each mounting processing device 20, but the present invention is not particularly limited thereto, and the mounting positions of some components are not limited thereto. The variance value may be obtained by statistically processing the deviation amount. For example, it is possible to sample a deviation amount of a part of all the parts that is a representative point and statistically process the sampled deviation amount to obtain a variance value. Even in this case, since the tendency of the variance value in each mounting processing apparatus can be grasped, the countermeasure processing can be performed more appropriately, and thus more efficient mounting processing can be executed.

  The functional blocks of the mounting machine controller 21 and the inspection machine controller 51 described above may be realized by executing software by a CPU, or may be configured by hardware using a circuit or the like.

  In the above-described embodiment, the component mounting system 10 including the mounting processing apparatus and the inspection apparatus according to the present invention has been described. However, the present invention is not particularly limited thereto, and may be in the form of an inspection control apparatus, an inspection control method, or a program thereof.

  The present invention can be used in the field of mounting electronic components.

DESCRIPTION OF SYMBOLS 10 Component mounting system, 12 LAN, 20 Mounting processing apparatus, 21 Mounting machine controller, 22 CPU, 23 ROM, 24 RAM, 25 HDD, 26 Input / output interface, 27 Mounting control part, 28 Calibration processing part, 30 Substrate processing unit, 32 Mounting processing unit, 33 Mounting head, 34 Suction nozzle, 35 Head moving part, 36 X axis slider, 37 Y axis slider, 38 Supply unit, 39 Camera unit, 40 Guide rail, 42 Guide rail, 44 Z axis motor, 46 Ball screw, 50 inspection device, 51 inspection machine controller, 52 CPU, 53 ROM, 54 RAM, 55 HDD, 56 input / output interface, 57 inspection control unit, 58 inspection determination unit, 60 substrate processing unit, 62 inspection processing unit, 63 imaging , 64 X-axis slider, 65 Y-axis slider 66 statistical processing unit, 67 an output control unit, 80 management computer, 81 management controller, 82 input device, 84 display, 86 input and output interface, P parts, S substrate.

Claims (6)

When a mounting process for mounting one or more components on a board is executed , and a notification for performing a predetermined calibration process is obtained from an inspection apparatus that inspects the mounting state of the components that have been mounted on the board, the components are placed on the board. A control unit for performing calibration processing of the moving unit to be moved to
A mounting processing apparatus.   The control unit determines whether or not the calibration process execution command is acquired from the inspection apparatus as the notification at the start of the mounting process, and when it is determined that the execution command is acquired, the control unit precedes the mounting process. The mounting processing apparatus according to claim 1, wherein the calibration processing is executed.   When the control unit determines whether or not the calibration processing execution command is acquired from the inspection apparatus as the notification when the board on which the component is mounted is unloaded, and the execution command is acquired. The mounting processing apparatus according to claim 1, wherein the calibration processing is executed prior to the mounting processing.   The control unit executes, as the calibration process, a process of adjusting an actual moving distance to the reference distance based on a measured value and a reference distance of a moving distance of a moving unit that moves a component in the mounting processing apparatus onto a substrate. The mounting processing apparatus according to any one of claims 1 to 3.   The control unit is output from the inspection apparatus when the statistical information of the mounting state obtained based on the result of the inspection processing of the mounting state of the component mounted on the board is out of a predetermined countermeasure determination range. The mounting processing apparatus of any one of Claims 1-4 which acquires the notification which performs the said predetermined | prescribed calibration process.   A method for controlling a mounting processing apparatus that executes mounting processing for mounting one or more components on a board,
Performing a calibration process of a moving unit that moves the component onto the substrate when a notification of performing a predetermined calibration process is obtained from an inspection apparatus that inspects the mounting state of the component that has been mounted on the substrate;
  A method for controlling a mounting processing apparatus including:

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