JP2001308591A - Electronic part mounter and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a plurality of electronic parts on a board within one period where a plurality of suction nozzles move from a sucking position to a mounting position and then return back to the sucking position. SOLUTION: Electronic parts are sucked to suction nozzles 108-1 to 108-4. When the electronic parts are turned to the left or right along with at least one of the suction nozzles 108-1 to 108-4, the suction nozzles 108-1 to 108-4 are moved up and down by means of Z-axis servo motors 203-1 to 203-4 to locate the electronic parts sucked to the suction nozzles 108-1 to 108-4 at such heights as causing no interference.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate such as an electronic circuit board.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus has a suction nozzle for holding an electronic component in a sucked state. The suction nozzle conveys the electronic component to a mounting position on a printed circuit board, and transfers the electronic component to the printed circuit board. Attach on top.

[0003] The electronic component mounting device includes a component supply device for supplying an electronic component, a head unit for mounting the suction nozzle, and the head unit between a suction position of the component supply device and the mounting position. A moving mechanism for horizontally moving the suction nozzle, a vertically moving mechanism for vertically moving the suction nozzle with respect to the head unit, and moving the suction nozzle left and right with respect to the head unit about the axis of the suction nozzle. It is provided with a rotation mechanism for rotating, and a component recognition device for measuring the suction posture and type of the sucked electronic component. An electronic component feeder that supplies electronic components one by one to the suction position of the suction nozzle is mounted on the component supply device in a state of being arranged in a horizontal row.

In the electronic component mounting apparatus, the electronic component supplied to the suction position is sucked by the suction nozzle. After sucking the electronic component, the suction nozzle is moved up by the vertical movement mechanism. The mounting posture of the sucked electronic component is determined by rotating the suction nozzle by the rotation mechanism. Next, the electronic component sucked by the component recognition device is recognized. Based on the result of component recognition, the moving mechanism moves the head unit from the suction position to the mounting position, and lowers the suction nozzle by the vertical movement mechanism to mount the electronic component on the board.

In some cases, a plurality of the suction nozzles are provided in the head unit in order to improve the mounting efficiency of electronic components. In this case, a plurality of suction nozzles are arranged in the head unit so as to have the same interval as the interval between the suction positions of the adjacent electronic component feeders. With such a configuration, each of the suction nozzles moves down at the suction position, and can suck the electronic component. By providing a plurality of suction nozzles in the head unit, a plurality of electronic components can be transported from the suction position to the mounting position when the head unit moves once from the suction position to the mounting position.

[0006]

However, in the electronic component mounting apparatus configured as described above, when each of the suction nozzles rotates while each of the suction nozzles is holding the electronic component,
Depending on the shape of the electronic component, the electronic components sucked by the suction nozzles adjacent to each other may collide with each other. For this reason, there has been a case where the electronic component cannot be recognized by the component recognition device or the electronic component cannot be mounted. In order to avoid this, when the suction nozzles adjacent to each other rotate (the electronic components are mounted at the same time), it is determined whether or not the electronic components sucked to the nozzles adjacent to each other can rotate without hitting from the external dimensions of each electronic component. Had to be judged.

If it is determined that rotation is impossible (simultaneous mounting is impossible), one of the electronic components that are adjacent to each other is mounted on the substrate from the component supply device, and the suction nozzle returns to the component supply device again and the other electronic component is returned. The component is mounted on the board from the component supply device. Therefore, the mounting efficiency may not be improved in spite of providing a plurality of suction nozzles.

Accordingly, an object of the present invention is to enable a plurality of electronic components to be mounted on a substrate in one cycle in which a plurality of suction nozzles move from a suction position to a mounting position and return to the suction position again.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the invention according to claim 1 is based on a component supply unit (for example, FIG. 1).
In order to take out a plurality of electronic components arranged in close proximity to each other in the electronic component supply device 140) shown in FIG. A plurality of suction units (for example, suction nozzles 108-1 to 108 shown in FIG.
-4), a vertical movement mechanism (for example, including Z-axis servo motors 203-1 to 203-4 shown in FIG. 2) for vertically moving the plurality of suction units, And a rotation mechanism (for example, including the θ-axis servo motors 204-1 to 204-4 shown in FIG. 2) for rotating the suction units at least to the left or right, and the plurality of suction units from the component supply unit to the substrate. A horizontal movement mechanism (for example, X shown in FIG.
A Y-direction drive mechanism 110) and a control unit that controls the operations of the plurality of suction units, the vertical movement mechanism, the rotation mechanism, and the horizontal movement mechanism (for example, the control device 200 illustrated in FIG. 2).
Before moving the plurality of suction units from the component supply unit onto the board by the horizontal movement mechanism, causing the plurality of suction units to suck electronic components, and transferring the electronic component to the board. Before mounting, when the electronic component is rotated together with at least one suction unit that has sucked the electronic component, the control unit is configured to adjust the height of each electronic component to be sucked so as not to interfere with each other. It is characterized in that each suction unit, the vertical movement mechanism and the rotation mechanism are controlled.

As described above, according to the first aspect of the invention, when the electronic component is rotated together with the suction portion that has sucked the electronic component, the heights of the electronic components to be sucked do not interfere with each other. Thus, since the electronic components are controlled, they can be rotated without hitting each other. Then, by rotating the sucked electronic component before mounting the sucked electronic component on the substrate, the posture of the sucked electronic component can be changed. With this, the suction unit moves from the suction position to the mounting position, and a plurality of electronic components can be mounted on the board in one cycle of returning to the suction position again.
Electronic components can be efficiently mounted.

Further, since the electronic components can be rotated without hitting each other, the electronic components can be arranged close to the component supply unit without worrying about the external dimensions of the electronic components. Therefore, it is not necessary to determine whether or not the electronic components sucked by the nozzles adjacent to each other can be rotated without hitting from the external dimensions of each electronic component.

According to a second aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component on a substrate using the electronic component mounting apparatus according to the first aspect, wherein the electronic component is mounted on each of the plurality of suction portions. At least one of the rotated suction units is rotated when at least one of the suction units sucking the electronic component is rotated after the suction and before mounting the electronic component on the substrate. Is set to a height different from that of the other suction portions so that the plurality of sucked electronic components do not interfere with each other.

As described above, according to the second aspect of the present invention, when rotating the suction unit that has sucked the electronic component, the height of the rotated suction unit interferes with the sucked electronic components. Since the height is set to be different from that of the other suction parts so as not to occur, the suction parts can be rotated without hitting each electronic component. Thus, in one cycle in which the suction unit moves from the suction position to the mounting position and returns to the suction position again, a plurality of electronic components can be mounted on the board, and the electronic components can be mounted efficiently.

According to a third aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component on a substrate using the electronic component mounting apparatus according to the first aspect, wherein the electronic components are sequentially attached to the plurality of suction portions. When the suction is performed and the plurality of suction units are sequentially raised to a predetermined height, at least one of the rising suction units is moved to the predetermined height before reaching the predetermined height so that electronic components to be suctioned do not interfere with each other. The electronic component is mounted after being rotated at a height of.

As described above, according to the third aspect of the present invention, when the plurality of suction portions are sequentially raised, the electronic components to be suctioned are not moved to a predetermined height so as not to interfere with each other. Since the suction unit that rises at the height is rotated, each electronic component can be rotated without hitting each other. Thus, in one cycle in which the suction unit moves from the suction position to the mounting position and returns to the suction position again, a plurality of electronic components can be mounted on the board, and the electronic components can be mounted efficiently.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. In the following description, the Z direction indicates a substantially vertical direction, the XY direction indicates a substantially horizontal direction, and the X direction is perpendicular to the Y direction.

FIG. 1 is a perspective view of an electronic component mounting apparatus 100 according to an embodiment of the present invention. As shown in FIG. 1, the electronic component mounting apparatus 100 includes a base 101 and suction nozzles (suction units) 108-1 to 108 for sucking electronic components.
-4, a head unit 105 to which the suction nozzles 108-1 to 108-4 are attached, and
It is composed of an XY direction drive mechanism (horizontal movement mechanism) 110 for positioning in the Y direction, a component supply device (component supply unit) 140 for supplying electronic components, a substrate transport device 102 for transporting the substrate 103, and the like. .

In the electronic component mounting apparatus 100, the suction nozzles 108-1 to 108-4 take out the electronic components from the component supply device 140 by sucking the electronic components, and together with the head unit 105, the suction nozzles 108-1 to 108-1.
08-4 is moved from the component supply device 140 onto the substrate 103 to mount electronic components.

A substrate transfer device 102 is arranged on the base 101, and the substrate 103 is transferred on the substrate transfer device 102 and stopped at a predetermined mounting work position. Component supply devices 140 are provided on both sides of the substrate transfer device 102.
Is arranged. Above the base 101, a head unit 105 is provided.

The head unit 105 can be moved in the X-axis direction (the direction of the substrate transfer device 102) and the Y-axis direction by the XY-direction drive mechanism 110. That is, the XY-direction drive mechanism 110 includes the X guide member 106 extending in the X direction and the Y guide member 106 extending in the Y direction.
Guide members 107, 107 and X-axis servo motor 201
(Shown in FIG. 2) and a Y-axis servomotor 202 (shown in FIG. 2). The head unit 105 is movably supported by an X guide member 106, and the X guide member 106 is connected to Y guide members 107, 107.
It is supported movably. The X guide member 106
The head unit 105 is moved in the Y direction along the Y guide member 107 by the Y axis servo motor 202, and is moved in the X direction along the X guide member 106 by the X axis servo motor 201.

The component supply device 140 is connected to the feeder bank 1
41 and electronic component feeders 142, 142,... The feeder bank 141 positions and fixes the electronic component feeder 142. A plurality of electronic component feeders 142 are mounted on the feeder bank 141 in a state of being arranged in a horizontal row. In the present embodiment, the electronic component feeder 142 is a tape feeder, and each tape feeder stores and holds electronic components such as ICs and capacitors at predetermined intervals on a tape derived from a reel. Then, the electronic component feeder 142
Is configured to sequentially transport electronic components to a suction position as electronic components are suctioned by suction nozzles 108-1 to 108-4 described later. With the above-described configuration, the component supply device 140 can control the respective electronic component feeders 142
The plurality of electronic components are arranged close to each other at the suction position.

The head unit 105 includes the suction nozzle 1
A Z-direction driving mechanism (not shown) for performing positioning in the Z-direction of each of 08-1 to 108-4;
A θ-axis rotation mechanism (not shown) for positioning a rotation angle around the axis (θ-axis) of each of the Z-directions 1 to 108-4.
And a component recognition device 205 (shown in FIG. 2) for recognizing the electronic component sucked by the suction nozzles 108-1 to 108-4.
Are provided.

The Z-direction drive mechanism includes an elevating mechanism (not shown) such as a pinion rack mechanism and a screw transmission mechanism.
A Z-axis servomotor 203-1 (shown in FIG. 2) and the like are provided. The θ-axis rotating mechanism includes a rotating shaft (not shown),
A shaft servomotor 204-1 (shown in FIG. 2) and the like are provided. The elevating mechanism is fixedly provided on the head unit 105. The rotation axis is the θ axis in the Z direction, and the rotation axis is rotatably supported by the lifting mechanism about the axis. Further, the suction nozzle 10 is attached to the rotation shaft.
8-1 is fixedly supported. The drive output of the Z-axis servo motor 203-1 is connected to the elevating mechanism. The drive output of the Z-axis servo motor 203-1 causes the suction nozzle 108-1 and the head unit 105 to move together with the rotary shaft. It can move in the Z direction. Also, the θ-axis servo motor 204-1
Is connected to the rotation shaft, and the suction output 108-1 can rotate right and left together with the rotation shaft by the drive output of the θ-axis servomotor 204-1. As described above, a plurality of Z-direction drive mechanisms and θ-axis rotation mechanisms are provided in the head unit 105, and the suction nozzles 108-2 to 108-4 also move up and down and rotate similarly to the suction nozzle 108-1. It has become. Servo motors for vertically moving the suction nozzles 108-2 to 108-4 are Z-axis servo motors 203-2 to 204-4, respectively.
Servo motors for rotating 2-108-4 are θ-axis servo motors 204-2 through 204-4, respectively.

The suction nozzles 108-1 to 108-4 are arranged in the head unit 105 in close proximity to each other and in order. The interval between the adjacent suction nozzles is substantially the same as the interval between the suction positions of the adjacent electronic component feeders 142, and the suction nozzles 108-1 to 108-4 simultaneously suck the electronic components from the corresponding electronic component feeders 142. hand,
It can be taken out.

The component recognition device 205 is, for example, a detection device using a laser beam, etc.
108-4 are provided in the head unit 105 near the tips. Further, although illustration is omitted here, for example, C
An imaging device such as a CD camera or an artificial retinal camera may be used. Then, the component recognition device 205 controls the suction nozzle 108
The electronic components adsorbed at -1 to 108-4 are recognized.

Next, the electronic component mounting apparatus 10 as described above
The control device 200 included in 0 will be described. As shown in FIG. 2, the control device 200 of the electronic component mounting device 100
Is a CPU (Central Processing)
Unit) 210 and RAM (Random Access)
ss Memory) 211 and ROM (Read O
An nlyMemory) 212 and a driver 213 are connected to each other via a system bus so that data can be input and output from each other.

Further, a component recognition device 2 is connected to the system bus.
05 is connected, and data can be input and output. Z-axis servo motors 203-1 to 203-4, θ-axis servo motors 204-1 to 204-4, X-axis servo motor 201, Y-axis servo motor 202, and suction nozzle 108
A driver 213 is connected to -1 to 108-4. The driver 213 controls the driving of each of the motors and controls the suction operation of the suction nozzles 108-1 to 108-4.

The CPU 210 inputs a detection signal from the component recognition device 205 according to a control program stored in the ROM 212 using a predetermined area of the RAM 211 as a work area, and controls each motor and suction nozzles 108-1 to 108-.
For example, a process for controlling the control unit 4 is calculated. ROM 21
3 includes a component recognition device 205, motors and suction nozzles 1
A control program for controlling 08-1 to 108-4 is stored. The driver 213 controls each motor and the suction nozzle 10 based on each process calculated by the CPU 210.
8-1 to 108-4 are drive-controlled.

More specifically, the CPU 210 drives and controls the X-axis servo motor 201 and the Y-axis servo motor 202 via the driver 213 based on the control program, and performs suction positioning for moving the head unit 105 to the suction position. Perform processing. Further, the CPU 210 controls the Z-axis servo motors 203-1 to 203-4 and the suction nozzle 108-
Drive control of the suction nozzles 108-1
108-4 is lowered to perform an adsorption process for adsorbing electronic components.

The ROM 212 stores information relating to the component data of the electronic components. Based on the component data and the control program, the Z-axis servo motors 203-1 to 203-4 and the θ-axis The servo motors 204-1 to 204-4 are drive-controlled to perform a posture changing process for changing the posture of the electronic component sucked by the suction nozzles 108-1 to 108-4. Also, CPU2
10 performs recognition processing for recognizing the sucked electronic component by the component recognition device 205 based on the control program. Then, the CPU 210 controls the driving of the X-axis servomotor 201 and the Y-axis servomotor 202 while correcting the mounting position based on the control program and the input data from the component recognizing device 205, and moves the head unit 105 to the substrate 1
A mounting positioning process for moving the mounting position to the mounting position on the electronic device 03 is performed. And CPU210 is based on a control program,
The Z-axis servo motors 203-1 to 203-4 and the suction nozzles 108-1 to 108-4 are drive-controlled to perform a mounting process for mounting electronic components on a substrate. Each motor, the component recognition device 205, and the suction nozzles 108-1 to 108-4 are controlled based on the various processes of the CPU 210 described above.

The posture changing process will be described in detail.
The component data of the electronic component includes data relating to the thickness of the electronic component (the height of the electronic component). And CPU
210 controls the Z-axis servomotors 203-1 to 203-4 and the θ-axis servomotors 204-1 to 204-4 via the driver 213 based on the thickness of the electronic component.

That is, the suction nozzles 108-1 to 108-4
Has absorbed the electronic component, and the θ-axis servomotor 204−
When the suction nozzles 108-1 to 108-1 operate,
Before the 08-4 rotates, the Z-axis servomotor 204-1
To operate the suction nozzles 108-1 to 108-1.
08-4 in the Z-axis direction are respectively changed. At this time, the lowermost part of the electronic component sucked by one of the suction nozzles 108-1 to 108-4 is higher than the uppermost part of the electronic component sucked by the suction nozzle adjacent to the suction nozzle. So that the Z-axis servo motor 204
By controlling -1 to 204-4, the suction nozzles 108-1 to 108-1 are controlled.
Change the height of 108-4.

The operation of the electronic component mounting apparatus 100 according to the present embodiment will be described with reference to FIGS. FIG. 3 is a flowchart illustrating the operation of the electronic component mounting apparatus 100 according to the present embodiment. FIGS. 4 to 7 show the positional relationship between the suction nozzles 108-1 and 108-2 and the electronic components in a step-by-step manner. In each of the drawings, (a) is a side view and (b) is a side view. It is a top view. 4 to 7, only the suction nozzles 108-1 and 108-2 are shown to simplify the drawings.

First, the substrate 1 is
03 is transported to the mounting work position and is held at the mounting work position. Next, the X-axis servomotor 201 and the Y-axis servomotor 202 operate to operate the head unit 105.
Is moved in the X-Y direction. Thereby, the suction nozzle 1
Each of 08-1 to 108-4 faces above the suction position of the corresponding electronic component feeder 142 (step S).
1). Next, Z-axis servo motors 203-1 to 203-
4 is operated, and as shown in FIG.
108-4 descends, and each of the suction nozzles sucks the electronic component one by one almost simultaneously (step S2).

When the suction nozzles 108-1 to 108-4 suck the electronic components, the Z-axis servo motors 203-1 to 20-3 are used.
3-4 operates in reverse, and as shown in FIG.
08-1 to 108-4 increase (step S3). Here, the suction nozzle 108-1 and the suction nozzle 108-1
The vertical positional relationship between the suction nozzle 108-2 and the adjacent suction nozzle 108-2 is as follows. That is, assuming that the thickness of the electronic component 301 sucked by the suction nozzle 108-1 is h1, the suction nozzle 108-2 rises higher by h1 or more than the suction nozzle 108-1. Thus, the suction nozzles 108-1 to 108-1
08-4 rises, the suction nozzle 108-
The lowermost part of the electronic component 302 sucked by the suction nozzle 108-1 is located above the uppermost part of the electronic component 301 sucked by the suction nozzle 108-1. Suction nozzle 108-2 and suction nozzle 10
Similarly to the height relationship between 8-3 and the suction nozzle 108-1 and the suction nozzle 108-2, the electronic component sucked by one of the suction nozzles is sucked by the other suction nozzle. Height different from that of electronic components. Suction nozzle 1
The same holds true for the height relationship between 08-3 and the suction nozzle 108-4.

As described above, the suction nozzles 108-1 to 108-1
When 08-4 rises, the θ-axis servo motor 204-1
204-4 operates, and as shown in FIG.
08-1 to 108-4 rotate (Step S)
4). Thereby, the suction nozzles 108-1 to 108-4
To change the posture of the electronic component that has been sucked.

Next, the Z-axis servo motors 203-1 and 203-2
03-4 operates, and as shown in FIG.
08-1 to 108-4 are moved up and down so that the suction nozzle 10
The heights of the electronic components sucked at 2-1 to 108-4 are made uniform (step S5). By adjusting the height of the electronic components, the suction nozzle 108-
It is possible to perform component recognition of the electronic components sucked at 1 to 108-4, and to move the head unit 105 from the suction position to the mounting position. Then, the electronic component is recognized by the component recognition device 205 (Step S).
6), based on the recognition result by the component recognition device 205,
A correction calculation of the mounting position of the electronic component is performed. Next, based on the correction calculation, the X-axis servo motor 201 and the Y-axis servo motor 202 operate to move the head unit 105 to the correction mounting position (Step S7). Next, the Z-axis servo motors 203-1 to 203-4 are operated, the suction nozzles 108-1 to 108-4 are respectively lowered, and the electronic components are mounted on the substrate 103 (step S8). The mounting of one cycle is completed by the operations of steps S1 to S8, and this cycle is repeated a predetermined number of times (step S9).

As described above, according to the present embodiment, before the electronic components are mounted on the substrate 103, the suction nozzles 108-1 to 108-1 along with the electronic components sucked in step S4.
When rotating 108-4, the heights of the electronic components sucked in step S3 do not interfere with each other. Therefore, the suction nozzles 108-1 to 108-1 to
Even if 8-4 rotates, the electronic components sucked by the adjacent suction nozzles do not collide with each other. Thereby, the suction nozzles 108-1 to 108-4 move from the suction position to the mounting position, and mount a plurality of electronic components from the suction position in one cycle (step S1 → step S9 → step S1) of returning to the suction position again. Can be transported to a location. for that reason,
In one cycle, the suction nozzles 108-1 to 108-4 can mount a plurality of electronic components on the board almost at the same time, and can mount the electronic components efficiently.

When a plurality of electronic component feeders 142 are mounted on the feeder bank 141 in order to prevent the electronic components sucked by the adjacent suction nozzles from colliding with each other, the electronic components outside the electronic components of the adjacent electronic component feeders are removed. The trouble of judging whether or not the adjacent electronic components can be mounted at the same time can be omitted from the diameter. That is, the electronic component feeder 142 can be connected to the feeder bank 14 without worrying about the outer diameter of adjacent electronic components.
1 can be attached. Also, if the external dimensions of the electronic component that can be sucked by the adjacent suction nozzles are not the external dimensions that will hit the electronic component and the adjacent suction nozzle, the electronic components should be almost mounted on the adjacent suction nozzles. Can be. For this reason, the maximum external dimension of the electronic component that can be suctioned for each suction nozzle can be determined in advance. In addition, since it is not necessary to set the conditions of the outer dimensions of the adjacent electronic components so that it is not determined that the adjacent electronic components cannot be simultaneously mounted, it is not necessary to reassign the suction, recognition, and mounting phases of the electronic components.

In the present embodiment, the height of the electronic components sucked by the adjacent suction nozzles is set so as not to interfere with each other. From the suction nozzle 108-1
１０８108-4 was performed when it rose, but is not limited to this case. That is, the suction nozzle 108 that has sucked the electronic component
Before any one of -1 to 108-4 rotates, an electronic component to be sucked by a suction nozzle adjacent to the rotating suction nozzle interferes with an electronic component sucked by the rotating suction nozzle. The height should not be changed.

For example, the suction nozzles 108-1 to 108-
4 picks up the electronic component, and then picks up the suction nozzles 108-1 to 108-1.
When 108-4 rises, the suction nozzles 108-1 to 108-1
The heights of the electronic components sucked at 108-4 are made uniform. Then, the component recognition device 205 performs component recognition. Next, the heights of the electronic components sucked by the suction nozzles 108-1 to 108-4 are set to different heights as shown in FIG. 5, and when the suction nozzles 108-1 to 108-4 rotate, the electronic components are separated from each other. The height does not interfere. Next, the suction nozzle 1
08-1 to 108-4 are rotated, and the suction nozzle 108 is rotated.
The posture of each electronic component sucked by -1 to 108-4 is changed. In this case, when performing component recognition by the component recognition device 205, the height of the electronic component sucked by the suction nozzles 108-1 to 108-4 may be shifted as shown in FIG. After the posture change, the head unit 105 is moved to the correction mounting position, and then the suction nozzles 108-1 to 108-1 are moved.
The electronic component is mounted on the substrate 103 by lowering 108-4.

Further, the following may be performed. That is, when the suction nozzles 108-1 to 108-4 suck electronic components, the suction nozzles 108-1 to 108-4 do not move down at the same time, but descend sequentially. For example, it is assumed that the suction nozzle 108-1 has moved down to suck the electronic component. Then, the component recognition device 20
5. The suction nozzle 108 reaches a height at which parts can be recognized by
-1 increases. If the lowermost part of the electronic component sucked by the suction nozzle 108-1 is higher than the uppermost part of the electronic component to be sucked by the suction nozzle 108-2 while the suction nozzle 108-1 is rising, the suction nozzle 108- Rotate 1 Thereby, the posture of the electronic component sucked by the suction nozzle 108-1 is changed. Next, the suction nozzle 108
-2 also sucks an electronic component in the same manner as the suction nozzle 108-1, and when the suction nozzle 108-2 is raised to a height at which the component can be recognized, the lowermost part of the electronic component sucked by the suction nozzle 108-2 is When the suction nozzle 108-3 becomes higher than the uppermost part of the electronic component to be suctioned, the suction nozzle 108
-2 rotates. The suction nozzles 108-3 and 108-4 sequentially perform the same operation. Then, the suction nozzle 108-4
Is changed to a height at which component recognition can be performed by the component recognition device 205 while changing the posture, component recognition is performed. Next, the head unit 105 is moved to the correction mounting position, and then the suction nozzles 108-1 to 108-4 are lowered to mount the electronic component on the board. In this case, at the same time as the suction nozzle 108-1, the suction nozzle 108-3 may be simultaneously lowered, suck the electronic component at the same time, rise at the same time, and rotate at the same time. That is, it is only necessary that adjacent suction nozzles do not operate at the same time.

Further, the following may be performed. That is, the suction nozzles 108-1 to 108-4 are simultaneously lowered at the suction position to suck the electronic component. Then, the suction nozzle 10
The suction nozzle 108-1 has a height such that the electronic component sucked by the items 8-1 to 108-4 can be moved to the mounting position.
108-4 rises at the same time. Next, component recognition is performed by the component recognition device 205, and the head unit 10
5 moves to the correction mounting position. And the suction nozzle 1
08-1 to 108-4 descend in order in a predetermined order to mount electronic components. Meanwhile, when the electronic component sucked by the descending suction nozzle falls to the height of the electronic component sucked by the suction nozzle adjacent to the descending suction nozzle, the descending suction nozzle The posture of the electronic component is changed by the rotation of.

In the above description, the number of suction nozzles is 4
However, the number of suction nozzles is not limited to four, but may be any number of two or more. Further, all the suction nozzles are provided in one head unit 105, but a plurality of head units may be provided with the suction nozzles. in this case,
Each of the plurality of head units is provided on the X guide member 106 so as to be movable in the X direction, and each head unit is provided with a vertical movement mechanism for vertically moving the suction nozzle and a rotating mechanism for rotating the suction nozzle left and right. In addition, it is a matter of course that each part can be variously changed without departing from the gist thereof.

[0045]

As described above, according to the first aspect of the present invention, when rotating the electronic component sucked by the suction portion,
The electronic components do not hit each other. Then, before mounting the sucked electronic component on the substrate, the sucked electronic component can be rotated to change the attitude of the sucked electronic component. Thus, in one cycle in which the suction unit moves from the suction position to the mounting position and returns to the suction position again, a plurality of electronic components can be mounted on the board, and the electronic components can be mounted efficiently. In addition, since the electronic components can rotate without hitting each other, when arranging the electronic components close to the component supply unit, the electronic components can be arranged without concern for the external dimensions. As a result, it is not necessary to determine whether or not the electronic components sucked by the nozzles adjacent to each other can be rotated without colliding with each other based on the external dimensions of each electronic component.

According to the second aspect of the present invention, when rotating the electronic components sucked by the suction portion, the electronic components do not collide with each other. Thus, in one cycle in which the suction unit moves from the suction position to the mounting position and returns to the suction position again, a plurality of electronic components can be mounted on the board, and the electronic components can be mounted efficiently.

According to the third aspect of the invention, when rotating the electronic components sucked by the suction portion, the electronic components do not collide with each other. Thus, in one cycle in which the suction unit moves from the suction position to the mounting position and returns to the suction position again, a plurality of electronic components can be mounted on the board, and the electronic components can be mounted efficiently.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component mounting apparatus to which the present invention is applied.

FIG. 2 is a block diagram illustrating a configuration of the electronic component mounting apparatus.

FIG. 3 is a flowchart illustrating an operation of the electronic component mounting apparatus.

FIG. 4 is a view for explaining an operation of the electronic component mounting apparatus.

FIG. 5 is a drawing for explaining the operation of the electronic component mounting apparatus.

FIG. 6 is a drawing for explaining the operation of the electronic component mounting apparatus.

FIG. 7 is a drawing for explaining the operation of the electronic component mounting apparatus.

[Description of Signs] 100 Electronic component mounting device 102 Substrate transport device 103 Substrate 105 Head unit 108-1, 108-2, 108-3, 108-4
Suction nozzle (suction unit) 110 XY-direction drive mechanism (horizontal movement mechanism) 140 Component supply device (component supply unit) 200 Control device (control unit) 201 X-axis servomotor (constituting horizontal movement mechanism) 202 Y-axis servo Motors (constituting a horizontal movement mechanism) 203-1, 203-2, 203-3, 203-4
Z-axis servo motor (constituting a vertical movement mechanism) 204-1, 204-2, 204-3, 204-4
θ-axis servo motor (constitutes a rotation mechanism)

Claims (3)

[Claims] A plurality of electronic components arranged close to each other in a component supply unit are taken out, and the plurality of electronic components are arranged close to each other and each of the plurality of electronic components is arranged so that the plurality of electronic components can be mounted on a substrate. In an electronic component mounting apparatus including a plurality of suction units for sucking components, a vertical movement mechanism for vertically moving the plurality of suction units, and a rotation mechanism for rotating the plurality of suction units at least to the left or right, A horizontal movement mechanism for moving the plurality of suction units from the component supply unit to an arbitrary position on the substrate; and controlling operations of the plurality of suction units, the vertical movement mechanism, the rotation mechanism, and the horizontal movement mechanism. A control unit, wherein the horizontal moving mechanism causes the plurality of suction units to suck electronic components before moving the plurality of suction units onto the substrate from the component supply unit. And, before mounting the electronic component on the substrate, when rotating the electronic component together with at least one suction unit that has sucked the electronic component, the height of each electronic component to be sucked is such that the height does not interfere with each other. The electronic component mounting apparatus, wherein the control unit controls the suction units, the vertical movement mechanism, and the rotation mechanism. 2. An electronic component mounting method for mounting an electronic component on a substrate using the electronic component mounting device according to claim 1, wherein the electronic component is sucked by each of the plurality of suction portions, and Before mounting the electronic component on the substrate, when rotating at least one suction unit of the suction unit that sucks the electronic component, the height of at least one rotated suction unit is adjusted to A plurality of electronic components having different heights from other suction parts so as not to interfere with each other. 3. An electronic component mounting method for mounting an electronic component on a substrate using the electronic component mounting device according to claim 1, wherein the electronic components are sequentially sucked by the plurality of suction portions and the plurality of suction devices are mounted. When the parts are sequentially raised to a predetermined height, at least one of the ascending suction parts is rotated at a position at a height before reaching the predetermined height so that electronic components to be suctioned do not interfere with each other. Electronic component mounting method, after mounting the electronic component.