JP4408066B2 - Surface mount machine - Google Patents

Description

  The present invention relates to a surface mounter for mounting an electronic component such as an IC chip on a printed circuit board or the like.

  In general, a surface mounting machine for mounting an electronic component sucked by a suction nozzle on a printed board is known.

  This type of surface mounter includes a device configured to detect whether solder or the like used in the component mounting operation is attached to the suction nozzle (for example, the component mounting apparatus of Patent Document 1). .

  In this component mounting apparatus, the suction nozzle passes above the imaging device mounted on the base side on which the printed circuit board is placed, and the suction nozzle is soiled based on the bottom image of the suction nozzle imaged at this time. Whether or not it is determined.

Specifically, in this device, when the recognition error that the component could not be recognized in the bottom image captured by the imaging device at the time of component recognition during the mounting operation reaches the set number of times, the component mounting process currently being executed The process shifts to a dirt inspection process. As this process, the nozzle is moved to the imaging position without picking up the components, the bottom surface of the suction nozzle is imaged by the imaging device, and the suction is examined by examining the luminance in this image. It is determined whether or not the nozzle is dirty.
JP-A-10-190292

  However, in the component mounting apparatus of the above-mentioned patent document 1, since it shifts from the component mounting process to another process and determines the dirt on the suction nozzle, the determination process takes time, and the component mounting process As a result, the workability of component mounting work was poor.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface mounter capable of detecting dirt on the suction nozzle while maintaining the efficiency of component mounting work as much as possible. .

In order to solve the above-described problem, the invention according to claim 1 is directed to the suction nozzle, in which the nozzle holding member having the suction nozzle that sucks the electronic component is relatively displaced with respect to the base on which the printed circuit board is placed. A surface mounting machine configured to mount an adsorbed electronic component on a printed circuit board, wherein a side imaging unit capable of imaging the tip of the adsorption nozzle from the side, and an imaging of the adsorption nozzle from below The side surface image and the bottom surface image are captured with respect to the suction nozzle during the mounting operation during the first period after the bottom surface imaging means and the electronic component suction work are performed and before the mounting position on the printed circuit board is moved. and controls the driving of the lateral imaging means and the bottom surface imaging means and the nozzle holding member, an electronic component on the basis of the bottom image captured in the first period is adsorbed in normal position by the suction nozzle Is a determinable control means whether this control unit is configured to previously store a bright spot threshold for each the component type, the bright spot in the captured bottom image in the first period Is compared with the threshold value of the bright spot to determine the presence or absence of a bright spot, and when it is determined that there is a bright spot in this determination, the component is determined based on the side image captured during the first period. It is determined whether or not the suction nozzle is present, and when it is determined that the bright spot is present and the part is not sucked, it is determined that the suction nozzle is dirty.

  According to a second aspect of the present invention, in the surface mounting machine according to the first aspect, one of two axes orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board placed on the base. A support member that supports the nozzle holding member on a base so that the nozzle holding member can be displaced along the axis of the nozzle, and the side imaging means includes at least one of the nozzle holding member and the support member. It is provided in either one.

  The invention according to claim 3 is the surface mounter according to claim 1 or 2, wherein the nozzle holding member has a plurality of suction nozzles.

According to a fourth aspect of the present invention, in the surface mounter according to any one of the first to third aspects, the control means is moved to the suction position of the next electronic component after the electronic component is mounted on the printed circuit board. The suction nozzle is controlled based on the bottom image captured during the second period by controlling the driving of the side imaging means, the bottom surface imaging means and the nozzle holding member so as to capture the side image and the bottom image during the second period. It is determined whether or not there is a bright spot on the bottom surface, and it is determined whether or not a part is sucked to the suction nozzle based on the side image captured during the second period. In this determination, when it is determined that there is a bright spot and the part is not sucked, it is determined that the suction nozzle is dirty .

The invention according to claim 5 is the surface mounter according to any one of claims 1 to 4 , further comprising notification means capable of notifying the operator of the driving state of the surface mounter, and the control means When it is determined that the nozzle is dirty, this is notified to the operator by the notification means.

  According to the present invention, the side image and the bottom image of the suction nozzle are captured during the mounting operation (the operation of repeatedly performing the suction operation of the electronic component and the mounting operation of the electronic component by the suction nozzle), and based on these images. Therefore, it is possible to accurately determine the bottom surface state of the suction nozzle (whether it is a component or a foreign object such as solder) that is attached to the bottom surface. Can detect dirt.

  That is, in the process of moving the suction nozzle during execution of the mounting operation, the side and bottom images of the suction nozzle can be taken, and dirt can be detected based on these images. Contamination detection can be performed in parallel.

  Therefore, according to the present invention, it is possible to detect the contamination of the suction nozzle while maintaining the efficiency of the component mounting work as much as possible.

Also, according to the present invention, the suction nozzle contamination determination can be performed at the time of component recognition, so that the suction nozzle contamination detection can be performed while maintaining the efficiency of the component mounting operation more reliably.

In other words, after the suction work is performed, the component recognition is performed by imaging the tip of the suction nozzle by the bottom surface image pickup means and / or the side face image pickup means, and detecting the positional deviation between the electronic component and the suction nozzle based on this image. It is common to execute this, and the suction nozzle contamination detection can be executed in parallel with the component recognition.

In addition, when performing stain detection after execution of an electronic component suction operation as in the present invention, in principle, the electronic component is sucked into the suction nozzle, but the convenience of the electronic component supply position, mounting location, etc. and the next process In order to shorten the moving distance of the nozzle holding member according to the content of the nozzle, when a specific suction nozzle that does not suck the electronic component is set (when there are multiple suction nozzles), or the electronic component is missed In such a case, a suction nozzle that does not suck electronic components (hereinafter referred to as an empty nozzle) may be driven. And in this invention, the said stain | pollution | contamination determination can be performed about such an empty nozzle.

  According to the second aspect of the present invention, when the side imaging means is provided on the support member, the suction nozzle is moved by moving the nozzle holding member along the support member (one axis on the plane). Since it can be moved to the imaging range of the side imaging means, the moving distance of the nozzle holding member required for imaging can be shortened compared with the case where the side imaging means is provided on the base, and as a result The side image of the nozzle can be taken at a high speed, thereby reducing the time required for detecting the dirt on the suction nozzle.

  On the other hand, when the side imaging means is provided on the nozzle holding member, the side imaging means is within the imaging range because both the suction nozzle and the side imaging means are fixed to the nozzle holding member. Since it can always be maintained, it is not necessary to move the nozzle holding member when taking an image, and a side image of the suction nozzle can be taken at a high speed. As a result, the time required to detect the dirt on the suction nozzle can be reduced. .

  In any of the above cases, the side imaging means does not need to be provided on the base, so the base area can be reduced to the minimum necessary size, and a compact surface mounter can be obtained. it can.

  Furthermore, in the invention according to claim 2, since the side holding means is provided on the support member for displacably supporting the nozzle holding member and the nozzle holding member itself, the suction nozzle accompanying the movement of the nozzle holding member As a result of avoiding the interference with the side image pickup means, it is possible to detect dirt on the suction nozzle while suppressing problems such as breakage of the suction nozzle as much as possible.

  According to the invention of claim 3, since a plurality of electronic components can be sucked or mounted on a printed board, the efficiency of component mounting work can be further improved.

According to the invention which concerns on Claim 4 , dirt detection can be reliably performed about the suction nozzle before attracting | sucking an electronic component.

According to the invention which concerns on Claim 5 , since the adsorption | suction nozzle in which dirt was detected can be alert | reported, the operator can take a required measure rapidly.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a partial plan view of a surface mounter according to the present invention, FIG. 2 is a side cross-sectional view showing a part of the surface mounter shown in FIG. 1, and FIG. It is front sectional drawing which abbreviate | omits and shows a part of surface mounting machine shown.

The surface mounting machine mainly includes a main body mechanism unit 1 that mounts an electronic component C (a small chip component such as an IC, a transistor, or a capacitor: see FIG. 9D ) on the printed circuit board P by the operation of each unit mechanism. It comprises a controller (control means) 30 (see FIG. 4) for controlling the operation.

  The main body mechanism unit 1 includes a mounting machine body including a base 2 and the like, and a head unit (nozzle holding member) 3 that is movable with respect to the mounting machine body.

  On the base 2 is disposed a conveyer 4 for conveying a printed circuit board. The conveyer 4 conveys a printed circuit board P placed on the upper part and moves to a predetermined mounting work position (the position shown in FIG. 1). ) To stop.

  On both sides of the conveyor 4, component supply units 5 are arranged, and these component supply units 5 are provided with multiple rows of tape feeders 5 a.

  Each of the tape feeders 5a is configured such that the electronic components C are stored at predetermined intervals and the held tapes are led out from the reels, and the electronic components C are intermittently disposed so that the head unit 3 can be taken out. It comes to pay out.

  In addition, in this embodiment, the bucket 6 arranged in the end of the row | line | column with each tape feeder 5a is provided on the said base 2. FIG. The bucket 6 is a box member that opens upward, and, as will be described in detail later, accommodates the electronic component C that has been recognized as being discarded during the mounting operation and has been conveyed.

  The head unit 3 is disposed above the base 2 and is movable between the component supply unit 5 and the mounting work position of the printed circuit board P.

  Specifically, the head unit 3 is movable along an X axis and a Y axis that are orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board P.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 9 driven by a Y-axis servomotor 8 are disposed on the base 2. A support member 10 for the head unit is disposed on the fixed rail 7, and a nut portion 10 a provided on the support member 10 is screwed into the ball screw shaft 9.

  Further, the support member 10 is provided with a guide member 11 in the X-axis direction and a ball screw shaft 13 driven by an X-axis servo motor 12, and the head unit 3 is movably held by the guide member 11. A nut portion (not shown) provided on the head unit 3 is screwed onto the ball screw shaft 13.

  Accordingly, the support member 10 is moved in the Y-axis direction by driving the Y-axis servo motor 8, and the head unit 3 is moved in the X-axis direction with respect to the support member 10 by driving the X-axis servo motor 12. By this mechanism, the movement of the head unit 3 along the X-axis and Y-axis directions is realized.

  In the present embodiment, the head unit 3 is provided with six mounting heads 15 each having a suction nozzle 14 at the tip thereof arranged in a line along the X-axis direction.

  The head unit 3 is provided with a Z-axis servomotor 16 and a Z-axis ball screw shaft 17 that is rotationally driven by the Z-axis servomotor 16 for each mounting head 15.

  The nut members 18 attached to the mounting heads 15 in a relatively rotatable state are screwed to the Z-axis ball screw shafts 17, and the ball screw shafts 124 are driven to rotate by the Z-axis servomotor 16. Thereby, the mounting head 15 is moved in the vertical direction.

  The head unit 3 is provided with a rotation mechanism 19 for rotating the mounting head 15 about the axis (around the R axis) corresponding to the mounting head 15.

  These rotation mechanisms 19 are respectively connected to an R-axis servomotor 27 (see FIG. 4), and the mounting heads 15 are rotated around the R-axis in response to the rotational drive of the R-axis servomotor 27. ing.

  Further, a holding portion 20 extending in a direction away from the support member 10 is formed at the lower end portion of the head unit 3, and the holding portion 20 supports each mounting head 15 in an inserted state.

  The holding portion 20 has a tip portion protruding downward, and a side illumination 21 for irradiating light to the side surface of each mounting head 15 is attached to the tip portion of the protrusion portion. As shown in FIG. 3, six side illuminations 21 are provided corresponding to the respective suction nozzles 14.

  On the other hand, a camera support 22 is suspended from the support member 10, and a side camera (side imaging means) 23 is attached to the lower end of the camera support 22. In addition, the side illumination 21 and the side camera 23 are arrange | positioned in the position which opposes on both sides of the suction nozzle 14 in the Y-axis direction.

  The side camera 23 is composed of a line sensor, an area sensor, etc., and images the suction nozzle 14 from the side. Under the illumination conditions of the side illumination 21, the lower end portion of the suction nozzle 14 and its peripheral range A transmission image can be obtained for (see FIG. 9).

  Furthermore, a lower imaging unit 24 that images the suction nozzle 14 from below is provided on the base 2 corresponding to the position of the side camera 23 in the X-axis direction.

  As shown in FIG. 3, the lower imaging unit 24 includes a lower camera (bottom imaging means) 25 and a dome-shaped lower illumination composed of a plurality of LEDs arranged so as to surround the imaging range of the lower camera 25 and spread upward. (Lower illumination means) 26, and a reflection image can be obtained for the suction nozzle 14 passing above or the bottom surface of the sucked electronic component C (see FIG. 9).

  In addition, since the lower imaging unit 24 is positioned so as to be in the same position as the side camera 23 in the X-axis direction, the head in the state where the Y-axis position of each suction nozzle 14 is aligned with the lower camera 25. By moving the unit 3 along the support member 10 (X-axis direction), the suction nozzles 14 can be simultaneously passed through the imaging ranges of both cameras 23 and 25, and the suction nozzles 14 are continuously connected. Can be passed.

  Therefore, if the imaging of both the cameras 23 and 25 is executed when passing through the imaging range, a side image and a bottom image can be obtained simultaneously for each suction nozzle 14 at the same time.

  Next, the control system in the present embodiment will be described with reference to FIG.

  The controller 30 is provided at an appropriate location inside the main body mechanism unit 1 and is a well-known CPU that executes logical operations, a ROM that stores initial settings, a RAM that temporarily stores various data during operation of the apparatus, and the like. It is composed of

  The controller 30 includes an axis control unit 31, an imaging device control unit 32, an image memory 33, a mounting information storage unit 34, a comparison information storage unit 35, and a calculation unit 36.

  Note that a display device 37 is connected to the controller 30, and the display device 37 is configured to be able to display a driving state of the mounting machine in accordance with an instruction from the calculation means 36.

  The axis control means 31 includes the Y-axis servo motor 8, the X-axis servo motor 12, the Z-axis servo motor 16 (first head Z-axis servo motor to sixth head Z-axis servo motor), and the R-axis servo motor 27 (first head). The driving of one head R-axis servo motor to sixth head R-axis servo motor is controlled.

  The imaging device control means 32 controls operations of the side camera 23, the lower camera 25, the side illumination 21, and the lower illumination 26.

  The image memory 33 stores image data obtained by imaging with the side camera 23 and the lower camera 25.

  The mounting information storage means 34 stores information on the electronic component C to be mounted on the printed circuit board P, and what type of electronic component C is mounted on which position of the printed circuit board P in any order. Information such as whether to do is memorized.

  The comparison information storage unit 35 stores a prescribed value (for example, a threshold value for a bright spot described later) that needs to be compared with an actual measurement value in the process described below.

  The calculation means 36 has a calculation function such as a CPU, and the axis control means 31 and the image pickup apparatus control means 32 according to the mounting order of the electronic components C stored in the mounting information storage means 34. To implement the mounting process described below.

  In particular, the calculation means 36 compares the brightness data stored in the comparison information storage means 35 with the brightness calculated based on the actually captured image data, and a bright spot is found in the suction nozzle 14. It is determined whether or not there is, and the subsequent processing is appropriately selected and executed according to the determination result.

  Next, processing executed by the controller 30 will be described with reference to FIG.

  First, when the electronic component C is picked up, the counter N1 for selecting the target suction nozzle 14 is set to 1 (initial value) (step S1), and the N1-th suction nozzle 14 is arranged on the component supply unit 5. The electronic component C is sucked by the suction nozzle 14 (step S2).

  Next, it is determined whether or not the component suction process has been executed for all six suction nozzles 14 (step S3). If there is a suction nozzle 14 that has not yet been executed (NO in step S3). Adds 1 to the counter N1 (step S4) and repeatedly executes step S2.

  On the other hand, if it is determined that the component suction processing has been completed for all the suction nozzles 14 (YES in step S3), the type of the suctioned electronic component C is determined in order to select the target suction nozzle 14 The counter N2 is set to 1 (initial value) (step S5).

  Next, it is determined whether or not the electronic component C sucked by the N-th suction nozzle 14 is a BGA (Ball Grid Array: a component having a ball-shaped protrusion on the lower surface) (step S6).

  If it is determined that the sucked electronic component C is not a BGA (NO in step S6), the side illumination 21 corresponding to the suction nozzle 14 is turned on (step S7).

  When this step S7 is executed and when it is determined that the sucked electronic component C is a BGA (YES in step S6), the electronic component C sucked by the N2th suction nozzle 14 is then performed. A bottom image and a side image are taken for (step S8).

  When the sucked electronic component C is a BGA, the side illumination 21 is kept off when the side and bottom surfaces of the BGA are imaged with the side illumination 21 turned on. This is because the illumination light reflected by the ridge-like projections can prevent problems such as the contour of the BGA not being clearly detected.

  Next, it is determined whether or not imaging of the electronic component C has been completed for all six suction nozzles 14 (step S9), and if it is determined that there is an electronic component C that has not yet been imaged (step S9). NO), 1 is added to the counter N2 (step S10), and step S6 is repeatedly executed.

  That is, in steps S <b> 5 to S <b> 10, each suction nozzle 14 passes through the imaging range of the lower camera 25 while determining whether or not the side illumination 21 is turned on for each electronic component C sucked by each suction nozzle 14. The support member 10 is displaced in the Y-axis direction so that the head unit is driven in the X-axis direction, so that side and bottom images are simultaneously captured for each suction nozzle 14, and this is continuously performed for each suction nozzle. Running.

  If it is determined in step S9 that imaging has been completed for all the suction nozzles 14 (YES in step S9), then a suction state detection process T for detecting the suction state of the electronic component C is executed.

  FIG. 6 is a flowchart showing the suction state detection process T of FIG.

  In the suction state detection process T, first, when detecting the suction state of the electronic component C, a counter N3 for selecting the target suction nozzle 14 is set to 1 (initial value) (step T1).

  Next, based on the bottom image of the electronic component C sucked by the N3th suction nozzle 14, it is determined whether or not there is a bright spot on the bottom surface (step T2).

  In step T2, the presence or absence of a bright spot is determined by comparing the bright spot threshold value for each component type stored in the comparison information storage means 35 with the bright spot in the bottom image. Become.

  Specifically, an upper limit value such as the area of the bright spot and the maximum brightness at the bright spot is set as the bright spot threshold value, which is obtained by performing predetermined image processing on the bottom image. When the area measurement value and the luminance measurement value of the bright spot exceed the above upper limit value, it is determined that there is a bright spot.

  Based on such processing, if it is determined that there is a bright spot on the bottom surface (YES in step T2), the electronic component C is attracted to the suction nozzle 14 based on the side image of the N3rd suction nozzle 14. It is determined whether or not (step T3).

  If it is determined that the electronic component C is not sucked (NO in step T3), the display device 37 notifies the operator that the bottom surface of the N3th suction nozzle 14 is dirty. (Step T4).

  That is, when a bright spot is detected in the bottom image (YES in step T2), it can be usually determined that the reflected light is from the lower illumination 26 with respect to the protrusion formed on the bottom surface of the electronic component C. If it is determined that the electronic component C is not further adsorbed in the state (NO in step T3), the adhering material such as solder H adhering to the bottom surface of the adsorbing nozzle 14, as shown in FIG. It can be determined that the light is reflected.

  Then, when the suction nozzle 14 is informed of contamination, it waits for an operator's confirmation response by an input device (not shown) (step T5), and for example, an input to skip the mounting work by the N3rd suction nozzle 14 is made. Then (YES in step T5), 1 is added to the counter N3 (step T6), and step T2 is repeatedly executed.

  On the other hand, if it is determined in step T2 that there is no bright spot, it is determined whether or not the electronic component C is sucked based on the side image of the N3th suction nozzle 14 (step T7).

  If it is determined in step T7 that the electronic component C is not sucked, that is, the N3rd suction nozzle 14 is not contaminated and the electronic component C is not sucked (see FIG. 9A). ), The suction operation of the suction nozzle 14 is executed again (step T8).

  When the suction operation of the electronic component C is completed, the bottom and side images of the N3th suction nozzle 14 are taken (step T9), and the above step T2 is repeatedly executed as described above. In step T9, processing for updating the bottom and side images captured last time to those captured this time is also executed.

  On the other hand, when it is determined in step T7 that the electronic component C is sucked, that is, although the electronic component C is sucked by the N3th suction nozzle 14, the electronic component C is determined based on the bottom image. If the electronic component C cannot be recognized (such as when the electronic component C is standing upright on the bottom surface of the suction nozzle 14 as shown in FIG. 9B), an operation of discarding the electronic component C is executed (step T10). .

  Here, the discarding operation is an operation of transporting the electronic component C determined to be discarded in step T7 to the upper side of the bucket 6 (see FIG. 1), and detaching the electronic component C from the suction nozzle 14 here. That is.

  When the above-described disposal operation is completed, the height adjustment of the N3rd suction nozzle 14 is executed so as to be within the imaging range of the side camera 23, and the head unit 3 is driven so that the side surface of the N3th suction nozzle 14 is driven. An image is picked up (step T11), and based on this side image, it is determined whether or not the electronic component C is detached from the N3th suction nozzle 14 (the presence or absence of the electronic component C) (step T12).

  If it is determined that the electronic component C is present (NO in step T12), step T10 is repeatedly executed. On the other hand, if it is determined that there is no electronic component C (YES in step T12), the suction operation in step T8 is performed. Execute.

  On the other hand, when it is determined in step T3 that the electronic component C is attracted to the N3rd suction nozzle 14, that is, when the presence of the electronic component C is recognized in both the bottom and side images, It is determined whether or not the electronic component C is attracted to the suction nozzle 14 in a normal posture (step T13).

  In step T13, the attitude of the electronic component C is determined from data such as the size of the electronic component C calculated based on the imaging data of the N3th suction nozzle 14.

  In this determination, when it is determined that the suction posture is abnormal (NO in step T13), for example, when the electronic component C is inclined with respect to the suction nozzle 14 as shown in FIG. Step T10 is executed.

  On the other hand, if it is determined that the suction posture is normal (YES in step T13), that is, if it is determined that the posture is as shown in FIG. 9D, the bottom surface of the N3rd suction nozzle 14 Then, a positional deviation amount between the suction nozzle 14 and the electronic component C is detected from the side image, and based on this, a positional correction amount with respect to the substrate P of the electronic component C (ie, a correction amount for the moving distance of the head unit 3). Is calculated (step T14).

  Next, it is determined whether or not the detection of the suction state has been completed for all the suction nozzles 14 (step T15). If it is determined that there is a suction nozzle 14 that has not been completed yet (NO in step T15), 1 is added to the counter N3 (step T16), and step T2 is repeatedly executed.

  On the other hand, if it is determined in step T15 that the suction state detection has been completed for all the suction nozzles 14, the process proceeds to the main routine of FIG.

  Referring to FIG. 5, when the suction state detection process T is completed, a component mounting process U is then executed.

  FIG. 7 is a flowchart showing the component mounting process shown in FIG.

  In the component mounting process U, first, each suction nozzle 14 is moved to the mounting position based on the correction value for the movement distance of the head unit 3, and the Z-axis servo motor 16 is driven to lower the suction nozzle 14. Thus, the electronic component C is mounted, and this operation is sequentially executed for each suction nozzle 14 (step U1).

  When the electronic component C is mounted, the height position of each suction nozzle 14 is adjusted so as to fall within the imaging range of the side camera 23, and a side image of the suction nozzle 14 is captured (step U2).

  Next, when detecting the take-back of the electronic component C by the suction nozzle 14, a counter N4 for selecting the target suction nozzle 14 is set to 1 (initial value) (step U3).

  Based on the side image, it is determined whether or not the electronic component C remains in the N4th suction nozzle 14 (whether or not the electronic component C is brought home) (step U4).

  If it is determined in step U4 that the electronic component C remains, the display device 37 notifies the operator that an unmounted error has occurred (step U5), and the operator's confirmation response is sent for this notification. It waits for something to be present (step U6).

  Here, for example, when the operator inputs that the component suction operation is to be mounted again for the N3th suction nozzle 14 (YES in step U6), the discarding operation in step T10 of the suction state detection process T is performed. Execute.

  If it is determined in step U4 that no electronic component C remains, it is determined whether or not the take-out detection has been completed for all the suction nozzles 14 (step U7), and the take-out detection has not yet been executed. If it is determined that there is the suction nozzle 14 (NO in step U7), 1 is added to the counter N4 (step U8), and step U4 is repeatedly executed.

  On the other hand, if it is determined that take-out detection has been completed for all the suction nozzles 14 (YES in step U7), the process proceeds to the main routine of FIG.

  Referring to FIG. 5 again, when the component mounting process U is completed, it is then determined whether or not all the electronic components C have been mounted on the printed circuit board P (step S11).

  Here, if it is determined that the mounting of all the electronic components C is not completed (NO in step S11), the above-described step S1 is repeatedly executed, while it is determined that the mounting of all the electronic components C is completed ( In step S11, YES), the process ends.

  In the present embodiment, a plurality of side lights 21 are arranged corresponding to each suction nozzle 14, but instead of or in addition to this, as shown in FIG. It can also be set as the structure which has arrange | positioned the one side illumination 21a to this. In this way, a reflection image can be obtained for the side surface of each suction nozzle 14.

  Furthermore, in the above embodiment, the side camera 23 is attached to the support member 10, but instead, a plurality of side cameras 23 corresponding to the respective suction nozzles 14 are disposed in the head unit 3. You can also.

  In this embodiment, since each side camera 23 and each suction nozzle 14 are not relatively displaced, an area sensor is used for these side cameras 23.

  Further, also in this embodiment, as for the side illumination, a plurality of headlights 3 provided on the head unit 3 as shown in FIG. 3 (reference numeral 21) or one provided on the support member 10 as shown in FIG. Either or both of 21a) can be employed, and a transmission or reflection image can be selectively obtained for the side image of each suction nozzle 14 by appropriately selecting these illuminations.

  As described above, according to the surface mounting machine, the side image and the bottom image of the suction nozzle 14 are captured during the mounting operation (step S8), and the bottom surface state of the suction nozzle 14 (solder or the like) based on both the images. Therefore, it is possible to accurately detect whether or not the suction nozzle 14 is contaminated in the course of a series of operations in the mounting operation.

  That is, in the process of moving the suction nozzle 14 during the execution of the mounting operation, the side and bottom images of the suction nozzle 14 can be taken, and dirt can be detected based on these images. The mounting operation and the dirt detection can be performed in parallel.

  Therefore, according to the surface mounting machine, it is possible to detect the contamination of the suction nozzle 14 while maintaining the efficiency of the component mounting work as much as possible.

  Further, according to the surface mounter, the side camera 23 is provided on at least one of the head unit 3 and the support member 10.

  Therefore, when the side camera 23 is provided on the support member 10, the suction nozzle 14 can be moved to the imaging range of the side camera 23 by moving the head unit 10 along the X axis. Compared with the case where the side camera 23 is provided on the table 2, the moving distance of the head unit 3 required for imaging can be shortened. As a result, a side image of the suction nozzle 14 can be captured at high speed. As a result, the time required to detect dirt on the suction nozzle 14 can be shortened.

  On the other hand, when the side imaging means is provided in the head unit 3, both the suction nozzle 14 and the side camera 23 are fixed to the head unit 3. Therefore, it is not necessary to move the head unit 3 when taking an image, and a side image of the suction nozzle 14 can be taken at a high speed. As a result, the time required for detecting the dirt on the suction nozzle 14 can be shortened. be able to.

  In any of the above cases, the side camera 23 does not need to be provided on the base 2, so that the area of the base 2 can be reduced to the minimum necessary size, and a compact surface mounter can be used. can do.

  Further, in the surface mounting machine, since the side camera 23 is provided on the support member that supports the head unit 3 so as to be displaceable, and the head unit 3 itself, As a result of avoiding the interference with the side camera 23, it is possible to detect contamination of the suction nozzle 14 while suppressing problems such as breakage of the suction nozzle 14 as much as possible.

  According to the surface mounting machine provided with the plurality of suction nozzles 14, a plurality of electronic components C can be sucked or mounted on the printed circuit board P, so that the efficiency of the component mounting work can be further improved.

  According to the surface mounter that performs the dirt determination of the suction nozzle 14 after the electronic component suction operation is performed and before it is moved to the mounting position on the printed circuit board P, the component recognition (the suction state detection) is performed. Since the dirt determination of the suction nozzle 14 can be executed at the time of execution of the processing, the dirt detection of the suction nozzle 14 can be executed while maintaining the efficiency of the component mounting work more reliably.

  In the above-described embodiment, the dirt detection of the suction nozzle 14 is performed between the suction of the electronic component and the mounting. However, the present invention is not limited to this, and for example, each suction nozzle of the head unit 3 14, after the mounting operation is completed, the dirt detection of the suction nozzle 14 may be performed in the process of moving to the suction position of the electronic component C that is the next suction target (for example, between steps S1 to S3). it can.

  In this way, it is possible to reliably execute the dirt detection on the suction nozzle 14 before sucking the electronic component C.

  According to the surface mounting machine provided with the display device 37, the suction nozzle 14 in which the dirt is detected can be notified, so that the operator can quickly take necessary measures.

  In the above-described embodiment, dirt detection (side surface imaging, determination) is performed every time the component mounting work is performed. However, the present invention is not limited to this, and for example, periodically or by the suction nozzle 14 You may make it perform every time the frequency | count of adsorption | suction becomes predetermined number of times.

  Furthermore, although the side camera 23 is provided on the head unit 3 or the support member 10 in the above embodiment, it may be provided on the base 2.

It is a partial top view of the surface mounting machine which concerns on this invention. It is the II-II sectional view taken on the line of FIG. It is front sectional drawing which abbreviate | omits and shows a part of surface mounting machine shown in FIG. It is a block diagram which shows a functional structure about the controller of the surface mounter of FIG. It is a flowchart which shows the process performed by the controller of FIG. It is a flowchart which shows the adsorption | suction state detection process of FIG. It is a flowchart which shows the component mounting process of FIG. It is a figure which shows the suction nozzle dirty with solder etc., (a) is a bottom view, (b) is a side view. It is a figure which shows a side surface and a bottom face image with a side camera and a lower camera, (a) shows the suction nozzle to which the electronic component C is not picked up, (b) is an electronic component standing upright on the bottom face of the suction nozzle. (C) shows a state where the electronic component is sucked and sucked with respect to the suction nozzle, and (d) shows a state where the electronic component is sucked by the suction nozzle in a normal posture. FIG. 4 is a view corresponding to FIG. 3 for a surface mounter according to another embodiment.

2 Base 3 Head unit (nozzle holding member)
DESCRIPTION OF SYMBOLS 10 Support member 14 Adsorption nozzle 23 Side camera (side imaging means)
25 Lower camera (bottom imaging means)
30 controller (control means)
37 Display device (notification means)
C Electronic component P Printed circuit board

Claims (5)

A nozzle holding member having a suction nozzle for sucking an electronic component is configured to mount the electronic component sucked by the suction nozzle on the printed board by being displaced relative to a base on which the printed board is placed. Surface mounted machine,
Side imaging means that can image the tip of the suction nozzle from the side,
A bottom imaging means capable of imaging the suction nozzle from below;
Lateral image pickup means for taking a side image and a bottom image of the suction nozzle during the mounting operation during the first period after the electronic component suction operation is performed and before moving to the mounting position on the printed circuit board, and Control means for controlling the driving of the bottom surface imaging means and the nozzle holding member and capable of determining whether or not the electronic component is attracted to the suction nozzle in a normal posture based on the bottom surface image captured during the first period. And
The control means stores the bright spot threshold value for each component type in advance and compares the bright spot in the bottom image captured during the first period with the bright spot threshold value. If it is determined that there is a bright spot in this determination, it is determined whether or not a component is adsorbed based on the side image captured during the first period, and the bright spot is present. and if a part is determined not to be adsorbed, the surface mounting machine, characterized in that it is configured to determine that the suction nozzle is dirty.   The nozzle holding member is displaceable along one of two axes orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board placed on the base. The support member which supports a holding member on a base is provided, and the side imaging means is provided in at least one of a nozzle holding member and a support member. Surface mount machine.   The surface mounter according to claim 1, wherein the nozzle holding member has a plurality of suction nozzles. The control means includes a side imaging means, a bottom imaging means, and a bottom imaging means so as to capture a side image and a bottom image during a second period after the electronic component is mounted on the printed circuit board and moved to the suction position of the next electronic component. The nozzle holding member is controlled to determine whether or not there is a bright spot on the bottom surface of the suction nozzle based on the bottom image captured during the second period, and is captured during the second period. It is determined whether or not a part is sucked by the suction nozzle based on the side image, and if it is determined in the determination during the second period that there is a bright spot and the part is not sucked, the suction The surface mounter according to claim 1, wherein the nozzle is determined to be dirty. In addition, the control unit may further notify the operator of the fact that the suction nozzle is dirty when it is determined that the suction nozzle is dirty. The surface mounter according to claim 1, wherein the surface mounter is configured as described above.

Images