JPH0645787A - Part mounting device and method - Google Patents

Abstract

PURPOSE:To restrain a part mounting head from oscillating due to deceleration so as to improve it in part suction accuracy and part mounting accuracy a method wherein complex arms which move on the same plane as the plane of rotation of a rotary table are provided. CONSTITUTION:Complex arms 2 and 3 on a rotary table 1 which rotates at a constant speed are made to pivot synchronously with the rotary table 1 and stopped at a part pick-up station while a part mounting head 4 holds a part by sucking. The complex arms 2 and 3 so pivots as to make the part mounting head 4 stop at a part recognition station 9a. The deviation volume of a part in suction position is recognized by a part recognition unit 9. Then, the complex arms 2 and 3 so pivots as to make the mounting head 4 stop at a prescribed mounting position on a circuit board 10 held bay a movable table 11 at a station 10a corrected by the detected volume of deviation of suction position, and the mounting head 4 is made to descend to mount a part on the circuit board successively. By this setup, a part mounting device of this design can be enhanced in part suction rate and mounting accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method for mounting various types of electronic components supplied from a component supply unit on a mounting member such as a circuit board.

[0002]

2. Description of the Related Art Conventionally, a component mounting apparatus for mounting electronic components on a circuit board is disclosed in, for example, Japanese Patent Laid-Open No. 3-54898. As shown in FIG. 3, this device includes a component supply unit 26 in which a plurality of component supply units 22 accommodating electronic components are arranged in parallel on a moving table driven by a driving unit 28 on a rail 27. The components are sucked and taken out by the mounting head 24 provided on the rotary table 21 at a predetermined position 21a by moving in the parallel direction.
On the other hand, the circuit board moving table 31 is moved by the means for positioning the circuit board 30 so that the position on the circuit board 30 on which the component is mounted comes to the predetermined position 30a, and the displacement of the component held by the mounting means is displaced. There is known a device that recognizes a component by means of component recognition means, corrects the position of the circuit board based on the recognition, and mounts the component on the circuit board by the mounting means.

In such a conventional component mounting apparatus, a swivel type was used as the mounting means. This apparatus is provided with a rotary table that can be intermittently rotated about a fixed axis, and a plurality of mounting heads are arranged at equal intervals on the rotary table. The rotary table intermittently rotates at the arrangement intervals of the mounting heads, and the appropriate stop position of the mounting head is set to coincide with the component suction / mounting position.

[0004]

However, in such a conventional component mounting apparatus, when the mounting tact speed is increased, vibration is generated due to the intermittent motion of the rotary table, and the component mounting position accuracy cannot be ensured. . Further, there is a problem that the life of the intermittent motion drive unit is shortened due to the acceleration / deceleration torque during the intermittent motion of the rotary table.

Furthermore, since the suction / mounting position of the mounting head is mechanically set, even if an attempt is made to speed up the mounting tact, the movement distance within the tact of the component supply moving table or the circuit board positioning table is short. However, during actual production, the mounting head side becomes slow until the positioning of each table is completed, and there is a problem that the production tact of the circuit board cannot be speeded up.

[0006]

In order to solve the above problems, the present invention provides a plurality of component supply units for accommodating a plurality of components and sequentially delivering the components to a predetermined component take-out position. A component supply unit arranged in parallel on a moving table that moves in the parallel direction of the component supply unit, positioning means for a mounting member that mounts the component, and a component that holds the component at a predetermined position of the component supply unit. And a component mounting device for mounting the component on the mounting member, wherein the component mounting device is disposed on the rotary table at equal intervals and a rotary table that rotates about a fixed axis. A plurality of multi-arms that move on the same plane as the rotation surface of the turntable, and a component mounting head that holds the component and mounts it on the mounting member are provided.

Also, the component supply unit may have a step of positioning and moving a predetermined component to a predetermined position within a movement range of a component mounting head provided at the tip of the multi-arm, and the multi-arm may move in a fixed direction. And a step of stopping the component mounting head at a predetermined position on the component supply unit by rotating in synchronization with the rotary table that rotates at a constant speed, and a step of holding the component by the component mounting head. It was done.

Further, there is a step of positioning and moving the mounting member positioning means to a predetermined position within a moving range of the component mounting head provided at the tip of the multi-arm, and the multi-arm is fixed in a fixed direction. A step of rotating the rotary table in synchronism with the rotary table rotating at a high speed, and stopping the component mounting head at a predetermined position on the component supply unit; and the step of mounting the component on the mounting member by the component mounting head. I had it.

[0009]

According to the component mounting apparatus and component mounting method of the present invention, since the component mounting rotary table rotates at a constant speed, vibration does not occur in the component mounting head due to acceleration / deceleration even if the mounting speed is increased. Further, since the rotary table continuously rotates to mount the components, the life of the components is extended.

Further, the component mounting head is installed on the multi-arm, and the components are sucked and mounted by the rotation of the rotary table and the rotation of the multi-arm. It can be set to any position within the movable range of the multi-arm, without exchanging parts.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show the configuration of the electronic component mounting apparatus of this embodiment.

As shown in FIG. 1, a plurality of multi-arm arms 2 and 3 that can move in the same plane as the plane of rotation of the rotary table 1 are arranged at equal intervals on a rotary table 1 that can rotate in a fixed direction. ing. The multi-arms 2 and 3 are configured such that the arm 2 rotates about the rotary shaft 2a on the rotary table 1 and the arm 3 rotates about the rotary shaft 3a on the arm 2, and A rotation drive unit (not shown) is provided. The component mounting head 4 is disposed on the arm 3 and has a vertically movable suction nozzle (not shown). The component mounting head 4 descends at a component supply position 5a to adsorb a component and then ascends, and a component recognition unit 9
The component pick-up position is recognized and the component pick-up position 10a is lowered to release the component pick-up. By this operation, the component is mounted on the circuit board 10 positioned by the circuit board moving table 11, and then the component is raised.

The component supply unit 6 includes a large number of component supply units 5.
Are arranged in parallel, and any component supply unit 5 can be positioned within a predetermined component supply range.
The drive unit 8 moves on the rail 7. The component supply unit 5 is equipped with a tape-shaped component assembly in which a large number of components are arranged side by side and stored, and the components can be sequentially delivered to a component removal position provided at one end.

Next, the operation of the electronic component mounting apparatus configured as described above will be described. As shown in FIG. 1, first,
A plurality of component supply units 5 are arranged in parallel on the component supply unit 6. In the component supply unit 5, various components mounted on the circuit board 10 are separately stored. The multi-arms 2 and 3 on the rotary table 1 which rotates at a constant speed rotate the parts waiting at the parts take-out position 5a of the parts supply unit 5 in synchronization with the rotary table 1, and the parts are taken out at a predetermined parts take-out position 5a. The mounting head 4 rotates so as to stop while suction-holding the component, and the component mounting head 4 descends to suction-hold the component. Next, the multi-arms 2 and 3 similarly rotate so that the component mounting head 4 stops on the component recognition position 9a on the component recognition unit 9. During this time,
The component recognition unit 9 recognizes the displacement amount of the component suction position. Next, the multi-arms 2 and 3 are tuned so that the mounting table 4 stops at the position 10a where the movable table 11 holding the circuit board 10 has corrected the displacement amount obtained by adding the adsorption position displacement amount to the predetermined mounting position. The mounting head 4 moves down and the components are sequentially mounted.

Next, an electronic component mounting method according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 shows an electronic component mounting method of this embodiment. FIG. 2 shows a movable range 12 of the mounting head 4 due to the rotation of the multi-arms 2 and 3. In the movable range 12, the rotary table 1 rotates at a constant speed, and the fulcrum 2 of the arm 2
While a is moving from 2a 'to 2a ", the mounting head 4 is configured to be capable of sucking a component standing by at each of the suction positions 5b to 5h on the component supply unit 5.

Next, the operation of the mounting apparatus configured as described above will be described. The predetermined component supply unit 5 provided on the component supply unit 6 is positioned at a position where the loss time due to the movement of the component supply unit 6 is minimized in the component suction positions 5b to 5h within the movable range 12 of the mounting head 4. To be done.
Mounted at the predetermined pick-up position 5b on the positioned component pick-up position of the component supply unit 5 by moving the multi-arm arms 2 and 3 on the rotary table 1 rotating at a constant speed in synchronization with the rotary table 1. The head 4 is rotated so as to be stopped while the components are suction-held. While stopped, the mounting head 4 descends to suck and hold components.

Similarly, the component mounting position on the circuit board 10 is moved within the movable range 12a of the mounting head 4 to position the component at a position where the loss time is minimized. Next, the multi-arms 2 and 3 rotate in synchronization so that the mounting head 4 stops at the component mounting position, the mounting head 4 moves down, and the components are sequentially mounted on the circuit board.

According to the electronic component mounting apparatus and the electronic component mounting method of this embodiment, the mounting head does not vibrate even if the component mounting speed is increased, the component suction rate is improved, and the mounting accuracy is improved.

Although the mounting of electronic components has been described in the present embodiment, the present invention is not limited to this, and can be used for mounting and assembling components other than electronic components.

[0021]

As is apparent from the above description of the embodiments, according to the component mounting apparatus of the present invention, the mounting head moves while the component mounting rotary table rotates at a constant speed, so that the mounting is performed at high speed. Vibration due to acceleration / deceleration does not occur in the component mounting head, and component suction / mounting position accuracy can be secured.
It is possible to improve the component pick-up rate and the mounting accuracy. Also,
There is no intermittent rotary motion mechanism of the rotary table, so long life can be achieved. Further, the component mounting head is installed on the multi-arm, and the suction / mounting position of the component can be set to any position within the movable range of the multi-arm. Therefore, the distances of the component supply unit and the circuit board moving table unit to move into the tact are short, and the loss time due to the movement of each moving table is reduced. Therefore, the production tact for producing circuit boards is improved, and the number of boards produced per unit time is increased.

[Brief description of drawings]

FIG. 1 is a plan view showing the configuration of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing a movable range of the component mounting head.

FIG. 3 is a plan view showing the configuration of a conventional electronic component mounting apparatus.

[Explanation of reference numerals] 1 rotary table 2 double-armed arm 1 2a rotary axis of double-armed arm 3 double-armed arm 2 3a rotary axis of double-armed arm 4 component mounting head 5 component supply unit 6 component supply unit 7 rail 8 component Drive unit of supply unit 9 Component recognition unit 10 Circuit board 11 Circuit board moving table 12 Component mounting head movable range

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kunio Sakurai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Naohiko Chimura 1006, Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A plurality of component supply units for accommodating a plurality of components and sequentially delivering the components to a predetermined component take-out position are arranged in parallel on a moving table that moves in the parallel direction of the plurality of component supply units. And a component mounting unit that mounts the component at a predetermined position of the component supply unit and mounts the retained component on the mounting member. In the mounting apparatus, the component mounting means includes a rotary table that rotates about a fixed axis, and a plurality of compound tables that are arranged on the rotary table at equal intervals and that move on the same plane as the rotary surface of the rotary table. A component mounting apparatus comprising an arm arm and a component mounting head that holds the component and mounts the component on the mounting member. 2. The component mounting unit in the component mounting apparatus according to claim 1, further comprising a step of positioning and moving a predetermined component to a predetermined position within a movement range of a component mounting head provided at the tip of the multi-arm. Then, the multi-arm arm has a step of rotating in synchronization with a rotary table that rotates in a constant direction at a constant speed, and stopping the component mounting head at a predetermined position on the component supply unit, wherein the component mounting head is A component mounting method including a step of holding the. 3. A step of positioning the mounting member in the component mounting apparatus according to claim 1 to a predetermined position within a moving range of a component mounting head provided at the tip of the multi-arm. The multi-arm arm has a step of rotating in synchronization with a rotary table that rotates at a constant speed in a certain direction, and stopping the component mounting head at a predetermined position on a component supply unit, wherein the component mounting head stores the component. A component mounting method including a step of mounting on a mounting member.