JP2022065172A - Required accuracy setting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately and automatically set the required accuracy of a target component to be mounted on a circuit board.

SOLUTION: A CPU of a management computer sets the n-th component in the mounting order as a target component in this sequence (S120), calculates (acquires) the peripheral status data of the target component (S130), and sets the required accuracy of the target component on the basis of the peripheral status data to store them in an HDD 83 (S140). Since the required accuracy is automatically set on the basis of the peripheral status data in this way, the set required accuracy is more suitable for the actual situation as compared with a conventional case. Therefore, the required accuracy of the target component can be appropriately and automatically set.

SELECTED DRAWING: Figure 5

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a required accuracy setting device.

Conventionally, there has been known a component mounting machine in which a sampling unit collects a component supplied from a component supply unit, carries the component onto a substrate, and mounts the component at a predetermined mounting position on the substrate. For example, in Patent Document 1, in this type of component mounting machine, the required accuracy is determined according to the type of process, the type / size of the component, and the like, and the head at the time of movement in the process is determined according to the determined required accuracy. Those that control the positioning waiting time, the moving speed of the head, and the moving acceleration of the head are disclosed.

Japanese Unexamined Patent Publication No. 4-328900

However, in Patent Document 1, the magnitude of the required accuracy is determined without considering the situation around the component to be mounted on the substrate. Therefore, for example, when mounting a certain component on a board, if another component is already mounted in the immediate vicinity of the mounting position of the component, or if another component is not yet mounted around the mounting position of the component. So, I couldn't change the required accuracy. Therefore, the required accuracy may not match the actual situation.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to appropriately and automatically set the required accuracy of a target component to be mounted on a substrate.

The required accuracy setting device of the present invention is
It is a required accuracy setting device that sets the required accuracy required when the sampling unit collects the parts supplied from the parts supply unit and mounts them at a predetermined mounting position on the board.
When collecting the target component from the component supply unit and / or when mounting the target component at the mounting position based on the peripheral status data regarding the peripheral status of the mounting position of the target component to be mounted on the substrate. It sets the required accuracy required for.

In this required accuracy setting device, when the target part is collected from the component supply unit and / or the target part is mounted at the mounting position based on the peripheral situation data regarding the peripheral situation of the mounting position of the target component to be mounted on the board. Automatically set the required accuracy when required. Since the required accuracy is automatically set based on the peripheral situation data in this way, the set required accuracy is more suitable for the actual situation as compared with the conventional case. Therefore, the required accuracy of the target component can be appropriately and automatically set.

In the required accuracy setting device of the present invention, the peripheral situation data includes data regarding the distance between the peripheral parts mounted or mounted around the target component and the target component, and sets the required accuracy. Therefore, the required accuracy may be set higher as the distance between the parts is smaller. By doing so, when the distance between the parts is small, the required accuracy is set high, so that the target part can be less likely to interfere with the peripheral parts when the target part is mounted.

In the required accuracy setting device of the present invention, the peripheral situation data is the component holding member of the sampling unit when the target component is mounted at the mounting position and the peripheral component mounted or mounted around the target component. When the required accuracy is set by including the data representing the positional relationship with the above, the required accuracy may be set higher as the positional relationship between the component holding member and the peripheral component is closer. In this way, when the part holding member is in a relationship that easily interferes with the peripheral parts due to the shape and size of the part holding member to which the target part is to be mounted, the required accuracy is set high, so that the target part is mounted. At this time, it is possible to prevent the component holding member from interfering with peripheral components.

In the required accuracy setting device of the present invention, the peripheral situation data includes data regarding the printing state of the solder printed at the mounting position of the target component before mounting the target component at the predetermined mounting position of the substrate, and the requirement is made. In setting the accuracy, the required accuracy may be set higher as the deviation of the printed solder from the mounting position is larger. In this way, if the printed solder is misaligned significantly, the allowable range for mounting the target component in the specified mounting position will be narrowed, but the required accuracy will be set high, so the target component will be within the allowable range. It will be easier to install inside.

In the required accuracy setting device of the present invention, in setting the required accuracy, the required accuracy is set based on the empirical positional deviation tendency of the target component in addition to the peripheral situation data, and the positional deviation tendency is set. The higher the value, the higher the required accuracy may be set. By doing so, when the empirically high tendency of the target component to be displaced is high, the required accuracy is set high, so that the positional displacement of the target component to be mounted is less likely to occur.

The block diagram which shows the outline of the structure of the component mounting line 10. The block diagram which shows the outline of the structure of the mounting machine 11. The block diagram which shows the electrical connection of a control device 60 and a management computer 80. Explanatory drawing which shows an example of a sequence. A flowchart showing an example of the required accuracy setting routine. Explanatory drawing which shows an example of the distance between parts. Explanatory drawing which shows an example of the protrusion amount of a nozzle. An example of sequence data after the required accuracy setting is completed is shown. A flowchart showing an example of a work allocation processing routine. The block diagram which shows the outline of the structure of the component mounting line 10 of another embodiment.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting line 10, and FIG. 2 is a configuration diagram showing an outline of the configuration of the mounting machine 11. In this embodiment, the left-right direction of FIGS. 1 and 2 is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

The component mounting line 10 includes a plurality of mounting machines 11A to 11D that perform processing for mounting components on the substrate S, and a management computer 80 that manages production of the entire system such as management of each mounting machine 11A to 11D. Since the mounting machines 11A to 11D have substantially the same configuration, they are collectively referred to as the mounting machine 11 when it is not necessary to distinguish them.

As shown in FIG. 2, the mounting machine 11 includes a transport unit 18 for transporting the substrate S, a collection unit 21 for collecting parts, a reel unit 56 for supplying parts, and a control device 60 for controlling the entire device. ing. The transport unit 18 includes support plates 20 and 20 provided at intervals in the front and rear of FIG. 2 and extending in the left-right direction, and conveyor belts 22 and 22 provided on opposite surfaces of both support plates 20 and 20. ing. The conveyor belts 22 and 22 are bridged to the drive wheels and driven wheels provided on the left and right of the support plates 20 and 20 so as to be endless. The substrate S is placed on the upper surfaces of the pair of conveyor belts 22 and 22 and conveyed from left to right. The substrate S is supported from the back surface side by a large number of supporting pins 23 erected.

The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is mounted on the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed to the inside of the mounting machine 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is slidably attached to the guide rails 28, 28 in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are driven by drive motors (not shown).

The mounting head 24 is interchangeably provided with auto tools 42A and 42B having one or more nozzles 40 for sucking parts. When it is not necessary to distinguish between the auto tools 42A and 42B, they are collectively referred to as the auto tools 42. The auto tool 42A includes 12 nozzles 40. The auto tool 42B includes one nozzle 40. In the auto tool 42A, the nozzle 40 has a structure in which the nozzle 40 slides directly in a sleeve extending vertically, whereas in the auto tool 42B, the nozzle 40 has a structure in which the nozzle 40 slides while being supported by a bearing. Therefore, the nozzle 40 of the auto tool 42B can move up and down smoothly as compared with the auto tool 42A, so that the operation accuracy is high. Further, the auto tool 42A has a mechanism for revolving the nozzle 40 by rotating the axis of the cylindrical body and a mechanism for rotating the nozzle 40 itself, whereas the auto tool 42B has the mechanism for rotating the axis of the cylindrical body. As a result, it has a mechanism to rotate the nozzle 40. Therefore, in this respect as well, the auto tool 42B having few moving parts has less rattling and higher operation accuracy than the auto tool 42A. The nozzle 40 uses pressure to adsorb parts to the tip of the nozzle and release the parts adsorbed to the tip of the nozzle. The nozzle 40 is moved up and down in the Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder elevating device using the Z-axis motor 45 as a drive source. The component holding member for holding and releasing the component is described here as a nozzle 40 for sucking and releasing the component, but the present invention is not particularly limited to this, and a mechanical chuck may be used, for example.

The reel unit 56 includes a plurality of reels 57 around which tapes containing parts are wound, and is detachably attached to the front side of the mounting machine 11. This tape is unwound from the reel 57 and sent out by the feeder unit 58 to the collection position collected by the mounting head 24. The parts camera 54 is arranged in front of the support plate 20 on the front side of the transport portion 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 sucking the parts passes above the parts camera 54, the parts camera 54 captures the state of the parts sucked by the nozzle 40 and outputs the image to the control device 60.

As shown in FIG. 3, the control device 60 is configured as a microprocessor centered on a CPU 61, and has a ROM 62 for storing a processing program, an HDD 63 for storing various data, a RAM 64 used as a work area, an external device and electricity. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the sampling unit 21, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication. The sliders 26 and 30 are equipped with position sensors (not shown), and the control device 60 controls the drive motors of the sliders 26 and 30 while inputting the position information from the position sensors.

As shown in FIG. 2, the management computer 80 includes a microprocessor centered on a CPU 81, a ROM 82 for storing a processing program, an HDD 83 for storing various information, a RAM 84 used as a work area, and a control device 60 for each mounting machine 11. The input / output interface 85 for bidirectional communication with the computer is provided, and these are connected via the bus 86. Further, the management computer 80 can input signals from an input device 87 represented by a mouse or a keyboard via the input / output interface 85, and is connected to the display 88 so that various images can be output.

Next, the operation of the component mounting line 10 of the present embodiment configured in this way will be described. As shown in FIG. 1, four mounting machines 11A to 11D constituting the component mounting line 10 sequentially mount components on one board S, so that the components are mounted on the one board S. All parts to be installed are installed. That is, all the parts are mounted on the board S from the time when one board S is introduced from the left entrance of the component mounting line 10 to the inside and the time when one board S is discharged to the outside from the right exit. In this case, only the number of mounting machines 11, that is, four are set here, and the sequence for mounting parts is stored in the HDD 83 of the management computer 80. An example of the sequence is shown in FIG. The sequence is associated with component-related data (component type, component size, mounting position on the substrate S, bump diameter, nozzle type, etc.) for each mounting order. The CPU 81 of the management computer 80 sets the required accuracy for each mounting order of the sequence, and allocates the sequence to the mounting machine having the specified accuracy that can realize the set required accuracy.

First, the required accuracy setting routine executed by the CPU 81 of the management computer 80 will be described. FIG. 5 is a flowchart showing an example of the required accuracy setting routine. This routine is stored in the HDD 83 of the management computer 80 and is executed for each sequence.

When the CPU 81 of the management computer 80 starts the required accuracy setting routine, it first creates overall image data according to the current sequence (step S100). The whole image data is data indicating which part is arranged where on the board if the parts are mounted according to the sequence. As shown in FIG. 5, the component-related data associated with the mounting order of the sequence includes the component type, component size, component mounting position (center coordinates), bump diameter, nozzle type to be used, and the like. The CPU 81 obtains the mounting area of the component from the mounting position (center coordinates) and the component size of each component-related data, and arranges the mounting area of each component on the XY plane in the mounting order. The mounting area is an area on the XY plane that the component occupies when the component is accurately mounted at the mounting position. As a result, the whole image data when all the parts are mounted on the board according to this sequence is created.

Next, the CPU 81 assigns the value 1 to the variable n (step S110), and sets the component having the nth mounting order in the current sequence as the target component (step S120). Next, the CPU 81 calculates (acquires) peripheral status data of the target component (step S130), sets the required accuracy of the target component based on the peripheral status data, and stores it in the HDD 83 (step S140). For example, as shown in FIG. 6, in the overall image data, when the peripheral component already exists before the target component is mounted, the CPU 81 determines the distance between the mounting area of the peripheral component and the mounting area of the target component. That is, the distance between parts is calculated as peripheral situation data, and the required accuracy of the target part is set based on the distance between parts. The required accuracy is a numerical value indicating how much deviation is allowed with respect to the original mounting area, and is expressed by a numerical value such as 20 μm, 40 μm, or 60 μm. The smaller the value, the higher the required accuracy. For example, when the distance between parts is 40 μm, the CPU 81 sets the required accuracy of the target parts to 40 μm. On the other hand, when the distance between parts is 20 μm, the CPU 81 sets the required accuracy of the target parts to 20 μm. In this way, the smaller the distance between the target component and the peripheral component, the higher the required accuracy of the target component is set. Actually, when setting the required accuracy of the target part, the required accuracy of the target part should be set to a value smaller than the interval between the parts in order to consider the required accuracy set for the peripheral parts. There are many. Further, as shown in FIG. 7, when the size of the nozzle type used for adsorbing the target component is larger than the size of the target component and protrudes, the CPU 81 has the nozzle 40 and its periphery when the target component is mounted at the mounting position. Data showing the positional relationship with the parts (nozzle protrusion amount) is also calculated as peripheral condition data, and the required accuracy of the target product is set in consideration of the nozzle protrusion amount. For example, when the distance between parts is 40 μm, the CPU 81 sets the required accuracy of the target parts to <40 μm (for example, 30 μm or 20 μm) in order to consider the amount of nozzle protrusion from the distance.

Next, the CPU 81 determines whether or not the variable n is the maximum value, that is, the last value in the mounting order of the current sequence (step S150), and if the variable n has not reached the maximum value, the variable n is set. It is incremented by 1 (step S160), and the processing after step S120 is performed again. On the other hand, if the variable n has reached the maximum value in step S150, it means that the setting of the required accuracy has been completed for all the parts from the first to the last in the mounting order of this sequence, so that the CPU 81 has this. End the routine. FIG. 8 shows an example of sequence data after the required accuracy setting is completed. As can be seen from FIG. 8, in the present embodiment, the required accuracy of the target component is also the required accuracy for each mounting order.

Next, the work allocation processing routine executed by the CPU 81 of the management computer 80 will be described. FIG. 9 is a flowchart showing an example of the work allocation processing routine. This routine is stored in the HDD 83 of the management computer 80, and is executed by the start instruction by the operator. When the CPU 81 of the management computer 80 starts the work allocation processing routine, it first acquires the specification accuracy of each of the mounting machines 11A to 11D (step S210). The specification accuracy is determined by both the accuracy of the mounting machine 11 itself and the accuracy of the auto tool 42 mounted on the mounting head 24 of the mounting machine 11. The specification accuracy of the mounting machines 11A to 11D may be acquired by the CPU 81 of the management computer 80 from the control device 60 of the mounting machines 11A to 11D by communication, or may be stored in advance in the HDD 83 of the management computer 80. It may be read out and acquired. Next, the CPU 81 acquires the required accuracy set for the components included in the sequence for each sequence (step S220), and sets the required accuracy for the sequence (step S230). Specifically, for a certain sequence, the CPU 81 sets the highest accuracy among the required accuracy set for each mounting order included in the sequence as the required accuracy of the sequence. Next, the CPU 81 allocates each sequence (step S240), and ends this routine. Specifically, when allocating a certain sequence, the CPU 81 allocates the sequence to the mounting machine 11 having the specification accuracy that satisfies the required accuracy of the sequence.

Next, the operation of the mounting machine 11, particularly the operation of sucking the parts supplied by the reel unit 56 to the nozzle 40 and mounting them at a predetermined position on the substrate S will be described. First, the CPU 61 of the control device 60 sucks the component to the nozzle 40 of the auto tool 42 according to the assigned sequence. When the auto tool 42A has 12 nozzles 40 like the auto tool 42A, the parts having the first to twelfth mounting orders are sequentially adsorbed to the nozzles 40 while the auto tool 42A is intermittently rotated. On the other hand, when having one nozzle 40 like the auto tool 42B, the component having the first mounting order is attracted to the nozzle 40. After that, the CPU 61 controls the X-axis and Y-axis sliders 26 and 30 of the sampling unit 21 to move the mounting head 24 above the parts camera 54, and then the parts camera 54 captures the parts sucked by the nozzle 40. Let me. When the auto tool 42A has 12 nozzles 40 like the auto tool 42A, the parts adsorbed by all the nozzles 40 are imaged while the auto tool 42A is intermittently rotated. On the other hand, when the auto tool 42B has one nozzle 40, the component adsorbed by one nozzle 40 is imaged. The CPU 61 grasps the posture of the component by analyzing the captured image. Next, the CPU 61 controls the X-axis and Y-axis sliders 26 and 30 of the sampling unit 21 to move the mounting head 24 onto the substrate S, and mounts the components attracted to the nozzle 40 on the substrate S. When the auto tool 42A has 12 nozzles 40 like the auto tool 42A, the parts having the first to twelfth mounting orders are sequentially mounted at the mounting positions on the substrate S while the auto tool 42A is intermittently rotated. On the other hand, when having one nozzle 40 like the auto tool 42B, one component is mounted at the mounting position on the substrate S. The CPU 61 repeatedly executes this work until the component to be mounted is mounted on the board S according to the assigned sequence, and after the action is completed, the board S is sent out to the mounting machine 11 on the downstream side.

Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present invention will be clarified. The management computer 80 of the present embodiment corresponds to the required accuracy setting device of the present invention, the reel unit 56 corresponds to the component supply unit, and the nozzle 40 corresponds to the component holding member of the sampling unit.

In the management computer 80 of the present embodiment described in detail above, it is required to mount the target component at the mounting position based on the peripheral situation data regarding the peripheral situation of the mounting position of the target component to be mounted on the substrate S. Automatically set the required accuracy. Since the required accuracy is automatically set based on the peripheral situation data in this way, the set required accuracy is more suitable for the actual situation as compared with the conventional case. Therefore, the required accuracy of the target component can be appropriately and automatically set.

Further, in setting the required accuracy, the management computer 80 sets the required accuracy of the target component higher as the distance between the peripheral component and the target component is smaller. Therefore, when the target component is mounted, the target component is set. It is possible to prevent interference with peripheral parts.

Further, the management computer 80 considers the protrusion amount of the nozzle in addition to the distance between parts when setting the required accuracy. That is, the closer the positional relationship between the nozzle 40 and the peripheral parts when mounting the target component to the mounting position, the higher the required accuracy of the target component is set. For example, when the nozzle 40 tends to interfere with peripheral parts due to the shape and size of the nozzle 40 on which the target part is to be mounted, the required accuracy of the target part is set high. Therefore, it is possible to prevent the nozzle 40 from interfering with peripheral parts when mounting the target parts.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be carried out in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the required accuracy setting routine (see FIG. 5) of the above-described embodiment, the required accuracy is set in a state where the mounting order is determined in advance, but the required accuracy may be set in a state where the mounting order is not determined. good. In that case, for example, a table is prepared in which the component mounting position and the component type are associated with each of the components from No. 1 to the final number mounted on one board S. The number is just a serial number. Then, in step S120, the CPU 81 of the management computer 80 sets the component whose number is n in the table as the target component. Further, in steps S130 and S140, the CPU 81 calculates the distance (distance between parts) between the mounting area of the peripheral component mounted around the target component and the mounting area of the target component as peripheral status data, and the distance between the components. Set the required accuracy of the target part based on. Then, after the setting of the required accuracy of all the parts is completed, the CPU 81 connects the parts to the mounting machine 11 having the specification accuracy satisfying the required accuracy of the parts based on the specification accuracy of the mounting machine 11 and the required accuracy set for the parts. Allocate. After that, the control device 60 of each mounting machine 11 determines in what mounting order the assigned parts are optimally mounted, and determines the mounting order. Even in this way, the same effect as that of the above-described embodiment can be obtained.

In the above-described embodiment, the required accuracy required when mounting the target component at the mounting position is set, but instead of or in addition to this, the nozzle 40 of the sampling unit 21 sucks the target component from the reel unit 56. You may set the required precision when required. For example, when the distance between the peripheral part and the target part is small, if the deviation when the nozzle 40 sucks the target part becomes large, the nozzle 40 may protrude from the target part or the amount of protrusion may increase, and the target part may be peripheral. May interfere with parts. Considering the prevention of such interference, it is preferable to set the required accuracy even at the time of adsorption. If the required accuracy at the time of suction and the required accuracy at the time of mounting are different for a certain part, the required accuracy at the time of suction may be adopted for the suction work of the part, and the required accuracy at the time of mounting may be adopted for the mounting work.

In the component mounting line 10 of the above-described embodiment, as shown in FIG. 10, a solder printing machine 91 and a printing inspection machine 92 are provided on the upstream side of the mounting machines 11A to 11D, and a substrate is provided on the downstream side of the mounting machines 11A to 11D. An inspection machine 93 and a reflow furnace 94 may be provided. The solder printing machine 91 screen-prints solder on the substrate S. The printing inspection machine 92 inspects the state of the solder printed on the substrate S by image processing. The board inspection machine 93 inspects the state in which the component is mounted on the printed solder by image processing. The reflow furnace 94 heats the substrate S to melt the solder and solders each component onto the substrate S. In such a configuration of FIG. 10, the larger the deviation from the mounting position of the printed solder, the larger the required accuracy of the target component may be set. A specific example is described below. In the solder printing machine 91, the solder is printed at a predetermined position (for example, a position facing the electrode portion (bump or the like) of the component) for each mounting position of the component. As a result of the inspection of the printing inspection machine 92, when the deviation of the solder printing by the solder printing machine 91 is within a predetermined range, the CPU 81 sets the required accuracy of the parts to be placed on the solder to a normal level. In this case, if the required accuracy is at a normal level, there is no problem in the electrical connection between the electrode portion of the component and the solder. If the deviation of the solder printing exceeds a predetermined range, the allowable range of the deviation of the electrode portion of the component to be placed on the solder becomes narrow. In that case, the CPU 81 sets the required accuracy of the parts to be placed on the solder higher than the normal level. This makes it easier to mount the target component within the permissible range. At this time, the required accuracy may be gradually increased according to the magnitude of the displacement of the solder printing. However, if the deviation of the solder printing reaches a defective range that greatly exceeds the predetermined range, there is a high possibility that the electrical connection between the electrode portion of the component and the solder will be hindered. You may try to remove it.

In the component mounting line 10 of FIG. 10, when the deviation of all the components is within the allowable range as a result of the inspection of the board inspection machine 93, the CPU 81 determines each component to be mounted on the substrate S to be carried into the component mounting line 10 next time. Do not change the required accuracy. However, when the frequency of the substrates S whose deviation exceeds the permissible range exceeds a predetermined number for a specific component (for example, k or more out of 10 substrates (k is a natural number)), the CPU 81 is displaced from the position of the component. It may be determined that the tendency is high, and the required accuracy of the component when it is mounted on the substrate S to be carried into the component mounting line 10 next time may be set high again. In this way, if the empirical misalignment tendency of a specific component is high, the required accuracy is set high, and the misalignment of that component is less likely to occur thereafter. It should be noted that the required accuracy may be gradually increased according to the frequency of the substrate S whose deviation exceeds the permissible range for a specific component.

In the above-described embodiment, the mounting machine 11 may have a plurality of working modes having different accuracy, and the component mounting process may be executed in the working mode suitable for the required accuracy of each component. For example, it is assumed that the mounting machine 11 can select either a high-precision mode (20 μm mode), a medium-precision mode (40 μm mode), or a low-precision mode (60 μm mode) as the working mode. In the high-precision mode, the mounting machine 11 sets the moving speed of the mounting head 24 to a low speed and controls the matching width between the target value of the position control and the measured value within a narrow range. As a result, although it takes a long time to mount the parts, it is possible to mount the parts with high accuracy. On the other hand, in the low-precision mode, the moving speed of the mounting head 24 is increased to control the matching width between the target value of the position control and the actually measured value within a wide range. As a result, although the accuracy of component mounting is not high, the component mounting time is shortened, which can contribute to the improvement of the throughput. In the medium precision mode, a moving speed and a matching width between the high precision mode and the low precision mode are adopted. Then, when the parts are sequentially mounted, a work mode that matches the required accuracy of the parts is adopted. By doing so, it is possible to allocate the mounting work of the parts so that the capability of the mounting machine 11 having the plurality of work modes is fully exhibited.

In the above-described embodiment, the management computer 80 is shown as an example of the required accuracy setting device of the present invention, but the present invention is not particularly limited thereto. For example, a computer for setting the required accuracy is provided separately from the management computer 80. May be good. Alternatively, the control device 60 of the mounting machine 11 may function as a required accuracy setting device.

INDUSTRIAL APPLICABILITY The present invention can be used for a computer or the like that manages a mounting machine in which a sampling unit mounts a component supplied from a component supply unit at a predetermined mounting position on a substrate.

10 component mounting line, 11, 11A to 11D mounting machine, 18 transport section, 20 support plate, 21 sampling section, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X-axis slider, 28 guide rail, 30 Y-axis slider , 32 guide rails, 40 nozzles, 42, 42A, 42B auto tools, 45 Z-axis motors, 54 parts cameras, 56 reel units, 57 reels, 58 feeders, 60 control devices, 61 CPUs, 62 ROMs, 63 HDDs, 64 RAM, 65 I / O interface, 66 bus, 80 management computer, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 I / O interface, 86 bus, 87 input device, 88 display, 91 solder printing machine, 92 printing inspection machine , 93 Substrate inspection machine, 94 Reflow furnace.

Claims (5)

It is a required accuracy setting device that sets the required accuracy required when the sampling unit collects the parts supplied from the parts supply unit and mounts them at a predetermined mounting position on the board.
When collecting the target component from the component supply unit and / or when mounting the target component at the mounting position based on the peripheral status data regarding the peripheral status of the mounting position of the target component to be mounted on the substrate. Set the required accuracy for
Requirement accuracy setting device. The peripheral situation data includes data regarding the distance between the peripheral parts mounted or mounted around the target component and the target component.
In setting the required accuracy, the smaller the distance between the parts, the higher the required accuracy is set.
The required accuracy setting device according to claim 1. The peripheral situation data includes data representing the positional relationship between the component holding member of the sampling unit and the peripheral component mounted or mounted around the target component when the target component is mounted at the mounting position. ,
In setting the required accuracy, the closer the positional relationship between the component holding member and the peripheral component is, the higher the required accuracy is set.
The required accuracy setting device according to claim 1 or 2. The peripheral situation data includes data regarding the printing state of the solder printed at the mounting position of the target component before mounting the target component at the predetermined mounting position of the substrate.
In setting the required accuracy, the larger the deviation of the printed solder from the mounting position, the higher the required accuracy is set.
The required accuracy setting device according to any one of claims 1 to 3. In setting the required accuracy, the required accuracy is set based on the data regarding the empirical misalignment tendency of the target component in addition to the peripheral situation data, and the higher the misalignment tendency is, the higher the required accuracy is set. do,
The required accuracy setting device according to any one of claims 1 to 4.

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