JP2000323895A - Automatic mounting device for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an automatic mounting device for electronic parts wherein numerous electronic parts are supplied while fast mounting is possible. SOLUTION: Electronic parts are automatically mounted on printed wiring boards 10 and 11. Here, a plurality of electronic part supply devices 6 wherein, fixed at specified positions, part take-out positions are extended linearly, a table means 8 wherein a printed wiring board is placed to move in X and Y axis directions for deciding the mounting position of an electronic part, and a plurality of turrets 16 and 17 wherein an electronic part is taken out of the electronic part supply device and mounted on the printed wiring board, are provided. Each of the turrets comprises a nozzle for taking out an electronic part, a camera 34 which recognizes the position of electronic part which is taken out, a servo mechanism 36 which corrects the recognized position of electronic part to a specified position, and a nozzle for mounting the electronic part on the printed wiring board. The part take-out operation, part-position recognizing operation, part-position correcting operation, and part mounting operation are performed almost at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic electronic component mounting apparatus, and more particularly to an automatic electronic component mounting apparatus for automatically mounting electronic components on a printed circuit board at high speed.

[0002]

2. Description of the Related Art Conventionally, an extremely large number of electronic components are mounted on a printed wiring board. At this time, in order to mount (mount) the electronic components on the printed wiring board, an electronic component automatic mounting apparatus is used. (Automatic electronic component mounter) is used. These electronic component automatic mounting apparatuses can be classified into the following two systems. That is, a method in which the component supply unit is a fixed type, the electronic component is taken out from the component supply unit by a mounting jig, and the electronic component is moved to a predetermined position on the fixedly positioned printed wiring board and mounted. Is a movable type, after moving the component supply unit to the component removal position of the turret, the turret receives a predetermined component, and after moving the printed wiring board mounted on the XY table to the predetermined position. And a method in which a turret mounts electronic components.

[0003]

The first method is a method in which a mounting jig moves between a pick-up position of an electronic component and a component mounting position. After the jig moves on the component position recognition camera and the component is recognized, the jig further moves to the mounting position of the printed wiring board, where the electronic component is mounted. In the first method, since the component supply unit is of a fixed type, there are advantages in that a large number of components can be supplied, components can be supplied while the mounting device is operating, and components can be replaced.

However, in the first method, the mounting jig moves between the component pick-up position and the component mounting position, so that the mounting speed is reduced accordingly. For this reason, the advantages required for a high-speed machine such as the supply of a large number of components, the supply of components while the mounting apparatus is operating, and the replacement of components are possible. In the first method, since electronic components of various sizes are picked up while being automatically replaced with pickup nozzles corresponding to the component sizes, a multifunctional mounting machine capable of handling a very large number of types of electronic components. It is mainly used for mounting ICs, odd-shaped parts, large parts, and the like. Further, since the printed wiring board and the component supply unit are of a fixed type, the external dimensions of the apparatus can be reduced, and the apparatus can be used by connecting the apparatuses.

In the second method, the turret has a nozzle for picking up and mounting components, and can simultaneously perform component pick-up, component position recognition, and component mounting while rotating the mounting head. In addition, high-speed mounting of electronic components is possible. For this reason, this method is used as a high-speed chip mounter for mainly mounting chip-type electronic components (chip resistors, chip capacitors, etc .; hereinafter, referred to as “chip components”), which are extremely large in number among electronic components. ing. However, in the second method, since the component supply unit is of a movable type, it is difficult to replace or replenish components during operation of the device. The rate is low. For this reason, in many conventional high-speed chip mounters, the component supply unit is divided into two parts, and while one component supply unit is operating, the other component supply unit waits while performing component replacement and component replenishment on the fixed stage, When one of the moving parts supply parts is out of order, the other parts supply part is automatically replaced with another parts supply part so that continuous operation can be performed.

However, since two sets of component supply units are provided, there is a problem that the component supply unit becomes very long. Further, a mechanism or the like for automatically exchanging the two sets of component supply units is required, so that there is a problem that the cost of the apparatus increases. Further, in the second method, there is a high-speed chip mounter having two movable component supply units and two turrets. However, there is no means for correcting a component position shift occurring between the two turrets. Since the mounting accuracy is poor and the number of component supply units is two, the entire apparatus becomes very long. Therefore, there is a problem that productivity per unit floor area is low and the cost of the apparatus is high.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus capable of supplying a large amount of electronic components and mounting at a high speed, while taking the advantages of the above two methods and overcoming the disadvantages. It is another object of the present invention to provide an electronic component automatic mounting apparatus with good mounting accuracy by correcting a positional shift generated between a plurality of rotary mounting units (turrets). Another object of the present invention is to provide an electronic component automatic mounting apparatus in which the external dimensions of the apparatus are small and the occupied floor area is small because the component supply unit is fixed. Furthermore, by automatically replacing the rotary mounting means (turret or nozzle) and automatically replacing the electronic component supply device,
It is an object of the present invention to provide an electronic component automatic mounting device capable of selecting high speed or multifunctionality.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to an electronic component automatic mounting apparatus for automatically mounting an electronic component on a printed wiring board, comprising a plurality of electronic components mounted and fixed at predetermined positions. A plurality of electronic component supply devices in which these component take-out positions extend linearly, and a printed circuit board mounted thereon and moved in the X-axis and Y-axis directions to supply electronic components. Table means for determining a mounting position, and a plurality of rotary mounting means for taking out an electronic component from the electronic component supply device and mounting it on a printed wiring board, each of the rotary mounting means being a component for taking out an electronic component Take-out means, component position recognizing means for recognizing the position of the picked-up electronic component, component position correcting means for correcting the position of the recognized electronic component to a predetermined position, and a printed wiring board Anda component mounting means for mounting,
It is characterized in that the component extracting means, the component position recognizing means, the component position correcting means and the component mounting means perform parallel processing almost simultaneously.

In the present invention, a plurality of printed wiring boards corresponding to the plurality of rotary mounting means are arranged in parallel on the table means at the same interval as the plurality of rotary mounting means, and the plurality of rotating mounting means are provided. It is preferable that each component extracting means of the type mounting means simultaneously take out the same electronic component and each component mounting means simultaneously mounts these electronic components.

Further, in the present invention, the plurality of rotary mounting means include a first rotary mounting means and a second rotary mounting means, and each of the first and second rotary mounting means is , A plurality of head means rotatable about a vertical axis perpendicular to the X-axis and the Y-axis, and a component take-out means and a component mounting means which are rotatably mounted on each of these head means so as to be rotatable about the vertical axis. It has a nozzle means, these rotary mounting means, the head means and the nozzle means are provided at positions where the rotation axes are respectively different, the component position correcting means,
If the component position recognizing means recognizes a positional shift between the component recognition position of the first rotary mounting means and the component recognition position of the second rotary mounting means, each of the first and second rotary mounting means It is preferable to correct the misalignment by rotating the head means by a required angle and rotating each of the nozzle means in a direction crossing each other by 90 degrees. Further, in the present invention, it is preferable that the component position correcting means corrects the angular displacement of the electronic component caused by the rotational movement of the nozzle to a predetermined position.

Further, in the present invention, the plurality of rotary mounting means comprises a first rotary mounting means and a second rotary mounting means, and each of the first and second rotary mounting means is A plurality of head means and a nozzle means rotatably attached to each of these head means and serving as a component take-out means and a component mounting means. When a misalignment is recognized between the component recognition position of the first rotary mounting means and the component recognition position of the second rotary mounting means, the head means or the nozzle means of each of the first and second rotary mounting means crosses each other by 90 degrees. It is preferable to move it by a necessary distance in the direction of movement.

In the present invention, the plurality of rotary mounting means include a first rotary mounting means and a second rotary mounting means, and the table means includes the first and second rotary mounting means. Means for mounting two printed wiring boards corresponding to the means, and board position recognizing means for recognizing an interval between the two printed wiring boards mounted on the table means; When the position deviation between the interval between the first and second rotary mounting means and the interval between the two printed wiring boards is recognized by the means and the board position recognizing means, the rotary mounting is performed by correcting the component position. Preferably, the spacing of the means is corrected to match the spacing of the printed circuit boards, thereby correcting any misalignment.

Further, in the present invention, it is preferable to further comprise a mounting means automatic replacing means for automatically replacing the rotary mounting means with another rotary mounting means or electronic component mounting means. Further, it is preferable that the present invention further includes a component supply device automatic replacement unit that automatically replaces the electronic component supply device with another electronic component supply device.

[0014]

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, a first embodiment of an electronic component automatic mounting apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an electronic component automatic mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a side view seen from the right side of FIG. 1, FIG. FIG. 5 is an enlarged plan view showing the correction of the angle of the component position on the turret, and FIG. 5 is an enlarged plan view showing the correction of the displacement between the turrets.

As shown in FIGS. 1 and 2, reference numeral 1 denotes an electronic component automatic mounting apparatus according to a first embodiment of the present invention. The electronic component automatic mounting apparatus 1 includes a frame 2 that supports the entire apparatus. Provided on both sides (upper and lower sides in FIG. 1) of the frame 2 are feeder units 4 as component supply units. These feeder units 4 are of a fixed type, and are attached to the frame 2 via an attachment base 5. Each feeder unit 4 includes a number of component supply devices 6 provided in parallel. An XY table 8 that is movable in two directions, that is, an X-axis direction and a Y-axis direction, is disposed in a region between these two feeder units 4. The XY table 8 has two printed wiring boards 10 and 11 mounted thereon.
A large number of electronic components are mounted at predetermined positions on 0 and 11. On the upstream and downstream sides (right and left sides in FIG. 1) of the XY table 8, the printed wiring board 1
A board handler 12 for carrying 0, 11 to the XY table 8 and a printed wiring board 10, on which components are mounted,
Board handlers 14 for unloading 11 are provided. These board handlers 12 and 14 move down to the same level as the XY table 8 when loading or unloading the printed wiring boards 10 and 11 into and out of the XY table 8, and rise after loading or unloading is completed. , XY table 8 does not interfere with the XY table 8 when it moves. These board handlers 12,
14 is shown only in FIG. 1 to make other configurations easier to see.
Here, in the first embodiment, two rotatable turrets 16 and 17 as rotatable mounting means corresponding to the two printed wiring boards 10 and 11 are provided.

As shown in FIG. 3, these turrets 1
The turrets 6 and 17 are rotatable about respective turret centers 18. The turret 16 has eight heads 2
0, and each head 20 is rotatable with respect to the turret 16. Each head 20 is provided with a nozzle 22 for taking out (pickup) and mounting (mounting) of an electronic component. The nozzle 20 is rotatable with respect to the head 20 and is vertically movable (in FIG. (Vertical direction). Further, the turret 16, the head 20, and the nozzle 22 have rotation axes at different positions. Similarly, the turret 17 also has eight heads 20, and each head 20 is rotatable with respect to the turret 17. Each of the heads 20 (B1 to B8) also includes a nozzle 22 rotatable with respect to the head 20 and capable of moving up and down. One of the turrets 16 is displaced from the other turret 17 by a distance D (see FIG. 5) in the X-axis direction.

As shown in FIG. 3, the component pickup position 26 of the feeder section 4 extends linearly. Each of the turrets 16 and 17 is movable along the component pick-up position 26 of the linearly extending feeder unit 4, and chain lines 28, 29, 30, and 3 indicating the outer shape of the turret.
1. Indicates the positions where the turrets 16 and 17 have moved to the positions where the components of the electronic component supply device 6 at both ends are taken out. As shown in FIG. 3, the mounting position of the nozzle 22 in each head 20 of the turret 16 is provided eccentrically from the head center 24, and the angles are shifted by 45 degrees at the head positions A1 to A8. Specifically, for example, the head position A1 is 90 degrees and the head position A is
2 is 135 degrees, and at head position A3 is 180 degrees. Here, the head position A5 is a pickup position of an electronic component, the head position A7 is a recognition position of a component position described later, the head position A8 is a component position correction position described later, and the head position A1 is a component mounting position. It is.

Similarly, the mounting position of the nozzle 12 in each head 20 of the turret 17 is also provided eccentrically from the center 24 of the head, and at the head positions B1 to B8,
The angles are shifted by 45 degrees. Here, the head position B5
Is the pickup position of the electronic component, and the head position B
Reference numeral 7 denotes a recognition position of a component position described later, and a head position B
Reference numeral 8 denotes a component position correction position, which will be described later, and a head position B1.
Is a component mounting position. These turrets 16, 17
Operate at the same time, that is, pick up an electronic component at the same time, recognize the component position, correct the component position, and mount the component. As shown in FIG. 3, the nozzle 22 of the head 20 at the head position A1 of the turret 16 where components are mounted and the nozzle 22 of the head 20 at the head position B1 of the turret 17 are arranged so that the angle is shifted by 90 degrees. ing.

A nozzle changer 32 is disposed in the vicinity of the moving position 29, 31 of each turret 16, 17 below the turret 16, 17, respectively. These nozzle changers 32 are provided because the nozzles 22 to be used are different depending on the type of electronic component, and the nozzles 22 mounted on the turrets 16 and 17 are sequentially replaced as necessary. It is possible.

As shown in FIGS. 2 and 3, at the head positions A7 and B7 below the turrets 16 and 17, a CCD camera 34 as a component position recognizing means is provided.
The turret is mounted so as to move integrally with the turret when moving along the component pickup position 26 of the feeder unit 4 without rotating integrally with the turret 17. The camera 34 determines whether the electronic component is sucked and held at the tip of the nozzle 22, whether the held electronic component is in a normal posture, whether the held electronic component has a normal holding angle, and the like. , For recognizing the position of the electronic component at the tip of the nozzle 22.

As shown in FIGS. 2 to 4, the turret 1
The turrets 16 and 17 are moved along the component pick-up position 26 of the feeder unit 4 without the angle correcting servo mechanism 36 rotating integrally with the turrets 16 and 17 above the head positions A8 and B8 of the feeders 4 and 6. It is mounted so that it moves together when moving. The angle correcting servo mechanism 36, when the angle of the recognized electronic component A by the camera 34 is shifted from the predetermined position, as well as angle corrected desired degree theta _A, as will be described later, positional deviation between the turret Is necessary to rotate the head 20 when this occurs, but this is for adjusting the minute angle of the nozzle 22 caused by the rotation of the head 20 at this time. FIG. 4 shows the head 20 at the position A8, but the same applies to the head 20 at the position B8.

As shown in FIGS. 1 and 2, the turret 1
The printed wiring board 10,
Board position recognition camera 38 for recognizing the position of 11
Are fixedly arranged. Fiducial marks (not shown) are printed on three or four corners of the printed wiring boards 10 and 11, and the board position recognition camera 38 recognizes these fiducial marks. Thereby, the distortion, elongation, shrinkage, etc. of the substrate are measured, and the displacement between the two printed wiring boards 10, 11 is also measured (recognized).

Next, referring to FIGS. 3 to 5, a description will be given of a correction method according to the present embodiment when a positional shift occurs between the two turrets 16 and 17. FIG. With the camera 34, two turrets 16, at head positions A7 and B7,
When it is recognized that a positional deviation (error) greater than or equal to a predetermined value occurs between the turrets 17, the heads 20 of the turrets 16 and 17 move from the head positions A8 and B8 to the head positions A1 and
During B1, the component position of each head 20 is corrected by a motor (not shown) built in each head 20. Although the rotation angle of the head 20 is very small, the rotation of the head 20 also causes the angle of the electronic component held by the nozzle 22 to change by a small angle. Therefore, this nozzle 2
In order to cancel the small angle of 2, the head positions A8, B8
In step (2), the nozzle 22 is rotated in the opposite direction in advance by a small angle by the angle correcting servo mechanism 36 (see FIG. 4). FIG. 5 shows each head 2 after being corrected in this way.
0 indicates the component mounting position. As shown in FIG. 5, the head 20 of the turret 16 is corrected to a necessary angle with respect to the head center 24 as indicated by an arrow Y and the minute angle of the nozzle 22 is canceled, so that the nozzle 22 is set at a position of 90 degrees. You. Thus, the error in the Y-axis direction is corrected. At the same time, the head 20 of the turret 17 is corrected to the required angle as indicated by the arrow X at the head center 24 and the minute angle of the nozzle 22 is canceled, so that the nozzle 22 is set at the position of 0 degrees. In this way,
The error in the X-axis direction is corrected.

In general, when a position shift occurs between two turrets, it is necessary to correct the error by moving each head at the component mounting position of each turret along the X axis and the Y axis, respectively. is there. However, providing each head with a mechanism that can move in two axial directions is mechanically complicated and increases the cost accordingly. On the other hand, in the present embodiment, as described above, in one turret 16,
By correcting the error in the Y-axis direction by rotating the head center 24, the error in the X-axis direction is corrected by the other turret 17, and the minute angle of the nozzle 22 due to the rotation of the head 20 is canceled. Therefore, the displacement (error) can be corrected by a very simple mechanism.

Next, the operation of the first embodiment will be described. The board handler 12 carries the two printed wiring boards 10 and 11 into the XY table 8. These two printed wiring boards 10 and 11 are mounted on an XY table 8.
The turret heads 16 and 17 are mounted in parallel at the same interval. Two printed wiring boards 10,
11 is moved in the X-axis direction and the Y-axis direction by the XY table 8, and the component mounting position of the printed wiring boards 10 and 11 is the component mounting position of the turrets 16 and 17.
1, It comes to just below B1. The printed wiring boards 10 and 11 on which the component mounting has been completed are carried out of the XY table 8 by the board handler 14.

Next, the component mounting operation will be described. Each of the turrets 16 and 17 transfers the electronic component supplied from the feeder unit 4 at the head positions A5 and B5 to the component pickup position 26.
And is held by suction by the nozzle 22. Thereafter, each of the turrets 16 and 17 rotates intermittently by 45 degrees. The position of the electronic component held by the nozzle 22 is recognized by the camera 34 at the head positions A7 and B7. Next, when the holding position (angle) of the electronic component is shifted, as shown in FIG.
The position is corrected by rotating the nozzle 22 by a necessary angle by the angle correcting servo mechanism 36. Then, the head position A
At 1, B1, the nozzle 22 holding the electronic component is lowered, and the electronic component is mounted on the component mounting position of the printed wiring boards 10, 11 which has been moved to the predetermined mounting position by the XY table 8. . These series of operations, that is, the operations of component pick-up, component angle recognition, angle correction, and component mounting, are simultaneously performed in parallel. That is, the operation of picking up a new electronic component, the operation of mounting the electronic component picked up before the operation 5, the operation of correcting the angle of the component picked up before the operation 4, and the angle of the component picked up before the operation 3. The recognition operation is performed simultaneously. Even when the turrets 16 and 17 move to the next component supply device 6, the above-described series of operations is not interrupted.
In this manner, in the present embodiment, the electronic components can be mounted at a very high speed.

If there is a displacement (error) of a predetermined value or more between the two turrets 16 and 17, the camera 34
Is recognized, as described above, the head position A
8 and B8, the head 20 is rotated by a required angle (see FIG. 5) by a motor (not shown) incorporated in each head 20 while moving to the head positions A1 and B1. The nozzle 22 is rotated in the direction opposite to the small angle by the angle correcting servo mechanism 36 so as to cancel the small angle displacement of the nozzle 22 caused by the rotation of the head 20 (see FIG. 4). Thus, the displacement between the turrets 16 and 17 is corrected. Further, when it is necessary to replace the nozzle 22 of a different type depending on the type of the electronic component, the turrets 16 and 17 are moved to the position of the nozzle changer 32 and replaced with the necessary nozzle 22.

In the first embodiment described above, the angle of the nozzle 22 is corrected by rotating the nozzle 22 at a required angle at the head positions A8 and B8 by the externally mounted servomotor mechanism 36, and the position between the turrets 16 and 17 is adjusted. The gap correction is
When moving from the head positions A8 and B8 to the head positions A1 and B1, the heads 2 are driven by motors incorporated in the respective heads 20.
Although this is performed by rotating 0 by a necessary angle, the present invention is not limited to this, and another method may be adopted. For example, the rotation of the nozzle 22 may be performed by a built-in motor, or the rotation of the head 20 may be performed by an externally mounted servo mechanism. Further, both the nozzle 22 and the head 20 may be rotated by a built-in motor, or both the nozzle 22 and the head 20 may be externally attached and rotated by a servo mechanism. However, in this case, the number of heads 20 attached to the turrets 16 and 17 should be at least one.
It is necessary to provide two head positions between the head positions A7, B7 for recognition and the component mounting positions A1, B1 and to attach two servo mechanisms to correspond to these head positions. is there. In the above-described first embodiment, when the camera 34 recognizes that a positional deviation (error) of a predetermined value or more has occurred between the two turrets 16 and 17, the head 20 is rotated by a necessary angle and The nozzle 22 is rotated in the opposite direction by a small angle so as to cancel the small angle displacement of the nozzle 22 caused by the rotation of the head 20 to correct the positional deviation between the turrets 16 and 17, but this is required. According to the accuracy of the mounting position, the step of rotating the nozzle 22 in the direction opposite to the minute angle so as to cancel the minute angle displacement of the nozzle 22 due to the rotation of the head 20 can be omitted.

Next, the second embodiment of the present invention will be described with reference to FIGS.
An embodiment will be described. FIG. 6 is an enlarged plan view of a main part showing an electronic component automatic mounting apparatus according to a second embodiment of the present invention.
FIGS. 7 to 9 are plan views showing a process of correcting a positional shift generated between the turret heads. As shown in FIG. 6, in the second embodiment, turrets 16 and 17 include:
A plurality of heads 20 and a plurality of nozzles 22 attached coaxially to each of the heads 20 are provided. Here, the head 20 is fixed, and the nozzle 22 is rotatable. A predetermined minute gap is interposed between the nozzle 22 and the head 20.
Therefore, the nozzle 22 can be moved by a minute position only in one of the X-axis and the Y-axis by a separately provided nozzle driving mechanism (not shown).

On the premise of such a structure, when a positional shift (error) occurs between the turrets 16 and 17, the camera 34 recognizes the error and first, as shown in FIG. , 17 are rotated such that the electronic component A is vertically positioned at a position of 90 degrees with respect to the X axis and zero degrees with respect to the Y axis. Next, as shown in FIG. 8, in the head (A1) 20 of the turret 16, the error is corrected by moving the nozzle 22 linearly in the Y-axis direction by a necessary distance (ΔY). Meanwhile, Turret 1
In the head (B1) 20 of No. 7, the error is corrected by moving the nozzle 22 linearly in the X-axis direction by a necessary distance (ΔX). As described above, by moving the nozzle 22 of each of the turrets 16 and 17 in only one of the X-axis direction and the Y-axis direction, it is possible to correct a positional shift generated between the turrets.

As described above, in the present embodiment, since the nozzle of each turret is moved only in one axis direction, a simple configuration is provided as compared with a mechanism for moving each turret in two axis directions. Can be. In the above-described example, a gap is provided between the head 20 and the nozzle 22. In addition, a minute gap is provided between the turret and the head, and the head is moved in the X-axis direction or the Y-axis direction. You may do so.

In FIG. 7, Z indicates the distance between the centers of the electronic components in the two turrets 16 and 17, and W indicates the nozzle 22 in the two turrets 16 and 17 at a predetermined position set in advance by a program. The distance between them is shown. In the present embodiment, as described above, the nozzle 22 of the head (A1) 20 is set to Δ
The Y-axis is corrected so as to move by Y and Z = W, the nozzle 22 of the head (B1) 20 is moved by ΔX, and the X-axis is corrected so that the X-axis centers of both parts are coaxial. Therefore, there is no reference point on the head 20 side as a reference. Therefore, as shown in FIG.
The positions of the printed wiring boards 10 and 11 are corrected by an amount corresponding to ΔX and ΔY. In FIG. 9, reference numeral 39 denotes a pad provided at a mounting position on the printed wiring boards 10 and 11 to which the electronic component A is mounted. Note that the position correction of the printed wiring boards 10 and 11 by the XY table 8 in the second embodiment by an amount corresponding to ΔX and ΔY is similarly performed in the first embodiment.

In the first and second embodiments, two printed wiring boards 10 and 11 are mounted on one XY table 8 in parallel according to the distance between the turrets 16 and 17. Therefore, it is conceivable that a gap may occur between the two printed wiring boards 10 and 11, or a distortion of the board or an error in accuracy of the board itself may occur.
These gap deviations and errors in board accuracy can be measured by the board position recognition camera 38 described above. The distance deviation and the error of the substrate accuracy measured by the camera 38 are corrected by the method of correcting the positional deviation between the turrets in the first embodiment described above (see FIGS. 3 to 5) or the second embodiment. By using the correction method (see FIGS. 6 to 9) when a displacement occurs between the turrets, the distance between the turrets 16 and 17 is corrected to match the measured substrate distance. can do.

Next, a third embodiment of the present invention will be described with reference to FIG. This embodiment is different from the first embodiment,
One printed wiring board 40 is mounted on an XY table 8. In this embodiment, different types of electronic components are supplied from feeder units 42 provided at two locations. Turret 1
Configurations 6 and 17 are the same as in the first embodiment. Next, the operation of the third embodiment will be described. The operations of component pick-up, component position recognition, component position correction, and component mounting in each of the turrets 16 and 17 in this embodiment are the first operations.
This is the same as the embodiment. The difference is that, in the third embodiment, when one of the turrets 16 performs component pickup or component mounting, the other turret 17 does not perform component pickup or component mounting, but stops operating, or the nozzle 22 does not. Automatic exchange or turret 17
The operation of automatic exchange of. That is, in the third embodiment, the turrets 16 and 17 are controlled not to operate synchronously but to operate only one of them as far as the operations of component pickup and component mounting are concerned. This allows different types of electronic components to be mounted relatively quickly.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In this embodiment, one printed wiring board 40 is mounted on the XY table 8 as in the third embodiment. Also, different types of electronic components are supplied from the feeder unit 42. In the present embodiment, the following configuration is different from the first and third embodiments. That is, the turret 17 can stand by at the turret standby positions 44 and 46 indicated by broken lines. Outside the waiting position 46, another turret 48 is arranged, and the turret 17 is moved to the turret waiting position 44 so that it can be replaced with this other turret 48. Outside the standby position 44, a mounting jig 50, which is a mounting means for special electronic components, is disposed, and the turret 17 moves to the turret standby position 46, and can be replaced with the mounting jig 50 for this special electronic component. It has become.

Further, in the present embodiment, the feeder section 42
Separately, a second feeder unit 52 for supplying a special electronic component is separately provided. Further, a component supply section switching device 54 is attached to the feeder section 42, and the second feeder section 5
2 is provided with a component supply unit switching device 56 for using the turret 17 and a mounting jig 50 for special electronic components.
Is used, the feeder units 42 and 52 are respectively switched. In the above-described third embodiment, the nozzle 22 is replaced.
In the embodiment, the turret (or the jig) itself is replaced. Therefore, since a turret (or a jig) is automatically selected and used according to the type of the electronic component, it is possible to mount many different types of electronic components at a higher speed.

In the present invention, when a position shift occurs at each component recognition position among a plurality of turrets, if the position shift is within a predetermined value, the component mounting position of the nozzle is corrected by an average value of the position shift. If the positional deviation is larger than a predetermined value, the component mounting timing by the nozzle of each turret is delayed by a predetermined short time, and the positional deviation of the component mounting position by each nozzle is corrected within this delayed time. Good.

[0038]

As described above, according to the electronic component automatic mounting apparatus of the present invention, a large amount of electronic components can be supplied and high-speed mounting is possible. In addition, by correcting a positional shift generated between a plurality of rotary mounting units (turrets), mounting accuracy can be improved. Further, since the component supply unit is of a fixed type, the external dimensions of the apparatus are small, and the occupied floor area can be reduced. Further, by automatically exchanging the component mounting means (turret or nozzle) and automatically exchanging the component supply unit, it is possible to select high-speed or multifunctional according to the production mode.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component automatic mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view seen from the right side of FIG. 1;

FIG. 3 is an enlarged plan view of a main part of FIG. 1;

FIG. 4 is an enlarged plan view showing an angle correction of a component mounting position in the turret.

FIG. 5 is an enlarged plan view showing correction of a displacement between the turrets;

FIG. 6 is an enlarged plan view of an essential part showing an electronic component automatic mounting apparatus according to a second embodiment of the present invention.

FIG. 7 is an enlarged plan view showing steps of a position shift correction method according to a second embodiment.

FIG. 8 is an enlarged plan view showing steps of a position shift correction method according to the second embodiment.

FIG. 9 is an enlarged plan view showing the steps of a position shift correction method according to the second embodiment.

FIG. 10 is a plan view showing an electronic component automatic mounting apparatus according to a third embodiment of the present invention.

FIG. 11 is a plan view showing an electronic component automatic mounting apparatus according to a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component automatic mounting apparatus 2 Frame 4,42,52 Feeder part 6 Component supply apparatus 8 XY table 10,11,40 Printed wiring board 12,14 Board handler 16,17,48,50 Turret 18 Turret center 20 Head 22 Nozzle 24 Head center 26 Component pick-up position 28, 29, 30, 31 Turret outline 32 Nozzle changer 34 Camera 36 Angle correcting servo mechanism 38 Board position recognition camera 44, 46 Turret standby position 54, 56 Component supply unit switching device

Claims (8)

[Claims] An electronic component automatic mounting apparatus for automatically mounting an electronic component on a printed wiring board, comprising: a plurality of electronic component supply devices fixedly arranged at predetermined positions; A plurality of electronic component supply devices extending linearly; table means for mounting a printed wiring board and moving in the X-axis and Y-axis directions to determine the mounting position of the electronic component; A plurality of rotary mounting means for extracting an electronic component and mounting the electronic component on the printed wiring board, wherein each of the rotary mounting means includes a component extracting means for extracting the electronic component and a position of the extracted electronic component. Component position recognizing means for recognizing, component position correcting means for correcting the position of the recognized electronic component to a predetermined position, and component mounting means for mounting the electronic component on the printed wiring board. An electronic component automatic mounting apparatus, wherein the component extracting means, the component position recognizing means, the component position correcting means, and the component mounting means perform parallel processing substantially simultaneously. 2. A plurality of printed wiring boards corresponding to the plurality of rotary mounting means are arranged in parallel on the table means at the same interval as the plurality of rotary mounting means, and the plurality of rotary mounting means are provided. 2. The electronic component automatic mounting apparatus according to claim 1, wherein each component extracting means of the means simultaneously extracts the same electronic component, and each component mounting means simultaneously mounts these electronic components. 3. The plurality of rotary mounting means comprises a first rotary mounting means and a second rotary mounting means. Each of the first and second rotary mounting means has an X-axis and a second rotary mounting means. A plurality of head means rotatable about a vertical axis perpendicular to the Y axis, and nozzle means which are rotatably mounted on each of these head means about the vertical axis and are the above-described component extracting means and component mounting means. The rotary mounting means, the head means, and the nozzle means are provided at positions where the rotation axes are different from each other. The component position correcting means is a component recognition position of the first rotary mounting means by the component position recognizing means. When a displacement between the component recognition position of the second rotary mounting means and the component recognition position is recognized,
Rotating the head means of each of the first and second rotary mounting means by the required angle to move each of the nozzle means 90
3. The automatic electronic component mounting apparatus according to claim 2, wherein the positional deviation is corrected by rotating the electronic component in a direction crossing the angle. 4. The electronic component automatic mounting apparatus according to claim 3, wherein said component position correcting means corrects an angular displacement of the electronic component caused by the rotational movement of the nozzle to a predetermined position. 5. The plurality of rotary mounting means comprises a first rotary mounting means and a second rotary mounting means, and each of the first and second rotary mounting means includes a plurality of heads. Means and a nozzle means which is rotatably attached to each of these head means and is a part taking-out means and a part mounting means. The part position correcting means is provided by the part position recognizing means. When a displacement is recognized between the component recognition position and the component recognition position of the second rotary mounting means,
3. The electronic component mounting apparatus according to claim 2, wherein the head means or the nozzle means of each of the first and second rotary mounting means is moved by a necessary distance in a direction crossing each other by 90 degrees. 6. The plurality of rotary mounting means comprises a first rotary mounting means and a second rotary mounting means, and the table means corresponds to the first and second rotary mounting means. And a board position recognizing means for recognizing an interval between the two printed circuit boards mounted on the table means, and a component position correcting means for recognizing the component position. When the position deviation between the interval between the first and second rotary mounting means and the interval between the two printed wiring boards is recognized by the means and the board position recognizing means, the component position is corrected by correcting the component position. 3. The electronic component automatic mounting apparatus according to claim 2, wherein the interval between the rotary mounting means is corrected so as to match the interval between the printed circuit boards, thereby correcting the positional deviation. 7. The electronic component automatic mounting apparatus according to claim 1, further comprising mounting means for automatically replacing said rotary mounting means with another rotary mounting means or electronic component mounting means. 8. The electronic component automatic mounting device according to claim 1, further comprising a component supply device automatic replacement means for automatically replacing the electronic component supply device with another electronic component supply device.