JP7105306B2 - inspection equipment - Google Patents

Description

An inspection device is disclosed herein.

Conventionally, there has been known a mounting apparatus provided with a mounting unit that picks up a component and mounts it on a base material such as a substrate (for example, Patent Document 1). A mounting unit described in Patent Document 1 includes a suction nozzle that suctions a component, a syringe member to which the suction nozzle is attached, and a Q-axis motor. The Q-axis motor rotates the syringe member and the suction nozzle via a plurality of gears or the like to adjust the angle of the component.

Retable 2016/189684

By the way, in such a mounting apparatus, there has been a demand for detecting an abnormality in a gear, syringe member, or the like. For example, an abnormality in a motor may be detected based on the current value of the motor. It is also conceivable to indirectly detect an abnormality in the gear or syringe member by detecting an abnormality in the motor caused by the abnormality. However, such a method is insufficient for detecting abnormalities in members other than the motor, such as gears and syringe members.

The present disclosure has been made to solve the above-described problems, and has a main purpose of facilitating detection of an abnormality other than the drive source in the rotation mechanism of the component mounting apparatus.

The present disclosure has taken the following means to achieve the above-described main objectives.

The inspection device of the present disclosure includes:
A mounting head unit, in a component mounting apparatus for mounting components on a board, comprising a rotating mechanism having a component holding portion for holding the component and a drive source for outputting a driving force for rotating the component holding portion, An inspection device for inspecting for abnormalities in
A first rotational position, which is a rotational position of a first portion of the rotating mechanism on the drive source side, is acquired from a first rotational position detection unit provided in the inspection device or provided in the mounting head unit, and the inspection device acquires A second rotational position, which is the rotational position of a second portion of the rotating mechanism that is farther from the drive source than the first portion of the rotating mechanism, is obtained from a second rotational position detecting portion provided by the mounting head unit. an abnormality determination unit that determines an abnormality of the rotation mechanism based on the acquired first and second rotation positions;
is provided.

In this inspection device, the abnormality determination unit determines the rotation based on the first rotation position of the first portion of the rotation mechanism on the drive source side and the second rotation position of the second portion farther from the drive source than the first portion. Judge the abnormality of the mechanism. Therefore, this inspection apparatus can easily detect an abnormality in a portion of the rotation mechanism that is farther from the drive source than the first portion, compared to a case where an abnormality in the rotation mechanism is determined based only on the operation of the drive source. Therefore, this inspection apparatus can easily detect an abnormality other than the drive source in the rotation mechanism of the component mounting apparatus.

Here, the first portion may be the drive source. The second portion may be the component holding portion, or may be a position detecting member temporarily attached to the rotating mechanism. The abnormality determination section may determine the abnormality based on the first and second rotational positions when the drive source is driven.

1 is a schematic explanatory diagram of a mounting system 10; FIG. FIG. 2 is a perspective view showing an outline of a mounting head unit 17; FIG. 4 is an explanatory diagram of a mounting head unit 17; FIG. 2 is a block diagram showing an electrical connection relationship of the mounting apparatus 11; FIG. 7 is an explanatory diagram of a second rotational position detector 74; 4 is a perspective view of a second rotational position detection portion 74 and a cord portion 73; FIG. 4 is a flowchart showing an example of an inspection processing routine; FIG. 4 is an explanatory diagram of an inspection using a position detection member 142 instead of the suction nozzle 42;

An embodiment of an inspection apparatus of the present disclosure will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 including a mounting apparatus 11, which is an embodiment of an inspection apparatus. FIG. 2 is a perspective view showing an outline of the mounting head unit 17. As shown in FIG. 3A and 3B are explanatory diagrams of the mounting head unit 17. FIG. 3A is a side view of the mounting head 50, and FIG. 3B is a bottom side view. FIG. 4 is a block diagram showing electrical connections of the mounting apparatus 11. As shown in FIG. 5A and 5B are explanatory diagrams of the second rotational position detection section 74, FIG. 5A is an explanatory diagram showing the movement of the mounting head unit 17 to the inspection position, and FIG. It is an explanatory view of the state moved to . FIG. 6 is a perspective view of the second rotational position detection section 74 and the cord section 73 in a state of being moved to the inspection position. The mounting system 10 of this embodiment includes a mounting device 11 that mounts a component P (see FIG. 2) on a board S, and a management computer 90 that manages information (eg, production program) regarding the mounting process. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. Further, the mounting processing includes processing for arranging, mounting, inserting, joining, and adhering the component P on the substrate S. FIG.

The mounting apparatus 11 includes a base 11a, a mounting processing unit 12 arranged and supported on the base 11a, and a control device 80 (see FIG. 4) that executes various controls. The mounting processing unit 12 includes a board transport unit 14 that transports the board S, a board support unit 15 that supports the board S from the bottom side, and a mounting head unit 17 that picks up (collects) the component P and places it on the board S. , and a head moving unit 16 for moving the mounting head unit 17 in the XY directions (see FIG. 1). The mounting processing unit 12 includes a supply unit 18 to which reels containing components P are mounted, an operation panel 19 including a display unit 24 for displaying a display screen, and an operation unit 25 for allowing the operator to perform various input operations, and ( See FIG. 4). The mounting processing unit 12 includes a parts camera 35 for photographing the parts P sucked by the suction nozzles 42 from below when the mounting head unit 17 passes above, and a plurality of storage holes capable of storing a plurality of types of suction nozzles 42. and a nozzle stocker 36 having The mounting processing unit 12 also includes a second rotational position detector 74 used to detect the rotational position of the rotation mechanism 59 of the mounting head unit 17 (see FIGS. 4 to 6).

The substrate transport unit 14 transports the substrate S from left to right by conveyor belts 22, 22 attached to a pair of front and rear support plates 21, 21, respectively. The substrate support unit 15 includes a plurality of support pins 23 that support the substrate S from below, and supports the substrate S transported and fixed by the substrate transport unit 14 from the back side thereof.

The head moving unit 16 includes an X-axis slider 26, a Y-axis slider 30, and the like. The X-axis slider 26 is attached so as to be slidable in the left-right direction on the front surface of the Y-axis slider 30 that is slidable in the front-rear direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. Note that the guide rails 32 , 32 are fixed inside the mounting device 11 . A pair of upper and lower guide rails 28, 28 extending in the horizontal direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the horizontal direction. The mounting head unit 17 moves in the horizontal direction as the X-axis slider 26 moves in the horizontal direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26, 30 is driven by a driving motor (not shown).

The mounting head unit 17 is attached to the front surface of the X-axis slider 26 . The mounting head unit 17 includes a head holding body 40 arranged on the X-axis slider 26 and holding a mounting head 50, a suction nozzle 42 for sucking a component P, and one or more suction nozzles 42. 50 and . As shown in FIG. 3, the head holder 40 includes a holder main body 45 attached to the X-axis slider 26 and an engaging shaft 46 arranged downward from the holder main body 45 . The engaging shaft 46 is axially rotatably disposed in the holder main body 45 , is inserted into a bottomed hole formed in the center of the mounting head 50 , and engages with the mounting head 50 . An R-axis motor 60 , a Q-axis motor 63 , and a Z-axis motor 66 for rotating the mounting head 50 are arranged in the holder main body 45 . The Q-axis motor 63 is provided with a first rotational position detector 64 that detects the rotational position (referred to as the first rotational position) of the Q-axis motor 63 (see FIG. 3). Based on the first rotational position detected by the first rotational position detector 64, the rotation of the Q-axis motor 63 is controlled. The first rotational position detector 64 may be, for example, a transmissive optical encoder. The Z-axis motor 66 raises and lowers the suction nozzle 42 by moving the horizontal portion 68 along a Z-axis guide 67 extending vertically downward. The rotation axis of the mounting head 50 (rotary portion 51) is called the R-axis, and the rotation axis of the suction nozzle 42 (component holding portion 55) is called the Q-axis.

The head holder 40 holds the mounting head 50 . The mounting head 50 has, for example, 16 component holders 55, and can mount 16 suction nozzles 42 (see FIGS. 2 and 3). The mounting head 50 is configured as a rotary work head that is rotatably held by the head holder 40 . The mounting head 50 includes a rotary portion 51 which is a cylindrical member, an R-axis gear 52 arranged below the rotary portion 51, a Q-axis gear 53 arranged above the rotary portion 51, and a A plurality of long cylindrical syringe members 56 to which the suction nozzles 42 are attached are provided. The mounting head 50 has a vertically movable component holder 55 having a suction nozzle 42 for picking up the component P and a syringe member 56 to which the suction nozzle 42 can be attached and detached. The mounting head 50 is held by the head holder 40 so as to be rotatable around a rotation axis (R axis), and has a rotary portion 51 having the same central axis as this rotation axis. The rotary portion 51 supports, for example, 16 syringe members 56 and allows the syringe members 56 to rotate around the central axis of the syringe members 56 and to move the syringe members 56 up and down. The R-axis gear 52 is a disk-shaped member having an outer diameter larger than that of the rotary portion 51, and has a gear groove formed on its outer peripheral surface. The R-axis gear 52 meshes with a small gear 62 connected to the rotation shaft of the R-axis motor 60 and is rotationally driven by the R-axis motor 60 via the small gear 62 . The Q-axis gear 53 is a cylindrical member having an outer diameter smaller than that of the rotary portion 51, and has a gear groove formed on its outer peripheral surface. The syringe member 56 is a member having a small gear 57 arranged on its upper end side and having the suction nozzle 42 mounted on its lower end side. The small gear 57 meshes with a gear groove formed on the outer periphery of the Q-axis gear 53 . The syringe members 56 are arranged along the outer circumference of the Q-axis gear 53 at regular intervals.

The suction nozzle 42 is a member that uses pressure to suck the component P onto the tip of the nozzle and release the component P that is sucked onto the tip of the nozzle. The suction nozzle 42 has a disc-shaped flange 43 and a tubular portion 44 formed on the tip side (see FIGS. 2, 3, 5 and 6). The flange 43 has a cord portion 73 formed around its circumference. The code portion 73 is used for detecting the rotational position of the flange 43 by a second rotational position detection portion 74 to be described later. The suction nozzle 42 , the syringe member 56 and the small gear 57 constitute a component holding portion 55 . The component holding portion 55 is rotatable around the rotation axis (Q axis) and used to hold the component P. As shown in FIG. The component holding unit 55 (suction nozzle 42 ) is connected to a Q-axis motor 63 , a Q-axis gear 53 , and a Q-axis power transmitted through a small gear 57 provided on the upper end side of the syringe member 56 . The driving force of the motor 63 rotates (rotates) about the rotation axis, and the angle of the sucked part P can be adjusted. A mechanism from the Q-axis motor 63 as a drive source to the farthest member (here, the suction nozzle 42 ) from the Q-axis motor 63 among the members rotated by the driving force of the Q-axis motor 63 is called a rotation mechanism 59 . In this embodiment, the rotation mechanism 59 includes, in order from the drive source, the Q-axis motor 63, the small gear 65, the Q-axis gear 53, the component holding portion 55 (the small gear 57, the syringe member 56, and the suction nozzle 42). ), and The component holding portion 55 is moved up and down along the Z-axis guide 67 in the Z-axis direction (vertical direction) by the driving force of the Z-axis motor 66 transmitted through the horizontal portion 68 . In the mounting head 50, the component holder 55 is moved up and down in the Z-axis direction at one elevation position (see FIG. 3) located on the front end side of the mounting head unit 17 in the Y-axis direction. The suction nozzles 42 mounted on the mounting head 50 are appropriately automatically exchanged with the suction nozzles 42 stored in the nozzle stocker 36 so as to be appropriate according to the type of the substrate S and the type of the component P. . Here, the picking member for picking up the component P is described as the suction nozzle 42, but is not particularly limited as long as it can pick up the component P, and may be a mechanical chuck or the like that clamps and picks up the component P.

The second rotational position detector 74 detects the rotational position of the rotating mechanism 59 . The second rotational position detector 74 is attached to the base 11a via a prism-shaped fixing member 79 arranged to extend upward from the base 11a (see FIG. 5, shown in FIG. 1). omit). Thus, the second rotational position detector 74 is fixedly arranged in the mounting apparatus 11 independently of the mounting head unit 17 . The second rotational position detector 74 is arranged, for example, at a position outside the movement range of the mounting head unit 17 when mounting the component P on the substrate S, and arranged so as not to interfere with the mounting head unit 17 during mounting. may be When the mounting head unit 17 moves to a predetermined inspection position, the flange 43 of the suction nozzle 42 positioned at the up/down position among the plurality of suction nozzles 42 faces the second rotational position detection section 74 (see FIGS. 5B and 6). ). In this state, the second rotational position detector 74 horizontally faces the suction nozzle 42 from the outer peripheral side of the mounting head unit 17 (mounting head 50). With the mounting head unit 17 at the inspection position, the second rotational position detector 74 reads the code portion 73 of the opposing flange 43 to detect the rotational position of the flange 43 (referred to as the second rotational position). Specifically, the code portion 73 has a region that reflects the light emitted from the second rotational position detection portion 74 and a region that does not reflect the light. and a light receiving portion for receiving light reflected by the code portion 73 . The second rotational position detector 74 detects the rotational position of the flange 43 by irradiating the code portion 73 with light and detecting the pattern of reflected light from the code portion 73 . The second rotational position detection unit 74 detects the initial position of the suction nozzle 42 when the component holding unit 55 is moved up and down (see the solid line in FIG. 5B ) and the extended position of the suction nozzle 42 , that is, in the lowered state. (see the dotted line in FIG. 5B) and the position of (see the dotted line in FIG. 5B).

In this way, the mounting head unit 17 is moved to the inspection position and the second rotational position detection section 74 and the code section 73 are opposed to each other, so that the second rotational position detection section 74 and the code section 73 are optically reflective. Acts as an encoder. The second part (the flange 43 in this case) whose second rotational position is to be detected by the second rotational position detector 74 of the rotating mechanism 59 is detected by the first rotational position detector 64 of the rotating mechanism 59 at the first rotational position. It exists at a position farther from the Q-axis motor 63 than the first portion (here, the Q-axis motor 63) whose position is to be detected. The second rotational position detector 74 also detects the rotational position of the suction nozzle 42 , which is the farthest member of the rotation mechanism 59 from the Q-axis motor 63 .

As shown in FIG. 4, the control device 80 is configured as a microprocessor centered on a CPU 81, and includes a ROM 82 for storing processing programs, an HDD 83 for storing various data, a RAM 84 used as a work area, an external device and an electric An input/output interface 85 for exchanging signals is provided, and these are connected via a bus. The control device 80 is connected to the board transfer unit 14, the board support unit 15, the head moving unit 16, the mounting head unit 17, the supply unit 18, the operation panel 19, the parts camera 35, etc. so as to be capable of two-way communication. exchange signals with The control device 80 is electrically connected to the first and second rotational position detectors 64 and 74, acquires signals from these, and acquires the first and second rotational positions. The control device 80 acquires the production program from the management computer 90 and stores it in the HDD 83 .

Next, the operation of the mounting system 10 of this embodiment configured in this way will be described. First, the mounting process of the mounting apparatus 11 will be described. A mounting processing routine is stored in the HDD 83 of the control device 80 and executed by an operator's instruction to start production. When this routine is executed, the CPU 81 controls the board transport unit 14 and the board support unit 15 to transport the board S into the mounting apparatus 11 and fix it at the mounting position. Next, the CPU 81 reads out the production program, sets the parts P to be arranged on the substrate S, and performs the process of mounting the suction nozzles 42 for picking up the parts P on the head holder 40 . Next, the CPU 81 controls the head moving unit 16 and the mounting head unit 17 to cause the suction nozzle 42 to pick up the component P from the supply unit 18 and to place the component P on the board S. At this time, the CPU 81 causes the parts camera 35 to image the part P held by the suction nozzle 42, and recognizes the orientation (rotational position) of the part P based on the image obtained by the imaging. Then, the CPU 81 controls the Q-axis motor 63 as necessary so that the rotational position of the component P when the component P is placed on the substrate S is a predetermined rotational position (the correct rotational position determined by the production program). is controlled to adjust the rotational position of the component P, and then the component P is placed on the board S. Then, when the mounting process of the current board S is completed, this board S is ejected, and the next board S is brought in and fixed at the mounting position. The CPU 81 repeatedly executes the above-described processing until the production of all substrates S is completed.

Next, an inspection process for determining an abnormality in the rotation mechanism 59 of the mounting head unit 17, particularly an abnormality in the rotation mechanism 59 other than the Q-axis motor 63 will be described. FIG. 7 is a flow chart showing an example of an inspection processing routine executed by the CPU 81 of the control device 80. As shown in FIG. This routine is stored in the HDD 83 and is started when the mounting apparatus 11 is powered on, for example.

When the inspection processing routine is started, the CPU 81 first determines whether the inspection timing has come (step S100), and repeats the processing of step S100 until the inspection timing comes. The inspection timing can be a predetermined timing, but in this embodiment, the CPU 81 determines that it is the inspection timing every time a predetermined period of time has elapsed since the execution of the previous inspection (processing after step S110). For example, a time interval at which an abnormality is detected in the rotating mechanism 59 is empirically determined, and the CPU 81 may determine that it is time to inspect when the time interval has passed since the execution of the previous inspection. Alternatively, the CPU 81 determines, based on the production program, that an inspectable time zone (for example, a time zone during which the board S is being transported, fixed, or unloaded) during which the mounting head unit 17 is not involved in the mounting process arrives. A time interval may be derived, and the inspection timing may be determined for each time interval. In addition, the CPU 81 derives the time required to perform the mounting process for one board based on the production program, and determines the time required to complete the mounting process for a predetermined number of boards (for example, 10 boards, 20 boards, etc.). It is also possible to determine that it is the inspection timing for each time interval, with the time required for the inspection being set as a predetermined time interval. When determining that it is the inspection timing at each predetermined time interval, the CPU 81 may determine that it is the inspection timing when the predetermined time interval has passed and the inspection is possible.

When determining that it is the inspection timing in step S100, the CPU 81 moves the mounting head unit 17 to the inspection position (step S110). Next, the CPU 81 sets the component holding portion 55 to be inspected among the plurality of component holding portions 55 (step S120), and the flange 43 of the component holding portion 55 to be inspected faces the second rotational position detecting portion 74. The rotary portion 51 is rotated by the R-axis motor 60 so as to be located at the facing position (step S130). This enables the second rotational position detector 74 to detect the second rotational position of the rotating mechanism 59 including the component holding section 55 to be inspected. The CPU 81 may perform step S110 and step S130 in parallel, or may perform step S130 first.

Subsequently, the CPU 81 starts driving the Q-axis motor 63 (step S140). Here, the CPU 81 starts driving the Q-axis motor 63 so that the first rotation position of the Q-axis motor 63 becomes a predetermined target position. Subsequently, the CPU 81 derives the time T1 from the start of change in the first rotational position to the start of change in the second rotational position based on the signals from the first rotational position detector 64 and the second rotational position detector 74. (Step S150). Then, the CPU 81 determines whether the time T1 is included in the abnormal range or the normal range based on the derived time T1 and a predetermined threshold value (step S160). Here, when the driving of the Q-axis motor 63 is started, the rotation driving force is transmitted to the suction nozzle 42 as the Q-axis motor 63 rotates, and the first rotation position and the second rotation position also start to change. At this time, for example, if at least one of the small gear 65, the Q-axis gear 53, and the small gear 57 is worn, the second rotational position starts to change after the first rotational position starts to change (that is, the suction nozzle 42 starts rotating), the time T1 increases. Therefore, in the present embodiment, a threshold is set as a value that can detect wear to the extent that the gear needs to be replaced, for example, and the CPU 81 uses this threshold to make the determination in step S160. When the time T1 is within the abnormal range in step S160, the CPU 81 stores the content of the abnormality (for example, gear wear) based on the determination result in the HDD 83 (step S170).

When the time T1 is within the normal range in step S160 or after step S170, the CPU 81 derives the difference S1 between the slope of the time change of the first rotation position and the slope of the time change of the second rotation position (step S180). . Then, the CPU 81 determines whether the difference S1 is included in the abnormal range or the normal range based on the derived difference S1 and a predetermined threshold value (step S190). Here, for example, when the viscosity of the grease applied to the outer peripheral surface of the syringe member 56 increases, the rotary portion 51 may prevent the syringe member 56 from rotating. In such a case, the followability of the rotation of the syringe member 56 and the suction nozzle 42 to the operation of the Q-axis motor 63 becomes slow, and the difference S1 becomes large. Therefore, in the present embodiment, a threshold is set as a value that can detect an increase in grease viscosity that requires maintenance such as reapplication of the grease, and the CPU 81 uses this threshold to perform determination in step S190. When the difference S1 is within the abnormal range in step S190, the CPU 81 stores the content of the abnormality (for example, lack of maintenance, increased viscosity of grease, etc.) based on the determination result in the HDD 83 (step S200).

When the difference S1 is within the normal range in step S190 or after step S200, the CPU 81 waits until it is detected that the Q-axis motor 63 has rotated to the target position based on the first rotation position (step S210). is detected, the Q-axis motor 63 is stopped (step S220). As the Q-axis motor 63 stops, the second rotation position also stops changing. Subsequently, the CPU 81 derives the positional deviation D1 between the first rotational position and the second rotational position after stopping (step S230). The positional deviation D1 can also be rephrased as the amount of positional deviation between the correct second rotational position corresponding to the target position of the Q-axis motor 63 and the second rotational position actually detected when stopped. Then, the CPU 81 determines whether the positional deviation D1 is included in the abnormal range or the normal range based on the derived positional deviation D1 and a predetermined threshold value (step S240). Here, for example, if the component holding portion 55 (especially the syringe member 56) is deformed such as torsion, even if the CPU 81 controls the rotational position of the suction nozzle 42 based on the first rotational position detection portion 64, the suction The nozzle 42 will deviate from the desired rotational position, affecting the mounting process. In such a case, the greater the degree of deformation such as twisting, the greater the positional deviation D1. Therefore, in the present embodiment, a threshold is set as a value that allows detection of deformation to the extent that replacement of the syringe member 56 is required, and the CPU 81 uses this threshold to perform the determination in step S240. When the positional deviation D1 is within the abnormal range in step S240, the CPU 81 stores the contents of the abnormality (for example, deformation of the syringe member 56) based on the determination result in the HDD 83 (step S250).

When the positional deviation D1 is within the normal range in step S240 or after step S250, the CPU 81 determines whether or not there is an uninspected component holding portion 55 (step S260), and the uninspected component holding portion 55 is If there is, the process proceeds to step S120, and the processing of steps S120 to S260 is performed. In this way, the CPU 81 sequentially determines whether there is an abnormality in the plurality of component holding portions 55. When it is determined in step S250 that there is no uninspected component holding portion 55, the CPU 81 outputs the inspection result (step S270), and proceeds to step S100 at the inspection timing. wait to become In step S270, the CPU 81 stores information such as the determination result of normality or abnormality for each component holding unit 55 to be inspected, the specific content of the abnormality, the derived time T1, the difference S1, and the value of the positional deviation D1 to the HDD 83. , or output to the management computer 90 . Alternatively, when there is an abnormality, the CPU 81 may display the contents of the abnormality and a warning message based thereon on the display section 24 of the operation panel 19 to notify the operator of the abnormality and prompt him/her to take action. Moreover, the CPU 81 may stop the mounting processing routine being executed based on the content of the abnormality.

Here, correspondence relationships between the components of the present embodiment and the components of the present disclosure will be clarified. The mounting apparatus 11 of this embodiment corresponds to the inspection apparatus and the component mounting apparatus of the present disclosure, the component holding section 55 corresponds to the component holding section, the Q-axis motor 63 corresponds to the drive source, and the rotation mechanism 59 corresponds to the rotation mechanism. , the mounting head unit 17 corresponds to the mounting head unit, the first rotational position detector 64 corresponds to the first rotational position detector, and the second rotational position detector 74 corresponds to the second rotational position detector. , and the control device 80 corresponds to an abnormality determination unit. Also, the head moving unit 16 corresponds to a head moving section.

According to the mounting apparatus 11 of the present embodiment described in detail above, the CPU 81 of the control device 80 controls the first rotation position of the first portion (here, the Q-axis motor 63) on the drive source side of the rotation mechanism 59 and the rotation mechanism Abnormality of the rotation mechanism 59 is determined based on the second rotation position of the second portion (here, the flange 43 of the suction nozzle 42) of the 59 that is farther from the drive source than the first portion. For this reason, the mounting apparatus 11 uses a portion of the rotation mechanism 59 that is farther from the Q-axis motor 63 than the first portion ( (for example, the small gear 65, the Q-axis gear 53, and the component holding portion 55) can be easily detected. Therefore, the mounting apparatus 11 can easily detect an abnormality in the rotation mechanism 59 other than the Q-axis motor 63 .

Further, the CPU 81 derives derived values (here, time T1, difference S1, and positional deviation D1) regarding the state of the rotating mechanism 59 based on the first and second rotational positions, and compares these derived values with the threshold. Therefore, the abnormality of the rotation mechanism 59 can be appropriately determined based on the derived value and the threshold value. Further, the mounting apparatus 11 includes a mounting head unit 17 including a rotation mechanism 59 to be inspected, and a head moving unit 16. An inspection device that determines abnormality of the rotation mechanism 59 and mounts the component P on the board S. Since it also serves as a component mounting device, the component mounting device itself can determine the abnormality of the rotation mechanism 59 .

Furthermore, the second rotational position detector 74 is fixedly arranged independently of the mounting head unit 17 . Then, the CPU 81 moves the mounting head unit 17 to an inspection position where the second rotational position detection section 74 can detect the second rotational position, and drives the Q-axis motor 63 to detect the detected first and second rotational positions. Perform location-based anomaly determination. Here, for example, when the movable mounting head unit 17 is provided with the second rotational position detector 74, when the Q-axis motor 63 is driven during inspection, the vibration caused by the rotation of the rotation mechanism 59 is detected by the second rotational position detector. 74, the detection accuracy of the second rotational position may be lowered. On the other hand, by arranging the second rotational position detection unit 74 in a fixed manner, it is possible to suppress such a decrease in detection accuracy, so that the accuracy of abnormality determination in the mounting apparatus 11 is improved.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the above-described embodiment, the first rotational position detector 64 detects the rotational position of the Q-axis motor 63 as the first rotational position. The rotational position of the first portion on the side may be detected. For example, the first rotational position detector 64 may detect the rotational position of the Q-axis gear 53 and the rotational position of the syringe member 56 . The first portion may be any portion of the syringe member 56 in the rotation mechanism 59 or a portion closer to the Q-axis motor 63 than the syringe member 56 . Also, although the second rotational position detector 74 detects the rotational position of the flange 43 as the second rotational position, it is not limited to this. The second rotational position detector 74 may detect the rotational position of the second portion of the rotation mechanism 59 that is farther from the drive source than the first portion. For example, the second rotational position detector 74 may detect the rotational position of the syringe member 56 . The second part may be any part of the syringe member 56 in the rotating mechanism 59 or a part farther from the Q-axis motor 63 than the syringe member 56 . A first rotational position detector 64 and a second rotational position detector detect the rotational positions of different parts of the same member, such as the first part being near the upper end of the syringe member 56 and the second part being near the lower end of the syringe member 56 . 74 may detect.

In the embodiment described above, the second rotational position detector 74 detects the rotational position of the flange 43 as the second rotational position, but this is not the only option. For example, the second rotational position detector 74 may detect the rotational position of a position detection member that is temporarily attached to the rotation mechanism 59 during inspection processing. For example, at the start of the inspection process, the CPU 81 replaces the suction nozzle 42 with the position detection member 142 (FIGS. 8A and 8B), and the code portion 173 formed on the flange 143 of the position detection member 142 and the second rotational position detection. The portion 74 may be opposed (FIG. 8C) to determine abnormality based on the first and second rotational positions. Also in this way, the abnormality of the small gear 65, the Q-axis gear 53, the small gear 57, the syringe member 56, etc. can be determined. Moreover, since the suction nozzle 42 does not need to include the flange 43 and the cord portion 73 (see FIG. 8A), the size and weight of the suction nozzle 42 can be easily reduced. The suction nozzle 42 and the position detection member 142 may be exchanged using the nozzle stocker 36, for example.

In the embodiment described above, the cord portion 73 is formed on the outer peripheral surface of the flange 43, and the second rotational position detection portion 74 detects the rotational position of the flange 43 along the radial direction of the flange 43. However, the present invention is not limited to this. A rotational position may be detected along the axial direction of the flange 43 . For example, a cord portion may be formed on the lower surface of the flange 43 and the second rotational position detection portion 74 may detect the rotational position of the flange 43 from below the flange 43 .

In the above-described embodiment, the second rotational position detector 74 may be detachable. Even in this case, if the second rotational position detector 74 is fixedly arranged independently of the mounting head unit 17 when the second rotational position detector 74 is mounted, the Q-axis It is possible to suppress deterioration in detection accuracy of the second rotational position due to vibration during rotation of the motor 63 .

In the above-described embodiment, the mounting apparatus 11 serves both as an inspection apparatus and a component mounting apparatus, but is not limited to this. For example, an inspection device different from the mounting device 11 may determine whether the mounting head unit 17 of the mounting device 11 is abnormal. For example, the mounting head unit 17 of the mounting apparatus 11 is removed and attached to the inspection apparatus, and inspection is performed based on the second rotation position detection section 74 provided in the inspection apparatus and the first rotation position detection section 64 provided in the mounting head unit 17. The control unit of the device may determine the abnormality. In this case, the control section of the inspection apparatus controls the R-axis motor 60 and Q-axis motor 63 of the attached mounting head unit 17 to be inspected, or obtains the first rotational position from the first rotational position detection section 64. You can do it.

In the above-described embodiment, the second rotational position detector 74 is fixedly arranged independently of the mounting head unit 17, but at least one of the first and second rotational position detectors 64 and 74 is fixed. may be strategically placed. For example, both the first and second rotational position detectors 64 and 74 may be fixedly arranged. Alternatively, both the first and second rotational position detectors 64 and 74 may be attached to the mounting head unit 17 . When an inspection device different from the mounting device 11 determines whether the mounting head unit 17 is abnormal, the inspection device may include at least one of the first and second rotational position detectors 64 and 74. , the first and second rotational position detectors 64 and 74 may both be attached to the mounting head unit 17 to be inspected. An inspection device different from the mounting device 11 may have a function as a head cleaner for cleaning the mounting head unit 17 in addition to the function of determining abnormality as described above.

In the above-described embodiment, the first rotational position detector 64 is a transmissive optical encoder, and the second rotational position detector 74 (and the code part 73) is a reflective optical encoder. Any method may be used. For example, the parts camera 35 may be used instead of the second rotational position detector 74 . For example, in the case of deriving the positional deviation D1, the parts camera 35 can be used as the second rotational position detector because it is sufficient to detect the second rotational position at the time of stop.

In the above-described embodiment, the CPU 81 determines the abnormality using the time T1, the difference S1, and the positional deviation D1. You can judge. For example, the CPU 81 derives the time T2 from the start of driving the Q-axis motor 63 in step S140 to the start of change of either the first rotational position or the second rotational position, and if the time T2 is greater than a predetermined threshold value ( That is, when neither the Q-axis motor 63 nor the flange 43 starts to rotate), it may be determined that an excessive load is applied to the Q-axis motor 63 due to an abnormality such as bending or bending of the syringe member 56 . In addition, after step S140, for example, the CPU 81 determines that even if a predetermined time (threshold value Tref, preferably a value larger than the threshold value used in step S160) elapses after the first rotation position starts to change, If the two-rotation position does not start to change, it may be determined that the Q-axis motor 63 is idling because the syringe member 56 is broken or bent. The CPU 81 derives the time T3 from when the Q-axis motor 63 is stopped in step S220 to when the second rotation position stops changing, and if this time T3 is greater than a predetermined threshold (that is, the rotation of the flange 43 is If the stop is slow), it may be determined that the viscosity of the grease has increased due to insufficient maintenance of the syringe member 56 . The CPU 81 may measure the backlash of the rotation mechanism 59 based on the first and second rotation positions to determine the abnormality. For example, the CPU 81 may determine abnormality as follows. First, the CPU 81 controls the Q-axis motor 63 based on the first rotational position detector 64 so that the flange 43 rotates in the first direction by a predetermined first angle, and determines the second rotational position after rotation. Store as a reference value. Next, the CPU 81 controls the Q-axis motor 63 based on the first rotational position detector 64 so that the flange 43 is further rotated in the first direction by the first angle, and then rotates by the first angle away from the first direction. The Q-axis motor 63 is controlled based on the first rotational position detector 64 so that the flange 43 rotates in the opposite second direction. Then, the second rotational position in the post-rotation state is stored as a comparison value. When the difference between the reference value and the comparison value is greater than a predetermined threshold value, it is determined that an abnormality such as gear wear has occurred.

In the above-described embodiment, in the inspection processing routine, the abnormality is determined in the raised state without lowering the component holding section 55 to be inspected. Abnormality determination may be performed based on the first and second rotational positions.

In the embodiment described above, the CPU 81 performed step S140 after steps S110 and S130, but the present invention is not limited to this. For example, if an abnormality is determined based on the difference S1 or the positional deviation D1, the timing of step S140, that is, the start of driving the Q-axis motor 63, may be set before or during steps S110 and S130.

In the above-described embodiment, the threshold value for abnormality determination is a value determined in advance by experiment or the like, but may be a value determined based on an initial value. For example, the time T1, the difference S1, and the positional deviation D1 obtained by executing the inspection processing routine when the mounting apparatus 11 is used for the first time are set as initial values, and the amount of change and the rate of change from these initial values can be used as thresholds. good.

In the above-described embodiment, the mounting head 50 has 16 component holders 55, but the number of component holders 55 is not limited to this, and may be plural. Also, the number of component holding portions 55 may be one.

In the above-described embodiment, when an abnormality is detected in the inspection processing routine of FIG. 7, the CPU 81 outputs inspection results or stops the mounting processing routine being executed. can't For example, when an abnormality is detected in the inspection processing routine of FIG. 7, the CPU 81 may correct the control amount of the Q-axis motor 63 when performing the mounting processing routine based on the detected abnormality. For example, when the CPU 81 determines in step S240 that the positional deviation D1 is included in the abnormal range, the CPU 81 may correct the control amount of the Q-axis motor 63 based on the positional deviation D1. For example, if the positional deviation D1 corresponds to a rotation angle of 1 degree of the suction nozzle 42, the CPU 81 adjusts the target rotation position of the Q-axis motor 63 to 1 degree of the suction nozzle 42 when adjusting the attitude of the part P. The posture of the component P placed on the board S may be corrected by correcting the correction so as to reduce it by an amount corresponding to . In this way, the CPU 81 can prevent an abnormality from occurring in the mounting process even when the rotation mechanism 59 has an abnormality.

In the above-described embodiment, the inspection device (here, the mounting device 11) makes various determinations based on the information acquired from the first rotational position detector and the second rotational position detector. The information may be added with board inspection related information related to the board inspection result, which is the inspection of the state of the component P mounted on the board S by the mounting head unit (the result of the mounting process of the mounting apparatus 11). Then, based on the acquired board inspection related information, or based on the acquired board inspection related information and the information acquired from the first and second rotational position detectors, the abnormality determination unit (for example, CPU 81) of the inspection apparatus , the abnormality determination related information, which is information relating to the determination of abnormality of the rotation mechanism 59, may be changed, or the abnormality may be determined. In other words, the CPU 81 learns by itself about the abnormality inspection of the rotation mechanism 59 based on the acquired board inspection related information, and judges and estimates an abnormality that cannot be judged only by the abnormality inspection performed by itself. may

The board inspection may be performed by a board inspection apparatus provided in the mounting system 10 (for example, a board inspection apparatus arranged downstream of the mounting apparatus 11 in the transport of the board S). The CPU 81 may acquire board inspection related information from the board inspection apparatus or from the management computer 90 . The substrate inspection includes, for example, an inspection of the position (XY coordinates, etc.) of the component P on the substrate S, an inspection of the posture (rotational position) of the component P on the substrate S, and the like. The substrate inspection apparatus may inspect the substrate based on the substrate image obtained by imaging the substrate S. The abnormality determination related information includes, for example, information on derived values such as the above-described time T1, difference S1, and positional deviation D1, information on thresholds to be compared with the derived values, information on details of anomalies, and information on details of processing when anomalies are determined. , and information about the correspondence relationship of these pieces of information.

For example, the CPU 81 acquires board inspection-related information from the board inspection apparatus, and the acquired board inspection-related information includes information indicating that there was an abnormality in the posture of the component P as a result of the board inspection. In this case, the threshold included in the abnormality determination related information may be changed in the direction of widening the abnormality range. For example, the CPU 81 may change the threshold to be compared with the time T1 in step S160 described above to a smaller value. Here, if an abnormality in the posture of the component P is found by the board inspection, there is a possibility that the abnormality of the rotation mechanism 59 could not be detected because the threshold value was inappropriate in the inspection of the rotation mechanism 59 performed by the CPU 81. There is By performing the above processing in such a case, the CPU 81 can change the threshold value to a more appropriate value based on the substrate inspection related information. In this case, the CPU 81 provides information indicating the degree of abnormality in the posture of the component P, for example, how many times the posture of the component P exceeded the threshold value used in the board inspection (amount of deviation of the rotation angle that is allowable from the correct posture). information, and change the threshold value so that the greater the degree of abnormality in the posture of the component P, the wider the range of abnormality.

Alternatively, if the acquired board inspection-related information includes information indicating that there was an abnormality in the posture of the component P as a result of the board inspection, the CPU 81 detects that the first rotational position detection unit 64 and the It may be determined that at least one of the second rotational position detector 74 is abnormal. Here, when an abnormality in the posture of the component P is found by the board inspection, the threshold value is appropriate in the inspection of the rotation mechanism 59 performed by the CPU 81, but the first and second rotation position detection units 64 and 74 are abnormal. There is a possibility that the abnormality of the rotating mechanism 59 could not be detected due to the presence of such an error. By performing the above processing in such a case, the CPU 81 can detect an abnormality in at least one of the first and second rotational position detectors 64 and 74 based on board inspection related information.

The CPU 81 changes the inspection threshold value of the rotation mechanism 59 or detects the first and second rotation positions based on the acquired board inspection related information (for example, based on the information indicating the degree of abnormality in the posture of the component P). It may be determined whether at least one of the parts 64 and 74 is determined to be abnormal. Alternatively, the CPU 81 may determine an abnormality of the rotation mechanism 59 based on board inspection related information.

Alternatively, the CPU 81 may change the correspondence relationship between the derived value and the content of the abnormality based on the acquired board inspection related information. For example, in the inspection processing routine of FIG. 7 described above, the CPU 81 determines that the content of the abnormality is "gear wear" when the time T1 is within the abnormality range. That is, for example, the time T1 and gear wear are associated in advance in the ROM 82 . At this time, the CPU 81 may change the content of the abnormality corresponding to the time T1 to another content of the abnormality (for example, breakage of the syringe) other than the "wear of the gear" based on the obtained substrate inspection related information. By doing so, the CPU 81 can more appropriately determine the contents of the abnormality in the subsequent inspection processing routine based on the substrate inspection related information.

Similarly, the CPU 81, based on the acquired board inspection-related information, determines the derived value and the processing details (for example, information about what kind of warning message to output to the display unit 24, and the display unit 24, information on whether to leave the abnormality to the operator, etc.) may be changed.

Further, as described above, when the CPU 81 corrects the control amount of the Q-axis motor 63 when performing the mounting processing routine based on the detected abnormality, the "contents of processing when abnormality is determined" includes this correction. Also included is the amount of correction to make. Then, the CPU 81 may change the processing content (here, the correction amount calculated based on the derived value) when it is determined to be abnormal based on the acquired substrate inspection related information. For example, it is assumed that the CPU 81 uses an angle having the same absolute value as the angle represented by the positional deviation D1 as the correction amount for the control of the Q-axis motor 63 . In this state, if the board inspection-related information acquired by the CPU 81 includes information indicating that there was an abnormality in the posture of the component P as a result of the board inspection, the CPU 81 changes the correction amount. (For example, an angle having the same absolute value as an angle 1.2 times or 0.8 times the angle represented by the positional deviation D1 may be used as the correction amount). By doing so, the CPU 81 can set a more appropriate correction amount based on the board inspection related information. In this case, the CPU 81 acquires board inspection-related information including information indicating the degree of abnormality in the posture of the component P, and tends to change the correction amount more as the degree of abnormality in the posture of the component P increases. You can change the amount. Alternatively, the CPU 81 corrects the control amount of the Q-axis motor 63 on the basis of the detected abnormality, and the CPU 81 outputs information related to board inspection including information indicating that there was an abnormality in the posture of the component P as a result of the board inspection. When the information is acquired, it may be considered that the correction cannot be performed, and the mounting process may be stopped or the operator may be notified of the abnormality.

The board inspection related information may be information related to board inspection results, and may include, for example, board inspection results as described above, or board images used for board inspection. . When the board inspection-related information includes a board image, the CPU 81 performs board inspection based on the board image, derives board inspection results, and performs the various processes described above based on the derived board inspection results. You may do at least one of them. In this case, information for inspecting the board based on the board image (for example, information on what kind of component P to be inspected is at what position on the board S, information on the correct posture of the component P, information on the threshold value, etc.) ) may be included in the board inspection related information, may be obtained from the management computer 90, or may be stored in the ROM 82 in advance.

The inspection device of the present disclosure may be configured as follows.

In the inspection apparatus of the present disclosure, the abnormality determination unit derives a derived value regarding the state of the rotating mechanism based on the first and second rotational positions, compares the derived value with a threshold value, and determines the abnormality. may be performed. By doing so, this inspection device can appropriately determine the abnormality of the rotation mechanism based on the derived value and the threshold value.

The inspection apparatus of the present disclosure may include the mounting head unit and a head moving section that moves the mounting head unit, and may also serve as a component mounting apparatus that mounts the component on a board. In this way, the component mounting apparatus itself can determine the abnormality of the rotation mechanism.

In the inspection apparatus of the present disclosure in which the inspection apparatus also serves as a component mounting apparatus, the second rotational position detection section is fixedly arranged independently of the mounting head unit, and the abnormality determination section includes the The mounting head unit is moved to a position where the second rotational position can be detected by the second rotational position detector, and the drive source is driven to detect the abnormality based on the detected first and second rotational positions. A judgment may be made. Here, for example, in the case where the movable mounting head unit is provided with the second rotational position detector, when the drive source is driven during inspection, the vibration caused by the rotation of the rotating mechanism is also transmitted to the second rotational position detector. , the detection accuracy of the second rotational position may be lowered. On the other hand, by fixedly arranging the second rotational position detection unit, it is possible to suppress such a decrease in detection accuracy, so that the accuracy of abnormality determination is improved in this inspection apparatus.

In this case, the first rotational position detection section is fixedly arranged independently of the mounting head unit, and the abnormality determination section is configured such that the first and second rotational position detection sections After moving the mounting head unit to a position where the second rotational position can be detected, the drive source may be driven to determine the abnormality based on the detected first and second rotational positions. .

In the inspection apparatus according to the present disclosure in which the inspection apparatus also serves as the component mounting apparatus, the abnormality determination section may determine the abnormality every time a predetermined time elapses. "Perform the abnormality determination every time a predetermined time elapses" means the case of performing the abnormality determination immediately after the predetermined time has elapsed (that is, the case of performing the abnormality determination at each predetermined time interval), has passed and the mounting head unit is ready for inspection.

INDUSTRIAL APPLICABILITY The present invention can be used in various industries for mounting components on substrates.

REFERENCE SIGNS LIST 10 mounting system 11 mounting apparatus 11a base 12 mounting processing unit 14 substrate transport unit 15 substrate support unit 16 head movement unit 17 mounting head unit 18 supply unit 19 operation panel 21 support plate 22 conveyor belt, 23 support pin, 24 display unit, 25 operation unit, 26 X-axis slider, 28 guide rail, 30 Y-axis slider, 32 guide rail, 35 parts camera, 36 nozzle stocker, 40 head holder, 42 suction nozzle, 43 Flange 44 Tubular Part 45 Holder Main Body 46 Engagement Shaft 50 Mounting Head 51 Rotary Part 52 R-axis Gear 53 Q-axis Gear 55 Component Holder 56 Syringe Member 57 Small Gear 59 Rotation mechanism, 60 R-axis motor, 63 Q-axis motor, 64 first rotational position detector, 65 small gear, 66 Z-axis motor, 67 Z-axis guide, 68 horizontal part, 73 cord part, 74 second rotational position detector, 79 fixing member, 80 control device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input/output interface, 90 management computer, 142 position detection member, 143 flange, 173 code section, P part, S substrate.

Claims (5)

A mounting head unit, in a component mounting apparatus for mounting components on a board, comprising a rotating mechanism having a component holding portion for holding the component and a drive source for outputting a driving force for rotating the component holding portion, An inspection device for inspecting for abnormalities in
A first rotational position, which is a rotational position of a first portion of the rotating mechanism on the drive source side, is acquired from a first rotational position detection unit provided in the inspection device or provided in the mounting head unit, and the inspection device acquires A second rotational position, which is the rotational position of a second portion of the rotating mechanism that is farther from the drive source than the first portion of the rotating mechanism, is obtained from a second rotational position detecting portion provided by the mounting head unit. an abnormality determination unit that determines an abnormality of the rotation mechanism based on the acquired first and second rotation positions;
with
The rotation mechanism has a gear arranged between the drive source and the component holder,
the first portion is a portion of the rotating mechanism closer to the drive source than the component holding portion;
The second portion is any portion of the component holding portion,
The abnormality determination unit derives two or more derived values regarding the state of the rotation mechanism based on the first and second rotation positions,
The two or more derived values are the time T1 from the start of change of the first rotational position to the start of change of the second rotational position, the slope of the time change of the first rotational position, and the time change of the second rotational position. including at least one of the difference S1 from the slope of
When determining the abnormality based on the derived value, the abnormality determination unit determines the type of abnormality of the rotating mechanism according to which one of the two or more derived values is used to determine that there is an abnormality. do,
inspection equipment. The abnormality determination unit compares the derived value with a threshold to determine the abnormality.
The inspection device according to claim 1. The inspection device according to claim 1 or 2,
the mounting head unit;
a head moving unit that moves the mounting head unit;
with
It also serves as a component mounting device that mounts the component on the board,
inspection equipment. The inspection device according to claim 3,
The second rotational position detection section is fixedly arranged at a position independent of the mounting head unit that does not move together with the mounting head unit by the head moving section . detecting the second rotational position from a direction perpendicular to the axis,
The abnormality determination section moves the mounting head unit to a position where the second rotation position detection section can detect the second rotation position, and drives the drive source to detect the detected first and second rotation positions. determining the abnormality based on the rotational position;
inspection equipment. The abnormality determination unit determines the abnormality every time a predetermined time elapses,
The inspection device according to claim 3 or 4.

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