JP7431927B2 - Component mounting system - Google Patents

Description

The present invention relates to a required accuracy setting device.

2. Description of the Related Art Conventionally, a component mounting machine is known in which a collecting section collects a component supplied from a component supply unit, carries the component onto a board, and mounts the component at a predetermined mounting position on the board. For example, in Patent Document 1, in this type of component mounting machine, the required accuracy is determined according to the type of process and the type/size of the component, and the head during movement in the process is determined according to the determined required accuracy. A method for controlling the positioning waiting time, moving speed, and moving acceleration of the head is disclosed.

Japanese Patent Application Publication No. 4-328900

However, in Patent Document 1, the magnitude of the required accuracy is determined without considering the surrounding situation of the component to be mounted on the board. Therefore, for example, when attaching a certain part to a board, there are cases where other parts are already installed in the immediate vicinity of the mounting position of that part, and cases where other parts are not yet mounted around the mounting position of that part. Therefore, it was not possible to change the required accuracy. As a result, the required accuracy sometimes did not match the actual situation.

The present invention has been made to solve the above-mentioned problems, and its main purpose is to automatically appropriately set the required precision of a target component to be mounted on a board.

The required accuracy setting device of the present invention includes:
A required accuracy setting device that sets a required accuracy required when a collecting section collects a component supplied from a component supply unit and mounts it on a predetermined mounting position on a board,
When collecting the target component from the component supply unit and/or mounting the target component at the mounting position based on surrounding situation data regarding the surrounding situation of the mounting position of the target component to be mounted on the board. This is to set the required accuracy required.

This required accuracy setting device collects the target part from the component supply unit and/or mounts the target part at the mounting position based on the surrounding situation data regarding the surrounding situation of the mounting position of the target part to be mounted on the board. Automatically sets the required precision when required. Since the required accuracy is automatically set based on the surrounding situation data in this way, the set required accuracy is more suited to the actual situation than in the past. Therefore, the required precision of the target part can be appropriately and automatically set.

In the required accuracy setting device of the present invention, the surrounding situation data includes data regarding an inter-component distance between the target component and a peripheral component that is attached or installed around the target component, and sets the required accuracy. In this case, the required accuracy may be set higher as the distance between the parts is smaller. In this way, when the distance between the parts is small, the required accuracy is set high, so that when the target part is mounted, it is difficult for the target part to interfere with surrounding parts.

In the required accuracy setting device of the present invention, the surrounding situation data includes a component holding member of the collecting section when mounting the target component to the mounting position and peripheral components mounted or mounted around the target component. In setting the required accuracy, the closer the positional relationship between the component holding member and the peripheral component is, the higher the required accuracy may be set. In this way, if the shape or size of the component holding member to which the target part is to be mounted is such that the component holding member is likely to interfere with surrounding components, the required accuracy will be set high, and the target part will be mounted. At the same time, the component holding member can be made less likely to interfere with peripheral components.

In the required accuracy setting device of the present invention, the surrounding situation data includes data regarding the printing state of solder printed at a predetermined mounting position on the board before the target component is mounted at the predetermined mounting position, and In setting the accuracy, the required accuracy may be set higher as the deviation of the printed solder from the mounting position is larger. In this way, if there is a large misalignment of the printed solder, the tolerance range when mounting the target component to the predetermined mounting position will be narrowed, but since the required accuracy is set high, the target component will be placed within the tolerance range. Easy to install inside.

In the required accuracy setting device of the present invention, when setting the required accuracy, in addition to the surrounding situation data, the required accuracy is set based on data regarding the empirical positional deviation tendency of the target part, and The higher the required accuracy is, the higher the required accuracy may be set. In this way, when the tendency of the target component to be misaligned based on experience is high, the required accuracy is set high, so that the target component to be mounted is less likely to be misaligned.

1 is a configuration diagram schematically showing the configuration of a component mounting line 10. FIG. FIG. 1 is a configuration diagram showing an outline of the configuration of a mounting machine 11. FIG. 3 is a block diagram showing electrical connections between a control device 60 and a management computer 80. An explanatory diagram showing an example of a sequence. 5 is a flowchart showing an example of a required accuracy setting routine. An explanatory diagram showing an example of distance between parts. An explanatory diagram showing an example of the amount of protrusion of a nozzle. An example of sequence data after the required accuracy setting is completed is shown. 5 is a flowchart showing an example of a work allocation processing routine. FIG. 3 is a configuration diagram schematically showing the configuration of a component mounting line 10 according to another embodiment.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram schematically showing the structure of the component mounting line 10, and FIG. 2 is a block diagram schematically showing the structure of the mounting machine 11. In this embodiment, the left-right direction in FIGS. 1 and 2 is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

The component mounting line 10 includes a plurality of mounting machines 11A to 11D that perform the process of mounting components onto the board S, and a management computer 80 that performs production management of the entire system such as management of each of the mounting machines 11A to 11D. Since the mounting machines 11A to 11D have almost the same configuration, they are collectively referred to as the mounting machine 11 unless it is necessary to distinguish between them.

As shown in FIG. 2, the mounting machine 11 includes a transport section 18 that transports the substrate S, a collection section 21 that collects components, a reel unit 56 that supplies the components, and a control device 60 that controls the entire device. ing. The conveying unit 18 includes support plates 20, 20 that are spaced apart from each other in the front and rear of FIG. ing. The conveyor belts 22, 22 are endlessly spanned over driving wheels and driven wheels provided on the left and right sides of the support plates 20, 20. The substrate S is placed on the upper surface of a pair of conveyor belts 22, 22 and is conveyed from left to right. This substrate S is supported from its back side by a large number of support pins 23 erected.

The sampling section 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30, which is slidable in the front-back direction, so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. Note that the guide rails 32, 32 are fixed inside the mounting machine 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Note that each slider 26, 30 is driven by a drive motor (not shown).

The mounting head 24 is replaceably equipped with auto tools 42A and 42B each having one or more nozzles 40 for picking up parts. Note that when there is no need to distinguish between the auto tools 42A and 42B, they are collectively referred to as the auto tool 42. The auto tool 42A is equipped with twelve nozzles 40. The auto tool 42B includes one nozzle 40. The auto tool 42A has a structure in which the nozzle 40 slides directly inside a sleeve extending vertically, whereas the auto tool 42B has a structure in which the nozzle 40 slides while being supported by a bearing. Therefore, the nozzle 40 of the auto tool 42B can move up and down more smoothly than the auto tool 42A, and therefore has higher operational accuracy. In addition, the auto tool 42A has a mechanism that causes the nozzle 40 to revolve by rotating the cylindrical body around its axis, and a mechanism that rotates the nozzle 40 itself, whereas the auto tool 42B has a mechanism that rotates the nozzle 40 itself by rotating the cylindrical body around the axis. This has a mechanism for rotating the nozzle 40 on its own axis. Therefore, in this respect as well, the auto tool 42B with fewer movable parts has less rattling and higher operational accuracy than the auto tool 42A. The nozzle 40 uses pressure to attract parts to the tip of the nozzle or to release the parts attracted to the tip of the nozzle. This nozzle 40 is raised and lowered in the Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder lifting and lowering device using a Z-axis motor 45 as a driving source. Note that the component holding member that holds and releases components is described here as a nozzle 40 that attracts and releases components, but is not particularly limited thereto, and may be a mechanical chuck, for example.

The reel unit 56 includes a plurality of reels 57 around which tapes containing components are wound, and is detachably attached to the front side of the mounting machine 11. This tape is unwound from the reel 57 and fed by the feeder section 58 to a sampling position where it is sampled by the mounting head 24. The parts camera 54 is arranged in front of the support plate 20 on the front side of the transport section 18. The imaging range of this parts camera 54 is above the parts camera 54. The parts camera 54 photographs the state of the parts sucked by the nozzle 40 when the nozzle 40 sucking the parts passes above the parts camera 54 , and outputs the image to the control device 60 .

As shown in FIG. 3, the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62 that stores processing programs, an HDD 63 that stores various data, a RAM 64 used as a work area, and external devices and electricity. It includes an input/output interface 65 for exchanging signals, and these are connected via a bus 66. The control device 60 is connected to the transport section 18, the collection section 21, the parts camera 54, the reel unit 56, etc. so as to be able to communicate bidirectionally. Note that each slider 26, 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each slider 26, 30 while inputting position information from these position sensors.

As shown in FIG. 2, the management computer 80 includes a microprocessor including a CPU 81, a ROM 82 that stores processing programs, an HDD 83 that stores various information, a RAM 84 that is used as a work area, and a control device 60 for each mounting machine 11. It is provided with an input/output interface 85 for performing bidirectional communication with the computer, and these are connected via a bus 86. Further, the management computer 80 is connected to a display 88 so that signals can be inputted from an input device 87 such as a mouse or a keyboard via an input/output interface 85, and various images can be outputted to a display 88.

Next, the operation of the component mounting line 10 of this embodiment configured in this manner will be described. As shown in FIG. 1, the four mounting machines 11A to 11D that make up the component mounting line 10 sequentially mount components on one board S. All parts to be installed are installed. That is, all the components are mounted on the board S after one board S is introduced into the component mounting line 10 from the left side entrance and until it is discharged to the outside from the right side exit. In this case, the number of sequences for component mounting is equal to the number of mounting machines 11, that is, four in this case, and is stored in the HDD 83 of the management computer 80. An example of the sequence is shown in FIG. The sequence is associated with component-related data (component type, component size, mounting position on the board S, bump diameter, nozzle type, etc.) for each mounting order. The CPU 81 of the management computer 80 sets the required precision for each mounting order of the sequence, and allocates the sequence to a mounting machine having a specified precision that can realize the set required precision.

First, the required accuracy setting routine executed by the CPU 81 of the management computer 80 will be described. FIG. 5 is a flowchart showing an example of the required accuracy setting routine. This routine is stored in the HDD 83 of the management computer 80 and executed for each sequence.

When the CPU 81 of the management computer 80 starts the required accuracy setting routine, it first creates overall image data according to the current sequence (step S100). The overall image data is data indicating which parts will be placed where on the board if the parts are mounted according to the sequence. As shown in FIG. 5, the component-related data associated with the sequence mounting order includes component type, component size, component mounting position (center coordinates), bump diameter, nozzle type to be used, and the like. The CPU 81 determines the mounting area of each component from the mounting position (center coordinates) and component size of each part-related data, and arranges the mounting area of each component on the XY plane in the mounting order. The mounting area is the area on the XY plane that the component occupies when the component is accurately mounted at the mounting position. This creates the overall image data when all the parts are mounted on the board according to the current sequence.

Next, the CPU 81 assigns the value 1 to the variable n (step S110), and sets the n-th component in the mounting order as the target component in the current sequence (step S120). Next, the CPU 81 calculates (obtains) peripheral situation data of the target part (step S130), sets the required accuracy of the target part based on the peripheral situation data, and stores it in the HDD 83 (step S140). For example, as shown in FIG. 6, in the overall image data, if a peripheral component already exists before the target component is mounted, the CPU 81 determines the distance between the mounting area of the peripheral component and the mounting area of the target component. That is, the distance between parts is calculated as surrounding situation data, and the required accuracy of the target part is set based on the distance between parts. The required accuracy is a numerical value indicating how much deviation from the original mounting area is allowed, and is expressed as a numerical value such as 20 μm, 40 μm, or 60 μm. The smaller the number, the higher the required accuracy. For example, when the distance between parts is 40 μm, the CPU 81 sets the required accuracy of the target part to 40 μm. On the other hand, when the distance between parts is 20 μm, the CPU 81 sets the required accuracy of the target part to 20 μm. In this way, the smaller the inter-component distance between the target part and the peripheral parts, the higher the required accuracy of the target part is set. In reality, when setting the required accuracy of the target part, the required accuracy set for surrounding parts is also taken into consideration, so the required accuracy of the target part is set to a smaller value than the interval between parts. There are many. Further, as shown in FIG. 7, if the size of the nozzle type used for suctioning the target component is larger than the size of the target component and protrudes, the CPU 81 determines whether the nozzle 40 and the surrounding area are used when mounting the target component to the mounting position. Data representing the positional relationship with the parts (the amount of protrusion of the nozzle) is also calculated as surrounding situation data, and the required accuracy of the target product is set in consideration of the amount of protrusion of the nozzle. For example, when the distance between parts is 40 μm, the CPU 81 sets the required accuracy of the target component to <40 μm (for example, 30 μm or 20 μm) in order to take into account the amount of protrusion of the nozzle.

Next, the CPU 81 determines whether the variable n is the maximum value, that is, the last value in the mounting order of the current sequence (step S150), and if the variable n has not reached the maximum value, the variable n is The value is incremented by 1 (step S160), and the processing from step S120 onwards is performed again. On the other hand, if the variable n has reached the maximum value in step S150, this means that the required accuracy setting has been completed for all parts from the first to the last part in the mounting order of the current sequence. End the routine. FIG. 8 shows an example of sequence data after the required accuracy setting is completed. As can be seen from FIG. 8, in this embodiment, the required accuracy of the target component is also the accuracy required for each mounting order.

Next, the work allocation processing routine executed by the CPU 81 of the management computer 80 will be described. FIG. 9 is a flowchart showing an example of a work allocation processing routine. This routine is stored in the HDD 83 of the management computer 80 and executed upon a start instruction from an operator. When the CPU 81 of the management computer 80 starts the work allocation processing routine, it first obtains the specification accuracy of each of the mounting machines 11A to 11D (step S210). The specification accuracy is determined by both the accuracy of the mounting machine 11 itself and the accuracy of the auto tool 42 mounted on the mounting head 24 of the mounting machine 11. The specification accuracy of these placement machines 11A to 11D may be acquired by the CPU 81 of the management computer 80 from the control device 60 of each placement machine 11A to 11D through communication, or may be acquired from the specifications stored in advance in the HDD 83 of the management computer 80. It may also be read and acquired. Next, for each sequence, the CPU 81 obtains the required accuracy set for the parts included in that sequence (step S220), and sets the required accuracy for that sequence (step S230). Specifically, for a certain sequence, the CPU 81 sets the highest accuracy among the required accuracy set for each mounting order included in that sequence as the required accuracy of that sequence. Next, the CPU 81 allocates each sequence (step S240), and ends this routine. Specifically, when allocating a certain sequence, the CPU 81 allocates the sequence to the mounting machine 11 having the specification accuracy that satisfies the required accuracy of the sequence.

Next, the operation of the mounting machine 11, particularly the operation of sucking the components supplied by the reel unit 56 onto the nozzle 40 and mounting them at a predetermined position on the substrate S, will be described. First, the CPU 61 of the control device 60 causes the nozzle 40 of the auto tool 42 to attract a component according to the assigned sequence. When the auto tool 42A has 12 nozzles 40, the auto tool 42A is rotated intermittently to sequentially attract the parts 1 to 12 in the mounting order to the nozzles 40. On the other hand, in the case where the auto tool 42B has one nozzle 40, the component that is installed first is attracted to the nozzle 40. Thereafter, the CPU 61 controls the X-axis and Y-axis sliders 26 and 30 of the sampling section 21 to move the mounting head 24 above the parts camera 54, and then images the parts sucked by the nozzle 40 on the parts camera 54. let In a case where the auto tool 42A has 12 nozzles 40, the auto tool 42A is rotated intermittently while images of the components sucked by all the nozzles 40 are taken. On the other hand, when the auto tool 42B has one nozzle 40, an image of the component sucked by one nozzle 40 is taken. The CPU 61 understands the orientation of the component by analyzing this captured image. Next, the CPU 61 controls the X-axis and Y-axis sliders 26 and 30 of the sampling section 21 to move the mounting head 24 onto the substrate S, and mounts the component sucked by the nozzle 40 onto the substrate S. When the auto tool 42A has 12 nozzles 40, the auto tool 42A is rotated intermittently to sequentially mount the parts numbered 1 to 12 on the mounting position on the board S. On the other hand, when the autotool 42B has one nozzle 40, one component is mounted on the mounting position on the board S. The CPU 61 repeatedly executes this operation until the components to be mounted on the board S are mounted on the board S according to the assigned sequence, and after completing the operation, sends the board S to the mounting machine 11 on the downstream side.

Here, the correspondence between the constituent elements of this embodiment and the constituent elements of the present invention will be clarified. The management computer 80 of this embodiment corresponds to the required accuracy setting device of the present invention, the reel unit 56 corresponds to a component supply unit, and the nozzle 40 corresponds to a component holding member of the sampling section.

In the management computer 80 of this embodiment described in detail above, based on the surrounding situation data regarding the surrounding situation of the mounting position of the target component to be mounted on the board S, the required information is required when mounting the target component to the mounting position. Automatically set required accuracy. Since the required accuracy is automatically set based on the surrounding situation data in this way, the set required accuracy is more suited to the actual situation than in the past. Therefore, the required precision of the target part can be appropriately and automatically set.

In addition, when setting the required accuracy, the management computer 80 sets the required accuracy of the target component to be higher as the distance between the peripheral component and the target component is smaller. It can be made less likely to interfere with peripheral parts.

Furthermore, when setting the required accuracy, the management computer 80 takes into account the amount of nozzle protrusion in addition to the distance between parts. That is, the closer the positional relationship between the nozzle 40 and the surrounding components when mounting the target component to the mounting position, the higher the required precision of the target component is set. For example, when the shape and size of the nozzle 40 on which the target component is to be mounted causes the nozzle 40 to easily interfere with surrounding components, the required accuracy of the target component is set to be high. Therefore, it is possible to make it difficult for the nozzle 40 to interfere with peripheral components when mounting the target component.

It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the required accuracy setting routine (see FIG. 5) of the embodiment described above, the required accuracy is set with the mounting order determined in advance, but even if the required accuracy is set with the mounting order not determined. good. In that case, for example, a table is prepared in which the component mounting position and component type are associated with each other from the first to the last component to be mounted on one board S. The number is simply a serial number. Then, in step S120, the CPU 81 of the management computer 80 sets the component numbered n in the table as the target component. In addition, in steps S130 and S140, the CPU 81 calculates the interval (inter-component distance) between the mounting area of the peripheral components mounted around the target component and the mounting region of the target component as surrounding situation data, and calculates the distance between the parts. Set the required accuracy of the target part based on. After setting the required accuracy for all parts, the CPU 81 sends the component to the mounting machine 11 having the specification accuracy that satisfies the required accuracy of the component, based on the specification accuracy of the placement machine 11 and the required accuracy set for the component. Assign. Thereafter, the control device 60 of each mounting machine 11 determines the optimal mounting order for the assigned parts, and determines the mounting order. Even in this case, the same effects as in the embodiment described above can be obtained.

In the embodiment described above, the required accuracy required when mounting the target component to the mounting position is set, but instead of or in addition to this, the nozzle 40 of the sampling section 21 sucks the target component from the reel unit 56. You may also set the required precision that is sometimes required. For example, when the distance between the surrounding parts and the target part is small, if the gap when the nozzle 40 picks up the target part becomes large, the nozzle 40 protrudes from the target part or the amount of protrusion increases, and the target part May interfere with parts. In consideration of preventing such interference, it is preferable to set the required accuracy even during suction. Note that if the required accuracy during suction and mounting are different for a certain component, the required accuracy during suction may be adopted for the suction operation of the component, and the required accuracy during attachment may be adopted for the attachment operation.

In the component mounting line 10 of the above-described embodiment, as shown in FIG. 10, a solder printing machine 91 and a print inspection machine 92 are provided on the upstream side of the mounting machines 11A to 11D, and a solder printing machine 91 and a print inspection machine 92 are provided on the downstream side of the mounting machines 11A to 11D. An inspection machine 93 and a reflow oven 94 may be provided. The solder printing machine 91 screen prints solder on the substrate S. The print inspection machine 92 inspects the state of solder printed on the substrate S by image processing. The board inspection machine 93 inspects the state in which components are mounted on the printed solder by image processing. The reflow oven 94 heats the substrate S to melt the solder and solder each component onto the substrate S. In the configuration shown in FIG. 10, the required accuracy of the target component may be set to be larger as the deviation from the printed solder mounting position is larger. A specific example will be described below. In the solder printing machine 91, solder is printed at a predetermined position for each mounting position of the component (for example, a position facing an electrode portion (bump, etc.) of the component). If the result of the inspection by the printing inspection machine 92 is that the deviation of the solder printing by the solder printing machine 91 is within a predetermined range, the CPU 81 sets the required precision of the component to be placed on the solder to a normal level. In this case, if the required accuracy is at a normal level, no problem will occur in the electrical connection between the electrode portion of the component and the solder. If the solder printing misalignment exceeds a predetermined range, the tolerance range for the misalignment of the electrode portion of the component placed on top of the solder becomes narrower. In that case, the CPU 81 sets the required accuracy of the component to be placed on the solder higher than the normal level. This makes it easier to mount the target part within the allowable range. At this time, the required accuracy may be increased in stages depending on the magnitude of solder printing deviation. However, if the misalignment of the solder printing reaches a defective range that greatly exceeds the predetermined range, there is a high possibility that the electrical connection between the electrode part of the component and the solder will be disrupted, so the CPU 81 will mark the board S as NG and remove it from the line. You may also remove it.

In the component mounting line 10 of FIG. 10, if the deviations of all components are within the allowable range as a result of the inspection by the board inspection machine 93, the CPU 81 determines the position of each component to be mounted on the next board S to be carried into the component mounting line 10. Do not change the required accuracy. However, if the frequency of boards S whose misalignment exceeds the allowable range for a particular component exceeds a predetermined number (for example, k or more out of 10 boards (k is a natural number)), the CPU 81 detects the misalignment of that component. If it is determined that the tendency is high, the required precision of the component when mounting it on the board S that will be carried into the component mounting line 10 next time may be reset to a higher value. In this way, if a particular component has a high tendency for positional deviation based on experience, the required accuracy is set high, so that positional deviation of that component is less likely to occur from then on. Note that the required accuracy may be increased in stages depending on the frequency of substrates S whose displacement exceeds the allowable range for a particular component.

In the embodiment described above, the mounting machine 11 may have a plurality of work modes with different precisions, and may execute the component mounting process in a work mode suitable for the required precision of each component. For example, it is assumed that the mounting machine 11 can select one of a high precision mode (20 μm mode), a medium precision mode (40 μm mode), and a low precision mode (60 μm mode) as the work mode. In the high-precision mode, the mounting machine 11 controls the movement speed of the mounting head 24 to be slow so that the width of agreement between the target value and the measured value of position control falls within a narrow range. As a result, components can be mounted with high precision, although it takes a long time to mount the parts. On the other hand, in the low precision mode, the moving speed of the mounting head 24 is increased to control the position control so that the matching width between the target value and the measured value falls within a wide range. Although the accuracy of component mounting is not high, the component mounting time is thereby shortened, which contributes to improving throughput. The medium precision mode employs a moving speed and matching width that are intermediate between the high precision mode and the low precision mode. Then, when parts are sequentially mounted, a work mode suitable for the required precision of the parts is adopted. In this way, it is possible to allocate component mounting operations so that the capabilities of the mounting machine 11, which has a plurality of work modes, are fully utilized.

In the embodiment described above, the management computer 80 was shown as an example of the required accuracy setting device of the present invention, but the invention is not limited to this. For example, a computer for setting required accuracy may be provided separately from the management computer 80. Good too. Alternatively, the control device 60 of the mounting machine 11 may function as a required accuracy setting device.

INDUSTRIAL APPLICATION This invention can be utilized for the computer etc. which manage the mounting machine which a collection part mounts the component supplied from the component supply unit to the predetermined mounting position on a board|substrate.

10 component mounting line, 11, 11A to 11D mounting machine, 18 conveyance section, 20 support plate, 21 collection section, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X-axis slider, 28 guide rail, 30 Y-axis slider , 32 guide rail, 40 nozzle, 42, 42A, 42B auto tool, 45 Z-axis motor, 54 parts camera, 56 reel unit, 57 reel, 58 feeder section, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 input/output interface, 66 bus, 80 management computer, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input/output interface, 86 bus, 87 input device, 88 display, 91 solder printing machine, 92 printing inspection machine , 93 Board inspection machine, 94 Reflow oven.

Claims (3)

A mounting machine including a collecting section equipped with a mounting head having a plurality of nozzles, and a component supply unit;
The collecting unit sets the required accuracy required when the collecting unit takes the components supplied from the component supply unit and mounts them at a predetermined mounting position on the board using work modes with different component mounting times depending on the required accuracy. A component mounting system comprising a required accuracy setting device,
The required accuracy setting device collects information on the target part including the mounting position and component size of the target part to be mounted on the board, and the mounting position of the target part in a state where the mounting order is not determined. A request is made when picking up the target component from the component supply unit and/or when mounting the target component at the mounting position based on the mounting position of the peripheral component and information on the peripheral component including the component size. The required accuracy is set, and then the work mode that matches the required accuracy is adopted to determine the mounting order, thereby creating sequence data in which the required accuracy is associated with each mounting order of the parts. death,
The mounting machine executes the mounting process of the component in the work mode suitable for the required accuracy that is associated with each mounting order according to the sequence data.
Parts mounting system. a mounting machine including a collection section and a parts supply unit;
A component mounting system comprising: a required accuracy setting device for setting required accuracy required when the collecting section takes the components supplied from the component supply unit and mounts them at a predetermined mounting position on the board. There it is,
The required accuracy setting device includes information on the target component including the mounting position and component size of the target component to be mounted on the board, and the mounting position and component size of peripheral components of the mounting position of the target component. and information on the peripheral parts including information on the peripheral parts, set the required accuracy required when mounting the target part at the mounting position, and generate sequence data in which the required accuracy is associated with each mounting order of the parts. to create,
The required accuracy indicates how much deviation is allowed from the original mounting area, and is set to a value smaller than the inter-component interval between the target component and the peripheral component in setting the required accuracy ,
The mounting machine has a plurality of work modes with different accuracies, and executes the mounting process of the component in the work mode suitable for the required accuracy that is associated with each mounting order according to the sequence data.
Parts mounting system. a mounting machine including a collection section and a parts supply unit;
A component mounting system comprising: a required accuracy setting device for setting required accuracy required when the collecting section takes the components supplied from the component supply unit and mounts them at a predetermined mounting position on the board. There it is,
The required accuracy setting device includes information on the target part including the mounting position and part size of the target part to be mounted on the board, and information on the mounting position and part size of peripheral parts of the mounting position of the target part. Based on the information on the peripheral parts including information on the peripheral parts, the required accuracy required when picking up the target part from the component supply unit and/or mounting the target part in the mounting position is set, and Sequence data is created in which the required accuracy is associated with each mounting order of the
When setting the required accuracy, the required accuracy setting device sets the required accuracy based on the predetermined mounting order and takes into account the information of the peripheral components that already exist before the target component is mounted. Set precision ,
The mounting machine has a plurality of work modes with different accuracies, and executes the mounting process of the component in the work mode suitable for the required accuracy that is associated with each mounting order according to the sequence data.
Parts mounting system.

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