JP2001094294A - Electronic parts mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform the suction and mounting of electronic parts by simple mechanism. SOLUTION: A beam 12 is inclined by sliding the positions in Y direction of sliders 15 and 16, and the straight line that mounting heads 6, 7, 8, and 9 shifting on that beam 12 form is directed onto the straight line on which the supply positions of parts supply units 4 stand, and the electronic parts are sucked at the same time from each unit 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 5-37194 discloses an example of an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. In Japanese Patent Application Laid-Open No. 5-37194, a linear motor is attached to a beam that moves in a direction perpendicular to the longitudinal direction, and two mounting heads individually move to suck electronic components from a component supply unit and print. The component is mounted on a substrate.

[0003]

However, in the above-mentioned prior art, the positions of a plurality of mounting heads in a direction perpendicular to the beam cannot be changed, and components such as a tape cassette for supplying components when sucking electronic components are not available. If the supply position is shifted by the cassette, the components cannot be simultaneously sucked even if the interval between the mounting heads matches the interval between the tape cassettes.

Further, when mounting a plurality of mounting heads moving on the same beam to mount electronic components on a printed circuit board, the two mounting positions rarely coincide with the positional relationship between the two mounting heads. Therefore, after one of the mounting heads performs the mounting operation of the component, the beam is moved, and the other mounting head performs the operation of mounting the component at the position where the component should be mounted. That is, in the technique disclosed in Japanese Patent Application Laid-Open No. 5-37194, the position in the length direction of the beam can be moved to an arbitrary position, but the position cannot be adjusted in the moving direction of the beam. At this time, this requirement can be satisfied by providing a drive shaft such as a linear motor in the beam movement direction for each mounting head, but it is necessary to provide a guide extending in the movement direction and the structure becomes complicated. In addition, the size of the moving mechanism is inevitably increased.

Accordingly, an object of the present invention is to make it possible to efficiently suck and mount electronic components with a simple mechanism.

[0006]

According to the present invention, there is provided an electronic component mounting apparatus which takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. A plurality of mounting heads are provided so as to be movable in the longitudinal direction of the beam, and the beam can swing in a horizontal plane.

[0007] With this configuration, the position in the direction orthogonal to the beam between the respective mounting heads can be adjusted. Further, the angular position of the electronic component held by the mounting head can be changed.

The present invention is also preferably arranged such that both ends of the beam can be individually moved with respect to a pair of guides extending in the beam movement direction and supporting both ends of the beam to guide the movement of the beam. A control device is provided for controlling the position of the plurality of mounting heads in a direction orthogonal to the beam by shifting the position with respect to the guide and swinging the beam in a horizontal plane.

With this configuration, the position adjustment of the plurality of mounting heads in the direction orthogonal to the beam can be easily performed only by controlling the movement of both ends of the beam along the guide.

Further, in the present invention, preferably, the longitudinal direction of the beam and the disposing direction of the component supply unit in the component supply section coincide with each other.

With this configuration, even if the component supply position in the longitudinal direction varies for each component supply unit, a plurality of mounting heads can be simultaneously adjusted to the supply positions of the plurality of supply units.

Further, in the present invention, the position adjustment by swinging the beam is performed at the time of supplying, mounting, and / or replacing the suction nozzle of the electronic component.

[0013] Because of this, the supply of parts and
The mounting and / or replacement of the suction nozzle can be performed.

According to the present invention, the angular deviation of the electronic component due to the oscillation of the beam is corrected by the rotation of the suction nozzle.

[0015] With this configuration, the electronic components can be mounted without any angular deviation.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings.

In the electronic component mounting apparatus shown in FIG. 1, a component supply unit 2 is provided on a base, and a printed board 3 is placed at a position different from the component supply unit 2. The substrate 3 is transferred to a transfer conveyor (not shown) and positioned on a predetermined mounting table. The component supply unit 4 has component supply units 4 arranged side by side.

Each of the component supply units 4 normally accommodates a large number of electronic components (not shown) of the same type and supplies the components to a predetermined supply position. Different component supply units 4 each store different types of electronic components. Since they are stored, a large number of component supply units 4 collectively supply many types of components. The supply positions of the component supply units 4 are arranged on a straight line extending in the X direction in a state where the component supply units 4 are attached to the component supply unit 2, and are indicated by black circles.

As shown in FIG. 1, the electronic component mounting apparatus sucks and takes out electronic components from the supply position of the component supply unit 4 and mounts them on the printed circuit board 3 by mounting heads 6, 7, 8,.
Beam 1 extending in the X direction by a mounting unit 10 having
2 so as to be movable along. Mounting unit 1
The movement of 0 is driven by a linear motor, but may be driven by a ball screw. In the mounting unit 10, the mounting heads 6 to 9 are arranged at the same intervals as the intervals at which the supply positions of the component supply units 4 are arranged in the component supply unit 2.

The beam 12 is moved in the Y direction by sliders 15, 16 moving on a pair of guides 13, 14 extending in the Y direction. The guide 13 and the slider 15 form a linear motor.
Also form a linear motor. Each slider 15,
16 move individually. The driving of the mounting unit 10 and the sliders 15 and 16 is controlled by a control device 19.

The beam 12 is supported on the slider 15 by the support shaft 1.
7 and is attached to the slider 16 so as to be swingable about a support shaft 18. That is, the beam 12 is directed in the X direction if the sliders 15 and 16 are at the same position in the Y direction. However, when the beam 12 is displaced as shown in FIG. Tilt can occur. When the tilt is generated in this way, the spindle 1
Although the interval between 7 and 18 needs to be longer than that in the X direction, when the spindles 17 and 18 are formed on the beam 12, the interval cannot be changed.
8 along the guide (not shown) with respect to the slider 16
Moveable in the direction.

At another position of the base, there is provided a nozzle stocker 21 for mounting and storing a suction nozzle 20 attached to the mounting head, and the suction nozzle 20 moves the mounting head 6 through the mounting head 6 through the mounting unit 10 in the X direction. 9 are arranged at equal intervals to the arrangement interval.

The operation of the above configuration will be described below.

First, the printed circuit board 3 is conveyed from an upstream device by a conveyor (not shown), and is positioned and fixed at a predetermined position.

Next, for each mounting sequence (not shown), the XY coordinate position of the substrate 3 to be mounted, the rotation angle position about the vertical axis, and the type of component to be mounted are specified in accordance with the mounting data. The mounting heads 6 to 9 suck electronic components to be sucked from the component supply unit 2. When the mounting data is programmed so that the mounting heads 6 to 9 can be simultaneously sucked from the component supply unit 2, the respective mounting heads 6 to 9 are beamed so as to face four adjacent component supply units 4. 12 and mounting unit 10
Moves. At this time, for example, when the mounting base itself of the component supply unit 4 is mounted so as to rotate about the vertical axis and the supply position of each unit 4 is on a straight line that is slightly deviated from the X direction, the slider is used. The movement of 15 and 16 is controlled so that the beam 12 is positioned in line with this supply position.

Next, the respective mounting heads 6 to 9 are simultaneously lowered and take out the electronic components at the same time.

Next, the mounting unit 10 is moved onto a component recognition camera (not shown) to determine how much the component is held at a position shifted with respect to each of the mounting heads 6 to 9 by X.
Recognized for the Y direction and the rotation angle.

Next, the beam 12 and the mounting unit 10 move, and the respective mounting heads 6 to 9 mount the electronic components at the mounting positions indicated by the above-described mounting data on the printed circuit board 3.

Further, the positional deviation of the rotation angle of the electronic component sucked to the mounting heads 6 to 9 before the mounting of the component is determined by each head 6.
The mounting heads 6 to 9 themselves are rotated and corrected by a rotation driving mechanism (not shown) mounted on the mounting heads 9 to 9.

When taking out the electronic component from the component supply unit 4, the mounting heads 6 to 9 in the mounting unit 10 are removed.
Can be simultaneously taken out by using any two of the sliders 1. However, even when the supply position of the component supply unit 4 is not oriented in the X direction as described above, the slider 1
Adjust the positioning positions of 5 and 16, and adjust the beam 1 in that direction.
2 can be swung around the support shaft 17 and the parts can be taken out at the same time.

Next, when the type of the substrate 7 changes and it becomes necessary for the mounting heads 6 to 9 to mount different types of suction nozzles 20, the nozzles 20 are exchanged by moving onto the nozzle stocker 21. At this time, the mounting heads 6 to 9
When any two or more of them can be simultaneously viewed on the position where the suction nozzle 20 of the stocker 21 is placed, they can be simultaneously lowered and replaced. However, also at this time, if the direction of the mounting position of the plurality of nozzles 20 is shifted from the X direction, the beam 12 can be swung and adjusted.

If the sliders 15 and 16 simultaneously move at the same speed when the beam 12 moves in the Y direction, the beam 1
2 can move while facing in the same direction (for example, the X direction), but if it is configured to be swingable around the support shafts 17 and 18 as in the present application, the sliders 15 and 16 are synchronized. Even when the beam 12 moves with some deviation without moving, since the beam 12 can swing with respect to the sliders 15 and 16, the inclination of the beam 12 causes the sliders 15 and 16 to move with the guides 13 and 14. You can move without gnawing.

Next, a second embodiment of the present invention will be described with reference to FIG.

The same structure as in the first embodiment will be described using the same reference numerals.

In the second embodiment, the mounting heads 25 and 26 are individually moved on the beam 24 by a linear motor. Therefore, the distance between the mounting heads 25 and 26 is variable, and each of the mounting heads 25 and 26 is individually moved in the X direction. Can be positioned.

The control of the movement of the mounting heads 25, 26 and the sliders 15, 16 is performed by a control device 28. The beam 24 is rotatable about the spindles 17 and 18 with respect to the sliders 15 and 16.

With such a configuration, the mounting head 25,
26 and the beam 24, and the mounting heads 25 and 26 face the supply positions of the two component supply units 4, respectively.
Electronic components are sucked. At this time, if the two supply positions are not aligned in the X direction, the sliders 15 and 16 move respectively, and the beam 24 swings around the support shaft 17 so as to face a straight line connecting the two supply positions. Is done.

When two electronic components to be attracted by the respective mounting heads 25 and 26 are mounted, if the distance between the two positions to be mounted is within the swing range of the beam 24 in the Y direction, the Y of the sliders 15 and 16 can be adjusted. Displaced beam 24
Can be mounted at the same distance, and two electronic components can be mounted at the same time by moving the beam 24 and the mounting heads 25 and 26. At this time, since the swing causes the electronic components held by the mounting heads 25 and 26 to be angularly displaced around the vertical axis, the suction nozzle 20 is corrected and rotated by a rotating device (not shown) mounted on the mounting heads 25 and 26. In the second embodiment, when two pieces of the same type of printed circuit boards 3 are placed in the X direction and electronic components to be mounted in the same order are mounted by the mounting heads 25 and 26, respectively, When the Y direction is slightly different between the two substrates 3 depending on the recognition result or the like, adjustment can be made by swinging the beam 24. Further, the X direction can be adjusted by individually moving the mounting heads 25 and 26,
As a result, the angular deviation of the component around the vertical axis is corrected by the rotation of the mounting head itself, and the same component can be mounted on the two substrates 3 at the same time.

When it is desired to exchange the nozzles 20 for the two mounting heads 25 and 26, the nozzle stocker 21
When the nozzle 20 or the mounting position of the nozzle 20 to be replaced is not in the X direction, the control device 28 controls the movement of the sliders 15 and 16 so that the beam 24 is directed in that direction, and the mounting head 25 , 26 are moved so as to match the nozzle 20 of the nozzle stocker 21 or its mounting position. In this manner, the nozzles 20 can be replaced by lowering the mounting heads 25 and 26 at the same time.

In this embodiment, the angle of the electronic component held by the mounting head, which is shifted by the inclination of the beam 24, is corrected by the rotation of the mounting head. If not, the angle positioning may be performed by the inclination of the beam 24 without rotating the mounting head.

In this embodiment, the mounting head 25,
Although a linear motor is used to individually move the motors 26, a plurality of hollow motors may be combined with a ball screw shaft, and each mounting head may be attached to the hollow motor to move individually. The movement of the sliders 15 and 16 may be realized by using such a hollow motor, or the slider may be moved by rotating a ball screw shaft by a motor and fixing the slider to a nut screwed to the ball screw shaft. It may be.

Although the present embodiment has been described with respect to an example of an electronic component mounting apparatus, for example, the structure of an application head employed in an adhesive application apparatus is the same as that of the mounting head. It may be provided.

[0043]

As described above, according to the present invention, it is possible to adjust the position of each mounting head in the direction orthogonal to the beam by only a simple mechanism of swinging the beam.
When mounting electronic components, a plurality of mounting heads in the same beam can simultaneously hold the electronic components. Further, at the time of mounting, a plurality of mounting heads within the same beam can simultaneously mount electronic components.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting apparatus according to a first embodiment.

FIG. 2 is a plan view illustrating an electronic component mounting apparatus according to a second embodiment.

[Explanation of symbols]

 2 Component Supply Unit 3 Printed Circuit Board 6 Mounting Head 7 Mounting Head 8 Mounting Head 9 Mounting Head 12 Beam 13 Guide 14 Guide 15 Slider 16 Slider 19 Controller 20 Suction Nozzle 21 Nozzle Stocker 24 Beam 25 Mounting Head 26 Mounting Head 28 Controller

Claims (7)

[Claims] An electronic component mounting apparatus for mounting an electronic component from a component supply unit on a printed circuit board and mounting the electronic component on a printed circuit board;
An electronic component mounting apparatus, comprising: a plurality of mounting heads movably in a longitudinal direction of the beam, wherein the beam can swing in a horizontal plane. 2. A pair of guides extending in the beam movement direction and supporting both ends of the beam to guide the movement of the beam, so that both ends of the beam can be individually moved, and the positions of both ends of the beam with respect to the guide are determined. 2. The electronic component according to claim 1, further comprising: a controller that controls the position of the plurality of mounting heads in a direction orthogonal to the beam by shifting the beam in a horizontal plane. Mounting device. 3. The electronic component mounting apparatus according to claim 1, wherein a longitudinal direction of the beam and a disposition direction of the component supply unit in the component supply unit match. 4. The electronic component mounting apparatus according to claim 1, wherein the position adjustment by swinging the beam is performed when the electronic component is supplied. 5. The apparatus according to claim 1, wherein the plurality of mounting heads are individually moved along the beam, and the position adjustment by swinging the beam is performed at the time of mounting a component.
The electronic component mounting device according to any one of the above. 6. The method according to claim 1, wherein the position adjustment by swinging the beam is performed when the suction nozzle is replaced.
The electronic component mounting device according to any one of the above. 7. The electronic component mounting apparatus according to claim 1, wherein the angular deviation of the electronic component due to the swing of the beam is corrected by rotating a suction nozzle.