JP6529442B2 - Holding unit drive unit setting method, control device, component mounting device, and surface mounting machine - Google Patents

Description

  The technology disclosed herein relates to a holder driving unit setting method, a control device, a component mounting device, and a surface mounter.

  Conventionally, in a component mounting apparatus for mounting a component on a substrate, a rotating body and a plurality of suction nozzles supported by the rotating body so as to be movable in the rotational axis direction of the rotating body, and a circle centered on the rotating axis It is known to have a rotary head having a plurality of suction nozzles arranged on the circumference and sucking and releasing parts, and a drive unit for moving the suction nozzles in the direction of the rotation axis (for example, Patent Document 1) reference).

  Specifically, the electrical component mounting system described in Patent Document 1 includes a plurality of mounting devices (corresponding to component mounting devices). Each mounting device includes a mounting head (corresponding to a rotary head) holding a plurality of suction nozzles on one circumference, and moves the mounting head to a predetermined position in a substantially horizontal movement plane, The pressure gas is sent to a piston (corresponding to a drive unit) provided for each suction nozzle to integrally raise and lower the piston and the suction nozzle.

JP 2001-352199 A

  The mounting apparatus described in Patent Document 1 described above is provided with a drive unit for each suction nozzle, so it can be said that the mounting apparatus has a wide mountable area. However, in this case, since a drive unit must be provided for each suction nozzle, there is a problem that the configuration of the rotary head becomes complicated.

  In this specification, a technique is disclosed that widens the mountable area while simplifying the configuration of the rotary head.

  The holding unit driving unit setting method disclosed in the present specification is a holding unit driving unit setting method for a component mounting device that holds a component supplied at a component supply position and mounts the component on a substrate, and the component mounting device A rotating body, a head main body portion rotatably supporting the rotating body, a rotating body drive portion rotating and driving the rotating body, and a plurality of members supported by the rotating body movably in the rotation axis direction A component holding unit, which is arranged on a circumference centered on the rotation axis and holds and releases a component, and a plurality of holding units whose number is smaller than the number of the component holding units A driving unit, which is fixed to the head main body, and holds a plurality of holding unit driving units each moving the component holding unit moved to a predetermined driving position on the circumference in the rotation axis direction; Rotor having A head, and a head transport unit for transporting the rotary head in a direction perpendicular to the rotation axis; each of the holder drive units includes a holder drive unit within a mountable area of the component mounting apparatus. The mountable area is divided into a plurality of small areas each including the unique area of the holder driving unit different from each other, and the small area is divided into each small area. The holding unit driving unit corresponding to the unique area included in the area is assigned, and the holding unit driving unit setting method is such that, with respect to each of the parts mounted on the substrate, the part supply position of the parts is The holder drive unit assigned to the small area to which it belongs is initialized as a holder drive unit used to hold the part. Including the initial setting process.

  According to the above-described holder drive unit setting method, the number of holder drive units is smaller than the number of component holders, so the configuration of the rotary head can be simplified. Further, according to the holding unit driving unit setting method described above, for each component to be mounted on the substrate, a unique region included in the small area to which the component supply position of the component belongs as a holding unit driving unit used to hold the component. Since the holder driving unit corresponding to the above is initialized, it is possible to widen the mountable area of the component mounting apparatus as compared to the case where the other holder driving units are initialized. Therefore, according to the holding unit drive unit setting method described above, the mountable area can be widened while simplifying the configuration of the rotary head.

  In addition, for each of the components mounted on the substrate after the initial setting step, the components can be held using the holding unit driving units other than the holding unit driving units initially set for the components. If it is determined that the component can be held in the first determination step of determining whether or not there is a hold in the first determination step, the component is used rather than using the holding unit drive unit initially set as the component. It is judged in the second judgment step of judging whether or not the part can be held in a short time by using the other holder drive unit capable of holding, and judged in the second judgment step that the holding can be held in a short time And resetting the other holder driving unit as the holder driving unit used for holding the part.

  According to the holding unit drive unit setting method described above, for each component mounted on the substrate, the second determination step if there is no holding unit drive unit capable of holding the component other than the initially set holding unit drive unit. In addition to the case where the second determination step is always executed regardless of whether or not there is a holding unit driving unit capable of holding the part other than the initially set holding unit driving unit, the calculation cost is reduced. It can be reduced. Thus, it is possible to efficiently reset the holder driving unit used to hold the component.

  Further, the holding unit driving unit setting method disclosed in the present specification is a holding unit driving unit setting method of a component mounting device for holding a component supplied at a component supply position and mounting the component on a substrate, the component mounting device A rotating body, a head main body rotatably supporting the rotating body, a rotating body driving unit rotating the rotating body, and the rotating body movably supported in the rotation axis direction A plurality of component holders, which are arranged on a circumference centered on the rotation axis and hold and release components, and a number of which is smaller than the number of the component holders. A plurality of holding unit driving units, each holding unit driving unit being fixed to the head body and moving the component holding unit moved to a predetermined driving position on the circumference in the rotation axis direction; Have And a head transport unit for transporting the rotary head in a direction perpendicular to the rotation axis, and each of the holder drive units includes a holder drive unit within a mountable area of the component mounting apparatus. The mountable area is divided into a plurality of small areas including the unique areas of the holder driving units different from each other, and the small areas are respectively divided into the small areas. The holding unit driving unit corresponding to the unique area included in the area is assigned, and the holding unit driving unit setting method is such that the mounting position of the part belongs to each of the parts mounted on the substrate. Initialize the holding unit driving unit allocated to the small area as a holding unit driving unit used for mounting the part Including the period setting step.

  According to the above-described holder drive unit setting method, the number of holder drive units is smaller than the number of component holders, so the configuration of the rotary head can be simplified. Further, according to the holding unit driving unit setting method described above, for each component to be mounted on the substrate, as a holding unit driving unit used for mounting the component, in the unique region included in the small area to which the mounting position of the component belongs Since the corresponding holder driving unit is initialized, the mountable area of the component mounting apparatus can be wider than when other holder driving units are initialized. Therefore, according to the holding unit drive unit setting method described above, the mountable area can be widened while simplifying the configuration of the rotary head.

  Further, after the initial setting step, for each of the components to be mounted on the substrate, the components can be mounted using the holding unit driving units other than the holding unit driving units initially set for the components. When it is determined that mounting is possible in the third determination step of determining whether there is any, and in the third determination step, the component is used rather than using the holding unit drive unit initially set as the component. It is determined that mounting can be performed in a short time in the fourth determination step of determining whether or not the component can be mounted in a short time by using the other mountable unit driving unit that can be mounted. And resetting the other holder driving unit as the holder driving unit used for mounting the component.

  According to the holding unit drive unit setting method described above, the fourth determination process is performed on each component mounted on the substrate if there is no holding unit drive unit capable of mounting the component other than the initially set holding unit drive unit. In addition to the case where the fourth determination step is always executed regardless of whether or not there is a holder drive unit capable of mounting the component other than the holder drive unit set in advance, the calculation cost can be calculated. It can be reduced. As a result, it is possible to efficiently reset the holder driving unit used to mount the component.

  The component mounting apparatus holds the components supplied at the plurality of component supply positions arranged in a row and mounts the components on the substrate, and the two holding unit driving units and the components And an imaging unit configured to image the component held by the holding unit, wherein the two holding unit driving units are disposed on both sides in the arrangement direction of the plurality of component supply positions with the rotating body interposed therebetween. The mountable area is a straight line passing through the rotation center of the rotating body when the imaging unit captures an image of the component as viewed from the rotation axis direction, and a straight line orthogonal to the arrangement direction of the plurality of component supply positions. It may be divided into two said small areas.

  According to the holding unit driving unit setting method, each component holding unit is compared with the case where a straight line dividing the mountable region into two small regions does not pass through the rotation center of the rotating body when imaging a component by the imaging unit. The moving distance in the above-described arrangement direction when moving the rotary head to the imaging position of the imaging unit after holding the component can be shortened. Alternatively, it is possible to shorten the moving distance in the above-described arrangement direction when moving the rotary head to the mounting position of the component to be mounted first after the component is imaged by the imaging unit. This allows components to be mounted in a shorter time.

  Further, the control device disclosed in the present specification is a control device of a component mounting device that holds a component supplied at a component supply position and mounts the component on a substrate, wherein the component mounting device includes a rotating body and the rotation. A head body portion rotatably supporting a body, a rotation body drive portion rotating the rotation body, and a plurality of component holding portions supported by the rotation body so as to be movable in a rotation axis direction, A plurality of component holding units arranged on a circumference centered on the rotation axis and holding and releasing components, and a plurality of holding unit driving units whose number is smaller than the number of the component holding units, A rotary head having a plurality of holding unit driving units fixed to the head main body and moving the component holding units each moved to a predetermined driving position on the circumference in the rotation axis direction; Said rotary A head transport unit for transporting the heads in a direction perpendicular to the rotation axis, and each of the holding unit drive units is configured to receive the component only by the holder drive unit within the mountable area of the component mounting apparatus. There is an inherent area which can be held, the mountable area is divided into a plurality of small areas each including the unique area of the holder driving unit different from each other, and each small area is included in the small area And the control unit is assigned to the small area to which the component supply position of the component belongs for each of the components mounted on the substrate. An initial setting process is performed to initialize the holding unit driving unit as a holding unit driving unit used to hold the component.

  According to the above control device, the mountable area can be widened while simplifying the configuration of the rotary head.

  Further, the control device disclosed in the present specification is a control device of a component mounting device that holds a component supplied at a component supply position and mounts the component on a substrate, wherein the component mounting device includes a rotating body and the rotation. A head body portion rotatably supporting a body, a rotation body drive portion rotating the rotation body, and a plurality of component holding portions supported by the rotation body so as to be movable in a rotation axis direction, A plurality of component holding units arranged on a circumference centered on the rotation axis and holding and releasing components, and a plurality of holding unit driving units whose number is smaller than the number of the component holding units, A rotary head having a plurality of holding unit driving units fixed to the head main body unit and moving the component holding units moved to a predetermined driving position on the circumference in the rotation axis direction; Rotary A head transport unit for transporting the tray in a direction perpendicular to the rotation axis, and the components are mounted on each of the storage unit drive units only by the storage unit drive unit within the mountable area of the component mounting apparatus There is a possible unique area, and the mountable area is divided into a plurality of small areas each including the unique area of the holder driving unit different from each other, and each small area is included in the small area The holding unit driving unit corresponding to the specific area is assigned, and the control device is configured to, for each of the parts mounted on the substrate, the holding assigned to the small area to which the mounting position of the part belongs. An initial setting process is performed to initialize the partial drive unit as a holding unit drive unit used to mount the part.

  According to the above control device, the mountable area can be widened while simplifying the configuration of the rotary head.

  The component mounting apparatus disclosed in the present specification is a component mounting apparatus that holds a component supplied at a component supply position and mounts the component on a substrate, and rotatably supports the rotating body and the rotating body. A head body portion, a rotary body drive portion for rotationally driving the rotary body, and a plurality of component holding portions supported by the rotary body so as to be movable in the direction of the rotation axis, centering on the rotation axis A plurality of component holding units arranged on the circumference and holding and releasing components, and a plurality of holding unit driving units whose number is smaller than the number of the component holding units, and fixed to the head main body A rotary head having a plurality of holding unit driving units for moving the component holding unit moved to a predetermined driving position on the circumference in the direction of the rotation axis, and the rotary head orthogonal to the rotation axis The Comprising a head transport portion for transporting direction, and a control device according to claim 6 or claim 7.

  According to the above component mounting apparatus, the mountable area can be widened while simplifying the configuration of the rotary head.

  A surface mounter disclosed in the present specification includes a component mounting apparatus according to claim 8, a component supply apparatus for supplying the component to the component mounting apparatus, and a component of the component by the component mounting apparatus for the substrate. And a substrate transfer device for transferring to a mounting position.

  According to the above surface mounter, the mountable area can be widened while simplifying the configuration of the rotary head.

  According to the technology disclosed herein, the mountable area can be expanded while simplifying the configuration of the rotary head.

Top view of the surface mounter according to the first embodiment Perspective view of the rotary head The perspective view which expands and shows a part of rotary head Top view of the rotary head Block diagram showing the electrical configuration of the surface mounter Schematic diagram showing mountable area, small area, and unique area Flow chart of setting process of Z axis drive Flow chart of initial setting process of Z-axis drive Flow chart of resetting process of Z-axis drive A schematic diagram for explaining the moving time of the Z-axis drive device Flow chart of initial setting process at mounting according to the second embodiment The schematic diagram which shows an example of the mountable area | region which concerns on Embodiment 3, a small area | region, and an intrinsic | native area | region The schematic diagram which shows the mountable area | region which concerns on Embodiment 3, the small area | region, and the other example of an intrinsic | native area | region

First Embodiment
Embodiment 1 will be described with reference to FIGS. 1 to 10. In the following description, mounting an electronic component on a printed circuit board means that the electronic component supplied at the component supply position is adsorbed (one example of holding) and the adsorbed electronic component is mounted on the mounting position on the printed circuit board. .

(1) Overall Configuration of Surface Mounter As shown in FIG. 1, the surface mounter 1 according to the present embodiment includes a base 10 and a conveyer 20 for conveying a printed board B1 (an example of a board) Component mounting device 30 for mounting an electronic component E1 (an example of a component) on a printed circuit board B1, and a component supply device 40 for supplying the electronic component E1 to the component mounting device 30, and the like.

The base 10 has a rectangular shape in plan view and a flat upper surface. Further, a backup plate (not shown) or the like for backing up the printed circuit board B1 when the electronic component E1 is mounted on the printed circuit board B1 is provided below the transport conveyor 20 in the base 10.
In the following description, the long side direction (left and right direction in FIG. 1) of the base 10 is the X axis direction, and the short side direction (front and rear direction in FIG. 1) of the base 10 is the Y axis direction. (The vertical direction in FIG. 2) is taken as the Z-axis direction.

  The transport conveyor 20 is disposed substantially at the center of the base 10 in the Y-axis direction, and transports the printed circuit board B1 along the transport direction (X-axis direction). The conveyer 20 includes a pair of conveyer belts 22 that are driven to circulate in the conveying direction. The printed circuit board B1 is set so as to bridge the two conveyor belts 22. The printed circuit board B1 is carried from one side in the transport direction (right side as shown in FIG. 1) along the conveyor belt 22 to the working position on the base 10 (position enclosed by the two-dot chain line in FIG. 1) and stopped at the working position After the electronic component E1 is mounted, it is carried out along the conveyor belt 22 to the other side (left side shown in FIG. 1).

The component supply device 40 is a feeder type, and is disposed at four locations in total at two locations aligned in the X-axis direction on both sides (upper and lower sides in FIG. 1) of the transport conveyor 20. A plurality of feeders 42 are attached to the component supply devices 40 in line in the left-right direction.
Each feeder 42 is a reel (not shown) around which a component supply tape (not shown) containing a plurality of electronic components E1 is wound, an electrically driven delivery device (not shown) for drawing out the component supply tape from the reel, etc. The electronic component E1 is supplied one by one from the component supply position provided at the end located on the transport conveyor 20 side.

  Here, as shown in FIG. 1, the plurality of component supply positions are arranged in a line in the left-right direction, and two adjacent component supply positions are intervals that are divisors of the diameter of a circumference 66 (see FIG. 4) described later. It is arranged by. The left-right direction is an example of the arrangement direction of a plurality of component supply positions.

The component mounting device 30 has a pair of support frames 32 provided above the base 10 and a component supply device 40 described later, a rotary head 50, and a rotation axis of a rotating body 60 (see FIG. 3) described later. And a head transport unit for transporting in a direction perpendicular to the direction.
Each support frame 32 is located on both sides of the base 10 in the X-axis direction, and extends in the Y-axis direction. The support frame 32 is provided with an X-axis servo mechanism and a Y-axis servo mechanism which constitute a head conveyance unit. The rotary head 50 is movable in the X-axis direction and the Y-axis direction within a fixed movable region by an X-axis servo mechanism and a Y-axis servo mechanism.

  The Y-axis servo mechanism has a Y-axis guide rail 33Y, a Y-axis ball screw 34Y in which a ball nut (not shown) is screwed, and a Y-axis servomotor 35Y. A head support 36 fixed to a ball nut is attached to each Y-axis guide rail 33Y. When the Y-axis servomotor 35Y is controlled to be energized, the ball nut advances and retracts along the Y-axis ball screw 34Y. As a result, the head support 36 fixed to the ball nut and the rotary head 50 to be described later It moves in the Y-axis direction along the rail 33Y.

  The X-axis servo mechanism has an X-axis guide rail (not shown), an X-axis ball screw 34X in which a ball nut (not shown) is screwed, and an X-axis servomotor 35X. A rotary head 50 is movably attached to the X-axis guide rail along its axial direction. When the X-axis servomotor 35X is energized and controlled, the ball nut advances and retracts along the X-axis ball screw 34X. As a result, the rotary head 50 fixed to the ball nut moves in the X-axis direction along the X-axis guide rail Do.

  Further, in the vicinity of the work position on the base 10, a component recognition camera C2 for capturing an image of the electronic component E1 adsorbed from the component supply position by the rotary head 50 is fixed. The component recognition camera C2 is configured as a line sensor in which a plurality of light receiving elements are arranged in a line in the left-right direction. The component recognition camera C2 is an example of an imaging unit.

(2) Configuration of Rotary Head Next, the configuration of the rotary head 50 will be described with reference to FIGS. 2 to 4. As shown in FIG. 2, the rotary head 50 has an arm shape in which the head main body 52 which is the main body is covered by the covers 53 and 54, and the electronic component E1 supplied by the component supply device 40 is adsorbed and printed. It mounts on board | substrate B1.

  As shown in FIG. 3, the rotating body 60 is provided around a shaft 62 having an axial shape along the Z-axis direction and the shaft 62 at the lower end of the rotary head 50, and has a diameter substantially larger than that of the shaft 62. And a cylindrical shaft holding portion 64. The shaft 62 is supported by the head main body 52 so as to be capable of rotating (i.e., pivotable) in both directions around the axis of the shaft 62.

  The shaft portion 62 has a double structure, and an N-axis driven gear 62N is provided around the axis of the shaft portion 62 at the upper portion of the inner shaft portion 62 (hereinafter referred to as "N axis"). An R-axis driven gear 62R is provided around the axis of the shaft portion 62 at the upper portion of the shaft portion 62 (hereinafter referred to as "R-axis").

  An N-axis driving device (an example of a rotating body driving unit) (not shown) for rotationally driving the rotating body 60 is disposed at a substantially central portion in the Z-axis direction of the rotary head 50. The N-axis drive device has an N-axis servomotor 35N (see FIG. 5) and an N-axis drive gear (not shown) provided around the output axis of the N-axis servomotor 35N. The N-axis drive gear is engaged with the N-axis driven gear 62N, and when the N-axis servomotor 35N is controlled to be energized, the rotary body 60 is driven via the rotational drive of the N-axis drive gear and the N-axis driven gear 62N. Are rotated at an arbitrary angle around the rotation axis 61 (see FIG. 4) along the Z-axis direction.

  In the shaft holding portion 64 of the rotating body 60, a plurality of (18 in the present embodiment) through holes are formed at equal intervals in the circumferential direction. In each through hole, a nozzle shaft 55 having a shaft shape is held so as to extend along the Z-axis direction while penetrating the shaft holding portion 64 via a cylindrical shaft holder 57. Further, at lower end portions of the nozzle shafts 55 projecting downward from the shaft holding portion 64, suction nozzles 56 (an example of a component holding portion) that suction the electronic component E1 are provided.

  Each suction nozzle 56 is supplied with negative pressure or positive pressure. Each suction nozzle 56 sucks and holds the electronic component E1 at its tip by negative pressure, and releases the electronic component E1 held at its tip by positive pressure. When the rotary body 60 is rotated by the N-axis drive device, the suction nozzles 56 provided on the nozzle shafts 55 together with the nozzle shafts 55 rotationally move (revolve) around the rotation axis 61 of the rotary body 60.

  Further, as shown in FIG. 2, an R-axis driving device 70 for rotationally driving each nozzle shaft 55 around its axis is disposed at a substantially central portion of the rotary head 50 in the Z-axis direction. The R-axis drive device 70 has an R-axis servomotor 35R and an R-axis drive gear (not shown) provided around the output axis of the R-axis servomotor 35R and engaged with the R-axis driven gear 62R. . A common gear not shown is provided below the R-axis driven gear 62R in the outer shaft portion 62 provided with the R-axis driven gear 62R.

  On the other hand, as shown in FIG. 3, each shaft holder 57 is provided with a nozzle gear 57R around its cylinder axis. The nozzle gear 57R provided on each nozzle shaft 55 is engaged with the common gear. When the R-axis servomotor 35R is controlled to be energized, the common gear is rotated via rotational driving of the R-axis drive gear and the R-axis driven gear 62R.

When the common gear rotates, the shaft holders 57 rotate by meshing with the nozzle gear 57R. And since each shaft holder 57 and each nozzle shaft 55 are in a ball spline connection, the eighteen nozzle shafts 55 are simultaneously rotated in the same direction and at the same angle around the axis with the rotation of the common gear.
Further, a spring stopper bolt 58 is screwed into the upper end portion of each nozzle shaft 55. Further, a winding spring 59 is disposed on the outer peripheral surface side of each nozzle shaft 55 between the spring fixing bolt 58 and the shaft holder 57.

  Further, as shown in FIG. 3 and FIG. 4, the rotary head 50 has moved to the drive positions 300 A, 300 B on the circumference 66 where the nozzle shaft 55 is arranged among the 18 nozzle shafts 55. Is provided with two Z-axis drive devices 80 (an example of a holding unit drive unit) for raising and lowering the rotary unit 60 in the direction (Z-axis direction, vertical direction) along the shaft 62 of the rotary unit 60. ing.

  The two Z-axis driving devices 80 have the same structure, and are symmetrically disposed on the left and right sides of the rotating body 60. That is, the two Z-axis drive devices 80 are disposed on both sides of the rotating body 60 in the arranging direction of the plurality of component supply positions.

  As shown in FIG. 3, the Z-axis drive device 80 has a Z-axis drive source 82 and a Z-axis movable portion 84 extending downward from the Z-axis drive source 82. Inside the Z-axis drive source 82, a Z-axis linear motor 35Z (see FIG. 5) for driving the Z-axis movable portion 84 by linear motor drive is provided. The Z-axis movable portion 84 is supported movably in the direction along the shaft 62 with respect to the Z-axis drive source 82, and is raised and lowered in the direction along the shaft 62 by the Z-axis drive source 82.

  At the lower end portion of the Z-axis movable portion 84 in the Z-axis drive device 80, as shown in FIGS. 3 and 4, a cam follower 86 (hereinafter referred to as "Z-axis cam follower 86") rotates around an axis along the X-axis direction. Is rotatably attached to the The Z-axis movable portion 84 is disposed such that the Z-axis cam follower 86 approaches the upper end portion of the nozzle shaft 55 (that is, the upper end portion of the spring stopper bolt 58) at the drive position. It is supported by For this reason, in the state where the Z-axis movable portion 84 is at the rising end position, the pivoting around the shaft portion 62 of each nozzle shaft 55 is permitted.

  When the Z-axis movable portion 84 is lowered from the rising end position by the Z-axis drive source 82, the Z-axis cam follower 86 abuts on the upper end portion of the nozzle shaft 55 at the drive position, and the nozzle shaft 55 is a coil spring 59. It is lowered against elastic force. When the nozzle shaft 55 is lowered, the suction nozzle 56 provided on the nozzle shaft 55 is lowered, and the tip of the suction nozzle 56 approaches the component supply position or the printed circuit board B1. When the Z-axis movable portion 84 is raised from this state, the nozzle shaft 55 and the suction nozzle 56 are raised by the elastic force return force of the winding spring 59.

  Further, as shown in FIG. 3, the rotary head 50 includes a switching device 90 for switching the pressure supplied to each suction nozzle 56 between a negative pressure and a positive pressure. A total of 18 switching devices 90 are provided corresponding to each suction nozzle 56 (each nozzle shaft 55). Each switching device 90 is positioned between the adjacent two nozzle shafts 55 on the outer side of each nozzle shaft 55 disposed on the circumference 66, and like each nozzle shaft 55, They are provided at equal intervals along the outer circumference.

Each switching device 90 has a shaft-shaped valve spool 92 and a cylindrical sleeve 94 in which the lower portion of the valve spool 92 is accommodated.
Each sleeve 94 is attached to be inserted into the inside of each attachment hole provided in the shaft holding portion 64. Each valve spool 92 is disposed inside the sleeve 94 with its axial direction extending along the Z-axis direction (vertical direction), and is supplied to each suction nozzle 56 by moving along the axial direction. Switch between negative pressure and positive pressure. In the present embodiment, the description of the path through which the negative pressure and the positive pressure are supplied to each sleeve 94 is omitted.

  Each of the valve spools 92 has an abutment portion 93 on its upper portion, which is substantially U-shaped in a lateral direction and to which a V-axis cam follower 106 of a V-axis drive device 100 described later abuts. The valve spools 92 are arranged such that the open sides of the substantially U-shaped contact portions 93 are directed outward (opposite to the shaft 62 side).

  Further, as shown in FIGS. 2 and 3, the rotary head 50 is provided with two V-axis drive devices 100 for moving the valve spool 92 of each switching device 90 in the Z-axis direction (vertical direction). The two V-axis drive devices 100 have the same structure, and are symmetrically disposed on the left and right sides of the rotary head 50 with the shaft portion 62 of the rotating body 60 interposed therebetween.

  As shown in FIG. 3, the V-axis drive device 100 has a box-shaped V-axis drive source 102 and a V-axis movable portion 104 extending upward from the V-axis drive source 102. Inside the V-axis drive source 102, a V-axis linear motor 35V (see FIG. 5) for driving the V-axis movable unit 104 by linear motor drive is provided. The V-axis movable portion 104 is supported movably in a direction along the shaft 62 with respect to the V-axis drive source 102, and is raised and lowered in the direction along the shaft 62 by the V-axis drive source 102.

  A cam follower 106 (hereinafter, referred to as “V-axis cam follower 106”) is rotatably attached to an upper end portion of the V-axis movable portion 104 in the V-axis drive device 100 about an axis along the X-axis direction. The V-axis movable portion 104 is disposed such that the V-axis cam follower 106 is positioned inside the substantially U-shaped contact portion 93 with respect to the valve spool 92 corresponding to the nozzle shaft 55 at the drive position. It is supported by the drive source 102.

  When the V-axis movable portion 104 is moved upward by the V-axis drive source 102, the V-axis cam follower 106 abuts on the contact portion 93 to push up the valve spool 92, and negative pressure is supplied to the suction nozzle 56. On the other hand, when the V-axis movable portion 104 is moved downward by the V-axis drive source 102, the V-axis cam follower 106 abuts on the contact portions 93 located on both sides thereof to push down the valve spool 92. Pressure is supplied.

  The rotary head 50 is also provided with a substrate recognition camera C1 (see FIG. 5). The substrate recognition camera C1 integrally moves with the rotary head 50 to capture an image at an arbitrary position on the printed circuit board B1 stopped at the work position.

(3) Electrical Configuration of Surface Mount Machine Next, the electrical configuration of the surface mount machine 1 will be described with reference to FIG. The main body of the surface mounter 1 is entirely controlled by the control unit 110. The control unit 110 includes an arithmetic processing unit 111 configured by a CPU or the like. A motor control unit 112, a storage unit 113, an image processing unit 114, an external input / output unit 115, a feeder communication unit 116, a display unit 117, an input unit 118 and the like are connected to the arithmetic processing unit 111. The control unit 110 is an example of a control device.

The motor control unit 112 controls the rotation of each motor under the control of the arithmetic control unit 111.
The storage unit 113 is configured by a ROM (Read Only Memory) that stores a program for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. The storage unit 113 stores an optimization program 113A, a mounting program 113B, a board data 113C, and the like.

The board data 113C includes board information relating to the number of printed boards B1 to be mounted, mounting point data for each electronic component E1 mounted on the printed board B1 (type of electronic parts E1 mounted and type of mounting position, etc. Data, component supply information and the like regarding the number of electronic components E1 held by each feeder 42 of the component supply device 40, and the type of component.
In the present embodiment, the control unit 110 can specify the feeder 42 that supplies the electronic component E1 mounted at the mounting position indicated by the mounting point data by referring to the component supply information. Thus, the component supply position of the electronic component E1 mounted at the mounting position indicated by the mounting point data can be uniquely identified.

  The image processing unit 114 receives imaging signals output from the substrate recognition camera C1 and the component recognition camera C2, respectively. In the image processing unit 114, analysis of the component image and analysis of the substrate image are respectively performed based on the captured image signals from the cameras C1 and C2.

  The external input / output unit 115 is a so-called interface, and is configured to receive detection signals output from various sensors 115A provided in the main body of the surface mounter 1. In addition, the external input / output unit 115 is configured to perform operation control on the various actuators 115B based on the control signal output from the arithmetic processing unit 111.

  The feeder communication unit 116 is connected to the control unit of each feeder 42 attached to the component supply device 40, and controls the feeders 42 collectively. The control unit of each feeder 42 controls the drive of the motor for delivering the component supply tape.

  The display unit 117 is configured of a liquid crystal display device or the like having a display screen, and displays the state of the surface mounter 1 and the like on the display screen. The input unit 118 is configured of a keyboard or the like, and is configured to receive an input from the outside by a manual operation.

  In the surface mounter 1 configured as described above, the transport state in which the printed board B1 is transported to the work position on the base 10 by the transport conveyor 20 during the automatic operation, and the printed board B1 carried in the work position The implementation states implemented on top are alternately executed. In this mounted state, the suction operation for suctioning the electronic components E1 supplied by the component supply device 40 to the 18 suction nozzles 56 respectively, and the rotary head 50 in a state where the electronic components E1 are suctioned by the suction nozzles 56 respectively. The image pickup operation of conveying each of the electronic components E1 by the component recognition camera C2 and the mounting operation of conveying the rotary head 50 and mounting the electronic components E1 on the printed circuit board B1 are sequentially repeated.

(4) Setting of Z-Axis Drive Device Used for Adsorption and Z-Axis Drive Device Used for Mounting In the present embodiment, the optimization program 113A is executed in advance by the control unit 110 before starting mounting of the electronic component E1. . When the optimization program 113A is executed, using the substrate data 113C stored in the storage unit 113, the adsorption order of each electronic component E1, the mounting order of each electronic component E1, and the order in which the plurality of suction nozzles 56 adsorb the electronic component E1. Are calculated and stored in the storage unit 113.

  Here, although the case where the order in which the electronic components E1 are adsorbed to the plurality of suction nozzles 56 is calculated by the optimization program 113A will be described as an example, the clockwise rotation of the circumference 66 with reference to any of the suction nozzles 56 It may be set in advance in a fixed manner such as the order of 左 or the order of counterclockwise rotation.

  Then, in the present embodiment, the setting process of the Z-axis drive device 80 is also executed in the above-described optimization program 113A. In the setting process of the Z-axis drive device 80, for each electronic component E1 mounted on the printed circuit board B1, the Z-axis drive device 80 used for suction of the electronic component E1 and the Z-axis drive device used for mounting the electronic component E1 This is processing for setting 80 to the substrate data 113C.

  Here, first, with reference to FIG. 6, matters to be premised in setting the Z-axis drive device 80 will be described. In addition, in FIGS. 6 and 10 described below, the number of suction nozzles 56 is omitted to eight for easy understanding.

  A rectangular frame 120 indicated by a solid line in FIG. 6 indicates a mountable area where the rotary head 50 can adsorb and mount the electronic component E1. Further, in FIG. 6, a position 140 indicates the position where the drive position 300B of the Z-axis drive 80 on the right side is located when the rotary head 50 moves to the left end of the movable area, and a position 141 indicates that the rotary head 50 is in the movable area. The position where the drive position 300A of the Z-axis drive device 80 on the left side when moved to the right end is located is shown.

  The electronic component E1 supplied at the component supply position to the left of the position 140 described above can not be adsorbed unless it is the Z-axis drive 80 on the left side, and the electronic component E1 supplied at the component supply position to the right of the position 141 Can not be adsorbed unless it is the Z-axis drive unit 80 on the right side. On the other hand, the electronic component E1 supplied at the component supply position between the position 140 and the position 141 can also be attracted using the Z-axis drive 80 on the left side, or the Z-axis drive 80 on the right side. It can also be adsorbed using The same applies to mounting.

  The area 121 on the left side of the position 140 is an area where the electronic component E1 can not be adsorbed and mounted only in the mountable area 120 of the rotary head 50 without the Z-axis drive device 80 on the left side. The region 121 is referred to as a unique region 121 of the Z-axis drive device 80 on the left side. Similarly, the area 122 on the right side of the position 141 is an area where the electronic component E1 can not be adsorbed and mounted only in the mountable area 120 of the rotary head 50 without the Z-axis drive device 80 on the right side. The region 122 on the more right side is referred to as the unique region 122 of the Z-axis drive device 80 on the right.

  Further, in the present embodiment, unique regions of the Z-axis drive device 80 which are different from one another by division lines 123 orthogonal to the mountable region 120 of the rotary head 50 in the arranging direction of component supply positions (horizontal direction shown in FIG. 1). Are divided into two subregions 124, 125 that Although the details will be described later, the dividing line 123 is set between the position 140 and the position 141 in the left-right direction. The small area 124 on the left is a small area that includes the unique area 121 of the Z-axis drive 80 on the left, and the small area 125 on the right is a small area that includes the unique area 122 on the Z-axis drive 80 on the right It is an area. The dividing line 123 is an example of a straight line.

  Further, in the present embodiment, the Z-axis drive device 80 corresponding to the unique area included in the small area is assigned to each small area. Specifically, since the small area 124 on the left side includes the unique area 121 of the Z-axis drive 80 on the left side, the Z-axis drive 80 on the left is allocated to the small area 124 on the left. Similarly, since the small area 125 on the right side includes the unique area 122 of the Z-axis drive 80 on the right side, the Z-axis drive 80 on the right is allocated to the small area 125 on the right.

(4-1) Setting Process of Z-Axis Drive Device Next, the setting process of the Z-axis drive device will be described with reference to FIG. The present process is started when the operator operates the input unit 118 to instruct the control unit 110 to execute the optimization program 113A.

In S101, the control unit 110 reads the substrate data 113C stored in the storage unit 113.
In S102, the control unit 110 selects one mounting point data from the substrate data 113C.

  In step S103, the control unit 110 executes an initial setting process of the Z-axis drive device for the mounting point data selected in step S102. Although the details will be described later, the initial setting process of the Z-axis drive device includes the Z-axis drive device 80 used for suction of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data, and the electronic component E1. In this processing, the Z-axis drive device 80 used for mounting is initialized to the selected mounting point data. S103 is an example of the initial setting process.

  In S104, the control unit 110 executes a reset process of the Z-axis drive device. Although the details will be described later, in the resetting process of the Z-axis drive device, the electronic component E1 can be obtained by using another Z-axis drive device 80 other than the Z-axis drive device 80 initially set in S103. Whether it can be adsorbed or mounted in a short time, if it can be adsorbed or mounted in a short time, Z axis drive used for suction or mounting of the electronic component E1 mounted in the mounting position indicated by the mounting point data This is processing for resetting another Z-axis drive device 80 as the device 80 to the mounting point data.

  In step S105, the control unit 110 determines whether or not all the loading point data have been selected. If all the loading point data have been selected, this processing ends, and if there is any loading point data that has not been selected yet. The process returns to S102 to repeat the process.

(4-2) Initial Setting Process of Z-Axis Drive Device Next, the initial setting process of the Z-axis drive device executed in S103 described above will be described with reference to FIG.

In step S201, the control unit 110 assigns the mounting point data selected in step S102 to a small area to which the component supply position of the electronic component E1 mounted at the mounting position indicated by the mounting point data belongs. Is initially set as a Z-axis drive device 80 used for suction of the electronic component E1.
For example, when the component supply position of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data belongs to the small area 124 on the left side, the control unit 110 uses the Z axis drive device used to adsorb the electronic component E1. As 80, the left Z-axis drive 80, which is the Z-axis drive 80 allocated to the left small area 124, is initialized. The same applies to the small area 125 on the right side.

In S202, the control unit 110 sets the Z-axis drive device 80 assigned to the small area to which the mounting position indicated by the mounting point data belongs to the selected mounting point data, of the electronic component E1 mounted at the mounting position. For example, when the mounting position indicated by the selected mounting point data belongs to the small area 124 on the left side, the control unit 110 mounts at the mounting position indicated by the mounting point data. As the Z-axis drive device 80 used for mounting the electronic component E1 to be processed, the Z-axis drive device 80 on the left side, which is the Z-axis drive device 80 allocated to the small area 124 on the left side, is initialized. The same applies to the small area 125 on the right side.

(4-3) Resetting Process of Z-Axis Drive Device Next, the resetting process of the Z-axis drive device executed in S104 described above will be described with reference to FIG. 9 and FIG.

  At S301, control unit 110 uses electronic component E1 mounted at the mounting position indicated by the mounting point data selected at S102 using another Z-axis drive 80 other than Z-axis drive 80 initially set at S103. It is determined whether or not adsorption is possible. S301 is an example of a first determination step.

  Specifically, the control unit 110 performs a soft limit check on the component supply position of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data, with respect to the other Z axis drive device 80. The soft limit check for the component supply position means that, when the electronic component E1 is adsorbed by a certain Z-axis drive device 80, the component supply position of the electronic component E1 is within the area where the Z-axis drive device 80 can adsorb. It means to judge.

For example, in the case of the Z-axis drive 80 on the right side, the characteristic region 122 of the Z-axis drive 80 on the right side shown in FIG. 6 and the Z-axis drive 80 on the right side An area 126 capable of attracting the component E1 is an area which can be attracted by the Z-axis drive device 80 on the right.
If the component supply position of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data is within the area where the other Z-axis drive device 80 can adsorb, the check result of the soft limit check becomes OK. If it is not in the area, the check result is NG. When the check result of the soft limit check is OK, the control unit 110 proceeds to S302, and when the check result is NG, proceeds to S304.

  In S302, the control unit 110 performs Z axis drive device 80 other than the Z axis drive device 80 which is initially set for the electronic component E1 mounted at the mounting position indicated by the selected mounting point data. Is used to determine whether adsorption can be performed in a short time. If adsorption can be performed in a short time, the process proceeds to step S303. If adsorption is not possible in a short time, the process proceeds to step S304. S302 is an example of a second determination step. Hereinafter, this will be specifically described with reference to FIG.

  As described above, in the present embodiment, by executing the optimization program 113A, the order in which the plurality of suction nozzles 56 suction the electronic component E1 is set. In FIG. 10, the position 145 is the position (circumferential) of the suction nozzle 56 (hereinafter simply referred to as "next suction nozzle 56") for suctioning the electronic component E1 next when suction of the electronic component E1 by one suction nozzle 56 is finished. And the position 146 indicates the component supply position to which the electronic component E1 to be adsorbed next is supplied.

  The control unit 110 causes one of the suction nozzles 56 to suck the electronic component E1, and then uses one of the Z-axis drive devices 80 to cause the next suction nozzle 56 (in FIG. 7, suction nozzle 56 at position 145) to When the component E1 is sucked, the next suction nozzle 56 is rotationally moved to the drive position 300 of the Z-axis drive 80 about the rotation axis 61, and the rotary head 50 is moved to move the Z-axis drive In parallel with the head moving operation of moving the 80 drive positions 300 to the component supply position where the next electronic component E1 is supplied.

  These move operations are initiated almost simultaneously. Therefore, when the electronic component E1 is adsorbed to the next suction nozzle 56 using one of the Z-axis drive devices 80, the next suction nozzle 56 is rotated around the rotation axis 61 to the drive position 300 of the Z-axis drive device 80. Any of the time Tr for rotating and moving, and the time Txy for moving the drive position 300 of the Z-axis drive unit 80 to the component supply position to which the electronic component E1 to be attracted next is moved by moving the rotary head 50 either. The larger one is the moving time T in the case of suction using the Z-axis drive device 80.

  For example, Tr1, Txy1, T1, Tr2, Txy2, and T2 are defined as follows. Here, with the selected mounting point data, the Z-axis driving device 80 on the left side is initially set as the Z-axis driving device 80 used for suction of the electronic component E1 mounted at the mounting position indicated by the mounting point data. Do.

Tr1: Time to rotationally move the next suction nozzle 56 to the drive position 300 of the Z-axis drive device 80 that is set initially (here, the drive position 300A of the Z-axis drive device 80 on the left) Txy1: Initial The time for moving the set driving position 300A of the Z-axis driving device 80 to the component supply position 146 of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data T1 ... Tr1 and Txy1 Whichever is larger

Tr 2... Until the next suction nozzle 56 is driven to the drive position 300 of another Z-axis drive 80 other than the Z-axis drive 80 which is initially set (here, the drive position 300 B of the Z-axis drive 80 on the right) Time to rotate and move Txy2: Time to move the drive position 300B of another Z-axis drive device 80 to the component supply position 146 of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data T2 ···・ The larger one of Tr2 and Txy2

In this case, in the case of T1 <T2, it is possible to adsorb in a short time by adsorbing using the Z-axis drive device 80 set in the initial setting. On the contrary, in the case of T1> T2, if it adsorbs using other Z axis drive unit 80, it can adsorb in a short time.
Therefore, with respect to the selected mounting point data, the control unit 110 controls the rotary head 50 when the suction of the electronic component E1 adsorbed immediately before the electronic component E1 mounted at the mounting position indicated by the mounting point data is completed. Position, position of next suction nozzle 56 (position on circumference 66), component supply position of electronic component E1 mounted at mounting position indicated by selected mounting point data, rotational speed of rotating body 60, rotary head 50 The movement time T is calculated for each Z-axis drive 80 from the movement speed of the other Z-axis drive, and when the movement time T of the other Z-axis drive 80 is shorter, adsorption is performed using the other Z-axis drive 80 It is judged that one can adsorb in a short time.

  In S303, the control unit 110 resets another Z-axis drive device 80 as the Z-axis drive device 80 used for suctioning the electronic component E1 mounted at the mounting position indicated by the selected mounting point data. S303 is an example of a reset process.

  In S304, can the electronic component E1 be mounted on the mounting position indicated by the selected mounting point data using the other Z-axis driving device 80 other than the Z-axis driving device 80 initially set in S201? Decide whether or not. Specifically, the control unit 110 performs a soft limit check on the mounting position indicated by the selected mounting point data with respect to the other Z axis drive device 80. Then, when the check result of the soft limit check is OK, the control unit 110 proceeds to S305, and in the case of NG, returns to the setting process of the Z-axis drive device shown in FIG. S304 is an example of a third determination step.

  In step S305, the control unit 110 determines whether the electronic component E1 can be mounted in a short time by using the other Z axis drive device 80 for the selected mounting point data, and can be mounted in a short time. The process proceeds to step S306, and when the mounting can not be performed in a short time, the process returns to the setting process of the Z-axis drive device illustrated in FIG. Since this determination is substantially the same as S302 except that the component supply position is replaced with the mounting position, the description will be omitted. S305 is an example of a fourth determination step.

  In S306, the control unit 110 resets another Z-axis drive device 80 as the Z-axis drive device 80 used for mounting the electronic component E1 mounted at the mounting position indicated by the selected mounting point data. S306 is an example of a resetting step.

(4-4) Division Line Next, the division line 123 described above will be described with reference to FIG. In the present embodiment, the dividing line 123 is set based on the position of the rotation axis 61 of the rotary head 50 when the electronic component E1 is imaged by the component recognition camera C2. The details will be described below.

  In the present embodiment, the control unit 110 sucks the electronic component E1 supplied by the component supply device 40 by the suction nozzle 56 and picks up the electronic component E1 with the component recognition camera C2, thereby detecting the attitude of the electronic component E1. Do. In the imaging of the electronic component E1, after the electronic component E1 is sucked by the 18 suction nozzles 56, the rotary head 50 is moved so as to pass above the component recognition camera C2 in the front-rear direction. Then, the two-dimensional image representing the rotary head 50 is generated by imaging the rotary head 50 in time series by the component recognition camera C2.

  The dividing line 123 is a straight line passing through the rotation center of the rotary head 50 when the rotary head 50 is imaged by the component recognition camera C2 when viewed from the direction of the rotation axis 61, and extends straight in the front-rear direction It is set as an example of a straight line orthogonal to the arrangement direction of the positions. The reason for doing this will be described below.

  The rotary head 50 sucks the electronic component E1 having the slowest suction order among the 18 electronic components E1 to be sucked in one suction operation, and then moves to a position imaged by the component recognition camera C2. In this case, when the component supply position of the electronic component E1 with the slowest suction order is on the left side of the rotation center of the rotary head 50 when the rotary head 50 is imaged by the component recognition camera C2, the Z-axis drive on the left side When suction is performed using 80, as compared with the case where suction is performed using the Z-axis drive device 80 on the right, the X-axis direction when moving to the position of the component recognition camera C2 after the suction of the electronic component E1 ends. The moving distance of can be shortened. The same is true for the small area on the right.

  Further, after the rotary head 50 is photographed by the component recognition camera C2, when the electronic component E1 having the earliest mounting order among the electronic components E1 being adsorbed is mounted at the mounting position, the rotary head 50 When mounted using the Z-axis drive device 80 on the left side when mounted on the left side of the rotation center of the rotary head 50 when imaging is performed by the component recognition camera C2, mounting is performed using the Z-axis drive device 80 on the right side Compared to the case where the electronic component E1 is imaged by the component recognition camera C2, the moving distance in the X-axis direction when moving to the mounting position of the electronic component E1 can be shortened. The same is true for the right area.

  When the dividing line 123 is set based on the rotation axis line 61 of the rotary head 50 when the electronic part E1 is imaged by the part recognition camera C2, the rotary head 50 when the rotary head 50 is imaged by the part recognition camera C2. With regard to the electronic component E1 supplied at the component supply position on the left side of the rotation center, the Z-axis drive device 80 on the left side is initialized as the Z-axis drive device 80 used for suction. The same is true for the right side. In addition, the same applies to mounting.

  Therefore, when the electronic component E1 is picked up by the component recognition camera C2 after the suction of the electronic component E1 having the latest suction order is finished and the electronic component E1 is picked up by the component recognition camera C2 and printed. The moving distance of the rotary head 50 in the X-axis direction when mounted on the substrate B1 can be shortened. Thereby, the time which mounting of electronic component E1 requires can be shortened.

(5) Effects of the Embodiment According to the holding unit drive unit setting method according to the first embodiment described above, the number of Z-axis drive devices 80 is smaller than the number of suction nozzles 56, so the configuration of the rotary head 50 is simplified. be able to. Further, according to the holding unit drive unit setting method according to the first embodiment, for each electronic component E1 mounted on the printed circuit board B1, component supply of the electronic component E1 as the Z-axis drive device 80 used for suctioning the electronic component E1. Since the Z-axis drive unit 80 corresponding to the specific area included in the small area to which the position belongs is initialized, the mountable area of the component mounting apparatus 30 can be compared with the case where the other Z-axis drive units 80 are initialized. It can be made wider. Therefore, according to the holding unit drive unit setting method, the mountable area can be widened while simplifying the configuration of the rotary head 50.

  Furthermore, according to the holding unit drive unit setting method according to the first embodiment, the electronic components E1 other than the Z-axis drive device 80 initially set to the electronic components E1 are electronic components E1 mounted on the printed circuit board B1. When there is no Z-axis drive device 80 that can be used for suction, S302 (the second determination step) is not performed, so it is used for suction of the electronic component E1 other than the Z-axis drive device 80 that is initially set. The calculation cost can be reduced as compared with the case where the second determination step is always performed regardless of whether or not there is the Z-axis drive device 80 capable of doing so. Thereby, the reset of the Z-axis drive device 80 used for holding the electronic component E1 can be efficiently performed.

  Further, according to the holding unit drive unit setting method according to the first embodiment, the mounting position of the electronic component E1 as the Z-axis drive device 80 used for mounting the electronic component E1 for each electronic component E1 mounted on the printed circuit board B1. Since the Z-axis drive unit 80 corresponding to the specific area included in the small area to which the X-axis belongs is initialized, the mountable area of the component mounting apparatus 30 is wider compared to the case where the other Z-axis drive units 80 are initialized. can do.

  In addition, according to the holding unit drive unit setting method according to the first embodiment, the electronic component E1 other than the Z-axis drive device 80 initially set to the electronic component E1 for each electronic component E1 mounted on the printed circuit board B1. If there is no Z-axis drive 80 capable of mounting the S, the step S305 (the fourth determination step) is not executed. Therefore, the Z-axis drive capable of mounting the electronic component E1 other than the Z-axis drive 80 set initially. The calculation cost can be reduced as compared with the case where the fourth determination step is always performed regardless of whether there is 80 or not. Thus, the Z-axis drive device 80 used for mounting the electronic component E1 can be efficiently reset.

  Further, according to the holding unit drive unit setting method according to the first embodiment, the rotating body 60 when the straight line (division line 123) dividing the mountable area into two small areas captures the electronic component E1 by the component recognition camera C2. In the X-axis direction when moving the rotary head 50 to the imaging position of the component recognition camera C2 after holding the electronic component E1 by each suction nozzle 56 (in comparison with the case where it does not pass through the rotation center of Moving distance can be shortened. Further, the moving distance in the X-axis direction when moving the rotary head 50 to the mounting position of the electronic component E1 to be mounted first after the electronic component E1 is imaged by the component recognition camera C2 can be shortened. Thereby, the electronic component E1 can be mounted in a shorter time.

Second Embodiment
Next, a second embodiment will be described with reference to FIG.
As described above, the optimization program 113A is started when the operator instructs the control unit 110 to execute. However, the worker may instruct the control unit 110 to mount the electronic component E1 without instructing the control unit 110 to execute the optimization program 113A. That is, when the operator instructs mounting of the electronic component E1, the Z axis drive device 80 used for suction and mounting is initialized to each mounting point data (in other words, each electronic component E1 mounted on the printed circuit board B1). It may or may not be initialized.

  Therefore, the control unit 110 according to the second embodiment executes an initial setting process at the time of mounting when mounting of the electronic component E1 is instructed by the worker. The initial setting process at the time of mounting determines whether or not the Z-axis drive device 80 used for suction and mounting is initially set to each mounting point data, and when the initial setting is not made, mounting of the electronic component E1 is started. It is a process which initializes the Z-axis drive device 80 used for adsorption | suction or mounting to each mounting point data before doing.

(1) Initial setting process at mounting The initial setting process at mounting will be described with reference to FIG. The present process is started when the operator instructs the control unit 110 to mount the electronic component E1.

In S401, the control unit 110 reads the substrate data 113C stored in the storage unit 113.
In S402, one control unit 110 mounting point data is selected.
In step S403, the control unit 110 determines whether or not the Z-axis drive device 80 used for suction of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data is initialized based on the selected mounting point data. If it is not initialized, the process proceeds to step S404. If it is initialized, the process proceeds to step S405.

In S404, the control unit 110 initializes the Z-axis drive device 80 used for suction of the electronic component E1 mounted at the mounting position indicated by the mounting point data to the selected mounting point data. Since this process is substantially the same as S201 described above, the description is omitted.
In S405, the control unit 110 determines whether or not the electronic component E1 mounted at the mounting position indicated by the selected mounting point data can be adsorbed using the Z-axis drive device 80 that is initially set. Specifically, the control unit 110 performs a software limit check on the component supply position of the electronic component E1 mounted at the mounting position indicated by the selected mounting point data with respect to the Z-axis drive device 80 initially set, and performs a check If the result is NG, the process proceeds to S406, and if the result is OK, the process proceeds to S407.

In S406, the control unit 110 executes error processing such as displaying an error message.
In step S407, the control unit 110 determines whether or not the Z-axis drive device 80 used for mounting the electronic component E1 mounted at the mounting position indicated by the mounting point data is initialized in the selected mounting point data. If the initial setting is not performed, the process advances to step S408. If the initial setting is performed, the process advances to step S409.

In S408, the control unit 110 initializes the Z-axis drive device 80 used for mounting the electronic component E1 mounted at the mounting position indicated by the mounting point data to the selected mounting point data. Since this process is substantially the same as S202 described above, the description is omitted.
In step S409, the control unit 110 determines whether the electronic component E1 can be mounted using the initially set Z-axis drive device 80 at the mounting position indicated by the selected mounting point data. Specifically, the control unit 110 performs a software limit check on the mounting position indicated by the selected mounting point data for the Z axis drive device 80 that has been initialized, and if the check result is NG, the process proceeds to S406 and OK In the case of, the process proceeds to S410.

  In S410, control unit 110 determines whether or not all the loading point data have been selected, and when all the loading point data have been selected, this processing ends, and when there is loading point data that has not yet been selected, The process returns to S402 and repeats.

  In the second embodiment, the reset process of the Z-axis drive device 80, which is initially set, is not performed. However, in the second embodiment, the reset process of the Z-axis drive device 80 may be performed.

(2) Effects of the Embodiment According to the holding unit drive unit setting method according to the second embodiment described above, as the Z-axis drive device 80 used for suction of the electronic component E1, the small area to which the component supply position of the electronic component E1 belongs. Since the Z-axis drive unit 80 corresponding to the specific area included in the initial setting is initialized, the mountable area of the component mounting apparatus 30 can be made wider than when other Z-axis drive units 80 are initialized. . The same applies to the mounting of the electronic component E1.

Embodiment 3
Next, a third embodiment of the present invention will be described with reference to FIGS. 12 to 13. In FIG. 12, the number of suction nozzles 56 is omitted to eight for easy understanding.
In the first embodiment described above, the case where the rotary head 50 includes the two Z-axis drive devices 80 and the mountable area 120 of the component mounting apparatus 30 is divided into two small areas has been described as an example. On the other hand, as shown in FIG. 12, the rotary head 350 according to the third embodiment is provided with four Z-axis drive devices 80, and the mountable area 360 of the component mounting apparatus 30 is divided into four small areas. There is.

  In FIG. 12, a region 361 is a unique region of the left Z-axis drive device 80, a region 362 is a unique region of the right Z-axis drive device 80, and a region 363 is a unique region of the front Z-axis drive device 80 Region 364 is a unique region of the rear Z-axis drive device 80. A rectangular area 365 surrounded by the four unique areas is an area where the electronic component E1 can be adsorbed and mounted by at least two Z-axis drive devices 80.

  As shown in FIG. 12, the mountable area 360 is divided into four small areas 365A to 365D by two diagonal lines. A small area 365A is a small area including the unique area 361 of the left Z-axis drive 80, a small area 365B is a small area including the unique area 362 of the right Z-axis drive 80, and a small area 365C is the front The small area 365D is a small area including the unique area 363 of the Z-axis drive apparatus 80, and the small area 365D is a small area including the unique area 364 of the Z-axis drive apparatus 80 on the rear side.

  Note that the mountable area 360 may be divided into four small areas as shown in FIG. The mountable area 360 can be divided into small areas in an arbitrary form as long as each small area is divided such that different specific areas of the Z-axis drive device 80 are included.

Other Embodiments
The art disclosed herein is not limited to the embodiments described above and illustrated in the drawings, and, for example, the following embodiments are also included in the technical scope.

  (1) In the above embodiment, the control unit 110 included in the surface mounter 1 is described as an example of the control device. On the other hand, the control device may be a computer different from the surface mounter 1. Then, the optimization program 113A may be executed by the computer, and the control unit 110 may be configured to control the surface mounter 1 according to the execution result.

  (2) In the above embodiment, the Z-axis drive device 80 which drives the suction nozzle 56 by a linear motor as the holding unit drive unit is described as an example, but the holding unit drive unit And may be moved by a piston.

  (3) In the above embodiment, the suction nozzle 56 has been described as an example of the component holding unit, but the component holding member may be a so-called chuck that holds the electronic component E1 with a plurality of claws.

  (4) Although the case where the resetting process is performed after the initial setting process has been described as an example in the above embodiment, the resetting process may not necessarily be performed.

DESCRIPTION OF SYMBOLS 1 ... surface mounting machine, 30 ... component mounting apparatus, 35X ... X-axis servomotor (an example of a head conveyance part) 35Y ... Y-axis servomotor (an example of a head conveyance part), 35N ... N axis servomotor (rotary body drive Examples of parts: 40: parts supply device 50: rotary head 52: head main body 56: suction nozzle (example of parts holding portion) 60: rotating body 61: rotation axis 66: circumference 80 ... Z-axis drive unit (an example of holding unit drive unit) 110 ... control unit (an example of control unit) 120 ... mountable area 121 ... unique area 122 ... unique area 123 ... dividing line (an example of straight line) Small area 124 124 Small area 125 Small area 146 Component supply position 300 Drive position 300A, 300B Drive position 350 Rotary head 360 Mountable area 361 to 364 ... intrinsic region, 365A～365D ... small areas, B1 ... PCB (an example of a substrate), E1 ... electronic component (an example of a component)

Claims (9)

A holding unit drive unit setting method for a component mounting apparatus, which holds a component supplied at a component supply position and mounts the component on a substrate,
The component mounting apparatus
With a rotating body,
A head main body rotatably supporting the rotating body;
A rotating body drive unit that rotationally drives the rotating body;
A plurality of component holding units supported by the rotating body so as to be movable in the rotational axis direction, arranged on a circumference centered on the rotational axis, and holding a plurality of components for holding and releasing the components Department,
A plurality of holding unit driving units having a number smaller than the number of the component holding units, which is fixed to the head main body, and rotates the component holding units moved to a predetermined drive position on the circumference. A plurality of holder drive units that are moved in the axial direction;
A rotary head having a
A head transport unit that transports the rotary head in a direction perpendicular to the rotation axis;
Equipped with
Each of the holding unit driving units has a unique area in the mountable area of the component mounting apparatus, which can hold the component only by the holding unit driving unit,
The mountable area is divided into a plurality of small areas including the unique areas of the holder driving unit different from one another, and the small areas correspond to the unique areas included in the small areas. The holder drive unit is assigned,
The holding unit driving unit setting method uses, for each of the components to be mounted on the substrate, a holding unit using the holding unit driving unit assigned to the small area to which the component supply position of the component belongs. A holding unit drive unit setting method including an initial setting step of initially setting as a drive unit. After the initial setting step, for each of the components mounted on the substrate, can the components be held using the other holding unit driving units other than the holding unit driving units initially set for the components? A first determination step of determining whether or not
When it is judged that holding is possible in the first judgment step, using the other holding unit driving unit capable of holding the part rather than using the holding unit driving unit initially set for the part A second determination step of determining whether or not the part can hold the part in a short time,
A resetting step of resetting the other holding unit drive unit as a holding unit drive unit used for holding the component when it is determined in the second determination step that holding can be performed in a short time;
The holder drive unit setting method according to claim 1, further comprising: A holding unit drive unit setting method for a component mounting apparatus, which holds a component supplied at a component supply position and mounts the component on a substrate,
The component mounting apparatus
With a rotating body,
A head main body rotatably supporting the rotating body;
A rotating body drive unit that rotationally drives the rotating body;
A plurality of component holding units supported by the rotating body so as to be movable in the rotational axis direction, arranged on a circumference centered on the rotational axis, and holding a plurality of components for holding and releasing the components Department,
A plurality of holding unit driving units having a number smaller than the number of the component holding units, which is fixed to the head main body, and rotates the component holding units moved to a predetermined drive position on the circumference. A plurality of holder drive units that are moved in the axial direction;
A rotary head having a
A head transport unit that transports the rotary head in a direction perpendicular to the rotation axis;
Equipped with
Each of the holding unit driving units has a unique region in which the component can be mounted only by the holding unit driving unit within the mountable region of the component mounting apparatus,
The mountable area is divided into a plurality of small areas including the unique areas of the holder driving unit different from one another, and the small areas correspond to the unique areas included in the small areas. The holder drive unit is assigned,
The holding unit driving unit setting method uses, for each of the components mounted on the substrate, a holding unit driving unit using the holding unit driving unit assigned to the small area to which the mounting position of the component belongs, for mounting the components The holding unit drive unit setting method including an initialization step of initializing as. After the initial setting step, for each of the components to be mounted on the substrate, can the components be mounted using the other holding unit drive units other than the holding unit drive units initially set for the components? A third determination step of determining whether or not
When it is determined that mounting is possible in the third determination step, using the other holding unit driving unit capable of mounting the component rather than using the holding unit driving unit initially set to the component A fourth determination step of determining whether or not the component can be mounted in a short time,
When it is determined in the fourth determination step that mounting can be performed in a short time, the other holding unit driving unit is reset as a holding unit driving unit used for mounting the component;
The holding unit drive unit setting method according to claim 3, further comprising: The component mounting apparatus holds the components supplied at the plurality of component supply positions arranged in a row and mounts the components on the substrate.
Two said holding part drive units,
An imaging unit configured to image the components held by each of the component holding units;
Equipped with
The two holding unit driving units are disposed on both sides of the arranging direction of the plurality of component supply positions with the rotating body interposed therebetween,
The mountable area is a straight line passing through the rotation center of the rotating body when the imaging unit captures an image of the component when viewed from the rotation axis direction, and a straight line orthogonal to the arrangement direction of the plurality of component supply positions The holder drive unit setting method according to any one of claims 1 to 4, wherein the holder is divided into the two small areas according to. A control device for a component mounting apparatus which holds a component supplied at a component supply position and mounts the component on a substrate,
The component mounting apparatus
With a rotating body,
A head main body rotatably supporting the rotating body;
A rotating body drive unit that rotationally drives the rotating body;
A plurality of component holding units supported by the rotating body so as to be movable in the rotational axis direction, arranged on a circumference centered on the rotational axis, and holding a plurality of components for holding and releasing the components Department,
A plurality of holding unit driving units having a number smaller than the number of the component holding units, the component holding units fixed to the head main body and each moved to a predetermined driving position on the circumference A plurality of holder drive units that are moved in the rotational axis direction;
A rotary head having a
A head transport unit that transports the rotary head in a direction perpendicular to the rotation axis;
Equipped with
Each of the holding unit driving units has a unique area in the mountable area of the component mounting apparatus, which can hold the component only by the holding unit driving unit,
The mountable area is divided into a plurality of small areas including the unique areas of the holder driving unit different from one another, and the small areas correspond to the unique areas included in the small areas. The holder drive unit is assigned,
The control device initially sets, for each of the components mounted on the substrate, the holding unit drive unit assigned to the small area to which the component supply position of the component belongs, as a holding unit drive unit that uses the component for holding the component Control device that executes the initial setting process to set. A control device for a component mounting apparatus which holds a component supplied at a component supply position and mounts the component on a substrate,
The component mounting apparatus
With a rotating body,
A head main body rotatably supporting the rotating body;
A rotating body drive unit that rotationally drives the rotating body;
A plurality of component holding units supported by the rotating body so as to be movable in the rotational axis direction, arranged on a circumference centered on the rotational axis, and holding a plurality of components for holding and releasing the components Department,
A plurality of holding unit driving units having a number smaller than the number of the component holding units, which is fixed to the head main body, and rotates the component holding units moved to a predetermined drive position on the circumference. A plurality of holder drive units that are moved in the axial direction;
A rotary head having a
A head transport unit that transports the rotary head in a direction perpendicular to the rotation axis;
Equipped with
Each of the holding unit driving units has a unique region in which the component can be mounted only by the holding unit driving unit within the mountable region of the component mounting apparatus,
The mountable area is divided into a plurality of small areas including the unique areas of the holder driving unit different from one another, and the small areas correspond to the unique areas included in the small areas. The holder drive unit is assigned,
The control device initializes, for each of the components to be mounted on the substrate, the holding unit driving unit assigned to the small area to which the mounting position of the component belongs as a holding unit driving unit used for mounting the components A control unit that performs initialization processing. A component mounting apparatus for holding a component supplied at a component supply position and mounting the component on a substrate,
With a rotating body,
A head main body rotatably supporting the rotating body;
A rotating body drive unit that rotationally drives the rotating body;
A plurality of component holding units supported by the rotating body so as to be movable in the rotational axis direction, arranged on a circumference centered on the rotational axis, and holding a plurality of components for holding and releasing the components Department,
A plurality of holding unit driving units having a number smaller than the number of the component holding units, which is fixed to the head main body, and rotates the component holding units moved to a predetermined drive position on the circumference. A plurality of holder drive units that are moved in the axial direction;
A rotary head having a
A head transport unit that transports the rotary head in a direction perpendicular to the rotation axis;
A control device according to claim 6 or 7;
Component mounting apparatus comprising: A component mounting apparatus according to claim 8;
A component supply device for supplying the component to the component mounting device;
A substrate transfer apparatus for transferring the substrate to a mounting position of the component by the component mounting apparatus;
Surface mounter equipped with

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