JP2006114534A - Component carrying device, surface mounting machine, and component testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a component carrying device in which the front end of an attracting member is made to have a buffing function, to discriminate abnormality caused by the fall etc., of the buffing function, and to take an appropriate measure when the abnormality occurs. <P>SOLUTION: In a surface mounting machine etc., the front end of a suction nozzle which sucks an electronic component is made swingable by a prescribed amount in the direction in which the section makes frequent appearances with respect to the main body of the nozzle and, at the same time, is biased in a projecting state by means of a spring. In addition, a camera 20 is provided which detects the position of the front end of the suction nozzle with respect to the main body of the nozzle. In a controller 30, at the same time, a nozzle abnormality discriminating means 35 which discriminates the abnormality when the front end of the suction nozzle is not in a normal region by checking whether or not the front end is in the normal region based on the image of the front end taken by the camera 20 and an abnormality processing means 36 which performs the measure when the abnormality is discriminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a component conveying device in which an adsorption member that adsorbs an electronic component is supported by a head unit so as to be movable up and down, a tip portion of the adsorption member is swingable, and is urged in a protruding state by an elastic member, The present invention relates to a surface mounter and a component testing apparatus to which the apparatus is applied.

  A conventional general surface mounter includes a movable head unit having a suction member (suction nozzle) that sucks electronic components. First, the head unit is moved to a component supply unit and stored in the component supply unit. The electronic component is vacuum-sucked by the suction member. Next, the head unit is moved onto the printed circuit board held at a predetermined position on the mounting machine body, and electronic components are mounted on the printed circuit board. At the time of suction or mounting, the suction member is lowered from the raised position to a predetermined suction height position or mounting height position to suck or mount electronic components. At this time, the suction member has a buffing function. Is known that is capable of swinging a predetermined amount up and down with respect to the main body of the suction member and biased into a protruding state by a spring (see, for example, Patent Document 1).

If the buffing function is provided in this way, it is caused by various factors such as variations in positioning in the height direction of the device, variations in the outer shape of the electronic component itself, warpage of the printed circuit board, and tape reel floating in the component supply unit. By absorbing variations in the height direction, it is possible to suppress physical stress from being applied to the electronic component and the printed circuit board on which the electronic component is mounted, thereby realizing high-speed mounting.
JP 2002-151893 A

  However, along with the recent trend toward miniaturization of electronic components, the shape of the tip of the suction member is also miniaturized, and the structure for providing a buffing function in this portion is also extremely small. For this reason, even if this part is produced with advanced processing technology, the buffing function is reduced due to inhalation of dust in the air or cream solder on the printed circuit board, wear due to continuous use, etc. There may be a situation in which, after the tip of the suction member receives an external force and is immersed during suction or the like, even if the external force is released, the original protruding state is not restored. When such a situation occurs, there is a possibility that the electronic components cannot be accurately picked up and mounted.

  The present invention has been made in view of the circumstances as described above, and in a component conveying apparatus in which the tip portion of the suction member has a buffing function, it is possible to determine an abnormality due to a decrease in the buffing function, etc. It is an object of the present invention to provide a device that makes it possible to take appropriate countermeasures.

  In order to solve the above problems, the present invention supports a movable head unit so that an adsorption member that adsorbs an electronic component can be moved up and down, and the tip of the adsorption member is located in a direction in which the adsorption member main body protrudes and appears. In a component conveying apparatus that is capable of constant rocking and is biased in a protruding state by an elastic member, a detecting means that detects the position of the tip of the suction member relative to the main body of the suction member, and detection by the detection means On the basis of this, it is provided with nozzle abnormality determining means for checking whether or not the position of the tip of the suction member is within a preset normal range and determining that it is abnormal if it is not within the normal range.

  According to this configuration, when the external force is released after the suction member tip is displaced in the immersion direction by an external force applied to the suction member tip during component suction, the suction member tip is within the normal range due to buffing failure or the like. In such a case, it is determined that the nozzle abnormality determination unit is abnormal based on the detection by the detection unit. As a result, it is possible to take an appropriate countermeasure when an abnormality occurs.

  In the present invention, the detection means includes, for example, a camera that images the tip of the suction member from the side. Thereby, based on the image by a camera, the position of the suction member front-end | tip part with respect to a suction member main body can be detected with a sufficient precision.

  Or the said detection means may have a distance sensor which detects the distance from the fixed position to the said adsorption member front-end | tip part. Even in this case, the position of the suction member tip with respect to the suction member main body can be detected with high accuracy.

  In the present invention, when it is determined as abnormal by the nozzle abnormality determining means, the use of the suction member is stopped, the suction member is replaced, the operation of the suction member is changed, and the electronic component sucked by the suction member It is preferable to provide an abnormality processing means for performing at least one of the disposals.

  If it does in this way, when it determines with it being abnormal by the nozzle abnormality determination means, the countermeasure corresponding to it can be performed appropriately.

  Preferably, the abnormality processing means causes the notification means to notify that there is an abnormality when the nozzle abnormality determination means determines that there is an abnormality.

  In this way, it is possible to promptly notify the operator or the like of the occurrence of abnormality.

  The present invention is effectively applied to a surface mounter. That is, as a means for transporting a component supplied from the component supply unit onto the substrate in a surface mounter that transports the component supplied by the component supply unit onto the substrate positioned at the mounting work position and mounts the component on a predetermined position on the substrate. The component transportation device is provided.

  The present invention is also effectively applied to a component testing apparatus. That is, in a component testing apparatus that performs various tests by transporting a component supplied in a component supply unit to a test unit, a configuration including the component transport device as a unit that transports the component from the component supply unit to the test unit And

  As is clear from the above description, according to the present invention, when an abnormality occurs such that the tip of the suction member does not return to the normal range after the part is sucked, this can be reliably determined. Thus, it is possible to prevent the above-described abnormality from being overlooked and to take an appropriate countermeasure according to the abnormality.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter according to an embodiment of the present invention. As shown in the drawing, a printed circuit board conveying conveyor 2 is arranged on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting work position. It has become.

  On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with multiple rows of tape feeders 4a. Each tape feeder 4a is configured such that small pieces of electronic components such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tapes are led out from the reels. Electronic parts are taken out intermittently.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located, and is in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on the horizontal plane). ) Can be moved to.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the movement position of the head unit 6 is detected.

  The head unit 6 is provided with a plurality of mounting heads 16 each having a suction nozzle 17 (suction member) at the tip. The mounting head 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle center axis (R-axis) with respect to the frame of the head unit 6. And a rotary driving means such as an R-axis servo motor. In the present embodiment, six mounting heads 16 are provided.

  The suction nozzle 17 is detachably attached to the mounting head 16. A plurality of types of suction nozzles 17 are prepared in accordance with the types and sizes of electronic components to be sucked, which are appropriately selected and mounted on the mounting head 16.

  As shown in FIG. 4, the suction nozzle 17 includes a nozzle body 17a, a nozzle tip 17b (suction member tip) that can be swung by a predetermined amount in the direction of projecting with respect to the nozzle body 17a, and a spring 18 ( Elastic member). The spring 18 is interposed between upper and lower retainers provided on the nozzle body 17a and the nozzle tip portion 17b, and urges the nozzle tip portion 17b in the protruding direction with respect to the nozzle body 17a. Therefore, the nozzle tip portion 17b is held in a state of protruding a predetermined amount from the nozzle body 17a when no external force is applied, and in the immersion direction (upward) against the biasing force of the spring 18 when an external force is applied from the tip side. It is designed to be displaced.

  Further, the mounting machine is provided with detection means for detecting the position of the nozzle tip portion 17b with respect to the nozzle body 17a of the suction nozzle 17, and in this embodiment, the camera 20 that images the nozzle tip portion 17b from the side. Is provided. As shown in FIG. 3, the camera 20 is located below the head unit support member 11 and is attached to the head unit support member 11 via an attachment member 22, and a line sensor in which a plurality of image sensors are arranged in a line. 21, and the line sensor 21 is arranged so that the arrangement direction (main scanning direction) of the imaging elements is the vertical direction. When the head unit 6 moves in the X-axis direction and passes through the intermediate portion of the head unit support member 11, the nozzle tip 17b and the camera 20 face each other, and the camera 20 moves along with the movement of the head unit 6 in the X-axis direction. Thus, the nozzle tip is imaged.

  FIGS. 5A and 5B show images of the nozzle tip 17b imaged by the camera 20 and the vicinity thereof. In these drawings, what is in the image area 25 shown by the solid line is the nozzle tip. 17b and the vicinity of the image. FIG. 5A is an image when the nozzle tip 17b is in a normal state in which the nozzle tip 17b protrudes from the nozzle body 17a by a predetermined amount L, and FIG. 5B is an abnormality in which the protrusion of the nozzle tip 17b from the nozzle body 17a is small. It is an image when it is in a state.

  In FIG. 1, reference numeral 24 denotes a component recognition camera. The camera 24 is installed on the base 1 in the vicinity of the component supply unit 4, and when the head unit 6 moves onto the camera 24 after component adsorption, the component adsorbed by the adsorption nozzle 17 of the mounting head 16 is displayed. Images are taken from below. Then, based on the image captured by the camera 24, component recognition is performed to determine whether or not the component suction state is good, to detect the shift of the component suction position, and to correct the mounting position accordingly. ing.

  FIG. 6 shows a controller 30 provided in the mounting machine. The controller 30 includes a CPU that executes logical operations, a ROM that stores programs and the like in advance, and a RAM that temporarily stores various data. The functional configuration includes a main control unit 31, an image processing unit 32, an axis, and the like. The main control unit 31 includes a nozzle abnormality determination unit 35 and an abnormality processing unit 36.

  The main control unit 31 comprehensively controls the image processing unit 32 and the axis control unit 33 in accordance with a program stored in advance. At the time of component recognition, the image processing unit 32 can input the component image captured by the component recognition camera 24 and perform predetermined image processing to recognize the shape of the component sucked by the suction nozzle 17. It is like that. Further, when detecting the position of the nozzle tip 17b, an image of the vicinity of the nozzle tip 17b captured by the camera 20 is input, and the shape of the nozzle tip 17b is recognized by performing predetermined image processing. It can be done.

  The axis control unit 33 controls a servo motor and the like to operate the head unit 6 and the mounting head 16. For example, at the time of component suction, the X-axis servo motor 15 and the Y-axis servo motor 9 are controlled so as to move the head unit 6 onto the component supply unit 4, and the mounting head 16 is lowered and the suction nozzle 17 moves the electronic component. The Z-axis servo motor (not shown) is controlled so that the mounting head 16 is returned to the raised position after adsorbing the X-axis, and the X-axis servo is moved so that the head unit 6 is moved onto the printed circuit board 3 when mounting components. The motor 15 and the Y-axis servo motor 9 are controlled, and the mounting head 16 is lowered to mount electronic components from the suction nozzle 17 onto the printed circuit board 3 and then the mounting head 16 is returned to the raised position. The Z-axis servo motor and the like are controlled.

  Further, the nozzle abnormality determination means 35 included in the main control unit 31 has the position of the nozzle tip 17b set in advance based on an image in the vicinity of the nozzle tip 17b as shown in FIG. It is checked whether or not it is within the normal range. Specifically, the projection amount of the nozzle tip 17b with respect to the nozzle body 17a is set in a normal range (the range of allowable error from the predetermined amount L in FIG. 5A). Check if it is inside. If it is not within the normal range, it is determined that there is an abnormality.

  Furthermore, the abnormality processing unit 36 included in the main control unit 31 causes the alarm display unit 37 (notification unit) to notify that there is an abnormality when the nozzle abnormality determination unit 35 determines that an abnormality has occurred. Perform the corresponding process. As the abnormality handling process, at least one of the use stop of the suction nozzle, the replacement of the suction nozzle, the change of the operation of the suction nozzle, and the disposal of the electronic component sucked by the suction nozzle is performed. do it. The alarm display unit 37 may be any unit that informs the operator of an abnormality, and a display device, an alarm sound generator, an alarm light generator, or the like that displays an abnormality occurrence on the monitor screen may be employed.

  FIG. 7 is a flowchart showing a specific example of processing by the nozzle abnormality determining means 35 and the abnormality processing means 36. The processing shown in this flowchart is started in a state in which the mounting head 16 is at a predetermined lifted position by the lifting drive means at an appropriate time except when the component is picked up and when the component is mounted. For example, this is performed when the head unit 6 is in the process of moving to the component supply unit 4 for the next component suction after component mounting. Moreover, it is also performed in the middle of component conveyance after component adsorption | suction until mounting of the component to the printed circuit board 3 is performed. Note that it may be performed only during either the movement of the head unit 6 after component mounting to the component supply unit 4 or the component transport of the head unit 6 after component mounting.

  When the processing shown in this flowchart starts, first, the head end 6 is driven in the X direction so that the nozzle tip 17b of the suction nozzle 17 passes through a position facing the camera 20, and the nozzle tip 17b is moved by the camera 20 described above. The vicinity is imaged from the side, and the image is captured by the controller 30 for recognition (step S1). And it is determined by the nozzle abnormality determination means 35 whether it is abnormal by investigating whether the protrusion amount of the nozzle front-end | tip part 17b with respect to the nozzle main body 17a is outside a normal range (step S2).

  If it is determined in step S2 that there is no abnormality, the current process ends.

  If it is determined in step S2 that there is an abnormality, the abnormality number n is incremented (step S3), and it is determined whether the abnormality number n has exceeded a preset limit value nx (step 4).

  If the number n of abnormalities does not exceed the preset limit value nx, the process proceeds to step S5, and the alarm display unit 37 is driven so as to display an error indicating that there is an abnormality. In step S6, it is determined whether the suction nozzle 17 has a component. In this case, the presence / absence of a component is determined from the image captured by the camera 20. Alternatively, if the suction nozzle 17 is in the process of transporting a part after picking up a part according to the current operating state of the mounting machine, it is determined that the part has a part, and the head unit 17 is attached to the part supply unit 4 after mounting the part. You may make it judge that it does not have a part when it is in the middle of moving to.

  When the determination in step S6 is YES, it is further determined in step S7 whether or not the suction state is normal (whether or not components can be mounted on the printed circuit board 3). This determination is performed based on the image captured by the camera 20 or based on the image captured from the lower side of the component sucked by the suction nozzle 17 by the component recognition camera 24.

  The abnormality handling process is selected from CASE1 to CASE4 shown in FIG. 8 according to the determination results in these steps S6 and S7, the number of times of abnormality, and the like.

  That is, when the suction nozzle 17 has no parts (when the determination in step S6 is NO), one of CASE 1 to 3 is selected (step S8).

  Here, CASE 1 disables the suction nozzles 17 determined to be abnormal, and uses only the remaining normal suction nozzles 17 among the plurality of suction nozzles 17 mounted on the head unit 6. In order to perform this, the operation of the mounting machine is continued after changing the program so that the parts are assigned to the normal suction nozzle 17 again. In CASE 2, the suction nozzle 17 determined to be abnormal is replaced with a spare nozzle automatically or manually, and the operation is continued. The CASE 3 is mounted after correcting the control data so that the suction nozzle 17 determined to be abnormal changes the head lowering stroke at the time of component suction or component mounting or lowers the lowering speed. The machine will continue to operate.

  The selection of the process in step S8 may be set in advance according to any one of the cases, or may be selected according to the number n of abnormalities. When selecting according to the number of times n, for example, the first and second thresholds n1 and n2 are set in advance in a relationship of n1 <n2 <nx, and CASE3 is selected up to the first threshold n1, CASE2 may be selected from the first threshold value n1 to the second threshold value n2, and CASE1 may be selected when the second threshold value n2 is exceeded.

  Further, when the suction nozzle 17 has a part (determination in step S6 is YES) and the suction posture is normal (determination in step S7 is YES), one of the CASEs 3 and 4 is selected. Is selected (step S9).

  Here, CASE 3 is as described above, and CASE 4 is for collecting or discarding the parts adsorbed by the adsorption nozzle 17.

  The selection of the process in step S9 may be performed by setting any one case in advance, or may be selected according to the number of times n of abnormality. When selecting according to the number of times of abnormality n, for example, if a threshold value smaller than the limit value nx is set, CASE3 is selected up to this threshold value, and CASE4 is selected when the threshold value is exceeded. Good.

  Further, when the suction nozzle 17 has a part (determination in step S6 is YES) and the suction posture is not normal (determination in step S7 is NO), the process of CASE 4 is performed.

  If it is determined in step S4 that the number n of abnormalities exceeds a preset limit value nx, the alarm display unit 37 is driven to display an error and the mounting machine is operated. Is stopped (step S11).

  According to the apparatus of the present embodiment as described above, the nozzle tip and its vicinity are imaged from the side by the camera, and the amount of protrusion of the nozzle tip 17b relative to the nozzle body 17a is examined based on the image, and this is within the normal range. If not, it is determined as abnormal. For this reason, the nozzle tip portion 17b does not return to a normal protruding state after the suction of the component or after mounting the component due to the deterioration of the buffing function due to the suction nozzle 17 sucking or wearing dust or cream solder. This can be reliably determined when it is in an immersive state as shown in b).

  In such an abnormality, for example, the lowering of the buffing function is compensated by changing the lowering stroke or the lowering speed of the suction nozzle 17. Alternatively, the abnormality can be resolved by replacing the suction nozzle 17. Alternatively, the use of the suction nozzles 17 determined to be abnormal and making the remaining normal suction nozzles 17 unusable prevents the electronic component from being sucked or mounted accurately. In addition, when the suction nozzle 17 has a part, if the number of abnormalities increases, the buffing function is greatly reduced and the part may be damaged at the time of mounting. Done. Further, when the number of abnormalities increases remarkably, the operation of the mounting machine is stopped.

  In this way, in the event that the suction nozzle does not normally protrude, appropriate handling processing is taken according to the mounting machine status at that time, the number of abnormalities, etc., and the parts caused by the reduction in the buffing function of the suction nozzle Occurrence of troubles such as damage and mounting defects is suppressed.

In addition, the specific structure of the apparatus of the present invention is not limited to the above embodiment, and can be variously changed. Other embodiments are described below.
(1) In the above embodiment, the camera 20 for imaging the nozzle tip and its vicinity is attached to the head unit support member 11. However, as shown in FIGS. A camera 40 may be provided on one. That is, in this embodiment, the camera 40 including the line sensor 41 is fixed to the base 1 via the support base 42. Also in this embodiment, the vicinity of the tip of the suction nozzle 17 is imaged by the camera 40 while the drive of the head unit 6 is controlled so that the suction nozzle 17 passes through the position facing the camera 40.
(2) As shown in FIGS. 10A and 10B, a camera 50 may be provided in the head unit 6. That is, in this embodiment, the camera 50 including the line sensor 51 is attached to the head unit 6 so as to be movable in the nozzle arrangement direction (X-axis direction) via the attachment frame 52, and the camera 50 is not illustrated. The tip of each suction nozzle 17 and its vicinity are imaged while being driven by the driving means and moving in the nozzle arrangement direction.
(3) As shown in FIGS. 11A and 11B, a plurality of cameras 60 corresponding to each suction nozzle 17 may be provided. That is, in this embodiment, six cameras 60 corresponding to the six suction nozzles 17 are fixedly attached to the head unit 6 via the attachment frame 62. In this case, an area sensor may be used for the camera 60.
(4) The detection means for detecting the position of the nozzle tip portion 17b with respect to the nozzle body 17a is not limited to the cameras 20, 40, 50, 60, but a distance as shown in FIGS. 12 (a) and 12 (b). The sensor 70 may be used. That is, in this embodiment, when the laser-type distance sensor 70 is installed on the base 1 and the head unit 6 passes above, the distance from the position of the distance sensor 70 to the tip of the suction nozzle 17 is detected, Based on this, the height position of the nozzle tip 17b is obtained.
(5) In each of the above embodiments, the ball screw 14 and the servo motor 15 are used as a mechanism for moving the head unit 6, but a linear motor may be used instead.
(6) In each of the above embodiments, the case where the present invention is applied to a surface mounter is shown. However, the present invention may be applied to a component testing apparatus that performs various electrical tests on electronic components such as ICs. it can. That is, although not shown in the figure, for example, it has a movable head unit on which one or more heads for component mounting are mounted, and the component placed at the component supply position is sucked by the head and conveyed to the test means. In such a test apparatus, a configuration similar to that shown in each of the above embodiments is adopted as the configuration of the suction nozzle of the head unit and the mounting head provided thereon, and the nozzle body A detecting means including a camera or a distance sensor for detecting the position of the nozzle tip relative to the nozzle is provided, and a nozzle abnormality determining means and an abnormality processing means may be provided in the controller as in FIG.

It is a top view which shows roughly the surface mounter which is one Embodiment of this invention. It is a front view which abbreviate | omits and shows a part of surface mounting machine of FIG. It is a side view which shows a head unit support member, the head unit supported by this, and a camera. It is an enlarged front view of a suction nozzle. The image of the vicinity of the nozzle tip imaged by the camera is shown, in which (a) is an image when normal and (b) is an image when abnormal. It is a block diagram which shows the control system which consists of a controller etc. of a surface mounting machine. It is a flowchart which shows the specific example of the process by the nozzle abnormality determination means and abnormality processing means which are contained in the controller shown in FIG. It is explanatory drawing which shows the various cases of abnormality processing. The 2nd Embodiment of the structure provided with the detection means is shown, Comprising: (a) is a front view, (b) is a side view. 3rd Embodiment of the structure where the detection means was provided is shown, Comprising: (a) is a front view, (b) is a side view. The 4th Embodiment of the structure provided with the detection means is shown, Comprising: (a) is a front view, (b) is a side view. The structure in the case of using a distance sensor as a detection means is shown, Comprising: (a) is a front view, (b) is a side view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Printed circuit board 4 Component supply part 6 Head unit 16 Mounting head 17 Adsorption nozzle 17a Nozzle main body 17b Nozzle front-end | tip part 20,40,50,60,70 Camera 30 Controller 35 Nozzle abnormality determination means 36 Abnormality processing means

Claims (7)

An adsorbing member that adsorbs an electronic component is supported by the movable head unit so as to be able to move up and down. In the component conveying device that is biased to the protruding state by the member,
Detecting means for detecting the position of the tip of the suction member relative to the suction member body;
Based on the detection by the detection means, a nozzle abnormality determination means for checking whether or not the position of the tip of the suction member is within a preset normal range and determining that it is abnormal if not within the normal range is provided. A component conveying apparatus characterized by the above.   The component conveying apparatus according to claim 1, wherein the detection unit includes a camera that images the tip of the suction member from a side.   The component conveying apparatus according to claim 1, wherein the detection unit includes a distance sensor that detects a distance from a certain position to the tip of the suction member.   If the nozzle abnormality determining means determines that there is an abnormality, the use of the suction member is stopped, the suction member is replaced, the operation of the suction member is changed, and the electronic component sucked by the suction member is discarded. The component conveying apparatus according to claim 1, further comprising an abnormality processing unit that performs at least one of the following processes.   5. The component conveying apparatus according to claim 4, wherein the abnormality processing unit causes the notification unit to notify that there is an abnormality when the abnormality determination unit determines that the abnormality is detected by the nozzle abnormality determination unit.   In a surface mounter that transports a component supplied in a component supply unit onto a substrate positioned at a mounting work position and mounts the component on a predetermined position of the substrate, as means for transporting the component from the component supply unit onto the substrate A surface mounting machine comprising the component conveying device according to any one of Items 1 to 5.   6. A component testing apparatus for carrying out various tests by conveying a component supplied in a component supply unit to a test means, as means for conveying the component from the component supply unit to the test means. A component testing apparatus comprising the component conveying apparatus described above.

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