JP6781282B2 - Control method of work head unit, mounting device and work head unit - Google Patents

Description

The present invention relates to a work head unit, a mounting device, and a method for controlling the work head unit.

Conventionally, as a mounting head for mounting a component on a substrate, a plurality of slits are formed on a rotating plate by changing the slit angles θ of each other, and each nozzle of the mounting head corresponds to the position of these slits. It has been proposed that the slits are arranged and provided with a control unit in which the angle θ between the slits is registered in advance (see, for example, Patent Document 1). It is said that this mounting head can detect the original position of the mounting head in the rotation direction at a high speed. Further, as the mounting head, the rotating member is at the reaction position of the sensor at the zero count position of the encoder of the motor that rotationally drives the rotary head, the reference spindle is directly under the pushing member, and the spindle is rotated around the axis. Has been proposed so that the angle of each spindle is 0 degrees at the zero count position of the encoder (see, for example, Patent Document 2). With this mounting head, the origin position can be adjusted without performing data backup.

Japanese Unexamined Patent Publication No. 5-206691 Japanese Unexamined Patent Publication No. 2013-143396

However, in the mounting heads described in Patent Documents 1 and 2, although the rotational position of the mounting head can be detected, the information directly related to the posture of the held component has not been sufficiently considered. In the mounting process, the mounting process may not be performed properly when the posture of the component held by the mounting head is rotated around the rotation axis of the nozzle, for example. For this reason, the work head is required to accurately acquire information on the posture of the held parts such as the rotation position of the parts.

The present invention has been made in view of such a problem, and provides a work head unit, a mounting device, and a control method of a work head unit capable of more accurately acquiring information on the posture of a held part. Is the main purpose.

The present invention has taken the following measures to achieve the above-mentioned main object.

The working head unit of the present invention
A part holding part that can rotate around the rotation axis and is used to hold parts,
A detection unit that is arranged at a position facing the component holding portion and detects the posture of the component holding portion,
It is equipped with.

In this work head unit, the posture of the component holding unit is detected at a position where the detecting unit faces the component holding unit that holds the component. In this way, since the posture of the portion holding the component is detected, for example, information that more reflects the posture of the component can be obtained as compared with the one that detects the posture other than the component holding portion. Therefore, it is possible to acquire information on the posture of the held parts more accurately. Here, the "posture of the component holding portion" may be a rotational position of the component holding portion on a predetermined axis.

The control method of the work head unit of the present invention is
A work head including a component holding portion that can rotate around a rotation axis and is used for holding a component, and a detecting portion that is arranged at a position facing the component holding portion and detects the posture of the component holding portion. It ’s a unit control method.
(A) The step includes a step of correcting the posture of the component holding unit based on the information on the posture of the component holding unit detected by the detecting unit.

In this control method, since the posture of the component holding portion that holds the component is detected, for example, information that more reflects the attitude of the component can be obtained as compared with the one that detects the posture other than the component holding portion. Therefore, it is possible to acquire information on the posture of the held parts more accurately. Further, since the posture of the component holding portion is corrected by using the result of detecting the posture of the portion holding the component, the posture of the component can be corrected more correctly. In this control method, various aspects of the work head unit described above may be adopted, or a configuration for realizing each function of the work head unit described above may be added.

Schematic diagram of the mounting system 10. Explanatory drawing of the outline of the mounting head unit 17. The explanatory view of the mounting head unit 17 having the mounting head 50. The block diagram which shows the electrical connection relation of the mounting apparatus 11. The flowchart which shows an example of the parts collection arrangement processing routine.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory view of the mounting system 10. FIG. 2 is an explanatory diagram of an outline of the mounting head unit 17. 3A and 3B are explanatory views of a mounting head unit 17 having a mounting head 50, FIG. 3A is a side view of the mounting head 50, and FIG. 3B is a bottom side view of the mounting head 50. FIG. 4 is a block diagram showing an electrical connection relationship of the mounting device 11. The mounting system 10 of the present embodiment includes a mounting device 11 including a mounting processing unit 12 and mounting a component P (see FIG. 2) on a substrate S, and a management computer that manages information related to the mounting processing (for example, production job data). It has 90 and. In this embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. Further, the mounting process includes a process of arranging, mounting, inserting, joining, and adhering the component P on the substrate S.

The mounting device 11 includes a board transport unit 14 that transports the board S, a board support unit 15 that supports the board S from the lower surface side, and a mounting head unit 17 that sucks (collects) the component P and arranges it on the board S. It includes a head moving unit 16 that moves the mounting head unit 17 in the XY directions (see FIG. 1). Further, the mounting device 11 includes an operation panel 19 including a supply unit 18 on which a reel accommodating a component P is mounted, a display unit 24 for displaying a display screen, and an operation unit 25 capable of performing various input operations by an operator. It is equipped with a control device 80 (see FIG. 4) that executes various controls (see FIG. 4).

The substrate transport unit 14 transports the substrate S from left to right by conveyor belts 22 and 22, which are attached to a pair of front and rear support plates 21 and 21, respectively. The board support unit 15 includes a plurality of support pins 23 that support the board S from below, and supports the board S from the back surface side of the board S that is transported and fixed by the board transfer unit 14.

The head moving unit 16 includes an X-axis slider 26, a Y-axis slider 30, and the like. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the mounting device 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is slidably attached to the guide rails 28, 28 in the left-right direction. The mounting head unit 17 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are driven by drive motors (not shown).

The mounting head unit 17 is mounted on the front surface of the X-axis slider 26. The mounting head unit 17 has a head holding body 40 arranged on the X-axis slider 26 for holding the mounting head 50, a suction nozzle 42 for sucking the component P, and one or more suction nozzles 42 mounted and removable mounting head 50. And have. As shown in FIG. 3, the head holding body 40 includes a holding body main body 45 attached to the X-axis slider 26 and an engaging shaft 46 arranged downward from the holding body main body 45. The engaging shaft 46 is arranged in the holding body body 45 so as to be rotatable about the shaft, and is inserted into a bottomed hole formed in the center of the mounting head 50 (Q-axis gear 53) to engage the mounting head 50. The holding body body 45 is provided with an R-axis motor 60, a Q-axis motor 63, and a Z-axis motor 66 that rotationally drive the mounting head 50. An encoder 61 is provided on the R-axis motor 60 (see FIG. 3), and the encoder 61 controls the basic rotation position. The encoder 61 may be a transmission type optical encoder. The Q-axis motor 63 is similar to the R-axis motor 60 and includes an encoder 64. The Z-axis motor 66 raises and lowers the suction nozzle 42 by moving the horizontal portion 68 along the Z-axis guide 67 extending vertically downward. The rotation axis of the mounting head 50 (rotary portion 51) is referred to as an R axis, and the rotation axis of the suction nozzle 42 (part holding portion 55) is referred to as a Q axis.

The head holder 40 holds the mounting head 50. The mounting head 50 includes, for example, 16 component holding portions 55, and 16 suction nozzles 42 can be mounted (see FIGS. 2 and 3). The mounting head 50 is configured as a rotary type working head that is held by the head holder 40 in a rotatable state. The mounting head 50 has a rotary portion 51 which is a cylindrical member, an R-axis gear 52 arranged below the rotary portion 51, a Q-axis gear 53 arranged above the rotary portion 51, and lower ends thereof. It includes a plurality of long cylindrical syringe members 56 to which the suction nozzle 42 is mounted. The mounting head 50 is provided with a component holding portion 55 having a suction nozzle 42 for collecting the component P and a syringe member 56 on which the suction nozzle 42 can be mounted and removed so as to be able to move up and down. The mounting head 50 is rotatably held by the head holder 40 about a rotation axis (R axis), and includes a rotary portion 51 having the same center axis as the rotation axis. The rotary portion 51 is, for example, a member that supports 16 syringe members 56 so as to be rotatable and vertically movable around the central axis of the syringe member 56. The R-axis gear 52 is a disk-shaped member having an outer diameter larger than that of the rotary portion 51, and a gear groove is formed on the outer peripheral surface thereof. The R-axis gear 52 meshes with a small gear 62 connected to the rotating shaft of the R-axis motor 60, and is rotationally driven by the R-axis motor 60 via the small gear 62. The Q-axis gear 53 is a cylindrical member having an outer diameter smaller than that of the rotary portion 51, and a gear groove is formed on the outer peripheral surface thereof. The syringe member 56 is a member in which a small gear 57 is arranged on the upper end side thereof and a suction nozzle 42 is mounted on the lower end side. The small gear 57 meshes with a gear groove formed on the outer circumference of the Q-axis gear 53. The syringe members 56 are arranged at equal intervals along the outer circumference of the Q-axis gear 53.

The suction nozzle 42 uses pressure to suck the component P to the tip of the nozzle and release the component P sucked to the tip of the nozzle. The suction nozzle 42 has a disc-shaped flange 43 and a tubular portion 44 formed on the tip end side (see FIGS. 2 and 3). The component holding portion 55 is composed of the suction nozzle 42 and the syringe member 56. The component holding portion 55 is rotatable about a rotation axis (Q axis) and is used for holding the component P. The component holding portion 55 (suction nozzle 42) has a Q-axis transmitted via a small gear 65 connected to the Q-axis motor 63, a Q-axis gear 53, and a small gear 57 arranged on the upper end side of the syringe member 56. The driving force of the motor 63 rotates (rotates) around the rotation axis, and the angle of the attracted component P can be adjusted. The component holding portion 55 is moved up and down in the Z-axis direction (vertical direction) along the Z-axis guide 67 by the driving force of the Z-axis motor 66 transmitted via the horizontal portion 68. The mounting head 50 raises and lowers the component holding portion 55 in the Z-axis direction at one raising / lowering position (see FIG. 3) located on the front end side of the mounting head unit 17 in the Y-axis direction. The sampling member for collecting the component P is described here as the suction nozzle 42, but the sampling member is not particularly limited as long as the component P can be sampled, and may be a mechanical chuck for sandwiching and sampling the component P.

A prismatic support member 47 that supports the R-axis encoder 70, the first Q-axis encoder 73, the second Q-axis encoder 76, and the like as a detection unit is arranged downward in front of the holder body 45. .. The support member 47 extends to a position facing the suction nozzle 42. A horizontal portion 48 is formed on the lower end side of the support member 47 toward the suction nozzle 42 side, and a first Q-axis encoder 73 is arranged at the tip of the horizontal portion 48. The R-axis encoder 70 is a detection unit that directly detects the rotational position of the mounting head 50 (rotary unit 51), and is configured as a reflection type optical encoder. The R-axis encoder 70 is arranged at a position facing the rotary portion 51 as a cylindrical portion of the mounting head 50. The R-axis encoder 70 includes a cord portion 71 formed over the central portion of the outer periphery of the rotary portion 51, and an element portion 72 arranged at a position facing the cord portion 71 of the support member 47. .. The cord unit 71 has a region that reflects the light emitted from the element unit 72 and a region that does not reflect the light. The element unit 72 includes an irradiation unit that irradiates light and a light receiving unit that receives the light reflected by the cord unit 71. The R-axis encoder 70 irradiates the cord unit 71 with light from the element unit 72 and detects the pattern of the reflected light from the cord unit 71 to grasp the rotational position of the rotary unit 51.

The first Q-axis encoder 73 is a detection unit that directly detects the rotational position of the suction nozzle 42 mounted at the lower end of the component holding unit 55, and is configured as a reflection type optical encoder. The first Q-axis encoder 73 is arranged at a position facing the flange 43 of the suction nozzle 42. The first Q-axis encoder 73 includes a cord portion 74 formed over the outer periphery of the flange 43, and an element portion 75 arranged at a position facing the cord portion 74 on the support member 47. The first Q-axis encoder 73 has either an initial position of the suction nozzle 42 (see the solid line in the blowout in FIG. 3) or an extension position of the suction nozzle 42 (see the tie line) when the component holding portion 55 is moved up and down. Also in the above, the element portion 75 formed long in the moving direction of the suction nozzle 42 so as to face the flange 43 is fixed to the support member 47. The second Q-axis encoder 76 is a detection unit that directly detects the rotational position of the syringe member 56 near the small gear 57 at the upper end of the component holding unit 55, and is configured as a reflection type optical encoder. The second Q-axis encoder 76 is arranged in a cylindrical portion on the upper end side of the syringe member 56. The second Q-axis encoder 76 includes a cord portion 77 formed over the outer periphery of the syringe member 56, and an element portion 78 arranged at a position facing the cord portion 77 on the support member 47. Since the cord unit 74, the cord unit 77, the element unit 75, and the element unit 78 have the same configuration as the cord unit 71 and the element unit 72, respectively, the description thereof will be omitted. The element portion 72 of the R-axis encoder 70, the element portion 75 of the first Q-axis encoder 73, and the element portion 78 of the second Q-axis encoder 76 are the component holding portion 55 and the rotary portion from the outer peripheral side of the mounting head unit 17 (mounting head 50). It is arranged so as to face the 51.

The mounting head unit 17 has a storage unit 41a for storing information, and includes a control unit 41 that controls the entire mounting head unit 17 (see FIG. 4). The control unit 41 includes a CPU, ROM, RAM, and the like. Information on the mounting head 50, information on the suction nozzle 42, and the like are stored in the storage unit 41a. The control unit 41 is electrically connected to detection units such as the R-axis encoder 70, the first Q-axis encoder 73, and the second Q-axis encoder 76, and acquires signals from these detection units.

As shown in FIG. 4, the control device 80 is configured as a microprocessor centered on a CPU 81, and has a ROM 82 for storing a processing program, an HDD 83 for storing various data, a RAM 84 used as a work area, an external device and electricity. It includes an input / output interface 85 and the like for exchanging signals, and these are connected via a bus. The control device 80 is connected to the board transfer unit 14, the board support unit 15, the head moving unit 16, the mounting head unit 17, the supply unit 18, the operation panel 19, and the like so as to be bidirectionally communicative with these units and the like. Exchange signals.

Next, the operation of the mounting system 10 of the present embodiment configured in this way, first, the mounting process of the mounting device 11 will be described. The mounting processing routine is stored in the HDD 83 of the control device 80, and is executed according to the production start instruction by the operator. When this routine is executed, the CPU 81 controls the board transport unit 14 and the board support unit 15 so as to transport the board S into the apparatus and fix it at the mounting position. Next, the CPU 81 reads out the production job data, sets the component P to be arranged on the substrate S, and mounts the mounting head 50 and the suction nozzle 42 for collecting the component P on the head holder 40. Next, the CPU 81 controls the head moving unit 16 and the mounting head unit 17, causes the suction nozzle 42 to collect the component P, and executes a process of arranging the component P on the substrate S. Then, when the mounting process of the current board S is completed, the board S is discharged, the next board S is carried in, and the board S is fixed at the mounting position. The CPU 81 repeatedly executes the above-described processing until the production of all the substrates S is completed.

Next, a process of having the suction nozzle 42 collect the component P executed in the mounting process routine and arranging the component P on the substrate S will be described. FIG. 5 is a flowchart showing an example of a component collection / arrangement processing routine executed by the CPU of the control unit 41 included in the mounting head unit 17. This routine is stored in the storage unit 41a of the control unit 41 and executed at a predetermined timing. In this routine, processing for correcting the rotational position of the component P and detecting the degree of deformation such as twisting of the syringe member 56 is performed. When this routine is started, the CPU of the control unit 41 drives the R-axis motor 60 so that the component holding unit 55, which is the target of the elevating operation, is arranged at a predetermined elevating position, and rotates the rotary unit 51. Rough positioning of the R axis, which is the axis, is performed (step S100). In this rough positioning, the value of the encoder 61 provided on the R-axis motor 60 is used to drive and control the R-axis motor 60 so that the rotary portion 51 is at the set rotation position. Next, the CPU acquires the value of the R-axis encoder 70, corrects the rotation position of the R-axis based on this value, and drives and controls the R-axis motor 60 so that the rotary portion 51 is positioned at the correct rotation position. (Step S110).

Next, the CPU of the control unit 41 roughly positions the Q axis, which is the rotation axis of the component holding unit 55 (suction nozzle 42) (step S120). In this rough positioning, the value of the encoder 64 provided in the Q-axis motor 63 is used to drive and control the Q-axis motor 63 so that the suction nozzle 42 is at the set rotation position. Next, the CPU acquires the value of the first Q-axis encoder 73, corrects the rotation position of the Q-axis based on this value, and drives and controls the Q-axis motor 63 so that the syringe member 56 is positioned at the correct rotation position. (Step S130). At this time, the control unit 41 may acquire the value of the first Q-axis encoder 73 at the extension position where the suction nozzle 42 is lowered. In this way, the control unit 41 can acquire the rotation position of the suction nozzle 42 in the state where the component P is arranged.

Next, the CPU of the control unit 41 acquires the values from the second Q-axis encoder 76 (step S140), and associates the values of the first Q-axis encoder 73 and the second Q-axis encoder 76 with the component holding unit 55 currently in use. It is stored in the storage unit 41a (step S150). In this way, the CPU saves the state of the component holding unit 55 as a history. Subsequently, the CPU obtains a difference value between the values of the first Q-axis encoder 73 and the second Q-axis encoder 76, and determines which range of the allowable range, the warning range, and the abnormal range includes the difference value (step). S160). The permissible range may be empirically determined as a range of the degree of deformation such as twisting of the component holding portion 55 that does not significantly affect the mounting process. The warning range may be empirically defined as a range in which the degree of deformation of the component holding portion 55 is relatively large and requires attention, for example. The abnormal range may be, for example, a range empirically determined as a range in which the component holding portion 55 should be replaced.

When the difference value between the first Q-axis encoder 73 and the second Q-axis encoder 76 is within the permissible range, the CPU of the control unit 41 executes the processes after step S190 as it is. On the other hand, when the difference value is within the warning range, the CPU outputs a command to the control device 80 to display a warning or the like indicating that maintenance is required on the operation panel 19 (step S170). Upon receiving this, the control device 80 displays a message on the display unit 24 of the operation panel 19 indicating that maintenance of the component holding unit 55 is required. On the other hand, when the difference value is in the abnormal range, the CPU outputs a command to interrupt the mounting process and a command to display an error display to that effect on the operation panel 19 to the control device 80 (step S180), and executes this routine as it is. finish. Upon receiving this command, the control device 80 interrupts the mounting process and causes the display unit 24 of the operation panel 19 to display a message indicating that the component holding unit 55 needs to be replaced.

After step S170, or when the difference value is within the permissible range in step S160, the CPU of the control unit 41 performs the sampling process of the component P (step S190). In this process, the CPU drives the Z-axis motor 66 so as to lower the suction nozzle 42 to the extension position after the mounting head unit 17 is arranged at the component sampling position of the designated supply unit 18, and causes the suction nozzle 42 to move down. A negative pressure is applied to attract the component P to this tip. Subsequently, the CPU determines whether or not the collection of the component P to be collected by the mounting head 50 is completed (whether all the parts P have been collected) (step S200), and if the collection is not completed, the steps S100 and subsequent steps are performed. Execute the process. On the other hand, when the collection of the component P is completed, the CPU drives the R-axis motor 60 so as to move the component holding portion 55 holding the component P to be arranged on the substrate S to the elevating position, and rotates the component P. The Q-axis motor 63 is driven so that the position becomes the correct rotation position (step S210). At this time, the CPU may perform the same processing as in steps S100 to S140 described above, or correct and position the rotation positions of the R axis and Q axis by using the correction values used in steps S100 to S140 described above again. May be used.

Subsequently, the CPU of the control unit 41 determines whether or not the mounting head unit 17 has been moved to the arrangement position where the component P is arranged on the board S (step S220), and if it has not been moved to the arrangement position, waits. To do. When the mounting head unit 17 has already been moved to the placement position, the CPU lowers the component holding unit 55 and executes the component P placement process (step S230). Then, the CPU determines whether or not the mounting head 50 has a component P that has been collected and has not been placed in the mounting head 50 (step S240), and the component P that has been collected and has not been placed is placed in the mounting head 50. At a certain time, the processes after step S210 are repeatedly executed. On the other hand, when there is no unarranged component P that has been collected, the CPU terminates this routine as it is. The CPU repeatedly executes such a process until the arrangement of the component P on all the boards S is completed.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The first Q-axis encoder 73 and the second Q-axis encoder 76 of the present embodiment correspond to the detection unit, the suction nozzle 42 corresponds to the sampling member, the flange 43 corresponds to the cylindrical portion of the sampling member, and the mounting head 50 corresponds to the work head. The support member 47 corresponds to the support member, the rotary portion 51 corresponds to the cylindrical portion of the work head, and the R-axis encoder 70 corresponds to the position detection portion. In the present embodiment, an example of the control method of the mounting device of the present invention is also clarified by explaining the operation of the mounting device 11.

According to the mounting head unit 17 of the present embodiment described above, the rotation position of the suction nozzle 42 is detected at a position where the first Q-axis encoder 73 faces the suction nozzle 42 holding the component P. In this way, since the rotation position of the portion holding the component P is directly detected, information on the rotation position of the component P held by the suction nozzle 42 can be acquired more accurately. Further, for example, the suction nozzle 42 can be positioned at a more accurate position as compared with using the encoder 64 which is separated from the suction nozzle 42. Further, since the posture of the component holding portion 55 is corrected by using the result of detecting the posture of the portion holding the component P, the posture of the component P can be corrected more correctly. Further, since the first Q-axis encoder 73 is arranged at a position facing the flange 43, the rotation position of the suction nozzle 42 closest to the held component P can be detected, and the rotation position of the component P can be determined. It can be acquired more accurately. Furthermore, since the second Q-axis encoder 76 is arranged at a position facing the cylindrical portion of the syringe member 56, the component holding portion is compared with the case where the suction nozzle 42 having a relatively small diameter detects the rotational position. It is easier to detect the rotation position of 55. Further, in the mounting head unit 17, since the posture of the component holding portion 55 is detected at two points of the suction nozzle 42 and the syringe member 56, the state of the syringe member 56 (for example, deformation) and the syringe member 56 and the suction nozzle are detected. It is possible to detect a deviation from 42.

Further, the mounting head unit 17 is a syringe based on the rotation position of the suction nozzle 42 and the rotation position of the cylindrical portion of the syringe member 56 acquired by the control unit 41 from the first Q-axis encoder 73 and the second Q-axis encoder 76. Information on the state of the member (for example, deformation such as twisting) is stored in the storage unit 41a. Therefore, the mounting head unit 17 can also manage the state of the syringe member 56. Further, the mounting head unit 17 is formed so as to face the flange 43 (cord portion 74) at both the initial position of the suction nozzle 42 and the extension position when the component holding portion 55 is moved up and down. To be equipped. Therefore, the mounting head unit 17 can detect the posture of the component P according to the elevating position of the component holding portion 55 when the component holding portion 55 moves up and down while holding the component P. Furthermore, since the mounting head unit 17 is provided with the element portion 72 of the R-axis encoder 70 that detects the rotational position of the rotary portion 51 at a position facing the rotary portion 51 (cylindrical portion), the mounting head 50 The rotation position can be directly acquired, and the rotary portion 51 can be positioned at a more accurate position as compared with using the encoder 64 which is separated from the rotary portion 51. Further, the mounting head unit 17 has a first Q-axis encoder 73 arranged to face the suction nozzle 42 side (one end side) and a second Q-axis encoder arranged to face the other end side of the syringe member 56. Since the syringe member 56 is provided with the 76, deformation such as twisting of the syringe member 56 can be detected in more detail. Further, in the mounting head unit 17, detection units such as the first Q-axis encoder 73 and the second Q-axis encoder 76 are arranged so as to face the component holding portion 55 from the outer peripheral side of the mounting head 50. Can be arranged relatively easily.

It is needless to say that the present invention is not limited to the above-described embodiment, and can be implemented in various aspects as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the first Q-axis encoder 73 is arranged at a position facing the suction nozzle 42, and the second Q-axis encoder 76 is arranged at a position facing the cylindrical portion of the syringe member 56. However, the present invention is not particularly limited to this, and either the first Q-axis encoder 73 or the second Q-axis encoder 76 may be omitted. Even in this way, since the rotation position of the component holding portion 55 can be directly detected, information on the rotation position of the component P held by the suction nozzle 42 can be acquired more accurately. When there is only one detection unit, the mounting head unit 17 omits the management of the information regarding the deformation of the syringe member 56 described above.

In the above-described embodiment, the cord portion 74 of the first Q-axis encoder 73 is formed on the flange 43, but is particularly limited if it is formed on the cylindrical outer surface of the suction nozzle 42. However, for example, the cord portion may be formed on the tubular portion 44. Even in this way, the same effect as that of the above-described embodiment can be obtained. Further, although the cord portion 77 of the second Q-axis encoder 76 is formed on the upper end side of the syringe member 56, it may be formed on any portion of the syringe member 56.

In the above-described embodiment, the rotation position is detected on the lower end side and the upper end side of the component holding portion 55 to detect the deformation of the component holding portion 55, but this process may be omitted. Even in this way, the information regarding the rotation position of the component P held by the suction nozzle 42 can be acquired more accurately.

In the above-described embodiment, the first Q-axis encoder 73 is provided with an element portion 75 formed so as to be able to detect the rotational position of the suction nozzle 42 at both the initial position and the extension position. For example, the element unit 75 may be raised and lowered according to the raising and lowering of the suction nozzle 42. Even in this way, the rotational position of the component P according to the elevating position of the suction nozzle 42 can be acquired more accurately.

In the above-described embodiment, the R-axis encoder 70 is provided, but this may be omitted. Even in this way, the correction of the rotation position of the rotary portion 51 is omitted, but the information regarding the rotation position of the component P held by the suction nozzle 42 can be acquired more accurately.

In the above-described embodiment, the rotary type mounting head 50 which is held by the head holding body 40 in a rotatable state has been described as an example, but a fixed type working head which is held by the head holding body 40 in a non-rotatable state. It may be provided with. Further, although not particularly described in the above-described embodiment, the mounting device 11 may include a mounting head unit in which a plurality of types of mounting heads are interchangeably held by the head holder 40.

In the above-described embodiment, each detection unit has been described as a reflection type optical encoder, but the present invention is not particularly limited as long as it detects the posture of the component holding unit 55, and is a transmission type optical encoder. It may be an encoder or a magnetic encoder. Further, each detection unit shall detect the rotation position of the component holding unit 55, but the present invention is not limited to this.

In the above-described embodiment, the mounting device 11 including the mounting head unit 17 has been described, but the present invention is not particularly limited to this, and the mounting head unit 17 may be used. Further, in the above-described embodiment, although the mounting device 11 has been described, the mounting head unit 17 may be controlled.

The present invention can be used in the field of mounting electronic components.

10 Mounting system, 11 Mounting equipment, 12 Mounting processing unit, 14 Board transfer unit, 15 Board support unit, 16 Head movement unit, 17 Mounting head unit, 18 Supply unit, 19 Operation panel, 21 Support plate, 22 Conveyor belt, 23 Support pin, 24 display unit, 25 operation unit, 26 X-axis slider, 28 guide rail, 30 Y-axis slider, 32 guide rail, 40 head holder, 41 control unit, 41a storage unit, 42 suction nozzle, 43 flange, 44 Tubular part, 45 holder body, 46 engaging shaft, 47 support member, 48 horizontal part, 50 mounting head, 51 rotary part, 52 Q-axis gear, 53 R-axis gear, 55 parts holding part, 56 syringe member, 57 small Gear, 60 R-axis motor, 61 encoder, 63 Q-axis motor, 64 encoder, 65 small gear, 66 Z-axis motor, 67 Z-axis guide, 68 horizontal part, 70 R-axis encoder, 71 cord part, 72 element part, 73 1st Q-axis encoder, 74 code part, 75 element part, 76 2nd Q-axis encoder, 77 code part, 78 element part, 80 controller, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input / output interface, 90 management Computer, P component, S board.

Claims (7)

A part holding part that can rotate around the rotation axis and is used to hold parts,
A detection unit that is arranged at a position facing the component holding portion and detects the posture of the component holding portion,
A control unit electrically connected to the detection unit is provided.
The component holding portion has a collecting member having a cylindrical portion and collecting parts, and a syringe member to which the collecting member can be attached and detached.
The detection unit is arranged at a position facing the cylindrical portion of the sampling member and a position facing the cylindrical portion of the syringe member.
The control unit determines the state of the syringe member based on the rotation position of the cylindrical portion of the sampling member and the rotation position of the cylindrical portion of the syringe member acquired from the detection unit.
Work head unit. Wherein, prior to determining the difference between the rotational position of the cylindrical portion of Quito preparative member and the rotational position of the cylindrical portion of the syringe member, the state of the syringe member on the basis of the preset predetermined range , The work head unit according to claim 1. The control unit determines which of the allowable range, the warning range, and the abnormal range as the predetermined range includes the difference value, and the state of the syringe member is the allowable state, the warning state, and the abnormal state. The work head unit according to claim 2, wherein it is determined which of the two. A work head unit used in a mounting device including a mounting processing unit for mounting components on a board and a display unit for displaying a display screen.
The control unit determines whether or not the difference value between the rotational position of the cylindrical portion of the sampling member and the rotational position of the cylindrical portion of the syringe member is included in the predetermined abnormal range, and the difference value is the abnormal range. The work head unit according to any one of claims 1 to 3, wherein when it is determined to be included in the above, the mounting process is interrupted and an error display is displayed on the display unit. A work head unit used in a mounting device including a mounting processing unit for mounting components on a board and a display unit for displaying a display screen.
The control unit determines whether or not the difference value between the rotation position of the cylindrical portion of the sampling member and the rotation position of the cylindrical portion of the syringe member is included in the predetermined warning range, and the difference value is the warning range. The work head unit according to any one of claims 1 to 4, wherein a warning indicating that maintenance is required is displayed on the display unit when it is determined that the work head unit is included in the above. The work head unit according to any one of claims 1 to 5,
A mounting device including a mounting processing unit that mounts components on a board. A component holder that has a collecting member that is rotatable around a rotation axis and has a cylindrical part to collect parts and a syringe member that has a cylindrical part and is capable of mounting and removing the collecting member and is used for holding parts. A detection unit that is arranged at a position facing the cylindrical portion of the sampling member and a position facing the cylindrical portion of the syringe member to detect the posture of the component holding portion, and electrically connected to the detection unit. It is a control method of a work head unit provided with a control unit.
(A) A step of determining the state of the syringe member based on the rotational position of the cylindrical portion of the sampling member and the rotational position of the cylindrical portion of the syringe member obtained from the detection unit.
How to control the work head unit, including.

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