JP2002252495A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that it is required to control an operating condition or a component mounting device appropriately in order to ensure the adjacent distance of a mounted component accurately but the condition is not satisfied sufficiently because a prior art component mounting device is simply operated according to a prepared mounting program. SOLUTION: The component mounting device comprises a means for mounting an electronic component by regulating the relative position between a circuit board and a nozzle, a means for calculating the adjacent distance between each electronic components from a mounting program, and a mounting-device control means for varying an operational speed, acceleration or timing of the component mounting means when the adjacent distance falls within a specified range.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a component mounting apparatus for mounting electronic components and the like on a substrate.

[0002]

2. Description of the Related Art FIG. 8 shows a conventional component mounting apparatus. In this component mounting apparatus using the orthogonal robot system, electronic components to be mounted are supplied in a form called taping supply, which is stored in a line in a carrier tape 11 for each type, and the carrier tape 11 wound on a reel 12 is a component. It is mounted on the supply device 13. The component supply device 13
A mechanism is provided that allows the carrier tape 11 to be pulled out from the reel 12 to the suction position 14 and electronic components to be taken out one by one from the suction position 14.

The orthogonal robot section includes a nut 21b that moves on a ball screw 20b rotated by a Y-axis motor 18.
The X-axis motor 17 is fixed to the nut 21a that moves on a ball screw 20a rotated by the X-axis motor 17,
The shaft motor 19 is fixed, and the head 16 is fixed to a nut 21c that moves on a ball screw 20c rotated by the V-axis motor 19.

As a result, the head 16 can move along the X and Y directions orthogonal to each other and the V direction perpendicular to the horizontal plane shown in the drawing. The head 16 is provided with a nozzle 15 for sucking an electronic component at its lower end, and the head 16 controls the air pressure of the nozzle 15 to hold and release the electronic component.

When the nozzle 15 holds an electronic component,
By operating the X-axis motor 17 and the Y-axis motor 18, the head 1
6 is moved above the suction position 14 of the component supply device 13, the V-axis motor 19 is operated to lower the head 16, and air is sucked from the nozzle 15 while the lower end of the nozzle 15 is in contact with the electronic component. Then, the electronic component is sucked and held at the lower end of the nozzle 15.

The nozzle 15 holding the electronic component operates the X-axis motor 17 and the Y-axis motor 18 to move the head 16 above the circuit board 22, and then operates the V-axis motor 19 to move the head 16 The electronic component is mounted on the circuit board 22 by lowering the nozzle 15 and turning off suction of air from the nozzle 15 in a state where the lower end of the electronic component sucked by the nozzle 15 is in contact with the circuit board 22.

The X-axis motor 17, the Y-axis motor 18, and the V
The shaft motor 19 is controlled by the microcomputer device 23, and is controlled to operate in a predetermined operation pattern (moving position, speed, acceleration, timing) according to an operation program stored in the microcomputer device 23 in advance.

[0008]

With the miniaturization of the circuit board 22, the pitch between adjacent electronic components has been narrowed to about 0.1 to 0.3 mm, and even a slight displacement has become unacceptable. I have. The mounting position deviation allowed on the circuit board is determined by the relationship between the spacing between electronic components on the circuit board, the mounting direction, and the shape. There is a demand for higher accuracy than the required equipment specifications.

In such a case, in order to guarantee the mounting accuracy, it is necessary to control the operation of the component mounting apparatus more precisely to ensure the accuracy of the adjacent distance, and conventionally, the operation speed is reduced. In order to ensure the accuracy by such means as above, there is no other way than to manually change the operation program itself of the microcomputer device 23, and there is a problem that it takes time to set the conditions of the operation program.

[0010]

According to a first aspect of the present invention, there is provided a component mounting apparatus comprising: a head having nozzles holding components to be mounted; Component mounting means for mounting components on a circuit board by adjusting the direction and the vertical direction, adjacent distance calculating means for obtaining an adjacent distance between components mounted on the circuit board from the mounting program, and obtaining the adjacent distance calculating means. A mounting machine control for automatically operating the component mounting means by making one or more of the parameters of the operation pattern of the component mounting means different from the case where the adjacent distance is outside the predetermined range when the adjacent distance is within a predetermined range. Means is provided.

According to a second aspect of the present invention, there is provided a component mounting apparatus comprising:
In claim 1, the parameters of the operation pattern of the component mounting means handled by the mounting machine control means are an operation speed, an acceleration, and a timing.

According to a third aspect of the present invention, there is provided a component mounting apparatus comprising:
3. The mounting machine control device according to claim 2, wherein when the adjacent distance calculated by the adjacent distance calculating device is within a predetermined range, the horizontal relative moving speed of the head and the mounting destination circuit board is set to be outside the predetermined range. It is characterized in that it is configured to reduce the number of cases.

According to a fourth aspect of the present invention, there is provided a component mounting apparatus comprising:
3. The mounting machine control unit according to claim 2, wherein when the adjacent distance calculated by the adjacent distance calculating unit is within a predetermined range, the acceleration of the horizontal relative movement speed of the head and the circuit board on which the mounting is performed is determined by the predetermined distance. The present invention is characterized in that it is configured to reduce the number of cases outside the range.

According to a fifth aspect of the present invention, there is provided a component mounting apparatus comprising:
3. The mounting machine control means according to claim 2, wherein when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range, the operation timing of the horizontal relative movement between the head and the circuit board on which the mounting is performed is set to a predetermined value. It is characterized in that it is configured to be faster than when it is out of the range.

According to a sixth aspect of the present invention, there is provided a component mounting apparatus comprising:
3. An operation according to claim 2, wherein the mounting machine control means moves the component to be mounted held by the head and the circuit board on which the mounting is to be performed, when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. It is characterized in that the speed is reduced as compared with the case where the adjacent distance is out of the predetermined range.

According to a seventh aspect of the present invention, there is provided a component mounting apparatus comprising:
3. The acceleration according to claim 2, wherein when the adjacent distance calculated by the adjacent distance calculating means is within a predetermined range, the component to be mounted held by the head and the vertical relative movement of the circuit board on which the mounting is performed. Is reduced more than when the adjacent distance is out of the predetermined range.

The component mounting apparatus according to claim 8 of the present invention provides:
3. An operation according to claim 2, wherein the mounting machine control means moves the component to be mounted held by the head and the circuit board on which the mounting is to be performed, when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. The timing is set to be earlier than when the adjacent distance is out of the predetermined range.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS.
It will be described based on. The mechanical configuration of the component mounting means for mounting the component on the circuit board by adjusting the relative position of the head holding the component to be mounted to the mounting destination in the horizontal and vertical directions and mounting the component on the circuit board is shown in FIG. Since the configuration is the same as that of the orthogonal robot system shown in FIG.

A component mounting apparatus according to an embodiment of the present invention includes an adjacency distance calculating means for obtaining an adjacency distance between electronic components at a mounting destination from a mounting program, and a mounting means for the mounting means in accordance with the adjacency distance obtained by the adjacency distance calculating means. The difference from the related art is that the mounting machine control means for automatically changing the operation is realized by using the microcomputer device 23 as a main part.

The microcomputer device 23 is configured as follows. FIG. 6 shows the structure of the mounting program. The mounting program includes an X coordinate and a Y coordinate indicating mounting coordinates, a component dimension X and a component dimension Y indicating external dimensions of the component, and a value of an adjacent determination distance as a determination reference value used for determination described later. . The following steps (step S1) of this mounting program are sequentially executed, and the X-axis motor 17, the Y-axis motor 18 and the V-axis motor 19 are operated to control the suction of air from the nozzles 15 and connect the electronic components to the circuit board. 2
2 is automatically mounted on the circuit board 22. For example, the result of the steps (S1) and (S2) being executed and mounted on the circuit board 22 is based on the data of the mounting program before the microcomputer device 23 is actually mounted. Can be assumed as shown in FIG.

In FIG. 5, an electronic component 31 is an electronic component mounted in step (S1), and an electronic component 32 is an electronic component mounted in step (S2).
The center positions P1 and P2 can be determined from the X and Y coordinates of the mounting program, respectively, and the area occupied on the circuit board from the component dimensions X and Y of the mounting program can be determined.
That is, in the case of the electronic component 31, a rectangle having sides of the length of CX1 and CY1 is used, and in the case of the electronic component 32, CX2 and CY2 are used.
The microcomputer 23 is configured to determine a rectangle having a side having a length of. Thus, the adjacent distance ΔR can be obtained by calculation before actual mounting.

Using the adjacent distance calculated by the adjacent distance judging means realized as described above, the mounting machine control means mainly constituted by the same microcomputer device 23 is configured as shown in FIG. I have.

The mounting machine control means determines the adjacent distance △ R calculated by the adjacent distance determination means in step (S1).
Is within a predetermined range. Specifically, it is automatically determined whether or not the adjacent distance ΔR is smaller than the adjacent determination distance of the operation program. When it is determined that the adjacent distance ΔR is larger than the adjacent determination distance, the step (S2) is executed. In step (S2), the nozzle 15 is sucked at the suction position 14 to move toward the mounting position of the substrate 22.
, The X-axis motor 17, the Y-axis motor 18 and the V-axis motor 19 are operated in a normal operation pattern.

If it is determined that the adjacent distance ΔR is smaller than the adjacent determination distance, step (S3) is executed. In step (S3), the X-axis motor 17, the Y-axis motor 18 and the V-axis motor 19 for driving the nozzle 15 so as to suck the component at the suction position 14 and move toward the mounting position of the board 22 have the normal operation pattern. Are operated with different high precision operation patterns.

This step (S1) and step (S2)
Alternatively, step (S3) is executed individually for each electronic component. The above “normal operation pattern” and “high-precision operation pattern” will be specifically described with reference to FIGS.

FIGS. 1 (a), 1 (b) and 1 (c) show the timing and speed at which the nozzle 15 moves in the horizontal direction before and after the timing P at which the electronic component is mounted. A “normal operation pattern” is shown, and a broken line indicates a “high-precision operation pattern”.

FIGS. 2 (d), (e) and (f) show the timing and speed at which the nozzle 15 moves in the horizontal and vertical directions before and after the timing P at which the electronic component is mounted. , The solid line indicates the “normal operation pattern”,
A broken line indicates a “high-precision operation pattern”.

-Example of FIG. 1A-In this example, the acceleration (the gradient of acceleration and deceleration) of the "normal operation pattern" and the "high-precision operation pattern" in the horizontal direction are the same. However, in the case of the "high-precision operation pattern", the maximum movement speed is slower than in the case of the "normal operation pattern", and in the case of the "high-precision operation pattern", it arrives at the mounting position at the same timing as the "normal operation pattern" Then, acceleration is started earlier than in the case of the “normal operation pattern”. That is, in the case of the “high-precision operation pattern”, the horizontal movement speed is slower than in the case of the “normal operation pattern”, and the nozzle 15 is transferred to the mounting position with high accuracy.

As described above, in the case of the "high-precision operation pattern", the horizontal movement speed of the nozzle 15 is reduced as compared with the normal operation so that the X-axis motor 17 and the Y-axis motor 18 stop from the operation state. The variation of the nozzle position caused by the overshoot can be suppressed, and the accuracy of the electronic component mounting position can be improved.

In this case, in the operation of the V-axis motor 19, the "high-precision operation pattern" and the "normal operation pattern" are the same. -Example of Fig. 1 (b)-In this example, the maximum movement speed of both operation patterns is the same, but the acceleration (inclined slope of acceleration and deceleration) is the "normal operation pattern" The acceleration is started later than in the case of the “normal operation pattern” so that the “high-precision operation pattern” arrives at the mounting position at the same timing as the “normal operation pattern”.

As described above, in the case of the "high-precision operation pattern", the horizontal movement acceleration of the nozzle 15 is reduced as compared with the normal operation so that the X-axis motor 17 and the Y-axis motor 18 are stopped from the operation state. Overshoot,
Alternatively, variation in the nozzle position due to mechanical play of the nozzle 15 can be suppressed, and the accuracy of the electronic component mounting position can be improved.

In this case, in the operation of the V-axis motor 19, the "high-precision operation pattern" and the "normal operation pattern" are the same. -Example of FIG. 1 (c)-In this example, the maximum movement speed and acceleration (gradient of acceleration and deceleration) of both operation patterns are the same, but in the case of the "high-precision operation pattern", the "normal operation pattern" Start accelerating faster than you would.

As described above, in the case of the “high-precision operation pattern”, the time interval between the end of the horizontal movement of the nozzle 15 and the mounting of the component or the time until the horizontal movement of the nozzle 5 is restarted after the mounting of the component. By increasing the spacing,
The residual vibration after the movement and the vibration at the start of the movement can be suppressed, and the accuracy of the electronic component mounting position can be improved.

In the operation of the V-axis motor 19 in this case, the "high-precision operation pattern" and the "normal operation pattern" are the same. 2D to 2F, the timing and speed at which the head moves in the horizontal direction before and after the electronic component mounting timing are shown in the lower graphs. In parallel with this, what kind of speed, acceleration, and timing the vertical movement of the nozzle 15 is performed is described.
It is shown above.

-Example of FIG. 2D-In this example, in the case of the "high-precision operation pattern", the operation is performed so that the maximum speed of the V-axis motor 19 in the vertical movement operation of the nozzle 15 is lower than the normal operation. When the nozzle 15 descends, acceleration starts earlier than in the case of the "normal operation pattern" so that the "high-precision operation pattern" arrives at the mounting position at the same timing as the "normal operation pattern".

In this case, the operation of the X-axis motor 17 and the operation of the Y-axis motor 18 in the "high-precision operation pattern" and the "normal operation pattern" are the same. Accordingly, it is possible to reduce an overshoot when the nozzle 15 descends or an impact when the electronic component comes into contact with the circuit board 22 when the nozzle 15 descends, thereby improving the accuracy of the electronic component mounting position.

-Example of FIG. 2E-In this example, a V-axis motor 19 for vertically moving the nozzle 15
The maximum speed is the same in both operation patterns, but the acceleration is slower in the case of the "high-precision operation pattern" than in the case of the "normal operation pattern", and in the case of the "high-precision operation pattern" it is also the "normal operation pattern" Acceleration is started earlier than in the case of the “normal operation pattern” so as to arrive at the mounting position at the same timing.

In this case, the operation of the X-axis motor 17 and the Y-axis motor 18 in the "high-precision operation pattern" and the "normal operation pattern" are the same. Accordingly, it is possible to reduce an overshoot when the nozzle 15 descends or a shock when the electronic component comes into contact with the circuit board 22 when the nozzle 15 descends, thereby improving the accuracy of the electronic component mounting position.

-Example of FIG. 2F-In this example, a V-axis motor 19 for vertically moving the nozzle 15
Is the same in both operation patterns in the maximum moving speed and acceleration (inclination of acceleration and deceleration), and when descending, acceleration starts earlier in the case of the "high-precision operation pattern" than in the case of the "normal operation pattern".

As described above, in the case of the “high-precision operation pattern”, the time interval from the end of the vertical movement of the nozzle 15 to the time when the component mounting is performed, or the time until the vertical movement of the nozzle 5 is restarted after the component mounting. By increasing the spacing,
Improving the accuracy of the electronic component mounting position by ensuring sufficient pneumatic control time for sucking and releasing the electronic components to and from the nozzles 15 when the pneumatic switching is incomplete. Can be.

In this case, the operation of the X-axis motor 17 and the operation of the Y-axis motor 18 are the same in the “high-precision operation pattern” and the “normal operation pattern”. Further, in this embodiment, the microcomputer device 23 uses any of the adjacent distances calculated by the adjacent distance determining means to calculate one of FIGS. 1 (a), 1 (b), and 1 (c).
Alternatively, the X-axis motor 17, the Y-axis motor 18, and the V-axis motor 19 are operated according to one of the operation patterns shown in FIGS. 2D, 2E, and 2F, but various combinations are possible.

More specifically, in FIGS. 2D, 2E, and 2F, the nozzle horizontal movement speed is the same in both the “high-precision operation pattern” and the “normal operation pattern” in each case. The horizontal movement speed of the nozzle in this case is shown in FIGS.
It is driven by any of (c).

Further, an example in which the horizontal movement and the vertical movement can be performed will be described in detail with reference to FIGS. FIG.
Indicates the type of change only in the horizontal direction, the top row indicates the standard pattern of horizontal movement, and this standard pattern is indicated by a broken line in each wave turn diagram in the lower row for comparison.

FIGS. 3 (a), 3 (b) and 3 (c) show the state shown in FIG.
FIGS. 3B and 3C show patterns for changing the low speed, low acceleration, and timing, and FIG. 3A and FIG. 3B show patterns of low speed and low acceleration by a combination of the pattern of FIG. Is shown. FIG. 3 (a + c) is FIG.
A low-speed timing change pattern based on a combination of the pattern (a) and the pattern (c) is shown. FIG.
(B + c) shows a pattern of timing change at low acceleration by a combination of the pattern of FIG. 3B and the pattern of FIG. FIG. 3 (a + b + c) shows a low-speed, low-acceleration and timing change pattern by a combination of the pattern of FIG. 3 (a), the pattern of FIG. 3 (b) and the pattern of FIG. 3 (c).

The vertical movement of the nozzle in FIG. 3 is operated at the standard speed shown at the bottom. As shown in FIG. 3, the operation is performed in one of the seven types in the horizontal independent pattern.

FIG. 4 shows the types of change only in the vertical direction. The top row and the second row show a standard pattern for horizontal movement and a standard pattern for vertical movement. These standard patterns are compared for comparison. The vertical standard in each wave turn diagram at the bottom is also indicated by a broken line.

FIGS. 4D, 4E, and 4F are shown in FIG.
FIGS. 4E and 4F show patterns of changing the low speed, low acceleration, and timing, and FIG. 4D + e shows a pattern of low speed and low acceleration by a combination of the pattern of FIG. 4D and the pattern of FIG. Is shown. FIG. 4 (d + f) is FIG.
A low-speed timing change pattern based on a combination of the pattern (d) and the pattern (f) is shown. FIG.
(E + f) shows a pattern of timing change at low acceleration by a combination of the pattern of FIG. 4 (e) and the pattern of (f). FIG. 4 (d + e + f) shows a low-speed, low-acceleration and timing change pattern by a combination of the pattern of FIG. 4 (d), the pattern of (e), and the pattern of (f).

As shown in FIG. 4, a single pattern in the vertical direction is operated in one of seven types. Thus, each of the single patterns in the horizontal and vertical directions is 7
There are various types of patterns, and operation in any of 49 patterns is possible depending on the combination of the horizontal direction and the vertical direction.

In the above embodiment, an example of a component mounting apparatus of the orthogonal robot type has been described. However, a component mounting apparatus of a type in which a table supporting a circuit board is moved with respect to a head descending to a predetermined position. Can be similarly applied.

In the above embodiment, an example of the component mounting apparatus of the type in which the nozzle 15 is moved up and down has been described, but the present invention is similarly applied to the component mounting apparatus of the type in which the table supporting the circuit board is moved up and down. be able to.

In FIG. 6, all the information is stored in one mounting program. However, each information is stored individually, the component dimensions and the adjacency determination distance are stored for each electronic component, and the adjacency determination distance is stored. It may be separated from the implementation program as a fixed value.

[0052]

As described above, according to the present invention, the adjacent distance calculating means determines the adjacent distance between the electronic components mounted on the circuit board from the mounting program, and the mounting machine control means determines the adjacent distance. Since the automatic operation is performed by switching one or more of the parameters of the operation pattern of the component mounting means accordingly, the workability is better than the conventional example in which the operator manually changes the operation program itself of the microcomputer device,
In addition, the speed can be reduced even in places where speed reduction is not necessary, such as when a simple setting change is performed to reduce the operation speed of only a specific type of electronic component in order to reduce the processing time by the manual operation. The inconvenience caused by this can be solved, and high mounting quality can be achieved while minimizing the decrease in production efficiency.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a single horizontal movement of a mounting machine control means of a component mounting apparatus of the present invention.

FIG. 2 is an explanatory diagram of a single vertical movement of a nozzle according to the embodiment;

FIG. 3 is a diagram showing seven types of horizontal movement patterns according to the embodiment;

FIG. 4 is a diagram showing seven types of vertical movement patterns according to the embodiment;

FIG. 5 is an explanatory diagram of an adjacent distance determining unit according to the embodiment;

FIG. 6 is a format diagram of an implementation program according to the embodiment;

FIG. 7 is a flowchart of an adjacent distance determining unit according to the embodiment;

FIG. 8 is a perspective view of a component mounting apparatus.

[Explanation of symbols]

 15 Nozzle 16 Head 17 X-axis motor 18 Y-axis motor 19 V-axis motor 22 Circuit board 23 Microcomputer device

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hiroki Yamamoto 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 3C007 AS08 CY40 FS01 HS04 HT20 KS16 KS22 KS23 KS36 KS38 LU02 LU03 LU04 LU10 LV04 MS22 MT02 MT04 MT08 NS12 NS17 5E313 AA01 AA11 EE02 EE24 FF24 FF28

Claims (8)

[Claims] A component mounting method for mounting a component on a circuit board by adjusting a relative position between a circuit board to be mounted and a nozzle in a horizontal direction and a vertical direction in accordance with a mounting program with a head having a nozzle holding components to be mounted. Means, an adjacent distance calculating means for obtaining an adjacent distance between components mounted on a circuit board from the mounting program, and an operation of the component mounting means when the adjacent distance obtained by the adjacent distance calculating means is within a predetermined range. A component mounting apparatus provided with mounting machine control means for automatically operating the component mounting means by making at least one of the parameters of the pattern different from the case where the adjacent distance is outside a predetermined range. 2. The method according to claim 1, wherein the parameter of the operation pattern of the component mounting means handled by the mounting machine control means is an operation speed, an acceleration,
The component mounting apparatus according to claim 1, wherein the timing is timing. And controlling the mounting machine control means to determine a horizontal relative moving speed of the head and the mounting destination circuit board when the adjacent distance calculated by the adjacent distance calculating means is within a predetermined range. 3. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to reduce the number of cases. 4. The mounting machine control means determines the acceleration of the horizontal relative movement speed of the head and the mounting-target circuit board when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to reduce the number of the component mounting cases outside the range. 5. The mounting machine control means according to claim 1, wherein when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range, the operation timing of the horizontal relative movement between the head and the circuit board on which the mounting is performed is determined.
The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to be faster than when the adjacent distance is out of a predetermined range. 6. An operation for vertically moving a component to be mounted held by the head and a circuit board to be mounted on the mounting machine control means when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. 3. The component mounting apparatus according to claim 2, wherein the speed is reduced as compared with a case where the adjacent distance is out of a predetermined range. 7. The acceleration of vertical movement of a component to be mounted held by the head and a circuit board to be mounted, when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. 3. The component mounting apparatus according to claim 2, wherein the distance is reduced as compared with a case where the adjacent distance is out of a predetermined range. 8. An operation for vertically moving a component to be mounted held by the head and a circuit board to be mounted on the mounting machine control means when the adjacent distance calculated by the adjacent distance calculation means is within a predetermined range. 3. The component mounting apparatus according to claim 2, wherein the timing is set earlier than when the adjacent distance is out of a predetermined range.